A semiconductor wafer cleaning machine feeding device

Abstract

The present invention belongs to the field of semiconductor placement and positioning technology, and discloses a semiconductor wafer cleaning machine loading equipment, including a collection component; a driving component; a supporting component; a drain component; a positioning and identification component; a placement component and a loading and unloading component. Through the newly designed loading and unloading component, the sliding seat moves in a circle, and the rotating block rotates the third hydraulic rod and other components to point to the position of the placement component. Under the action of the extension and retraction of the third hydraulic rod and the movement of the robot arm composed of two connecting pieces, the clamping plate can be inserted under the wafer. At this time, the telescopic rod shrinks the stroke, and the clamping plate will move a distance in the direction of the square plate. The two rubber blocks and two clamping wheels form a rectangular area that can clamp the wafer without damage. Then, through the movement of the rotating block, the third hydraulic rod and the connecting piece, the wafer is moved to the top of the supporting component, which solves the problem that the traditional robot arm has excessive grasping force or uncoordinated movements, which may cause the wafer to break.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor placement and positioning, and in particular relates to a semiconductor wafer cleaning machine loading device. Background Art

[0002] The loading equipment of the semiconductor wafer cleaning machine is a special equipment used to load the wafers to be cleaned into the cleaning machine, which usually includes a wafer conveying mechanism, a wafer tray, a robotic arm, a visual recognition system, a positioning device, etc.

[0003] The actual operation process is: first, the wafer conveying mechanism sends the wafer to the bottom of the robotic arm, then the robotic arm grabs the wafer and places it on the wafer tray, then the visual recognition system confirms the wafer position, and finally, the positioning device adjusts the wafer position so that it is accurately placed in the cleaning tank. However, in the actual production process, if the robotic arm grabs too much force or the movement is uncoordinated, it may cause the wafer to break. At the same time, if there is a problem with the visual recognition system or the positioning device, it may cause the wafer to be placed inaccurately. If the cleaning tank is not cleaned in time, the wafer will also fail to be placed in the designated position. Summary of the invention

[0004] The object of the present invention is to provide a semiconductor wafer cleaning machine loading device to solve the problems raised in the above background technology.

[0005] In order to achieve the above-mentioned purpose, the present invention provides the following technical solutions: a semiconductor wafer cleaning machine feeding device, comprising a collecting component, a driving component is fixedly installed on the right side of the collecting component, and also comprises a linkage positioning and rotating mechanism, which comprises a supporting component, the supporting component is fixedly installed inside the collecting component, a draining component is fixedly installed on the top of the supporting component, a positioning and identifying component is fixedly installed on the top of the draining component, and a placing component is fixedly installed on the back of the positioning and identifying component;

[0006] A loading and unloading assembly, wherein the loading and unloading assembly is fixedly installed on the left side of the collecting assembly, the loading and unloading assembly comprises an arc track, a sliding seat is movably clamped on the top of the arc track, a rotating block is fixedly installed on the top of the sliding seat, a third hydraulic rod is fixedly connected to the top of the rotating block, the telescopic end of the third hydraulic rod is fixedly connected to two connecting plates, a square plate is fixedly connected to the bottom of the connecting plate on the right side, two telescopic rods are fixedly installed on the top of the square plate, the telescopic ends of the two telescopic rods are fixedly connected to a clamping plate, clamping wheels are rotatably installed on the front and rear sides of the square plate, and two rubber blocks are fixedly installed on the right top of the clamping plate.

[0007] Preferably, the collecting assembly comprises a shell, and two curved pipes are fixedly installed inside the shell, and the left ends of the two curved pipes are fixedly connected to a liquid storage tank.

[0008] Preferably, the driving assembly includes a motor, which is fixedly mounted on the right side of the shell, and the output end of the motor is fixedly connected to a first rotating wheel, a transmission belt is movably sleeved on the outer edge of the first rotating wheel, a first gear is fixedly mounted on the top of the first rotating wheel, and a second gear is meshed on the left side of the first gear.

[0009] Preferably, the supporting assembly includes a second rotating wheel, which is rotatably mounted inside the shell, the outer edge of the second rotating wheel is movably connected to the left side of the transmission belt, a toothed disc is fixedly mounted on the top of the second rotating wheel, a bevel gear is meshed on the top right side of the toothed disc, a sun gear is fixedly connected to the right end of the rotating shaft of the bevel gear, three planetary gears are annularly distributed on the outer edge of the sun gear, the outer edges of the three planetary gears are meshed with a first gear ring, a first hydraulic rod is fixedly connected to the top of the toothed disc, and the telescopic end of the first hydraulic rod is fixedly connected to the supporting tray.

[0010] Preferably, the first gear ring is fixedly connected to the front side of the housing, and the three planetary gears and the sun gear are rotatably mounted on the front side of the housing.

[0011] Preferably, the drainage assembly includes a disc, which is movably sleeved on the outer edge of the first hydraulic rod, and the disc is provided with a plurality of fan-shaped grooves in an annular shape. A second gear ring is movably mounted on the top of the disc, and a plurality of blades are provided in an annular array on the inner wall of the second gear ring, and a bearing is fixedly connected to the top of the second gear ring.

[0012] Preferably, the disc is fixedly mounted inside the housing, the second gear ring is meshed with the second gear, the outer ring of the bearing is fixedly connected to the inner wall of the housing, and the inner ring of the bearing is fixedly connected to the second gear ring.

[0013] Preferably, the positioning and identification component includes a fixed seat, a cross bar is fixedly installed on the top of the fixed seat, a Poisson frame is fixedly connected to the left side of the cross bar, a second hydraulic rod is fixedly connected to the middle position of the Poisson frame, a convex lens is fixedly connected to the telescopic end of the second hydraulic rod, and a laser locator and a visual camera are installed at annular intervals on the outer edge of the convex lens.

[0014] Preferably, the placement component includes a base, the base is fixedly mounted on the back of the shell, a support frame is fixedly mounted on the top of the base, a square shell is fixedly mounted on the top of the support frame, and a plurality of slides are fixedly mounted inside the square shell.

[0015] The beneficial effects of the present invention are as follows:

[0016] 1. The present invention adopts a newly designed loading and unloading assembly. The sliding seat makes a circular motion on the arc track. The rotating block rotates the third hydraulic rod and other components to point to the position where the assembly is placed. Under the action of the extension and retraction of the third hydraulic rod and the movement of the robot arm composed of two connecting pieces, the clamping plate can be inserted under the wafer in a certain slideway in the square shell. At this time, the telescopic rod shrinks and the clamping plate moves a distance in the direction of the square plate. The two rubber blocks and the two clamping wheels form a rectangular area that can clamp the wafer without damage. Then, through the movement of the rotating block, the third hydraulic rod and the connecting piece, the wafer is moved to the top of the supporting assembly, which solves the problem that the traditional robot arm has excessive grasping force or uncoordinated movements, which may cause the wafer to break.

[0017] 2. The present invention installs a positioning and identification component with a beam-forming effect. The second hydraulic rod increases the stroke, moves the convex lens downward to the specified position, and three laser positioning devices distributed in a triangle emit lasers. Positioning is performed through the beam-forming effect of the convex lens. Positioning data can be collected through a visual camera. Each movement of the loading and unloading components is precisely controlled to ensure that the wafer can be smoothly placed in the center of the tray, thereby solving the problem of inaccurate wafer placement that may be caused by problems with the visual recognition system or the positioning device.

[0018] 3. The present invention is equipped with a newly designed drain component. The clockwise rotating second gear ring will drive multiple blades on its inner wall to rotate. The multiple blades are installed at a forty-five degree inclination. During rotation, the cleaning liquid will be gathered to the middle position of the disc to form a centripetal force, so that the cleaning liquid can flow from the fan-shaped groove and enter the liquid storage tank through the curved pipe for collection. When the motor rotates counterclockwise, the second gear ring will be subjected to the counterclockwise rotation force of the second gear. The multiple inclined bearings on its inner wall will generate centrifugal force during rotation, forming a spin-drying effect to achieve a cleaning effect, thereby solving the problem that the cleaning tank is not cleaned in time, resulting in the inability to successfully place the wafer in the designated position. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0020] Figure 2 For the present invention Figure 1 A schematic diagram of the structure enlargement in the middle;

[0021] Figure 3 It is a cross-sectional view of the collecting component structure of the present invention;

[0022] Figure 4 This is a schematic diagram of the structure of the drive assembly of the present invention;

[0023] Figure 5 It is a schematic diagram of the supporting assembly structure of the present invention;

[0024] Figure 6 It is a schematic diagram of the structure of the components placed in the present invention;

[0025] Figure 7 This is a schematic diagram of the structure of the positioning and identification component of the present invention;

[0026] Figure 8 It is a schematic diagram of the structure of the loading and unloading components of the present invention.

[0027] In the figure: 1, collecting component; 2, driving component; 3, supporting component; 4, draining component; 5, positioning and identifying component; 6, placing component; 7, loading and unloading component; 11, shell; 12, elbow; 13, liquid storage tank; 21, motor; 22, first rotating wheel; 23, transmission belt; 24, first gear; 25, second gear; 31, second rotating wheel; 32, toothed disc; 33, bevel gear; 34, first gear ring; 35, planetary gear; 36, sun gear; 37, first hydraulic rod; 38, bearing tray; 41, disc; 42. fan-shaped groove; 43. second gear ring; 44. blade; 45. bearing; 51. fixed seat; 52. cross bar; 53. Pozidrivium frame; 54. second hydraulic rod; 55. convex lens; 56. laser locator; 57. visual camera; 61. base; 62. support frame; 63. square shell; 64. slideway; 71. arc track; 72. sliding seat; 73. rotating block; 74. third hydraulic rod; 75. connecting piece; 76. square plate; 77. telescopic rod; 78. clamping wheel; 79. clamping plate; 710. rubber block. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] like Figures 1 to 8 As shown, an embodiment of the present invention provides a semiconductor wafer cleaning machine feeding device, including a collecting component 1, a driving component 2 is fixedly installed on the right side of the collecting component 1, and further includes:

[0030] The linkage positioning and rotating mechanism comprises a supporting component 3, the supporting component 3 is fixedly mounted inside the collecting component 1, a drain component 4 is fixedly mounted on the top of the supporting component 3, a positioning and identifying component 5 is fixedly mounted on the top of the drain component 4, and a placing component 6 is fixedly mounted on the back of the positioning and identifying component 5;

[0031] The upper and lower material assembly 7 is fixedly installed on the left side of the collecting assembly 1. The upper and lower material assembly 7 includes an arc track 71. The top of the arc track 71 is movably connected with a sliding seat 72. The top of the sliding seat 72 is fixedly installed with a rotating block 73. The top of the rotating block 73 is fixedly connected with a third hydraulic rod 74. The telescopic end of the third hydraulic rod 74 is fixedly connected with two connecting pieces 75. Both connecting pieces 75 can be actively rotated. The two connecting pieces 75 form a mechanical arm that can operate in the horizontal direction. The bottom of the right connecting piece 75 is fixedly connected with a square plate 76. The top of the square plate 76 is fixedly installed with two telescopic rods 77. The telescopic ends of the two telescopic rods 77 are fixedly connected with a clamping plate 79. The front and rear sides of the square plate 76 are rotatably installed with clamping wheels 78. Two rubber blocks 710 are fixedly installed on the right top of the clamping plate 79.

[0032] By means of the sliding seat 72 making circular motion on the arc track 71, the rotating block 73 rotates the third hydraulic rod 74 and other parts to point to the position where the component 6 is placed. Under the action of the extension and retraction of the third hydraulic rod 74 and the movement of the robot arm composed of the two connecting pieces 75, the clamping plate 79 can be inserted under the wafer in a slide 64 in the square shell 63. At this time, the telescopic rod 77 shrinks its stroke, and the clamping plate 79 moves a distance in the direction of the square plate 76. The two rubber blocks 710 and the two clamping wheels 78 form a rectangular area that can clamp the wafer without damage. Then, through the movement of the rotating block 73, the third hydraulic rod 74 and the connecting piece 75, the wafer is moved to the top of the supporting component 3, thereby solving the problem that the conventional robot arm has excessive grasping force or uncoordinated movements, which may cause the wafer to break.

[0033] The collecting assembly 1 comprises a shell 11, two elbows 12 are fixedly installed inside the shell 11, and the left ends of the two elbows 12 are fixedly connected to a liquid storage tank 13;

[0034] The cleaning liquid gathers toward the middle of the disc 41, forming a centripetal force, so that the cleaning liquid can flow from the fan-shaped groove 42 and enter the liquid storage tank 13 through the elbow 12 for collection;

[0035] The driving assembly 2 includes a motor 21, which is fixedly mounted on the right side of the housing 11. The output end of the motor 21 is fixedly connected to a first rotating wheel 22, a transmission belt 23 is movably sleeved on the outer edge of the first rotating wheel 22, a first gear 24 is fixedly mounted on the top of the first rotating wheel 22, and a second gear 25 is meshed on the left side of the first gear 24;

[0036] The motor 21 rotates clockwise to transmit the driving force to the first rotating wheel 22 and the first gear 24, and the rotating force is transmitted to the second rotating wheel 31 and the second gear ring 43 through the transmission belt 23 and the second gear 25, so that the second rotating wheel 31 and the second gear ring 43 can rotate clockwise at the same time. The driving assembly 2 is started in the reverse direction to make the motor 21 rotate counterclockwise. At this time, the second gear ring 43 is subjected to the counterclockwise rotation force of the second gear 25;

[0037] The supporting assembly 3 includes a second rotating wheel 31, which is rotatably mounted inside the housing 11. The outer edge of the second rotating wheel 31 is movably sleeved with the left side of the transmission belt 23. A toothed disc 32 is fixedly mounted on the top of the second rotating wheel 31. A bevel gear 33 is meshed on the top right side of the toothed disc 32. A sun gear 36 is fixedly connected to the right end of the rotating shaft of the bevel gear 33. Three planetary gears 35 are annularly distributed on the outer edge of the sun gear 36. The outer edges of the three planetary gears 35 are meshed with a first gear ring 34. A first hydraulic rod 37 is fixedly connected to the top of the toothed disc 32. A supporting tray 38 is fixedly connected to the telescopic end of the first hydraulic rod 37. The first gear ring 34 is fixedly connected to the front side of the housing 11. The three planetary gears 35 and the sun gear 36 are all rotatably mounted on the front side of the housing 11.

[0038] The first hydraulic rod 37 increases the stroke, driving the support tray 38 to move upward. After clamping the wafer, the loading and unloading assembly 7 operates again, and the two rubber blocks 710 and the two clamping wheels 78 cancel the clamping and move away from the working area of ​​the support assembly 3. After the support tray 38 clamps the wafer, the first hydraulic rod 37 shortens the stroke again. At this time, the wafer is in the circular concave area formed by the housing 11 and the second gear ring 43;

[0039] The drain assembly 4 includes a disc 41, which is movably sleeved on the outer edge of the first hydraulic rod 37. The disc 41 is provided with a plurality of fan-shaped grooves 42 in an annular shape. A second gear ring 43 is movably mounted on the top of the disc 41. A plurality of blades 44 are arranged in an annular array on the inner wall of the second gear ring 43. A bearing 45 is fixedly connected to the top of the second gear ring 43. The disc 41 is fixedly mounted inside the housing 11. The second gear ring 43 is meshed with the second gear 25. The outer ring of the bearing 45 is fixedly connected to the inner wall of the housing 11. The inner ring of the bearing 45 is fixedly connected to the second gear ring 43.

[0040] The clockwise rotating second gear ring 43 will drive the multiple blades 44 on its inner wall to rotate. The multiple blades 44 are installed at a 45-degree inclination. When rotating, the cleaning liquid will be gathered to the middle position of the disc 41, forming a centripetal force, so that the cleaning liquid can flow from the fan-shaped groove 42 and enter the liquid storage tank 13 through the curved pipe 12 for collection. The motor 21 rotates counterclockwise. At this time, the second gear ring 43 will be subjected to the counterclockwise rotation force of the second gear 25. The multiple inclined bearings 45 on its inner wall will generate centrifugal force during rotation, forming a spin-drying effect, and the clamping rod of the tray 38 contracted in the circular groove area will also be spin-dried, which is convenient for the next cleaning work;

[0041] The positioning and identification component 5 includes a fixed seat 51, a cross bar 52 is fixedly installed on the top of the fixed seat 51, a cross bar 53 is fixedly connected to the left side of the cross bar 52, a second hydraulic rod 54 is fixedly connected to the middle of the cross bar 53, a convex lens 55 is fixedly connected to the telescopic end of the second hydraulic rod 54, and a laser locator 56 and a visual camera 57 are installed at intervals at the outer edge of the convex lens 55;

[0042] The second hydraulic rod 54 increases the stroke to move the convex lens 55 downward to the specified position. Three laser locators 56 distributed in a triangle emit lasers to perform positioning through the focusing effect of the convex lens 55. The positioning data can be collected through the visual camera 57. Each movement of the loading and unloading assembly 7 is precisely controlled to ensure that the wafer can be smoothly placed in the center of the tray 38.

[0043] The placement component 6 includes a base 61, which is fixedly installed on the back of the shell 11. A support frame 62 is fixedly installed on the top of the base 61, a square shell 63 is fixedly installed on the top of the support frame 62, and a plurality of slideways 64 are fixedly installed inside the square shell 63.

[0044] The clamping plate 79 can be inserted under the wafer in a slide 64 in the square shell 63. At this time, the telescopic rod 77 shrinks its stroke, and the clamping plate 79 moves a distance in the direction of the square plate 76. The two rubber blocks 710 and the two clamping wheels 78 form a rectangular area that can clamp the wafer without damage and pull it out of the slide 64.

[0045] Working principle:

[0046] When using the present feeding and cleaning equipment, the positioning identification component 5 must be started first to calibrate the equipment. The second hydraulic rod 54 increases the stroke, and the convex lens 55 is moved downward to the specified position. Three laser positioning devices 56 distributed in a triangle emit lasers, and positioning is performed through the focusing effect of the convex lens 55. The positioning data can be collected through the visual camera 57.

[0047] When the positioning is completed, the loading and unloading assembly 7 is driven again, and the sliding seat 72 makes a circular motion on the arc track 71, so that the entire loading and unloading assembly 7 can be close to the direction of the placement assembly 6, and the rotating block 73 can rotate the third hydraulic rod 74 and other components to point to the position of the placement assembly 6. Under the action of the extension and contraction of the third hydraulic rod 74 and the movement of the robot arm composed of the two connecting pieces 75, the clamping plate 79 can be inserted under the wafer in a slide 64 in the square shell 63. At this time, the telescopic rod 77 shrinks its stroke, and the clamping plate 79 will move a distance in the direction of the square plate 76. The two rubber blocks 710 and the two clamping wheels 78 form a rectangular area that can clamp the wafer without damage. Then, through the movement of the rotating block 73, the third hydraulic rod 74 and the connecting piece 75, the wafer is moved to the top of the supporting assembly 3. Under the action of the positioning and identification assembly 5, each movement of the loading and unloading assembly 7 is precisely controlled to ensure that the wafer can be smoothly placed in the central position of the supporting tray 38.

[0048] At this time, the first hydraulic rod 37 increases its stroke, driving the support tray 38 to move upward. After clamping the wafer, the loading and unloading assembly 7 operates again, and the two rubber blocks 710 and the two clamping wheels 78 cancel the clamping and move away from the working area of ​​the support assembly 3. After the support tray 38 clamps the wafer, the first hydraulic rod 37 shortens its stroke again. At this time, the wafer is in the circular concave area formed by the housing 11 and the second gear ring 43;

[0049] At this time, the driving assembly 2 is started, and the motor 21 rotates clockwise, transmitting the driving force to the first rotating wheel 22 and the first gear 24, and the rotational force is transmitted to the second rotating wheel 31 and the second gear ring 43 respectively through the transmission belt 23 and the second gear 25, so that the second rotating wheel 31 and the second gear ring 43 can rotate clockwise at the same time. The rotation of the second rotating wheel 31 will drive the support tray 38 and the clamped wafer to rotate. At this time, the cleaning liquid is sprayed on the wafer. While the second rotating wheel 31 rotates, the toothed disc 32 will also transmit the rotational force to the bevel gear 33, and the bevel gear 33 drives the sun gear 36 to rotate. The three planetary gears 35 rotate in the fixed first gear ring 34, which plays a role of uniform torque, ensuring that the support tray 38 can rotate at a uniform speed;

[0050] The clockwise rotating second gear ring 43 drives the multiple blades 44 on its inner wall to rotate. The multiple blades 44 are installed at a 45-degree inclination. When rotating, the cleaning liquid is gathered to the middle of the disc 41, forming a centripetal force, so that the cleaning liquid can flow from the fan-shaped groove 42 and enter the liquid storage tank 13 through the curved pipe 12 for collection.

[0051] When cleaning is completed, the loading and unloading assembly 7 is started again, and the wafer clamped by the supporting tray 38 is lifted up and taken out for unloading. At this time, the driving assembly 2 is started in reverse to make the motor 21 rotate counterclockwise. At this time, the second gear ring 43 will be subjected to the counterclockwise rotation force of the second gear 25, and the multiple inclined bearings 45 on its inner wall will generate centrifugal force during rotation, forming a drying effect, and the clamping rod of the supporting tray 38 contracted in this circular groove area will also be dried, which is convenient for the next cleaning work. The work process ends here.

[0052] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0053] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor wafer cleaning machine loading device, comprising a collecting component (1), characterized in that: A driving assembly (2) is fixedly mounted on the right side of the collecting assembly (1), and further comprises: A linkage positioning and rotating mechanism, comprising a supporting component (3), the supporting component (3) being fixedly mounted inside the collecting component (1), a drain component (4) being fixedly mounted on the top of the supporting component (3), a positioning and identifying component (5) being fixedly mounted on the top of the drain component (4), and a placement component (6) being fixedly mounted on the back of the positioning and identifying component (5); A loading and unloading assembly (7), wherein the loading and unloading assembly (7) is fixedly mounted on the left side of the collecting assembly (1), and comprises an arc-shaped track (71), a sliding seat (72) being movably clamped at the top of the arc-shaped track (71), a rotating block (73) being fixedly mounted at the top of the sliding seat (72), a third hydraulic rod (74) being fixedly connected to the top of the rotating block (73), two connecting pieces (75) being fixedly connected to the telescopic end of the third hydraulic rod (74), a square plate (76) being fixedly connected to the bottom of the right connecting piece (75), two telescopic rods (77) being fixedly mounted on the top of the square plate (76), the telescopic ends of the two telescopic rods (77) being fixedly connected to a clamping plate (79), clamping wheels (78) being rotatably mounted on both the front and rear sides of the square plate (76), and two rubber blocks (710) being fixedly mounted on the right top of the clamping plate (79); The collecting assembly (1) comprises a shell (11), two curved pipes (12) are fixedly installed inside the shell (11), and the left ends of the two curved pipes (12) are fixedly connected to a liquid storage tank (13); The driving assembly (2) comprises a motor (21), the motor (21) being fixedly mounted on the right side of the housing (11), the output end of the motor (21) being fixedly connected to a first rotating wheel (22), the outer edge of the first rotating wheel (22) being movably sleeved with a transmission belt (23), a first gear (24) being fixedly mounted on the top of the first rotating wheel (22), and a second gear (25) being meshed with the left side of the first gear (24); The drain assembly (4) comprises a disc (41) which is movably sleeved on the outer edge of the first hydraulic rod (37); the disc (41) is provided with a plurality of fan-shaped grooves (42) in an annular shape; a second gear ring (43) is movably mounted on the top of the disc (41); a plurality of blades (44) are provided in an annular array on the inner wall of the second gear ring (43); and a bearing (45) is fixedly connected to the top of the second gear ring (43).

2. The semiconductor wafer cleaning machine feeding device according to claim 1, characterized in that: The support assembly (3) comprises a second rotating wheel (31), the second rotating wheel (31) being rotatably mounted inside the housing (11), the outer edge of the second rotating wheel (31) being movably sleeved with the left side of the transmission belt (23), a toothed disc (32) being fixedly mounted on the top of the second rotating wheel (31), a bevel gear (33) being meshed on the right side of the top of the toothed disc (32), a sun gear (36) being fixedly connected to the right end of the rotating shaft of the bevel gear (33), three planetary gears (35) being annularly distributed on the outer edge of the sun gear (36), the outer edges of the three planetary gears (35) being meshed with a first gear ring (34), a first hydraulic rod (37) being fixedly connected to the top of the toothed disc (32), and a support tray (38) being fixedly connected to the telescopic end of the first hydraulic rod (37).

3. The semiconductor wafer cleaning machine loading device according to claim 2, characterized in that: The first gear ring (34) is fixedly connected to the front side of the housing (11), and the three planetary gears (35) and the sun gear (36) are all rotatably mounted on the front side of the housing (11).

4. The semiconductor wafer cleaning machine loading device according to claim 1, characterized in that: The disc (41) is fixedly mounted inside the housing (11); the second gear ring (43) meshes with the second gear (25); the outer ring of the bearing (45) is fixedly connected to the inner wall of the housing (11); and the inner ring of the bearing (45) is fixedly connected to the second gear ring (43).

5. The semiconductor wafer cleaning machine loading device according to claim 1, characterized in that: The positioning identification component (5) comprises a fixing seat (51), a cross bar (52) is fixedly mounted on the top of the fixing seat (51), a cross bar (52) is fixedly connected to the left side of the cross bar (52) with a cross frame (53), a second hydraulic rod (54) is fixedly connected to the middle of the cross frame (53), a convex lens (55) is fixedly connected to the telescopic end of the second hydraulic rod (54), and a laser locator (56) and a visual camera (57) are installed at intervals on the outer edge of the convex lens (55) in an annular manner.

6. The semiconductor wafer cleaning machine loading device according to claim 1, characterized in that: The placement component (6) comprises a base (61), the base (61) being fixedly mounted on the back of the housing (11), a support frame (62) being fixedly mounted on the top of the base (61), a square shell (63) being fixedly mounted on the top of the support frame (62), and a plurality of slideways (64) being fixedly mounted inside the square shell (63).

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