High-efficiency radio frequency light emitting assembly packaging structure

Abstract

The invention relates to the technical field of radio frequency optical transmission assembly packaging, in particular to an efficient radio frequency optical transmission assembly packaging structure which comprises a temperature control coaxial laser, a packaging shell, a microwave processing unit and a driving control unit. The packaging shell comprises an outer shell, a radio frequency input port, a middle cover plate, an upper cover plate, a lower cover plate, a coupling wiring terminal and a through-wall connecting terminal, the microwave circuit, the control driving circuit, the gold wire bonding process and the shell structure design of the efficient radio frequency light emitting assembly packaging structure are all designed and simulated by utilizing simulation software such as ADS / HFSS / MATLAB / CAXA; finally, efficient packaging of a multifunctional radio frequency light emitting assembly which integrates electricity / light conversion, automatic laser light power control (APC), automatic temperature control (ATC), radio frequency signal processing and the like within 18GHz can be realized.

Description

Technical Field

[0001] The present invention relates to the technical field of radio frequency optical transmission component packaging, and in particular to a high-efficiency radio frequency optical transmitting component packaging structure. Background Art

[0002] In recent years, miniaturized RF optoelectronic components have been widely used in satellite communications, electronic countermeasures, electromagnetic spectrum perception and monitoring, and other scenarios for long-distance transmission of RF signals. Since these application scenarios have rigid requirements such as miniaturization, low power consumption, high reliability, and high environmental adaptability, they place high requirements on the integrated packaging of RF optoelectronic components. The RF optical transmission link is mainly composed of an optical transmitting component and an optical receiving component connected to the interconnected optical fiber to form a transmission path. In miniaturized application scenarios, since the packaging structure of the optical receiving microcomponent is relatively simple, the present invention does not make a major description. At present, such miniaturized RF optoelectronic optical transmitting components generally use RF optoelectronic hybrid integration technology based on BOX optoelectronic microassembly process to package optical (electrical) bare chips, optical components, and circuit boards in a separate shell to form an airtight structure. However, this packaging structure has the following shortcomings: 1. The optical path design is not standardized to a high degree and requires special design based on optical components or structural layout; 2. The optical path assembly has high precision, great difficulty, and low efficiency; 3. The optical path cannot be fully automatically packaged, and the yield and consistency are relatively low; 4. The optical path packaging part is difficult to repair; 5. Components of different sizes require customized special fixtures, which have a long cycle and high cost.

[0003] Coaxial optical devices are a type of device package widely used in high-speed digital optical transmission. They have the advantages of high standardization, mature technology, large batch production capacity, fully automatic packaging, good reliability, good consistency, low cost, and high degree of industrialization. In recent years, due to the increase in civilian dense wavelength division multiplexing (DWDM) optical transmission applications and the large-scale promotion of ROF in 5G base station signal transmission and all-optical WIFI, the integration of industrial-grade temperature-controlled coaxial lasers has also been rapidly improved. At present, COC containing optical chips, semiconductor refrigerators (TEC), miniaturized lenses, optical isolators and other tiny optoelectronic components can be integrated in the TO56 laser package. The integration and key optoelectronic technical indicators are comparable to those of laser packages based on BOX optoelectronic micro-assembly processes, and they also have airtightness. Due to the obvious advantages of coaxial optical devices such as large volume and mature industrial support, high-performance and high-environmental adaptability devices screened through large samples have the possibility of being on the application platform with high reliability requirements, and the cost-effectiveness and packaging efficiency are extremely high.

[0004] However, the temperature-controlled coaxial laser also has some shortcomings, such as poor heat dissipation performance and difficulty in integrated hermetic packaging with microwave bare chip circuits, which need to be overcome in the design. Summary of the invention

[0005] The purpose of the present invention is to make up for the shortcomings of packaging technology based on BOX optoelectronic micro-assembly process, combine the industrial advantages of temperature-controlled coaxial lasers, and provide a high-efficiency radio frequency optical transmission component packaging structure, which realizes high-density integration of temperature-controlled coaxial lasers, drive control units, and microwave processing units in a small shell, and at the same time realizes three-dimensional enhanced heat dissipation of the temperature-controlled coaxial laser and integrated hermetic packaging of microcomponents.

[0006] To achieve the above-mentioned purpose, the present invention provides a high-efficiency RF optical transmission component packaging structure, including a temperature-controlled coaxial laser, a packaging shell, a microwave processing unit and a drive control unit; the packaging shell includes a shell, a RF input port, a middle cover plate, an upper cover plate, a lower cover plate, a coupling terminal and a through-wall connection terminal, the shell has a temperature-controlled coaxial laser mounting cavity, a microwave processing unit mounting cavity, a power access cavity and a drive control unit mounting cavity, the RF input port is connected to the shell and is located on one side of the shell, the middle cover plate is embedded in the upper part of the microwave processing unit mounting cavity, the upper cover plate is connected to the shell and is located at the top of the shell, the lower cover plate is connected to the shell and is located at the bottom of the shell, the coupling terminal is connected to the shell and is arranged on the shell, and the through-wall connection terminal is connected to the shell and is arranged on the shell;

[0007] The temperature-controlled coaxial laser is connected to the shell and is located inside the temperature-controlled coaxial laser installation cavity. The microwave processing unit is connected to the shell and is located inside the microwave processing unit installation cavity. The drive control unit is connected to the shell and is located inside the drive control unit installation cavity.

[0008] The LD-pin of the temperature-controlled coaxial laser meets 50Ω impedance matching; and a conical inductor is selected as the internal bias inductor.

[0009] Among them, the LD-pin of the temperature-controlled coaxial laser is a radio frequency input pin, which maintains a distance greater than 1.5 mm from other pins in the pin package layout, and the LD-pin is connected to the microwave processing unit; the CASE pin of the temperature-controlled coaxial laser is welded on the kovar interlayer between the microwave processing unit mounting cavity and the drive control unit mounting cavity, and the other pins of the temperature-controlled coaxial laser are connected to the corresponding pin pads of the drive control unit.

[0010] Among them, the temperature-controlled coaxial laser installation cavity is made of tungsten-copper material, the other structural parts of the shell are made of Kovar alloy material, and the surface of the shell is gold-plated; the RF input port, the coupling terminal and the through-wall connection terminal form an integrated structure with the shell by sintering or brazing.

[0011] The temperature-controlled coaxial laser installation cavity is divided into two compartments in the length direction, namely an outer cavity and an inner cavity, the outer cavity is close to the output light interface, and the inner cavity is close to the laser tube socket electrical interface; the temperature-controlled coaxial laser installation cavity has a through hole in the middle that passes through the entire tungsten copper frame, and the through hole size is the outer diameter of the temperature-controlled coaxial laser Φ d +0.1mm.

[0012] The outer cavity is a sealed cavity filled with epoxy structural adhesive; the inner cavity is a heat-conducting cavity filled with heat-conducting mud with high thermal conductivity.

[0013] The middle cover is embedded in the upper part of the microwave processing unit installation cavity and is fixed on the middle cover installation threaded hole boss of the microwave processing unit installation cavity by screws.

[0014] The invention discloses an efficient radio frequency optical transmitting component packaging structure, in which the microwave circuit, the control drive circuit, the gold wire bonding process and the shell structure design are all designed and simulated by using simulation software such as ADS / HFSS / MATLAB / CAXA, and ultimately can realize the efficient packaging of a multifunctional radio frequency optical transmitting component integrating electrical / optical conversion within 18 GHz, automatic optical power control (APC) of the laser, automatic temperature control (ATC) and radio frequency signal processing; and overcomes the key technical problems such as the frame-type three-dimensional heat dissipation and airtightness enhancement of the optical transmitting component of the temperature-controlled coaxial laser. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art are briefly introduced below.

[0016] Figure 1 It is a schematic diagram of the packaging structure of the high-efficiency radio frequency optical transmitting component of the present invention.

[0017] Figure 2 Schematic diagram of a typical pin arrangement of the present invention.

[0018] Figure 3 It is a schematic cross-sectional diagram of the temperature-controlled coaxial laser assembly of the present invention.

[0019] Figure 4 It is a schematic diagram of the implementation of the driving control unit of the present invention.

[0020] Figure 5 It is a schematic diagram of the installation structure of the drive control unit of the present invention.

[0021] In the figure: 1-temperature-controlled coaxial laser, 2-packaging shell, 3-microwave processing unit, 4-drive control unit, 5-housing, 6-RF input port, 7-middle cover, 8-upper cover, 9-lower cover, 10-coupling terminal, 11-through-wall connection terminal, 12-temperature-controlled coaxial laser installation cavity, 13-microwave processing unit installation cavity, 14-power access cavity, 15-drive control unit installation cavity, 16-external cavity, 17-inner cavity, 18-cavity calcifiable interlayer, 19-laser drive control interface, 20-microwave processing unit power supply control interface, 21-external power supply / communication introduction interface, 22-high-frequency ceramic circuit board, 23-input interface microstrip, 24-output interface microstrip, 25-first positioning groove, 26-second positioning groove, 27-third positioning groove. DETAILED DESCRIPTION

[0022] Embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, but should not be construed as limiting the present invention.

[0023] See also Figures 1 to 5 ,in Figure 1 This is a schematic diagram of the packaging structure of the invented high-efficiency radio frequency optical transmitting component. Figure 2 This is a typical pin layout diagram of the invention. Figure 3 is a schematic cross-sectional view of the temperature-controlled coaxial laser assembly of the present invention, Figure 4 is a schematic diagram of the implementation of the drive control unit of the present invention, Figure 5 It is a schematic diagram of the installation structure of the drive control unit of the present invention.

[0024] The present invention provides a high-efficiency radio frequency optical transmission component packaging structure, comprising a temperature-controlled coaxial laser 1, a packaging shell 2, a microwave processing unit 3 and a drive control unit 4, wherein the packaging shell 2 comprises an outer shell 5, a radio frequency input port 6, a middle cover plate 7, an upper cover plate 8, a lower cover plate 9, a coupling terminal 10 and a through-wall connection terminal 11, and the outer shell 5 has a temperature-controlled coaxial laser mounting cavity 12, a microwave processing unit mounting cavity 13, a power supply access cavity 14 and a drive control unit mounting cavity 15.

[0025] According to this specific embodiment, the packaging shell 2 includes a shell 5, a radio frequency input port 6, a middle cover plate 7, an upper cover plate 8, a lower cover plate 9, a coupling terminal 10 and a through-wall connection terminal 11, the radio frequency input port 6 is connected to the shell 5 and is located on one side of the shell 5, the middle cover plate 7 is embedded in the upper part of the microwave processing unit installation cavity 13, the upper cover plate 8 is connected to the shell 5 and is located at the top of the shell 5, the lower cover plate 9 is connected to the shell 5 and is located at the bottom of the shell 5, the coupling terminal 10 is connected to the shell 5 and is arranged on the shell 5, and the through-wall connection terminal 11 is connected to the shell 5 and is arranged on the shell 5; the temperature-controlled coaxial laser 1 is connected to the shell 5 and is located inside the temperature-controlled coaxial laser installation cavity 12, the microwave processing unit 3 is connected to the shell 5 and is located inside the microwave processing unit installation cavity 13, and the drive control unit 4 is connected to the shell 5 and is located inside the drive control unit installation cavity 15.

[0026] The temperature-controlled coaxial laser 1 integrates a TO tube socket, a tube cap (including an aspherical lens), a COC (loaded with a laser chip, a backlight detector chip, a bias inductor), a thermistor, a high-efficiency semiconductor cooler (TEC), an optical isolator, a pigtail and other optoelectronic components, and can realize the input and electrical / optical conversion of broadband RF signals, the temperature control of the laser chip, and the output of optical power through the pigtail.

[0027] Furthermore, the bias inductor should use a conical inductor as the bias inductor of the laser chip in a broadband and high-frequency optical transmission component.

[0028] Furthermore, the housing of the temperature-controlled coaxial laser 1 must be equipped with a stainless steel metal jacket to enhance its structural strength and provide better anti-vibration and anti-impact performance.

[0029] Furthermore, the selection of the temperature-controlled coaxial laser 1 should be determined according to the technical requirements for use, including the type of socket electrical interface, operating temperature, operating bandwidth, wavelength, electro-optical conversion slope efficiency, maximum optical output power, in-band flatness, noise coefficient, optical interface type and other technical parameters. In this embodiment, a temperature-controlled coaxial laser with an integrated wavelength of 1310nm and a 25G rate DFB optical chip, an electro-optical conversion slope efficiency greater than 0.2W / A after packaging, and a maximum optical output power greater than 10mW is selected as the electro-optical conversion device;

[0030] Furthermore, the temperature-controlled coaxial laser 1 needs to include the following pins, the physical and typical pin layout diagrams of which are shown in the attached figure. Figure 2 As shown, the present invention selects one of them as an embodiment.

[0031]

[0032] Furthermore, the LD-pin of the temperature-controlled coaxial laser 1 is a radio frequency input pin, and the distance from other pins should be greater than 1.5 mm in the pin package layout. The LD-pin needs to be shaped and placed for welding (bonding) on ​​the microwave processing unit 3 during assembly, and the CASE pin needs to be directly welded on the cavity varable interlayer 18 between the microwave processing unit mounting cavity 13 and the drive control unit mounting cavity 15. The other pins need to be shaped and placed for welding on the corresponding pin pads of the drive control unit 4 during assembly. The assembly cross-sectional view of the temperature-controlled coaxial laser 1 is shown in FIG. Figure 3 shown.

[0033] Among them, the size of the shell 5 varies according to the index parameters and the complexity of the functions, but the specific packaging structure remains unchanged; the coupling terminal 10 refers to the terminal for connecting the external power supply / communication signal of the component, which is fixed on the four sides of the shell 5; the through-wall connection terminal 11 is the terminal for connecting the upper and lower power supplies and control drive signals of the component, and is fixed on the internal cavity compartment of the component.

[0034] Furthermore, the RF input port 6 can be a universal or special RF interface such as SMA, SMP, SMPM, or a wool button, and is fixed to the housing 5 by sintering a signal pin, fixing a connector with external screws, or welding the entire connector.

[0035] Furthermore, the temperature-controlled coaxial laser mounting cavity 12 is designed as a tungsten-copper alloy frame structure to improve the heat dissipation performance and airtightness performance of the temperature-controlled coaxial laser 1; the depth direction penetrates the upper and lower parts of the outer shell 5, the upper top surface is flush with the upper cover plate 8, and the lower bottom surface is flush with the bottom surface of the outer shell 5; the length direction dimension is the same as the stainless steel casing outside the temperature-controlled coaxial laser 1, and the width direction dimension is the outer diameter Φd+1mm of the temperature-controlled coaxial laser 1.

[0036] Furthermore, the temperature-controlled coaxial laser installation cavity 12 is divided into two compartments in the length direction, namely an outer cavity 16 and an inner cavity 17, wherein the outer cavity 16 is close to the output optical interface and the inner cavity 17 is close to the laser tube socket electrical interface; a through hole is punched in the middle of the temperature-controlled coaxial laser installation cavity 12 to pass through the entire tungsten copper frame, and the through hole size is the outer diameter Φ of the temperature-controlled coaxial laser 1 d +0.1mm.

[0037] Furthermore, the outer cavity 16 is designed as a sealed cavity and needs to be filled with epoxy structural glue. This type of glue has a low shrinkage rate and excellent sealing and waterproof performance; the inner cavity 17 is designed as a heat-conducting cavity and needs to be filled with thermal conductive mud with high thermal conductivity to enhance the thermal conductivity of the entire frame; the timing of the operation of potting glue and filling thermal conductive mud is after the components have completed debugging and testing.

[0038] Furthermore, the microwave processing unit mounting cavity 13 is used to install the microwave processing unit 3, and is a back-to-back structure with the drive control unit mounting cavity 15, separated by a cavity resistant partition 18 in the middle. The microwave processing unit 3 is connected to the drive control unit 4 through the through-wall connection terminal 11 that passes through the cavity resistant partition 18. The bottom of the cavity is flat and has no bosses. The microwave processing unit 3 is bonded to the bottom of the cavity by conductive glue to ensure that the bottom ground surface of the high-frequency circuit board of the microwave processing unit 3 is in good contact with the bottom of the cavity; the upper part of the microwave processing unit mounting cavity 13 is provided with a middle cover plate 7 mounting threaded hole position for installing the middle cover plate 7.

[0039] Furthermore, the coupling terminal 10 outside the housing 5 is connected to the through-wall connection terminal 11 inside the power access cavity 14, and the connection method is gold wire bonding or flexible flat cable soldering.

[0040] Furthermore, the drive control unit mounting cavity 15 is used to install the drive control unit 4. A mounting grounding boss or a screw mounting hole is set in the drive control unit mounting cavity 15. The drive control unit 4 is bonded with a gold-plated grounding pad around the bottom surface of the drive control unit 4 circuit board to the grounding boss by conductive glue or assembled to the screw mounting hole at the bottom of the cavity with tiny screws; a height of 1 mm is reserved on the upper part of the drive control unit 4 for installing the lower cover plate 9.

[0041] Furthermore, the middle cover plate 7 is embedded in the upper part of the microwave processing unit installation cavity 13 and fixed to the middle cover plate 7 installation threaded hole boss of the microwave processing unit installation cavity 13 by screws. The function of the middle cover plate 7 is to provide a layer of physical protection when the upper cover plate 8 is not parallel seam welded, so as to protect the micro-assembled bare chip on the microwave processing unit 3 from being damaged by foreign matter due to short-time exposure to the air during the debugging process;

[0042] Furthermore, the lower cover plate 9 is embedded in the bottom of the drive control unit installation cavity 15 , and after debugging is completed, the lower cover plate 9 and the housing 5 are sealed as a whole by laser sealing, thereby completing the airtight packaging of the drive control unit 4 .

[0043] Furthermore, the upper cover plate 8 is welded by a parallel seam welding process, and the lower cover plate 9 is welded by a laser sealing process to achieve airtightness of each cavity of the housing 5 .

[0044] Furthermore, the coupling terminal 10 is fixed to the side of the housing 5 by sintering, brazing, etc., mainly to complete the physical connection between the housing power supply, data, and radio frequency signals and the cables connected outside the housing;

[0045] The microwave processing unit 3 realizes microwave functions from inputting RF signals into the RF interface to outputting them to the laser, including but not limited to microwave functions such as amplification, coupled detection, filtering, limiting, switching, and digitally controlled attenuation.

[0046] Furthermore, the microwave processing unit 3 includes a high-frequency ceramic circuit board 22 and a microwave functional bare chip. The high-frequency ceramic circuit board 22 includes an input interface microstrip 23, an output interface microstrip 24 and input and output pins connected to the microwave functional bare chip. Some U-shaped grooves (three are shown in the figure, namely the first positioning groove 25, the second positioning groove 26 and the third positioning groove 27) are reserved on the high-frequency ceramic circuit board 22 to position the microwave functional bare chip.

[0047] Furthermore, the high-frequency ceramic circuit board 22 is bonded to the bottom of the microwave processing unit mounting cavity 13 by conductive glue, the input interface microstrip 23 is bonded or welded to the RF interface coupling connection terminal by conductive glue, the output interface microstrip 24 is bonded or welded to the laser LD-pin by conductive glue, the microwave functional bare chip can be bonded to the bottom of the mounting cavity directly or through a molybdenum copper carrier using conductive glue, and the bare chip input / output pins on the high-frequency ceramic board are connected by gold wire bonding. The power supply and control of the high-frequency ceramic circuit board 22 are implemented by connecting the through-wall connection terminal 11 by gold wire bonding. The specific implementation diagram is shown in Figure 4 shown.

[0048] Furthermore, in order to ensure high frequency performance, the gold wire bonding adopts the wedge bonding process.

[0049] The driving control unit 4 mainly realizes the introduction of external power supply / communication, the conversion of internal power supply voltage of the component, the laser bias drive and TEC temperature control, the power supply and control of the microwave processing unit 3, the reporting of internal status information of the component and the access of external communication control information.

[0050] Furthermore, the drive control unit 4 mainly includes a drive control circuit board and on-board circuits and devices. The main interfaces include an external power supply / communication introduction interface 21, a laser drive control interface 19, and a microwave processing unit power supply control interface 20. The external power supply / communication introduction interface 21 is a through-wall connection terminal 11 for connecting the power supply to the cavity 14.

[0051] Furthermore, the on-board circuit and devices include a power supply voltage stabilization conversion circuit, a laser bias drive circuit, a TEC temperature control circuit, and an external communication and control circuit; the power supply voltage stabilization conversion circuit realizes the conversion of the external input voltage to the voltage required by the internal power supply and the filtering and decoupling processing. In this embodiment, the external power supply input is +5V, and the internal power supply requirements are +5V, -5V, and +3.3V. The voltage conversion is realized by the LDO chip; the laser bias drive circuit realizes the low-noise current bias and stable optical power output of the temperature-controlled coaxial laser 1; the TEC temperature control circuit cooperates with the temperature-controlled coaxial laser 1 to realize the ultra-wide operating temperature range (-55°C to +70°C) of the component. The DFB laser chip always works at the set working temperature T0±0.1°C, so as to achieve stable output of the laser wavelength; the external communication and control circuit is connected to the laser bias drive circuit and the TEC temperature control circuit through the single-chip microcomputer to adjust the optical power and optical wavelength output of the component, and is connected to the microwave processing unit power supply control interface 20 to realize the control of the microwave chip; the single-chip microcomputer is connected to the external power supply / communication introduction interface 21 to report the component working status such as output optical power, optical wavelength, gain setting value, switch status and other reporting status information, and receive external input control information such as output optical power, optical wavelength, gain setting value, switch status and other control information of the component.

[0052] Furthermore, the external power supply / communication introduction interface 21 connects the power supply access cavity 14 and the through-wall connection terminal 11 of the drive control unit installation cavity 15, and the microwave processing unit power supply control interface 20 connects the microwave processing unit installation cavity 13 and the through-wall connection terminal 11 of the drive control unit installation cavity 15. The external power supply / communication introduction interface 21 and the microwave processing unit power supply control interface 20 on the drive control circuit board are designed to have a structure corresponding to the position of the corresponding through-wall connection terminal 11, and a soldering pad is provided, which is directly welded and installed with the corresponding through-wall connection terminal 11.

[0053] Furthermore, the laser drive control interface 19 is designed as a pad package and is directly welded to the corresponding pin of the temperature-controlled coaxial laser.

[0054] The microwave circuit, control drive circuit, gold wire bonding process, and shell 5 structure design of the high-efficiency RF optical transmission component packaging structure of the present invention are all designed and simulated using simulation software such as ADS / HFSS / MATLAB / CAXA, which can ultimately achieve high-efficiency packaging of a multifunctional RF optical transmission component that integrates electrical / optical conversion within 18GHz, automatic optical power control (APC) of the laser, automatic temperature control (ATC), and RF signal processing; and overcome key technical difficulties such as frame-type three-dimensional heat dissipation and enhanced airtightness of the optical transmission component of the temperature-controlled coaxial laser 1.

[0055] The present invention has the following advantages:

[0056] 1. High packaging efficiency: Using highly standardized and mature temperature-controlled coaxial devices to replace inefficient on-site BOX laser packaging can greatly improve packaging efficiency;

[0057] 2. Good consistency: Based on the screening of a large number of temperature-controlled coaxial components, components with good consistency can be selected for later assembly, which can effectively ensure the consistency of component performance;

[0058] 3. Good reliability: The coaxial temperature control device technology based on large-scale automated and industrialized production is mature and stable, which helps to ensure the long-term reliability of the components.

[0059] 4. Low cost: Temperature-controlled coaxial devices have low cost and high yield rate, which can effectively reduce component packaging costs.

[0060] 5. Good maintainability: Through the rapid disassembly and replacement of the temperature-controlled coaxial laser 1, the rapid optical path packaging maintenance of the components can be achieved.

[0061] 6. Simple integration process: Based on simple SMT mounting and micro-assembly process, component packaging can be completed without the need for optical coupling packaging process equipment, greatly reducing the entry threshold.

[0062] What is disclosed above is only one or more preferred embodiments of the present application, and cannot be used to limit the scope of rights of the present application. Ordinary technicians in this field can understand that all or part of the processes of implementing the above embodiments and equivalent changes made according to the claims of the present application are still within the scope covered by the present application.

Claims

1. A high-efficiency radio frequency optical transmission component packaging structure, characterized in that: It includes a temperature-controlled coaxial laser, a packaging shell, a microwave processing unit and a drive control unit; The packaging shell includes a shell, a radio frequency input port, a middle cover plate, an upper cover plate, a lower cover plate, a coupling terminal and a through-wall connection terminal. The shell has a temperature-controlled coaxial laser mounting cavity, a microwave processing unit mounting cavity, a power supply access cavity and a drive control unit mounting cavity. The radio frequency input port is connected to the shell and is located on one side of the shell. The middle cover plate is embedded in the upper part of the microwave processing unit mounting cavity. The upper cover plate is connected to the shell and is located at the top of the shell. The lower cover plate is connected to the shell and is located at the bottom of the shell. The coupling terminal is connected to the shell and is arranged on the shell. The through-wall connection terminal is connected to the shell and is arranged on the shell. The temperature-controlled coaxial laser is connected to the shell and is located inside the temperature-controlled coaxial laser installation cavity. The microwave processing unit is connected to the shell and is located inside the microwave processing unit installation cavity. The drive control unit is connected to the shell and is located inside the drive control unit installation cavity.

2. The high-efficiency radio frequency optical transmitting component packaging structure as claimed in claim 1, characterized in that: The LD-pin of the temperature-controlled coaxial laser meets 50Ω impedance matching; the internal bias inductor uses a conical inductor.

3. The high-efficiency radio frequency optical transmitting component packaging structure as claimed in claim 2, characterized in that: The LD-pin of the temperature-controlled coaxial laser is a radio frequency input pin, and maintains a distance of more than 1.5 mm from other pins in the pin package layout, and the LD-pin is connected to the microwave processing unit; the CASE pin of the temperature-controlled coaxial laser is welded on the kovar interlayer between the microwave processing unit mounting cavity and the drive control unit mounting cavity, and the other pins of the temperature-controlled coaxial laser are connected to the corresponding pin pads of the drive control unit.

4. The high-efficiency radio frequency optical transmitting component packaging structure as claimed in claim 3, characterized in that: The temperature-controlled coaxial laser installation cavity is made of tungsten copper, the other structural parts of the shell are made of Kovar alloy, and the surface of the shell is gold-plated; the RF input port, the coupling terminal and the through-wall connection terminal are sintered or brazed to form an integrated structure with the shell.

5. The high-efficiency radio frequency optical transmitting component packaging structure as claimed in claim 4, characterized in that: The temperature-controlled coaxial laser installation cavity is divided into two compartments in the length direction, namely an outer cavity and an inner cavity, wherein the outer cavity is close to the output light interface, and the inner cavity is close to the laser tube socket electrical interface; a through hole is punched in the middle of the temperature-controlled coaxial laser installation cavity to pass through the entire tungsten copper frame, and the through hole size is the outer diameter Φ of the temperature-controlled coaxial laser d +0.1mm.

6. The high-efficiency radio frequency optical transmitting component packaging structure as claimed in claim 5, characterized in that: The outer cavity is a sealed cavity filled with epoxy structural adhesive; the inner cavity is a heat-conducting cavity filled with heat-conducting mud with high thermal conductivity.

7. The high-efficiency radio frequency optical transmitting component packaging structure as claimed in claim 6, characterized in that: The middle cover plate is embedded in the upper part of the microwave processing unit installation cavity and is fixed on the middle cover plate installation threaded hole boss of the microwave processing unit installation cavity by screws.

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