A bonding device

Abstract

This application relates to a bonding device, comprising: a main body having a receiving channel extending through it along a first direction; a shaft movably inserted through the receiving channel; a flexible member including a first support portion, a second support portion, and a movable portion, the first and second support portions being disposed on opposite sides of the movable portion and both connected to the main body, the movable portion being connected to the shaft and spaced apart from the main body; and a bonding head connected to the movable portion; wherein the movable portion is configured to drive the shaft to move along the first direction under the pressure of the bonding head. In this application, the movable portion can deform along the first direction and drive the shaft to move along the first direction. The first and second support portions can strengthen the rigidity of the flexible member in the direction intersecting the first direction, reducing the probability of the flexible member deviating in the direction intersecting the first direction, making the pressure applied to the target part during the bonding process more stable, and improving the accuracy of the product after bonding.

Description

Technical Field

[0001] This application relates to the field of bonding technology, and in particular to a bonding device. Background Technology

[0002] Bonding process refers to a process of bonding an IC (integrated circuit chip) or other structure to a COF (Chip On Flex) flatbed. This process requires taking the IC out and then hot-pressing it onto the COF flatbed cable to fix the two together.

[0003] However, during hot pressing, the process pressure is often unstable and difficult to control. If the pressure changes or deviates due to various factors, it will affect the accuracy of the bonded product. Summary of the Invention

[0004] Therefore, it is necessary to provide a bonding device to address the problem of unstable and difficult-to-control process pressure during the bonding process.

[0005] In a first aspect, this application provides a bonding device, comprising:

[0006] The main body has a passageway extending through it in the first direction;

[0007] A shaft is movably disposed in the receiving channel along the first direction;

[0008] A flexible component includes a first support portion, a second support portion, and a movable portion. The first support portion and the second support portion are disposed on opposite sides of the movable portion along a direction intersecting the first direction and are both connected to the main body. The movable portion is connected to the shaft and is spaced apart from the main body in the first direction.

[0009] The bonding head is connected to the movable part and is used to pick up and put down the target part to be bonded;

[0010] The movable part is configured to drive the shaft to move along the first direction under the pressure of the head.

[0011] In some embodiments, both the first support portion and the second support portion have a support surface disposed toward the main body, the support surface abutting against the surface of the main body, and the movable portion has a connecting surface disposed toward the main body and connected to the shaft, wherein the connecting surface is spaced apart from the main body in the first direction.

[0012] In some embodiments, the flexible member further includes a transition portion connecting the first support portion and the movable portion and / or the second support portion and the movable portion, wherein a clearance groove is formed on one side surface of the transition portion facing the body, and the clearance groove is used to provide deformation space for the movement of the movable portion in the first direction.

[0013] In some embodiments, the clearance groove includes a first sub-groove and a second sub-groove, the first sub-groove being formed at the connection position between the transition portion and the first support portion or the second support portion, and the second sub-groove being formed at the connection position between the transition portion and the movable portion.

[0014] In some embodiments, the shaft has a first end and a second end disposed opposite to each other along the first direction, the first end being used to connect to the head, and the flexible member being connected to the first end and / or the second end.

[0015] In some embodiments, the flexible member includes a first sub-member and a second sub-member, the first sub-member being connected to the first end and the second sub-member being connected to the second end; the first support portion, the movable portion and the second support portion of the first sub-member are arranged sequentially along a second direction, and the first support portion, the movable portion and the second support portion of the second sub-member are arranged sequentially along a third direction.

[0016] The first direction, the second direction, and the third direction are arranged to intersect each other.

[0017] In some embodiments, the bonding device further includes a pre-compression assembly disposed on the side of the second sub-piece away from the second end, and for providing pre-compression to the second sub-piece and the shaft along the first direction.

[0018] In some embodiments, the preload assembly includes a support member and a pressure member. The support member is disposed on the side of the second sub-component opposite to the second end and spaced apart from the second sub-component. The pressure member is movably disposed on the support member along the first direction to adjust the preload applied to the second sub-component and the shaft.

[0019] In some embodiments, the pressure component includes a mating component and an adjusting component. One of the mating component and the adjusting component is provided with a first connecting portion, and the other is provided with a second connecting portion. The first connecting portion and the second connecting portion are movably mated and connected along the first direction, so that the mating component and the adjusting component can move relative to each other along the first direction.

[0020] In some embodiments, the mating sub-component has a mating groove extending along the first direction, the groove wall is provided with a first thread, and the outer peripheral surface of the adjusting sub-component is provided with a second thread that matches the first thread.

[0021] In some embodiments, the preload assembly further includes a buffer member connected between the mating sub-component and the support member, and is used to provide a buffering force along the first direction.

[0022] In some embodiments, the bonding device further includes a force gauge connected along the first direction between the preload assembly and the second sub-assembly for measuring the preload and transmitting the preload to the second sub-assembly and the shaft.

[0023] In some embodiments, the bonding device further includes a drive member and a control member. The drive member is drivenly connected to the main body, and the control member is communicatively connected to the force gauge and the drive member, respectively, for receiving the measurement result of the force gauge and controlling the drive member to drive the main body to move along the first direction according to the measurement result.

[0024] In some embodiments, the bonding device further includes a heat insulation element disposed between the first sub-component and the bonding head.

[0025] In the aforementioned bonding device, after the bonding head picks up the target part to be bonded, it applies heat pressure to the target part. Under the pressure of the bonding head, the movable part of the flexible part can deform along the first direction, driving the shaft to move along the first direction. At the same time, the first support part and the second support part provide support on opposite sides of the movable part, which can enhance the rigidity of the flexible part in the direction intersecting with the first direction, reduce the probability of the flexible part deviating in the direction intersecting with the first direction, and enable the flexible part to deform more stably along the first direction, converting the deformation into the amount of movement of the shaft in the first direction. This makes the pressure applied to the target part during the bonding process more stable and improves the accuracy of the product after bonding. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the overall structure of a bonding device according to one or more embodiments.

[0027] Figure 2 This is a schematic cross-sectional view of a bonding device according to one or more embodiments.

[0028] Figure 3 This is a schematic diagram of the structure of a flexible element in a bonding device according to one or more embodiments.

[0029] Figure 4 This is a schematic diagram of the structure of a flexible element in a bonding device according to one or more embodiments.

[0030] Figure 5 This is a schematic cross-sectional view of a bonding device according to one or more embodiments.

[0031] Figure 6 This is a schematic cross-sectional view of a bonding device according to one or more embodiments.

[0032] Figure 7 This is a schematic diagram of the structure of the mating sub-component and the adjusting sub-component in a bonding device according to one or more embodiments.

[0033] Figure 8 This is a schematic diagram of the structure of the bonding head in a bonding device according to one or more embodiments.

[0034] Explanation of reference numerals in the attached drawings: 100, Bonding device; 10, Main body; 20, Shaft; 30, Flexible component; 40, Bonding head; 50, Pre-compression assembly; 60, Force gauge; 70, Heat insulation component; 11, Receiving channel; 21, First end; 22, Second end; 31, First support part; 32, Second support part; 33, Movable part; 34, Support surface; 35, Connecting surface; 36, Transition part; 37, Clearance groove; 38, First sub-component; 39, Second sub-component; 41, Adsorption surface; 42, Adsorption hole; 51, Support component; 52, Pressure component; 53, Buffer component; 371, First sub-groove; 372, Second sub-groove; 521, Mating sub-component; 522, Adjusting sub-component; 523, Mating groove; a, First direction; b, Second direction; c, Third direction. Detailed Implementation

[0035] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0036] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0037] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0038] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0039] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0040] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0041] Please also refer to Figure 1 , Figure 2 as well as Figure 3One embodiment of this application provides a bonding device 100, including a main body 10, a shaft 20, a flexible member 30, and a bonding head 40. The main body 10 has a receiving channel 11 extending through it along a first direction a, and the shaft 20 is movably disposed through the receiving channel 11 along the first direction a. The flexible member 30 includes a first support portion 31, a second support portion 32, and a movable portion 33. The first support portion 31 and the second support portion 32 are disposed on opposite sides of the movable portion 33 along a direction intersecting the first direction a, and are both connected to the main body 10. The movable portion 33 is connected to the shaft 20 and is spaced apart from the main body 10 along the first direction a. The bonding head 40 is connected to the movable portion 33 and is used to pick up and place the target part to be bonded. The movable portion 33 is configured to drive the shaft 20 to move along the first direction a under the pressure of the bonding head 40.

[0042] It should be noted that the bonding device 100 refers to a device used for hot-pressing and bonding an IC to a COF cable. The body 10 refers to the structure within the bonding device 100 that provides a mounting and support base for other structures. The body 10 can be rectangular, cylindrical, or other shapes, and a receiving channel 11 is formed through it along a first direction a. Specifically, the first direction a can be vertical, meaning the receiving channel 11 extends vertically and penetrates the body 10. In this way, the receiving channel 11 forms a mounting space.

[0043] Furthermore, the shaft 20 extends vertically and passes through the receiving channel 11. That is, one end of the shaft 20 along its longitudinal direction extends into the receiving channel 11 from one side opening and extends out from the other side opening, so that the shaft 20 passes through the receiving channel 11. At this time, the shaft 20 can move vertically within the receiving channel 11.

[0044] The flexible component 30 refers to a structure that can undergo elastic deformation to drive the shaft 20 to move in the vertical direction. The flexible component 30 includes a first support part 31, a second support part 32, and a movable part 33. The first support part 31 and the second support part 32 are arranged on opposite sides of the movable part 33 in a direction perpendicular to the first direction a. That is, when the first direction a is set to the vertical direction, the first support part 31 and the second support part 32 are arranged on opposite sides of the movable part 33 in the first horizontal direction.

[0045] Specifically, in the vertical direction, the positions of the first support portion 31 and the second support portion 32 correspond to the positions of the main body 10, allowing the first support portion 31 and the second support portion 32 to be connected to the main body 10 respectively. That is, the first support portion 31 and the second support portion 32 are supported on the main body 10 in the vertical direction. At the same time, the movable portion 33 is located between the first support portion 31 and the second support portion 32, and the position of the movable portion 33 corresponds to the position of the shaft 20, allowing the movable portion 33 to be connected to the shaft 20 so that the movable portion 33 can smoothly drive the shaft 20 to move in the vertical direction.

[0046] Furthermore, the movable part 33 is spaced apart from the main body 10 in the vertical direction. That is, in the vertical direction, the gap formed between the movable part 33 and the main body 10 can provide a certain deformation space for the movable part 33. When the movable part 33 deforms in the vertical direction under the action of external force, it can smoothly drive the shaft 20 to move in the vertical direction.

[0047] Furthermore, the bonding head 40 refers to the structure that actually connects to the target component to be bonded, i.e., the IC, and applies pressure to the IC to heat-press it onto the COF cable. The bonding head 40 is located at the bottom of the bonding device 100 for easy removal or placement of the IC. The bonding head 40 is connected to the movable part 33. During heat pressing of the IC, pressure is transmitted through the bonding head 40 to the movable part 33, causing the movable part 33 to deform vertically, thereby driving the shaft 20 to move vertically. This buffers the pressure applied to the IC, effectively protecting the IC and the COF cable structure during the heat pressing process.

[0048] With the above structure, under the pressure of the bonding head 40, the movable part 33 of the flexible member 30 can deform along the first direction a, and drive the shaft 20 to move along the first direction a. At the same time, the first support part 31 and the second support part 32 provide support on opposite sides of the movable part 33, which can strengthen the rigidity of the flexible member 30 in the direction intersecting with the first direction a, reduce the probability of the flexible member 30 deviating in the direction intersecting with the first direction a, so that the flexible member 30 can deform more stably along the first direction a, and convert the deformation into the movement of the shaft 20 in the first direction a, making the pressure applied to the target part during the bonding process more stable and improving the accuracy of the product after bonding.

[0049] like Figure 3 and Figure 4 As shown, in some embodiments, the first support portion 31 and the second support portion 32 both have a support surface 34 facing the main body 10, and the support surface 34 abuts against the surface of the main body 10. The movable portion 33 has a connecting surface 35 facing the main body 10 and connected to the shaft 20. In the first direction a, the connecting surface 35 is spaced apart from the main body 10.

[0050] Specifically, the side surfaces of the first support portion 31 and the second support portion 32 facing the main body 10 are constructed as support surfaces 34. In the vertical direction, the support surfaces 34 of the first support portion 31 and the second support portion 32 are at the same height. In this way, the support surfaces 34 of the first support portion 31 and the second support portion 32 can abut against the lower surface of the main body 10, forming a more stable support.

[0051] The side surface of the movable part 33 facing the main body 10 is constructed as a connecting surface 35, which is connected to the shaft 20, so that the movable part 33 can smoothly drive the shaft 20 to move in the vertical direction.

[0052] In the vertical direction, the support surfaces 34 of the first support part 31 and the second support part 32 respectively abut against and support the lower surface of the main body 10. At the same time, the connecting surface 35 of the movable part 33 is spaced apart from the lower surface of the main body 10, providing a certain deformation space for the movable part 33.

[0053] In one specific embodiment, the distance between the connecting surface 35 and the lower surface of the main body 10 can be set to 1 mm. Of course, in some other embodiments, the distance between the connecting surface 35 and the lower surface of the main body 10 can also be adjusted according to the actual situation to meet the pressure required during the hot pressing process, which will not be elaborated here.

[0054] Through the above structure, a certain deformation space is formed between the connecting surface 35 and the main body 10. At the same time, the first support part 31 and the second support part 32 can be stably supported between the support surface 34 and the main body 10 to strengthen the rigidity of the overall structure of the flexible part 30 in the horizontal direction, so that the movable part 33 can deform more stably in the vertical direction, and the pressure in the vertical direction is more stable.

[0055] In some embodiments, the flexible member 30 further includes a transition portion 36 connecting the first support portion 31 and the movable portion 33 and / or the second support portion 32 and the movable portion 33. The transition portion 36 has a relief groove 37 on one side surface facing the main body 10. The relief groove 37 is used to provide deformation space for the movement of the movable portion 33 in the first direction a.

[0056] Specifically, the transition part 36 serves as a connection between the first support part 31 and the movable part 33, and between the second support part 32 and the movable part 33. Thus, when the movable part 33 deforms smoothly in the vertical direction, the first support part 31 and the second support part 32 can provide higher rigidity for the movable part 33 in the horizontal direction, making the deformation of the movable part 33 in the vertical direction more stable.

[0057] Furthermore, a clearance groove 37 is formed on the side surface of the transition portion 36 facing the main body 10. That is, the clearance groove 37 is formed on the same side surface of the transition portion 36 as the support surface 34 and the connecting surface 35, and the opening of the clearance groove 37 faces the main body 10. When the movable portion 33 deforms and moves vertically under the action of external force, the clearance groove 37 provides deformation space for the movable portion 33, so that the first support portion 31 and the second support portion 32 are not affected and can be more stably supported on the main body 10.

[0058] Therefore, by setting the clearance groove 37, deformation space is provided for the deformation movement of the movable part 33 in the first direction a, so that while the movable part 33 deforms, the first support part 31 and the second support part 32 can be stably supported on the main body 10.

[0059] In some embodiments, the clearance groove 37 includes a first sub-groove 371 and a second sub-groove 372. The first sub-groove 371 is formed at the connection position between the transition portion 36 and the first support portion 31 or the second support portion 32, and the second sub-groove 372 is formed at the connection position between the transition portion 36 and the movable portion 33.

[0060] Specifically, the openings of the first sub-slot 371 and the second sub-slot 372 are arranged opposite to each other, such that the first sub-slot 371 is located at the connection between the transition portion 36 and the first support portion 31, and the second sub-slot 372 is located at the connection between the transition portion 36 and the movable portion 33, or the first sub-slot 371 is located at the connection between the transition portion 36 and the second support portion 32, and the second sub-slot 372 is located at the connection between the transition portion 36 and the movable portion 33.

[0061] The above structure enables the movable part 33 to deform more stably along the first direction a and drive the shaft 20 to move along the first direction a.

[0062] like Figure 2 , Figure 5 as well as Figure 6 As shown, in some embodiments, the shaft 20 has a first end 21 and a second end 22 disposed opposite to each other along a first direction a, the first end 21 being used to connect to the head 40, and the flexible member 30 being connected to the first end 21 and / or the second end 22.

[0063] Specifically, the shaft 20 has a first end 21 and a second end 22 that are disposed opposite to each other. The first end 21 of the shaft 20 is disposed downward and passes through the receiving channel 11 until it extends out of the receiving channel 11 and connects with the bottom end 40, while the second end 22 is located at the other end of the receiving channel 11.

[0064] The flexible component 30 can be a single component and connected to either the first end 21 or the second end 22. That is, when the flexible component 30 is a single component, it can be located at either the top or bottom end of the shaft body 20. When the flexible component 30 is located at the bottom end of the shaft body 20, it is actually connected between the head 40 and the shaft body 20.

[0065] Of course, there can also be two flexible members 30, and the two flexible members 30 are respectively connected to the first end 21 and the second end 22. That is, one flexible member 30 is located at the top of the shaft 20, and the other flexible member 30 is located between the head 40 and the shaft 20.

[0066] In this way, the flexible component 30 can uniformly transmit pressure along the first direction a, enabling the shaft 20 to move stably along the first direction a. Furthermore, the use of two flexible components 30 working together can further improve stability.

[0067] Please refer to it again. Figure 1 and Figure 2 In some embodiments, the flexible member 30 includes a first sub-member 38 and a second sub-member 39. The first sub-member 38 is connected to a first end 21, and the second sub-member 39 is connected to a second end 22. The first support portion 31, the movable portion 33, and the second support portion 32 of the first sub-member 38 are sequentially arranged along a second direction b, and the first support portion 31, the movable portion 33, and the second support portion 32 of the second sub-member 39 are sequentially arranged along a third direction c. The first direction a, the second direction b, and the third direction c intersect each other.

[0068] Specifically, the flexible component 30 is configured as two parts, namely a first sub-component 38 and a second sub-component 39. The first sub-component 38 is disposed at the first end 21 of the shaft 20, that is, between the shaft 20 and the head 40, and the second sub-component 39 is disposed at the second end 22 of the shaft 20, that is, at the top end of the shaft 20.

[0069] Wherein, when the first direction a is set as the vertical direction, the second direction b can be set as the first horizontal direction, and the third direction c can be set as the second horizontal direction, wherein the first horizontal direction and the second horizontal direction are perpendicular to each other.

[0070] When the first support portion 31, movable portion 33, and second support portion 32 of the first sub-component 38 are arranged sequentially along the first horizontal direction, the first support portion 31, movable portion 33, and second support portion 32 of the second sub-component 39 are arranged sequentially along the second horizontal direction. That is, the arrangement directions of the first support portion 31, movable portion 33, and second support portion 32 of the first sub-component 38 and the first support portion 31, movable portion 33, and second support portion 32 of the second sub-component 39 are perpendicular to each other in the horizontal plane.

[0071] In this way, in the vertical direction, the movable portion 33 of the first sub-component 38 and the movable portion 33 of the second sub-component 39 can be arranged opposite each other and stably transmit pressure in the vertical direction. At the same time, the first support portion 31 and the second support portion 32 of the first sub-component 38 and the first support portion 31 and the second support portion 32 of the second sub-component 39 can form a more stable support in the horizontal direction, strengthen the rigidity in the horizontal direction, and reduce the probability of the flexible member 30 shifting in the horizontal direction.

[0072] In some embodiments, the bonding device 100 further includes a preload assembly 50 disposed on the side of the second sub-piece 39 away from the second end 22 and for providing preload to the second sub-piece 39 and the shaft 20 along a first direction a.

[0073] Specifically, the pre-pressure component 50 refers to a structure capable of providing a certain pre-pressure along the first direction a. The pre-pressure component 50 is disposed on the side of the second sub-component 39 away from the second end 22 of the shaft 20. Before the hot pressing operation, the pre-pressure is first set according to the required pressure. For example, when the required pressure is 450N, the pre-pressure can be set to 440N. Then, during the hot pressing, the movable part 33 deforms in the vertical direction under the action of pressure, thereby driving the shaft 20 to move in the vertical direction, causing a change in the pressure on the pre-pressure component 50, and controlling the actual pressure applied to the IC during the operation based on the change value.

[0074] In this way, by providing a certain pre-pressure through the pre-pressure component 50, the pressure adjustment range becomes smaller and more precise, thereby improving the accuracy of pressure control during hot pressing.

[0075] like Figure 2 and Figure 5 As shown, in some embodiments, the preload assembly 50 includes a support member 51 and a pressure member 52. The support member 51 is disposed on the side of the second sub-component 39 opposite to the second end 22 and is spaced apart from the second sub-component 39. The pressure member 52 is movably disposed on the support member 51 along a first direction a to adjust the preload applied to the second sub-component 39 and the shaft 20.

[0076] Specifically, the support member 51 may be configured as a support frame, which is mounted on the side of the second sub-member 39 away from the second end 22. The support frame is supported on the first support portion 31 and the second support portion 32 of the second sub-member 39, and the middle position of the support frame is spaced apart from the second sub-member 39.

[0077] The pressure member 52 is disposed on the support member 51, and the pressure member 52 can move vertically relative to the support member 51. In this way, by moving the pressure member 52 in the vertical direction, a preload can be applied to the shaft 20 through the second sub-member 39, and the magnitude of the preload applied to the shaft 20 can be adjusted by the specific position of the pressure member 52.

[0078] In some embodiments, the pressure member 52 includes a mating part 521 and an adjusting part 522. One of the mating part 521 and the adjusting part 522 is provided with a first connecting portion (not shown in the figure), and the other is provided with a second connecting portion (not shown in the figure). The first connecting portion and the second connecting portion are movably mated and connected along a first direction a, so that the mating part 521 and the adjusting part 522 can move relative to each other along the first direction a.

[0079] Specifically, the first connecting part can be provided on the mating part 521, and the second connecting part is provided on the adjusting part 522. At this time, the first connecting part and the second connecting part are mated and connected, and the two can move relative to each other along the first direction a, thereby driving the mating part 521 and the adjusting part 522 to move relative to each other in the vertical direction.

[0080] Of course, in some other embodiments, the first connecting part may also be provided on the adjusting sub-part 522, and the second connecting part may be provided on the mating sub-part 521, with the two mating and connecting with each other.

[0081] This allows the pressure member 52 to move vertically relative to the support member 51, thereby adjusting the preload applied by the pressure member 52 to the second sub-member 39 and the shaft 20.

[0082] like Figure 7 As shown, in some embodiments, a mating groove 523 extending along the first direction a is provided on the mating part 521, and a first thread is provided on the groove wall of the mating groove 523. A second thread matching the first thread is provided on the outer peripheral surface of the adjusting part 522.

[0083] Specifically, the mating component 521 can be configured as a connecting bolt, and a mating groove 523 extending along the first direction a is formed on the connecting bolt, with the groove opening facing upwards. In addition, a first thread is formed on the inner wall of the mating groove 523.

[0084] Furthermore, the adjusting component 522 can be configured as an adjusting screw that mates with the connecting bolt, and the outer circumferential surface of the adjusting screw is provided with a second thread that matches the first thread, wherein the first thread is an internal thread and the second thread is an external thread.

[0085] The adjusting screw is inserted into the mating groove 523, and by rotating it, the adjusting screw and the connecting bolt are connected through the first thread and the second thread. When the adjusting screw is screwed in, the total length of the adjusting screw and the connecting bolt as a whole in the vertical direction decreases, that is, the preload applied to the second sub-part 39 and the shaft 20 decreases. When the adjusting screw is screwed out, the total length of the adjusting screw and the connecting bolt as a whole in the vertical direction increases, that is, the preload applied to the second sub-part 39 and the shaft 20 increases. Thus, the preload applied to the second sub-part 39 and the shaft 20 can be adjusted simply and quickly.

[0086] Understandably, in some other embodiments, the mating sub-component 521 and the adjusting sub-component 522 can also be configured with other mutually cooperating structures. For example, the mating sub-component 521 and the adjusting sub-component 522 are respectively provided with slots and blocks. By engaging the blocks with the slots at different positions, the relative position between the mating sub-component 521 and the adjusting sub-component 522 can be adjusted, thereby realizing the movement of the pressure member 52 in the vertical direction.

[0087] like Figure 2 , Figure 5 as well as Figure 6 As shown, in some embodiments, the pre-compression assembly 50 further includes a buffer 53 connected between the mating sub-assembly 521 and the support 51, and is used to provide a buffering force along the first direction a.

[0088] Specifically, the buffer 53 may be, but is not limited to, a spring, which is sleeved on the outer periphery of the mating sub-part 521 and located between the mating sub-part 521 and the support 51. In this way, the spring can provide a certain buffering force in the vertical direction during the process of the pre-pressure assembly 50 providing pre-pressure to the second sub-part 39 and the shaft 20, and during the process of the bonding head 40 performing the hot pressing operation.

[0089] In some embodiments, the bonding device 100 further includes a force gauge 60, which is connected between the preload assembly 50 and the second sub-assembly 39 along a first direction a, for measuring the preload and transmitting the preload to the second sub-assembly 39 and the shaft 20.

[0090] Specifically, the force gauge 60 can be, but is not limited to, a pressure sensor. The force gauge 60 is positioned between the mating part 521 and the second part 39. The force gauge 60 can transmit the pre-pressure formed between the mating part 521 and the adjusting part 522 to the second part 39 and the shaft 20. During the transmission process, the force gauge 60 can measure the pre-pressure in real time.

[0091] Therefore, based on the magnitude of the pre-pressure fed back by the force gauge 60, pressure can be better adjusted. Furthermore, during the hot pressing operation, the movable part 33 deforms and drives the shaft 20 to move vertically, causing the shaft 20 to press upward against the force gauge 60. At this time, the force condition on the force gauge 60 changes, and the force gauge 60 can quickly measure the change in force and determine the actual pressure applied to the IC based on the magnitude of the change, thereby adjusting the pressure more accurately and achieving high-precision control.

[0092] In some embodiments, the bonding device 100 further includes a drive member (not shown) and a control member (not shown). The drive member is driven to the main body 10, and the control member is communicatively connected to the force gauge 60 and the drive member, respectively, for receiving the measurement results of the force gauge 60 and controlling the drive member to drive the main body 10 to move along the first direction a according to the measurement results.

[0093] Specifically, the driving component may be, but is not limited to, a servo motor, which drives the main body 10 to move vertically to perform the hot pressing operation.

[0094] Furthermore, the control component can be a controller, and it is communicatively connected to both the force gauge 60 and the drive component. During the hot pressing operation, the force gauge 60 measures the actual pressure in real time and transmits the measurement result to the control component. The control component then controls the drive component in a timely manner based on the measurement result to move the main body 10 in the vertical direction, thereby achieving high-precision pressure control.

[0095] In some embodiments, the bonding device 100 further includes a heat insulation element 70 disposed between the first sub-part 38 and the bonding head 40.

[0096] It should be noted that during the hot pressing process, the connector 40 is connected to the IC and needs to provide heat and pressure to the IC. The pressure is typically controlled between 10N and 500N, while the temperature needs to reach 500℃.

[0097] Therefore, a heat insulation component 70 is provided between the first sub-component 38 and the connector 40 to isolate the heat on the connector 40, thereby preventing the heat from continuing to transfer and reducing the probability of damage to the first sub-component 38 and other structures in a high-temperature environment.

[0098] Among them, the heat insulation component 70 can be made of inorganic heat insulation material, and its heat resistance temperature needs to reach 500℃.

[0099] like Figure 8 As shown, in some embodiments, the side of the head 40 away from the movable part 33 is provided with an adsorption surface 41, and an adsorption hole 42 is provided on the adsorption surface 41 for adsorbing the target part.

[0100] Specifically, the side of the connector 40 facing away from the movable part 33 is the bottom surface of the connector 40. An adsorption surface 41 is provided on the bottom surface, and an adsorption hole 42 is opened on the adsorption surface 41. An inner cavity communicating with the adsorption hole 42 can be opened inside the connector 40. By drawing negative pressure into the inner cavity, the adsorption surface 41 and the IC can be adsorbed, thereby realizing the adsorption of the IC by the connector 40.

[0101] After the connector 40 adsorbs the IC onto the adsorption surface 41, it can move the IC and position the IC at a designated position on the COF bus to facilitate hot pressing.

[0102] According to one or more embodiments, in the actual application of this application, the IC is first adsorbed onto the adsorption surface 41 of the connector 40, and the connector 40 is used to position the IC at a designated position on the COF cable.

[0103] Furthermore, the pressure required during the hot pressing operation is adjusted by screwing in or out the adjusting screw to adjust the specific position between the adjusting screw and the connecting bolt, thereby adjusting the preload applied to the second sub-component 39 and the shaft 20.

[0104] Meanwhile, the force gauge 60, located between the second sub-component 39 and the connecting bolt, can measure the preload in real time, so as to better adjust the magnitude of the preload.

[0105] After the pre-pressure adjustment is completed, the temperature of the bonding head 40 is adjusted according to the temperature required during the hot-pressing operation, and the IC is hot-pressed onto the COF cable through the bonding head 40. At this time, under the action of pressure, the movable part 33 of the first sub-component 38 deforms upward, driving the shaft 20 to move upward. The second end 22 of the shaft 20 presses against the movable part 33 of the second sub-component 39, driving the movable part 33 of the second sub-component 39 to deform upward, and transmitting the pressure to the force gauge 60. The force gauge 60 can measure the pressure in real time and feed the measurement result back to the control component. Then, the output torque of the drive component is adjusted based on the measurement result, thereby achieving high-precision pressure control and improving the accuracy of the bonded product.

[0106] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0107] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A bonding device, characterized in that, include: The main body has a passageway extending through it in the first direction; A shaft is movably disposed in the receiving channel along the first direction; A flexible component includes a first support portion, a second support portion, and a movable portion. The first support portion and the second support portion are disposed on opposite sides of the movable portion along a direction intersecting with the first direction and are both connected to the main body. The movable portion is connected to the shaft and is spaced apart from the main body in the first direction. and The bonding head is connected to the movable part and is used to pick up and put down the target part to be bonded; The movable part is configured to drive the shaft to move along the first direction under the pressure of the head.

2. The bonding device according to claim 1, characterized in that, Both the first support portion and the second support portion have a support surface facing the main body, and the support surface abuts against the surface of the main body. The movable portion has a connecting surface facing the main body and connected to the shaft. In the first direction, the connecting surface is spaced apart from the main body.

3. The bonding device according to claim 2, characterized in that, The flexible component further includes a transition portion connecting the first support portion and the movable portion and / or the second support portion and the movable portion. The transition portion has a clearance groove on one side surface facing the main body. The clearance groove is used to provide deformation space for the movement of the movable portion in the first direction.

4. The bonding device according to claim 3, characterized in that, The clearance groove includes a first sub-groove and a second sub-groove. The first sub-groove is formed at the connection position between the transition part and the first support part or the second support part, and the second sub-groove is formed at the connection position between the transition part and the movable part.

5. The bonding device according to claim 1, characterized in that, The shaft has a first end and a second end disposed opposite to each other along the first direction. The first end is used to connect with the head, and the flexible member is connected to the first end and / or the second end.

6. The bonding device according to claim 5, characterized in that, The flexible component includes a first sub-component and a second sub-component, the first sub-component being connected to the first end and the second sub-component being connected to the second end; the first support portion, the movable portion and the second support portion of the first sub-component are arranged sequentially along a second direction, and the first support portion, the movable portion and the second support portion of the second sub-component are arranged sequentially along a third direction. The first direction, the second direction, and the third direction are arranged to intersect each other.

7. The bonding device according to claim 6, characterized in that, The bonding device further includes a pre-compression assembly disposed on the side of the second sub-component away from the second end, and used to provide pre-compression to the second sub-component and the shaft body along the first direction.

8. The bonding device according to claim 7, characterized in that, The pre-compression assembly includes a support member and a pressure member. The support member is disposed on the side of the second sub-component away from the second end and is spaced apart from the second sub-component. The pressure member is movably disposed on the support member along the first direction to adjust the pre-compression applied to the second sub-component and the shaft.

9. The bonding device according to claim 8, characterized in that, The pressure component includes a mating component and an adjusting component. One of the mating component and the adjusting component is provided with a first connecting portion, and the other is provided with a second connecting portion. The first connecting portion and the second connecting portion are movably mated and connected along the first direction, so that the mating component and the adjusting component can move relative to each other along the first direction.

10. The bonding device according to claim 9, characterized in that, The mating component has a mating groove extending along the first direction, and the groove wall is provided with a first thread. The outer peripheral surface of the adjusting component is provided with a second thread that matches the first thread.

11. The bonding device according to claim 9, characterized in that, The pre-compression assembly further includes a buffer element connected between the mating sub-component and the support element, which is used to provide a buffering force along the first direction.

12. The bonding device according to claim 7, characterized in that, The bonding device further includes a force gauge connected along the first direction between the preload assembly and the second sub-component, for measuring the preload and transmitting the preload to the second sub-component and the shaft.

13. The bonding device according to claim 12, characterized in that, The bonding device further includes a drive unit and a control unit. The drive unit is drivenly connected to the main body, and the control unit is communicatively connected to the force gauge and the drive unit, respectively, for receiving the measurement results of the force gauge and controlling the drive unit to drive the main body to move along the first direction according to the measurement results.

14. The bonding device according to claim 6, characterized in that, The bonding device further includes a heat insulation element disposed between the first sub-component and the bonding head.

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