A packaging method for chip packaging structure based on three-dimensional stacking

Abstract

The invention relates to the field of chip packaging technology and discloses a packaging method based on a three-dimensional stacked chip packaging structure, comprising a workbench, wherein a plurality of hexagonal columns are fixedly connected to one side of the top of the workbench, a top platform is fixedly connected to the top of the hexagonal columns, and a plurality of table legs are fixedly connected to the four sides of the bottom of the workbench. A substrate is placed above a supporting flexible plate, and a chip is placed on the bottom of a suction orifice plate for adsorption. The forward and reverse motors are started, and the forward and reverse motors drive the threaded columns to rotate. During the rotation of the threaded columns, the circular shell is driven to descend, and the circular shell drives the filter plate to descend. During the falling of the filter plate, the suction orifice plate is pressed down, and the suction orifice plate drives the chip to descend, so that the two chips are docked. The suction orifice plate pressurizes the chips through the rotation of the forward and reverse motors to prevent the epoxy resin between the chips from generating bubbles, thereby strengthening the connection effect between the chips and improving the quality of the finished product of the stacked chips.

Description

[0001] This application is a divisional application of the application filed on July 12, 2024, with application number 202410933170.9 and invention name “A chip packaging structure and packaging method based on three-dimensional stacking”. Technical Field

[0002] The present invention relates to the technical field of chip packaging, and in particular to a packaging method based on a three-dimensional stacked chip packaging structure. Background Art

[0003] A chip packaging device based on three-dimensional stacking is generally used to vertically stack and package multiple chips together to improve chip density and performance.

[0004] However, in the existing technology, the stacked chips need to be pressed together during the chip stacking process. During the pressing process, the epoxy resin used to bond the two chips cannot be air-dried and hardened, which affects the hardening efficiency of the device, making it impossible to carry out subsequent work continuously, thereby reducing the working efficiency of the device. Summary of the Invention

[0005] The object of the present invention is to provide a packaging method based on a three-dimensional stacked chip packaging structure to solve the problems raised in the above background technology.

[0006] To solve the above technical problems, the present invention is achieved through the following technical solutions:

[0007] The present invention is a chip packaging structure based on three-dimensional stacking, including a workbench, a plurality of hexagonal columns fixedly connected to one side of the top of the workbench, the top of the hexagonal columns fixedly connected to the top platform, a plurality of table legs fixedly connected to the four sides of the bottom of the workbench, a working groove is provided on one side of the top of the workbench, and also includes a lifting packaging mechanism, the lifting packaging mechanism includes a forward and reverse motor fixedly connected to the top of the top platform, the output end of the forward and reverse motor is fixedly connected to a threaded column, one end of the threaded column passes through the top platform and extends to the outside of the top platform, one end of the threaded column is sleeved on the outer wall and threadedly connected to a round shell, one side of the outer wall of the round shell is fixedly connected to an extrusion block, and the inner wall of the round shell is provided with a hardening component.

[0008] Furthermore, the hardening component includes a circular groove opened on the top of the inner wall of the circular shell, and a rotating block is sleeved on the inner wall of the circular groove and rotatably connected to it. One end of the rotating block is fixedly connected to the main gear, and a number of secondary gears are respectively meshed and connected to the outer wall of the main gear. A fixed rod is sleeved on the inner wall of the secondary gear and contacts it, and one end of the fixed rod is fixedly connected to the top of the inner wall of the circular shell.

[0009] Furthermore, a rotating sleeve is fixedly connected to the bottom of the secondary gear, an arc-shaped fan is sleeved on the outer wall of the rotating sleeve and fixedly connected, an annular heater is sleeved on the inner wall of the circular shell and fixedly connected, a filter plate is sleeved on the bottom end of the inner wall of the circular shell and fixedly connected, a first telescopic rod is fixedly connected to the two sides of the bottom of the top platform, the output end of the first telescopic rod is fixedly connected to the suction orifice plate, a number of vertical grooves are respectively provided on the outer wall of the threaded column, a vertical block is sleeved on the inner wall of the vertical groove and slidably connected, and one end of the vertical block is fixedly connected to the inner wall of the main gear.

[0010] Furthermore, a clamping assembly is provided on the inner wall of the working groove, and the clamping assembly includes a hexagonal rod fixedly connected to both sides of the bottom of the inner wall of the working groove, the top of the hexagonal rod is fixedly connected to a square platform, sliding grooves are respectively provided on both sides of the top of the square platform, and square holes are respectively provided at both ends of the top of the square platform close to the sliding grooves. An airbag is fixedly connected to one side of the working table close to the hexagonal column, and the bottom ends of both sides of the airbag are respectively connected to air pipes.

[0011] Furthermore, one end of the air pipe is connected to a conversion box, the bottom of the conversion box is fixedly connected to the top of the workbench, one side of the inner wall of the conversion box is fixedly connected to a first return spring, one end of the first return spring is fixedly connected to a first movable plate, and the side of the first movable plate away from the first return spring is fixedly connected to a first extrusion rod, and one end of the first extrusion rod passes through the conversion box and extends to the outside of the conversion box.

[0012] Furthermore, a telescopic spring is fixedly connected to one side of the inner wall of the sliding groove, one end of the telescopic spring is fixedly connected to the guide rail shell, an extrusion spring is fixedly connected to the bottom of the inner wall of the guide rail shell, one end of the extrusion spring is fixedly connected to the lifting plate, the outer wall of the lifting plate is slidably connected to the inner wall of the guide rail shell, a bent rod is fixedly connected to one side of the lifting plate, and the end of the bent rod away from the lifting plate is fixedly connected to the clamping plate.

[0013] Furthermore, an auxiliary component is provided on the inner wall of the working groove, and the auxiliary component includes a barrel fixedly connected to the center of the bottom of the inner wall of the working groove, a second telescopic rod is fixedly connected to the bottom of the inner wall of the barrel, a circular plate is sleeved and in contact with the top of the inner wall of the barrel, and a vertical rod is fixedly connected to the top of the circular plate.

[0014] Furthermore, one end of the vertical rod passes through the barrel and extends to the outside of the square platform, the top of the vertical rod is fixedly connected to a load-bearing flexible plate, the bottom ends of both sides of the outer wall of the barrel are respectively connected to vertical boxes, the bottom of the inner wall of the vertical box is fixedly connected to a second return spring, one end of the second return spring is fixedly connected to the second movable plate, the top of the second movable plate is fixedly connected to a lifting rod, one end of the lifting rod passes through the vertical box and extends to the outside of the vertical box, and the top of the lifting rod is fixedly connected to a triangular blade.

[0015] Furthermore, the outer wall of the triangular blade contacts the inner wall of the square hole, and an exhaust pipe is connected to one side of the top of the outer wall of the vertical box. One end of the exhaust pipe passes through the square table and extends to the outside of the square table. The end of the exhaust pipe away from the vertical box is connected to a diffuser, and the bottom of the diffuser is fixedly connected to the top of the square table.

[0016] A packaging method based on a three-dimensional stacked chip packaging structure, the chip packaging method comprising the following steps:

[0017] Step 1: Start the forward and reverse motors, which drive the threaded column to rotate. During the rotation of the threaded column, the round shell is driven to descend, and the round shell drives the filter plate to descend. During the falling process of the filter plate, the suction orifice plate is pressed down, and the suction orifice plate drives the chip to descend, thereby solving the process of stacking chips.

[0018] Step 2: During the descent of the hardening component, the annular heater is started, and the vertical groove opened on the threaded column engages with the inner wall of the sleeved vertical block. When the threaded column rotates, it drives the vertical block to rotate, and the vertical block drives the connected main gear to rotate, and the main gear drives the secondary gear to rotate, and the secondary gear drives the rotating sleeve to rotate, and the rotating sleeve drives the arc fan to rotate. The setting of the filter plate and the suction orifice plate solves the problem of slow hardening process during chip stacking.

[0019] Step 3: The round shell drives the extrusion block to descend. The extrusion block descends. Through the setting of the air bag, the air pipe, the conversion box, and the first return spring, the first movable plate moves. The first movable plate drives the first extrusion rod to move. During the movement of the first extrusion rod, the guide rail shell is pushed to move. The problem of inaccurate alignment during the stacking process is solved by the coordinated setting of the extrusion spring, the lifting plate, the bending rod, the clamping plate and the suction orifice plate device.

[0020] Step 4: During the process of the chip being pressed down, the chip drives the supporting flexible plate to fall, the supporting flexible plate drives the vertical rod to fall, the vertical rod drives the circular plate to move downward, the circular plate moves downward, and air pressure is generated. The air pressure passes through the barrel, the vertical box, and the second return spring, and the second movable plate moves upward, and the second movable plate drives the lifting rod to move upward, and the lifting rod drives the triangular blade to rise. When the second movable plate moves to the top of the vertical box, the exhaust pipe and the diffuser are set to solve the problem of slow hardening efficiency.

[0021] The present invention has the following beneficial effects:

[0022] In the present invention, the substrate is placed above the supporting flexible board, and the chip is placed on the bottom of the suction orifice plate for adsorption, and the forward and reverse motors are started. The forward and reverse motors drive the threaded column to rotate, and the threaded column drives the round shell to descend during the rotation, and the round shell drives the filter plate to descend. During the falling process of the filter plate, the suction orifice plate is pressed down, and the suction orifice plate drives the chip to descend, so that the two chips are docked, and through the rotation of the forward and reverse motors, the suction orifice plate pressurizes the chip to prevent the epoxy resin between the chips from generating bubbles, thereby strengthening the connection effect between the chips and improving the quality of the finished product of the stacked chips.

[0023] (2) In the present invention, during the process of the hardening component descending, the annular heater is started, and the annular heater heats the air flow inside the circular shell. The vertical groove opened at the threaded column is engaged with the inner wall of the sleeved vertical block. When the threaded column rotates, it drives the vertical block to rotate, and the vertical block drives the connected main gear to rotate, the main gear drives the secondary gear to rotate, the secondary gear drives the rotating sleeve to rotate, and the rotating sleeve drives the arc fan to rotate. The arc fan generates air flow, and the heated air flow passes through the filter holes of the filter plate and the suction orifice plate to heat the stacked chips during the bonding process, thereby accelerating the hardening process between the stacked chips and improving the working efficiency of the device.

[0024] (3) In the present invention, the circular shell drives the extrusion block to descend, and the extrusion block squeezes the airbag during the falling process. The airflow inside the airbag enters the interior of the conversion box through the air pipe, and the airflow pushes the first movable plate inside the conversion box. The first movable plate drives the first extrusion rod to move, and the first extrusion rod pushes the guide rail shell to move during the movement. The two guide rail shells approach each other, so that the clamping plate in the clamping assembly clamps the chip, which enhances the accuracy of the device when stacking the chips. In addition, the suction orifice plate will press down the clamping plate during the falling process, and the clamping plate drives the bending rod to descend, and the bending rod drives the lifting plate to descend. The lifting plate is lifted and lowered in the groove of the guide rail shell, so that stacked chips of different layers can be clamped, which enhances the applicability of the device clamping.

[0025] (4) In the present invention, when the chip is pressed down, the chip drives the supporting flexible plate to fall, the supporting flexible plate drives the vertical rod to fall, the vertical rod drives the circular plate to move downward, and air pressure is generated during the circular plate's downward movement. The airflow in the air pressure enters the interior of the vertical box through the barrel. After the airflow enters the interior of the vertical box, the airflow pushes the second movable plate to move upward, the second movable plate drives the lifting rod to move upward, and the lifting rod drives the triangular blade to rise. During the triangular blade's rise, the epoxy resin leaked out when the chip is squeezed can be cut off, thereby enhancing the aesthetics of the stacked chips. When the second movable plate moves to the top of the vertical box, the airflow enters the interior of the diffuser through the exhaust pipe, and the airflow is diffused by the top platform, thereby air-drying the chips during the stacking process, thereby enhancing the hardening efficiency of the device and improving the working efficiency of the device.

[0026] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0028] Figure 1 It is a schematic diagram of the overall side structure of the present invention;

[0029] Figure 2 This is a schematic diagram of the overall side half-section structure of the present invention;

[0030] Figure 3 It is a bottom view schematic diagram of part of the structure of the present invention;

[0031] Figure 4 This is a schematic diagram of the half-section side structure of the hardened component of the present invention;

[0032] Figure 5 This is a schematic top view of the interior of a portion of the structure of the present invention;

[0033] Figure 6 A schematic diagram of a half-section top view of a portion of the structure of the present invention;

[0034] Figure 7 For the present invention Figure 2 A magnified view of middle A;

[0035] Figure 8 For the present invention Figure 4 Enlarged view of middle B;

[0036] Figure 9 For the present invention Figure 6Enlarged view of middle C;

[0037] Figure 10 For the present invention Figure 6 Enlarged view of middle D;

[0038] Figure 11 Schematic diagram of the packaging method of the present invention.

[0039] In the accompanying drawings, the components represented by the reference numerals are as follows:

[0040] In the figure: 1. workbench; 2. hexagonal column; 3. top platform; 4. table leg; 5. working groove; 6. lifting and packaging mechanism; 61. forward and reverse motor; 62. threaded column; 63. round shell; 64. extrusion block; 65. hardening component; 66. clamping component; 67. auxiliary component; 651. round groove; 652. rotating block; 653. main gear; 654. secondary gear; 655. fixing rod; 656. rotating sleeve; 657. arc fan; 658. ring heater; 659. filter plate; 6510. first telescopic rod; 6512. suction orifice plate; 661. hexagonal rod; 662. square table; 663. sliding groove; 664. square hole; 665. gas Bag; 666, air pipe; 667, conversion box; 668, first return spring; 669, first movable plate; 6610, first extrusion rod; 6611, telescopic spring; 6612, guide rail housing; 6613, extrusion spring; 6614, lifting plate; 6615, bending rod; 6616, clamping plate; 671, barrel; 672, second telescopic rod; 6714, circular plate; 675, vertical rod; 676, load-bearing flexible plate; 677, vertical box; 678, second return spring; 679, second movable plate; 6710, lifting rod; 6711, triangular blade; 6712, exhaust pipe; 6713, diffuser; 6514, vertical slot; 6515, vertical block. DETAILED DESCRIPTION

[0041] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0042] Example 1, please refer to Figures 1-11 As shown, the present invention is a chip packaging structure based on three-dimensional stacking, comprising a workbench 1, with a plurality of hexagonal columns 2 fixedly connected to one side of the top of the workbench 1. The purpose of such a configuration is to enhance the fixing effect. The top of the hexagonal columns 2 is fixedly connected to a top platform 3. The bottom of the workbench 1 is fixedly connected to a plurality of legs 4 on all sides. A working groove 5 is provided on one side of the top of the workbench 1.

[0043] The lifting and packaging mechanism 6 includes a forward and reverse motor 61 fixedly connected to the top of the top platform 3, and the output end of the forward and reverse motor 61 is fixedly connected to a threaded column 62. One end of the threaded column 62 passes through the top platform 3 and extends to the outside of the top platform 3. A circular shell 63 is sleeved on the outer wall of one end of the threaded column 62 and threadedly connected. An extrusion block 64 is fixedly connected to one side of the outer wall of the circular shell 63, and a hardening component 65 is provided on the inner wall of the circular shell 63.

[0044] The hardening component 65 includes a circular groove 651 opened on the top of the inner wall of the circular shell 63. The inner wall of the circular groove 651 is sleeved and rotatably connected with a rotating block 652. The purpose of this arrangement is to prevent the main gear 653 from falling off. One end of the rotating block 652 is fixedly connected to the main gear 653. Several secondary gears 654 are meshed and connected around the outer wall of the main gear 653. The inner wall of the secondary gear 654 is sleeved and contacted with a fixing rod 655. The purpose of this arrangement is to prevent the secondary gear 654 from falling off. One end of the fixing rod 655 is fixedly connected to the top of the inner wall of the circular shell 63.

[0045] The bottom of the secondary gear 654 is fixedly connected to a rotating sleeve 656, and the outer wall of the rotating sleeve 656 is sleeved and fixedly connected to an arc fan 657, the inner wall of the circular shell 63 is sleeved and fixedly connected to an annular heater 658, and the bottom end of the inner wall of the circular shell 63 is sleeved and fixedly connected to a filter plate 659, and the two sides of the bottom of the top platform 3 are respectively fixedly connected to the first telescopic rod 6510, the purpose of this arrangement is to follow the lifting and retraction of the suction orifice plate 6512, and the first telescopic rod 6510 itself does not have the function of automatic retraction, and the output end of the first telescopic rod 6510 is fixedly connected to the suction orifice plate 6512, and the purpose of this arrangement is to adsorb the chip, and the outer wall of the threaded column 62 is respectively provided with a plurality of vertical grooves 6514, and the inner wall of the vertical groove 6514 is sleeved and slidably connected to a vertical block 6515, and one end of the vertical block 6515 is fixedly connected to the inner wall of the main gear 653. It should be noted that (see Figure 4 ), the first telescopic rod 6510 includes a telescopic base and a telescopic core rod, and the telescopic core rod is slidably arranged inside the telescopic base.

[0046] Place the substrate above the supporting flexible plate 676, and place the chip on the bottom of the suction orifice plate 6512 for adsorption, start the forward and reverse motor 61, and the forward and reverse motor 61 drives the threaded column 62 to rotate. During the rotation of the threaded column 62, the round shell 63 is driven to descend, and the round shell 63 drives the filter plate 659 to descend. During the falling process of the filter plate 659, the suction orifice plate 6512 is pressed down, and the suction orifice plate 6512 drives the chip to descend, so that the two chips are docked, and through the rotation of the forward and reverse motor 61, the suction orifice plate 6512 pressurizes the chip to prevent the epoxy resin between the chips from generating bubbles, thereby strengthening the connection effect between the chips and improving the quality of the finished product of the stacked chips. It should be noted that the suction orifice plate 6512 is an existing device with holes and adsorption force.

[0047] During the descent of the hardening component 65, the annular heater 658 is started, and the annular heater 658 heats the air flow inside the circular shell 63. The vertical groove 6514 opened at the threaded column 62 is engaged with the inner wall of the sleeved vertical block 6515. When the threaded column 62 rotates, it drives the vertical block 6515 to rotate, and the vertical block 6515 drives the connected main gear 653 to rotate. The main gear 653 drives the secondary gear 654 to rotate, and the secondary gear 654 drives the rotating sleeve 656 to rotate. The rotating sleeve 656 drives the arc fan 657 to rotate, and the arc fan 657 generates airflow. The heated airflow passes through the filter hole of the filter plate 659 and the suction orifice plate 6512 to heat the stacked chips during the bonding process, thereby accelerating the hardening process between the stacked chips and improving the working efficiency of the device.

[0048] In Example 2, a clamping assembly 66 is provided on the inner wall of the working groove 5. The clamping assembly 66 includes a hexagonal rod 661 fixedly connected to both sides of the bottom of the inner wall of the working groove 5. The top of the hexagonal rod 661 is fixedly connected to a square platform 662. Sliding grooves 663 are respectively provided on both sides of the top of the square platform 662. Square holes 664 are respectively provided at both ends of the top of the square platform 662 near the sliding grooves 663. An air bag 665 is fixedly connected to the side of the working table 1 near the hexagonal column 2. The bottom ends of both sides of the air bag 665 are respectively connected to air pipes 666.

[0049] One end of the air pipe 666 is connected to the conversion box 667, the bottom of the conversion box 667 is fixedly connected to the top of the workbench 1, and the first return spring 668 is fixedly connected to one side of the inner wall of the conversion box 667. The purpose of this arrangement is to facilitate resetting. One end of the first return spring 668 is fixedly connected to the first movable plate 669, and the side of the first movable plate 669 away from the first return spring 668 is fixedly connected to the first extrusion rod 6610. One end of the first extrusion rod 6610 passes through the conversion box 667 and extends to the outside of the conversion box 667.

[0050] A telescopic spring 6611 is fixedly connected to one side of the inner wall of the sliding groove 663, one end of the telescopic spring 6611 is fixedly connected to the guide rail shell 6612, an extrusion spring 6613 is fixedly connected to the bottom of the inner wall of the guide rail shell 6612, one end of the extrusion spring 6613 is fixedly connected to the lifting plate 6614, the outer wall of the lifting plate 6614 is slidably connected to the inner wall of the guide rail shell 6612, one side of the lifting plate 6614 is fixedly connected to a bent rod 6615, and the end of the bent rod 6615 away from the lifting plate 6614 is fixedly connected to the clamping plate 6616.

[0051] The inner wall of the working groove 5 is provided with an auxiliary component 67, which includes a barrel 671 fixedly connected to the center of the bottom of the inner wall of the working groove 5. The bottom of the inner wall of the barrel 671 is fixedly connected to a second telescopic rod 672. It should be noted that compared with the first telescopic rod 6510, the second telescopic rod 672 also includes a telescopic base and a telescopic core rod. The telescopic core rod is slidably arranged inside the telescopic base. At the same time, a spring is provided between the telescopic base and the telescopic core rod to adjust the distance between the telescopic base and the telescopic core rod. The top of the inner wall of the barrel 671 is sleeved and in contact with a circular plate 6714, and the top of the circular plate 6714 is fixedly connected to a vertical rod 675.

[0052] One end of the vertical rod 675 passes through the barrel 671 and extends to the outside of the square platform 662. The top of the vertical rod 675 is fixedly connected to a load-bearing flexible plate 676. The purpose of this arrangement is to prevent damage to the chip caused by excessive extrusion. The bottom ends of both sides of the outer wall of the barrel 671 are respectively connected to vertical boxes 677. The bottom of the inner wall of the vertical box 677 is fixedly connected to a second return spring 678. One end of the second return spring 678 is fixedly connected to a second movable plate 679. The top of the second movable plate 679 is fixedly connected to a lifting rod 6710. One end of the lifting rod 6710 passes through the vertical box 677 and extends to the outside of the vertical box 677. The top of the lifting rod 6710 is fixedly connected to a triangular blade 6711. The purpose of this arrangement is to facilitate outward extension from the square hole 664.

[0053] The outer wall of the triangular blade 6711 contacts the inner wall of the square hole 664. The top side of the outer wall of the vertical box 677 is connected to an exhaust pipe 6712. One end of the exhaust pipe 6712 passes through the square platform 662 and extends to the outside of the square platform 662. The end of the exhaust pipe 6712 away from the vertical box 677 is connected to a diffuser 6713. The purpose of this setting is to diffuse the range of the airflow. The bottom of the diffuser 6713 is fixedly connected to the top of the square platform 662.

[0054] When in use, the round shell 63 drives the extrusion block 64 to descend. The extrusion block 64 squeezes the air bag 665 during the falling process. The air flow inside the air bag 665 enters the interior of the conversion box 667 through the air pipe 666. The air flow pushes the first movable plate 669 inside the conversion box 667. The first movable plate 669 drives the first extrusion rod 6610 to move. The first extrusion rod 6610 moves and pushes the guide rail shell 6612 to move. The two guide rail shells 6612 approach each other. The clamping plate 6616 in the clamping assembly 66 clamps the chip, which enhances the accuracy of the device in stacking chips, and the suction orifice plate 6512 presses down the clamping plate 6616 during the falling process. The clamping plate 6616 drives the bending rod 6615 to descend, and the bending rod 6615 drives the lifting plate 6614 to descend. The lifting plate 6614 is lifted and lowered in the groove of the guide rail shell 6612, so that stacked chips of different layers can be clamped, thereby enhancing the applicability of the device clamping.

[0055] When the chip is pressed down, the chip drives the supporting flexible plate 676 to fall, and the supporting flexible plate 676 drives the vertical rod 675 to fall, and the vertical rod 675 drives the circular plate 6714 to move downward. During the downward movement of the circular plate 6714, air pressure is generated, and the airflow in the air pressure enters the interior of the vertical box 677 through the barrel 671. After the airflow enters the interior of the vertical box 677, the airflow pushes the second movable plate 679 to move upward, and the second movable plate 679 drives the lifting rod 6710 to move upward, and the lifting rod 6710 drives the triangular blade 6711 to rise. During the rising process of the triangular blade 6711, the epoxy resin leaked when the chip is squeezed can be cut off, thereby enhancing the aesthetics of the stacked chip. When the second movable plate 679 moves to the top of the vertical box 677, the airflow enters the interior of the diffuser 6713 through the exhaust pipe 6712, and the airflow is diffused by the top platform 3, thereby drying the chips in the stacking process, enhancing the hardening efficiency of the device, and improving the working efficiency of the device.

[0056] A packaging method based on a three-dimensional stacked chip packaging structure comprises the following steps:

[0057] Step 1: Start the forward and reverse motor 61, which drives the threaded column 62 to rotate. During the rotation of the threaded column 62, the circular shell 63 is driven to descend. The circular shell 63 drives the filter plate 659 to descend. During the falling process of the filter plate 659, the suction orifice plate 6512 is pressed down. The suction orifice plate 6512 drives the chip to descend, thereby solving the process of stacking chips.

[0058] Step 2: During the descent of the hardening assembly 65, the annular heater 658 is started, and the vertical groove 6514 provided on the threaded column 62 engages with the inner wall of the sleeved vertical block 6515. When the threaded column 62 rotates, the vertical block 6515 is driven to rotate, and the vertical block 6515 drives the connected main gear 653 to rotate, the main gear 653 drives the secondary gear 654 to rotate, the secondary gear 654 drives the rotating sleeve 656 to rotate, and the rotating sleeve 656 drives the arc fan 657 to rotate. The arrangement of the filter plate 659 and the suction orifice plate 6512 solves the problem of slow hardening process during chip stacking.

[0059] Step 3: The round shell 63 drives the extrusion block 64 to descend. The extrusion block 64 descends. Through the arrangement of the air bag 665, the air pipe 666, the conversion box 667, and the first return spring 668, the first movable plate 669 moves. The first movable plate 669 drives the first extrusion rod 6610 to move. During the movement of the first extrusion rod 6610, the guide rail shell 6612 is pushed to move. Through the coordination of the extrusion spring 6613, the lifting plate 6614, the bending rod 6615, the clamping plate 6616 and the suction orifice plate 6512, the problem of inaccurate alignment during the stacking process is solved.

[0060] Step 4: When the chip is pressed down, the chip drives the supporting flexible plate 676 to fall, and the supporting flexible plate 676 drives the vertical rod 675 to fall, and the vertical rod 675 drives the circular plate 6714 to move downward, and the circular plate 6714 moves downward to generate air pressure. The air pressure is set through the barrel 671, the vertical box 677, and the second return spring 678, and the second movable plate 679 moves upward. The second movable plate 679 drives the lifting rod 6710 to move upward, and the lifting rod 6710 drives the triangular blade 6711 to rise. When the second movable plate 679 moves to the top of the vertical box 677, the exhaust pipe 6712 and the diffuser 6713 are set to solve the problem of slow hardening efficiency.

[0061] The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the present invention to the specific embodiments described. Obviously, many modifications and variations are possible based on the content of this specification. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better understand and utilize the present invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A packaging method based on a three-dimensional stacked chip packaging structure, characterized in that: The steps include: Step 1: Start the forward and reverse motor (61), the forward and reverse motor (61) drives the threaded column (62) to rotate, the threaded column (62) drives the round shell (63) to descend during the rotation, the round shell (63) drives the filter plate (659) to descend, the filter plate (659) presses down the suction orifice plate (6512) during the falling process, and the suction orifice plate (6512) drives the chip to descend; Step 2: During the descent of the hardening assembly (65), the annular heater (658) is started, and the vertical groove (6514) provided on the threaded column (62) is engaged with the inner wall of the sleeved vertical block (6515). When the threaded column (62) rotates, the vertical block (6515) is driven to rotate, and the vertical block (6515) drives the connected main gear (653) to rotate, the main gear (653) drives the secondary gear (654) to rotate, the secondary gear (654) drives the rotating sleeve (656) to rotate, and the rotating sleeve (656) drives the arc fan (657) to rotate; Step 3: The round shell (63) drives the extrusion block (64) to descend, and the extrusion block (64) descends. Through the setting of the air bag (665), the air pipe (666), the conversion box (667), and the first return spring (668), the first moving plate (669) moves, and the first moving plate (669) drives the first extrusion rod (6610) to move. During the movement of the first extrusion rod (6610), the guide rail shell (6612) is pushed to move. The two guide rail shells (661 2) they are brought close to each other, so that the clamping plate (6616) in the clamping assembly (66) clamps the chip, thereby enhancing the accuracy of the device in stacking the chips, and the suction orifice plate (6512) presses down the clamping plate (6616) during the falling process, and the clamping plate (6616) drives the bending rod (6615) to descend, and the bending rod (6615) drives the lifting plate (6614) to descend, and the lifting plate (6614) is lifted and lowered in the groove of the guide rail shell (6612); Step 4: When the chip is pressed down, the chip drives the supporting flexible plate (676) to fall, the supporting flexible plate (676) drives the vertical rod (675) to fall, the vertical rod (675) drives the circular plate (6714) to move downward, the circular plate (6714) moves downward, and air pressure is generated. The air pressure is set through the barrel (671), the vertical box (677), and the second return spring (678), and the second movable plate (679) moves upward. The second movable plate (679) drives the lifting rod (6710) to move upward. The lifting rod (6710) drives the triangular blade (6711) to rise. When the second movable plate (679) moves to the top of the vertical box (677), the airflow enters the interior of the diffuser (6713) through the exhaust pipe (6712), and the airflow is diffused by the top platform (3), thereby performing air drying on the chips during the stacking process. Device for implementing the above method: A chip packaging structure based on three-dimensional stacking comprises a workbench (1), wherein a plurality of hexagonal columns (2) are fixedly connected to one side of the top of the workbench (1), a top platform (3) is fixedly connected to the top of the hexagonal columns (2), a plurality of table legs (4) are fixedly connected to the four sides of the bottom of the workbench (1), a working groove (5) is provided on one side of the top of the workbench (1), and further comprises: A lifting and packaging mechanism (6), the lifting and packaging mechanism (6) includes a forward and reverse motor (61) fixedly connected to the top of the top platform (3), the output end of the forward and reverse motor (61) is fixedly connected to a threaded column (62), one end of the threaded column (62) passes through the top platform (3) and extends to the outside of the top platform (3), one end of the threaded column (62) is sleeved on the outer wall and threadedly connected to a round shell (63), one side of the outer wall of the round shell (63) is fixedly connected to an extrusion block (64), and the inner wall of the round shell (63) is provided with a hardening component (65).

2. The packaging method of a chip packaging structure based on three-dimensional stacking according to claim 1, characterized in that: The hardening component (65) includes a circular groove (651) provided on the top of the inner wall of the circular shell (63); a rotating block (652) is sleeved on the inner wall of the circular groove (651) and rotatably connected; one end of the rotating block (652) is fixedly connected to a main gear (653); a plurality of secondary gears (654) are meshed and connected around the outer wall of the main gear (653); a fixing rod (655) is sleeved on the inner wall of the secondary gear (654) and contacts the inner wall; one end of the fixing rod (655) is fixedly connected to the top of the inner wall of the circular shell (63).

3. The packaging method of a chip packaging structure based on three-dimensional stacking according to claim 2, characterized in that: The bottom of the secondary gear (654) is fixedly connected to a rotating sleeve (656), the outer wall of the rotating sleeve (656) is sleeved with and fixedly connected to an arc fan (657), the inner wall of the circular shell (63) is sleeved with and fixedly connected to an annular heater (658), the bottom end of the inner wall of the circular shell (63) is sleeved with and fixedly connected to a filter plate (659), the bottom two sides of the top platform (3) are respectively fixedly connected to a first telescopic rod (6510), the output end of the first telescopic rod (6510) is fixedly connected to a suction orifice plate (6512), the outer wall of the threaded column (62) is respectively provided with a plurality of vertical grooves (6514), the inner wall of the vertical groove (6514) is sleeved with and slidably connected to a vertical block (6515), and one end of the vertical block (6515) is fixedly connected to the inner wall of the main gear (653).

4. The packaging method of a chip packaging structure based on three-dimensional stacking according to claim 3, characterized in that: The inner wall of the working groove (5) is provided with a clamping assembly (66), and the clamping assembly (66) includes a hexagonal rod (661) fixedly connected to both sides of the bottom of the inner wall of the working groove (5), and a square platform (662) is fixedly connected to the top of the hexagonal rod (661), and sliding grooves (663) are respectively provided on both sides of the top of the square platform (662), and square holes (664) are respectively provided at both ends of the top of the square platform (662) close to the sliding groove (663). An air bag (665) is fixedly connected to one side of the working table (1) close to the hexagonal column (2), and the bottom ends of both sides of the air bag (665) are respectively connected to air pipes (666).

5. The packaging method of a chip packaging structure based on three-dimensional stacking according to claim 4, characterized in that: One end of the air pipe (666) is connected to a conversion box (667), the bottom of the conversion box (667) is fixedly connected to the top of the workbench (1), one side of the inner wall of the conversion box (667) is fixedly connected to a first return spring (668), one end of the first return spring (668) is fixedly connected to a first movable plate (669), and a side of the first movable plate (669) away from the first return spring (668) is fixedly connected to a first extrusion rod (6610), and one end of the first extrusion rod (6610) passes through the conversion box (667) and extends to the outside of the conversion box (667).

6. The packaging method of a chip packaging structure based on three-dimensional stacking according to claim 5, characterized in that: A telescopic spring (6611) is fixedly connected to one side of the inner wall of the sliding groove (663), one end of the telescopic spring (6611) is fixedly connected to the guide rail housing (6612), an extrusion spring (6613) is fixedly connected to the bottom of the inner wall of the guide rail housing (6612), one end of the extrusion spring (6613) is fixedly connected to the lifting plate (6614), the outer wall of the lifting plate (6614) is slidably connected to the inner wall of the guide rail housing (6612), a bent rod (6615) is fixedly connected to one side of the lifting plate (6614), and the end of the bent rod (6615) away from the lifting plate (6614) is fixedly connected to the clamping plate (6616).

7. The packaging method of a chip packaging structure based on three-dimensional stacking according to claim 6, characterized in that: The inner wall of the working tank (5) is provided with an auxiliary component (67), the auxiliary component (67) comprising a barrel (671) fixedly connected to the center of the bottom of the inner wall of the working tank (5), a second telescopic rod (672) fixedly connected to the bottom of the inner wall of the barrel (671), a circular plate (6714) sleeved on and in contact with the top of the inner wall of the barrel (671), and a vertical rod (675) fixedly connected to the top of the circular plate (6714).

8. The packaging method of a chip packaging structure based on three-dimensional stacking according to claim 7, characterized in that: One end of the vertical rod (675) passes through the barrel (671) and extends to the outside of the square platform (662); the top of the vertical rod (675) is fixedly connected to a load-bearing flexible plate (676); the bottom ends of both sides of the outer wall of the barrel (671) are respectively connected to vertical boxes (677); the bottom of the inner wall of the vertical box (677) is fixedly connected to a second return spring (678); one end of the second return spring (678) is fixedly connected to a second movable plate (679); the top of the second movable plate (679) is fixedly connected to a lifting rod (6710); one end of the lifting rod (6710) passes through the vertical box (677) and extends to the outside of the vertical box (677); the top of the lifting rod (6710) is fixedly connected to a triangular blade (6711).

9. The packaging method of a chip packaging structure based on three-dimensional stacking according to claim 8, characterized in that: The outer wall of the triangular blade (6711) contacts the inner wall of the square hole (664), and the top side of the outer wall of the vertical box (677) is connected to an exhaust pipe (6712). One end of the exhaust pipe (6712) passes through the square platform (662) and extends to the outside of the square platform (662). The end of the exhaust pipe (6712) away from the vertical box (677) is connected to a diffuser (6713), and the bottom of the diffuser (6713) is fixedly connected to the top of the square platform (662).

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