Glue pouring method of lighting device

Abstract

The invention relates to a glue pouring method of a lighting device. The glue pouring method comprises the steps that first glue is preheated and defoamed; preheating and drying the lighting device; calibrating the ratio of the first glue to the second glue; the first glue and the second glue respectively enter a glue mixing nozzle in proportion; the position of the lighting device is kept, and a glue mixing nozzle is adopted for surface glue pouring in a glue dispensing mode; the lighting device naturally solidifies the surface pouring glue in a standing mode. Therefore, the preparation problem of a low-thickness surface glue layer with the height less than 1mm is solved, the method is suitable for glue with poor flowability caused by high density, the difficulty that the low-thickness surface glue layer cannot be leveled due to poor flowability of the glue is overcome, and the problem that bubbles are easy to generate due to the low-thickness surface glue layer is avoided; therefore, the consistency of surface glue pouring of the lighting device is improved, components of the lighting device are protected as much as possible, a surface glue layer with the height smaller than 1 mm can be prepared, and the method is particularly suitable for low-thickness LED lamp beads such as RGBW lamp beads.

Description

Technical Field

[0001] The present application relates to the field of LED glue potting, and in particular to a glue potting method for a lighting device. Background Art

[0002] The traditional wide-angle light source controls the RGB LED lamp beads through the DMX control mode. The RGBLED lamp beads used in this technology are 2.6 mm in height, and the thickness of the potting glue on the surface can reach 2.5 mm or even higher. For the traditional glue potting process, the thicker the glue, the better the fluidity and the easier the glue potting. The glue potting process is also called the glue potting process. The glue is used to cover the surface of the light board such as the PCB. The glue level is flush with the LED light-emitting surface, which does not affect the LED light-emitting efficiency. At the same time, it can play a waterproof role and also play a certain heat dissipation role. After the glue is cured, it wraps all electronic devices and light source devices to prevent damage to the object components and protect the LED lamp beads well.

[0003] However, with the development of technology, on the one hand, the density of glue is getting higher and higher in order to improve the protection performance, so the fluidity is reduced; on the other hand, RGB LED lamp beads that are too large and too high have problems such as high cost, large volume, and high height. Therefore, there is a demand for low-thickness LED lamp beads for wide-angle light sources. However, low-thickness LED lamp beads, such as RGBW lamp beads, are less than 1 mm in height, so the thickness of the surface potting glue cannot be higher than 1 mm. However, the thinner the glue, the worse the fluidity of the glue under the action of surface tension, making it difficult to level the surface of the light board, and it is easy to cause bubbles after curing. Summary of the invention

[0004] Based on this, it is necessary to provide a glue filling method for a lighting device.

[0005] One embodiment of the present application is a method for glue filling of a lighting device, which comprises the following steps:

[0006] The first glue is preheated and degassed;

[0007] Preheating and drying of lighting fixtures;

[0008] Calibrate the ratio of the first glue to the second glue;

[0009] The first glue and the second glue enter the glue mixing nozzle respectively according to the proportion;

[0010] The lighting device is kept in position, and glue is dispensed on the surface using a glue mixing nozzle;

[0011] The lighting device is naturally cured by surface glue in a static manner.

[0012] The above-mentioned glue pouring method for the lighting device overcomes the difficulty of preparing a low-thickness surface glue layer with a height of less than 1 mm, is suitable for glue with high density resulting in poor fluidity, overcomes the difficulty of the low-thickness surface glue layer being unable to flow level due to poor glue fluidity, and avoids the bubble problem that is easily caused by the low-thickness surface glue layer, thereby improving the consistency of the glue pouring on the surface of the lighting device and protecting the components of the lighting device as much as possible. Therefore, a surface glue layer with a height of less than 1 mm can be prepared, which is particularly suitable for low-thickness LED lamp beads such as RGBW lamp beads.

[0013] In one embodiment, the first glue is preheated and degassed, comprising the steps of: preheating the first glue to 40° C. to 45° C., and degassed by stirring for at least 10 minutes.

[0014] In one of the embodiments, before degassing by stirring for at least 10 minutes, the method for glue filling of the lighting device further comprises the step of: evacuating the first container storing the first glue to -0.8 Mpa.

[0015] Illustratively, during the degassing process for at least 10 minutes in a stirring manner, the first container is continuously evacuated to -0.8 MPa.

[0016] In one of the embodiments, before calibrating the ratio of the first glue to the second glue, the method for glue filling of the lighting device further includes the step of: adjusting the air pressure in the first container storing the first glue and the second container storing the second glue to 0.2 MPa to 0.3 MPa.

[0017] In one embodiment, calibrating the ratio of the first glue to the second glue comprises the steps of: calibrating the ratio of the first glue to the second glue to be 4.8:1 to 5.3:1.

[0018] In one of the embodiments, a glue mixing nozzle is used to dispense glue on the surface, so that the thickness of the glue layer on the surface of the lighting device is less than or equal to 0.7 mm.

[0019] In one embodiment, the lighting device is left to stand in a static manner to naturally cure the surface glue filling, specifically: the lighting device is left to stand in a static manner to naturally cure the surface glue filling for 24 hours.

[0020] In one of the embodiments, before the first glue is preheated and degassed, the method for glue filling of the lighting device further includes the steps of: presetting the ambient temperature to 15° C. to 25° C. and the relative humidity to not higher than 45%.

[0021] In one of the embodiments, after the lighting device is left to stand for natural curing, the method for pouring glue into the lighting device further comprises the step of: pouring glue into the interior of the lighting device.

[0022] In one embodiment, the internal glue filling of the lighting device comprises the following steps:

[0023] Preheating and drying of lighting fixtures;

[0024] The first glue filling inside the lighting device;

[0025] The lighting device is naturally cured by the first glue filling in a static manner;

[0026] Second glue filling inside the lighting device;

[0027] The lighting device is naturally cured by the second glue filling in a static manner. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0029] FIG. 1 is a schematic flow chart of a first embodiment of a method for filling a lighting device according to the present application.

[0030] FIG. 2 is a schematic flow chart of a second embodiment of a method for filling a lighting device according to the present application.

[0031] FIG. 3 is a schematic flow chart of a third embodiment of a method for filling glue for a lighting device according to the present application.

[0032] FIG. 4 is a schematic flow chart of a fourth embodiment of a method for filling glue for a lighting device according to the present application.

[0033] FIG. 5 is a schematic structural diagram of an embodiment of the lighting device described in the present application.

[0034] FIG. 6 is a schematic structural diagram of the embodiment shown in FIG. 5 in another direction.

[0035] FIG. 7 is a schematic structural diagram of the embodiment shown in FIG. 6 in another direction.

[0036] FIG. 8 is a schematic diagram of structural decomposition of the embodiment shown in FIG. 7 in another direction.

[0037] Figure numerals: 100, lighting device. DETAILED DESCRIPTION

[0038] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0039] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may also be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of this application are for illustrative purposes only and do not represent the only implementation method.

[0040] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0041] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are in contact indirectly through an intermediate medium. Moreover, a first feature being “above”, “above”, or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0042] Unless otherwise defined, all technical and scientific terms used in the specification of this application have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in the specification of this application includes any and all combinations of one or more related listed items.

[0043] The present application discloses a method for glue pouring for lighting devices, which includes some or all of the technical features of the following embodiments; that is, the method for glue pouring for lighting devices includes some or all of the following steps. In one embodiment of the present application, a method for glue pouring for lighting devices includes the following steps: preheating and degassing the first glue; preheating and drying the lighting device; calibrating the ratio of the first glue to the second glue; the first glue and the second glue respectively enter the mixing nozzle in proportion; the lighting device maintains its position, and the mixing nozzle is used to pour glue on the surface in a dispensing manner; the lighting device is naturally cured by the surface pouring of glue in a static manner. The above-mentioned method for pouring glue for lighting devices overcomes the difficulty of preparing a low-thickness surface glue layer with a height of less than 1 mm, is suitable for glue with poor fluidity due to high density, overcomes the difficulty of the low-thickness surface glue layer that the glue cannot be leveled due to poor fluidity of the glue, and avoids the problem of bubbles that are easily caused by the low-thickness surface glue layer, thereby improving the consistency of the surface pouring of the lighting device, and protecting the components of the lighting device as much as possible, so that a surface glue layer with a height of less than 1 mm can be prepared, which is particularly suitable for low-thickness LED lamp beads such as RGBW lamp beads. The glue filling method of the lighting device is described in detail below with reference to FIG. 1 to FIG. 8 .

[0044] In one embodiment, a method for glue filling of a lighting device is shown in FIG1 , which includes the following steps: S100, preheating and degassing the first glue; S200, preheating and drying the lighting device; S300, calibrating the ratio of the first glue to the second glue; S400, the first glue and the second glue enter the mixing nozzle in proportion; S500, the lighting device maintains its position, and the mixing nozzle is used to perform surface glue filling in a dispensing manner; S600, the lighting device is left to naturally cure the surface glue filling in a static manner. Exemplarily, before step S400, the method for glue filling of the lighting device also includes the steps of: preheating the mixing nozzle; and in steps S400 and S500, maintaining the temperature of the mixing nozzle.

[0045] As an example, a method for glue filling of a lighting device is shown in FIG2, which includes the following steps: S100, preheating and degassing the first glue; S200, preheating and drying the lighting device; S300, calibrating the ratio of the first glue to the second glue; S310, preheating the glue mixing nozzle; S400, maintaining the temperature of the glue mixing nozzle, and the first glue and the second glue respectively enter the glue mixing nozzle in proportion; S500, the lighting device maintains its position, maintains the temperature of the glue mixing nozzle, and uses the glue mixing nozzle to perform surface glue filling in a dispensing manner; S600, the lighting device is allowed to naturally cure the surface glue filling in a static manner. The time for the lighting device to naturally cure the surface glue filling in a static manner can be set or adjusted according to actual conditions. The rest of the embodiments are similar and will not be described in detail.

[0046] With this design, the entire process is simple and efficient, as described in detail below.

[0047] The first glue is preheated and degassed, on the one hand, to eliminate the bubbles carried in the first glue itself as much as possible, and on the other hand, to match the temperature of the first glue with the temperature of the lighting device, while increasing fluidity.

[0048] The lighting device is preheated and dried so that the temperature of the lighting device matches the temperature of the first glue. On the one hand, this helps to avoid bubbles when the first glue contacts the lighting device. On the other hand, the steps of preheating and drying the lighting device ensure that the first glue has better fluidity when it contacts the dispensing surface of the lighting device.

[0049] The ratio of the first glue to the second glue is precisely controlled to ensure as much as possible that when the surface glue is dispensed by dispensing in the subsequent step, the surface glue layer of the lighting device has the target index and meets the design requirements.

[0050] The first glue and the second glue enter the mixing nozzle respectively in proportion, and the step of calibrating the ratio of the first glue to the second glue is carried out. On the one hand, the accuracy of the glue dosage is ensured, and on the other hand, the first glue and the second glue form preliminary contact and mixing in the mixing nozzle, which is conducive to avoiding the first glue and the second glue from mixing on the surface of the lighting device and causing uneven glue coating, and is conducive to the accuracy of surface glue filling in a dispensing manner using the mixing nozzle, ensuring the uniformity of the glue layer and avoiding bubbling, which is conducive to preparing a low-thickness surface glue layer with a height of less than 1 mm. Therefore, a surface glue layer with a height of less than 1 mm can be prepared, which is particularly suitable for low-thickness LED lamp beads such as RGBW lamp beads.

[0051] The lighting device maintains its position, and a glue mixing nozzle is used to dispense glue on the surface. On the one hand, as mentioned above, it is conducive to preparing a low-thickness surface glue layer to avoid bubbles, and on the other hand, it is conducive to improving the fluidity of the glue and ensuring the uniformity of the surface glue layer of the lighting device as much as possible. It is suitable for glue with poor fluidity due to high density, and overcomes the difficulty that the low-thickness surface glue layer cannot be leveled due to poor glue fluidity. In this process, since the position of the glue mixing nozzle moves and the lighting device maintains its position, the path control of the glue mixing nozzle can be preset in advance according to the specifications and position of the lighting device, thereby realizing automated dispensing to complete the surface glue filling process.

[0052] In this way, after the surface glue filling process is completed, it can be basically ensured that the surface glue layer of the lighting device is uniform and free of bubbles, so that the lighting device can be naturally cured by the surface glue filling in a static manner.

[0053] In addition, the design of preheating the glue mixing nozzle and maintaining the temperature of the glue mixing nozzle further improves the mixing uniformity and fluidity of the first glue and the second glue in the steps of the first glue and the second glue entering the glue mixing nozzle respectively in proportion and using the glue mixing nozzle to perform surface glue filling in a dispensing manner. In conjunction with other steps, it eliminates bubbles and improves the uniformity of the surface glue layer of the lighting device, avoiding the bubble problem that is easily caused by the low thickness of the surface glue layer, and is therefore conducive to the preparation of a lighting device with a lower thickness surface glue layer.

[0054] In one of the embodiments, before the first glue is preheated and degassed, the glue pouring method of the lighting device further includes the steps of: presetting the ambient temperature to 15°C to 25°C, and the relative humidity to be no higher than 45%, and the relative humidity is Relative Humidity, referred to as RH. The preset environment is the temperature of the preset environment; as an example, the preset ambient temperature is lower than the temperature at which the first glue is preheated, and the relative humidity of the preset environment is no higher than 45%, avoiding excessive humidity; illustratively, the preset ambient temperature differs from the temperature at which the first glue is preheated by 20°C to 30°C. Usually, the glue pouring method of the lighting device performs the glue pouring process in a specific environment such as a glue pouring room. When testing the glue pouring process, it was found that if the ambient temperature is close to the temperature at which the first glue is preheated, too high an ambient temperature is likely to affect the discharge of bubbles in the first glue, so appropriately lowering the ambient temperature is beneficial to reducing energy consumption on the one hand, and to avoiding the generation of bubbles after curing on the other hand.

[0055] In each embodiment, the first glue is preheated and degassed; in one embodiment, the first glue is preheated and degassed, including the steps of: preheating the first glue to 40°C to 45°C, that is, the preheating temperature of the first glue is 40°C to 45°C. In one embodiment, the first glue is preheated and degassed, including the steps of: preheating the first glue to 40°C to 45°C, and degassed by stirring for at least 10 minutes, such as stirring and degassed for 15 minutes, 20 minutes, 30 minutes or 40 minutes; illustratively, the first glue is degassed by stirring in an environment of 40°C to 45°C for at least 10 minutes. Exemplarily, before degashing by stirring, the first container storing the first glue is placed in a negative pressure state by vacuuming, that is, the first glue in the first container is placed in a negative pressure state. In one embodiment, before degassing for at least 10 minutes in a stirring manner, the method for glue filling of the lighting device further includes the steps of: vacuuming the first container storing the first glue to -0.8Mpa; illustratively, before degassing for at least 10 minutes in a stirring manner, the method for glue filling of the lighting device further includes the steps of: vacuuming the first container storing the first glue to -0.8Mpa; and in the process of degassing for at least 10 minutes in a stirring manner, continuing to vacuumize the first container to -0.8Mpa. That is, degassing is carried out in a warm negative pressure environment, which is conducive to degassing the first glue in the first container under stirring. At the same time, in conjunction with the subsequent preheating and drying steps of the lighting device, and optionally in conjunction with the design of preheating the glue mixing nozzle and maintaining the temperature of the glue mixing nozzle, the bubble problem that is easy to occur due to the low thickness of the surface glue layer is avoided as much as possible before the glue is filled in the dispensing manner, thereby improving the consistency of the glue filling on the surface of the lighting device.

[0056] In each embodiment, the lighting device is preheated and dried; illustratively, the preheating temperature of the lighting device, i.e., the target temperature of the lighting device preheating, is higher than the preheating temperature of the first glue; illustratively, the preheating temperature of the lighting device is 25°C to 30°C higher than the preheating temperature of the first glue. Such a design makes the temperature of the lighting device higher than the temperature of the first glue in the subsequent dispensing step of dispensing the surface glue by using a mixing nozzle. On the one hand, it is beneficial for the mixed glue of the first glue and the second glue to escape from the outside when the mixed glue, especially the residual tiny bubbles in the first glue, contacts the lighting device. On the other hand, it is beneficial to improve the fluidity of the mixed glue on the surface of the lighting device, so that when the mixing nozzle is used to dispense the surface glue in the subsequent dispensing method, the fluidity of the mixed glue is improved. It is suitable for the first glue and the second glue with relatively higher density, avoids the bubble problem caused by the low thickness of the surface glue layer, and improves the consistency of the surface glue filling of the lighting device. Therefore, a relatively lower height surface glue layer can be prepared, which is particularly suitable for low thickness LED lamp beads such as RGBW lamp beads.

[0057] In each embodiment, the ratio of the first glue to the second glue is calibrated; in one embodiment, the ratio of the first glue to the second glue is calibrated, including the steps of: calibrating the ratio of the first glue to the second glue to be 4.8:1 to 5.3:1. As an example, the ratio of the first glue to the second glue is calibrated to be 5:1. The first glue and the second glue are glues with different components. As an example, the AB glue commonly used in the industry can be used, with the first glue being A glue and the second glue being B glue. The specific components depend on the type and use of the product. As an example but not a limitation, AB glue is a two-component hardening glue, A glue, i.e., component A, is usually epoxy resin, acrylate copolymer or acrylic modified epoxy resin, etc., and may contain catalysts and other additives; B glue, i.e., component B, is modified amine or other hardener, and may also contain catalysts and other additives. A glue and B glue are stored separately, and then mixed in a certain proportion when used, so that A glue and B glue are solidified and hardened under the action of B glue; wherein, the catalyst can control the curing time, and other additives can control the properties of the glue, such as viscosity, rigidity, flexibility, adhesion, etc.

[0058] In one embodiment, before calibrating the ratio of the first glue to the second glue, the method for glue filling of the lighting device further includes the step of: adjusting the air pressure in the first container storing the first glue and the second container storing the second glue to 0.2MPa to 0.3MPa. This is conducive to releasing the residual tiny bubbles of the first glue, and adjusting the state of the first glue and the second glue before mixing, so that in the subsequent step of the first glue and the second glue entering the mixing nozzle respectively in proportion, the first glue and the second glue are in the same or similar state when mixed, so it is not easy to bubble.

[0059] Exemplarily, in one embodiment, before calibrating the ratio of the first glue to the second glue, the method for pouring glue for the lighting device further includes the step of preheating the second glue; if necessary, before calibrating the ratio of the first glue to the second glue, the method for pouring glue for the lighting device further includes the step of preheating and degassing the second glue. As an example, the temperature at which the second glue is preheated is the same as the temperature at which the first glue is preheated. Exemplarily, the preheating temperature of the second glue is 40°C to 45°C. As an example, the second glue is preheated to 40°C to 45°C, and the second glue is degassed for at least 10 minutes in a stirring manner, that is, the second glue is degassed for at least 10 minutes in a stirring manner; Exemplarily, in an environment of 40°C to 45°C, the second glue is degassed for at least 10 minutes in a stirring manner, for example, degassed for 15 minutes, 20 minutes, 30 minutes or 40 minutes. Exemplarily, before degassing in a stirring manner, the second container storing the second glue is placed in a negative pressure state by vacuuming, that is, the second glue in the second container is placed in a negative pressure state. In one embodiment, before degassing for at least 10 minutes in a stirring manner, the method for glue filling of the lighting device further includes the steps of: vacuuming the second container storing the second glue to -0.8Mpa; illustratively, before degassing the second glue for at least 10 minutes in a stirring manner, the method for glue filling of the lighting device further includes the steps of: vacuuming the second container storing the second glue to -0.8Mpa; and in the process of degassing the second glue for at least 10 minutes in a stirring manner, continuing to vacuumize the second container to -0.8Mpa. That is, degassing is performed in a warm negative pressure environment, which is conducive to degassing the second glue in the second container under stirring. In conjunction with the first glue preheating and degassing steps, the subsequent lighting device preheating and drying steps, and the optional design of preheating the glue mixing nozzle and maintaining the temperature of the glue mixing nozzle, the bubble problem that is easy to occur due to the low thickness of the surface glue layer is avoided as much as possible before glue filling in a dispensing manner, thereby improving the consistency of glue filling on the surface of the lighting device.

[0060] In each embodiment, the first glue and the second glue enter the mixing nozzle in proportion; in this step, the proportion is the ratio of the first glue and the second glue calibrated previously; as an example, the first glue and the second glue enter the mixing nozzle in a ratio of 4.8:1 to 5.3:1. As an example, the ratio of the first glue to the second glue is 5:1, and the first glue and the second glue enter the mixing nozzle in a ratio of 5:1. Exemplarily, the mixing nozzle is a dispensing nozzle using a mixing tube. Before the mixing nozzle is used to dispense glue on the surface in a dispensing manner, the first glue and the second glue are mixed in proportion in the mixing nozzle in advance to form a mixed glue.

[0061] In each embodiment, the lighting device maintains its position, and a glue mixing nozzle is used to dispense glue on the surface; in one embodiment, a glue mixing nozzle is used to dispense glue on the surface, so that the thickness of the glue layer on the surface of the lighting device is less than or equal to 1 mm. In one embodiment, a glue mixing nozzle is used to dispense glue on the surface, so that the thickness of the glue layer on the surface of the lighting device is less than or equal to 0.7 mm. As an example, the glue mixing tube used by the glue dispensing nozzle can be a static mixing tube with a specification of GSM9-16. As mentioned above, the embodiments of the present application overcome the difficulty of preparing a low-thickness surface glue layer of less than 1 mm in height by improving the fluidity of the glue and controlling the bubbles. It is suitable for glue with high density resulting in poor fluidity, ensures the uniformity of the glue layer and avoids bubbling, so that a surface glue layer with a height of no more than 0.7 mm can be prepared, which is particularly suitable for low-thickness LED lamp beads such as RGBW lamp beads.

[0062] In each embodiment, the surface of the lighting device is naturally cured by standing still. In one embodiment, the surface of the lighting device is naturally cured by standing still, specifically: the surface of the lighting device is naturally cured by standing still for more than 12 hours. As an example, the surface of the lighting device is naturally cured by standing still, specifically: the surface of the lighting device is naturally cured by standing still for 24 hours. In other embodiments, the surface of the lighting device is naturally cured by standing still, specifically: the surface of the lighting device is naturally cured by standing still for 20 hours. For the first glue or the second glue with a UV curing agent, that is, for the mixed glue with a UV curing agent, illustratively, the surface of the lighting device is naturally cured by standing still, specifically, the surface of the lighting device is naturally cured by standing still in combination with UV light irradiation.

[0063] In one of the embodiments, after the lighting device is left to stand for natural curing, the method for glue pouring of the lighting device further comprises the step of: pouring glue inside the lighting device. In one of the embodiments, a method for pouring glue of a lighting device is shown in FIG3, and comprises the steps of: S100, preheating and degassing the first glue; S200, preheating and drying the lighting device; S300, calibrating the ratio of the first glue to the second glue; S400, the first glue and the second glue respectively enter the mixing nozzle in proportion; S500, the lighting device maintains its position, and the mixing nozzle is used to perform surface glue pouring in a dispensing manner; S600, the lighting device is left to stand for natural curing of the surface glue pouring; S700, the lighting device is poured with glue inside. The rest of the embodiments are similar and will not be described in detail. Such a design is conducive to realizing the internal glue pouring process, thereby improving the waterproof performance of the lighting device, and is suitable for outdoor lighting use.

[0064] In one embodiment, the internal glue pouring of the lighting device includes the following steps: preheating and drying the lighting device; pouring glue into the lighting device for the first time; letting the lighting device stand still to naturally cure the first pouring of glue; pouring glue into the lighting device for the second time; letting the lighting device stand still to naturally cure the second pouring of glue. Such a design is conducive to improving the uniformity and effectiveness of the internal glue pouring of the lighting device.

[0065] In one embodiment, a method for glue filling of a lighting device is shown in FIG4 , which includes the following steps: S100, preheating and degassing the first glue; S200, preheating and drying the lighting device; S300, calibrating the ratio of the first glue to the second glue; S400, the first glue and the second glue enter the mixing nozzle in proportion; S500, the lighting device maintains its position, and the mixing nozzle is used to perform surface glue filling in a dispensing manner; S600, the lighting device is left to naturally cure the surface glue filling in a static manner; S710, the lighting device is preheated and dried; S720, the lighting device is filled with glue for the first time; S730, the lighting device is left to naturally cure the first glue filling in a static manner; S740, the lighting device is filled with glue for the second time; S750, the lighting device is left to naturally cure the second glue filling in a static manner. The rest of the embodiments are similar and will not be described in detail. It can be seen from the above description that step S200 and step S710 are the same in description, but the specific lighting devices are different. The lighting device of step S200 has not yet undergone the surface glue filling process, so it can be called a lighting device before surface glue filling, and the lighting device of step S710 has completed the surface glue filling process, so it can be called a lighting device with a surface glue layer.

[0066] In one embodiment, the lighting device after glue filling is shown in FIG. 5 and FIG. 6. In this embodiment, the lighting device 100 is an outdoor light, such as a wall washer, a light strip, or a matrix light. In combination with FIG. 7 and FIG. 8, a lighting device with a surface glue layer height of less than 1 mm can be realized, which can be used as an RGBW lamp bead light source. For example, the thickness of its light source, that is, the lamp bead, is only 0.7 mm, so the thickness of the glue filling needs to be controlled within 0.7 mm, and the surface glue layer of the lighting device 100 meets the thickness requirement and is suitable for the Artnet control mode, thereby improving the applicability of the lighting device. In contrast, when the glue thickness is thin, due to the tension of the glue, the fluidity is very poor, resulting in 0.7 mm thick glue It is difficult to level the entire PCB plane of the lighting device to install the lamp beads. Such a process problem cannot be solved in the traditional glue filling process; and when the glue thickness is not greater than 0.7 mm, due to the poor fluidity, it is easy to generate bubbles after curing. Such a process problem cannot be solved in the traditional glue filling process.

[0067] The following is an example of the method for filling glue in the lighting device in combination with actual application conditions. In one embodiment, the method for filling glue in the lighting device includes the following steps.

[0068] Before glue filling:

[0069] The ambient temperature of the glue filling room is 15℃-25℃, and the humidity is ≤45%RH.

[0070] Glue A was heated to 40°C-45°C, and evacuated to -0.8 MPa, and stirred for degassing for 30 minutes.

[0071] Adjust the air pressure of plastic barrel A and plastic barrel B to 0.2MPa to 0.3MPa respectively.

[0072] Calibrate the glue ratio of A glue 5: B glue 1, and check the glue quantity output by the machine.

[0073] The outer diameter of the dispensing nozzle is 1.4 mm to 2 mm, wherein the dispensing nozzle has a mixing tube, and the mixing tube adopts a static mixing tube with a specification of GSM9-16.

[0074] Glue filling:

[0075] Before glue pouring, the product is loaded into the jig, and the jig is placed in an oven and dried at 70℃ for 2 hours. The jig is taken out and glue is poured while it is hot.

[0076] The product has the surface glue filling of LED, and the surface glue amount is 4.0g-4.2g.

[0077] Debug the motion trajectory of the equipment's dispensing nozzle, and pour glue through the dispensing nozzle at a speed of 0.3g / s.

[0078] After the glue is poured, the product is placed in an environment with a temperature of 15℃-25℃ and a humidity of ≤45%RH for natural curing.

[0079] The first time the product is filled with glue, the product is placed in an oven and baked at 70℃ for 2 hours. Each glue hole is filled with 40g of glue, and it is filled twice, a total of 80g, and the glue flow rate is 1g / s.

[0080] After filling the glue, take the fixture out of the equipment and place it on the curing rack for curing for 12 hours.

[0081] The product is filled with glue for the second time, with 10g of glue in each glue hole, filled twice, a total of 20g; the glue flow rate is 1g / s.

[0082] After filling the glue, take the fixture out of the equipment and place it on the curing rack for curing for 12 hours.

[0083] After glue filling:

[0084] If the equipment is shut down or the glue filling is stopped for more than 2 minutes, anti-curing protection is performed.

[0085] When the equipment is shut down or glue filling is stopped for more than 2 hours, the mixing hose must be cleaned; the A / B glue barrels must be kept in a vacuum state, and the vacuum gauge should display -0.07MPa to -0.08MPa.

[0086] If the equipment is shut down for more than 7 days, the glue barrel and pipes of the equipment must be cleaned.

[0087] The equipment work surface must be kept clean. When the equipment is shut down and there is glue in the glue barrel, it must be inspected every day. The A / B glue barrel must be kept in a vacuum state, and the vacuum meter should show -0.07MPa to -0.08MPa.

[0088] Such a method for gluing lighting devices overcomes the difficulty of preparing a low-thickness surface glue layer with a height of less than 1 mm, is suitable for glue with high density resulting in poor fluidity, overcomes the difficulty of the low-thickness surface glue layer being unable to flow level due to poor glue fluidity, and avoids the bubble problem that is easily caused by the low-thickness surface glue layer, thereby improving the consistency of the gluing on the surface of the lighting device and protecting the components of the lighting device as much as possible. Therefore, a surface glue layer with a height of less than 1 mm can be prepared, which is particularly suitable for low-thickness LED lamp beads such as RGBW lamp beads.

[0089] It should be noted that other embodiments of the present application also include a method for glue filling for a lighting device that can be implemented by combining the technical features in the above embodiments.

[0090] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0091] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the scope of patent protection of the present application shall be subject to the attached claims.

Claims

1. A method for glue filling of a lighting device, characterized in that: Includes steps: The first glue is preheated and degassed; Preheating and drying of lighting fixtures; Calibrate the ratio of the first glue to the second glue; The first glue and the second glue enter the glue mixing nozzle respectively according to the proportion; The lighting device is kept in position, and glue is dispensed on the surface using a glue mixing nozzle; The lighting device is naturally cured by surface glue in a static manner.

2. The method for filling glue for a lighting device according to claim 1, characterized in that: The first glue is preheated and degassed, comprising the steps of: preheating the first glue to 40° C. to 45° C., and degassed by stirring for at least 10 minutes.

3. The glue pouring method for the lighting device according to claim 2, characterized in that: Before degassing in a stirring manner for at least 10 minutes, the glue filling method for the lighting device further includes the step of: evacuating a first container storing the first glue to -0.8 Mpa.

4. The glue pouring method for the lighting device according to claim 1, characterized in that: Before calibrating the ratio of the first glue to the second glue, the method for glue filling of the lighting device further includes the step of adjusting the air pressure in the first container storing the first glue and the second container storing the second glue to 0.2 MPa to 0.3 MPa.

5. The glue pouring method for the lighting device according to claim 4, characterized in that: Calibrating the ratio of the first glue to the second glue includes the steps of: calibrating the ratio of the first glue to the second glue to be 4.8:1 to 5.3:

1.

6. The method for glue filling of the lighting device according to claim 1, characterized in that: The glue mixing nozzle is used to dispense glue on the surface, so that the thickness of the glue layer on the surface of the lighting device is less than or equal to 0.7 mm.

7. The glue pouring method for the lighting device according to claim 1, characterized in that: The lighting device is left to stand in a static manner to naturally cure the surface glue filling, specifically: the lighting device is left to stand in a static manner to naturally cure the surface glue filling for 24 hours.

8. The glue pouring method for the lighting device according to claim 1, characterized in that: Before the first glue is preheated and degassed, the glue filling method for the lighting device further includes the steps of: presetting the ambient temperature to 15° C. to 25° C. and the relative humidity to not higher than 45%.

9. The method for glue filling of a lighting device according to any one of claims 1 to 8, characterized in that: After the lighting device is left to stand for natural curing, the method for pouring glue into the lighting device further comprises the step of: pouring glue into the interior of the lighting device.

10. The glue pouring method for the lighting device according to claim 9, characterized in that: Gluing inside the lighting device includes the following steps: Preheating and drying of lighting fixtures; The first glue filling inside the lighting device; The lighting device is naturally cured by the first glue filling in a static manner; Second glue filling inside the lighting device; The lighting device is naturally cured by the second glue filling in a static manner.

Images