Electronic equipment assembly and heat dissipation protective shell thereof

Abstract

The invention provides an electronic equipment assembly and a heat dissipation protection shell thereof. The heat dissipation protection shell comprises a protection shell, a heat dissipation device and a wiring assembly. The protective shell is used for being connected with electronic equipment, the heat dissipation device is fixedly connected with the protective shell and comprises a semiconductor cooler and a mainboard, the mainboard is connected with a charging interface of the electronic equipment through the wiring assembly, and the electronic equipment can supply power to the heat dissipation device. The heat dissipation device is used for dissipating heat of the electronic equipment. According to the heat dissipation protective shell provided by the embodiment of the invention, the electronic equipment can supply power to the heat dissipation device by designing a structure in which the protective shell and the heat dissipation device are integrated, the heat dissipation device can realize heat dissipation of the electronic equipment, and the heat dissipation protective shell has the characteristics of simple structure, convenience in use and excellent heat dissipation performance.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment accessories, and in particular to an electronic equipment component and a heat dissipation protective shell thereof. Background Art

[0002] As the diversity of mobile phone usage increases, mobile terminal companies and APP application development companies are launching various multi-functional applications, such as the interpolation function of the original game, the super-resolution function, the beauty function of Douyin live broadcast, etc. The diversity of these functions will lead to increased power consumption, and the ease of play and fun of the APP will lead users to use their mobile phones for a long time, which will cause the mobile phone to heat up seriously. Even worse, the mobile phone will exit the application due to heat, causing the user's live broadcast to be interrupted. Therefore, many users will wear a relatively heavy heat dissipation back clip to solve the problem of mobile phone heating, and use an external power supply to power the heat dissipation back clip. This form of heat dissipation back clip is bulky and unsightly, and the external power supply will affect the user's operation when playing games. Summary of the invention

[0003] A first aspect of an embodiment of the present application provides a heat dissipation protective shell, which includes a protective shell, a heat dissipation device and a wiring assembly; the protective shell is used to be connected to an electronic device, the heat dissipation device is fixedly connected to the protective shell, the heat dissipation device includes a semiconductor refrigerator and a mainboard, the mainboard is connected to the charging interface of the electronic device through the wiring assembly, the electronic device can supply power to the heat dissipation device, and the heat dissipation device is used to dissipate heat from the electronic device.

[0004] In a second aspect, an embodiment of the present application provides an electronic device assembly, which includes an electronic device and the heat dissipation protective shell described in the above embodiment, the protective shell of the heat dissipation protective shell is connected to the electronic device, the heat dissipation device is arranged in close proximity to the electronic device, and the electronic device is electrically connected to the heat dissipation device via the wiring assembly to power the heat dissipation device.

[0005] The heat dissipation protective shell provided in the embodiment of the present application is designed to have a structure in which the protective shell and the heat dissipation device are integrated. The electronic device can supply power to the heat dissipation device, and the heat dissipation device can realize heat dissipation for the electronic device. It has the characteristics of simple structure, easy use and excellent heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0007] Figure 1 This is a front view structural diagram of an embodiment of a heat dissipation protective shell of the present application;

[0008] Figure 2 yes Figure 1 A schematic diagram of the side view structure of the heat dissipation protective shell in the embodiment;

[0009] Figure 3 It is a structural schematic diagram of the cooperation state between the heat dissipation protective shell and the electronic device in the embodiment of the present application;

[0010] Figure 4 It is a structural schematic diagram of an embodiment of the heat dissipation device of the present application;

[0011] Figure 5 It is a structural schematic diagram of another embodiment of the heat dissipation protective shell of the present application;

[0012] Figure 6 It is a partial structural diagram of an embodiment of the electronic device of the present application;

[0013] Figure 7 yes Figure 6 A schematic diagram of a disassembled structure of an electronic device in an embodiment;

[0014] Figure 8 yes Figure 6 A schematic cross-sectional view of the structure of the electronic device along line AA in the embodiment;

[0015] Fig. 9 yes Figure 8 A schematic diagram of the structure enlarged at B in the embodiment;

[0016] Fig.10 yes Fig. 9 An enlarged schematic diagram of the structure at C in the embodiment;

[0017] Fig.11 yes Fig. 9 An enlarged schematic diagram of the structure at D in the embodiment;

[0018] Fig.12 It is a structural schematic diagram of an embodiment of the electronic device of the present application;

[0019] Fig.13 yes Fig.12 A schematic cross-sectional view of the structure of the electronic device at EE in the embodiment;

[0020] Fig.14 It is a schematic diagram of the structural composition block diagram of an embodiment of the electronic device of the present application. DETAILED DESCRIPTION

[0021] The present application is further described in detail below in conjunction with the accompanying drawings and examples. It is particularly noted that the following examples are only used to illustrate the present application, but are not intended to limit the scope of the present application. Similarly, the following examples are only some embodiments of the present application rather than all embodiments, and all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0022] The terms "first", "second", and "third" in the embodiments of the present application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", and "third" can expressly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the embodiments of the present application, all directional indications (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. The terms "including" and "having" in the embodiments of the present application and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or components inherent to these processes, methods, products, or devices.

[0023] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0024] As used herein, "electronic devices" (or simply "terminals") include, but are not limited to, devices configured to receive / send communication signals via a wireline connection (e.g., via a public switched telephone network (PSTN), a digital subscriber line (DSL), a digital cable, a direct cable connection, and / or another data connection / network) and / or via a wireless interface (e.g., for a cellular network, a wireless local area network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and / or another communication terminal). Communication terminals configured to communicate via a wireless interface may be referred to as "wireless communication terminals", "wireless terminals" or "mobile terminals". Examples of mobile terminals include, but are not limited to, satellite or cellular phones; personal communication system (PCS) terminals that may combine cellular radiotelephones with data processing, fax, and data communication capabilities; PDAs that may include radiotelephones, pagers, Internet / intranet access, web browsers, organizers, calendars, and / or global positioning system (GPS) receivers; and conventional laptop and / or palmtop receivers or other electronic devices that include radiotelephone transceivers. A mobile phone is an electronic device equipped with a cellular communication module.

[0025] Market research has found that the proportion of users wearing mobile phone protective cases is 71-92%. When users use the heat dissipation back clip in conventional technical solutions to cool down their phones, they need to remove the mobile phone protective case, which is cumbersome. If the mobile phone protective case is not removed when using the heat dissipation back clip, the heat dissipation module is not in direct contact with the back shell, the thermal resistance is large, and the heat dissipation effect is poor. The heat dissipation back clip module is large, which affects the user's gaming experience; the heat dissipation back clip needs to be powered separately, and the user needs to be equipped with a charger, data cable, etc.; when the heat dissipation back clip is used, the charging cable affects the user's operation.

[0026] In view of this, the present application embodiment provides a heat dissipation protective shell, please refer to Figure 1 and Figure 2 , Figure 1 This is a front view of the structure of an embodiment of the heat dissipation protective shell of the present application. Figure 2 yes Figure 1 The side view of the heat dissipation protective shell in the embodiment; it should be noted that the heat dissipation protective shell in the present application can be used to dissipate heat for electronic devices including mobile phones, tablet computers, etc. The heat dissipation protective shell 800 includes but is not limited to the following structures: a protective shell 810, a heat dissipation device 820 and a wiring assembly 830.

[0027] For more information, please see Figure 3 , Figure 31 is a schematic diagram of the structure of the heat dissipation protective shell and the electronic device in the embodiment of the present application, wherein the heat dissipation protective shell 800 and the electronic device 10 together constitute an electronic device assembly. The protective shell 810 is used to connect with the electronic device, such as by snapping or bonding, and the heat dissipation device 820 is fixedly connected to the protective shell 810.

[0028] Optionally, please also refer to Figure 4 , Figure 4 It is a structural schematic diagram of an embodiment of the heat dissipation device of the present application. The heat dissipation device 820 in this embodiment includes a semiconductor cooler 821 and a main board 822. The main board 822 is connected to the charging interface 10a of the electronic device 10 through a wiring component 830. The main board 822 is used to control the working state of the semiconductor cooler 821.

[0029] Thermo Electric Cooler is made by using the Peltier effect of semiconductor materials. The so-called Peltier effect refers to the phenomenon that when a direct current passes through a couple composed of two semiconductor materials, one end absorbs heat and the other end releases heat. Heavily doped N-type and P-type bismuth telluride are mainly used as semiconductor materials for TEC. The bismuth telluride elements are electrically connected in series and generate heat in parallel. TEC includes some P-type and N-type pairs (groups), which are connected together by electrodes and sandwiched between two ceramic electrodes; when current flows through TEC, the heat generated by the current will be transferred from one side of TEC to the other side, generating a "hot" side and a "cold" side on the TEC. This is the heating and cooling principle of TEC.

[0030] The wiring assembly 830 includes a wire 831 and a male connector 832. The wire 831 is embedded in the protective shell 810. The two ends of the wire 831 are respectively connected to the mainboard 822 and the charging interface 10a of the electronic device 10. The charging interface 10a of the electronic device 10 and the male connector 832 can be TYPE-C, micro-C, lighting interfaces, etc. that cooperate with each other, and are not specifically limited here.

[0031] The electronic device 10 can supply power to the heat sink 820, and the heat sink 820 is used to dissipate heat from the electronic device 10. Optionally, the heat dissipation protective shell 800 in this embodiment may further include a temperature sensor 840, which is disposed on the inner side of the protective shell 810 and connected to the mainboard 822, and is used to detect the surface temperature of the electronic device 10. The temperature sensor 840 detects the current temperature and power consumption of the mobile phone, and predicts the future behavior of the user, so as to achieve the purpose of intelligently controlling the semiconductor refrigerator 821, thereby achieving the purpose of controlling the temperature of the entire device.

[0032] Optionally, see Figure 4 and Figure 3The heat dissipation device 820 in this embodiment further includes a heat dissipation component 823, and the heat dissipation component 823 and the electronic device 10 are respectively attached to opposite sides of the semiconductor refrigerator 821. Optionally, the heat dissipation component 823 includes a radiator 8231 and a heat dissipation fan 8232, the radiator 8231 is attached to the surface of the semiconductor refrigerator 821, and the heat dissipation fan 8232 is fixedly connected to the radiator 8231 for dissipating heat from the radiator 8231, wherein the heat dissipation fan 8232 can be disposed on the side surface of the radiator 8231 away from the semiconductor refrigerator 821.

[0033] Optionally, see Figure 4 The heat dissipation device 820 in this embodiment further includes an outer frame 824, and the heat dissipation fan 8232, the radiator 8231, the semiconductor cooler 821 and the mainboard 822 are respectively fixedly connected to the outer frame 824. Optionally, the protective shell 810 in this embodiment is provided with a through hole 811, the heat dissipation device 820 is embedded in the through hole 811, and the outer frame 824 is fixedly connected to the protective shell 810.

[0034] When the control motherboard / battery of electronic devices such as mobile phones is working, a large amount of heat is generated, and the temperature of the whole device rises. When equipped with the heat dissipation protective shell in the embodiment of the present application, the reverse charging function of the electronic device is used, and the Type-C socket is matched with each other to power the heat dissipation device 820 on the heat dissipation protective shell 800. When the semiconductor cooler 821 (TEC for short) of the heat dissipation device 820 begins to intervene, the TEC heat absorption end contacts the back shell of the mobile phone battery, and cools the entire mobile phone through heat conduction, thereby cooling the main chip of the mobile phone, thereby ensuring the normal operation of the chip, ensuring that the mobile phone is smooth and not stuck, and not being shut down due to high temperature. The heat release end of the TEC can contact the heat sink 8231 through the thermal conductive gel, and the heat sink 8231 is cooled by the heat dissipation fan 8232, thereby effectively dissipating the heat of the TEC hot end.

[0035] The heat dissipation protective shell in the embodiment of the present application integrates the heat dissipation device based on the TEC principle and the charging module on the mobile phone protective shell, and uses the reverse charging function of the mobile phone to power the accessory through the Type-C (etc.) interface, without the need for an external charging cable. Introduction to the working principle of the system: reverse discharge of mobile phone battery → mobile phone Type-C female socket → portable heat dissipation protective shell (Type-C male socket) → portable heat dissipation protective shell (mainboard) → portable heat dissipation protective shell (TEC heat dissipation module, i.e. semiconductor refrigerator 821); introduction to the heat dissipation principle of the system: mobile phone mainboard / mobile phone battery → mobile phone back shell → TEC heat dissipation module (TEC) → TEC heat dissipation module (radiator) → TEC heat dissipation module (cooling fan).

[0036] Optionally, see Figure 5 , Figure 5It is a structural schematic diagram of another embodiment of the heat dissipation protective shell of the present application, wherein, different from the aforementioned embodiment, the protective shell 810 in this embodiment is not provided with a through hole, and the semiconductor cooler 821 is attached to the side of the protective shell 810 facing away from the electronic device 10, wherein the material of the protective shell 810 in this embodiment can be metal, thereby improving the heat dissipation efficiency of the heat dissipation device 820.

[0037] The heat dissipation protective shell provided in the embodiment of the present application is designed with a structure in which the protective shell and the heat dissipation device are integrated. The electronic device can supply power to the heat dissipation device, and the heat dissipation device can realize the heat dissipation of the electronic device. It has the characteristics of simple structure, convenient use and excellent heat dissipation performance. The heat dissipation effect is good, and the temperature drops by about 10°C, which solves the heating problems of heavy-load long-term applications such as live broadcasts and games, and the exit of mobile phone applications; portability: no need to be equipped with chargers, data cables, etc. (using the reverse charging function of the mobile phone); improve the game holding experience: when using traditional heat dissipation back clips, the charging cable affects the user's operation, and the embodiment of the present application solves this problem.

[0038] Please also read Figures 6 to 8 , Figure 6 is a partial structural diagram of an embodiment of the electronic device of the present application, Figure 7 yes Figure 6 A schematic diagram of the disassembled structure of the electronic device in the embodiment, Figure 8 yes Figure 6 Schematic diagram of the structure of the electronic device along the AA line in the embodiment; it should be noted that the electronic device in the present application may include electronic devices with camera components such as mobile phones, tablet computers, laptops, wearable devices, etc. The electronic device 10 includes but is not limited to the following structures: a housing component 100 and a control circuit board 200.

[0039] For more information, please see Fig. 9 , Fig. 9 yes Figure 8The enlarged schematic diagram of the structure at B in the embodiment, wherein the housing assembly 100 includes: a main housing 110, a decorative member 120 and an elastic member 130. The main housing 110 may be the back cover of the electronic device, i.e., the battery cover. The main housing 110 includes a first surface 111 and a second surface 112 disposed opposite to each other, the main housing 110 is provided with a through mounting hole 1100, the decorative member 120 is disposed in the mounting hole 1100 and protrudes from the first surface 111, the decorative member 120 is connected to the main housing 110 through the elastic member 130, and can be elastically contracted along the mounting hole 1100 when the decorative member 120 is subjected to force. Optionally, the decorative member 120 and the elastic member 130 in this embodiment may be arranged corresponding to the control circuit board 200 in the thickness direction of the electronic device, or corresponding to the chip arrangement on the control circuit board 200, and the elastic member 130 may play the role of elastic buffering, reducing the impact on the main housing and internal devices (such as the control circuit board 200) when the decorative member 120 is impacted by external force. The elastic member 130 may be a spring or a pre-stressed and compressible material. The main housing 110 may be fixed to the middle frame 300 of the electronic device by double-sided adhesive tape; the control circuit board 200, i.e., the main board (on which all chips are integrated), may be fixed to the middle frame 300 by screws.

[0040] Please also read Fig.10 and Fig.11 , Fig.10 yes Fig. 9 The enlarged schematic diagram of the structure at C in the embodiment, Fig.11 yes Fig. 9 The enlarged schematic diagram of the structure at D in the embodiment, optionally, the housing assembly 100 in this embodiment further includes a cover plate 140, wherein the cover plate 140 may be a structure such as a flash 210 or a camera covered on the electronic device, which is not specifically limited here. The cover plate 140 may also be provided with a lens 1400.

[0041] The cover plate 140 includes an integral cover body 141 and a connecting portion 142, the connecting portion 142 is arranged along the side circumference of the cover body 141, and the connecting portion 142 is fixedly connected to the second surface 112 of the main housing 110, specifically, it can be fixed by bonding with a double-sided adhesive tape 101. Optionally, the decorative member 120 in this embodiment is an annular structure, the cover body 141 is inserted into the decorative member 120, and the decorative member 120 and the connecting portion 142 are connected by an elastic member 130.

[0042] Optionally, the elastic member 130 in this embodiment can be a spring, which is an annular structure and is fixedly connected to the decorative member 120, specifically by welding. The elastic member 130 is specifically a spring with a square cross section to ensure that the decorative member 120 does not deflect after assembly.

[0043] Optionally, see Fig.10 and Fig.11 In this embodiment, the decorative element 120 is provided with a locking protrusion 121 at one end of the second surface 112 of the main housing 110, and the locking protrusion 121 is locked with the second surface 112 of the main housing 110. A positioning protrusion 143 can also be provided on the connecting portion 142 for positioning with the positioning hole on the main housing 110.

[0044] Optionally, the housing assembly 100 in this embodiment further includes a decorative plate 150, which is fixedly connected to the first surface 111 of the main housing 110, which may be bonded or welded, etc., which is not specifically limited here. The decorative plate 150 is provided with a through hole 151 corresponding to the mounting hole 1100 of the main housing 110, and the decorative member 120 is passed through the through hole 151 and protrudes from the side surface of the decorative plate 150 away from the main housing 110, wherein the amount of the decorative member 120 protruding from the decorative plate 150 is generally more than 0.3 mm, and the stress problem encountered is more serious. The amount of the decorative member 120 protruding from the decorative plate 150 in this embodiment is more than 0.3 mm.

[0045] The decorative part 120 (including the square cross-section spring) is assembled between the decorative plate 150 and the cover plate connection part 142, and the decorative part will not deflect by the hole matching in the XY direction. In the Z direction, the pre-stressing and compressible characteristics of the spring are used. In the non-falling state, that is, the natural state, the decorative part 120 is supported by the spring in a normal "convex" state to achieve the ID effect; when the electronic device falls on the back and the decorative part 120 collides with the floor, the compressible characteristics of the spring are used, and the spring is compressed so that the decorative part 120 can be "retracted", that is, the protrusion of the decorative part 120 changes to a "variable" state, so that the energy of the electronic device falling and colliding is reduced, and the further impact and force transmission of the decorative part 120 to the internal structure is also reduced, and finally the force on the control circuit board 200 (main board) is also relieved, so that the main board chip does not fail.

[0046] In order to solve the mainboard stress problem caused by decorative parts of electronic equipment, a rear camera decorative part solution is designed. This rear camera decorative part solution cleverly utilizes the pre-load characteristics and compressible characteristics of the spring, which not only ensures the barrel protruding effect on the ID appearance, but also solves the mainboard stress problem caused by the impact transmission of the decorative parts when the back falls, so that the product design takes into account both the appearance and the quality reliability of the product.

[0047] Furthermore, the present application also provides an electronic device. The electronic device in this embodiment may include a mobile phone, a tablet computer, a laptop computer, a wearable device, etc. This embodiment is described by taking a mobile phone as an example. Figure 3 , Fig.12 as well as Fig.13 , Fig.12 is a schematic diagram of the structure of an embodiment of the electronic device of the present application, Fig.13 yes Fig.12 The electronic device in the embodiment is a schematic cross-sectional view of the structure at EE. The electronic device in this embodiment may include a display module 400, a middle frame 300, a control circuit board 200, a battery 500 and a housing assembly 100. The housing assembly 100 may be the structure in the aforementioned embodiment, which will not be described in detail here.

[0048] Optionally, the display screen module 400 and the main housing 110 of the housing assembly 100 cooperate with the middle frame 300 to form an accommodation space 1000, and the control circuit board 200 and the battery 500 and other devices are arranged in the accommodation space 1000. The control circuit board 200 is electrically connected to the display screen module 400, and the control circuit board 200 is used to control the display screen module 400. The detailed technical features of the other parts of the electronic device are within the scope of understanding of those skilled in the art and will not be repeated here.

[0049] See also Fig.14 , Fig.14 It is a schematic diagram of the structural composition block diagram of an embodiment of an electronic device of the present application. The electronic device can be a mobile phone, a tablet computer, a laptop computer, a wearable device, etc. The diagram of this embodiment takes a mobile phone as an example. The structure of the electronic device may include an RF circuit 910, a memory 920, an input unit 930, a display unit 940 (which may be the display screen module 400 in the above embodiment), a sensor 950, an audio circuit 960, a wifi module 970, a processor 980 (which may be the control circuit board 200 in the above embodiment) and a power supply 990, etc. Among them, the RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960 and the wifi module 970 are respectively connected to the processor 980; the power supply 990 is used to provide power to the entire electronic device.

[0050] Specifically, the RF circuit 910 is used to receive and send signals; the memory 920 is used to store data instruction information; the input unit 930 is used to input information, which may specifically include a touch panel 931 and other input devices 932 such as operation buttons; the display unit 940 may include a display panel 941, etc.; the sensor 950 includes an infrared sensor, a laser sensor, etc., for detecting user approach signals, distance signals, etc.; the speaker 961 and the microphone (or microphone) 962 are connected to the processor 980 through the audio circuit 960 for receiving and sending sound signals; the wifi module 970 is used to receive and transmit wifi signals, and the processor 980 is used to process data information of the electronic device. For the specific structural features of the electronic device, please refer to the relevant description of the above embodiment, which will not be described in detail here.

[0051] The above descriptions are only some embodiments of the present application, and do not limit the protection scope of the present application. Any equivalent device or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A heat dissipation protective shell, characterized in that: The heat dissipation protective shell includes a protective shell, a heat dissipation device and a wiring assembly; the protective shell is used to be connected to an electronic device, the heat dissipation device is fixedly connected to the protective shell, the heat dissipation device includes a semiconductor refrigerator and a mainboard, the mainboard is connected to the charging interface of the electronic device through the wiring assembly, the electronic device can supply power to the heat dissipation device, and the heat dissipation device is used to dissipate heat from the electronic device.

2. The heat dissipation protective shell according to claim 1, characterized in that: The heat dissipation device also includes a heat dissipation component, and the heat dissipation component and the electronic equipment are respectively attached to the opposite sides of the semiconductor refrigerator.

3. The heat dissipation protective shell according to claim 2, characterized in that: The heat dissipation component comprises a radiator, and the radiator is attached to the surface of the semiconductor refrigerator.

4. The heat dissipation protective shell according to claim 3, characterized in that: The heat dissipation assembly also includes a heat dissipation fan, which is fixedly connected to the radiator and is used to dissipate heat from the radiator.

5. The heat dissipation protective shell according to claim 4, characterized in that: The heat dissipation assembly further comprises an outer frame, and the heat dissipation fan, the radiator, the semiconductor refrigerator and the mainboard are respectively fixedly connected to the outer frame.

6. The heat dissipation protective shell according to claim 5, characterized in that: The semiconductor refrigerator is attached to a side of the protective shell facing away from the electronic device.

7. The heat dissipation protective shell according to claim 5, characterized in that: The protective shell is provided with a through hole, the heat dissipation device is embedded in the through hole, and the outer frame is fixedly connected to the protective shell.

8. The heat dissipation protective shell according to claim 6 or 7, characterized in that: The material of the protective shell is metal.

9. The heat dissipation protective shell according to claim 1, characterized in that: The wiring assembly includes a wire and a male connector. The wire is embedded in the protective shell, and two ends of the wire are respectively connected to the mainboard and a charging interface of the electronic device.

10. An electronic device component, characterized in that: The electronic device assembly includes an electronic device and a heat dissipation protective shell as described in any one of claims 1 to 9, wherein the protective shell of the heat dissipation protective shell is connected to the electronic device, the heat dissipation device is arranged in close contact with the electronic device, and the electronic device is electrically connected to the heat dissipation device through the wiring assembly to supply power to the heat dissipation device.

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