Display module and display device

Abstract

The display module and the display device disclosed by the embodiments of the present application, wherein the display panel comprises a non-display part, the non-display part comprises a first area and a second area arranged on at least one side of the first area, a chip on film is arranged on the first area, a compensation film is arranged on the second area and at least one side of the chip on film, a glue layer covers the chip on film and the compensation film, and a polaroid is arranged on the display panel and covers the non-display part and the glue layer. The embodiments of the present application fill the gap of the second area by arranging the compensation film, reduce the gap between the part of the glue layer in the first area and the part of the glue layer in the second area, improve the flatness of the glue layer, and thus improve the flatness of the polaroid.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] The borderless technology of the binding area of ​​the display screen is to first use a cover film for binding in the binding area, then attach a polarizer to cover the binding area, and then use glue to fill the binding area; in the non-binding area, a polarizer is super-attached, and then packaging glue is applied on the side, and then it is cut into one piece to achieve a four-sided borderless technology.

[0003] During research and practice with existing technologies, the inventors discovered that the spacing between the chip-on-film (COF) layers in the bonding area affects the distribution of the colloid during lateral adhesive application. For example, the colloid can completely fill the area where the COF is located. However, the colloid cannot completely fill the area where the COF is not located. This causes the portion of the polarizer corresponding to the non-COF area to be concave, resulting in an uneven polarizer surface and degrading the overall visual quality of the display. Summary of the Invention

[0004] The embodiments of the present application provide a display module and a display device, which can improve the flatness of a polarizer.

[0005] In one aspect, an embodiment of the present application provides a display module, comprising:

[0006] The display panel includes a non-display portion, wherein the non-display portion includes a first area and a second area provided on at least one side of the first area;

[0007] A chip-on-film (CFO), the CFO being bound and disposed in the first area;

[0008] a compensation film, disposed in the second area and located on at least one side of the chip-on-film;

[0009] a glue layer covering the chip-on-film and the compensation film; and

[0010] A polarizer is disposed on the display panel and covers the non-display portion and the adhesive layer.

[0011] Optionally, in some embodiments of the present application, the display module further includes a conductive adhesive, which covers both the first area and the second area, and the chip-on-film and the compensation film are both connected to a side of the conductive adhesive away from the non-display portion.

[0012] Optionally, in some embodiments of the present application, a first binding pad is provided on the first region, the chip-on-film includes a second binding pad, and the second binding pad is bound and connected to the first binding pad via the conductive adhesive;

[0013] The compensation film includes a third binding pad, and the third binding pad is arranged on the conductive adhesive.

[0014] Optionally, in some embodiments of the present application, the chip-on-film and the compensation film are provided separately.

[0015] Optionally, in some embodiments of the present application, the chip-on-film and the compensation film are integrally connected.

[0016] Optionally, in some embodiments of the present application, the chip-on-film includes a base layer and a metal layer disposed on the base layer, the base layer extends from the first region to the second region, and the metal layer includes a second binding pad located in the first region and a third binding pad located in the second region;

[0017] Wherein, the portion of the chip-on-film located in the second area forms the compensation film.

[0018] Optionally, in some embodiments of the present application, the non-display portion includes an electrostatic lead-out line, and the third binding pads of the compensation film located on both side areas of the non-display portion are electrically connected to the electrostatic lead-out line;

[0019] The metal layer includes a trace, a third binding pad electrically connected to the electrostatic lead is connected to the trace, the trace extends from the compensation film area to the COF area, and the trace is configured to be grounded.

[0020] Optionally, in some embodiments of the present application, the glue layer includes a first sublayer and a second sublayer, the first sublayer covers the COF and the compensation film, and the second sublayer covers a side of the first sublayer away from the non-display portion;

[0021] The material viscosity of the second sub-layer is higher than the material viscosity of the first sub-layer.

[0022] Optionally, in some embodiments of the present application, in a direction parallel to the long side of the non-display portion, the first areas and the second areas are alternately arranged;

[0023] Two compensation films are provided in the second area between two adjacent first areas in a direction parallel to the long side of the non-display portion.

[0024] Optionally, in some embodiments of the present application, the long side of the compensation film is flush with the side edge of the non-display portion.

[0025] Optionally, in some embodiments of the present application, the display panel includes an array substrate and an opposing substrate disposed on the array substrate, the polarizer is disposed on a side of the opposing substrate away from the array substrate and extends beyond the opposing substrate, and the adhesive layer connects a side surface of the opposing substrate and a side surface of the polarizer close to the array substrate;

[0026] The non-display portion includes a portion of the array substrate located in a binding area, and the chip-on-film and the compensation film are disposed on the array substrate.

[0027] On the other hand, correspondingly, an embodiment of the present application further provides a display device, which includes the display module as described in any one of the above embodiments.

[0028] In the display module and display device of the embodiments of the present application, the display panel includes a non-display portion, the non-display portion includes a first area and a second area arranged on at least one side of the first area, the cover chip film is bound and arranged in the first area, the compensation film is arranged in the second area and is located on at least one side of the cover chip film, the adhesive layer covers the cover chip film and the compensation film, and the polarizer is arranged on the display panel and covers the non-display portion and the adhesive layer.

[0029] In the embodiment of the present application, a compensation film is provided to fill the step in the second area, thereby reducing the step difference between the adhesive layer in the first area and the adhesive layer in the second area, improving the flatness of the adhesive layer, and thus improving the flatness of the polarizer. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 1 is a schematic diagram of a top view of the display module provided in an embodiment of the present application;

[0031] Figure 2 yes Figure 1 Schematic diagram of the cross section along the MM line;

[0032] Figure 3 yes Figure 1 Schematic diagram of the cross section along line NN;

[0033] Figure 4 yes Figure 3 Enlarged view of section G;

[0034] Figure 5 yes Figure 1 Another cross-sectional diagram along line NN;

[0035] Figure 6 It is a structural schematic diagram of the display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts are within the scope of protection of this application. In addition, it should be understood that the specific embodiments described here are only used to illustrate and explain the present application and are not used to limit the present application. In this application, the various embodiments can be combined with each other but will not be repeated one by one. In addition, unless otherwise specified, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the drawings; while "inner" and "outer" refer to the outline of the device; the terms "first", "second", "third", etc. are used only as labels and do not impose numerical requirements or establish an order.

[0037] The embodiments of the present application provide a display module and a display device, which are described in detail below. It should be noted that the order of description of the following embodiments does not limit the preferred order of the embodiments.

[0038] Please refer to Figures 1 to 3 The display panel 11 of the display module 100 includes, but is not limited to, one of a liquid crystal display (LCD) panel, an organic light-emitting display (OLED) panel, an inorganic electroluminescent (EL) display panel, a quantum dot light-emitting display (QED) panel, a micro-LED display panel, a nano-LED display panel, a field emission display (FED) panel, and an electrophoretic display (EPD) panel. Hereinafter, the organic light-emitting display panel will be used as an example for explanation. However, the embodiments are not limited to the organic light-emitting display panel, and another display panel listed above or known in the art may be applied to the embodiments.

[0039] exist Figure 1 and Figure 2 In the embodiment, the first direction F1 may be a direction parallel to one side of the display panel 11 in a plan view, and may be, for example, a transverse direction of the display panel 11. The second direction F2 may be a direction parallel to the other side of the display panel 11 in a plan view, and may be a longitudinal direction of the display panel 11. The third direction F3 may be a thickness direction of the display panel 11. Optionally, in some embodiments, the first direction F1 and the second direction F2 may not intersect perpendicularly.

[0040] Optionally, the display panel 11 may have a rectangular shape in a plan view, but embodiments are not limited thereto. In some embodiments, the display panel 11 may have a rectangular shape with vertical or rounded corners in a plan view. In a plan view, the display panel 11 has two long sides arranged in the first direction F1 and two short sides arranged in the second direction F2. That is, the long sides of the display panel 11 are parallel to the first direction F1, and the short sides of the display panel 11 are parallel to the second direction F2.

[0041] The display panel 11 may include a display area DA and a non-display area NDA. In a plan view, the shape of the display area DA may correspond to the shape of the display panel 11. For example, if the display panel 11 has a rectangular shape in a plan view, the display area DA may also have a rectangular shape.

[0042] The display area DA may be an area including pixels that display an image. The pixels may be arranged in a matrix. The pixels may have a rectangular, diamond, or square shape in a plan view, but embodiments are not limited thereto. For example, in a plan view, the pixels may have a quadrilateral shape other than a rectangular, diamond, or square shape, a polygonal shape other than a quadrilateral shape, a circular shape, or an elliptical shape.

[0043] The non-display area NDA may be an area that does not include pixels and does not display an image. The non-display area NDA may be arranged near (or around) the display area DA. Figure 1 As shown in FIG, the non-display area NDA may surround the display area DA, but the embodiment is not limited thereto.

[0044] The portion of the display panel 11 corresponding to the display area DA is a display portion AA, and the portion of the display panel 11 corresponding to the non-display area NDA is a non-display portion NA.

[0045] Please refer to Figures 1 to 3 The embodiment of the present application provides a display module 100 , which includes a display panel 11 , a chip-on-film 12 , a compensation film bc1 , a glue layer 13 , a polarizer 14 and a circuit board 15 .

[0046] Optionally, one end of the chip-on-film 12 is bound and connected to the display panel 11 , and the other end of the chip-on-film 12 is bound and connected to the circuit board 15 .

[0047] The non-display portion NA of the display panel 11 includes a first area na1 and a second area na2 disposed at least one side of the first area na1. The chip-on-film 12 is bonded to the first area na1.

[0048] The compensation film bc1 is disposed in the second area na2 and located on at least one side of the chip-on-film 12 .

[0049] The adhesive layer 13 covers the COF 12 and the compensation film bc1 . The polarizer 14 is disposed on the display panel 11 and covers the non-display portion NA and the adhesive layer 13 .

[0050] It should be understood that the embodiment of the present application fills the step of the second area na2 by setting the compensation film bc1, reduces the step difference between the adhesive layer 13 in the first area na1 and the second area na2, improves the flatness of the adhesive layer 13, and thus improves the flatness of the polarizer 14.

[0051] Optionally, in some embodiments of the present application, the display panel 11 includes an array substrate 1a and an opposing substrate 1b disposed on the array substrate 1a. A polarizer 14 is disposed on a side of the opposing substrate 1b away from the array substrate 1a and extends beyond the opposing substrate 1b. An adhesive layer 13 connects the side surface of the opposing substrate 1b to the side of the polarizer 14 close to the array substrate 1a.

[0052] The non-display portion NA includes a portion of the array substrate 1 a located in the binding area, and the chip-on-film 12 and the compensation film bc1 are disposed on the array substrate 1 a.

[0053] It should be noted that the number of COFs 12 may be determined according to the actual size of the display panel 11 . For example, a small display panel 11 may have only one COF 12 , while a large display panel 11 may require multiple COFs 12 .

[0054] It is understood that since the display panel 11 is an electroluminescent panel, the display panel 11 also includes a light-emitting device, which is disposed on the array substrate 1a. The opposing substrate 1b serves as a package cover. The light-emitting device can be an organic light-emitting device, an inorganic light-emitting device, a quantum dot light-emitting device, a micro light-emitting device, or a sub-millimeter light-emitting device.

[0055] If the display panel 11 is a liquid crystal display panel, the display panel 11 further includes a liquid crystal layer disposed between the array substrate 1a and the counter substrate 1b. The counter substrate 1b may be a color filter substrate including a color filter layer or a substrate without a color filter layer.

[0056] Since the COF 12 and compensation film bc1 are disposed on the array substrate 1a, the adhesive layer 13 covers the portion of the array substrate 1a not covered by the opposing substrate 1b. The polarizer 14 also covers the portion of the array substrate 1a not covered by the opposing substrate 1b, achieving a borderless display.

[0057] Please refer to Figure 2In some embodiments, the display module 100 may further include a heat sink 171 and a side adhesive 172. The heat sink 171 is disposed on the side of the array substrate 1a away from the counter substrate 1b. The other end of the COF 12 is bent to the back of the heat sink 171, and the circuit board 15 is disposed on the back of the heat sink 171.

[0058] Side adhesive 172 covers the sides of the array substrate 1a and the counter substrate 1b and connects to the polarizer 14. Optionally, in some embodiments, the display module 100 may further include a heat sink 171 and side adhesive 172. Heat sink 171 is disposed on the side of the array substrate 1a facing away from the counter substrate 1b. The other end of the COF 12 is bent over the back of the heat sink 171, and the circuit board 15 is disposed on the back of the heat sink 171.

[0059] The side coating glue 172 covers the side surfaces of the array substrate 1 a and the counter substrate 1 b and connects to the polarizer 14 .

[0060] In some embodiments of the present application, the display module 100 further includes a conductive adhesive 16 that covers both the first area na1 and the second area na2. The COF 12 and the compensation film bc1 are both connected to the side of the conductive adhesive 16 away from the non-display area NA.

[0061] It can be understood that an integrated conductive adhesive 16 is attached to the binding area of ​​the non-display part NA of the array substrate 1a. Compared with setting the conductive adhesive only on the covering film, the embodiment of the present application extends the conductive adhesive 16 to the second area na2, so that during the hot pressing process, the cover film 12 and the compensation film bc1 can be bound together on the same conductive adhesive 16, saving process steps.

[0062] In addition, the conductive adhesive 16 extending to the second area na2 further reduces the step between the first area na1 and the second area na2 , thereby improving the flatness of the adhesive layer 13 covering the non-display portion NA and the flatness of the polarizer 14 .

[0063] Optionally, the process for hot pressing the COF 12 and the compensation film bc1 can include first pre-pressing the COF 12 and the compensation film bc1 using a pre-pressing head to adhere the COF 12 and the compensation film bc1 to the conductive adhesive 16; then, hot pressing all COFs 12 and all compensation films bc1 using a single long pressing head. Using a single long pressing head to hot press all COFs 12 and compensation films bc1 ensures that the COF 12 and compensation films bc1 are subjected to the same pressure and are confined to the same pressure plane, thereby improving the flatness of the conductive adhesive 16 and, in turn, the flatness of the COF 12 and compensation films bc1.

[0064] Optionally, in some embodiments of the present application, the chip-on-film 12 and the compensation film bc1 are integrally connected.

[0065] It can be understood that the chip-on-film 12 and the compensation film bc1 are integrally connected, so that the two form a whole, which improves the stability of the connection between the two; and during the pre-pressing in the hot pressing step, the two can be aligned with the conductive adhesive 16 only once, and a pre-pressing head is used to pre-press the two at the same time, which improves the efficiency of pre-pressing and improves the flatness of the two during pre-pressing.

[0066] Optionally, the chip-on-film 12 extends from the first area na1 to the second area na2 , wherein the portion of the chip-on-film 12 extending to the second area na2 is the compensation film bc1 .

[0067] Optionally, in some embodiments of the present application, the chip-on-film 12 and the compensation film bc1 may also be separately provided.

[0068] It is understandable that the COF 12 and the compensation film bc1 are separated so that a shorter pre-pressing head can be used to pre-press the COF 12 and the compensation film bc1 respectively during pre-pressing, thereby avoiding the use of a longer pre-pressing head and reducing costs.

[0069] In addition, the separate arrangement of the compensation film bc1 and the COF film 12 facilitates adjustment of the distance between the two and the relative position and distance between the two and the conductive adhesive 16 , thereby better adjusting the flatness of the two.

[0070] exist Figure 1 In the example, the chip-on-film 12 and the compensation film bc1 are connected as a whole, but the invention is not limited thereto. Figure 1 To elaborate.

[0071] The compensation film bc1 is disposed in the second area na2 and located on at least one side of the chip-on-film 12. The compensation film bc1 extends along the first direction F1.

[0072] It should be noted that, a compensation film bc1 may be provided on one side of a chip-on-chip film 12, so that the compensation film bc1 and the chip-on-chip film 12 may be integrated into an inverted L-shape; or two compensation films bc1 may be provided on both sides of a chip-on-chip film 12, so that the compensation film bc1 and the chip-on-chip film 12 may be integrated into a T-shape.

[0073] In some embodiments of the present application, in a long side direction (first direction F1 ) parallel to the non-display portion NA, the first regions na1 and the second regions na2 are alternately arranged.

[0074] In the second area na2 between two adjacent first areas na1 in a direction parallel to the long side of the non-display portion NA, two compensation films bc1 are provided.

[0075] It should be understood that the number of compensation films bc1 provided in the second area na2 can be determined based on the length of the second area na2. In other words, the longer the second area na2 is in the first direction F1, the more compensation films bc1 can be provided. However, this is not limited to this. For example, based on the requirements of the hot pressing process, one compensation film bc1, two compensation films bc1, or three or more compensation films bc1 can be provided for each second area na2.

[0076] Two compensation films bc1 are disposed in the second region na2 between two adjacent first regions na1, thereby forming a T-shaped integrated structure with a compensation film bc1 disposed on each side of a COF 12. This allows the T-shaped structure to be pre-pressed simultaneously with a single pre-pressing head, improving pre-pressing efficiency. Furthermore, the T-shaped integrated structure positions the COF 12 between the two compensation films bc1, ensuring uniformity of the conductive adhesive 16 beneath the COF 12 during pre-pressing and improving the stability and effectiveness of the binding between the COF 12 and the array substrate 1a.

[0077] Optionally, in some embodiments of the present application, the long side of the compensation film bc1 is flush with the side of the non-display portion NA.

[0078] It is understood that the long sides of the compensation film bc1 extend along the first direction F1. The sides of the non-display area NA correspond to the sides of the array substrate 1a. The long sides of the compensation film bc1 are flush with the sides of the array substrate 1a, improving the integrity and flatness of the compensation film bc1 covering the second area na2, thereby improving the overall flatness of the adhesive layer 13.

[0079] Please refer to Figure 3 and Figure 4 Optionally, in some embodiments of the present application, a first binding pad 111 is provided on the first area na1 . The COF 12 includes a second binding pad 121 , which is bonded to the first binding pad 111 via a conductive adhesive 16 .

[0080] The compensation film bc1 includes a third binding pad ry1 , which is disposed on the conductive adhesive 16 .

[0081] It is understood that the first binding pad 111 is provided on the array substrate 1 a , and the second binding pad 121 of the COF 12 is bonded to the first binding pad 111 via the conductive adhesive 16 to transmit signals to the display panel 11 .

[0082] The third binding pad ry1 is provided in the compensation film bc1 to balance the pressure on the compensation film bc1 and the COF 12 during pre-compression and main compression, thereby improving the uniformity of the pressure resistance of the two and reducing the risk of unevenness caused by uneven pressure.

[0083] Optionally, the distance between two adjacent third binding pads ry1 is equal to the distance between two adjacent second binding pads 121 , so as to improve the flatness between the chip-on-film 12 and the compensation film bc1 .

[0084] Optionally, based on the same spacing, the size of the third binding pad ry1 is the same as the size of the second binding pad 121, which can further improve the flatness between the chip-on-film 12 and the compensation film bc1 during hot pressing.

[0085] Optionally, in some embodiments of the present application, the COF 12 includes a base layer 12a and a metal layer 12b disposed on the base layer 12a. The base layer 12a extends from the first area na1 to the second area na2. The metal layer 12b includes a second binding pad 121 located in the first area na1 and a third binding pad ry1 located in the second area na2.

[0086] The portion of the chip-on-film 12 located in the second area na2 forms a compensation film bc1 .

[0087] Optionally, in some embodiments of the present application, the non-display portion NA includes an electrostatic lead-out line 112 . The third binding pads ry1 of the compensation film bc1 located on both sides of the non-display portion NA are electrically connected to the electrostatic lead-out line 112 .

[0088] Please refer to Figure 1 The metal layer 12b includes a trace 12c. The third bonding pad ry1 electrically connected to the electrostatic lead 112 is connected to the trace 12c. The trace 12c extends from the compensation film bc1 region to the COF region 12. The trace 12c is configured to be grounded.

[0089] It is understood that existing COFs also have grounding pads. By reusing the third binding pad ry1 as a secondary grounding pad, the COF 12 can avoid overcrowding in the space provided for the second binding pad 121 and improve the uniformity of force between the COF 12 and the compensation film bc1. Furthermore, since the compensation film bc1 provides ample space for the third binding pad ry1, the area of ​​the third binding pad ry1 can be designed to be larger than that of the second binding pad 121, thereby increasing the yield rate of the third binding pad ry1 and improving anti-static performance.

[0090] It should be noted that, in some embodiments, when the COF 12 and the compensation film bc1 are separately provided, the third binding pad ry1 of the compensation film bc1 is configured not to output or input electrical signals, that is, the third binding pad ry1 is a redundant binding pad.

[0091] In some embodiments, when no binding pad is provided in the array substrate 1a based on the second area na2, the thickness of the compensation film bc1 may be greater than the thickness of the chip-on-film 12 to compensate for the thickness difference of the first binding pad 111, thereby improving the flatness of the compensation film bc1 and the chip-on-film 12.

[0092] Optionally, the thickness difference between the compensation film bc1 and the COF 12 is less than or equal to the thickness of the first binding pad 111 to compensate for the thickness difference of the first binding pad 111 and thereby improve the flatness of the compensation film bc1 and the COF 12 .

[0093] Optionally, based on the area where no binding pad is set in the portion of the array substrate 1a located in the second zone na2, the thickness of the third binding pad ry1 in this area can be greater than the thickness of the second binding pad 121, for example, the number of metal layers forming the third binding pad ry1 is greater than the number of metal layers forming the second binding pad 121.

[0094] The thickness of the third binding pad ry1 is equal to the sum of the thickness of the first binding pad 111 and the thickness of the second binding pad 121 , so as to improve the flatness of the chip-on-film 12 and the compensation film bc1 .

[0095] Figure 5 FIG. 1 shows a schematic diagram of a display module 100 according to one or more embodiments of the present application. Figure 2 The corresponding embodiment, Figure 5 The adhesive layer of the display module 100 of the corresponding embodiment includes at least two sub-layers.

[0096] exist Figure 5 In the embodiment, parts different from the above embodiments will be described to avoid redundant description.

[0097] Optionally, the glue layer 13 includes a first sublayer 131 and a second sublayer 132. The first sublayer 131 covers the COF 12 and the compensation film bc1, and the second sublayer 132 covers a side of the first sublayer 131 away from the non-display area NA.

[0098] The material viscosity of the second sub-layer 132 is higher than the material viscosity of the first sub-layer 131 .

[0099] It is understood that the viscosity of the material of the second sub-layer 132 is higher than that of the material of the first sub-layer 131, resulting in better sealing performance of the first sub-layer 131 and better fluidity of the material of the second sub-layer 132. The better sealing performance of the first sub-layer 131 can effectively seal the chip-on-film 12 and the compensation film bc1, while the better fluidity of the material of the second sub-layer 132 can effectively smooth the topography of the first sub-layer 131, thereby improving the flatness of the adhesive layer 13 and thus the flatness of the polarizer 14.

[0100] Figure 6FIG2 is a schematic diagram of the structure of a display device 1000 according to an embodiment of the present application. The embodiment of the present application further provides a display device 1000, which includes the display module 100 according to any one of the above embodiments.

[0101] It should be noted that the structure of the display module 100 of the display device 1000 disclosed in the present application is similar to or identical to the structure of the display module 100 of the above embodiments, and therefore will not be described in detail here.

[0102] Optionally, the display device 1000 may further include an outer frame 200 , and the display module 100 is disposed within the outer frame 200 .

[0103] In the display device 1000 of the embodiment of the present application, the display panel 11 includes a non-display portion NA, the non-display portion NA includes a first area na1 and a second area na2 arranged on at least one side of the first area na1, the cover chip film is bound and arranged in the first area na1, the compensation film is arranged in the second area na2 and is located on at least one side of the cover chip film 12, the adhesive layer covers the cover chip film 12 and the compensation film bc1, and the polarizer is arranged on the display panel 11 and covers the non-display portion NA and the adhesive layer 13.

[0104] In the embodiment of the present application, the compensation film bc1 is provided to fill the step of the second area na2 , thereby reducing the step difference between the adhesive layer 13 in the first area na1 and the second area na2 , improving the flatness of the adhesive layer 13 , and thus improving the flatness of the polarizer 14 .

[0105] The above is a detailed introduction to a display module and a display device provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for those skilled in the art, based on the ideas of the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A display module, characterized in that: include: The display panel includes a non-display portion, wherein the non-display portion includes a first area and a second area provided on at least one side of the first area; A chip-on-film (CFO), the CFO being bound and disposed in the first area; a compensation film, disposed in the second area and located on at least one side of the chip-on-film; an adhesive layer covering the chip-on-film and the compensation film; as well as a polarizer, disposed on the display panel and covering the non-display portion and the adhesive layer; The chip-on-film and the compensation film are integrally connected, the chip-on-film comprising a base layer and a metal layer disposed on the base layer, the base layer extending from the first area to the second area, the metal layer comprising a second binding pad located in the first area and a third binding pad located in the second area, and the portion of the chip-on-film located in the second area forming the compensation film; The non-display portion includes an electrostatic lead-out line, and the third binding pad of the compensation film located in the two side areas of the non-display portion is electrically connected to the electrostatic lead-out line; the metal layer includes a routing line, and the third binding pad electrically connected to the electrostatic lead-out line is connected to the routing line, and the routing line extends from the area of ​​the compensation film to the area of ​​the flip chip film, and the routing line is configured to be grounded.

2. The display module according to claim 1, wherein: The display module further includes a conductive adhesive, which covers both the first area and the second area. The COF and the compensation film are both connected to a side of the conductive adhesive away from the non-display portion.

3. The display module according to claim 2, wherein: A first binding pad is provided on the first area, the chip-on-film includes a second binding pad, and the second binding pad is bound and connected to the first binding pad through the conductive adhesive; The compensation film includes a third binding pad, and the third binding pad is arranged on the conductive adhesive.

4. The display module according to any one of claims 1 to 3, wherein: The glue layer includes a first sublayer and a second sublayer, the first sublayer covers the COF and the compensation film, and the second sublayer covers a side of the first sublayer away from the non-display portion; The material viscosity of the second sub-layer is higher than the material viscosity of the first sub-layer.

5. The display module according to any one of claims 1 to 3, wherein: In a direction parallel to the long side of the non-display portion, the first areas and the second areas are alternately arranged; Two compensation films are provided in the second area between two adjacent first areas in a direction parallel to the long side of the non-display portion.

6. The display module according to any one of claims 1 to 3, wherein: The long sides of the compensation film are flush with the side sides of the non-display portion.

7. The display module according to any one of claims 1 to 3, wherein: The display panel includes an array substrate and an opposing substrate disposed on the array substrate, the polarizer is disposed on a side of the opposing substrate away from the array substrate and extends beyond the opposing substrate, and the adhesive layer connects a side surface of the opposing substrate and a side surface of the polarizer close to the array substrate; The non-display portion includes a portion of the array substrate located in a binding area, and the chip-on-film and the compensation film are disposed on the array substrate.

8. A display device, characterized in that: Comprising the display module according to any one of claims 1 to 7.

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