Fluid dispensing system and method

Abstract

There is provided a fluid dispensing system comprising: a fluid permeable surface having a predefined permeability to allow permeation of a fluid; and a controller configured to control a rate of penetration of the fluid into the volume by controlling one or both of a pressure of the fluid and an exposed surface area of the fluid permeable surface. A method of controlling dispensing of a fluid, a plasma generating apparatus comprising such a fluid dispensing system, and the use of such a system, method or apparatus in a lithographic apparatus or a lithographic process are also provided.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to EP application 22189906.5 filed on August 11, 2022, and the entirety of which is incorporated herein by reference. Technical Field

[0003] The present invention relates to a fluid dispensing system, a method for controlling the dispensing of a fluid, a plasma generating device comprising the fluid dispensing system, and use of the fluid dispensing system, method or plasma generating device in a lithography device or a lithography process. The present invention is particularly but not exclusively applied to EUV lithography. Background Art

[0004] A lithographic apparatus is a machine configured to apply a desired pattern onto a substrate. A lithographic apparatus may be used, for example, in the manufacture of integrated circuits (ICs). A lithographic apparatus may, for example, project a pattern from a patterning device (e.g., a mask) onto a layer of radiation-sensitive material (resist) disposed on a substrate.

[0005] The wavelength of radiation used by a lithographic apparatus to project a pattern onto a substrate determines the minimum size of features that can be formed on the substrate. A lithographic apparatus using EUV radiation, which is electromagnetic radiation having a wavelength in the range 4 nm-20 nm, can be used to form smaller features on a substrate than a conventional lithographic apparatus (which may, for example, use electromagnetic radiation having a wavelength of 193 nm).

[0006] The lithographic apparatus includes a patterning device (e.g., a mask or reticle). Radiation is provided through or reflected from the patterning device to form an image on a substrate. A film assembly (also referred to as a pellicle) may be provided to protect the patterning device from airborne particles and other forms of contamination. Contamination on the surface of the patterning device can cause manufacturing defects on the substrate.

[0007] Within the device, there is a low pressure gas, typically hydrogen, which can have various functions, such as cooling or cleaning. The gas is at a low pressure to minimize the amount of radiation absorbed by the gas. Even if there is a low pressure hydrogen environment within the device, radiation such as EUV radiation can produce hydrogen plasma. Hydrogen plasma includes hydrogen ions and hydrogen radicals, which can interact with materials within the device. This is undesirable because it can lead to contamination of optical elements within the device. For example, hydrogen plasma can react with silicon to form silane. Silane can diffuse within the device and then decompose, leaving silicon contaminants within the device. If the contaminant is on an optical element such as a reflector, a mask, or a reference, this can lead to a loss of throughput of the lithography device.

[0008] The present invention has been conceived in an attempt to address at least some of the problems identified above. Summary of the invention

[0009] According to a first aspect of the present disclosure, a fluid dispensing system is provided, which includes: a fluid permeable surface having a predefined permeability to allow penetration of the fluid; and a controller configured to control the rate at which the fluid penetrates into a volume by controlling one or both of the pressure of the fluid and the exposed surface area of ​​the fluid permeable surface.

[0010] Providing fluids such as gases and steam is useful for controlling the composition of the atmosphere within a volume, such as within a lithographic apparatus. For example, oxygen can be provided to the atmosphere within a lithographic apparatus to mitigate silane production and its corresponding effect on optical elements within the apparatus. Even though the presence of oxygen is useful, the concentration of oxygen must be carefully controlled, because otherwise its beneficial effects will be exceeded by its negative effects, such as oxidation of optical elements. The very small amount of oxygen required is below the operating parameters of the mass flow controller. One option to overcome this problem is to dilute the gas or fluid being provided with a carrier gas or carrier fluid. For example, oxygen can be diluted with hydrogen or nitrogen. In this way, existing systems, such as mass flow controllers, can be used to provide the required small amount of gas. However, this strategy has at least one significant disadvantage because it requires providing a second gas to dilute the gas of interest. In systems that need to operate at low pressures, providing additional gas is undesirable.

[0011] The disclosed system overcomes this problem by controlling the amount of fluid provided based on the penetration of the fluid through the fluid permeable surface. In particular, the rate at which the fluid penetrates into the volume (such as into the lithographic apparatus) can be controlled by controlling one or both of the pressure of the fluid and the exposed surface area of ​​the fluid permeable surface. With regard to controlling the pressure of the fluid, it will be recognized that the fluid is in contact with the fluid permeable surface. The rate at which the fluid can be provided to the volume will depend on the properties of the fluid, the properties of the fluid permeable surface, the surface area of ​​the fluid permeable surface through which the fluid can penetrate, and the pressure difference between the different sides of the fluid permeable surface. Therefore, by controlling the pressure of the fluid, the rate at which the fluid passes through the fluid permeable surface can be increased or decreased. Therefore, if the surface area through which the fluid is provided remains constant, the rate at which the fluid is provided to the volume is increased. In other words, the penetration rate per unit area of ​​the fluid permeable surface can be controlled by controlling the pressure difference across the fluid permeable surface. Similarly, if the exposed surface area is increased or decreased, all other conditions are equal, then the total amount of fluid that penetrates through the fluid permeable surface will increase or decrease accordingly, although the fluid penetrates per unit area of ​​the fluid permeable surface at the same rate. It will be appreciated that the rate at which fluid permeates into a volume through a fluid-permeable surface can be controlled by adjusting one or both of the exposed surface areas, i.e., the surface area in fluid connection with the volume through which fluid can be provided to the volume.

[0012] The fluid permeable surface can be defined by a pipe or tube. Therefore, a fluid distribution system can include a pipe or tube (which can be used synonymously) containing a fluid (such as a gas or a liquid). Therefore, the fluid permeable surface can be at least a portion of the surface of a pipe or tube. The pipe or tube can conveniently position the fluid permeable surface in an area of ​​the volume, such as being positioned in a lithographic apparatus, positioned in a position where the fluid needs to be provided via the pipe or tube. For example, this can be at a position where it is most desirable to suppress the creation of unwanted substances (such as silane). The fluid permeable surface can be any suitable form that allows the fluid to penetrate into the volume. For example, the fluid permeable surface can be in the form of an area of ​​a wall that at least partially defines the volume into which the fluid is to be provided.

[0013] The fluid may be selected from air, oxygen, nitrogen oxides, hydrogen, helium, carbon oxides, neon, argon and water, or any combination thereof. The carbon oxides may be carbon monoxide or carbon dioxide. The nitrogen oxides may be any nitrogen oxides, such as, for example, NO2 or NO.

[0014] The fluid permeable surface may include plastic, ceramic, sintered metal, or any combination thereof. These materials may be selected to be permeable to fluids and may form at least a portion of a conduit, tube, or other surface through which fluids may be provided to a volume such as in a lithographic apparatus.

[0015] The system can be configured to be pressurized at from about 0.1 bar to about 10 bar, optionally from about 0.5 bar to about 5 bar, preferably about 1 bar. In embodiments where the system is providing fluid to a volume that is near a vacuum, the pressure differential across the fluid permeable surface will approximate the pressure differential between the two sides of the fluid permeable surface. Since the pressure differential can be controlled, the permeation rate of the fluid can also be controlled.

[0016] The fluid is preferably nitrogen-free. In other words, the fluid does not include nitrogen. Under certain conditions, nitrogen can cause damage to optical elements within the lithographic apparatus. Therefore, in the event that nitrogen poses a hazard to any component within the apparatus to which the fluid dispensing system is providing fluid, it is preferred to manage this hazard by providing a gas that does not contain nitrogen. It will be appreciated that by nitrogen-free, it will be understood that nitrogen is intentionally not included, but functionally insignificant trace amounts may still be present.

[0017] The system can be configured to deliver fluid at the following rates: from about 1 × 10 -3 mbar*1 / s / cm 2 To about 1×10 - 8 mbar*1 / s / cm 2 , preferably from about 1×10 -4 mbar*1 / s / cm 2 To about 1×10 -7 mbar*1 / s / cm 2 , preferably from about 1×10 -5 mbar*1 / s / cm 2 To about 1×10 -6 mbar*1 / s / cm 2 .

[0018] The system can be configured to deliver fluid at the following flow rates: from about 1 × 10 -3 mbar*l / s to about 1×10 - 7 mbar*l / s, preferably from about 1×10 -4 mbar*l / s to about 1×10 -6 mbar*l / s, preferably about 1×10 -5 mbar*l / s.

[0019] The system may include a pump configured to control the pressure of the fluid and / or a pressure regulator configured to control the pressure of the fluid. The present disclosure is not particularly limited by the exact manner of controlling the pressure of the fluid, and any means that can control the pressure of the fluid may be employed.

[0020] The system may include a moving mechanism configured to move the fluid permeable surface relative to the volume to which the fluid is to be dispensed and / or to move an impermeable shield on at least a portion of the fluid permeable surface so as to control the rate at which the fluid penetrates into the volume. In essence, the effective change control of the surface area of ​​the fluid that can be provided by it provides how much fluid is provided to the volume in a given time period. For example, in the case where the fluid permeable surface is a part of a pipeline or a pipe, the length of the pipeline in the volume can be adjusted so as to adjust the rate at which the fluid is provided to the volume. As an example, in the case where a larger amount of fluid is needed, the pipeline can be moved so that there is a longer length of pipeline that is communicated with the volume fluid. Similarly, if less fluid is needed, the pipeline can be moved so that there is a shorter length of pipeline that is communicated with the volume fluid. The exposed area of ​​the fluid permeable surface can also be reduced by covering a portion of the surface with an impermeable shield. Therefore, although the total surface area of ​​the fluid permeable surface in the volume to which the fluid is to be provided is unchanged, the effective area is controlled by controlling the exposed area of ​​the fluid permeable surface.

[0021] According to a second aspect of the present disclosure, there is provided a method for controlling the dispensing of a fluid, the method comprising: a) providing a fluid permeable surface having a predefined permeability, b) providing a fluid in contact with the fluid permeable surface, and c) controlling one or both of the pressure of the fluid and the exposed surface area of ​​the fluid permeable surface to control the rate at which the fluid penetrates into a volume through the fluid permeable surface.

[0022] Small amounts of fluid can be provided into a volume such as within a lithographic apparatus by providing the fluid in contact with a fluid permeable surface and then adjusting the pressure of the fluid and / or the surface area through which the fluid can permeate. Previously, the fluid would need to be diluted with a carrier gas, which is undesirable.

[0023] The method may include controlling the exposed surface area of ​​the fluid permeable surface by changing one or both of the following: the length of the pipe or tube comprising the fluid permeable surface, and at least partially reversibly covering the fluid permeable surface with an impermeable material. As described with respect to the first aspect of the present disclosure, the surface area of ​​the fluid permeable surface can be adjusted to adjust the rate at which a fluid can penetrate into a volume through the fluid permeable surface in a given time. This is because, with all other conditions unchanged, the rate at which a fluid penetrates through the material comprising the surface per unit area is unchanged, so by providing a larger area, the total amount of fluid provided per unit time is increased. Additionally or alternatively, by covering a portion of the fluid permeable surface with an impermeable surface, the surface area through which a fluid can penetrate is reduced.

[0024] The method may comprise providing a fluid selected from the group consisting of air, oxygen, nitrogen oxides, hydrogen, helium, carbon oxides, neon, argon and water, or any combination thereof. Preferably, the fluid is nitrogen-free.

[0025] According to a third aspect of the present disclosure, there is provided a plasma generating device comprising the fluid dispensing system according to the first aspect of the present disclosure.

[0026] Although specific reference is made herein to lithography apparatus, and in particular EUV lithography apparatus, the present disclosure may also be applied to any other system requiring the provision of small amounts of fluid that cannot otherwise be provided by existing mechanical means (such as mass flow controllers or simply injecting the fluid), or by diluting the fluid of interest with a carrier fluid.

[0027] Such an apparatus may be selected from a lithography apparatus, a plasma etching apparatus, a laser and a fusion reactor. Preferably, the apparatus is an EUV lithography apparatus. Each of these apparatuses defines an internal volume including a gas, and it is desirable to be able to provide a small amount of gas in this volume. As described herein, due to the small volumes involved, existing means for providing such small amounts of fluid do not allow for providing a pure fluid, and the only way this can be achieved is to dilute the fluid with a carrier fluid, which is undesirable, particularly when the volume is operated at low pressure.

[0028] According to the fourth aspect of the present invention, there is provided the use of the fluid dispensing system according to the first aspect of the present disclosure, the method according to the second aspect of the present disclosure, or the plasma generating device according to the third aspect of the present disclosure in a lithography apparatus or a lithography process, wherein the lithography apparatus or the lithography process is preferably an EUV lithography apparatus or an EUV lithography process.

[0029] It will be appreciated that features described with respect to one embodiment may be combined with any features described with respect to another embodiment, and that all such combinations are expressly contemplated and disclosed herein. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Embodiments of the invention will now be described, by way of example only, with reference to the accompanying schematic drawings in which corresponding reference numerals indicate corresponding parts and in which:

[0031] Figure 1 depicts a lithographic apparatus according to an embodiment of the present invention;

[0032] Figure 2 is a schematic depiction of an apparatus according to one embodiment of the present invention; and

[0033] Figure 3 is a schematic depiction of an apparatus according to one embodiment of the present invention.

[0034] The features and advantages of the present invention will become more apparent from the detailed description set forth below when taken in conjunction with the accompanying drawings, in which like reference numerals identify corresponding elements throughout. In the accompanying drawings, like reference numerals generally indicate identical, functionally similar, and / or structurally similar elements. DETAILED DESCRIPTION

[0035] Figure 1 An exemplary lithography system including a fluid dispensing system 15 according to the present invention is shown. It will be appreciated that the present invention is not limited to only lithography systems, but finds particular application to lithography systems. It will also be appreciated that more than one fluid dispensing system 15 may be provided as required. The lithography system comprises a radiation source SO and a lithography apparatus LA. The radiation source SO is configured to generate an extreme ultraviolet (EUV) radiation beam B. The lithography apparatus LA comprises an illumination system IL, a support structure MT configured to support a patterning device MA (e.g., a mask), a projection system PS, and a substrate table WT configured to support a substrate W. The illumination system IL is configured to condition the radiation beam B before the radiation beam B is incident on the patterning device MA. The projection system is configured to project the radiation beam B (now patterned by the mask MA) onto the substrate W. The substrate W may include a previously formed pattern. In this case, the lithography apparatus aligns the patterned radiation beam B with the pattern previously formed on the substrate W. In this embodiment, the precise location of the fluid dispensing system 15 is not provided, and it will be appreciated that the fluid dispensing system 15 may be located in any desired location.

[0036] The radiation source SO, the illumination system IL, and the projection system PS may all be constructed and arranged so that they may be isolated from the external environment. A gas (e.g., hydrogen) at a pressure below atmospheric pressure may be provided in the radiation source SO. A vacuum may be provided in the illumination system IL and / or the projection system PS. A small amount of gas (e.g., hydrogen) at a pressure far below atmospheric pressure may be provided in the illumination system IL and / or the projection system PS.

[0037] Figure 1 The radiation source SO shown in is of a type that may be referred to as a laser generated plasma (LPP) source. The laser is arranged to deposit energy into a fuel, such as tin (Sn) provided from a fuel emitter, via a laser beam, the laser being, for example, a CO2 laser. Although tin is mentioned in the following description, any suitable fuel may be used. The fuel may be, for example, in liquid form and may be, for example, a metal or an alloy. The fuel emitter may include a nozzle configured to direct tin (e.g. in the form of droplets) toward a plasma formation region along a trajectory. The laser beam is incident on the tin at the plasma formation region. Plasma is created at the plasma formation region by depositing laser energy into the tin. During de-excitation and recombination of ions of the plasma, radiation is emitted from the plasma, the radiation including EUV radiation.

[0038] EUV radiation is collected and focused by a near normal incidence radiation collector (sometimes more generally referred to as a normal incidence radiation collector). The collector may have a multi-layer structure arranged to reflect EUV radiation (e.g., EUV radiation having a desired wavelength such as 13.5 nm). The collector may have an elliptical configuration, having two elliptical foci. The first focus may be at the plasma formation region, and the second focus may be at an intermediate focus, as discussed below.

[0039] The laser may be separate from the radiation source SO. In this case, the laser beam may be transferred from the laser to the radiation source SO by means of a beam delivery system (not shown) comprising, for example, suitable guiding mirrors and / or a beam expander and / or other optical devices. The laser and the radiation source SO may together be considered as a radiation system.

[0040] The radiation reflected by the collector forms a radiation beam B. The radiation beam B is focused at a point to form an image of the plasma formation region, which serves as a virtual radiation source for the illumination system IL. The point at which the radiation beam B is focused may be referred to as an intermediate focus. The radiation source SO is arranged so that the intermediate focus is located at or near an opening in an enclosure of the radiation source.

[0041] A radiation beam B is transferred from a radiation source SO into an illumination system IL which is configured to condition the radiation beam. The illumination system IL may include a facet field mirror device 10 and a facet pupil mirror device 11. The facet field mirror device 10 and the facet pupil mirror device 11 together provide a radiation beam B having a desired cross-sectional shape and a desired angular distribution. The radiation beam B is transferred from the illumination system IL and is incident on a patterning device MA held by a support structure MT. The patterning device MA reflects the radiation beam B and patterns the radiation beam B. The illumination system IL may include other mirrors or devices in addition to or instead of the facet field mirror device 10 and the facet pupil mirror device 11.

[0042] After reflection from the patterning device MA, the patterned radiation beam B enters the projection system PS. The projection system comprises a plurality of mirrors 13, 14 configured to project the radiation beam B onto a substrate W held by a substrate table WT. The projection system PS may apply a reduction factor to the radiation beam so as to form an image having features that are smaller than corresponding features on the patterning device MA. For example, a reduction factor of 4 may be applied. Although in Figure 1 The projection system PS has two mirrors 13, 14, but the projection system may comprise any number of mirrors (eg six mirrors).

[0043] Figure 1 The radiation source SO shown in FIG. 1 may include components that are not shown. For example, a spectral filter may be provided in the radiation source. The spectral filter may be substantially transmissive for EUV radiation, but substantially blocking radiation of other wavelengths, such as infrared radiation.

[0044] If the patterning device MA is not protected, contamination may require cleaning or discarding the patterning device MA. Cleaning the patterning device MA interrupts valuable manufacturing time, and discarding the patterning device MA is costly. Replacing the patterning device MA also interrupts valuable manufacturing time. Therefore, a small amount of fluid (such as oxygen) can be provided by the device of the present disclosure, which is less than the amount of fluid that can be provided by existing means without using a diluting carrier gas. The gas can be used to clean certain elements within the device and / or mitigate the creation of contaminants.

[0045] Figure 21 is a schematic depiction of a fluid dispensing system 15 according to the present invention applied to an exemplary volume, which can be, for example, the interior of a lithographic apparatus or other plasma generating device. In this exemplary depiction, a conduit 16 is fluidically connected to a volume 17. As shown by the double-headed arrow, the conduit 16 can be moved to change the length of the conduit 16 that is fluidically connected to the volume 17. In this way, the rate at which the fluid is provided to the volume 17 via penetration through the conduit 16 can be controlled. The conduit 16 is connected to a controller 18. The controller 18 can adjust the degree to which the conduit 16 is fluidically connected to the volume 17 and / or can control the pressure within the conduit 16 to control the rate at which the fluid is provided to the volume 17 via penetration through the conduit 16. Although depicted as a linear conduit, the conduit 16 can be of any shape and can be, for example, coiled. The conduit 16 is also depicted as being dead-end, but it will be appreciated that if desired, it can enter and then leave the volume 17, such as in the form of one or more loops. Although not shown, it will be appreciated that a shield may be provided covering at least a portion of the conduit 16 within the volume 17, thereby controlling the effective length of the conduit 16 within the volume 17 (i.e., the length of the conduit 16 from which fluid can be provided to the volume 17). In the depicted embodiment, the conduit 17 is positioned proximate to the reflector 19 so that the fluid provided by the conduit 17 is provided proximate to where it is needed. Again, the present disclosure is not particularly limited to providing fluid to a reflector, and in fact the present disclosure may be operated in any volume where the addition of a small amount of fluid is desired. The volume may be any enclosed area where the controlled addition of a small amount of fluid is desired that cannot be achieved by existing control systems.

[0046] Figure 3 An embodiment is depicted in which a fluid permeable surface 20 is disposed in a wall of the volume 17. A controller 18 is in communication with the fluid permeable surface 20 so as to control the rate at which fluid permeates into the volume 17. As previously discussed, this can be accomplished by varying the exposed surface area and / or pressure of the fluid permeable surface 20. In order to vary the exposed surface area of ​​the fluid permeable surface 20, a shield 21 may be provided. The double-headed arrow depicts that the shield 21 moves to expose more or less of the fluid permeable surface 20 in order to control the rate at which fluid is provided to the volume 17. The shield 21 may be of any configuration so long as it reduces the rate at which fluid can enter the volume 17. For example, the shield 21 may be in the form of a variable aperture that is opened or closed to vary the exposed surface area of ​​the fluid permeable surface 20.

[0047] In summary, the present disclosure provides for providing very small amounts of fluid into a volume where previously the fluid of interest would have needed to be diluted with a carrier gas due to limitations of existing control systems. The present disclosure thereby also avoids the need to add additional volumes of carrier gas to the system to which the fluid is being supplied. The present disclosure also allows for providing the fluid near where the fluid is desired.

[0048] While specific embodiments of the invention have been described above, it will be appreciated that the invention may be practiced otherwise than as described.

[0049] The above description is intended to be illustrative rather than limiting. It will therefore be apparent to those skilled in the art that modifications may be made to the invention as described without departing from the scope of the claims set forth below.

Claims

1. A fluid dispensing system, comprising: a fluid permeable surface having a predefined permeability to allow penetration of a fluid; and a controller configured to control the rate at which the fluid permeates into the volume by controlling one or both of the pressure of the fluid and the exposed surface area of ​​the fluid permeable surface.

2. A fluid dispensing system according to claim 1, wherein the fluid permeable surface is defined by a pipe or a tube.

3. A fluid dispensing system according to claim 1 or 2, wherein the fluid is selected from air, oxygen, nitrogen oxides, hydrogen, helium, carbon oxides, neon, argon and water or any combination thereof.

4. A fluid dispensing system according to any preceding claim, wherein the fluid permeable surface comprises plastic, ceramic or sintered metal.

5. A fluid dispensing system according to any preceding claim, wherein the system is configured to be pressurized at from about 0.1 bar to about 10 bar, optionally from about 0.5 bar to about 5 bar, preferably about 1 bar.

6. A fluid dispensing system according to any preceding claim, wherein the fluid does not contain nitrogen.

7. A fluid dispensing system according to any preceding claim, wherein the system is configured to provide fluid at a rate of from about 1×10 -3 mbar*1 / s / cm 2 To about 1×10 -8 mbar*1 / s / cm 2 , preferably from about 1×10 -4 mbar*1 / s / cm 2 To about 1×10 -7 mbar*1 / s / cm 2 , preferably from about 1×10 -5 mbar*1 / s / cm 2 To about 1×10 -6 mbar*1 / s / cm 2 .

8. A fluid dispensing system according to any preceding claim, wherein the system is configured to provide fluid at a flow rate of: from about 1×10 -3 mbar*1 / s to about 1×10 -7 mbar*1 / s, preferably from about 1×10 -4 mbar*1 / s to about 1×10 -6 mbar*1 / s, preferably about 1×10 -5 mbar*1 / s.

9. A fluid dispensing system according to any preceding claim, wherein the system comprises a pump configured to control the pressure of the fluid and / or a pressure regulator configured to control the pressure of the fluid.

10. A fluid dispensing system according to any preceding claim, wherein the system includes a moving mechanism configured to move the fluid permeable surface relative to the volume into which the fluid is to be dispensed and / or to move an impermeable shield over at least a portion of the fluid permeable surface so as to control the rate at which the fluid penetrates into the volume.

11. A method for controlling the dispensing of a fluid, the method comprising: a) providing a fluid permeable surface having a predefined permeability, b) providing a fluid in contact with said fluid permeable surface, c) controlling one or both of the pressure of the fluid and the exposed surface area of ​​the fluid permeable surface to control the rate at which the fluid permeates through the fluid permeable surface into a volume.

12. The method of claim 9, wherein the exposed surface area of ​​the fluid permeable surface is controlled by one or both of: varying the length of a conduit or tube comprising the fluid permeable surface, and at least partially reversibly covering the fluid permeable surface with a non-fluid permeable material.

13. The method according to any one of claims 11 or 12, wherein providing a fluid in contact with the fluid permeable membrane comprises providing air, oxygen, nitrogen oxides, hydrogen, helium, carbon oxides, neon, argon and water or any combination thereof, preferably wherein the fluid does not contain nitrogen.

14. A plasma generating device comprising a fluid dispensing system according to any one of claims 1 to 10.

15. The plasma generating device according to claim 14, wherein the device is selected from a lithography device, a plasma etching device, a laser and a fusion reactor, preferably an EUV lithography device.

16. Use of the fluid dispensing system according to claims 1 to 10, the method according to claims 11 to 13 or the plasma generating device according to claim 14 or 15 in a lithography apparatus or a lithography process, wherein the lithography apparatus or the lithography process is preferably an EUV lithography apparatus or an EUV lithography process.

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