Electronic device

Abstract

The electronic device includes: a sensor layer; and a sensor driver for operating in a first mode for sensing a touch input or in a second mode for sensing a pen input, the sensor layer including: first electrodes arranged along a first direction and extending along a second direction; a second electrode arranged along the second direction and extending along the first direction; a third electrode arranged in the first direction and extending in the second direction; a fourth electrode arranged in the second direction, extending in the first direction, and including a sub-electrode; a first trace connected to the first electrode; a second trace connected to the second electrode; a third trace connected to the third electrode; and a fourth trace connected to the fourth electrode and to an end of each of the sub-electrodes.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the priority of Korean Patent Application No. 10-2023-0097963 filed in the Korean Intellectual Property Office on July 27, 2023, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] Embodiments of the present disclosure described herein relate to an electronic device that senses input by a pen. Background Art

[0004] Multimedia electronic devices including televisions, mobile phones, tablet computers, navigation systems and game consoles are often equipped with display devices for image presentation. These devices are often characterized by a sensor layer or input sensor that provides a touch-based input method. In addition to traditional input schemes such as buttons, keyboards and mice, this scheme allows users to easily, intuitively and conveniently input information or commands. The sensor layer is designed to detect touch or pressure applied by the user's body. There is a growing demand for the use of pens, especially for users who are accustomed to writing tools or for specific applications (such as sketching or drawing) that employ fine touch input. Summary of the invention

[0005] Embodiments of the present disclosure provide an electronic device that senses an input by a pen.

[0006] An embodiment of the present disclosure provides an electronic device, which includes a sensor layer and a sensor driver configured to operate the sensor layer, wherein the sensor driver is also configured to operate in a first mode for sensing touch input or in a second mode for sensing pen input, wherein the sensor layer includes: a plurality of first electrodes arranged along a first direction and extending along a second direction intersecting the first direction; a plurality of second electrodes arranged along the second direction and extending along the first direction; a plurality of third electrodes arranged along the first direction and extending along the second direction; a fourth electrode arranged along the second direction, extending along the first direction, and including a plurality of sub-electrodes electrically connected to each other; a plurality of first traces electrically connected to the plurality of first electrodes, respectively; a plurality of second traces electrically connected to the plurality of second electrodes, respectively; a third trace electrically connected to the plurality of third electrodes; and a fourth trace electrically connected to the fourth electrode and connected to an end of each of the plurality of sub-electrodes, wherein the sensor driver is also configured to output a driving signal to the third trace and the fourth trace in the first mode.

[0007] The first mode includes a mutual capacitance detection mode and a self capacitance detection mode, wherein the sensor driver is further configured to output driving signals to the plurality of first electrodes and the plurality of second electrodes in the self capacitance detection mode.

[0008] The self-capacitance detection mode includes a first time period and a second time period, wherein the sensor driver is further configured to: output drive signals to multiple first traces in the first time period; output drive signals to multiple second traces, third traces and fourth traces in the second time period.

[0009] The plurality of third electrodes and the fourth electrodes are grounded in the mutual capacitance detection mode.

[0010] In the self-capacitance detection mode, a driving signal is provided to the plurality of third electrodes and the fourth electrodes.

[0011] In the self-capacitance detection mode, the plurality of third electrodes are electrically separated from the third trace and the fourth electrode is electrically separated from the fourth trace.

[0012] The electronic device also includes a switch connected between the fourth electrode and the fourth trace, wherein the switch is open in the first mode and is closed in the second mode.

[0013] The electronic device further includes a plurality of switches connected between the plurality of sub-electrodes, wherein the plurality of switches are opened in the first mode and are closed in the second mode.

[0014] The third trace includes a first portion extending along the first direction and electrically connected to the plurality of third electrodes, a second portion extending along the second direction from a first end of the first portion, and a third portion extending along the second direction from a second end of the first portion.

[0015] The electronic device further includes a plurality of switches connected between the first portion and the second portion and between the first portion and the third portion, respectively, wherein the plurality of switches are opened in the first mode and are closed in the second mode.

[0016] The sensor layer also includes a plurality of fifth traces electrically connected to the plurality of third electrodes, respectively.

[0017] The electronic device also includes a plurality of switches connected between the plurality of fifth traces and the plurality of third electrodes, respectively, wherein the plurality of switches are opened in the first mode and are closed in the second mode.

[0018] The second mode includes a charging section and a pen sensing section, wherein in the charging section, a plurality of first electrodes, a plurality of second electrodes, and a fourth electrode are grounded, wherein in the pen sensing section, a plurality of third electrodes and a fourth electrode are grounded, and the sensor driver is further configured to detect coordinates of the pen input based on current provided from the plurality of first electrodes and the plurality of second electrodes.

[0019] An embodiment of the present disclosure provides an electronic device, which includes: a sensor layer, including multiple first electrodes, multiple second electrodes, multiple third electrodes, fourth electrodes and multiple traces; and a sensor driver configured to operate the sensor layer, wherein the sensor driver is also configured to operate in a mutual capacitance detection mode, a self-capacitance detection mode or a pen sensing mode including a charging time period and a pen sensing time period, wherein the sensor driver is also configured to output drive signals to the multiple first electrodes and the multiple second electrodes in the self-capacitance detection mode, and calculate input coordinates by sensing changes in the capacitance of each of the multiple first electrodes and the multiple second electrodes, wherein the sensor driver is also configured to output drive signals to at least some of the traces connected to the multiple third electrodes and the fourth electrode in the self-capacitance detection mode.

[0020] The fourth electrode includes a plurality of sub-electrodes electrically connected to each other, wherein the plurality of traces include: a plurality of first traces electrically connected to the plurality of first electrodes, respectively; a plurality of second traces electrically connected to the plurality of second electrodes, respectively; a third trace connected to a first end of each of the plurality of third electrodes; a fourth trace electrically connected to the fourth electrode and to an end of each of the plurality of sub-electrodes; and a plurality of fifth traces connected to second ends of the plurality of third electrodes, respectively, wherein the sensor driver is further configured to output drive signals to at least some of the third traces, the fourth trace and the fifth traces in a self-capacitance detection mode.

[0021] In the self-capacitance detection mode, a driving signal is provided to the plurality of third electrodes and the fourth electrodes.

[0022] In the self-capacitance detection mode, the plurality of third electrodes are electrically separated from the third trace and the fourth electrode is electrically separated from the fourth trace.

[0023] The sensor driver is also configured to apply current to one of the plurality of pads connected to the third trace and the plurality of fifth traces during a charging time period, and to receive current via another pad among the plurality of pads, and wherein the plurality of first electrodes, the plurality of second electrodes, and the fourth electrode are grounded during the charging time period, wherein the sensor driver is also configured to detect coordinates of pen input based on the current provided from the plurality of first electrodes and the plurality of second electrodes during a pen sensing time period, and wherein the plurality of third electrodes and the fourth electrode are grounded during the pen sensing time period.

[0024] The sensor driver is also configured to output sending signals to the plurality of first electrodes, receive receiving signals from the plurality of second electrodes, and calculate input coordinates by sensing changes in mutual capacitance between the plurality of first electrodes and the plurality of second electrodes in a mutual capacitance detection mode, wherein the plurality of third electrodes and the fourth electrodes are grounded in the mutual capacitance detection mode.

[0025] An embodiment of the present disclosure provides an electronic device, which includes a sensor layer and a sensor driver, wherein the sensor layer includes a plurality of first electrodes arranged along a first direction and extending along a second direction intersecting the first direction, a plurality of second electrodes arranged along the second direction and extending along the first direction, a plurality of third electrodes arranged along the first direction and extending along the second direction, a fourth electrode arranged along the second direction, extending along the first direction and including a plurality of sub-electrodes connected in parallel to each other, a plurality of first traces electrically connected to the plurality of first electrodes, a plurality of second traces electrically connected to the plurality of second electrodes, a third trace electrically connected to a first end portion of each of the plurality of third electrodes, a fourth trace electrically connected to the fourth electrode and connected to an end portion of each of the plurality of sub-electrodes, and a second trace electrically connected to the plurality of third electrodes, The sensor driver is configured to drive the sensor layer and operate in a pen sensing mode for sensing pen input or in a touch sensing mode for sensing touch input, wherein the sensor driver is further configured to apply current to one of a plurality of pads connected to the third trace and the plurality of fifth traces in the pen sensing mode, receive current via another pad among the plurality of pads, and detect coordinates of the pen input based on the current provided from the plurality of first electrodes and the plurality of second electrodes, wherein the sensor driver is further configured to output drive signals to the plurality of first electrodes and the plurality of second electrodes in the touch sensing mode, calculate input coordinates by sensing changes in capacitance of each of the plurality of first electrodes and the plurality of second electrodes, and output drive signals to the third trace, the fourth trace, and at least some of the plurality of fifth traces in the touch sensing mode.

[0026] In the touch sensing mode, a driving signal is provided to the plurality of third electrodes and the fourth electrodes.

[0027] The plurality of third electrodes and the fourth electrodes are electrically separated from at least some of the third trace, the fourth trace, and the plurality of fifth traces in the touch sensing mode and are not provided with a driving signal. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The above and other features of the present disclosure will become apparent by describing in detail the embodiments of the present disclosure with reference to the attached drawings.

[0029] Figure 1 is a perspective view of an electronic device according to an embodiment of the present disclosure.

[0030] Figure 2 is a perspective view of an electronic device according to an embodiment of the present disclosure.

[0031] Figure 3 is a cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0032] Figure 4is a diagram illustrating the operation of an electronic device according to an embodiment of the present disclosure.

[0033] Figure 5 is a cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0034] Figure 6 is a plan view of a sensor layer according to an embodiment of the present disclosure.

[0035] Figure 7 is an enlarged plan view of a sensing unit according to an embodiment of the present disclosure.

[0036] Fig. 8A is a plan view showing a first conductive layer of a sensing unit according to an embodiment of the present disclosure.

[0037] Figure 8B is a plan view showing a second conductive layer of a sensing unit according to an embodiment of the present disclosure.

[0038] Fig. 9 It is along Fig. 8A and Figure 8B 2 is a cross-sectional view of a sensor layer according to an embodiment of the present disclosure taken along line II′ in each of the drawings.

[0039] Fig. 10A yes Fig. 8A An enlarged plan view of the area AA' shown in FIG.

[0040] Fig. 10B yes Figure 8B An enlarged plan view of the area BB' shown in FIG.

[0041] Fig.11A is a cross-sectional view showing a portion of a sensor layer according to an embodiment of the present disclosure in an enlarged manner.

[0042] Fig. 11B is a cross-sectional view showing a portion of a sensor layer according to an embodiment of the present disclosure in an enlarged manner.

[0043] Fig. 12A is a cross-sectional view showing a portion of a sensor layer according to an embodiment of the present disclosure in an enlarged manner.

[0044] Fig. 12B is a cross-sectional view showing a portion of a sensor layer according to an embodiment of the present disclosure in an enlarged manner.

[0045] Fig.13A is a diagram illustrating the operation of the sensor driver according to an embodiment of the present disclosure.

[0046] Fig. 13Bis a diagram illustrating the operation of the sensor driver according to an embodiment of the present disclosure.

[0047] Fig.14 is a diagram showing a first mode of embodiment according to the present disclosure.

[0048] Fig.15 is a diagram showing a first mode of embodiment according to the present disclosure.

[0049] Fig.16 is a diagram showing a first mode of embodiment according to the present disclosure.

[0050] Fig.17 is a diagram showing a second mode according to an embodiment of the present disclosure.

[0051] Fig.18 is a diagram showing a second mode according to an embodiment of the present disclosure.

[0052] Fig.19 is a diagram showing a second mode according to an embodiment of the present disclosure.

[0053] Fig. 20 is a plan view of a sensor layer according to an embodiment of the present disclosure.

[0054] Fig.21 is a plan view of a sensor layer according to an embodiment of the present disclosure.

[0055] Fig. 22 is a plan view of a sensor layer according to an embodiment of the present disclosure.

[0056] Fig.23 is a plan view of a sensor layer according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0057] Here, when a component (or region, layer, portion, etc.) is referred to as being "on," "connected to," or "coupled to" another component, this means that the component may be directly disposed on / directly connected to / directly coupled to the other component, or a third component may be disposed between the component and the other component.

[0058] Throughout the specification, the same reference numerals may refer to the same components. In addition, in the drawings, in order to effectively describe the technical content, the thickness, ratio and size of the components may be exaggerated. "And / or" includes all of one or more combinations that the relevant components can define.

[0059] Terms such as first, second, etc. can be used to describe various components, but these components should not be limited by these terms. The above terms are used to distinguish one component from another component. For example, a first component can be named as a second component, and similarly, a second component can also be named as a first component. Unless the context clearly indicates otherwise, a singular expression includes a plural expression.

[0060] In addition, terms such as "below", "below", "on", and "above" are used to describe the relationship of components shown in the drawings. The above terms are relative concepts and are described with reference to the directions shown in the drawings.

[0061] It should be understood that terms such as “include” or “have” are intended to specify the features, quantities, steps, operations, components, parts, or combinations thereof described herein, and do not exclude the possibility of adding or existing one or more other features or quantities, steps, operations, components, parts, or combinations thereof.

[0062] Here, the terms "part" and "unit" refer to software components or hardware components that perform specific functions. Hardware components may include, for example, field programmable gate arrays (FPGAs) or application specific integrated circuits (ASICs). Software components may refer to executable code in an addressable storage medium and / or data used by the executable code. Thus, software components may be, for example, object-oriented software components, class components, and task components, and may include processes, functions, properties, programs, subroutines, program code segments, drivers, firmware, microcode, circuits, data, databases, data structures, tables, arrays, or variables.

[0063] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present disclosure belongs. It will also be understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and unless explicitly defined as such in this article, should not be interpreted in an idealized or overly formalized sense.

[0064] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0065] Figure 1 is a perspective view of an electronic device 1000 according to an embodiment of the present disclosure.

[0066] refer to Figure 1 The electronic device 1000 may be a device activated in response to an electrical signal. For example, the electronic device 1000 may be a mobile phone, a foldable mobile phone, a laptop computer, a television, a tablet computer, a vehicle navigation system, a game console, or a wearable device, but may not be limited thereto. Figure 1 It is shown that the electronic device 1000 is a mobile phone.

[0067] The active area 1000A and the peripheral area 1000NA may be provided in the electronic device 1000. The electronic device 1000 may display an image via the active area 1000A. The active area 1000A may include a surface formed by the first direction DR1 and the second direction DR2. The peripheral area 1000NA may surround the active area 1000A. In one embodiment of the present disclosure, the peripheral area 1000NA may be omitted.

[0068] The thickness direction of the electronic device 1000 may be parallel to a third direction DR3 crossing the first direction DR1 and the second direction DR2. Therefore, the front surface (or top surface) and the rear surface (or bottom surface) of each member constituting the electronic device 1000 may be described based on the third direction DR3.

[0069] Figure 2 is a perspective view of an electronic device 1000 - 1 according to an embodiment of the present disclosure.

[0070] refer to Figure 2 , the electronic device 1000-1 may include a foldable area FA and a plurality of non-foldable areas NFA1 and NFA2. The non-foldable areas NFA1 and NFA2 may include a first non-foldable area NFA1 and a second non-foldable area NFA2. The foldable area FA may be disposed between the first non-foldable area NFA1 and the second non-foldable area NFA2. The foldable area FA may be referred to as a foldable area, and the first non-foldable area NFA1 and the second non-foldable area NFA2 may be referred to as a first non-foldable area and a second non-foldable area.

[0071] like Figure 2 As shown in , the foldable area FA can be folded relative to a folding axis FX parallel to the second direction DR2. When the electronic device 1000-1 is folded, the foldable area FA has a predetermined curvature and a radius of curvature. The first non-foldable area NFA1 and the second non-foldable area NFA2 can face each other, and the electronic device 1000-1 can be folded inwardly so that the display surface is not exposed to the outside.

[0072] In one embodiment of the present disclosure, the electronic device 1000-1 may be folded outwardly so that the display surface is exposed to the outside. In one embodiment of the present disclosure, the electronic device 1000-1 may be folded inwardly or outwardly from an unfolded state, but the present disclosure may not be limited thereto.

[0073] exist Figure 2, an example in which one folding axis FX is provided in the electronic device 1000-1 is shown, but the present disclosure is not limited thereto. For example, a plurality of folding axes may be provided in the electronic device 1000-1, and the electronic device 1000-1 may be folded inwardly or outwardly relative to each of the plurality of folding axes from the unfolded state.

[0074] exist Figure 1 and Figure 2 In the embodiment, the bar-shaped electronic device 1000 and the foldable electronic device 1000-1 are described as examples, but the present disclosure is not limited thereto. For example, the description to be made below can be applied to various electronic devices such as a curved electronic device, a rollable electronic device, or a slidable electronic device.

[0075] Figure 3 is a cross-sectional view of an electronic device 1000 according to an embodiment of the present disclosure.

[0076] refer to Figure 3 , the electronic device 1000 may include a display layer 100 , a sensor layer 200 , an anti-reflection layer 300 , and a window 400 .

[0077] The display layer 100 may include a base layer 110 , a circuit layer 120 , a light emitting element layer 130 , and an encapsulation layer 140 .

[0078] The base layer 110 may be a member providing a base surface on which the circuit layer 120 is disposed. The base layer 110 may be a glass substrate, a metal substrate, a silicon substrate, a polymer substrate, etc. However, the embodiment may not be limited thereto, and the base layer 110 may be an inorganic layer, an organic layer, or a composite material layer.

[0079] The circuit layer 120 may be disposed on the base layer 110. The circuit layer 120 may include an insulating layer, a semiconductor pattern, a conductive pattern, a signal line, etc. The insulating layer, the semiconductor layer, and the conductive layer may be formed on the base layer 110 using methods such as coating, deposition, etc., and then, the insulating layer, the semiconductor layer, and the conductive layer may be selectively patterned via a plurality of photolithography processes. Thereafter, the semiconductor pattern, the conductive pattern, and the signal line included in the circuit layer 120 may be formed.

[0080] The light emitting element layer 130 may be disposed on the circuit layer 120. The light emitting element layer 130 may expose a portion of the circuit layer 120. The light emitting element layer 130 may include a light emitting element. For example, the light emitting element layer 130 may include an organic light emitting material, an inorganic light emitting material, an organic-inorganic light emitting material, a quantum dot, a quantum rod, a micron light emitting diode (LED), or a nano LED.

[0081] The encapsulation layer 140 may be disposed on the light emitting element layer 130. The encapsulation layer 140 may contact an exposed portion of the circuit layer 120. The encapsulation layer 140 may protect the light emitting element layer 130 from foreign substances such as moisture, oxygen, and dust particles.

[0082] The sensor layer 200 may be disposed on the display layer 100. The sensor layer 200 may be formed on the display layer 100 via a continuous process. In this case, the sensor layer 200 may be represented as being directly disposed on the display layer 100. For example, the sensor layer 200 may be in direct contact with the encapsulation layer 140. Directly disposed may mean that no third component is disposed between the sensor layer 200 and the display layer 100. In other words, a separate bonding member may not be disposed between the sensor layer 200 and the display layer 100. Alternatively, the sensor layer 200 may be coupled to the display layer 100 via a bonding member. The bonding member may include a conventional adhesive or glue.

[0083] The anti-reflection layer 300 may be disposed on the sensor layer 200. The anti-reflection layer 300 may reduce reflectivity of external light incident from the outside of the electronic device 1000. The anti-reflection layer 300 may be disposed directly on top of the sensor layer 200. However, the present disclosure may not be limited thereto, and an adhesive member may be disposed between the anti-reflection layer 300 and the sensor layer 200.

[0084] The window 400 may be disposed on the anti-reflection layer 300. An adhesive member may be disposed between the anti-reflection layer 300 and the window 400, but the present disclosure may not be particularly limited thereto. The window 400 may include an optically transparent insulating material. For example, the window 400 may include glass or plastic. The window 400 may have a multilayer structure or a single-layer structure. For example, the window 400 may include a plurality of plastic films bonded together with an adhesive, or may include a glass substrate and a plastic film bonded together with an adhesive.

[0085] Figure 4 is a diagram for illustrating the operation of the electronic device 1000 according to an embodiment of the present disclosure.

[0086] refer to Figure 4 , the electronic device 1000 may include a display layer 100 , a sensor layer 200 , a display driver 100C, a sensor driver 200C, a main driver 1000C, and a power supply circuit 1000P.

[0087] The display layer 100 may be a component that generates an image. The display layer 100 may be a light-emitting display layer. For example, the display layer 100 may be an organic light-emitting display layer, an inorganic light-emitting display layer, an organic-inorganic light-emitting display layer, a quantum dot display layer, a micro-LED display layer, or a nano-LED display layer.

[0088] The sensor layer 200 may be provided on the display layer 100. The sensor layer 200 may sense an external input applied from the outside. The sensor layer 200 may be an integrated sensor continuously formed during a manufacturing process of the display layer 100, or the sensor layer 200 may be an external sensor attached to the display layer 100. The sensor layer 200 may be referred to as a sensor, an input sensing layer, an input sensing panel, a device for sensing input coordinates, etc.

[0089] The sensor layer 200 may sense a first input 2000 or a second input 3000 applied from the outside. Each of the first input 2000 and the second input 3000 may be an input method that may provide a capacitance change of the sensor layer 200, or may be an input method that may cause an induced current in the sensor layer 200. For example, the first input 2000 may be a passive type input method such as a user's body. The second input 3000 may be an input using a pen PN. For example, the pen PN may be a passive type pen or an active type pen.

[0090] In one embodiment of the present disclosure, the pen PN may be a device that generates a magnetic field of a predetermined resonant frequency. The pen PN may transmit an output signal based on an electromagnetic resonance scheme. The pen PN may be referred to as an input device, an input pen, a magnetic pen, a stylus, or an electromagnetic resonance pen.

[0091] The pen PN may include an LC resonant circuit, and the LC resonant circuit may include an inductor L and a capacitor C. In one embodiment of the present disclosure, the LC resonant circuit may be a variable resonant circuit that changes the resonant frequency. In this case, the inductor L may be a variable inductor and / or the capacitor C may be a variable capacitor, but the present disclosure may not be particularly limited thereto.

[0092] The inductor L generates a current by a magnetic field formed in the sensor layer 200. The generated current is transmitted to the capacitor C. The capacitor C stores the charge of the current input from the inductor L, and releases the stored charge to the inductor L. Thereafter, the inductor L may emit a magnetic field at a resonant frequency. The induced current may flow in the sensor layer 200 by the magnetic field emitted by the pen PN, and the induced current may be transmitted to the sensor driver 200C as a reception signal or a sensing signal.

[0093] The main driver 1000C may control the overall operation of the electronic device 1000. For example, the main driver 1000C may control the operation of the display driver 100C and the sensor driver 200C. The main driver 1000C may include at least one microprocessor and may also include a graphics controller. The main driver 1000C may be an application processor, a central processing unit, or a main processor.

[0094] The display driver 100C may drive the display layer 100. The display driver 100C may receive image data and control signals from the main driver 1000C. The control signals may include various signals. For example, the control signals may include an input vertical synchronization signal, an input horizontal synchronization signal, a main clock signal, a data enable signal, and the like.

[0095] The sensor driver 200C may drive the sensor layer 200. The sensor driver 200C may receive a control signal from the main driver 1000C. The control signal may include a clock signal of the sensor driver 200C. In addition, the control signal may further include a mode determination signal that determines a driving mode of the sensor driver 200C and the sensor layer 200.

[0096] The sensor driver 200C and the sensor layer 200 may operate in a first mode or a second mode. For example, the first mode may be a mode for sensing a touch input (e.g., the first input 2000). The second mode may be a mode for sensing a pen input (e.g., the second input 3000). The second mode may include a charging section and a pen sensing section. The first mode may be referred to as a touch sensing mode, and the second mode may be referred to as a pen sensing mode. The charging section may be referred to as a charging time period, and the pen sensing section may be referred to as a pen sensing time period.

[0097] The switch between the touch sensing mode and the pen sensing mode can be performed in various ways. For example, the sensor driver 200C and the sensor layer 200 can sense the first input 2000 and the second input 3000 via a time-sharing operation. Alternatively, the switch between the touch sensing mode and the pen sensing mode can be performed by user selection, or one of the touch sensing mode and the pen sensing mode can be activated or switched by the activation of a specific application. Alternatively, when the sensor driver 200C and the sensor layer 200 operate alternately in the touch sensing mode and the pen sensing mode, the touch sensing mode can be maintained when the first input 2000 is sensed, or the pen sensing mode can be maintained when the second input 3000 is sensed.

[0098] The sensor driver 200C may calculate the input coordinate information based on the signal received from the sensor layer 200, and provide a coordinate signal having the coordinate information to the main driver 1000C. The main driver 1000C performs an operation corresponding to the user input based on the coordinate signal. For example, the main driver 1000C may operate the display driver 100C to display a new application image on the display layer 100.

[0099] The power supply circuit 1000P may include a power management integrated circuit (PMIC). The power supply circuit 1000P may generate a plurality of driving voltages for driving the display layer 100, the sensor layer 200, the display driver 100C, and the sensor driver 200C. For example, the plurality of driving voltages may include a gate high voltage, a gate low voltage, an ELVSS voltage, an ELVDD voltage, an initialization voltage, etc., but may not be particularly limited to the above examples.

[0100] Figure 5 is a cross-sectional view of an electronic device 1000 according to an embodiment of the present disclosure.

[0101] refer to Figure 5 , the electronic device 1000 may include a display layer 100, a sensor layer 200, an anti-reflection layer 300, an adhesive layer ADH, and a window 400. The adhesive layer ADH may be disposed between the anti-reflection layer 300 and the window 400. The adhesive layer ADH may include a conventional adhesive or glue having light transmittance.

[0102] At least one inorganic layer is formed on the top surface of the base layer 110. The inorganic layer may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. The inorganic layer may be formed into a plurality of layers. A plurality of inorganic layers may constitute a barrier layer and / or a buffer layer. In this embodiment, the display layer 100 is shown as including a buffer layer BFL.

[0103] The buffer layer BFL may improve the bonding strength between the base layer 110 and the semiconductor pattern. The buffer layer BFL may include at least one of silicon oxide, silicon nitride, and silicon oxynitride. For example, the buffer layer BFL may include a structure in which silicon oxide layers and silicon nitride layers are alternately stacked.

[0104] The semiconductor pattern may be disposed on the buffer layer BFL. The semiconductor pattern may include polysilicon. However, not limited thereto, the semiconductor pattern may include amorphous silicon, low temperature polysilicon, or an oxide semiconductor.

[0105] Figure 5 Only a portion of the semiconductor pattern is shown, and the semiconductor pattern may also be arranged in another area. The semiconductor pattern may be arranged across pixels in a specific rule. Depending on whether the semiconductor pattern is doped, the semiconductor pattern may have different electrical characteristics. The semiconductor pattern may include a first region with high conductivity and a second region with low conductivity. The first region may be doped with an N-type dopant or a P-type dopant. The P-type transistor may include a doped region doped with a P-type dopant, and the N-type transistor may include a doped region doped with an N-type dopant. The second region may be a non-doped region or a region doped at a lower concentration than the first region.

[0106] The first region may have a conductivity greater than that of the second region and may be used as an electrode or a signal line. The second region may correspond to an active region or a channel of a transistor. In other words, a portion of the semiconductor pattern may be an active region of a transistor, another portion of the semiconductor pattern may be a source or a drain of the transistor, and another portion of the semiconductor pattern may be a connecting electrode or a connecting signal line.

[0107] Each of the pixels may have an equivalent circuit including seven transistors, one capacitor, and a light emitting element, and the equivalent circuit diagram of the pixel may be modified into various forms. Figure 5 One transistor 100PC and a light emitting element 100PE included in a pixel are shown as an example.

[0108] The source region SC, the active region AL, and the drain region DR of the transistor 100PC may be formed of a semiconductor pattern. The source region SC and the drain region DR may extend in opposite directions from the active region AL in cross section. Figure 5 A portion of a connection signal line SCL formed of a semiconductor pattern is shown. The connection signal line SCL may be connected to the drain region DR of the transistor 100PC on a plane.

[0109] The first insulating layer 10 may be disposed on the buffer layer BFL. The first insulating layer 10 may overlap with a plurality of pixels in common and may cover the semiconductor pattern. The first insulating layer 10 may be an inorganic layer and / or an organic layer and may have a single-layer or multi-layer structure. The first insulating layer 10 may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. In the present embodiment, the first insulating layer 10 may be a single-layer silicon oxide layer. The first insulating layer 10 to be described later and the insulating layer of the circuit layer 120 may be an inorganic layer and / or an organic layer and may have a single-layer or multi-layer structure. The inorganic layer may include at least one of the above materials, but may not be limited thereto.

[0110] The gate GT of the transistor 100PC is disposed on the first insulating layer 10. The gate GT may be a part of the metal pattern. The gate GT overlaps the active area AL, and the first insulating layer 10 is between the gate GT and the active area AL. The gate GT may function as a mask in the process of doping the semiconductor pattern.

[0111] The second insulating layer 20 may be disposed on the first insulating layer 10 and may cover the gate electrode GT. The second insulating layer 20 may overlap with the pixel in common. The second insulating layer 20 may be an inorganic layer and / or an organic layer and may have a single layer or a multilayer structure. The second insulating layer 20 may include at least one of silicon oxide, silicon nitride, and silicon oxynitride. In the present embodiment, the second insulating layer 20 may have a multilayer structure including a silicon oxide layer and a silicon nitride layer.

[0112] The third insulating layer 30 may be disposed on the second insulating layer 20. The third insulating layer 30 may have a single layer or a multi-layer structure. For example, the third insulating layer 30 may have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0113] The first connection electrode CNE1 may be disposed on the third insulating layer 30. The first connection electrode CNE1 may be connected to the connection signal line SCL via a contact hole CNT-1 extending through the first insulating layer 10, the second insulating layer 20, and the third insulating layer 30. For example, the first connection electrode CNE1 may directly contact the connection signal line SCL in the contact hole CNT-1.

[0114] The fourth insulating layer 40 may be disposed on the third insulating layer 30. The fourth insulating layer 40 may be a single-layer silicon oxide layer. The fifth insulating layer 50 may be disposed on the fourth insulating layer 40. The fifth insulating layer 50 may be an organic layer.

[0115] The second connection electrode CNE2 may be disposed on the fifth insulating layer 50. The second connection electrode CNE2 may be connected to the first connection electrode CNE1 via a contact hole CNT-2 extending through the fourth insulating layer 40 and the fifth insulating layer 50. For example, the second connection electrode CNE2 may directly contact the first connection electrode CNE1 in the contact hole CNT-2.

[0116] The sixth insulating layer 60 may be disposed on the fifth insulating layer 50 and may cover the second connection electrode CNE2. The sixth insulating layer 60 may be an organic layer.

[0117] The light emitting element layer 130 may be disposed on the circuit layer 120. The light emitting element layer 130 may include a light emitting element 100PE. For example, the light emitting element layer 130 may include an organic light emitting material, an inorganic light emitting material, an organic-inorganic light emitting material, a quantum dot, a quantum rod, a micro-LED, or a nano-LED. Hereinafter, an example in which the light emitting element 100PE is an organic light emitting element will be described, but the present disclosure is not particularly limited thereto.

[0118] The light emitting element 100PE may include a first electrode AE, a light emitting layer EL, and a second electrode CE.

[0119] The first electrode AE ​​may be disposed on the sixth insulating layer 60. The first electrode AE ​​may be connected to the second connection electrode CNE2 via a contact hole CNT-3 extending through the sixth insulating layer 60. For example, the first electrode AE ​​may directly contact the second connection electrode CNE2 in the contact hole CNT-3.

[0120] The pixel defining layer 70 may be disposed on the sixth insulating layer 60 and may cover a portion of the first electrode AE. An opening 70-OP is formed in the pixel defining layer 70. The opening 70-OP of the pixel defining layer 70 exposes at least a portion of the first electrode AE.

[0121] Effective area 1000A (see Figure 1 ) may include a light emitting region PXA and a non-light emitting region NPXA adjacent to the light emitting region PXA. The non-light emitting region NPXA may surround the light emitting region PXA. In the present embodiment, the light emitting region PXA corresponds to a portion of the first electrode AE ​​exposed by the opening 70-OP.

[0122] The light-emitting layer EL may be disposed on the first electrode AE. The light-emitting layer EL may be disposed in a region corresponding to the opening 70-OP. For example, the light-emitting layer EL may be formed separately in each pixel. When the light-emitting layer EL is formed separately in each pixel, each light-emitting layer EL may emit light of at least one color of blue, red, and green. However, the present disclosure may not be limited thereto, and the light-emitting layer EL may be connected to the pixel and commonly included in the pixel. In this case, the light-emitting layer EL may provide blue light or white light.

[0123] The second electrode CE may be disposed on the light emitting layer EL. The second electrode CE may have an integral shape, and may be commonly included for a plurality of pixels.

[0124] The hole control layer may be disposed between the first electrode AE ​​and the light emitting layer EL. The hole control layer may be commonly disposed in the light emitting region PXA and the non-light emitting region NPXA. The hole control layer may include a hole transport layer and may also include a hole injection layer. The electron control layer may be disposed between the light emitting layer EL and the second electrode CE. The electron control layer may include an electron transport layer and may also include an electron injection layer. The hole control layer and the electron control layer may be commonly formed in a plurality of pixels using an open mask or an inkjet process.

[0125] The encapsulation layer 140 may be disposed on the light emitting element layer 130. The encapsulation layer 140 may include an inorganic layer, an organic layer, and an inorganic layer stacked in sequence, but the layers constituting the encapsulation layer 140 may not be limited thereto. The inorganic layer may protect the light emitting element layer 130 from moisture and oxygen, and the organic layer may protect the light emitting element layer 130 from foreign matter such as dust particles. The inorganic layer may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, an aluminum oxide layer, and the like. The organic layer may include an acrylic-based organic layer, but may not be limited thereto.

[0126] The sensor layer 200 may include a base layer 201 , a first conductive layer 202 , a sensing insulating layer 203 , a second conductive layer 204 , and a cover insulating layer 205 .

[0127] The base layer 201 may be an inorganic layer including at least one of silicon nitride, silicon oxynitride, and silicon oxide. Alternatively, the base layer 201 may be an organic layer including epoxy resin, acrylic resin, or imide-based resin. The base layer 201 may have a single-layer structure or a structure of multiple layers stacked along the third direction DR3.

[0128] Each of the first conductive layer 202 and the second conductive layer 204 may have a single layer structure or a structure of a plurality of layers stacked along the third direction DR3 .

[0129] The single-layer conductive layer may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum or an alloy thereof. The transparent conductive layer may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO) or indium zinc tin oxide (IZTO). In addition, the transparent conductive layer may include a conductive polymer such as poly (3,4-ethylenedioxythiophene) (PEDOT), a metal nanowire, graphene, etc.

[0130] The conductive layer of the multi-layer structure may include a metal layer. The metal layer may have a three-layer structure of, for example, titanium / aluminum / titanium. The conductive layer of the multi-layer structure may include at least one metal layer and at least one transparent conductive layer.

[0131] At least one of the sensing insulating layer 203 and the cap insulating layer 205 may include an inorganic film. The inorganic film may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0132] At least one of the sensing insulating layer 203 and the cover insulating layer 205 may include an organic film. The organic film may include at least one of acrylic resin (such as methacrylic resin), polyisoprene, vinyl-based resin, epoxy-based resin, urethane-based resin, cellulose-based resin, siloxane-based resin, polyimide-based resin, polyamide-based resin, and perylene-based resin.

[0133] The anti-reflection layer 300 may be disposed on the sensor layer 200. The anti-reflection layer 300 may include a spacer layer 310, a plurality of color filters 320, and a planarization layer 330.

[0134] The partition layer 310 may overlap the conductive pattern of the second conductive layer 204. The partition layer 310 may also overlap the pixel defining layer 70. The cover insulating layer 205 may be disposed between the partition layer 310 and the second conductive layer 204. In another embodiment of the present disclosure, the cover insulating layer 205 may be omitted.

[0135] The spacer layer 310 can prevent external light reflection of the second conductive layer 204. The material constituting the spacer layer 310 is not particularly limited as long as it is a material that absorbs light. The spacer layer 310 is a layer having a black color. In one embodiment, the spacer layer 310 may include a black colorant. The black colorant may include a black dye and a black pigment. The black colorant may include carbon black, a metal such as chromium, or an oxide thereof.

[0136] The partition opening 310-OP may be provided in the partition layer 310. The partition opening 310-OP may overlap the light emitting layer EL. The color filter 320 may be provided to correspond to the partition opening 310-OP. The color filter 320 may transmit light provided from the light emitting layer EL overlapping the color filter 320.

[0137] The planarization layer 330 may cover the partition layer 310 and the color filter 320. The planarization layer 330 may include an organic material and provide a flat surface at a top surface thereof. In one embodiment, the planarization layer 330 may be omitted.

[0138] In one embodiment of the present disclosure, the anti-reflection layer 300 may include a reflection adjustment layer instead of the color filter 320. For example, Figure 5 In the illustration of FIG. 3 , the color filter 320 may be omitted, and a reflection adjustment layer may be added in place of the color filter 320. The reflection adjustment layer may selectively absorb light of some light bands among light reflected from the inside of the display panel and / or the electronic device or light incident from the outside of the display panel and / or the electronic device.

[0139] As an example, the reflection adjustment layer can absorb light in a first wavelength region within the range of 490nm to 505nm and a second wavelength region within the range of 585nm to 600nm, so that the transmittance in the first wavelength region and the second wavelength region can be equal to or lower than 40%. The reflection adjustment layer can absorb light of wavelengths outside the wavelength range of red light, green light, and blue light emitted from the light-emitting layer EL. In this way, the reflection adjustment layer absorbs light of wavelengths that do not fall within the wavelength range of red light, green light, or blue light emitted from the light-emitting layer EL, thereby preventing or minimizing a reduction in the brightness of the display panel and / or the electronic device. In addition, by adopting the reflection adjustment layer, a reduction in the luminous efficiency of the display panel and / or the electronic device can be prevented or minimized, and visibility can be improved.

[0140] The reflection adjustment layer may be formed as an organic material layer containing a dye, a pigment or a combination thereof. The reflection adjustment layer may contain a tetraazaporphyrin (TAP)-based compound, a porphyrin-based compound, a metal porphyrin-based compound, an oxazine-based compound, a squarylium-based compound, a triarylmethane-based compound, a polymethine-based compound, an anthraquinone-based compound, a phthalocyanine-based compound, an azo-based compound, a perylene-based compound, a xanthene-based compound, a diimonium-based compound, a dipyrromethene-based compound, a cyanine-based compound and a combination thereof.

[0141] In one embodiment, the reflection adjusting layer may have a transmittance in the range of about 64% to 72%.The transmittance of the reflection adjusting layer may be adjusted according to the content of the pigment and / or dye contained in the reflection adjusting layer.

[0142] Figure 6 is a plan view of a sensor layer 200 according to an embodiment of the present disclosure. Figure 7 is an enlarged plan view of a sensing unit SU according to an embodiment of the present disclosure. Fig. 8A is a plan view showing a first conductive layer 202su of a sensing unit SU according to an embodiment of the present disclosure.

[0143] Figure 8B is a plan view showing a second conductive layer 204su of the sensing unit SU according to an embodiment of the present disclosure. Fig. 9 It is along Fig. 8A and Figure 8B 2 is a cross-sectional view of the sensor layer 200 according to an embodiment of the present disclosure, taken along line II′ in each of the drawings.

[0144] refer to Figure 6 , a sensing region 200A and a peripheral region 200NA adjacent to the sensing region 200A may be provided in the sensor layer 200 .

[0145] The sensor layer 200 may include a plurality of first electrodes 210, a plurality of second electrodes 220, a plurality of third electrodes 230, and a plurality of fourth electrodes 240-1 and 240-2 disposed in the sensing region 200A. The first electrodes 210 may be referred to as first touch electrodes, the second electrodes 220 may be referred to as second touch electrodes, the third electrodes 230 may be referred to as first pen electrodes, and the fourth electrodes 240-1 and 240-2 may be referred to as second pen electrodes.

[0146] Each of the first electrodes 210 may intersect the second electrode 220. Each of the first electrodes 210 may extend along the second direction DR2, and the first electrodes 210 may be spaced apart from each other in the first direction DR1. For example, columns of the first electrodes 210 may be spaced apart from each other in the first direction DR1. Each of the second electrodes 220 may extend along the first direction DR1, and the second electrodes 220 may be spaced apart from each other in the second direction DR2. For example, rows of the second electrodes 220 may be spaced apart from each other in the second direction DR2. The sensing unit SU may be a region where one first electrode 210 and one second electrode 220 intersect each other.

[0147] exist Figure 6 , six first electrodes 210 and ten second electrodes 220 are shown as examples, and sixty sensing units SU are shown as examples, but the number of the first electrodes 210, the number of the second electrodes 220, and the number of the sensing units SU are not limited thereto.

[0148] refer to Figure 6 and Figure 7 , each of the first electrodes 210 may include first segmentation electrodes 210dv1 and 210dv2. The first segmentation electrodes 210dv1 and 210dv2 may extend along the second direction DR2 and may be spaced apart from each other in the first direction DR1. The first segmentation electrodes 210dv1 and 210dv2 may have a shape symmetrical about a line extending in the second direction DR2.

[0149] Each of the second electrodes 220 may include second segmentation electrodes 220dv1 and 220dv2. The second electrodes 220 may extend along the first direction DR1 and may be spaced apart from each other in the second direction DR2. The second segmentation electrodes 220dv1 and 220dv2 may have symmetrical shapes about a line extending in the first direction DR1.

[0150] refer to Figure 7 , Fig. 8A , Figure 8B and Fig. 9, each of the first segmentation electrodes 210 dv1 and 210 dv2 may include a first pattern 211 and a first bridge pattern 212 , and each of the second segmentation electrodes 220 dv1 and 220 dv2 may include a second pattern 221 and a second bridge pattern 222 .

[0151] The first pattern 211 and the first bridge pattern 212 may be disposed on different layers, and the first pattern 211 and the first bridge pattern 212 may be electrically connected to each other via the first contact CN1. The second pattern 221 and the second bridge pattern 222 may be disposed on different layers, and the second pattern 221 and the second bridge pattern 222 may be electrically connected to each other via the second contact CN2. For example, the first bridge pattern 212 and the second bridge pattern 222 may be included in the first conductive layer 202su, and the first pattern 211 and the second pattern 221 may be included in the second conductive layer 204su. The first conductive layer 202su may be included in Figure 5 The first conductive layer 202 in the embodiment of the present invention, and the second conductive layer 204su may include Figure 5 In the second conductive layer 204.

[0152] Each of the third electrodes 230 may extend in the second direction DR2, and the third electrodes 230 may be spaced apart from each other in the first direction DR1. For example, columns of the third electrodes 230 may be spaced apart from each other in the first direction DR1.

[0153] In one embodiment of the present disclosure, each of the third electrodes 230 may include a plurality of first sub-electrodes 230s electrically connected to each other. The plurality of first sub-electrodes 230s may be connected in parallel to each other. The number of first sub-electrodes 230s included in each of the third electrodes 230 may vary. For example, as the number of first sub-electrodes 230s included in each of the third electrodes 230 increases, the resistance of each of the third electrodes 230 decreases. In addition, an effect may be observed from increasing the size of each of the third electrodes 230. For example, the coupling capacitance between the first electrode 210 and the third electrode 230 may be increased, thereby improving the resistance to the second input 3000 (see Figure 4 ) is improved. On the contrary, as the number of the first sub-electrodes 230s included in each of the third electrodes 230 is reduced, the annular coil pattern formed using the third electrode 230 can become denser, and thus the sensing sensitivity can be improved. In addition, the number of the fourth pads PD4 connected to the third electrode 230 in a one-to-one correspondence can be reduced, and thus the dead space can be reduced.

[0154] although Figure 6It is shown that one third electrode 230 includes two first sub-electrodes 230s as an example, but the present disclosure is not particularly limited thereto. The first sub-electrodes 230s may be arranged in one-to-one correspondence with the first electrodes 210. Therefore, one sensing unit SU may include a portion of one first sub-electrode 230s.

[0155] In one embodiment of the present disclosure, one third electrode 230 includes two first sub-electrodes 230s, so that one third electrode 230 may correspond to two first electrodes 210. Therefore, the number of first electrodes 210 included in the sensor layer 200 may be greater than the number of third electrodes 230. For example, the number of first electrodes 210 may be equal to the product of the number of third electrodes 230 included in the sensor layer 200 and the number of first sub-electrodes 230s included in each of the third electrodes 230. Figure 6 In the embodiment, the number of the first electrodes 210 may be six, the number of the third electrodes 230 may be three, and the number of the first sub-electrodes 230s included in each of the third electrodes 230 may be two.

[0156] The plurality of fourth electrodes 240-1 and 240-2 may be spaced apart from each other in the second direction DR2. The fourth electrode 240-1 may include a plurality of sub-electrodes 240s1 (hereinafter referred to as second sub-electrodes) connected in parallel to each other, and the fourth electrode 240-2 may include a plurality of sub-electrodes 240s2 (hereinafter referred to as second sub-electrodes) connected in parallel to each other. Figure 6 FIG. 5 shows, as an example, that each of the plurality of fourth electrodes 240 - 1 and 240 - 2 includes five sub-electrodes 240 s 1 or 240 s 2 , but the present disclosure is not particularly limited thereto.

[0157] The second sub-electrodes 240s1 and 240s2 may be arranged along the second direction DR2, and each of the second sub-electrodes 240s1 and 240s2 may extend along the first direction DR1. The number of second sub-electrodes 240s1 and 240s2 included in the plurality of fourth electrodes 240-1 and 240-2 may be equal to or less than the number of second electrodes 220.

[0158] When the plurality of fourth electrodes 240-1 and 240-2 include the second sub-electrodes 240s1 and 240s2, the size of each of the plurality of fourth electrodes 240-1 and 240-2 may be increased. In this case, the coupling capacitance between each of the plurality of fourth electrodes 240-1 and 240-2 and the second electrode 220 may be increased. The larger the coupling capacitance, the greater the sensitivity of the second input 3000 (see Figure 4 ). Therefore, the sensing sensitivity of the sensor layer 200 can be improved.

[0159] In one embodiment of the present disclosure, the sensor layer 200 may include one fourth electrode (e.g., 240-1), and therefore, the number of second sub-electrodes (e.g., 240s1) included in one fourth electrode (e.g., 240-1) may be the same as the number of second electrodes 220. However, the present disclosure is not limited thereto. For example, the sensor layer 200 may include a plurality of fourth electrodes 240-1 and 240-2 spaced apart from each other in the second direction DR2. In this case, each of the plurality of fourth electrodes 240-1 and 240-2 may include a plurality of second sub-electrodes 240s1 and 240s2.

[0160] refer to Figure 7 , Fig. 8A and Figure 8B , each of the first sub-electrodes 230s may include a third-first pattern 231 and a third-second pattern 232. The third-first pattern 231 and the third-second pattern 232 may be disposed on different layers, and the third-first pattern 231 and the third-second pattern 232 may be electrically connected to each other via a third contact CN3.

[0161] Each of the second sub-electrodes 240s1 and 240s2 (in the case where the second sub-electrodes 240s1 and 240s2 are not distinguished, each of the second sub-electrodes 240s1 and 240s2 may be collectively referred to as a “second sub-electrode 240s”) may include a fourth-first pattern 241, a fourth-second pattern 242, a fourth-third pattern 243, and a fourth-fourth pattern 244. The fourth-first pattern 241 and the fourth-second pattern 242 may be disposed on the same layer, and the fourth-third pattern 243 and the fourth-fourth pattern 244 may be disposed on the same layer, but may be disposed on a different layer from the fourth-first pattern 241 and the fourth-second pattern 242. For example, the fourth-first pattern 241 and the fourth-third pattern 243 may be electrically connected to each other via a fourth contact CN4, and the fourth-fourth pattern 244 may be electrically connected to the fourth-first pattern 241 via a fifth contact CN5, and electrically connected to the fourth-second pattern 242 via a sixth contact CN6.

[0162] The third-first pattern 231 , the fourth-first pattern 241 , and the fourth-second pattern 242 may be included in the first conductive layer 202su, and the third-second pattern 232 , the fourth-third pattern 243 , and the fourth-fourth pattern 244 may be included in the second conductive layer 204su.

[0163] In one embodiment of the present disclosure, the first conductive layer 202su may further include a dummy pattern 202dm. Each of the dummy patterns 202dm may be electrically floating or electrically grounded. Each of the dummy patterns 202dm may be electrically insulated from the first bridge pattern 212, the second bridge pattern 222, the third-first pattern 231, the fourth-first pattern 241, and the fourth-second pattern 242. In one embodiment of the present disclosure, the dummy pattern 202dm may be omitted.

[0164] The sensor layer 200 may further include a plurality of first traces 210t disposed in the peripheral area 200NA, a plurality of first pads PD1 connected in one-to-one correspondence with the first traces 210t, a plurality of second traces 220t, and a plurality of second pads PD2 connected in one-to-one correspondence with the second traces 220t.

[0165] The first traces 210t may correspond to the first electrodes 210 one-to-one and be electrically connected to the first electrodes 210, respectively, and the second traces 220t may correspond to the second electrodes 220 one-to-one and be electrically connected to the second electrodes 220, respectively. Therefore, the two first split electrodes 210dv1 and 210dv2 included in one first electrode 210 may be connected to one of the first traces 210t. The two second split electrodes 220dv1 and 220dv2 included in one second electrode 220 may be connected to one of the second traces 220t. Each of the second traces 220t may include a plurality of branches to be connected to the two second split electrodes 220dv1 and 220dv2.

[0166] The sensor layer 200 may also include a third trace 230rt1 arranged in the peripheral area 200NA, a plurality of third pads PD3 connected to a first end and a second end of the third trace 230rt1, fourth traces 240t-1 and 240t-2, fourth pads PD4 connected to the fourth traces 240t-1 and 240t-2 in a one-to-one correspondence, a fifth trace 230rt2, and a fifth pad PD5 connected to the fifth trace 230rt2 in a one-to-one correspondence.

[0167] The third trace 230rt1 may be electrically connected to all of the third electrodes 230. The third trace 230rt1 may include a first line portion 231t extending along the first direction DR1 and electrically connected to the third electrode 230, a second line portion 232t extending along the second direction DR2 from a first end of the first line portion 231t, and a third line portion 233t extending along the second direction DR2 from a second end of the first line portion 231t. The first line portion 231t may be referred to as a first portion, the second line portion 232t may be referred to as a second portion, and the third line portion 233t may be referred to as a third portion. The second line portion 232t may extend to the leftmost third pad PD3, and the third line portion 233t may extend to the rightmost third pad PD3.

[0168] In one embodiment of the present disclosure, each of the resistance of the second line portion 232t and the resistance of the third line portion 233t may be substantially equal to the resistance of one of the third electrodes 230. Therefore, the second line portion 232t and the third line portion 233t may be used as the third electrode 230, and the same effect obtained when the third electrode 230 is also provided in the peripheral area 200NA may be obtained. For example, one of the second line portion 232t and the third line portion 233t and one of the third electrodes 230 may form a coil. Therefore, the pen PN provided in the area adjacent to the peripheral area 200NA may also be sufficiently charged by a loop or coil including the second line portion 232t or the third line portion 233t.

[0169] In one embodiment of the present disclosure, in order to adjust the resistance of the second line portion 232t and the resistance of the third line portion 233t, the width of each of the second line portion 232t and the third line portion 233t in the first direction DR1 may be adjusted. However, this is merely an example, and the first line portion 231t, the second line portion 232t, and the third line portion 233t may have substantially the same width.

[0170] The fifth traces 230rt2 may be connected to the third electrodes 230 in a one-to-one correspondence. In other words, the number of the fifth traces 230rt2 may correspond to the number of the third electrodes 230. Figure 6 , three fifth traces 230rt2 are shown as an example.

[0171] At least one of the fifth traces 230rt2 may overlap at least one of the first traces 210t. Therefore, the area size of the peripheral region 200NA may be reduced.

[0172] The fourth traces 240t-1 and 240t-2 may be spaced apart from each other, and the sensing area 200A is interposed between the fourth traces 240t-1 and 240t-2. One end of each of the second sub-electrodes 240s1 may be connected to the fourth trace 240t-1. One end of each of the second sub-electrodes 240s2 may be connected to the fourth trace 240t-2. Since all of the second sub-electrodes 240s1 are connected to the fourth trace 240t-1, the second sub-electrode 240s1 may be used as one electrode. In addition, since all of the second sub-electrodes 240s2 are connected to the fourth trace 240t-2, the second sub-electrode 240s2 may be used as one electrode. Therefore, an effect similar to expanding the size of each of the plurality of fourth electrodes 240-1 and 240-2 may be achieved. As a result, the coupling capacitance between each of the plurality of fourth electrodes 240-1 and 240-2 and the second electrode 220 may be increased. The larger the coupling capacitance, the greater the sensitivity to the second input 3000 (see Figure 4 ). Therefore, the sensing sensitivity of the sensor layer 200 can be improved.

[0173] Fig. 10A yes Fig. 8A An enlarged plan view of the area AA' shown in FIG. Fig. 10B yes Figure 8B An enlarged plan view of the area BB' shown in FIG.

[0174] refer to Fig. 8A , Figure 8B , Fig. 10A and Fig. 10B , each of the first electrode 210, the second electrode 220, the third electrode 230, the plurality of fourth electrodes 240-1 and 240-2, and the dummy pattern 202dm may have a grid structure. Each of the grid structures may include a plurality of grid lines. The plurality of grid lines may have a shape extending in a predetermined direction and may be connected to each other. The shape may have various shapes such as a straight line, a line with a protrusion, or an uneven line. An opening in which a grid structure is not provided may be formed in each of the first electrode 210, the second electrode 220, the third electrode 230, the plurality of fourth electrodes 240-1 and 240-2, and the dummy pattern 202dm.

[0175] exist Fig. 10A and Fig. 10B 2 shows as an example that the grid structure includes grid lines extending along a first crossing direction CDR1 crossing the first direction DR1 and the second direction DR2 and grid lines extending along a second crossing direction CDR2 crossing the first crossing direction CDR1. However, the extending directions of the grid lines constituting the grid structure are not particularly limited to Fig. 10A and Fig. 10BFor example, the grid structure may include only grid lines extending in the first direction DR1 and the second direction DR2, or include grid lines extending in the first direction DR1, the second direction DR2, and the first and second crossing directions CDR1 and CDR2. In other words, the grid structure may be changed into various forms.

[0176] Fig.11A is a cross-sectional view showing a portion of a sensor layer according to an embodiment of the present disclosure in an enlarged manner.

[0177] refer to Fig.11A , two sensing units SUN1 and SUN2 and two second traces 220ta are shown as examples. The second traces 220ta may be electrically connected to the second electrodes 220, respectively. In one embodiment of the present disclosure, one second electrode 220 may be connected to one second trace 220ta via one connection point. In this case, each of the sensing units SUN1 and SUN2 may further include an additional bridge pattern 220ab for electrically connecting two second segmentation electrodes 220dv1 and 220dv2 included in the second electrode 220 to each other.

[0178] Fig. 11B is a cross-sectional view showing a portion of a sensor layer according to an embodiment of the present disclosure in an enlarged manner.

[0179] refer to Fig. 11B , two sensing units SUN1a and SUN2a, two first traces 210ta and 210ta1, and one fifth trace 230rt2 connected to one third electrode 230-1 are shown as examples. The fifth trace 230rt2 may not overlap with the first trace 210ta1, and may overlap with the first trace 210ta. For example, a portion of the fifth trace 230rt2 extending in the second direction DR2 may overlap with the first trace 210ta.

[0180] Each of the first traces 210ta and 210ta1 may be electrically connected to the first electrode 210. In one embodiment of the present disclosure, one first electrode 210 may be connected to the first trace 210ta or 210ta1 via one connection point. In this case, each of the sensing units SUN1a and SUN2a may further include an additional bridge pattern 210ab for electrically connecting two first segmentation electrodes 210dv1 and 210dv2 included in the first electrode 210 to each other.

[0181] Fig. 12A is a cross-sectional view showing a portion of a sensor layer according to an embodiment of the present disclosure in an enlarged manner.

[0182] refer to Fig. 12A, two sensing units SUN1b and SUN2b and two second traces 220tb are shown as an example.

[0183] The second trace 220tb may be electrically connected to the second electrode 220a. In one embodiment of the present disclosure, one second electrode 220a may be connected to one second trace 220tb via one connection point. In this case, each of the second electrodes 220a may further include a connection portion 220cp connected to the two second segmented electrodes 220dv1 and 220dv2. The second trace 220tb may be connected to the connection portion 220cp. The connection portion 220cp connected to the two second segmented electrodes 220dv1 and 220dv2 may form a triangle-like shape.

[0184] Fig. 12B is a cross-sectional view showing a portion of a sensor layer according to an embodiment of the present disclosure in an enlarged manner.

[0185] refer to Fig. 12B , two sensing units SUN1c and SUN2c, two first traces 210tb and 210tb1, and one fifth trace 230rt2 are shown as an example. The fifth trace 230rt2 may not overlap with the first trace 210tb1, and may overlap with the first trace 210tb.

[0186] The first traces 210tb and 210tb1 may be electrically connected to the first electrode 210a, respectively. In one embodiment of the present disclosure, one first electrode 210a may be connected to the first trace 210tb or 210tb1 via one connection point. In this case, the first electrode 210a may further include a connection portion 210cp connected to the two first segmented electrodes 210dv1 and 210dv2. The first trace 210tb or 210tb1 may be connected to the connection portion 210cp. The connection portion 210cp may extend in the first direction DR1.

[0187] Fig.13A is a diagram illustrating the operation of the sensor driver according to an embodiment of the present disclosure. Fig. 13B is a diagram illustrating the operation of the sensor driver according to an embodiment of the present disclosure. Fig.13A and Fig. 13B , each shows operations in nine sensing frames SF1, SF2, SF3, SF4, SF5, SF6, SF7, SF8, and SF9 as an example.

[0188] refer to Figure 4 and Fig.13A, the sensor driver 200C may selectively operate in the first mode MD1 or the second mode MD2. The sensor layer 200 may operate in the first mode MD1 or the second mode MD2 in response to the operation of the sensor driver 200C.

[0189] In each of the first, second, third, and fourth sensing frames SF1, SF2, SF3, and SF4, and the eighth and ninth sensing frames SF8 and SF9, the sensor driver 200C may operate in the first and second modes MD1 and MD2 in a time-division manner. Fig.13A and Fig. 13B It is shown that the sensor driver 200C is continuously driven in the first mode MD1 and the second mode MD2, but the present disclosure is not particularly limited thereto. For example, the sensor driver 200C may operate in the second mode MD2 and then operate in the first mode MD1.

[0190] The first mode MD1 may include a self-capacitance detection mode SS and a mutual capacitance detection mode MS. Fig.13A 2 shows as an example that the sensor driver 200C is continuously driven in the self-capacitance detection mode SS and the mutual capacitance detection mode MS, but the present disclosure is not particularly limited thereto. Fig. 13B As shown in the figure, in the first mode MD1a, the sensor driver 200C can operate in the mutual capacitance detection mode MS and then operate in the self capacitance detection mode SS. In one embodiment of the present disclosure, the sensor driver 200C can be driven continuously in the self capacitance detection mode SS, the second mode MD2, and the mutual capacitance detection mode MS, or the sensor driver 200C can be driven continuously in the mutual capacitance detection mode MS, the second mode MD2, and the self capacitance detection mode SS.

[0191] Each of the first sensing frame SF1, the second sensing frame SF2, the third sensing frame SF3, and the fourth sensing frame SF4, and the eighth sensing frame SF8 and the ninth sensing frame SF9 may be a touch sensing frame focusing on touch sensing. Fig.13A and Fig. 13B , each touch sensing frame includes the second mode MD2 as an example, but the present disclosure is not limited thereto. For example, an operation period in the second mode MD2 may be longer than an operation period in the first mode MD1.

[0192] The pen PN may be sensed in the second mode MD2 of the fourth sensing frame SF4. In this case, starting from the next frame (eg, starting from the fifth sensing frame SF5), the sensor driver 200C and the sensor layer 200 may continuously operate in the second mode MD2. Fig.13A and Fig. 13BThe fifth, sixth, and seventh sensing frames SF5, SF6, and SF7 shown in FIG. 4 may be pen sensing frames.

[0193] When the pen PN is not sensed during the continuous operation in the second mode MD2, the sensor driver 200C and the sensor layer 200 may operate in the first mode MD1 and the second mode MD2 in a time-sharing manner again. For example, when the pen PN is not sensed in the seventh sensing frame SF7, the sensor driver 200C and the sensor layer 200 may operate in the first mode MD1 and the second mode MD2 in a time-sharing manner again from the eighth sensing frame SF8.

[0194] The above description is based on an example in which the sensor driver 200C operates continuously in the second mode MD2 when the pen PN is sensed, but the present disclosure is not particularly limited to this. For example, the sensor driver 200C can operate continuously in the second mode MD2 by user selection, the execution of a specific application, or the occurrence of a specific operation (e.g., pen removal). In addition, the above description is based on an example in which the sensor driver 200C operates in the first mode MD1 and the second mode MD2 in a time-sharing manner when the pen PN is not sensed, but the present disclosure is not particularly limited to this. For example, the sensor driver 200C can operate in the first mode MD1 and the second mode MD2 in a time-sharing manner by user selection, the execution or termination of a specific application, or the occurrence of a specific operation (e.g., pen connection).

[0195] Fig.14 is a diagram for illustrating a first mode according to an embodiment of the present disclosure. Fig.15 is a diagram for illustrating a first mode according to an embodiment of the present disclosure.

[0196] refer to Figure 4 , Fig.13A , Fig.14 and Fig.15 The first mode MD1 includes a self-capacitance detection mode SS. The self-capacitance detection mode SS may include a first sub-section and a second sub-section. Fig.14 is a diagram for illustrating operations in the first subsection, and Fig.15 is a diagram for illustrating an operation in a second subsection. The first subsection may be referred to as a first time period, and the second subsection may be referred to as a second time period.

[0197] The sensor driver 200C may output driving signals Txs1 and Txs2 to the first and second electrodes 210 and 220 in the self-capacitance detection mode SS, and may calculate input coordinates by sensing a change in capacitance of each of the first and second electrodes 210 and 220 .

[0198] In one embodiment of the present disclosure, the sensor driver 200C may output a driving signal Txsp1 or Txsp2 to at least some of the third trace 230rt1, the fourth traces 240t-1 and 240t-2, and the fifth trace 230rt2 in a partial section of the first mode MD1. For example, the partial section of the first mode MD1 may correspond to the self-capacitance detection mode SS. As an example, the first mode MD1 corresponds to a portion of the first sensing frame SF1, and the above-mentioned partial section of the first mode MD1 may be less than the entire time of operating the first mode MD1 in the first sensing frame SF1.

[0199] In other words, the same signal as that provided to the adjacent first trace 210t or second trace 220t may be provided to at least some of the third trace 230rt1, the fourth traces 240t-1 and 240t-2, and the fifth trace 230rt2. In this case, at least some of the third trace 230rt1, the fourth traces 240t-1 and 240t-2, and the fifth trace 230rt2 may be used as guard lines.

[0200] refer to Fig.14 , in the first subsection, the sensor driver 200C may output the driving signal Txs1 to the first trace 210t. In this case, the sensor driver 200C may also output the driving signal Txsp1 to the fifth trace 230rt2 disposed adjacent to the first trace 210t. The driving signal Txs1 and the driving signal Txsp1 are signals having the same waveform and are substantially the same signal. In this case, no parasitic capacitance may be generated between the first trace 210t and the fifth trace 230rt2.

[0201] refer to Fig.15 , in the second subsection, the sensor driver 200C may output the driving signal Txs2 to the second trace 220t. In this case, the sensor driver 200C may output the driving signal Txsp2 to the third trace 230rt1 and the fourth traces 240t-1 and 240t-2 disposed adjacent to the second trace 220t. The driving signal Txs2 and the driving signal Txsp2 are signals having the same waveform and are substantially the same signal. In this case, no parasitic capacitance may be generated between the second trace 220t, the third trace 230rt1, and the fourth traces 240t-1 and 240t-2.

[0202] In one embodiment of the present disclosure, the third electrode 230 is electrically connected to the third trace 230rt1 and the fifth trace 230rt2, and the plurality of fourth electrodes 240-1 and 240-2 are electrically connected to the fourth traces 240t-1 and 240t-2. Therefore, when the sensor driver 200C outputs the driving signal Txsp1 or Txsp2 to at least some of the third trace 230rt1, the fourth traces 240t-1 and 240t-2, and the fifth trace 230rt2, the driving signal Txsp1 or Txsp2 may also be transmitted to the third electrode 230 and the plurality of fourth electrodes 240-1 and 240-2.

[0203] According to one embodiment of the present disclosure, in the self-capacitance detection mode SS, the same signal as the signal provided to the first electrode 210 and the second electrode 220 may be provided to at least some of the traces connected to the third electrode 230 and the plurality of fourth electrodes 240-1 and 240-2. Therefore, the parasitic capacitance generated between the traces may be reduced or eliminated. As a result, the touch sensitivity may be improved in the self-capacitance detection mode SS.

[0204] In addition, since at least some of the third trace 230rt1, the fourth traces 240t-1 and 240t-2, and the fifth trace 230rt2 operate as protection lines, there is no need to add separate protection lines. Therefore, there is no need to allocate space for separate protection lines and for pads connected to the separate protection lines. Therefore, the degree of freedom in design can be improved.

[0205] Fig.16 is a diagram for illustrating a first mode according to an embodiment of the present disclosure.

[0206] refer to Figure 4 , Fig.13A and Fig.16 , the first mode MD1 includes the mutual capacitance detection mode MS. Fig.16 is a diagram for illustrating the mutual capacitance detection mode MS in the first mode MD1.

[0207] In the mutual capacitance detection mode MS, the sensor driver 200C may sequentially provide a transmission signal TX to the first electrode 210, and detect the input coordinates of the first input 2000 using a reception signal RX detected via the second electrode 220. For example, the sensor driver 200C may calculate the input coordinates by sensing a change in mutual capacitance between the first electrode 210 and the second electrode 220.

[0208] exist Fig.16 In FIG. 1 , a transmission signal TX is provided to one first electrode 210 and a reception signal RX is output from the second electrode 220 as an example. Fig.16Only the first electrode 210 (which is provided with the transmission signal TX) is provided Fig.16 The sensor driver 200C may detect the input coordinates of the first input 2000 by sensing a change in capacitance between the first electrode 210 and the second electrode 220 .

[0209] In the mutual capacitance detection mode MS, the third electrode 230 and the plurality of fourth electrodes 240 - 1 and 240 - 2 may be grounded, applied with a constant voltage, or electrically floated.

[0210] Fig.17 is a diagram for illustrating a second mode according to an embodiment of the present disclosure.

[0211] refer to Figure 4 , Figure 6 , Fig.13A and Fig.17 , the second mode MD2 may include a charging section and a pen sensing section. Fig.17 is a diagram for illustrating a charging section.

[0212] In one embodiment of the present disclosure, in the charging section, the sensor driver 200C may apply a first signal to one of the third pad PD3 and the fifth pad PD5, and apply a second signal to the other pad of the third pad PD3 and the fifth pad PD5. The second signal may be an inverted signal of the first signal. For example, the first signal may be a signal having a pulse waveform or a signal having a sine waveform. Therefore, the current RFS may have a current path flowing from one pad to another pad. In addition, because the first signal and the second signal have pulse waveforms or sine waveforms that are inverted to each other, the direction of the current RFS may change periodically. In addition, because the second signal is inverted to the first signal, the noise caused by the first signal and the noise caused by the second signal may cancel each other. Therefore, it may not be in the display layer 100 (see Figure 3 ) occurs.

[0213] In one embodiment of the present disclosure, in the charging section, the sensor driver 200C may apply the first signal to one of the third pad PD3 and the fifth pad PD5, and the other pad of the third pad PD3 and the fifth pad PD5 may be grounded. In this case, the current RFS may also flow from one pad to the other pad. In addition, even when the other pad is grounded, because the first signal has a pulse wave or a sine wave, the direction of the current RFS may change periodically.

[0214] One pad to which the first signal is applied and another pad to which the second signal or ground is applied can be continuously changed. Thus, the loop coil patterns in various positions and in various shapes can form a magnetic field.

[0215] exist Fig.17 , a case where the current RFS is supplied to one third pad PD3a connected to one third trace 230rt1 and received via one fifth pad PD5a connected to the third electrode 230 is shown as an example. In this case, a coil-shaped current path may be formed by a portion of the third trace 230rt1 connected to the third pad PD3a, a portion of the fifth trace 230rt2 connected to the fifth pad PD5a, and the third electrode 230 connected to the fifth trace 230rt2. In the second mode MD2, the LC resonant circuit of the pen PN may be charged through the current path.

[0216] According to the present disclosure, the current path of the loop coil pattern may be implemented by components included in the sensor layer 200. The electronic device 1000 (see Figure 1 ) Even when the digitizer is not included, input by the pen PN can be sensed. Therefore, since there is no need to add a digitizer for sensing the pen PN, an increase in thickness, an increase in weight, and a decrease in flexibility of the electronic device 1000 due to the addition of the digitizer may not occur.

[0217] In the charging section, the first electrode 210, the second electrode 220, and the plurality of fourth electrodes 240-1 and 240-2 may be grounded, applied with a constant voltage, or electrically floating. In particular, the first electrode 210, the second electrode 220, and the plurality of fourth electrodes 240-1 and 240-2 may be floating. In this case, the current RFS may not flow to the first electrode 210, the second electrode 220, and the plurality of fourth electrodes 240-1 and 240-2.

[0218] Fig.18 is a diagram for illustrating a second mode according to an embodiment of the present disclosure. Fig.19 is a diagram for illustrating a second mode according to an embodiment of the present disclosure.

[0219] refer to Figure 4 , Fig.13A , Fig.18 and Fig.19 , the second mode MD2 may include a charging section and a pen sensing section. Fig.18 and Fig.19 is a diagram for illustrating a pen sensing section. Fig.19 It is shown that the first sensing current Ia and the second sensing current Ib generated by the pen PN flow through one of the sensing units SU.

[0220] The sensor driver 200C may receive a first reception signal PRX1 from the first electrode 210 and a second reception signal PRX2 from the second electrode 220. In this regard, the third electrode 230 and the plurality of fourth electrodes 240-1 and 240-2 may be floated, grounded, or applied with a constant voltage.

[0221] The LC resonant circuit of the pen PN can emit a magnetic field at a resonant frequency while releasing the charged charge. The first induced current Ia can be generated in the first sub-electrode 230s of the third electrode 230 by the magnetic field provided from the pen PN, and the second induced current Ib can be generated in the second sub-electrode 240s of the fourth electrode 240-1 or 240-2. A first coupling capacitor Ccp1 can be formed between the third electrode 230 and the first electrode 210, and a second coupling capacitor Ccp2 can be formed between the fourth electrode 240-1 or 240-2 and the second electrode 220. The first induced current Ia can be transmitted from the third electrode 230 to the first electrode 210 via the first coupling capacitor Ccp1, and the second induced current Ib can be transmitted from the fourth electrode 240-1 or 240-2 to the second electrode 220 via the second coupling capacitor Ccp2.

[0222] The sensor driver 200C may receive a first reception signal PRX1a based on the first sensing current Ia from the first electrode 210, and receive a second reception signal PRX2a based on the second sensing current Ib from the second electrode 220. The sensor driver 200C may detect input coordinates of the pen PN (also referred to as "coordinates of pen input") based on the first reception signal PRX1a and the second reception signal PRX2a.

[0223] In the pen sensing section, the third electrode 230 and the plurality of fourth electrodes 240 - 1 and 240 - 2 may be grounded or applied with a constant voltage. The sensor driver 200C may detect coordinates of a pen input based on currents supplied from the first and second electrodes 210 and 220 .

[0224] Fig. 20 is a plan view of a sensor layer 200 according to an embodiment of the present disclosure.

[0225] refer to Fig. 20 The switch SW1 may be disposed between each of the plurality of fourth electrodes 240 - 1 and 240 - 2 and each of the fourth traces 240 t - 1 and 240 t - 2 . The switch SW1 may be turned on or off according to an operation mode of the sensor layer 200 .

[0226] In one embodiment of the present disclosure, the switch SW1 may be a transistor. The switch SW1 may be included in the sensor layer 200 or the display layer 100 (see Figure 5For example, when the switch SW1 is included in the display layer 100, the transistor constituting the switch SW1 may have Figure 5 The stack structure of the transistor 100PC shown in FIG. 1 is similar to the stack structure of the transistor 100PC and may be formed simultaneously via the same process as the transistor 100PC. However, this is merely an example and the present disclosure is not particularly limited thereto.

[0227] In one embodiment of the present disclosure, when Fig.14 and Fig.15 When the driving signal Txsp1 or Txsp2 is provided to at least some of the third trace 230rt1, the fourth traces 240t-1 and 240t-2, and the fifth trace 230rt2 as described in the above, the switch SW1 may be disconnected. For example, the plurality of fourth electrodes 240-1 and 240-2 may be electrically separated from the fourth traces 240t-1 and 240t-2. In this case, the driving signal Txsp1 or Txsp2 may not be provided to the plurality of fourth electrodes 240-1 and 240-2.

[0228] The switch SW1 may be disconnected in the first mode MD1 and turned on in the second mode MD2. When the switch SW1 is disconnected, the plurality of fourth electrodes 240-1 and 240-2 may be electrically separated from the fourth traces 240t-1 and 240t-2. Therefore, this method may result in an effect of reducing the area size of the electrodes that are electrically connected and responsible for generating capacitance. For example, in a state where the switch SW1 is turned on, one fourth electrode 240-1 and one fourth trace 240t-1 may be connected to each other to constitute the area size of one electrode. In a state where the switch SW1 is disconnected, one fourth electrode 240-1 and one fourth trace 240t-1 may be electrically separated from each other to constitute the area size of the corresponding electrode. Therefore, the area size may be reduced, and thus the basic capacitance may be reduced.

[0229] Fig.21 is a plan view of a sensor layer 200 according to an embodiment of the present disclosure.

[0230] refer to Fig.21 , a plurality of switches SW1a may be disposed between the plurality of fourth electrodes 240-1 and 240-2 and the fourth traces 240t-1 and 240t-2. The switches SW1a may be connected to the second sub-electrodes 240s1 and 240s2, respectively, in a one-to-one correspondence. The plurality of switches SW1a may be turned on or off according to an operation mode of the sensor layer 200. The switches SW1a may be turned off in the first mode MD1 and turned on in the second mode MD2.

[0231] When Fig.14 and Fig.15When the driving signal Txsp1 or Txsp2 is provided to at least some of the third trace 230rt1, the fourth traces 240t-1 and 240t-2, and the fifth trace 230rt2 as described in the above, the switch SW1a may be turned off. For example, the second sub-electrodes 240s1 and 240s2 may be electrically separated from the fourth traces 240t-1 and 240t-2. In this case, the driving signal Txsp1 or Txsp2 may not be provided to the second sub-electrodes 240s1 and 240s2.

[0232] In addition, when the switch SW1a is turned off, not only the second sub-electrodes 240s1 and 240s2 are electrically separated from the fourth traces 240t-1 and 240t-2, but also the second sub-electrodes 240s1 and 240s2 are electrically separated from each other. In other words, the area size of one electrode unit generating capacitance can be reduced, and thus the basic capacitance can be reduced.

[0233] Fig. 22 is a plan view of a sensor layer 200 according to an embodiment of the present disclosure.

[0234] refer to Fig. 22 , a switch (hereinafter referred to as a first switch) SW1 may be respectively disposed between each of the plurality of fourth electrodes 240-1 and 240-2 and each of the fourth traces 240t-1 and 240t-2, and a switch (hereinafter referred to as a second switch) SW2 may be disposed between each of the third electrodes 230 and each of the fifth traces 230rt2. The first switch SW1 and the second switch SW2 may be turned on or off according to an operation mode of the sensor layer 200. For example, the first switch SW1 and the second switch SW2 may be turned off in the first mode MD1, and the first switch SW1 and the second switch SW2 may be turned on in the second mode MD2.

[0235] When Fig.14 and Fig.15 When the driving signal Txsp1 or Txsp2 is provided to at least some of the third trace 230rt1, the fourth traces 240t-1 and 240t-2, and the fifth trace 230rt2 as described in the above, the first switch SW1 and the second switch SW2 may be turned off.

[0236] Fig.23 is a plan view of a sensor layer 200 according to an embodiment of the present disclosure.

[0237] refer to Fig.23, a switch SW1 (hereinafter referred to as a first switch) may be provided between each of the plurality of fourth electrodes 240-1 and 240-2 and each of the fourth traces 240t-1 and 240t-2, and a switch (hereinafter referred to as a third switch) SW3 may be provided between the first line portion 231t and the second line portion 232t and between the first line portion 231t and the third line portion 233t, respectively. The first switch SW1 and the third switch SW3 may be turned on or off according to the operation mode of the sensor layer 200. For example, the first switch SW1 and the third switch SW3 may be turned off in the first mode MD1, and the first switch SW1 and the third switch SW3 may be turned on in the second mode MD2.

[0238] When Fig.14 and Fig.15 When the driving signal Txsp1 or Txsp2 is provided to at least some of the third trace 230rt1, the fourth traces 240t-1 and 240t-2, and the fifth trace 230rt2 as described in FIG.

[0239] According to the above-described embodiment, in the self-capacitance detection mode, the same signal as the signal provided to the first electrode and the second electrode can be provided to at least some of the traces connected to the third electrode and the fourth electrode. Therefore, the parasitic capacitance generated between the traces can be reduced or eliminated. As a result, the touch sensitivity can be improved in the self-capacitance detection mode. In addition, since at least some of the traces connected to the third electrode and the fourth electrode work as guard lines, there is no need to add a separate guard line. Therefore, there is no need to allocate space for both the separate guard line and the pad connected to the separate guard line. Therefore, the degree of freedom in design can be improved.

[0240] While the present disclosure has been described with reference to the embodiments thereof, it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the disclosure as set forth in the appended claims.

Claims

1. An electronic device, comprising: Sensor layer; as well as a sensor driver configured to operate the sensor layer, wherein the sensor driver is further configured to operate in a first mode for sensing a touch input or in a second mode for sensing a pen input, Wherein, the sensor layer comprises: a plurality of first electrodes arranged along a first direction and extending along a second direction intersecting the first direction; a plurality of second electrodes arranged along the second direction and extending along the first direction; a plurality of third electrodes arranged along the first direction and extending along the second direction; a fourth electrode, arranged along the second direction, extending along the first direction, and comprising a plurality of sub-electrodes electrically connected to each other; a plurality of first traces, electrically connected to the plurality of first electrodes respectively; a plurality of second traces, electrically connected to the plurality of second electrodes respectively; a third trace electrically connected to the plurality of third electrodes; and a fourth trace electrically connected to the fourth electrode and to an end of each of the plurality of sub-electrodes, The sensor driver is further configured to output driving signals to the third trace and the fourth trace in the first mode.

2. The electronic device according to claim 1, wherein: The first mode includes a mutual capacitance detection mode and a self-capacitance detection mode, The sensor driver is further configured to output the driving signal to the plurality of first electrodes and the plurality of second electrodes in the self-capacitance detection mode.

3. The electronic device according to claim 2, wherein: The self-capacitance detection mode includes a first time period and a second time period. Wherein, the sensor driver is further configured to: outputting the driving signal to the plurality of first traces during the first time period; and The driving signal is output to the plurality of second traces, the third trace, and the fourth trace during the second time period.

4. The electronic device according to claim 2, wherein: The plurality of third electrodes and the fourth electrode are grounded in the mutual capacitance detection mode.

5. The electronic device according to claim 2, wherein: In the self-capacitance detection mode, the driving signal is provided to the plurality of third electrodes and the fourth electrode.

6. The electronic device according to claim 2, wherein: In the self-capacitance detection mode, the plurality of third electrodes are electrically separated from the third trace and the fourth electrode is electrically separated from the fourth trace.

7. The electronic device according to claim 1, further comprising: A switch is connected between the fourth electrode and the fourth trace, wherein the switch is opened in the first mode and is closed in the second mode.

8. The electronic device according to claim 1, further comprising: A plurality of switches are connected between the plurality of sub-electrodes, wherein the plurality of switches are opened in the first mode and are closed in the second mode.

9. The electronic device according to claim 1, wherein: The third trace includes a first portion extending along the first direction and electrically connected to the plurality of third electrodes, a second portion extending along the second direction from a first end of the first portion, and a third portion extending along the second direction from a second end of the first portion.

10. The electronic device according to claim 9, further comprising: A plurality of switches are connected between the first part and the second part and between the first part and the third part, respectively, wherein the plurality of switches are opened in the first mode and are closed in the second mode.

11. The electronic device according to claim 1, wherein: The sensor layer also includes a plurality of fifth traces electrically connected to the plurality of third electrodes, respectively.

12. The electronic device according to claim 11, further comprising: A plurality of switches are respectively connected between the plurality of fifth traces and the plurality of third electrodes, wherein the plurality of switches are opened in the first mode and are closed in the second mode.

13. The electronic device according to claim 1, wherein: The second mode includes a charging section and a pen sensing section, wherein, in the charging section, the plurality of first electrodes, the plurality of second electrodes and the fourth electrode are grounded, Wherein, in the pen sensing section, the plurality of third electrodes and the fourth electrodes are grounded, and the sensor driver is further configured to detect coordinates of the pen input based on currents provided from the plurality of first electrodes and the plurality of second electrodes.

14. An electronic device comprising: a sensor layer including a plurality of first electrodes, a plurality of second electrodes, a plurality of third electrodes, a fourth electrode, and a plurality of traces; as well as a sensor driver configured to operate the sensor layer, wherein the sensor driver is further configured to operate in a mutual capacitance detection mode, a self capacitance detection mode, or a pen sensing mode including a charging period and a pen sensing period, wherein the sensor driver is further configured to output a driving signal to the plurality of first electrodes and the plurality of second electrodes in the self-capacitance detection mode, and calculate input coordinates by sensing a change in capacitance of each of the plurality of first electrodes and the plurality of second electrodes, The sensor driver is further configured to output the drive signal to at least some of the traces connected to the plurality of third electrodes and the fourth electrode in the self-capacitance detection mode.

15. The electronic device according to claim 14, wherein: The fourth electrode includes a plurality of sub-electrodes electrically connected to each other, Wherein, the plurality of traces include: a plurality of first traces, electrically connected to the plurality of first electrodes respectively; a plurality of second traces, electrically connected to the plurality of second electrodes respectively; a third trace connected to a first end portion of each of the plurality of third electrodes; a fourth trace electrically connected to the fourth electrode and to an end of each of the plurality of sub-electrodes; and A plurality of fifth traces are respectively connected to the second ends of the plurality of third electrodes, wherein the sensor driver is further configured to output the driving signal to at least some of the third traces, the fourth traces and the fifth traces in the self-capacitance detection mode.

16. The electronic device according to claim 15, wherein: In the self-capacitance detection mode, the driving signal is provided to the plurality of third electrodes and the fourth electrode.

17. The electronic device according to claim 15, wherein: In the self-capacitance detection mode, the plurality of third electrodes are electrically separated from the third trace and the fourth electrode is electrically separated from the fourth trace.

18. The electronic device according to claim 15, wherein: The sensor driver is further configured to apply current to one of the plurality of pads connected to the third trace and the plurality of fifth traces during the charging period and receive current via another pad of the plurality of pads, and wherein the plurality of first electrodes, the plurality of second electrodes, and the fourth electrode are grounded during the charging period, The sensor driver is further configured to detect coordinates of a pen input based on currents provided from the plurality of first electrodes and the plurality of second electrodes during the pen sensing time period, and wherein the plurality of third electrodes and the fourth electrodes are grounded during the pen sensing time period.

19. The electronic device according to claim 14, wherein: The sensor driver is further configured to output transmission signals to the plurality of first electrodes, receive reception signals from the plurality of second electrodes, and calculate input coordinates by sensing changes in mutual capacitance between the plurality of first electrodes and the plurality of second electrodes in the mutual capacitance detection mode, Wherein, the plurality of third electrodes and the fourth electrode are grounded in the mutual capacitance detection mode.

20. An electronic device comprising: The sensor layer includes: a plurality of first electrodes arranged along a first direction and extending along a second direction intersecting the first direction; a plurality of second electrodes arranged along the second direction and extending along the first direction; a plurality of third electrodes arranged along the first direction and extending along the second direction; a fourth electrode, arranged along the second direction, extending along the first direction and comprising a plurality of sub-electrodes connected in parallel to each other; a plurality of first traces, electrically connected to the plurality of first electrodes respectively; a plurality of second traces, electrically connected to the plurality of second electrodes respectively; a third trace electrically connected to a first end portion of each of the plurality of third electrodes; a fourth trace electrically connected to the fourth electrode and to an end of each of the plurality of sub-electrodes; and a plurality of fifth traces respectively connected to the second ends of the plurality of third electrodes; and a sensor driver configured to drive the sensor layer and operate in a pen sensing mode for sensing a pen input or in a touch sensing mode for sensing a touch input, wherein the sensor driver is further configured to apply a current to one of a plurality of pads connected to the third trace and the plurality of fifth traces in the pen sensing mode, receive the current via another pad of the plurality of pads, and detect the coordinates of the pen input based on the current provided from the plurality of first electrodes and the plurality of second electrodes, Wherein, the sensor driver is also configured to output drive signals to the multiple first electrodes and the multiple second electrodes in the touch sensing mode, calculate input coordinates by sensing changes in capacitance of each of the multiple first electrodes and the multiple second electrodes, and output the drive signals to the third trace, the fourth trace, and at least some of the multiple fifth traces in the touch sensing mode.

21. The electronic device according to claim 20, wherein: In the touch sensing mode, the driving signal is provided to the plurality of third electrodes and the fourth electrode.

22. The electronic device according to claim 20, wherein: The plurality of third electrodes and the fourth electrodes are electrically separated from the third trace, the fourth trace, and the at least some of the plurality of fifth traces in the touch sensing mode, and are not provided with the driving signal.

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