TR assembly based on phased array technology

Abstract

The invention discloses a TR assembly based on the phased array technology, and the TR assembly comprises a structural cavity with an upward opening, and the structural cavity is divided into an upper accommodation space and a lower accommodation space through an interlayer medium. Wherein an integrated circuit board integrating a wave control power supply and a signal processing unit is arranged in the lower-layer accommodating space; a TR circuit board is arranged in the upper-layer accommodating space; the interlayer medium is provided with an opening for the flexible board to pass through, and the flexible board passes through the opening to realize connection with the TR circuit board and the integrated circuit board; the TR circuit board is arranged on the upper surface of the interlayer medium, a plurality of first grooves are formed in the contact surface of the interlayer medium and the TR circuit board, a frequency conversion SIP is arranged in each first groove, and the TR circuit board is connected with each frequency conversion SIP; and an AIP function module is arranged above the TR circuit board. According to the invention, the requirements of multiple beams, high power and small size can be met, so that the new requirements of most phased arrays are met.

Description

Technical Field

[0001] The present invention relates to the field of antennas, and in particular to a TR component based on phased array technology. Background Art

[0002] With the development of high-integration chips, many traditional phased array TR functions are gradually replaced by highly integrated chips, and the technical threshold of traditional phased array millimeter wave TR is gradually lowered. However, traditional phased array millimeter wave TR, whether tile-type or brick-type, is mostly single-beam fixed polarization.

[0003] However, with the development of phased array technology, many new functional requirements have begun to emerge, such as multi-beam, high power, small size, etc. The millimeter-wave TR components designed with traditional multi-function chips cannot meet the requirements of multi-beam, high power, and small size at the same time.

[0004] The development of phased array technology is constrained by the process and the characteristics of the device itself, and has entered a bottleneck period. There are only two conventional designs. One is to use separate devices to build TR components, which become brick-type or tile-type TR components. This type of design can improve the efficiency and thermal capacity of the product and ensure the long-term stability of the product, but this type of product has low integration, high cost, single function, and large product size. The second is to use silicon-based multifunctional chips to build tile-type TR components. This type of component is small in size and high in integration, but the product has small thermal capacity and poor thermal conductivity, and cannot adapt to products with high power or long working time. The cost of using silicon-based multifunctional chips is low, but this type of chip is inefficient, has low output power, high heat consumption, concentrated heat source, and greater difficulty in heat dissipation. It is currently mostly used in communication products.

[0005] The channel spacing of millimeter wave TR components is 3-10mm, which is small. For tile-type TR, it is very difficult to achieve through separate devices, and only highly integrated devices can be used. Silicon-based multifunctional chips have low costs, but the output power they can achieve currently cannot reach 1W, and the efficiency is mostly less than 20%, the heat loss is extremely high, and high power output cannot be achieved.

[0006] Currently, millimeter-wave phased arrays are mainly single-beam phased arrays. Due to space limitations and the difficulty of process implementation, quad-beam has reached the limit of technology and design and is difficult to expand further.

[0007] Due to the small cross-sectional size of the tile-type TR component, the chip is installed in the AOB form. The biggest problem with this type of TR component is the heat dissipation problem. The heat from the chip is transferred to the antenna board and cannot be effectively dissipated, which has a fatal impact on the working time and reliability of the product. Summary of the invention

[0008] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a TR component based on phased array technology that can meet the requirements of multi-beam, high power and small size, thereby meeting most new requirements of phased arrays.

[0009] The objective of the present invention is achieved through the following technical solutions: A TR component based on phased array technology, comprising a structural cavity opening upward, wherein the structural cavity is divided into upper and lower accommodating spaces by an interlayer medium; The lower accommodating space is provided with an integrated circuit board integrating a wave control power supply and a signal processing unit; the upper accommodating space is provided with a TR circuit board; the interlayer medium is provided with an opening for the soft board to pass through, and the soft board passes through the opening to achieve connection with the TR circuit board and the integrated circuit board; The TR circuit board is arranged on the upper surface of the interlayer medium, and a plurality of first grooves are arranged on the contact surface between the interlayer medium and the TR circuit board, a frequency conversion SIP device is arranged in each first groove, and the TR circuit board is connected to each frequency conversion SIP device respectively; An AIP functional module is arranged above the TR circuit board, and the AIP functional module is soldered and interconnected with the TR circuit board through BGA value balls; a plurality of TR board heat conduction holes are also arranged on the TR circuit board, which are used to quickly conduct the heat generated by the AIP functional module to the interlayer medium.

[0010] Preferably, the flexible board integrates transmission lines of power supply, intermediate frequency signal and control signal, so as to realize interconnection of power supply line, signal transmission line and control line between the integrated circuit board and the TR circuit board.

[0011] Preferably, a low-frequency connector is provided at the bottom of the structural cavity, one end of the low-frequency connector is connected to the integrated circuit board, and the other end passes through the bottom of the structural cavity and extends outside the structural cavity to realize power supply and signal communication between the integrated circuit board and the external terminal.

[0012] Preferably, the low-frequency connector is a J30J connector.

[0013] Preferably, the wave-controlled power supply includes a DC / DC chip, which is used to receive the external voltage input from the low-frequency connector and convert it into the voltage required by the FPGA, AD / DA, DSP, variable frequency SIP, AIP devices to power the entire TR component. Preferably, the signal processing unit includes a DSP chip, an FPGA chip and an AD / DA device; The FPGA chip is connected to the low-frequency connector to realize the transmission of control instructions, and is connected to the DSP chip to realize the control of the DSP chip. The FPGA chip also controls the variable frequency SIP through the soft board; The DSP chip is connected to the low-frequency connector to achieve signal transmission; the DSP chip is connected to the TR circuit board through the AD / DA device and the soft board in turn.

[0014] Preferably, the AIP functional module comprises an antenna printed circuit board and a HTCC / LTCC multilayer board; the antenna printed circuit board and the HTCC / LTCC multilayer board are fixed by welding through interconnection pads to realize signal transmission; a plurality of second grooves are arranged on the upper surface of the HTCC / LTCC multilayer board, and a first multifunctional chip is arranged in each second groove; a plurality of third grooves are arranged on the lower surface of the HTCC / LTCC multilayer board, and a second multifunctional chip is arranged in each third groove, and each of the third grooves is sealed by a cover plate to protect the second multifunctional chip in the third groove; a plurality of BGA planting balls are also arranged on the lower surface of the HTCC / LTCC multilayer board for realizing signal and current transmission between the AIP functional module and the external circuit, A plurality of signal transmission holes are arranged inside the HTCC / LTCC multilayer board, and transmission lines are arranged inside the transmission holes. The transmission lines are used to connect the BGA ball planting and the second groove and the third groove of the HTCC / LTCC multilayer board, and are connected to the first multifunctional chip through gold wire bonding at the second groove, and are connected to the second multifunctional chip through gold wire bonding at the third groove, thereby realizing the interconnection of the BGA ball planting, the first multifunctional chip, and the second multifunctional chip; in the second groove, the first multifunctional chip is also connected to the interconnection pad through the internal routing of the HTCC / LTCC multilayer board, thereby realizing signal transmission with the antenna printed circuit board.

[0015] Preferably, the interlayer medium and the structural cavity are an integrated structure; the antenna printed circuit board is integrated with multiple antenna units; The number of the first multifunctional chips is the same as that of the antenna units and they correspond one to one. Each first multifunctional chip includes a power amplifier, a low noise amplifier, a switch and a limiter connected in sequence.

[0016] Preferably, the second multifunctional chip is a multi-channel multifunctional chip, each channel of which includes an attenuator, a phase shifter and an amplifier to achieve amplitude and phase control and signal amplification; The product of the number of second multifunctional chips and the number of channels of each second multifunctional chip is the same as the number of first multifunctional chips, so as to ensure that each multifunctional chip has a corresponding channel.

[0017] The beneficial effects of the present invention are as follows: (1) The present invention adopts the AIP method to solve the problem of low output power of antennas, multifunctional devices, and multifunctional chips, while meeting the requirements of small size space and heat dissipation of tile-type TR components.

[0018] (2) The present invention stacks microwave multilayer boards twice or multiple times and stacks devices three-dimensionally through a SIP framework, thereby realizing the millimeter-wave multi-beam phased array TR component.

[0019] (3) The present invention adopts the AIP form, selects reasonable thermal conductive radio frequency materials, changes the heat dissipation path, and reasonably conducts the heat of the chip to solve the high-power heat dissipation problem. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the electrical principle of the present invention; Figure 3 It is a structural diagram of the AIP module; In the figure, 1-AIP functional module, 1.1-antenna printed circuit board, 1.2-interconnection pad, 1.3-heat dissipation hole, 1.4-first multifunctional chip, 1.5-second multifunctional chip, 1.6-cover plate, 1.7-signal transmission hole, 1.8-bonding lead, 2-frequency conversion SIP device, 3-structural cavity, 4-DC / DC chip, 5-TR board thermal conductive hole, 6-BGA ball planting, 7-TR circuit board, 8-flexible board, 9-AD / DA device, 10-DSP chip, 11-FPGA chip, 12-integrated circuit board, 13-low frequency connector. DETAILED DESCRIPTION

[0021] The technical solution of the present invention is further described in detail below in conjunction with the accompanying drawings, but the protection scope of the present invention is not limited to the following.

[0022] like Figure 1As shown, a TR component based on phased array technology includes: an AIP functional module 1, which mainly realizes RF amplification, amplitude and phase control, and antenna transceiver functions, and is interconnected with the TR board through BGA value balls; a frequency conversion SIP device 2, which mainly realizes up and down frequency conversion functions, and is directly welded on the TR board through SMT. The output signal is transmitted to each AIP through the internal feeding network of the TR board, and the intermediate frequency signal is transmitted to the wave control power supply + signal processing board through the soft board, and is transmitted to the AD / DA chip through the internal circuit of the processing board; a structural cavity 3, which mainly realizes the installation, fixation and heat dissipation functions of the TR board and the signal processing board; a DC / DC chip 4, which mainly converts the external voltage into FPGA, AD / DA, DSP, frequency conversion SIP, AIP The voltage required by the devices; the heat conduction hole 5 of the TR board is mainly used to quickly conduct the heat of the AIP to the cavity; the BGA ball 6 on the AIP is mainly used to realize the signal transmission and heat conduction between the TR and the AIP, and at the same time realize the installation between the AIP and the TR board; the TR circuit board 7 mainly includes the functions of feeding network, vertical transition, signal and power transmission, and at the same time connects each AIP and the variable frequency SIP through the feeding network, vertical transition, signal line, etc.; the soft board 8 is mainly for the interconnection between the TR board and the processing board, including the transmission functions of power supply, intermediate frequency signal, and control signal; the AD / DA device 9 is mainly used to convert the digital signal processed by the DSP chip into an intermediate frequency analog signal, and convert the received analog signal into a digital signal and transmit it to the DSP In the chip; DSP chip 10, mainly realizes the function of signal processing; FPGA chip 11, mainly realizes the functions of phased array beam control, frequency conversion, transceiver control, etc.; integrated circuit board 12 adopts the structure of wave control power supply + signal processing board, mainly realizes the functions of beam control and signal processing, and adopts multi-layer circuits inside to realize the transmission of power supply, signal, etc., and is interconnected with TR board through soft board; low-frequency connector 13, specifically adopts J30J low-frequency connector, mainly for power supply and signal communication with external terminal.

[0023] like Figure 2 As shown, during transmission, the external terminal signal is transmitted to the DSP chip through the low-frequency connector and the internal circuit of the processing board, and then transmitted to the AD / DA chip through the internal wiring of the processing board after processing. After digital-to-analog conversion, it becomes an intermediate frequency signal, which is transmitted to the TR board through the processing board and the soft board. In the internal circuit of the TR board, it is transmitted to the frequency conversion SIP device for up-conversion. The frequency-converted RF signal is distributed to each AIP in the internal feeding network of the TR board and finally radiated. During reception, the AIP receives the energy in the air and transmits it to the TR board. It is synthesized into the frequency conversion SIP through the internal feeding network of the TR board, and down-converted into an intermediate frequency signal. It is transmitted to the AD / DA chip of the processing board in the internal circuit of the TR board and the soft board for analog-to-digital conversion. Finally, the digital signal is transmitted to the DSP chip for signal processing, and finally transmitted to the terminal through the low-frequency connector.

[0024] The power supply is transmitted to the DC / DC chip through the low-frequency connector and the internal wiring of the processing board, and the voltage required by each functional chip is output respectively, and is transmitted to each chip through the internal wiring of the processing board, the flexible board, and the internal wiring of the TR board.

[0025] The control signal is transmitted to the FPGA chip through the low-frequency connector and DSP, and then transmitted to each chip through the internal wiring of the processing board, the soft board, and the internal wiring of the TR board to realize functions such as phased array beam control and frequency conversion.

[0026] like Figure 3 As shown, the AIP functional module 1 includes: an antenna printed circuit board 1.1, which uses a high dielectric constant microwave multilayer board to integrate 4 / 8 / 16 antenna units; an interconnection pad 1.2 between the antenna board and the HTCC / LTCC multilayer board, and the two are connected by high-temperature solder. At the same time, it realizes the signal transmission function; the heat dissipation holes 1.3 are densely distributed under the multi-function chip and filled with metal to quickly transfer heat to the bottom of the AIP; the first multi-function chip 1.4 mainly integrates the functions of amplifier, low noise amplifier, switch, limiter, etc. The number of chips is determined according to the number of antenna units in the antenna board, and each first multi-function chip corresponds to one antenna unit; the second multi-function chip 1.5 mainly realizes the functions of multi-channel amplitude and phase control and signal amplification, and can be mainly divided into 4-channel multi-function chip, 8-channel multi-function chip, and 16-channel multi-function chip, depending on the antenna requirements; the cover plate 1.6, which adopts an alloy metal cover plate, is used to cover the second multi-function chip on the back of the AIP, and is airtight with the AIP through laser sealing and welding to protect the second multi-function chip; BGA ball planting 6 mainly realizes the signal and current transmission between the AIP and the external circuit, by taking into account the installation support and heat conduction of the AIP product; The signal transmission holes 1.7 inside the HTCC / LTCC microwave multilayer board mainly realize the circuit transmission interconnection function between the chips inside the AIP; the bonding wires 1.8 between the first multifunctional chip and the second multifunctional chip and the AIP are mainly gold wires or aluminum wires to realize signal transmission.

[0027] In the AIP, the transmission signal enters the second multifunctional chip inside the AIP, performs amplitude and phase adjustment and small signal amplification, and then transmits it to the first multifunctional chip through the AIP internal multi-layer ceramic circuit board, amplifies it, and then transmits it to the antenna board through the internal circuit, and radiates it into space through the antenna board. The receiving signal receives the space energy through the antenna to the AIP internal circuit, transmits it to the first multifunctional chip for amplification, and then transmits it to the second multifunctional chip through the AIP internal multi-layer ceramic circuit board for amplitude and phase adjustment, and preferably transmits it to the outside through the AIP internal multi-layer ceramic circuit board circuit and external implant ball.

[0028] In the embodiment of the present application, the integrated multifunctional microwave board is made of Ruilong's domestically produced board RA300A, and the RF and digital circuit boards are mixed in the form of a soft-hard composite board, which can solve the problem of interconnecting a large number of data lines. At the same time, different feeding networks can be designed on the RF board according to different beam requirements.

[0029] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the above embodiments, it is still possible for a person skilled in the art to modify the methods described in the above embodiments, such as changing the names of the methods, etc. Any modification, equivalent substitution, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A TR component based on phased array technology, characterized by: It comprises a structural cavity (3) opening upward, wherein the structural cavity (3) is divided into upper and lower accommodating spaces by an interlayer medium; An integrated circuit board (12) integrating a wave-controlled power supply and a signal processing unit is arranged in the lower accommodating space; a TR circuit board (7) is arranged in the upper accommodating space; an opening for the soft board (7) to pass through is arranged on the interlayer medium, and the soft board (8) passes through the opening to achieve connection with the TR circuit board (7) and the integrated circuit board (12); The TR circuit board (7) is arranged on the upper surface of the interlayer medium, and a plurality of first grooves are arranged on the contact surface between the interlayer medium and the TR circuit board (7), a frequency conversion SIP device (2) is arranged in each of the first grooves, and the TR circuit board (7) is connected to each frequency conversion SIP device (2) respectively; An AIP functional module (1) is arranged above the TR circuit board (7), and the AIP functional module (1) is interconnected with the TR circuit board (7) by welding via a BGA value ball (6); a plurality of TR board heat conduction holes (5) are also arranged on the TR circuit board (7) for quickly conducting heat generated by the AIP functional module (1) to the interlayer medium.

2. A TR assembly based on phased array technology according to claim 1, characterized in that: The soft board (8) integrates transmission lines for power supply, intermediate frequency signals and control signals, and is used to achieve interconnection of power supply lines, signal transmission lines and control lines between the integrated circuit board (12) and the TR circuit board (7).

3. The TR assembly based on phased array technology according to claim 1, characterized in that: A low-frequency connector (13) is provided at the bottom of the structural cavity (3); one end of the low-frequency connector (13) is connected to the integrated circuit board (12), and the other end of the low-frequency connector (13) passes through the bottom of the structural cavity (3) and extends outside the structural cavity (3) to achieve power supply and signal communication between the integrated circuit board (12) and an external terminal.

4. The TR assembly based on phased array technology according to claim 3, characterized in that: The low frequency connector is a J30J connector.

5. The TR assembly based on phased array technology according to claim 1, characterized in that: The wave-controlled power supply comprises a DC / DC chip (4) for receiving an external voltage inputted by a low-frequency connector and converting it into a voltage required by FPGA, AD / DA, DSP, variable frequency SIP, and AIP devices, thereby supplying power to the entire TR component.

6. The TR assembly based on phased array technology according to claim 1, characterized in that: The signal processing unit comprises a DSP chip (10), an FPGA chip (11) and an AD / DA device (9); The FPGA chip (11) is connected to the low-frequency connector (13) to realize the transmission of control instructions, and is connected to the DSP chip (10) to realize the control of the DSP chip (10). The FPGA chip (11) also controls the variable frequency SIP (2) through the soft board (8); The DSP chip (10) is connected to the low-frequency connector (13) to achieve signal transmission; the DSP chip (10) is connected to the TR circuit board (7) via the AD / DA device (9) and the soft board (8) in sequence.

7. The TR assembly based on phased array technology according to claim 1, characterized in that: The AIP functional module (1) comprises an antenna printed circuit board (1.1) and an HTCC / LTCC multilayer board; the antenna printed circuit board (1.1) and the HTCC / LTCC multilayer board are fixed by welding via interconnection pads (1.2) to achieve signal transmission; a plurality of second grooves are arranged on the upper surface of the HTCC / LTCC multilayer board, and a first multifunctional chip (1.4) is arranged in each second groove; a plurality of third grooves are arranged on the lower surface of the HTCC / LTCC multilayer board, and a second multifunctional chip (1.5) is arranged in each third groove, and each third groove is sealed by a cover plate (1.6) to protect the second multifunctional chip (1.5) in the third groove; and a plurality of BGA planting balls are also arranged on the lower surface of the HTCC / LTCC multilayer board to achieve signal and current transmission between the AIP functional module and an external circuit. A plurality of signal transmission holes (1.7) are arranged inside the HTCC / LTCC multilayer board, and transmission lines are arranged inside the signal transmission holes (1.7). The transmission lines are used to connect the BGA ball planting and the second groove and the third groove of the HTCC / LTCC multilayer board, and are connected to the first multifunctional chip (1.4) through a bonding wire (1.8) at the second groove, and are connected to the second multifunctional chip (1.5) through gold wire bonding at the third groove, thereby realizing the interconnection between the BGA ball planting, the first multifunctional chip (1.4), and the second multifunctional chip (1.5); in the second groove, the first multifunctional chip (1.4) is also connected to the interconnection pad (1.2) through the internal routing of the HTCC / LTCC multilayer board, thereby realizing signal transmission with the antenna printed board (1.1).

8. The TR assembly based on phased array technology according to claim 7, characterized in that: The antenna printed circuit board (1.1) has multiple antenna units integrated therein; The number of the first multifunctional chips (1.4) is the same as that of the antenna units and they correspond one to one, and each first multifunctional chip (1.4) comprises a power amplifier, a low noise amplifier, a switch and a limiter which are connected in sequence.

9. The TR assembly based on phased array technology according to claim 8, characterized in that: The second multifunctional chip (1.5) is a multi-channel multifunctional chip, each channel of which includes an attenuator, a phase shifter and an amplifier to achieve amplitude and phase control and signal amplification; The product of the number of second multifunctional chips (1.5) and the number of chip channels of each second multifunctional chip (1.5) is the same as the number of first multifunctional chips (1.4), so as to ensure that each multifunctional chip has a corresponding channel.

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