Hemispherical harmonic oscillator processing device and method

Abstract

The invention discloses a hemispherical harmonic oscillator processing device and method, and the device comprises a base which comprises a first sliding table and a second sliding table which are in sliding connection; the sliding body is in sliding connection with the first sliding table and can slide in the third direction close to or away from the second sliding table, and the first sliding table, the second sliding table and the sliding body are perpendicular to one another; the first rotating shaft is fixedly connected to the side wall of the sliding body, and the side wall of the sliding body is perpendicular to the first sliding table and close to the side wall of the second sliding table; the first fixer is arranged on the first rotating shaft and is used for fixing a to-be-processed hemispherical harmonic oscillator; the second rotating shaft is fixedly connected to the second sliding table; the second fixer is arranged on the second rotating shaft and is used for fixing the ball head grinding wheel; and one side of the ball head grinding wheel is fixed to the second fixator, the other side of the ball head grinding wheel extends to be close to the first fixator, and when the to-be-machined hemispherical harmonic oscillator is fixed to the first fixator, the other side of the ball head grinding wheel can extend to be in contact with the to-be-machined hemispherical harmonic oscillator.

Description

Technical Field

[0001] The invention relates to the technical field of oscillator processing, and in particular to a hemispherical oscillator processing device and method. Background Art

[0002] The hemispherical resonator gyroscope is a sensor used to measure and maintain directional stability. It has the advantages of high precision, high stability, fast response, low power consumption, and resistance to shock and vibration. Today, hemispherical resonator gyroscopes have played an important role in many fields such as missile guidance, astronomical observation, autonomous driving, and aerospace. As the core component of the hemispherical resonator gyroscope, the processing quality of the hemispherical resonator will directly affect the working performance of the gyroscope.

[0003] The quartz hemispherical resonator is a thin-walled hemispherical shell structure with complex structure and small size. It has extremely high precision requirements during processing. The resonator is mostly made of fused quartz, which is a hard and brittle material and is prone to breakage or cracks during processing.

[0004] At present, in the method of ultra-precision machining of the resonator using a small-diameter ball-end grinding wheel, a two-axis linkage method is used to machine each part, resulting in poor grinding accuracy in some areas. At the same time, the two-axis linkage machining method causes the contour error of the ball-end grinding wheel during the grinding process to be copied to the surface of the resonator, affecting the machining accuracy of the resonator. Summary of the invention

[0005] In view of the above problems, the present invention is proposed to provide a hemispherical resonator processing device and method that overcome the above problems or at least partially solve the above problems.

[0006] According to one aspect of the present invention, a hemispherical resonator processing device is provided, comprising: a base, comprising a first slide and a second slide slidably connected, the first slide slides relative to the second slide along a first direction, and the second slide slides relative to the first slide along a second direction; a sliding body, slidably connected to the first slide, and can slide along a third direction close to or away from the second slide, and the first slide, the second slide and the sliding body are perpendicular to each other; a first rotating shaft, fixedly connected to the side wall of the sliding body, and can rotate along a fourth direction, and the side wall is a side wall of the sliding body that is perpendicular to the first slide and close to the second slide; a first fixture, arranged on the first rotating shaft, and used to fix the hemispherical resonator to be processed; a second rotating shaft, fixedly connected to the second slide, and can rotate along a fifth direction; a second fixture, arranged on the second rotating shaft, and used to fix a ball-end grinding wheel; the ball-end grinding wheel, one side of which is fixed to the second fixture, and the other side extends to be close to the first fixture, and when the first fixture fixes the hemispherical resonator to be processed, the other side of the ball-end grinding wheel can extend to contact the hemispherical resonator to be processed.

[0007] Optionally, the processing device according to the present invention also includes: a pad block, arranged between the second rotating shaft and the second fixture; the pad block is provided with a slope of a preset angle on the side close to the second fixture, so that the ball head grinding wheel can process the hemispherical resonator to be processed at an inclined axis according to the preset angle.

[0008] Optionally, the processing device according to the present invention also includes: a first driver connected to the first slide, used to drive the first slide to slide in the first direction; a second driver connected to the second slide, used to drive the second slide to slide in the second direction; a third driver connected to the slide, used to drive the slide to slide in the third direction; a fourth driver connected to the first rotating shaft, used to drive the first rotating shaft to rotate along the fourth direction; a fifth driver connected to the second rotating shaft, used to drive the second rotating shaft to rotate along the fifth direction.

[0009] Optionally, the processing device according to the present invention also includes: a controller, which is respectively connected to the first driver, the second driver, the third driver, the fourth driver and the fifth driver, and is used to control the operation of the first driver, the second driver, the third driver, the fourth driver and the fifth driver based on a preset processing path.

[0010] Optionally, in the processing device according to the present invention, the first fixture is a vacuum suction cup.

[0011] According to another aspect of the present invention, there is provided a method for processing a hemispherical oscillator, which is suitable for being executed by the above-mentioned device, and comprises: establishing a grinding wheel mathematical model in a grinding wheel coordinate system, and establishing a hemispherical oscillator mathematical model in a workpiece coordinate system; respectively converting the grinding wheel mathematical model and the hemispherical oscillator mathematical model into a grinding wheel conversion model and a hemispherical oscillator conversion model based on a base coordinate system; determining a rotation range of the second rotating shaft according to the grinding wheel conversion model and the hemispherical oscillator conversion model; determining a processing path of the first slide, the second slide, the sliding body, the first rotating shaft and the second rotating shaft according to the rotation range; and driving the first slide, the second slide, the sliding body, the first rotating shaft and the second rotating shaft according to the processing path so as to process the hemispherical oscillator with the grinding wheel.

[0012] Optionally, in the processing method according to the present invention, the mathematical model of the grinding wheel includes a ball head sub-model and a grinding wheel rod sub-model, and the mathematical model of the hemispherical resonator includes an inner circle rod sub-model, an inner fillet corner sub-model, an inner spherical surface sub-model, an outer spherical surface sub-model, an outer fillet corner sub-model and an outer circle rod sub-model.

[0013] Optionally, in the processing method according to the present invention, the grinding wheel mathematical model and the hemispherical oscillator mathematical model are respectively converted into a grinding wheel conversion model and a hemispherical oscillator conversion model based on a base coordinate system, including: using a first conversion mapping matrix to convert each sub-model of the grinding wheel mathematical model into a corresponding grinding wheel conversion sub-model; using a second conversion mapping matrix to convert each sub-model of the hemispherical oscillator mathematical model into a corresponding oscillator conversion sub-model.

[0014] Optionally, in the processing method according to the present invention, the rotation range of the second rotating axis is determined according to the grinding wheel conversion model and the hemispherical resonator conversion model, including: slicing along the Y-axis direction of the base coordinate system, and performing interference analysis and solving on any sub-model of the grinding wheel conversion model and each sub-model of the hemispherical resonator conversion model, so as to obtain the allowable rotation range of the second rotating axis.

[0015] Optionally, in the processing method according to the present invention, the processing paths of the first slide, the second slide, the sliding body, the first rotating shaft and the second rotating shaft are determined according to the rotation range, including: using the rotation range to solve the mathematical model of the grinding wheel and the mathematical model of the hemispherical resonator to obtain the moving path of the processing point; based on the moving path of the processing point, the processing paths of the first slide, the second slide, the sliding body, the first rotating shaft and the second rotating shaft are determined.

[0016] Optionally, in the processing method according to the present invention, the inner round rod sub-model is expressed as:

[0017]

[0018] The fillet submodel is represented as:

[0019]

[0020] The inner sphere submodel is expressed as:

[0021]

[0022] The outer sphere submodel is expressed as:

[0023]

[0024] The outer fillet submodel is expressed as:

[0025]

[0026] The outer cylindrical rod model is expressed as:

[0027]

[0028] Among them, d is the diameter of the central rod of the resonator, r is the radius of the inner and outer corners of the resonator, R is the radius of the inner sphere of the resonator, h is the wall thickness of the resonator, and L is the length from the center of the resonator to the end of the outer rod.

[0029] Optionally, in the processing method according to the present invention, the ball head sub-model is expressed as:

[0030]

[0031] The grinding wheel rod model is expressed as:

[0032]

[0033] where r s is the radius of the ball head, and l is the length of the grinding wheel rod.

[0034] Optionally, in the processing method according to the present invention, the first transformation mapping matrix is ​​expressed as:

[0035] Among them, α is the transformation inclination angle of the grinding wheel coordinate system relative to the base coordinate system, and the transformation inclination angle is the same as the preset angle of the ball-end grinding wheel oblique axis machining resonator. β is the transformation angle of the grinding wheel coordinate system relative to the base coordinate system, and the transformation angle indicates the rotation angle of the second axis.

[0036] Optionally, in the processing method according to the present invention, the second transformation mapping matrix is ​​expressed as:

[0037] Wherein, c is the X-axis translation of the oscillator coordinate system relative to the base coordinate system, and d is the Y-axis translation of the hemispherical oscillator coordinate system relative to the base coordinate system.

[0038] Optionally, in the machining method according to the present invention, the transformed grinding wheel conversion sub-model is expressed as:

[0039] in, x t ,y t 、z t They represent the coordinate values ​​of the target sub-model before transformation, x t ′、y t ′、z t ′ respectively represent the coordinate values ​​of the target sub-model after transformation.

[0040] Optionally, in the processing method according to the present invention, the transformed resonator converter model is expressed as:

[0041] in, x w ,y w 、z wThey represent the coordinate values ​​of the target sub-model before transformation, x w ′ ,y w ′ 、z w ′ They respectively represent the coordinate values ​​of the target sub-model after transformation.

[0042] According to the solution of the present invention, three-axis linkage processing is realized when the ball head grinding wheel is used to process the inner spherical surface and the outer spherical surface of the hemispherical resonator, thereby avoiding the copying of the grinding wheel contour error to the workpiece surface during processing and improving the processing accuracy.

[0043] According to the solution of the present invention, a three-axis linkage ultra-precision grinding method is provided, which can grind the inner and outer spherical surfaces of the resonator while avoiding interference, thereby improving the processing quality.

[0044] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented according to the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present invention. Moreover, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0046] Figure 1 A schematic structural diagram of a hemispherical resonator processing device 100 according to an embodiment of the present invention is shown;

[0047] Figure 2 A schematic diagram showing the contact between a ball-end grinding wheel 180 and a hemispherical resonator 200 to be processed according to an embodiment of the present invention is shown;

[0048] Figure 3 A schematic diagram showing the spatial coordinate relationship between the ball-end grinding wheel 180 and the hemispherical resonator 200 according to an embodiment of the present invention is shown;

[0049] Figure 4 A schematic flow chart of a method 200 for processing a hemispherical resonator according to an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0050] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0051] In order to solve the above problems existing in the prior art, the solution of the present invention is proposed. Figure 1 A schematic structural diagram of a hemispherical resonator processing device 100 according to an embodiment of the present invention is shown.

[0052] like Figure 1 As shown, the processing device 100 includes a base 110 , a slide 120 , a first rotating shaft 130 , a first fixture 140 , a second rotating shaft 150 , a cushion block 160 , a second fixture 170 and a ball-end grinding wheel 180 .

[0053] The base 110 includes a first slide 111 and a second slide 112. The first slide 111 and the second slide 112 are arranged in a "T" shape, and the first slide 111 and the second slide 112 can slide relative to each other. The first slide 111 slides relative to the second slide 112 along a first direction, and the second slide 112 slides relative to the first slide 111 along a second direction.

[0054] The sliding body 120 is arranged on the first slide 111 and is slidably connected to the first slide 111 and can slide along a third direction approaching or away from the second slide 112, wherein the first slide 111, the second slide 112 and the sliding body 120 are perpendicular to each other.

[0055] The first rotating shaft 130 is fixedly connected to a side wall of the sliding body 120, which is a side wall of the sliding body 120 that is perpendicular to the first slide platform 111 and close to the second slide platform 112. The first rotating shaft 130 can rotate along a fourth direction.

[0056] The first fixture 140 is arranged on the first rotating shaft 130, and is used to fix the hemispherical resonator 200 to be processed. When the first rotating shaft 130 rotates, the hemispherical resonator 200 to be processed is driven to rotate through the first fixture 140. In addition, when the sliding body 120 and the first slide table 111 slide, they can also drive the hemispherical resonator 200 to be processed to move. In some embodiments, the first fixture 140 can be a vacuum suction cup.

[0057] The second rotating shaft 150 is fixed on the second sliding body 112 and can rotate along the fifth direction.

[0058] The pad 160 is fixedly connected to the second rotating shaft 150, and a preset angle slope is arranged on its upper surface, so that the ball-end grinding wheel 180 can process the hemispherical resonator 200 to be processed at a preset angle. In this embodiment, the preset angle can be 40°.

[0059] The second fixture 170 is fixed to the sloped surface of the pad 160 to fix the ball-end grinding wheel 180 .

[0060] One side of the ball end grinding wheel 180 is fixed on the second fixture 170, and the other side extends close to the first fixture 140. When the first fixture 140 fixes the hemispherical resonator 200 to be processed, the other side of the ball end grinding wheel 180 can extend to contact the hemispherical resonator 200 to be processed, thereby processing the hemispherical resonator 200 to be processed.

[0061] like Figure 2 As shown, Figure 2 A schematic diagram of the contact between the ball-end grinding wheel 180 and the hemispherical resonator 200 to be processed according to an embodiment of the present invention is shown. It is worth noting that during the processing, it is necessary to avoid contact or interference between the ball-end grinding wheel 180 and the hemispherical resonator 200 to be processed at other positions except the processing point (i.e., the processing position of the ball-end grinding wheel 180 on the hemispherical resonator 200 to be processed). For example, if the processing point is the ball head part of the ball-end grinding wheel 180 and the inner spherical surface of the hemispherical resonator 200 to be processed, it is necessary to ensure that the grinding wheel rod of the ball-end grinding wheel 180 does not contact the hemispherical resonator 200 to be processed. Therefore, it is necessary to set the processing path of each driving part (the first slide 111, the second slide 112, the slide body 120, the first rotating shaft 130 and the second rotating shaft 150) (i.e., pre-generate the above-mentioned processing path) to ensure contact between non-processing points. Figure 2 In the figure, the X-axis corresponds to the direction of the second slide 112 , the Y-axis corresponds to the direction of the slide body 120 , and the Z-axis corresponds to the direction of the first slide 111 .

[0062] In some embodiments, the processing path of each driving part can be achieved by the following method.

[0063] Firstly, the mathematical model of the grinding wheel is established in the grinding wheel coordinate system, and the mathematical model of the hemispherical resonator is established in the workpiece coordinate system. The mathematical model of the grinding wheel includes the ball head sub-model and the grinding wheel rod sub-model, and the mathematical model of the hemispherical resonator includes the inner circle rod sub-model, the inner fillet sub-model, the inner spherical surface sub-model, the outer spherical surface sub-model, the outer fillet sub-model and the outer circle rod sub-model.

[0064] For example, the ball head sub-model can be constructed based on the position of the ball head center, and the grinding wheel rod sub-model can be constructed based on the position of the grinding wheel rod center. Similarly, the inner circle rod sub-model can be constructed based on the position of the inner circle rod center of the hemispherical resonator. The inner fillet sub-model can be constructed based on the position of the hemispherical resonator center, and so on.

[0065] Prior to this, it is necessary to drive the first slide 111, the second slide 112, the slide body 120, the first rotating shaft 130 and the second rotating shaft 150 so that the ball head grinding wheel 180 and the hemispherical resonator 200 to be processed are in the initial processing state. Figure 3 As shown, Figure 3 The schematic diagram of the spatial coordinate relationship between the ball-end grinding wheel 180 and the hemispherical resonator 200 according to an embodiment of the present invention is shown. In this state, the above-mentioned grinding wheel coordinate system, workpiece coordinate system and base coordinate system are constructed. In this embodiment, the coordinate relationship of the base coordinate is as follows: Figure 1 As shown, the X-axis is parallel to the lateral long axis of the second slide 112 , the Y-axis is parallel to the lateral long axis of the slide 120 , and the Z-axis is parallel to the lateral long axis of the first slide 111 .

[0066] In some embodiments, the ball head sub-model is represented by:

[0067]

[0068] The grinding wheel rod model is expressed as:

[0069]

[0070] where r s is the radius of the ball head, and l is the length of the grinding wheel rod.

[0071] The inner circular rod model is expressed as:

[0072]

[0073] The fillet submodel is represented as:

[0074]

[0075] The inner sphere submodel is expressed as:

[0076]

[0077] The outer sphere submodel is expressed as:

[0078]

[0079] The outer fillet submodel is expressed as:

[0080]

[0081] The outer cylindrical rod model is expressed as:

[0082]

[0083] Among them, d is the diameter of the central rod of the resonator, r is the radius of the inner and outer corners of the resonator, R is the radius of the inner sphere of the resonator, h is the wall thickness of the resonator, and L is the length from the center of the resonator to the end of the outer rod.

[0084] Subsequently, the grinding wheel mathematical model and the hemispherical oscillator mathematical model are converted into a grinding wheel conversion model and a hemispherical oscillator conversion model based on a base coordinate system, respectively.

[0085] Specifically, each sub-model of the grinding wheel mathematical model is converted into a corresponding grinding wheel conversion sub-model using the first conversion mapping matrix, and each sub-model of the hemispherical oscillator mathematical model is converted into a corresponding oscillator conversion sub-model using the second conversion mapping matrix.

[0086] Among them, the first conversion mapping matrix is ​​expressed as:

[0087]

[0088] α is the transformation inclination angle of the grinding wheel coordinate system relative to the base coordinate system, and the transformation inclination angle is the same as the preset angle of the ball-end grinding wheel oblique axis machining resonator (i.e., the slope angle of the pad 160). β is the transformation rotation angle of the grinding wheel coordinate system relative to the base coordinate system, and the transformation rotation angle indicates the rotation angle of the second rotating shaft.

[0089] The second transformation mapping matrix is ​​expressed as:

[0090]

[0091] c is the X-axis translation of the oscillator coordinate system relative to the base coordinate system, and d is the Y-axis translation of the hemispherical oscillator coordinate system relative to the base coordinate system.

[0092] The transformed grinding wheel conversion submodel is expressed as:

[0093]

[0094] in, x t ,y t 、z t They represent the coordinate values ​​of the target sub-model before transformation, x t ′ ,y t ′ 、z t ′ They respectively represent the coordinate values ​​of the target sub-model after transformation.

[0095] The transformed resonator converter model is expressed as:

[0096]

[0097] in, x w ,y w 、z w They represent the coordinate values ​​of the target sub-model before transformation, x w ′、y w ′、z w ′ respectively represent the coordinate values ​​of the target sub-model after transformation.

[0098] Afterwards, the rotation range of the second rotating shaft 150 is determined according to the grinding wheel conversion model and the hemispherical resonator conversion model.

[0099] Specifically, the slice is sliced ​​along the Y-axis direction of the base coordinate system, and the interference analysis is performed on any sub-model of the grinding wheel conversion model and each sub-model of the hemispherical resonator conversion model to obtain the rotation range allowed by the second rotating shaft. As described above, the Y-axis direction is the direction where the slide 120 is located. By making a section along the Y-axis direction, the three-dimensional space problem is converted into a two-dimensional plane problem to solve the interference angle, so as to obtain the allowable angle range of each processing stage when the inclination angle α is 40°, and then determine the starting angle during the inner spherical surface grinding stage. When the inner spherical surface is processed, the second rotating shaft 150 is rotated according to the resonator processing position point based on the starting angle, so as to realize the three-axis linkage processing of the inner spherical surface of the hemispherical resonator.

[0100] Subsequently, according to the rotation range, the processing paths of the first slide 111, the second slide 112, the slide body 120, the first rotating shaft 130 and the second rotating shaft 150 are determined. Specifically, the mathematical model of the grinding wheel and the mathematical model of the hemispherical resonator are solved by using the rotation range of the second rotating shaft 150 to obtain the moving path of the processing point. Based on the moving path of the processing point, the processing paths of the first slide 111, the second slide 112, the slide body 120, the first rotating shaft 130 and the second rotating shaft 150 are determined.

[0101] In some embodiments, the device 100 further includes a first driver, a second driver, a third driver, a fourth driver, a fifth driver and a controller. The first driver is connected to the first slide 111 to drive the first slide 111 to slide in the first direction, the second driver is connected to the second slide 112 to drive the second slide 112 to slide in the second direction, the third driver is connected to the slide 120 to drive the slide 120 to slide in the third direction, the fourth driver is connected to the first rotating shaft 130 to drive the first rotating shaft 130 to rotate along the fourth direction, and the fifth driver is connected to the second rotating shaft 150 to drive the second rotating shaft 150 to rotate along the fifth direction. The controller is connected to the first driver, the second driver, the third driver, the fourth driver and the fifth driver respectively, and is used to control the first driver, the second driver, the third driver, the fourth driver and the fifth driver to work based on a preset processing path.

[0102] Finally, according to the processing path, the first slide 111 , the second slide 112 , the slide body 120 , the first rotating shaft 130 and the second rotating shaft 150 are driven by the respective drivers so that the ball end grinding wheel 180 processes the hemispherical resonator 200 .

[0103] The device 200 provided by the present invention utilizes the first slide 111, the second slide 112, the slide body 120, the first rotating shaft 130 and the second rotating shaft 150 to realize three-axis linkage processing when the ball head grinding wheel 180 processes the inner spherical surface and the outer spherical surface of the hemispherical resonator 200, thereby avoiding copying the grinding wheel contour error to the workpiece surface during processing and improving the processing accuracy.

[0104] In addition, a three-axis linkage ultra-precision grinding method applied to the device 100 is provided, which can grind the inner and outer spherical surfaces of the resonator 200 while avoiding interference, thereby improving the processing quality.

[0105] Figure 4 FIG. 2 is a schematic flow chart of a method 200 for processing a hemispherical resonator according to an embodiment of the present invention. Figure 4 As shown, the method 200 is performed by the processing device 100 described above.

[0106] The method 200 begins at step 202 , in which a grinding wheel mathematical model is established in a grinding wheel coordinate system, and a hemispherical oscillator mathematical model is established in a workpiece coordinate system.

[0107] In step 204, the grinding wheel mathematical model and the hemispherical oscillator mathematical model are respectively converted into a grinding wheel conversion model and a hemispherical oscillator conversion model based on a base coordinate system.

[0108] In step 206, the rotation range of the second rotating shaft 150 is determined according to the grinding wheel conversion model and the hemispherical resonator conversion model.

[0109] In step 208 , the processing paths of the first slide 111 , the second slide 112 , the sliding body 120 , the first rotating shaft 130 , and the second rotating shaft 150 are determined according to the rotation range.

[0110] In step 210 , according to the processing path, the first slide 111 , the second slide 112 , the slide body 120 , the first rotating shaft 130 , and the second rotating shaft 150 are driven so that the grinding wheel 180 processes the hemispherical resonator 200 .

[0111] It should be noted that the working principle and process of the method 200 provided in this embodiment are similar to those of the above-mentioned device 100. For relevant details, reference may be made to the description of the above-mentioned device 100, which will not be repeated here.

[0112] A11. The method as described in A7, wherein the inner round rod sub-model is represented as:

[0113]

[0114] The fillet submodel is represented as:

[0115]

[0116] The inner sphere submodel is expressed as:

[0117]

[0118] The outer sphere submodel is expressed as:

[0119]

[0120] The outer fillet submodel is expressed as:

[0121]

[0122] The outer cylindrical rod model is expressed as:

[0123]

[0124] Among them, d is the diameter of the central rod of the resonator, r is the radius of the inner and outer corners of the resonator, R is the radius of the inner sphere of the resonator, h is the wall thickness of the resonator, and L is the length from the center of the resonator to the end of the outer rod.

[0125] A12. The method as described in A7, wherein the ball head sub-model is expressed as:

[0126]

[0127] The grinding wheel rod model is expressed as:

[0128]

[0129] where r s is the radius of the ball head, and l is the length of the grinding wheel rod.

[0130] A13. The method as described in A8, wherein the first conversion mapping matrix is ​​expressed as:

[0131] Among them, α is the transformation inclination angle of the grinding wheel coordinate system relative to the base coordinate system, and the transformation inclination angle is the same as the preset angle of the ball-end grinding wheel oblique axis machining resonator. β is the transformation angle of the grinding wheel coordinate system relative to the base coordinate system, and the transformation angle indicates the rotation angle of the second rotating shaft.

[0132] A14. The method as described in A13, wherein the second conversion mapping matrix is ​​expressed as:

[0133] Wherein, c is the X-axis translation of the oscillator coordinate system relative to the base coordinate system, and d is the Y-axis translation of the hemispherical oscillator coordinate system relative to the base coordinate system.

[0134] A15. The method as described in A14, wherein the transformed grinding wheel conversion sub-model is expressed as:

[0135] in, The x t ,y t 、z t They represent the coordinate values ​​of the target sub-model before transformation, x t ′ ,y t ′ 、z t ′ They respectively represent the coordinate values ​​of the target sub-model after transformation.

[0136] A16. The method as described in A14, wherein the transformed resonator converter model is expressed as:

[0137] in, The x w ,y w 、z w They represent the coordinate values ​​of the target sub-model before transformation, x w ′ ,y w ′ 、z w ′ They respectively represent the coordinate values ​​of the target sub-model after transformation.

[0138] Although the present invention has been described in terms of a limited number of embodiments, it will be apparent to those skilled in the art, having benefit of the above description, that other embodiments are contemplated within the scope of the invention thus described. Furthermore, it should be noted that the language used in this specification is selected primarily for readability and didactic purposes, rather than for the purpose of explaining or defining the subject matter of the present invention. Therefore, many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the appended claims.

Claims

1. A hemispherical resonator processing device, comprising: The base comprises a first slide and a second slide which are slidably connected, wherein the first slide slides relative to the second slide in a first direction, and the second slide slides relative to the first slide in a second direction; A sliding body is slidably connected to the first sliding platform and can slide along a third direction approaching or away from the second sliding platform, and the first sliding platform, the second sliding platform and the sliding body are perpendicular to each other; a first rotating shaft, fixedly connected to a side wall of the sliding body, and capable of rotating along a fourth direction, wherein the side wall is a side wall of the sliding body that is perpendicular to the first slide platform and close to the second slide platform; A first fixture is arranged on the first rotating shaft and is used to fix the hemispherical resonator to be processed; A second rotating shaft, fixedly connected to the second slide table, capable of rotating along a fifth direction; A second fixture is arranged on the second rotating shaft and is used to fix the ball-end grinding wheel; A ball-end grinding wheel has one side fixed on the second fixture and the other side extending close to the first fixture. When the first fixture fixes the hemispherical resonator to be processed, the other side of the ball-end grinding wheel can extend to contact the hemispherical resonator to be processed.

2. The apparatus of claim 1, further comprising: a cushion block, arranged between the second rotating shaft and the second fixture; A slope of a preset angle is arranged on one side of the cushion block close to the second fixture, so that the ball-end grinding wheel can process the hemispherical resonator to be processed at an inclined axis according to the preset angle.

3. The apparatus of claim 1, further comprising: a first driver connected to the first slide table and configured to drive the first slide table to slide in a first direction; a second driver connected to the second slide table and configured to drive the second slide table to slide in a second direction; a third driver connected to the sliding body and used to drive the sliding body to slide in a third direction; a fourth driver, connected to the first rotating shaft, and configured to drive the first rotating shaft to rotate along a fourth direction; A fifth driver is connected to the second rotating shaft, and is used to drive the second rotating shaft to rotate along a fifth direction.

4. The apparatus of claim 3, further comprising: The controller is connected to the first driver, the second driver, the third driver, the fourth driver and the fifth driver respectively, and is used to control the first driver, the second driver, the third driver, the fourth driver and the fifth driver to work based on a preset processing path.

5. The device according to claim 1, wherein: The first fixture is a vacuum suction cup.

6. A method for processing a hemispherical resonator, suitable for being performed by the device according to any one of claims 1 to 5, the method comprising: Establish a grinding wheel mathematical model in the grinding wheel coordinate system, and establish a hemispherical resonator mathematical model in the workpiece coordinate system; The grinding wheel mathematical model and the hemispherical oscillator mathematical model are respectively converted into a grinding wheel conversion model and a hemispherical oscillator conversion model based on a base coordinate system; Determining the rotation range of the second rotating shaft according to the grinding wheel conversion model and the hemispherical resonator conversion model; Determining the processing paths of the first slide, the second slide, the sliding body, the first rotating shaft and the second rotating shaft according to the rotation range; According to the processing path, the first slide, the second slide, the sliding body, the first rotating shaft and the second rotating shaft are driven so that the grinding wheel processes the hemispherical resonator.

7. The method of claim 6, wherein: The grinding wheel mathematical model includes a ball head sub-model and a grinding wheel rod sub-model, and the hemispherical resonator mathematical model includes an inner circle rod sub-model, an inner fillet corner sub-model, an inner spherical surface sub-model, an outer spherical surface sub-model, an outer fillet corner sub-model and an outer circle rod sub-model.

8. The method of claim 7, wherein: The grinding wheel mathematical model and the hemispherical resonator mathematical model are respectively converted into a grinding wheel conversion model and a hemispherical resonator conversion model based on a base coordinate system, including: Using a first conversion mapping matrix, converting each sub-model of the grinding wheel mathematical model into a corresponding grinding wheel conversion sub-model; The second conversion mapping matrix is ​​used to convert each sub-model of the hemispherical resonator mathematical model into a corresponding resonator conversion sub-model.

9. The method of claim 8, wherein: According to the grinding wheel conversion model and the hemispherical resonator conversion model, determining the rotation range of the second rotating shaft includes: Slicing is performed along the Y-axis direction of the base coordinate system, and interference analysis is performed on any sub-model of the grinding wheel conversion model and each sub-model of the hemispherical resonator conversion model to obtain the allowable rotation range of the second rotation axis.

10. The method of claim 9, wherein: According to the rotation range, determining the processing paths of the first slide, the second slide, the slide body, the first rotating shaft and the second rotating shaft includes: Using the rotation range, the grinding wheel mathematical model and the hemispherical resonator mathematical model are solved to obtain a moving path of the processing point; Based on the moving path of the processing point, the processing paths of the first slide, the second slide, the sliding body, the first rotating shaft and the second rotating shaft are determined.

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