Cooling structure of liquid cooling charging gun

Abstract

The invention discloses a cooling structure of a liquid cooling charging gun, which comprises a pair of charging terminals and a cooling water tank, and the charging terminals are respectively arranged on the left side and the right side of the cooling water tank. According to the invention, the P-type semiconductor and the N-type semiconductor are directly packaged in the cooling water tank, so that contact parts can be reduced, and the charging terminal can be directly cooled; compared with an existing cooling structure method, active refrigeration can be achieved, and the cold face can reach 0 DEG C or below, so that heat of cooling liquid is taken away, and the temperature is lower than the environment temperature.

Description

Technical Field

[0001] The present invention belongs to the technical field of charging gun cooling, and in particular relates to a liquid-cooled charging gun cooling structure. Background Art

[0002] With the development of new energy charging technology, the demand for fast charging is getting higher and higher, and the charging current is getting larger and larger. During high-power charging, a large amount of heat will be generated at the contact point between the charging gun and the charging seat. The high temperature generated by continuous charging will trigger the over-temperature protection and interrupt the charging. Therefore, temperature control is very important during high-power charging, and effective cooling measures need to be taken. The cooling structure methods of existing charging guns are unable to perform active cooling, and most of them use fans to take away the heat of the coolant, which usually cannot be lower than the ambient temperature, resulting in the cooling effect of the charging gun is not significant. Therefore, in view of the above problems, the cooling structure of a liquid-cooled charging gun provided by the present invention is of great significance. Summary of the invention

[0003] The present invention provides a liquid-cooled charging gun cooling structure, which can reduce contact parts and directly cool the charging terminals by directly encapsulating P-type semiconductors and N-type semiconductors in a cooling water tank. Compared with the existing cooling structure method, active cooling can be achieved, and the cold surface can reach 0°C or below, thereby taking away the heat of the coolant and making it lower than the ambient temperature. In summary, the problems in the background technology are solved.

[0004] In order to solve the above technical problems, the present invention is achieved through the following technical solutions:

[0005] A liquid-cooled charging gun cooling structure of the present invention comprises a pair of charging terminals and a cooling water tank, wherein the charging terminals are respectively installed on the left and right sides of the cooling water tank.

[0006] Furthermore, the front end of the charging terminal is cylindrical, and the rear end thereof is flat.

[0007] Furthermore, the cooling water tank is assembled from a left cooling water tank and a right cooling water tank, and the left cooling water tank and the right cooling water tank are both composed of a water inlet, a wire, a packaged semiconductor, and a water outlet.

[0008] Furthermore, the packaged semiconductors in the left cooling water tank and the right cooling water tank are P-type semiconductors and N-type semiconductors, respectively; the cooling surfaces of the P-type semiconductors and the N-type semiconductors are close to one end of the charging terminal, and the heating surfaces thereof are in contact with the coolant in the left cooling water tank and the right cooling water tank, respectively.

[0009] Compared with the prior art, the present invention has the following beneficial effects:

[0010] (1) When in use, the liquid-cooled charging gun cooling structure of the present invention can reduce the contact parts by directly encapsulating the P-type semiconductor and the N-type semiconductor in the cooling water tank, and directly cool the charging terminal;

[0011] (2) When in use, the liquid-cooled charging gun cooling structure of the present invention can achieve active cooling compared to the existing cooling structure method, and the cold surface can reach 0°C or below, thereby taking away the heat of the coolant and making it lower than the ambient temperature.

[0012] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0014] Figure 1 It is a structural schematic diagram of a liquid-cooled charging gun cooling structure of the present invention;

[0015] Figure 2 It is a structural schematic diagram of the left cooling water tank in the present invention;

[0016] Figure 3 It is a structural schematic diagram of the right cooling water tank in the present invention.

[0017] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0018] 1. Charging terminal; 2. Cooling water tank; 201. Water inlet; 202. Wire; 203. Packaged semiconductor; 204. Water outlet. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] In the description of the present invention, it should be understood that the terms "relative", "one end", "inside", "lateral", "end", "two ends", "both sides", "front", "one end face", "the other end face" and the like indicating orientation or positional relationship are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0021] Embodiment 1:

[0022] See also Figure 1-3 As shown, a liquid-cooled charging gun cooling structure of the present invention includes a pair of charging terminals 1 and a cooling water tank 2. The charging terminals 1 are respectively installed on the left and right sides of the cooling water tank 2. The charging terminals 1 and the cooling water tank 2 can be bonded or fixed by other means.

[0023] The front end of the charging terminal 1 is cylindrical, and the rear end is flat. The cylindrical front end of the charging terminal 1 is plugged into the charging socket, and the flat rear end is ultrasonically welded to the wire 202.

[0024] Among them, the cooling water tank 2 is assembled from a left cooling water tank and a right cooling water tank. Both the left cooling water tank and the right cooling water tank are composed of a water inlet 201, a wire 202, a packaged semiconductor 203, and a water outlet 204. The left cooling water tank and the right cooling water tank are provided with a circuit for the circulation of coolant. When the two are combined together, an inlet and outlet circuit for the flow of coolant will be formed.

[0025] Among them, the packaged semiconductors 203 in the left cooling water tank and the right cooling water tank are P-type semiconductors and N-type semiconductors respectively. The cooling surfaces of the P-type semiconductor and the N-type semiconductor are close to one end of the charging terminal 1, and their heating surfaces are in contact with the coolant in the left cooling water tank and the right cooling water tank respectively. When the charging gun is charging, the P / N-type semiconductors packaged in the left cooling water tank and the right cooling water tank will produce a Peltier effect. By controlling the wiring method of the wire 202, the bonding surface of the charging terminal 1 is cooled, and the heating surface is directly in contact with the coolant, and the heat is taken away by the circulating coolant, thereby dissipating heat and cooling down.

[0026] Embodiment 2:

[0027] The cooling water tank 2 in the embodiment 1 may be assembled from a left cooling water tank and a right cooling water tank according to different molding processes, or may be integrally molded or composed of upper and lower parts.

[0028] The circuits, electronic components and chip modules involved in the present invention are all prior art and can be fully implemented by those skilled in the art. Needless to say, the content protected by the present invention does not involve improvements to software and methods.

[0029] The standard parts used in the application documents can all be purchased from the market. All the components in this application document can be customized according to the description in the specification and drawings. The specific connection methods of each part adopt mature conventional means such as bolts, rivets, welding, etc. in the prior art. Machinery, parts and equipment all adopt conventional models in the prior art. The electrical components appearing in this article are all electrically connected to the external main controller and 220V AC power, and the main controller is a conventional known device that can play a control role.

[0030] The working principle of the present invention is:

[0031] When the present invention is in use, the charging terminal 1 is directly fitted with the cooling water tank 2 to reduce the temperature rise during charging. This is mainly achieved by directly encapsulating P-type semiconductors and N-type semiconductors inside the left cooling water tank and the right cooling water tank, and then assembling the left cooling water tank and the right cooling water tank together for use. The left and right cooling water tanks are provided with a circuit for the circulation of coolant. When the two are combined together, an inlet and outlet circuit for the flow of coolant is formed. When the charging gun is charging, the P / N-type semiconductors encapsulated in the left and right cooling water tanks will produce a Peltier effect. By controlling the wiring method of the wire 202, the fitting surface of the charging terminal is cooled, and the heating surface is directly in contact with the coolant, and the heat is taken away by the circulating coolant to dissipate heat and cool down.

[0032] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A liquid-cooled charging gun cooling structure, characterized in that: It includes a pair of charging terminals and a cooling water tank, wherein the charging terminals are respectively installed on the left and right sides of the cooling water tank.

2. A liquid-cooled charging gun cooling structure according to claim 1, characterized in that: The front end of the charging terminal is cylindrical, and the rear end is flat.

3. The liquid-cooled charging gun cooling structure according to claim 1, characterized in that: The cooling water tank is assembled from a left cooling water tank and a right cooling water tank, and the left cooling water tank and the right cooling water tank are both composed of a water inlet, a wire, a packaged semiconductor, and a water outlet.

4. A liquid-cooled charging gun cooling structure according to claim 3, characterized in that: The packaged semiconductors in the left cooling water tank and the right cooling water tank are respectively a P-type semiconductor and an N-type semiconductor, the cooling surfaces of the P-type semiconductor and the N-type semiconductor are close to one end of the charging terminal, and the heating surfaces thereof are in contact with the coolant in the left cooling water tank and the right cooling water tank respectively.

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