A photoresist coating detection device for wafer production

Abstract

The present invention provides a photoresist coating detection device for wafer production, which relates to the technical field of coating detection. It includes a suction cup installed on a plurality of the follower tubes. An embedded groove is formed on the lifting plate. A sealing block is slidably installed coaxially inside the follower tube. A plurality of telescopic holes are equidistantly formed at the upper end of the sealing block. A control rod is slidably connected to each of the telescopic holes. A top hole with the same number as the telescopic holes is formed on the upper end surface of the sealing block, and the top hole communicates with the telescopic holes. A control groove is formed on each of the control rods. A parallel plate is installed on the protruding part of each control rod. In terms of the wafer fixing system, a multi-point adsorption type fixing structure is adopted. Through the coordinated work of the lifting plate and a plurality of follower tubes, the all-round stable fixing of the wafer is achieved. This design not only improves the stability of wafer fixing, but also can judge whether the fixing is in place through negative pressure detection, ensuring the detection accuracy.

Description

Technical Field

[0001] The present invention relates to the technical field of coating detection, and more specifically, it relates to a photoresist coating detection device for wafer production. Background Art

[0002] In the contemporary semiconductor manufacturing field, the photoresist coating detection during the wafer production process is an extremely crucial technological process. Although the existing detection devices are equipped with multiple suction cups for wafer fixation, this design should be able to provide stable support in all directions. However, during the actual operation, the device often starts the detection when only one suction cup completes the fixation, without fully utilizing the advantage of multi-point fixation. This operation method seriously violates the original design intention of the device, making the functional advantages of the multi-suction cup fixation system unable to be fully exerted.

[0003] This improper operation method has led to a series of technical problems. When the wafer is fixed by only a single suction cup, the other unactivated suction cups cannot provide the necessary supporting force, making the wafer prone to uneven stress distribution and tiny deformation during the detection process. These problems directly affect the detection accuracy of the photoresist coating. Especially during high-precision detection, any slight deformation on the wafer surface may cause deviation in the detection data, ultimately affecting the product quality and production efficiency. This situation not only reduces the reliability of the detection but also may cause a decline in the quality control level of the entire production line. Summary of the Invention

[0004] (I) Technical Problems to be Solved

[0005] Aiming at the problems existing in the prior art, the present invention provides a photoresist coating detection device for wafer production to solve the technical problems mentioned in the background art.

[0006] (II) Technical Solutions

[0007] To achieve the above object, the present invention provides the following technical solution: A photoresist coating detection device for wafer production, including a lifting plate and a plurality of follower tubes arranged along the axis of the lifting plate.

[0008] The adsorption mechanism includes suction cups mounted on multiple of the follower tubes. An embedded groove is provided on the lifting disc. A sealing block is slidably mounted coaxially within the follower tube. A plurality of expansion holes are equidistantly provided at the upper end of the sealing block. A control rod is slidably connected within each of the expansion holes. A top hole with the same number as the expansion holes is provided on the upper end face of the sealing block, and the top hole communicates with the expansion holes. A control groove is provided on each of the control rods. A parallel plate is mounted on the extended portion of each control rod, and the parallel plate is attached to the sealing block. A round head is mounted on the control rod. A limiting edge is mounted on the upper end face of the sealing block, and the plurality of parallel plates can only slide within the limiting edge; and

[0009] The negative pressure mechanism includes external connecting tubes connected to multiple of the follower tubes, and the multiple external connecting tubes are respectively connected to external negative pressure devices.

[0010] Preferably, a workbench is mounted at the lower end of the lifting disc. A moving frame is mounted on the workbench. A detector is mounted on the extended end of the moving frame. A cylinder is mounted on the workbench, and the extended end of the cylinder is connected to the lifting disc.

[0011] Preferably, springs are respectively mounted on the plurality of parallel plates. The springs are sleeved and slidably connected to the control rods, and the springs abut against the side wall of the sealing block. This design provides a stable elastic force for the parallel plates through the elastic action of the springs, while ensuring the flexible movement of the control rods, improving the reliability and response speed of the sealing system.

[0012] Preferably, the adsorption mechanism further includes a plurality of fixed rods arranged along the axis and mounted on the workbench. An air pipe is mounted on the plurality of fixed rods. A bottom hole is provided on the lower end face of the follower tube, and the air pipe is slidably connected within the bottom hole. The air pipe passes through the bottom hole and communicates with the sealing block. This design establishes a stable air path system through the cooperation of the fixed rods and the air pipe, ensuring the reliability and tightness of negative pressure transmission.

[0013] Preferably, a right-angle groove with the same number as the expansion holes is provided along the axis within the sealing block, and a central groove is provided at the central position of the sealing block. One end of the central groove communicates with the plurality of expansion holes, and the other end of the central groove communicates with the air pipe. This design forms a complete air path network through the arrangement of the right-angle groove and the central groove, realizing the uniform distribution and effective transmission of negative pressure.

[0014] Preferably, a plurality of communication grooves are equidistantly formed in the side wall of the ventilation pipe. A top plate and a bottom plate are respectively installed at the upper and lower ends of the ventilation pipe. The bottom plate is connected to a plurality of the fixing rods. When the top plate abuts against the inside of the follower pipe, the plurality of communication grooves are respectively communicated with the inner and outer sides of the follower pipe. This design realizes the automatic switching and sealing of the gas path through the cooperation of the communication grooves and the top and bottom plates, ensuring the reliable operation of the negative pressure system.

[0015] Preferably, an annular pipe is installed between the plurality of follower pipes, and the plurality of follower pipes are respectively communicated with the annular pipe. This design realizes the balanced distribution of negative pressure by connecting the plurality of follower pipes through the annular pipe, improving the stability and reliability of the entire system.

[0016] Preferably, the negative pressure mechanism further includes two one-way plates symmetrically installed on the inner wall of the outer connection pipe, and two one-way plates are symmetrically installed coaxially inside the outer connection pipe. Two bidirectional rods are installed between the two one-way plates. This design realizes the one-way control of negative pressure through the cooperation of the one-way plates and the one-way disks, improving the stability of the system.

[0017] Preferably, an intermediate plate is installed on the inner wall of the outer connection pipe. Two sliding grooves are formed in the intermediate plate. The bidirectional rods are slidably connected in the two sliding grooves, and a plurality of microfluid holes are formed in the inner walls of the two sliding grooves.

[0018] Preferably, return springs are respectively installed on the two one-way plates, and the two return springs are respectively connected to both sides of the intermediate plate. This design ensures the automatic reset function of the one-way plates through the elastic action of the return springs, improving the reliability of the system.

[0019] (III) Beneficial effects

[0020] Compared with the prior art, the present invention provides a lithography glue coating detection device for wafer production, having the following beneficial effects:

[0021] First, in terms of the wafer fixing system, a multi-point adsorption type fixing structure is adopted. Through the collaborative work of the lifting plate and a plurality of follower pipes, the all-round stable fixing of the wafer is realized. This design not only improves the stability of wafer fixing, but also can judge whether the fixing is in place through negative pressure detection, effectively avoiding the displacement and deformation of the wafer during the detection process and ensuring the detection accuracy.

[0022] Secondly, in terms of the negative pressure control system, a bidirectional pressure balance mechanism is innovatively designed. Through the ingenious cooperation of the outer connection pipe, the one-way plates and the one-way disks, the precise control and automatic adjustment of negative pressure are realized. When there is a slight air leakage in the system, the external negative pressure device can replenish it in time to maintain a stable negative pressure environment; and when the pressure changes suddenly, the system can automatically isolate the external negative pressure source to prevent the pressure fluctuation from affecting the detection effect.

[0023] Finally, in terms of safety protection, a perfect safety protection mechanism is constructed through the coordinated work of components such as the sealing block, control rod, and spring. When the wafer is placed improperly, the system can automatically release the adsorption to avoid damaging the wafer. At the same time, the startup and release processes of the entire system are automatically controlled, greatly improving the safety and convenience of operation. Brief Description of the Drawings

[0024] Figure 1 It is a schematic diagram of the overall structure of a photoresist coating detection device for wafer production in the present invention;

[0025] Figure 2 It is a schematic diagram of the structures of the lifting plate and the cylinder in the present invention;

[0026] Figure 3 It is a schematic diagram of the structures of the follower tube, suction cup, and external connection tube in the present invention;

[0027] Figure 4 It is a schematic cross-sectional view of the follower tube and the sealing block in the present invention;

[0028] Figure 5 It is a schematic cross-sectional view of the sealing block in the present invention;

[0029] Figure 6 It is a schematic cross-sectional view of the control rod in the present invention;

[0030] Figure 7 It is a schematic cross-sectional view of the ventilation pipe in the present invention;

[0031] Figure 8 It is a schematic cross-sectional view of the external connection tube in the present invention;

[0032] Figure 9 It is a schematic diagram of the structure of the middle plate in the present invention.

[0033] In the figure: 11, lifting plate; 12, follower tube; 13, workbench; 14, moving frame; 15, detector; 21, suction cup; 22, embedded groove; 23, sealing block; 24, telescopic hole; 25, control rod; 26, top hole; 27, control groove; 28, parallel plate; 29, round head; 31, external connection tube; 32, one-way plate; 33, one-way plate; 34, two-way rod; 35, middle plate; 36, chute; 37, microfluidic hole; 38, return spring; 210, limiting edge; 211, spring; 212, fixed rod; 213, ventilation pipe; 214, bottom hole; 215, right-angle groove; 216, center groove; 217, communication groove; 218, top plate; 219, bottom plate; 220, annular tube; 16, cylinder. Detailed Embodiments

[0034] It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments may be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0035] It should be pointed out that, unless otherwise specified, all technical and scientific terms used in the present application have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present application belongs.

[0036] In the present invention, unless otherwise stated, the orientations such as "upper" and "lower" are generally in the directions shown in the drawings, or in the vertical, perpendicular or gravitational directions; similarly, for the convenience of understanding and description, "left" and "right" are generally the left and right shown in the drawings; "inner" and "outer" refer to the inner and outer of the contours of the respective components themselves, but the above orientation terms are not used to limit the present invention.

[0037] Please refer to Figures 1 to 9, A photoresist coating detection device for wafer production, including a lifting plate 11 and a plurality of follower tubes 12 arranged along the axis of the lifting plate 11. A workbench 13 is installed at the lower end of the lifting plate 11. A moving frame 14 is installed on the workbench 13. A detector 15 is installed at the extending end of the moving frame 14. A cylinder 16 is installed on the workbench 13, and the extending end of the cylinder 16 is connected to the lifting plate 11. The adsorption mechanism includes suction cups 21 installed on a plurality of follower tubes 12. An embedded groove 22 is formed on the lifting plate 11. A sealing block 23 is slidably installed coaxially inside the follower tube 12. A plurality of expansion holes 24 are equidistantly formed at the upper end of the sealing block 23. A control rod 25 is slidably connected to each expansion hole 24 respectively. A top hole 26 with the same number as the expansion holes 24 is formed on the upper end surface of the sealing block 23. The top hole 26 communicates with the expansion hole 24. A control groove 27 is formed on each control rod 25. A parallel plate 28 is installed on the extending part of each control rod 25. The parallel plate 28 is attached to the sealing block 23. A round head 29 is installed on the control rod 25. A limiting edge 210 is installed on the upper end surface of the sealing block 23. The plurality of parallel plates 28 can only slide within the limiting edge 210. Springs 211 are installed on the plurality of parallel plates 28 respectively. The springs 211 are sleeved and slidably connected to the control rods 25, and the springs 211 abut against the side wall of the sealing block 23. The adsorption mechanism further includes a plurality of fixing rods 212 arranged along the axis and installed on the workbench 13. A ventilation pipe 213 is installed on the plurality of fixing rods 212. A bottom hole 214 is formed on the lower end surface of the follower tube 12. The ventilation pipe 213 is slidably connected to the bottom hole 214. The ventilation pipe 213 passes through the bottom hole 214 and communicates with the sealing block 23. A right-angle groove 215 with the same number as the expansion holes 24 is formed along the axis inside the sealing block 23. And a central groove 216 is formed at the central position of the sealing block 23. One end of the central groove 216 communicates with the plurality of expansion holes 24, and the other end of the central groove 216 communicates with the ventilation pipe 213. A plurality of communication grooves 217 are equidistantly formed on the side wall of the ventilation pipe 213. A top plate 218 and a bottom plate 219 are installed at the upper and lower ends of the ventilation pipe 213 respectively. The bottom plate 219 is connected to the plurality of fixing rods 212. When the top plate 218 abuts inside the follower tube 12, the plurality of communication grooves 217 communicate with the inside and outside of the follower tube 12 respectively. An annular pipe 220 is installed between the plurality of follower tubes 12. The plurality of follower tubes 12 are respectively communicated with the annular pipe 220.

[0038] When performing coating detection on the wafer, the cylinder 16 extends to the highest position at this time, so it will drive the lifting plate 11 and multiple follower tubes 12 to rise to the highest position synchronously. At this time, the top plate 218 abuts against the lower end surface of the follower tube 12, and then the corresponding wafer is placed in the embedded groove 22, and the wafer fits on multiple suction cups 21. Then, the cylinder 16 is started to pull downward. Since the fixed rod 212 is installed on the workbench 13, the air pipe 213 and the sealing block 23 do not move. The multiple follower tubes 12 and the lifting plate 11 move downward, and the right-angle groove 215 fits on the side wall of the follower tube 12. Therefore, the right-angle groove 215 is in a sealed state, and multiple round heads 29 respectively abut against the side wall of the follower tube 12. Therefore, the control groove 27 on the control rod 25 connects the top hole 26 and the telescopic hole 24. Therefore, the space between the sealing block 23 and the suction cup 21 communicates with the outside. As the bottom hole 214 covers multiple communication grooves 217, the space between the follower tube 12 and the sealing block 23 is in a sealed state at this time. With the continuous action of the cylinder 16, it will drive the follower tube 12 to slide downward continuously. At this time, since the diameter of the air pipe 213 is much smaller than the diameter of the sealing block 23, the volume of the sealed space between the sealing block 23 and the air pipe 213 increases, so it will be in a negative pressure state. Since the suction cup 21 communicates with the outside through the air pipe 213, as the space above the sealing block 23 decreases, the internal air will be discharged. At this time, it is in a normal atmospheric pressure state. When the round head 29 leaves the side wall of the follower tube 12, under the action of the spring 211, it drives the control rod 25 to expand outward, and then the parallel plate 28 abuts against the limiting edge 210, and the control rod 25 closes the top hole 26 and the telescopic hole 24. Therefore, the suction cup 21 is in a closed state at this time, and the space below the sealing block 23 is in the maximum negative pressure state. When the follower tube 12 moves downward again, the right-angle groove 215 will release the seal with the follower tube 12, and then the negative pressure will be conducted between the suction cup 21 and the lower end surface of the wafer. At this time, if any suction cup 21 and the wafer are not in a closed state, the negative pressure in the corresponding follower tube 12 will communicate with the atmospheric pressure to reach the atmospheric pressure state. And the multiple follower tubes 12 are in a communicating state with each other through the annular tube 220, and the right-angle groove 215 connects the spaces at the upper and lower ends of the follower tube 12. Therefore, as long as there is one non-closed suction cup 21, the negative pressure suction will be lost. Only when the wafer is placed parallel without the embedded groove 22 will the situation where the suction cup 21 and the wafer are not sealed occur. Therefore, the adsorption will be released at this time to avoid damaging the wafer. Then, after reinstallation, adsorption fixation is performed, and then detection is carried out through the detector 15. Only at this time can the safe and effective detection of the wafer be ensured.

[0039] After the detection is completed, the follower tube 12 is then pushed upward by the cylinder 16, and then the round head 29 abuts against the side wall of the follower tube 12 to unseal it. At this time, the space between the suction cup 21 and the sealing block 23 is again in a state of being connected to the atmosphere. Therefore, the wafer after the detection can be taken out, and the next detection process can be carried out.

[0040] Please refer to Figures 7 to 9 , the negative pressure mechanism includes an external connecting pipe 31 connected to a plurality of follower tubes 12. The plurality of external connecting pipes 31 are respectively connected to an external negative pressure device. The negative pressure mechanism further includes two one-way discs 32 symmetrically installed on the inner wall of the external connecting pipe 31. And two one-way plates 33 are symmetrically installed coaxially in the external connecting pipe 31. Two bidirectional rods 34 are installed between the two one-way plates 33. An intermediate plate 35 is installed on the inner wall of the external connecting pipe 31. Two sliding grooves 36 are opened in the intermediate plate 35. The bidirectional rods 34 are slidably connected in the two sliding grooves 36. A plurality of micro-flow holes 37 are opened on the inner walls of the two sliding grooves 36. Return springs 38 are respectively installed on the two one-way plates 33. The two return springs 38 are respectively connected to both sides of the intermediate plate 35.

[0041] Since one end of the plurality of external connecting pipes 31 is connected to the external negative pressure mechanism, and the other end of the external connecting pipe 31 is connected to the follower tube 12, the negative pressure value provided by the external device is the same as the negative pressure value generated after the sealing block 23 connects the follower tube 12 up and down. Since the negative pressure values on both sides are the same, under the action of the return spring 38, the one-way plates 33 on both sides will be returned to their original positions, thus connecting the one-way plates 33 and the one-way discs 32 on both sides. At this time, even if there is air leakage between the suction cup 21 and the wafer, the external negative pressure device can continue to provide the negative pressure value, thus ensuring the stability of use. And when the cylinder 16 moves up and down, since the speed is very fast, the pressure change will also be very fast. At this time, a very large amount of gas cannot flow through the plurality of micro-flow holes 37 in a short time. Therefore, the pressure change will be promptly reflected on the one-way plates 33 on both sides. When the pressure in the follower tube 12 is high, the one-way plate 33 and the one-way disc 32 on the side of the follower tube 12 are in a sealed state. When the pressure in the follower tube 12 is low, the one-way plate 33 and the one-way disc 32 on the other side are in a sealed state. Therefore, when the pressure in the follower tube 12 undergoes a sudden change, the external negative pressure device will be promptly closed and will not be affected. Only when there is a slight air leakage between the wafer and the suction cup 21 will the external negative pressure device take effect. Therefore, the detection effect is ensured.

[0042] Among all the solutions mentioned above, for the connection between two components, welding, connection by bolts and nuts, connection by bolts or screws, or other well-known connection methods can be selected according to the actual situation, which will not be elaborated here one by one. For those mentioned above that involve fixed connection, welding is preferably considered. Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that these embodiments can be subject to various changes, modifications, substitutions, and variations without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A photoresist coating detection device for wafer production, characterized in that: It comprises a lifting plate (11), a plurality of follower tubes (12) arranged along the axis of the lifting plate (11), an adsorption mechanism and a negative pressure mechanism; The adsorption mechanism comprises a suction cup (21) mounted on a plurality of the following tubes (12) and a plurality of fixed rods (212) mounted on a workbench (13) and arranged along the axis. The lifting plate (11) is provided with an embedded groove (22). A sealing block (23) is coaxially slidably mounted in the following tube (12). A plurality of telescopic holes (24) are equidistantly formed at the upper end of the sealing block (23). A control rod (25) is slidably connected to each of the telescopic holes (24). The sealing block (23) is provided with a plurality of telescopic holes (24) at an equal distance. The upper end surface of the control rod (25) is provided with top holes (26) of the same number as the telescopic holes (24), the top holes (26) are connected to the telescopic holes (24), each of the control rods (25) is provided with a control groove (27), the extended portion of each of the control rods (25) is provided with a parallel plate (28), the parallel plate (28) is attached to the sealing block (23), the control rod (25) is provided with a round head (29), and the upper end surface of the sealing block (23) is provided with a A limited edge (210), the plurality of parallel plates (28) can only slide within the limited edge (210), a plurality of fixed rods (212) are provided with ventilation pipes (213), a bottom hole (214) is provided on the lower end surface of the follower tube (12), the ventilation pipe (213) is slidably connected in the bottom hole (214), the ventilation pipe (213) passes through the bottom hole (214) and is connected to the sealing block (23), and the sealing block (23) is provided with a plurality of fixed rods (212) along the axis. The same number of right-angle grooves (215) as the telescopic holes (24) are provided, and a central groove (216) is provided at the central position of the sealing block (23), one end of the central groove (216) is connected to the plurality of telescopic holes (24), and the other end of the central groove (216) is connected to the vent pipe (213), an annular tube (220) is installed between the plurality of follower tubes (12), and the plurality of follower tubes (12) are respectively connected to the annular tube (220); and The negative pressure mechanism comprises an external pipe (31) connected to the plurality of follower pipes (12), and the plurality of external pipes (31) are respectively connected to external negative pressure equipment.

2. The photoresist coating detection device for wafer production according to claim 1, characterized in that: The workbench (13) is installed at the lower end of the lifting plate (11), a moving frame (14) is installed on the workbench (13), a detector (15) is installed on the protruding end of the moving frame (14), a cylinder (16) is installed on the workbench (13), and the protruding end of the cylinder (16) is connected to the lifting plate (11).

3. The photoresist coating detection device for wafer production according to claim 1, characterized in that: A spring (211) is respectively installed on the plurality of parallel plates (28); the spring (211) is sleeved and slidably connected to the control rod (25), and the spring (211) abuts against the side wall of the sealing block (23).

4. According to claim 1, a photoresist coating detection device for wafer production is provided with a plurality of connecting grooves (217) at equal intervals on the side wall of the ventilation pipe (213), and a top plate (218) and a bottom plate (219) are respectively installed at the upper and lower ends of the ventilation pipe (213), and the bottom plate (219) is connected to a plurality of the fixing rods (212), and when the top plate (218) is in contact with the follower tube (12), the plurality of connecting grooves (217) are respectively connected to the inner and outer sides of the follower tube (12).

5. The photoresist coating detection device for wafer production according to claim 1, characterized in that: The negative pressure mechanism also includes two one-way discs (32) symmetrically mounted on the inner wall of the external pipe (31), and two one-way plates (33) symmetrically mounted coaxially arranged in the external pipe (31), and two two-way rods (34) are mounted between the two one-way plates (33).

6. The photoresist coating detection device for wafer production according to claim 5, characterized in that: An intermediate plate (35) is installed on the inner wall of the external pipe (31), two slide grooves (36) are provided in the intermediate plate (35), the two-way rod (34) is slidably connected in the two slide grooves (36), and a plurality of micro-flow holes (37) are provided on the inner walls of the two slide grooves (36).

7. The photoresist coating detection device for wafer production according to claim 6, characterized in that: The two one-way plates (33) are respectively provided with return springs (38), and the two return springs (38) are respectively connected to the two sides of the middle plate (35).

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