A composite cable containing electromagnetic shielding material and a manufacturing method thereof

Abstract

The present invention discloses a composite cable containing an electromagnetic shielding material and a manufacturing method thereof. A composite cable containing an electromagnetic shielding material includes an insulating sheath, a conductive wire core, and a shielding layer. The insulating sheath wraps the conductive wire core, and the shielding layer is embedded in the insulating sheath. The shielding layer includes a semiconductor and graphene. The strip-shaped semiconductor is heated to a molten state in a furnace, and graphene is coated on the surface of the molten semiconductor, and then cooled to obtain a shielding body of the semiconductor and graphene. Every two shielding bodies form a spatial double-helix structure, and a plurality of shielding bodies are woven to form a woven ribbon structure. A method for manufacturing the above-mentioned composite cable is to combine a graphene wire core and a metal copper core to obtain a conductive wire core; then an inner insulating layer, a heat dissipation layer, a shielding layer, a waterproof layer, and an outer insulating layer are sequentially coated on the conductive wire core. The present invention utilizes the semiconductor and graphene to weave a double-helix structure barrier around the conductive wire core, which plays a role in isolating the magnetic field and improving the electromagnetic shielding performance.

Description

Technical Field

[0001] The present invention relates to the technical field of cable manufacturing, and in particular to a composite cable containing an electromagnetic shielding material and a manufacturing method thereof. Background Art

[0002] Electric wires are used to transmit electric power and electrical signals, and mainly consist of a wire core and an insulating sheath wrapped around the wire core. The wire core is mainly made of metallic copper, which has the advantages of low resistance, good electrical conductivity, corrosion resistance and good stability. In signal transmission, usually two copper wires with insulating protective layers are twisted together with a certain density. The electric waves radiated by each wire during transmission will be offset by the electric waves emitted by the other wire, reducing the degree of signal interference. This kind of twisted pair is more commonly used in network cables. In some applications with relatively high shielding requirements, it obviously cannot meet the shielding requirements. When the electric wire is used in a high magnetic field strength environment, the electric wire is prone to heat generation. Since a magnetic force is generated when an electric current passes through a magnetic field, the electric wire will generate a certain oscillation, and an electromotive force will be generated, resulting in an increase in voltage and other phenomena that affect the normal transmission of signals and the service life of the electric wire. Therefore, it is necessary to seek a shielding electric wire that can overcome the use in a strong magnetic field and has a good magnetic field shielding effect. Summary of the Invention

[0003] The purpose of the present invention is to provide a composite cable containing an electromagnetic shielding material and a manufacturing method thereof. A shielding body is made by combining a semiconductor and graphene, and then wound into a double helix structure to form a shielding layer, constructing a barrier for isolating electromagnetic interference and playing an electromagnetic shielding role.

[0004] To solve the above technical problems, the technical solution provided by the present invention is: a composite cable containing an electromagnetic shielding material, including an insulating sheath, a conductive wire core and a shielding layer. The insulating sheath wraps the conductive wire core, and the shielding layer is embedded in the insulating sheath. The shielding layer includes a semiconductor and graphene. The semiconductor is in strip shape. The strip-shaped semiconductor is heated to a molten state in a furnace, and graphene is coated on the surface of the molten semiconductor. After cooling, a shielding body of the semiconductor and graphene is obtained. Every two shielding bodies are wound around each other to form a spatial double helix structure, and a plurality of double helix structure shielding bodies are woven to form a woven belt structure. Among them, graphene has a honeycomb lattice sheet structure, and graphene forms a dense covering layer on the surface of the semiconductor. The number of stacked layers of graphene is 5-8 layers, and the heating temperature of the semiconductor is 1415°C to 1500°C; and a polyurethane coating is coated on the surface of the shielding layer; the gaps between the shielding bodies are connected by carbon nanotubes arranged at intervals, and the carbon nanotubes and the shielding bodies are connected by conductive silver glue or ultrasonic nanowelding.

[0005] The present invention adopts the above technical solution, where a semiconductor and graphene are combined into a group and wound around each other. Then, multiple groups of wound semiconductors and graphene are wound and combined to form a helically woven ribbon-shaped shielding layer. The helical structure formed by each group of shielding bodies is connected by carbon nanotubes in between, enabling the entire woven ribbon-shaped shielding layer to conduct and form a spatial structure, increasing the thickness of the shielding layer, better reflecting and attenuating electromagnetic wave energy, improving the conductivity of the shielding layer, and better guiding external interference signals into the ground. When the shielding layer is applied to wires and cables, the shielding layer can form a barrier for shielding magnetic fields. Based on the reflection, absorption, and skin effect of electromagnetic waves, and being grounded during use, external interference signals are guided into the ground. The polyurethane coating also has an electromagnetic wave absorption effect, capable of absorbing or significantly attenuating the electromagnetic wave energy received on its surface, improving the electromagnetic shielding effect. The composite cable of the present invention combines a semiconductor and graphene into a group and winds them around each other. Then, multiple groups of wound semiconductors and graphene are wound and combined to form a helically woven tape structure, which is embedded in an insulating sheath and surrounds the outer periphery of the conductive wire core, forming a barrier for shielding magnetic fields. Based on the reflection, absorption, and skin effect of electromagnetic waves, and being grounded during use, external interference signals are guided into the ground, improving the electromagnetic shielding effect.

[0006] For the above-mentioned composite cable containing electromagnetic shielding materials, a polyurethane coating mixed with an adhesive is coated on the surface of the shielding layer. The polyurethane coating plays a role in absorbing electromagnetic wave energy and weakening the radiation of electromagnetic waves.

[0007] For the above-mentioned composite cable containing electromagnetic shielding materials, the cross-section of the semiconductor is circular, and the cross-section of the graphene is circular ring-shaped. The thickness of the graphene is greater than or equal to the radius of the semiconductor. The combination of graphene and the semiconductor enhances the performance of absorbing and scattering electromagnetic waves, preventing electromagnetic waves from penetrating and causing a reaction electric field, thereby achieving the effect of electromagnetic shielding. When electromagnetic waves pass through graphene, the electrons in the graphene will be excited and undergo energy level transitions, dissipating part of the electromagnetic energy.

[0008] For the above-mentioned composite cable containing electromagnetic shielding materials, when the semiconductor and graphene are made into a shielding body, a strip-shaped shielding body can also be formed by hot pressing the semiconductor and graphene with the same volume at high temperature, where the component percentage of the semiconductor and graphene is 1:1. Making the shielding body by hot pressing the semiconductor and graphene in equal parts provides a different manufacturing process.

[0009] For the above-mentioned composite cable containing electromagnetic shielding materials, the insulating sheath includes an inner insulating layer, a heat dissipation layer, a waterproof layer, and an outer insulating layer arranged in sequence from the inside to the outside. The inner and outer insulating layers are made of polyethylene materials, and the shielding layer is provided between the heat dissipation layer and the waterproof layer.

[0010] The above-mentioned composite cable containing electromagnetic shielding material has a conductive wire core made of a metal copper core and a graphene wire core, and the graphene wire core surrounds the outer periphery of the metal copper core. Adding graphene material can improve the conductivity of the conductive wire core.

[0011] The above-mentioned composite cable containing electromagnetic shielding material has a conductive wire core composed of two metal copper cores. Graphene coatings are applied on the surfaces of the two metal copper cores. The two metal copper cores are insulated from each other and wound around each other to form a twisted pair.

[0012] For the above-mentioned composite cable containing electromagnetic shielding material, both ends of the carbon nanotubes are supported on two shielding bodies. Each group of shielding bodies is connected by a metal foil, so that the shielding layer is integrally enclosed to form a hollow tubular structure. The metal foil is connected to both ends of the shielding body, and the shielding bodies are stacked on the shielding layer to form several layers of grid structures. The metal foil is a flexible conductive material. After connecting multiple groups of shielding bodies, it can ensure the overall flexibility and conductivity of the shielding layer. When the shielding layer is grounded during use, after peeling off the outer layer of the insulating sheath, the shielding layer can be stretched to a certain extent, which is convenient for operation.

[0013] Another technical solution provided by the present invention is: a manufacturing method of the above-mentioned composite cable containing electromagnetic shielding material, which is obtained by the following steps:

[0014] Step S01: Weave and wind the graphene wire core around the outer periphery of the metal copper core, and press or heat and fuse them together to obtain a conductive wire core;

[0015] Step S02: Immerse the conductive wire core in polyethylene material to cover an inner insulating layer, and then cover a heat dissipation layer made of high-temperature vulcanized silicon after the inner insulating layer cools.

[0016] Step S03: Heat the semiconductor in a furnace to a temperature of 1415 °C to 1500 °C to make its surface in a molten state, then spray graphene on the surface of the semiconductor and cool it to obtain the shielding body of the semiconductor and graphene. Connect both ends of the carbon nanotubes to two of the shielding bodies by conductive silver glue bonding or ultrasonic nanowelding, and then rotate to form a spatial double helix structure. The shielding body in the spatial double helix structure is woven to form a hollow woven belt and used as a shielding layer to be sleeved on the outer periphery of the heat dissipation layer;

[0017] Step S04: Coat a polyurethane coating and a waterproof glue on the surface of the shielding layer in sequence. After solidification, immerse the wire in polyethylene material again, and take it out and solidify to form an outer insulating layer.

[0018] Due to the above manufacturing method, in the electromagnetic shielding composite cable of the present invention, the high electron mobility of graphene on the metal copper core can reduce electron scattering in copper, lower the resistance, and thus significantly improve the conductivity of the material; the high-temperature vulcanized silicone achieves a heat dissipation effect while also having a flame retardant property; the shielding layer uses a spiral woven ribbon structure constructed by weaving semiconductors and graphene to form an electromagnetic shielding barrier, effectively isolating external electromagnetic interference signals; the polyurethane coating plays a role in absorbing electromagnetic waves, reducing the energy of electromagnetic waves radiated onto the cable, the waterproof layer is coated on the surface of the shielding layer to play a waterproofing role, and finally an outer insulating layer is covered on the outer periphery of the waterproof layer to achieve the last layer of insulation of the cable.

[0019] The beneficial effects achieved by the present invention are as follows: After the semiconductor is heated to a molten state, powdered graphene is coated on its surface, and the graphene fuses with the semiconductor into one body. The graphene forms a dense covering layer on the surface of the semiconductor, which can absorb and reflect electromagnetic waves radiated onto its surface, weakening the energy of the electromagnetic waves. Then, the semiconductor and graphene form a shielding body, and every two shielding bodies are connected by carbon nanotubes arranged at intervals and wound to form a spatial double helix structure. Then, multiple groups of shielding bodies with a double helix structure are combined to form a woven belt, realizing an increase in the thickness of the shielding layer. Utilizing the high conductivity of carbon nanotubes and graphene, when in use and grounded, the electromagnetic waves radiated onto the surface of the cable will be reflected and absorbed, and the current generated on the shielding layer will be quickly introduced into the ground, achieving high shielding performance. Among them, the polyurethane coating coated on the surface of the shielding layer is a wave-absorbing material, further absorbing and weakening the energy of electromagnetic wave radiation. The semiconductor is heated to 1415 °C to 1500 °C, exceeding the melting point of the semiconductor, so that a molten state begins to form on the surface of the semiconductor, and the graphene powder can be evenly distributed on the surface of the semiconductor and firmly combined after cooling. The present invention uses semiconductors and graphene to weave and construct a spiral woven belt, which surrounds the conductive wire core to form an electromagnetic shielding barrier. Graphene has good conductivity and can introduce external interference signals into the ground, improving the electromagnetic shielding effect of the cable; the cable of the present invention can be applied to fields such as network cables, control cables, audio and video transmission, and industrial control. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a schematic cross-sectional structure diagram of the composite cable according to an embodiment of the present invention;

[0021] Figure 2 is a schematic cross-sectional structure diagram of other embodiments of the present invention;

[0022] Figure 3 is a schematic structure diagram of the shape of a double helix formed by the combination of the semiconductor and graphene of the present invention;

[0023] Figure 4 is a schematic partial structure diagram of the shielding layer according to an embodiment of the present invention;

[0024] Figure 5 It is a schematic structural diagram of the shielding body according to an embodiment of the present invention;

[0025] Figure 6 It is a schematic structural diagram of the shielding body according to another embodiment of the present invention;

[0026] Figure 7 It is a flowchart of the manufacturing method of the composite cable according to an embodiment of the present invention.

[0027] Description of reference numerals: Insulating sheath 1, Conductive wire core 2, Shielding layer 3, Inner insulating layer 11, Heat dissipation layer 12, Waterproof layer 13, Outer insulating layer 14, Metal copper core 21, Graphene wire core 22, Graphene coating 23, Semiconductor 31, Graphene 32, Carbon nanotube 33, Polyurethane coating 34, Metal foil 35, Shielding body 3a. Detailed implementation manners

[0028] The present invention will be further described below with reference to the accompanying drawings and specific implementation manners.

[0029] Refer to Figures 1 to 6As shown in the figure, a composite cable containing an electromagnetic shielding material includes an insulating sheath 1, a conductive wire core 2, and a shielding layer 3. The insulating sheath 1 wraps the conductive wire core 2, and the shielding layer 3 is embedded in the insulating sheath 1. The shielding layer 3 includes a semiconductor 31 and graphene 32. The semiconductor 31 is strip-shaped. The strip-shaped semiconductor 31 is heated in a furnace to a molten state, and graphene 32 is coated on the surface of the molten semiconductor 31. After cooling, a shielding body 3a of the semiconductor 31 and graphene 32 is obtained. Every two shielding bodies 3a are wound around each other to form a spatial double helix structure. The shielding layer 3 in the form of a woven ribbon is formed by weaving multiple double helix structure shielding bodies 3a. Among them, graphene forms a dense covering layer on the surface of the semiconductor, and graphene has a flaky structure with a honeycomb lattice. The number of stacked layers of graphene is 5 - 8 layers, and the heating temperature of the semiconductor 31 is 1415°C to 1500°C; and a polyurethane coating 34 is coated on the surface of the shielding layer 3; among them, the polyurethane coating 34 is preferably coated on the surface of the shielding body 3a. Among them, the gaps between the shielding bodies 3a are connected by carbon nanotubes 33 arranged at intervals. Among them, the carbon nanotubes 33 and the shielding bodies 3a are connected by conductive silver glue or ultrasonic nanowelding. The semiconductor 31 in this embodiment uses crystalline silicon, and its melting point is 1410°C. When it is heated above its melting point, the semiconductor 31 gradually forms a molten state, and then it is stretched into a strip shape by a stretching machine. Graphene powder is coated on the surface of the molten semiconductor 31, so that the graphene powder adheres to the surface of the semiconductor 31. After cooling and solidifying, graphene and the semiconductor are tightly combined to form the shielding body 3a. When connecting the carbon nanotubes 33 and the shielding bodies 3a, it can be bonded by a silver powder-containing glue with conductive function at a certain curing temperature, and the conductivity can be guaranteed; it can also use high-frequency vibration waves transmitted to the surfaces of two objects to be welded. Under the condition of applying pressure, the surfaces of the two objects rub against each other to form the fusion between molecular layers, thereby completing the connection between the carbon nanotubes 33 and the shielding bodies 3a. After the carbon nanotubes 33 and the shielding bodies 3a are connected, every two shielding bodies 3a are taken as a group, and then a double helix structure is formed through weaving and winding. Then, the shielding layer 3 in the form of a woven ribbon is formed by weaving multiple groups of double helix structure shielding bodies 3a. Among them, the carbon nanotubes have good mechanical properties, and the tensile strength reaches 50 - 200 GPa, which is 100 times that of steel; the carbon nanotubes have high hardness and good flexibility and can be stretched. This makes the structure of the shielding layer 3 firm and not easily scratched by a blade when the cable outer skin is peeled off. When grounding at the head or tail end, it can be stretched and wound for grounding, so that the shielding layer 3 has good structural firmness and operability.

[0030] In this embodiment, the semiconductor 31 is heated to 1415 °C. The surface of the semiconductor 31 starts to soften and gradually forms a molten state. The semiconductor 31 is stretched into a strip shape by the aforementioned stretcher. Then, it is continuously heated to raise the temperature of the semiconductor 31 to 1500 °C. At this time, the surface of the semiconductor 31 enters the molten state and the semiconductor on the surface has higher fluidity. Then, graphene powder is sprayed on the semiconductor to make the graphene combine better with the semiconductor.

[0031] Graphene is an allotrope of carbon. Carbon atoms are bonded by sp² hybridization to form a single-layer hexagonal honeycomb lattice graphene. Using this crystal structure of graphene, fullerenes (C60), graphene quantum dots, carbon nanotubes, nanoribbons, multi-walled carbon nanotubes, and nanohorns can be constructed. Layers of graphene stacked together (more than 10 layers) form graphite, and the layers are held together by van der Waals forces, with an interplanar spacing of 0.335 nanometers. The number of stacked graphene layers in this embodiment is 5 - 8 layers.

[0032] In this embodiment, two shields 3a are placed at intervals, and are connected by spaced carbon nanotubes 33 in between. Then, the two connected shields 3a are rotated to make them continuously spiral, and finally a double-helix structure is formed, as Figure 3 shown. The shield 3a presenting the double-helix structure forms a three-dimensional spatial structure, and then is woven and formed by a warp knitting machine, so that multiple groups of shields 3a with double-helix structures are wound and combined with each other to form a braided strip-shaped shielding layer 3. Among them, the shielding layer 3 is hollow, and a conductor core is used to pass through it. The shielding layer 3 has an electromagnetic shielding effect. The shielding layer 3 of this embodiment can build an electromagnetic shielding barrier in space, and due to the double-helix structure of the shield 3a, the thickness of the shielding layer 3 can be increased when it is made into a braided belt, thereby enhancing its ability to shield electromagnetic interference. Among them, between the shields 3a forming the braided belt, they can be connected by contact conduction, and multiple groups of shields 3a are wound and connected with each other.

[0033] A polyurethane coating 34 mixed with an adhesive is coated on the surface of the shielding layer 3. Polyurethane is an electromagnetic wave absorbing material, which can absorb the electromagnetic wave energy radiated on its surface, weaken the energy of electromagnetic radiation, and assist the shielding layer 3 in shielding electromagnetic interference.

[0034] The cross-section of the semiconductor 31 is circular, and the cross-section of the graphene 32 is annular. The thickness of the graphene 32 is greater than or equal to the radius of the semiconductor 31.

[0035] As Figure 6As shown, in other embodiments, when the semiconductor 31 and the graphene 32 are made into the shielding body 3a, a strip-shaped shielding body 3a can also be formed by hot pressing the semiconductor 31 and the graphene 32 with the same volume, wherein the component percentage of the semiconductor 31 and the graphene 32 is 1:1. The semiconductor 31 can be heated to a semi-molten state, and then the graphene 32 is attached to the surface of the semiconductor 31, and a certain pressure is applied to make them combine.

[0036] Combine Figures 1-6 As shown, the shielding layer 3 is arranged around the conductive wire core 2 and is embedded in the insulating sheath 1 to play a role of a barrier. Each single semiconductor 31 and graphene 32 are wound and coiled with each other to form a double helix structure. Then, the double helix structures composed of multiple groups of semiconductors 31 and graphene 32 are woven into a woven belt. The shielding layer 3 forms a woven belt structure and coaxially surrounds the conductive wire core 2, which can block external electromagnetic signal interference. At the same time, after the graphene 32 is combined with the semiconductor 31 and grounded, the interference signal is connected to the ground.

[0037] In different embodiments, the conduction between the semiconductor 31 and the graphene 32 is realized in different ways. For example, the conduction between each group of semiconductors and graphene is contact conduction. In other embodiments, there is a gap between each group of semiconductors and graphene, and they are connected by carbon nanotubes arranged at intervals. The semiconductor 31 is used for the shielding layer, which can help the shielding layer 3 evenly distribute charges and cooperate with the graphene 32 with high conductivity to conduct the interference current generated by electromagnetic radiation into the ground.

[0038] The semiconductor 31 and the graphene 32 are coiled to form a double helix structure. When multiple groups of double helix structures of the semiconductor 31 and the graphene 32 are combined to form a woven belt-shaped shielding layer 3, the thickness of the shielding layer 3 can be increased, and the electromagnetic shielding performance can be improved.

[0039] The shielding principle of shielded cables is based on the reflection, absorption, and skin effect of electromagnetic waves. The shielding layer of a shielded cable can be a metal braid or copper foil. By grounding, external interference signals are introduced into the ground, thereby reducing interference to the cable. In the embodiments of the present invention, the semiconductor 31 can play a role in evenly distributing the electric field, reducing the local electric field strength, and avoiding excessive electric field strength; graphene 32 is combined on the semiconductor 31, where the graphene 32 can be made into strips and adapted to the shape of the semiconductor 31. The graphene 32 and the semiconductor 31 are combined to form a double helix structure, thereby forming the shielding layer 3 of the cable. Utilizing the high conductivity of graphene 32, the conductivity of the shielding layer 3 is increased, its resistance is reduced, and external electromagnetic interference signals are introduced into the ground. When the cable transmits electrical signals in an environment with a high magnetic field strength, the current in the magnetic field will generate a force, causing the cable to have a certain amplitude. The shielding layer 3 of the cable belongs to a conductor, and in the vibration, it cuts the magnetic induction lines in the magnetic field. When a conductor moves in a magnetic field, a certain magnetic induction current will be generated. In the present invention, the semiconductor 31 and graphene 32 are combined to form a double helix structure, and then multiple groups of the double helix structure of the semiconductor 31 and graphene 32 are combined and woven to form a braided belt structure of the shielding layer 3, making the shielding layer 3 have a larger thickness. On the one hand, it reflects the electromagnetic waves outside the cable, and on the other hand, it uses the high conductivity of graphene 32 to quickly introduce the generated magnetic induction current into the ground after grounding.

[0040] Common shielding layers in cables are metal braids or copper foils. By reflecting external electromagnetic waves, they prevent electromagnetic waves from entering the interior of the cable, thereby reducing the incoming of external interference signals; the shielding layer can also have an absorption effect. The eddy currents in the shielding layer consume the energy of the electromagnetic waves and convert it into heat energy, thereby reducing the intensity of the interference signals; high-frequency electromagnetic waves are more concentrated on the surface of the conductor, and the shielding layer can effectively prevent high-frequency electromagnetic waves from penetrating, further reducing interference.

[0041] In the present invention, the shielding layer 3 is composed of the semiconductor 31 and graphene 32. First, the semiconductor 31 and graphene 32 are combined to form a double helix structure, and they are also conductively connected through contact conduction or carbon nanotubes 33 therebetween. Then, multiple groups of the double helix structure of the semiconductor 31 and graphene 32 are combined and woven into a braided belt-shaped shielding layer 3, making the shielding layer 3 of the present invention have a larger thickness, forming a shielding net on the outer periphery of the conductive wire core 2. When the cable operates in an environment with a high magnetic field strength, external electromagnetic waves cannot penetrate the shielding layer 3, and eddy currents are formed on the surface of the shielding layer 3 to consume the energy of the externally radiated electromagnetic waves, convert it, and concentrate the high-frequency electromagnetic waves on the surface of the shielding layer 3. Finally, the interference signals are introduced into the ground through conversion by grounding, thereby achieving a good shielding effect.

[0042] In other embodiments, the semiconductor and graphene can be combined in other ways. For example, graphene can be coated on the semiconductor as a coating, or graphene powder can be added to the semiconductor to change the conductivity of the semiconductor.

[0043] In this embodiment, the semiconductor is made of one of the materials gallium arsenide, silicon, cadmium sulfide, and gallium phosphide. Each semiconductor and graphene are in a round bar shape, and the grid shape formed on the surface is circular, oval, triangular, or rectangular. The surface of the shielding layer 3 is in a grid shape, so that the shielding layer 3 presents a grid form. When surrounding the outer periphery of the conductive wire core, a shielding net is formed, and it can be stretched during grounding operations. Compared with a rectangle of the same length, the round bar-shaped graphene and semiconductor have a larger cross-sectional area in the shape of a circle. The resistance of a conductor is calculated as R = ρ * L / S, where R is the resistance, ρ is the resistivity, L is the length of the conductor, and S is the cross-sectional area of the conductor. Using graphene and semiconductor as the conductor, its resistivity ρ is determined. In the case of the same length L, the larger its cross-sectional area S, the smaller its resistance R. Therefore, setting graphene and the semiconductor in a round bar shape is beneficial to reducing the resistance value of the shielding layer.

[0044] In this embodiment, the insulating sheath 1 includes an inner insulating layer 11, a heat dissipation layer 12, a waterproof layer 13, and an outer insulating layer 14 arranged in sequence from the inside to the outside. The inner insulating layer 11 and the outer insulating layer 14 are made of polyethylene materials, and the shielding layer 3 is embedded between the heat dissipation layer 12 and the waterproof layer 13.

[0045] The conductive wire core 2 is made of a metal copper core 21 and a graphene wire core 22, and the graphene wire core 22 surrounds the outer periphery of the metal copper core 21. The graphene material has high conductivity, and when combined with the metal copper core 21, it improves the conductivity of the conductive wire core 2. In other embodiments, the graphene material can also be added to the molten metal copper, and the graphene can penetrate into the copper core to improve the conductivity of the copper core. And graphene also has high corrosion resistance and heat resistance, improves the electric field distribution of the metal copper core 21, reduces the air gap between the conductor and the insulating layer, and thus reduces the electric field concentration phenomenon.

[0046] As Figure 2 shown, the conductive wire core 2 is composed of two metal copper cores 21. Graphene coatings 23 are coated on the surfaces of the two metal copper cores 21. The two metal copper cores 21 are insulated from each other and wound around each other to form a twisted pair. Due to the twisted design of the twisted pair, the electromagnetic fields between the two copper wires composed of the two metal copper cores 21 will cancel each other out, thereby reducing the sensitivity to external interference and playing a shielding role. In addition, the twisting of the twisted pair can also help eliminate its own internal interference and external noise interference, and improve the reliability of data transmission.

[0047] As Figure 4As shown, in this embodiment, both ends of the carbon nanotubes 33 are supported on two shielding bodies 3a. Each group of shielding bodies 3a is connected by a metal foil 35, so that the shielding layer 3 as a whole encloses to form a hollow tubular structure. The metal foil 35 is connected to both ends of the shielding body 3a, and the shielding bodies 3a are stacked on the shielding layer 3 to form several grid structures. In this embodiment, the shielding layer 3 is composed of three or more double-helical shielding bodies 3a. The shielding bodies 3a are stacked, so that there will be no large gaps inside the shielding layer 3 to leak electromagnetic waves and allow the electromagnetic waves to directly penetrate the shielding layer 3. The shielding layer 3 with a hollow tubular structure surrounds the conductive wire core 2 to form a barrier, shielding the electromagnetic interference in a strong magnetic environment outside the shielding layer 3. The metal foil 35 is made of a metal material and extended into a thin metal sheet, which is used to connect each group of shielding bodies 3a to construct the spatial tubular shielding layer 3 structure. The holes formed by the gaps between the shielding bodies 3a indicate that after the insulating sheath 1 of the cable is peeled off, the shielding layer 3 can be stretched and has a certain shrinkability to ground the shielding layer 3. And the surface of the shielding layer 3 is dense, playing a role in strongly absorbing and reflecting the electromagnetic wave energy.

[0048] Referring to Figure 7 As shown, the embodiment of the present invention also discloses a manufacturing method of the electromagnetic shielding composite cable described in the above specific embodiment, which is obtained by the following steps:

[0049] Step S01: Weave and wind the graphene wire core around the outer periphery of the metal copper core, and press or heat and fuse them tightly together to obtain a conductive wire core;

[0050] Step S02: Immerse the conductive wire core in polyethylene material to cover an inner insulating layer, and then cover a heat dissipation layer made of high-temperature vulcanized silicon after the inner insulating layer cools;

[0051] Step S03: Heat the semiconductor in a furnace to a temperature of 1415°C to 1500°C to make its surface in a molten state, then spray graphene on the surface of the semiconductor, and after cooling, obtain the shielding body of the semiconductor and graphene. Connect both ends of the carbon nanotubes to two of the shielding bodies by conductive silver glue bonding or ultrasonic nano-welding, and then rotate to form a spatial double-helical structure. The shielding bodies in the spatial double-helical structure are woven to form a hollow braided belt and used as a shielding layer to be sleeved on the outer periphery of the heat dissipation layer;

[0052] Step S04: Coat a polyurethane coating and a waterproof glue on the surface of the shielding layer in sequence. After solidification, immerse the wire in polyethylene material again, and take it out and solidify to form an outer insulating layer.

[0053] Step S01 is the step of manufacturing the conductive wire core. In step S01, the graphene wire core 22 is in a round strip shape and is wound around the outer periphery of the metal copper core 21. Then, the temperature is raised by heating, so that the temperature of the metal copper core 21 rises to 1090 °C, exceeding its melting point. The surface of the metal copper core 21 begins to soften. Then, the graphene wire core 22 wound around the metal copper core 21 is pressed and bonded onto the metal copper core 21 to complete the manufacturing of the conductive wire core 2;

[0054] Step S02 is to coat the inner insulation layer 11 and the heat dissipation layer 12 on the conductive wire core. The polyethylene material is heated into a molten liquid state. The conductive wire core 2 is immersed and passed through the polyethylene material, so that the polyethylene covers the outer surface of the conductive wire core 2. Then, after cooling and shaping, the heat dissipation layer 12 is covered on the inner insulation layer 11 in the same way. The heat dissipation layer 12 can be made of high-temperature vulcanized silicone;

[0055] Step S03 is the manufacturing of the shielding layer. In step S03, the semiconductor starts to melt at a temperature of 1410 °C. In this implementation step, the semiconductor is heated to 1415 °C or above, so that the surface of the semiconductor 31 melts. Then, powdered graphene is sprayed on the surface of the semiconductor 31, so that the surface of the semiconductor 31 is covered with graphene 32. After cooling and solidifying, it is shaped, so that the graphene 32 wraps around the outer periphery of the semiconductor 31 to form a shielding body 3a for manufacturing the shielding layer 3; Then, every two shielding bodies 3a are used, and carbon nanotubes 33 are connected between the two shielding bodies 3a by means of conductive silver glue bonding or ultrasonic nanowelding. Then, using equipment such as a warp knitting machine, one end of the two shielding bodies 3a is rotated around the center line of the distance between them, and a spatial double helix structure is formed by rotation; Then, multiple groups of double helix structure shielding bodies are woven to form a woven belt, so that the woven belt has a relatively thick thickness and can stack more layers. The woven belt is used as the shielding layer 3 and is sleeved on the outer periphery of the heat dissipation layer 12;

[0056] In step S04, finally, an electromagnetic wave absorbing polyurethane coating 34 is coated on the surface of the shielding layer 3 to further absorb the energy of electromagnetic waves. Then, a waterproof glue is coated to form a waterproof layer 13 and a polyethylene rubber to complete the covering of the outer insulation layer 14.

[0057] Among them, in step S03, after the shielding layer 3 in the shape of a woven belt is woven, metal foils 35 can be passed through both ends of the shielding layer 3 to connect each double helix structure shielding body 3a to form a hollow woven belt.

[0058] The electromagnetic shielding composite cable obtained by this method, with the composite semiconductor and graphene as the shielding layer, has high shielding performance and electrical conductivity, and is applicable to fields such as industrial control, signal transmission, and long-distance power transmission.

[0059] In other embodiments, when manufacturing the conductive wire core, a graphene coating 23 is coated on the surface of the metal copper core 21 to replace the woven and wound graphene wire core 22.

[0060] In the specific implementation of the present invention, the graphene wire core 22 is woven and wound around the outer periphery of the metal copper core 21, and then the graphene wire core 22 can be tightly connected to the metal copper core 21 by pressing, or the graphene wire cores 21 can be combined together by heating the metal copper core 21, that is, by heating to melt the surface of the metal copper core 21 to form a molten state, and the graphene wire core 22 is fused on the surface of the metal copper core 21. After cooling and solidifying, the metal copper core 21 and the graphene wire core 22 are tightly combined.

[0061] Then, an insulating sheath 1 is covered on the conductive wire core 2. A polyethylene material is formed on the outer surface of the conductive wire core 2 to form an inner insulating layer 11, and high-temperature vulcanized silicon is covered on the outer surface of the inner insulating layer 11 to form a heat dissipation layer 12. Then, the woven shielding layer 3 is sleeved on the outer surface of the heat dissipation layer 12, and the shielding layer 3 is kept coaxial with the conductive wire core 2. Then, a waterproof glue is coated on the surface to form a waterproof layer 13, and finally, a polyethylene material is formed on the outer surface of the waterproof layer 13 to form an outer insulating layer 14.

[0062] In summary, the present invention has been made into actual samples and tested many times as described in the specification and the illustrated content. From the test results, it can be proved that the present invention can achieve its expected purpose, and its practical value is beyond doubt. The above-mentioned embodiments are only used to illustrate the present invention for convenience, and do not impose any form of limitation on the present invention. Any person with ordinary knowledge in the technical field can, without departing from the technical features of the present invention, make local changes or modified equivalent embodiments by using the technical content disclosed in the present invention, and without departing from the technical feature content of the present invention, still fall within the scope of the technical features of the present invention.

Claims

1. A composite cable containing electromagnetic shielding material, comprising an insulating sheath, a conductive core and a shielding layer, wherein the insulating sheath wraps the conductive core, and the shielding layer is embedded in the insulating sheath, characterized in that: The shielding layer comprises a semiconductor and graphene, wherein the semiconductor is in a strip shape, the strip semiconductor is heated to a molten state in a furnace, graphene is coated on the surface of the molten semiconductor, and the semiconductor and graphene shielding body is obtained by cooling, wherein every two shielding bodies are intertwined to form a spatial double helix structure, and a plurality of shielding bodies with double helix structures are woven to form a woven belt structure, wherein the graphene is in a honeycomb lattice sheet structure, the graphene forms a dense covering layer on the surface of the semiconductor, the number of graphene stacking layers is 5-8 layers, and the semiconductor heating temperature is 1415°C~1500°C; and a polyurethane coating is coated on the surface of the shielding layer; the gaps between the shielding bodies are connected by spaced carbon nanotubes, wherein the carbon nanotubes and the shielding bodies are connected by conductive silver glue or ultrasonic nano welding.

2. The composite cable containing electromagnetic shielding material according to claim 1, characterized in that: The polyurethane coating mixed with the adhesive is coated on the surface of the shielding layer.

3. The composite cable containing electromagnetic shielding material according to claim 1, characterized in that: The cross section of the semiconductor is circular, the cross section of the graphene is annular, and the thickness of the graphene is greater than or equal to the radius of the semiconductor.

4. The composite cable containing electromagnetic shielding material according to claim 1, characterized in that: When the semiconductor and graphene are made into a shielding body, the semiconductor and graphene of the same volume are pressed together at high temperature to form a strip-shaped shielding body, wherein the composition percentage of the semiconductor and the graphene is 1:

1.

5. The composite cable containing electromagnetic shielding material according to claim 1, characterized in that: The insulating sheath comprises an inner insulating layer, a heat dissipation layer, a waterproof layer and an outer insulating layer which are arranged in sequence from the inside to the outside, wherein the inner and outer insulating layers are made of polyethylene material, and the shielding layer is arranged between the heat dissipation layer and the waterproof layer.

6. The composite cable containing electromagnetic shielding material according to claim 5, characterized in that: The conductive core is made of a metal copper core and a graphene core, and the graphene core surrounds the outer circumference of the metal copper core.

7. The composite cable containing electromagnetic shielding material according to claim 5, characterized in that: The conductive wire core is composed of two metal copper cores, the surfaces of the two metal copper cores are coated with graphene coatings, the two metal copper cores are insulated from each other and are intertwined to form a twisted pair.

8. The composite cable containing electromagnetic shielding material according to claim 1, characterized in that: The two ends of the carbon nanotubes are supported on two shielding bodies, and each group of shielding bodies is connected by metal foil, so that the shielding layer is enclosed as a whole to form a hollow tubular structure. The metal foil is connected to the two ends of the shielding body, and the shielding body is stacked on the shielding layer to form a grid structure of several layers.

9. A method for manufacturing a composite cable containing an electromagnetic shielding material as claimed in any one of claims 1 to 8, characterized in that: Prepared by the following steps: Step S01: weaving and winding the graphene core around the outer periphery of the metal copper core, pressing them tightly or heating and fusing them into one, to obtain a conductive core; Step S02: immersing the conductive wire core in polyethylene material, covering it with an inner insulating layer, and then covering it with a heat dissipation layer made of high-temperature silicon sulfide after the inner insulating layer is cooled; Step S03: heating the semiconductor to 1415°C-1500°C in a furnace to form a molten state on its surface, spraying graphene on the surface of the semiconductor, and obtaining a shielding body of the semiconductor and graphene after cooling, connecting the two ends of the carbon nanotubes to two of the shielding bodies by means of conductive silver glue bonding or ultrasonic nano welding, and then rotating them to form a spatial double helix structure, weaving the shielding body with a spatial double helix structure to form a hollow braided belt and sheathing it on the periphery of the heat dissipation layer as a shielding layer; Step S04: Coat the surface of the shielding layer with a polyurethane coating and a waterproof glue in sequence, immerse the wire in a polyethylene material after solidification, and take it out and solidify to form an outer insulation layer.

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