Wafer processing rotary adsorption platform

Abstract

The invention belongs to the field of wafer processing, and particularly relates to a wafer processing rotary adsorption platform which comprises a fixed base. The end part of the fixed base is fixedly connected with a mounting seat; a driving part is fixedly connected to the inner wall of the middle part of the mounting seat; the output end of the driving part is fixedly connected with a workbench; a vacuum pump is mounted in the workbench; the output end of the vacuum pump is fixedly connected with a plurality of connecting pipes; an adsorption table is slidably connected to the inner wall of the workbench, a plurality of adsorption holes are formed in the adsorption table, and the multiple adsorption holes communicate with the multiple connecting pipes; the extrusion plate extrudes gas in the gas cylinder after the rotary adsorption platform is powered off, the gas is blown out by the spray head to drive the workbench to continue to rotate, and when the shifting piece continues to rotate along with the workbench to approach the sliding block, the second magnetic block and the first magnetic block attract each other through magnetic force to assist in driving the powered-off workbench to return to the zero position. The situation that the rotary adsorption platform loses the zero position due to power failure is reduced, and the grinding machining efficiency of the wafer after being powered on is guaranteed.

Description

Technical Field

[0001] The invention belongs to the field of wafer processing, in particular to a wafer processing rotating adsorption platform. Background Art

[0002] A wafer is a silicon chip used to make silicon semiconductor circuits. It is a key component for the high-density manufacturing of extremely large-scale integrated circuits. The wafer trimming process is one of the important links that reflects the wafer processing accuracy.

[0003] A patent application with publication number CN114454092A discloses a rotating lifting and adsorption platform for wafer grinding, including a base, a lifting plate, an adapter plate and a drive motor. A lifting plate and a vacuum adsorption groove are arranged on the base. The base is connected to the drive motor through an adapter plate, and the adapter plate is connected to a rotary joint. This application increases the range and accuracy of wafer grinding and reduces the occurrence of edge collapse by realizing multi-turn rotation of the rotating mechanism with unlimited angles.

[0004] The above-mentioned wafer rotating adsorption platform can perform multiple rotations at unlimited angles by setting a rotating mechanism, thereby increasing the grinding range of the wafer. When the wafer is subjected to a grinding and shaping process, the wafer is usually placed on the adsorption platform for adsorption and rapid rotation, and a precision grinding wheel is used to cooperate with the grinding and shaping on the surface of the wafer. However, since the rotating adsorption platform for wafer processing is prone to lose its position after power failure, it is difficult for the rotating adsorption platform to return to the zero position after power failure, and it needs to be recalibrated after power is turned on to operate normally, thereby affecting the processing efficiency of the wafer.

[0005] To this end, the present invention provides a wafer processing rotating adsorption platform. Summary of the invention

[0006] In order to make up for the deficiencies of the prior art, at least one technical problem raised in the background technology is solved.

[0007] The technical solution adopted by the present invention to solve its technical problems is: a wafer processing rotating adsorption platform described in the present invention includes a fixed base; a mounting seat is fixedly connected to the end of the fixed base; a driving member is fixedly connected to the middle inner wall of the mounting seat; the output end of the driving member is fixedly connected to a workbench; a vacuum pump is installed inside the workbench; a plurality of connecting pipes are fixedly connected to the output end of the vacuum pump; an adsorption platform is slidably connected to the inner wall of the workbench, a plurality of adsorption holes are opened on the adsorption platform, and the plurality of adsorption holes are connected to a plurality of connecting pipes; an air pipe is arranged on the outside of the fixed base; a nozzle is fixedly connected to the end of the air pipe; a transmission mechanism is arranged on the outer wall of the fixed base, and the transmission mechanism transports the gas by squeezing the gas into the air pipe, and finally the gas can be ejected by the nozzle to drive the workbench to continue to rotate and reset when the power is off.

[0008] Preferably, the transmission mechanism includes a circular frame, stirring blades and a pushing assembly; the circular frame is fixedly connected to the outer wall of the workbench; multiple stirring blades are fixedly connected to the outer wall of the circular frame, and multiple stirring blades are on the same horizontal line as the nozzle; the pushing assembly is arranged on the outer wall of the fixed base, and the pushing assembly is used to squeeze the gas to be ejected from the nozzle.

[0009] Preferably, the pushing assembly includes an air cylinder, an elastic member 1, an extrusion plate and an electromagnetic valve; the air cylinder is fixedly connected to the outer wall of the fixed base; the elastic member 1 is fixedly connected to the inner wall of the air cylinder and away from the side of the air pipe; the extrusion plate is slidably connected to the inner wall of the air cylinder; and the electromagnetic valve is fixedly connected between the air cylinder and the air pipe.

[0010] Preferably, a paddle is fixedly connected to the outer wall of the workbench and located below the circular ring frame; a sliding block is slidably connected to the inner wall of the mounting seat; an elastic member 2 is fixedly connected between the surface of the sliding block and the inner wall of the mounting seat; an electromagnet 1 is fixedly connected to the bottom end of the sliding block; a matching magnet 1 is fixedly connected to the inner wall of the mounting seat and located directly below the electromagnet 1.

[0011] Preferably, a first magnetic block is fixedly connected to the outer wall of the paddle; a second magnetic block is fixedly connected to the outer wall of the sliding block, and the first magnetic block is arranged opposite to the second magnetic block.

[0012] Preferably, a friction block is hingedly connected to the outer wall of the mounting seat via a torsion spring, and the friction block and the paddle are on the same horizontal line; an extrusion assembly is arranged outside the mounting seat, and the extrusion assembly is used to squeeze the friction block out of the outer wall of the friction paddle when the power is off.

[0013] Preferably, the bottom end of the sliding block is fixedly connected with an extension plate; the outer wall of the mounting seat is fixedly connected with an air box; the inner wall of the air box is slidably connected with an extrusion rod, the air box is connected to the friction block through a conduit, and the extrusion rod is located above the extension plate.

[0014] Preferably, a guide block is fixedly connected to the outer wall of the extrusion plate; a flow channel is opened inside the guide block; a sponge frame is fixedly connected to the side of the guide block away from the extrusion plate, and the sponge frame is connected to the flow channel; a storage box is fixedly connected to the end of the air cylinder, and a through hole is opened at the bottom end of the storage box; a sealing assembly is arranged inside the storage box, and the sealing assembly is used to control the downward flow of lubricating oil inside the storage box.

[0015] Preferably, the blocking assembly includes a third magnetic block, a fixing frame, a circulation channel and a fourth magnetic block; the third magnetic block is fixedly connected to the guide block; the fixing frame is fixedly connected to the inner wall of the storage box, and the fixing frame is located at the through hole; the circulation channel is opened in the middle of the fixing frame; the fourth magnetic block is slidably connected to the inner wall of the fixing frame, a T-shaped channel is opened on the fourth magnetic block, the T-shaped channel corresponds to the circulation channel, and the fourth magnetic block and the third magnetic block can repel each other when they are close to each other.

[0016] Preferably, a push rod is slidably connected to the middle inner wall of the workbench, and the push rod is located at the bottom end of the adsorption platform; two side baffles are relatively fixedly connected to the outer wall of the push rod; elastic parts three are fixedly connected to the middle upper surfaces of the two side baffles, and elastic parts three are fixedly connected to the inner wall of the workbench; electromagnet two is fixedly connected to the bottom end of the push rod; matching magnet two is fixedly connected to the inner wall of the workbench and located below electromagnet two.

[0017] The beneficial effects of the present invention are as follows: 1. The wafer processing rotating adsorption platform described in the present invention has an extrusion plate that squeezes the gas inside the gas cylinder after the rotating adsorption platform is powered off. The gas is blown out from the nozzle to blow multiple stirring blades to drive the workbench to continue to rotate. When the paddle continues to rotate with the workbench and approaches the sliding block, the second magnetic block and the first magnetic block are magnetically attracted to each other, thereby assisting in driving the workbench to return to the zero position after power failure, reducing the situation where the rotating adsorption platform loses its zero position due to power failure, and ensuring the grinding processing efficiency of the wafer after power is turned on.

[0018] 2. The present invention discloses a wafer processing rotating adsorption platform, which has an extension plate that slides up with the sliding block after the rotating adsorption platform is powered off, triggering the extrusion rod to squeeze the gas in the gas box to the friction block. The gas pushes the rear protrusion of the friction block to assist the friction paddle, thereby reducing the impact force generated between the paddle and the sliding block. The lubricating oil stored in the storage box is used to control the downward flow of the lubricating oil in cooperation with the magnetic force between the third magnetic block and the fourth magnetic block, thereby improving the smoothness of the sliding of the extrusion plate in the gas cylinder. The wafer is ejected after the platform is powered off by relying on the ejector rod and the side stop frame, thereby facilitating the wafer picking up after power failure. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention will be further described below in conjunction with the accompanying drawings.

[0020] Figure 1 is a stereogram of the present invention; Figure 2 It is a structural schematic diagram of the sliding block in the present invention; Figure 3 It is a structural schematic diagram of the adsorption platform in the present invention; Figure 4 It is a partial structural cross-sectional view of the gas cylinder in the present invention; Figure 5 It is a structural schematic diagram of the side guard frame in the present invention.

[0021] In the figure: 1. fixed base; 11. mounting base; 12. driving member; 13. working table; 14. connecting pipe; 15. adsorption table; 16. air pipe; 17. nozzle; 2. circular ring frame; 21. stirring fan blade; 3. air cylinder; 31. elastic member 1; 32. extrusion plate; 33. solenoid valve; 4. paddle; 41. sliding block; 42. elastic member 2; 43. electromagnet 1; 44. matching magnet 1; 5. magnetic block 1; 51. magnetic block 2; 6. friction block; 7. extension plate; 71. air box; 72. extrusion rod; 8. guide block; 81. sponge rack; 82. storage box; 9. magnetic block 3; 91. fixed frame; 92. circulation channel; 93. magnetic block 4; 94. ejector rod; 95. side stop frame; 96. elastic member 3; 97. electromagnet 2; 98. matching magnet 2. DETAILED DESCRIPTION

[0022] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0023] like Figures 1 to 4As shown, a wafer processing rotating adsorption platform described in an embodiment of the present invention comprises a fixed base 1; a mounting seat 11 is fixedly connected to the end of the fixed base 1; a driving member 12 is fixedly connected to the inner wall of the middle of the mounting seat 11; a workbench 13 is fixedly connected to the output end of the driving member 12, and the driving member 12 is used to drive the workbench 13 to rotate. The driving member 12 of this application is a motor; a vacuum pump is installed inside the workbench 13; a plurality of connecting pipes 14 are fixedly connected to the output end of the vacuum pump; an adsorption platform 15 is slidably connected to the inner wall of the workbench 13, and a plurality of adsorption holes are opened on the adsorption platform 15, and the plurality of adsorption holes are connected to the plurality of connecting pipes 14; an air pipe 16 is arranged on the outside of the fixed base 1; a nozzle 17 is fixedly connected to the end of the air pipe 16; a transmission mechanism is arranged on the outer wall of the fixed base 1, and the transmission mechanism transports the gas by squeezing the gas into the air pipe 16, and finally the gas can be ejected by the nozzle 17 when the power is off to drive the workbench 13 to continue to rotate and repeat. When grinding the wafer, first place the wafer on the workbench 13 and locate it on the upper surface of the adsorption platform 15. The fixed base 1 serves as the main supporting mechanism of the wafer processing rotating adsorption platform, and cooperates with the mounting seat 11 and the driving member 12 to support the workbench 13. The precision grinding wheel is placed on the upper surface of the wafer. The vacuum pump cooperates with multiple connecting pipes 14 and multiple adsorption holes to tightly vacuum adsorb the wafer. As the output end of the driving member 12 drives the workbench 13 to rotate rapidly, the initial position of the wafer is zero position. After the workbench 13 rotates, it leaves the zero position and the precision grinding wheel grinds the wafer. During the grinding process, if the wafer processing rotating adsorption platform is powered off, the transmission mechanism squeezes the gas into the interior of the air pipe 16, and then the gas is ejected from the nozzle 17 at one end of the air pipe 16. The transmission mechanism drives the workbench 13 to continue to rotate, so that the workbench 13 can rotate back to the zero position, reducing the situation where the rotating adsorption platform loses its zero position due to power failure, and ensuring the grinding efficiency of the wafer after power is turned on.

[0024] like Figures 1 to 3 As shown, the transmission mechanism includes a circular frame 2, a stirring blade 21 and a pushing assembly; the circular frame 2 is fixedly connected to the outer wall of the workbench 13; a plurality of the stirring blades 21 are fixedly connected to the outer wall of the circular frame 2, and the plurality of stirring blades 21 are on the same horizontal line as the nozzle 17; the pushing assembly is arranged on the outer wall of the fixed base 1, and the pushing assembly is used to squeeze the gas to be ejected from the nozzle 17; when the wafer processing rotating adsorption platform loses its zero position after power failure, the pushing assembly is used to squeeze the gas into the air pipe 16, and finally the gas is ejected from the nozzle 17, and the gas blows the plurality of stirring blades 21 on the circular frame 2 to rotate, and then the plurality of stirring blades 21 drive the workbench 13 to continue to rotate, and the driving member 12 will not be locked due to power failure, and the gas squeezed by the pushing assembly can drive the workbench 13 back to the zero position, which plays a role in returning the workbench 13 to the zero position after power failure, and at the same time, the rotation of the plurality of stirring blades 21 can blow air, and the wind blows the rotating adsorption platform to achieve the effect of heat dissipation.

[0025] like Figures 1 to 4 As shown, the pushing assembly includes an air cylinder 3, an elastic member 31, an extrusion plate 32 and an electromagnetic valve 33; the air cylinder 3 is fixedly connected to the outer wall of the fixed base 1; the elastic member 31 is fixedly connected to the inner wall of the air cylinder 3 and the side away from the air pipe 16; the extrusion plate 32 is slidably connected to the inner wall of the air cylinder 3; the electromagnetic valve 33 is fixedly connected between the air cylinder 3 and the air pipe 16; when the power is cut off and the workbench 13 is driven to return to the zero position, the gas is first injected from the nozzle 17, and the injected gas flows along the air pipe 16 through the electromagnetic valve 33 opened at this time to reach the inside of the air cylinder 3, and as the gas continues to The gas is injected into the gas cylinder 3, and the gas pushes the extrusion plate 32 to slide and squeeze the elastic member 31 to contract. When the injected gas is sufficient to drive the workbench 13 to return to the zero position after power failure, the solenoid valve 33 is closed. When the rotating adsorption platform drives the wafer grinding to be powered off, the solenoid valve 33 opens automatically after power failure, and the elastic member 31 cooperates with the extrusion plate 32 to squeeze the gas injected into the gas cylinder 3. The gas is squeezed and sent to the nozzle 17 through the gas flow pipe 16 for spraying. The gas blows multiple stirring blades 21 to drive the workbench 13 to continue to rotate and return to the zero position, thereby squeezing the gas to reset the workbench 13 after power failure.

[0026] like Figures 1 to 3 As shown, the outer wall of the workbench 13 and the lower part of the circular frame 2 are fixedly connected with a paddle 4; the inner wall of the mounting seat 11 is slidably connected with a sliding block 41; an elastic member 42 is fixedly connected between the surface of the sliding block 41 and the inner wall of the mounting seat 11; an electromagnet 43 is fixedly connected to the bottom end of the sliding block 41; a matching magnet 44 is fixedly connected to the inner wall of the mounting seat 11 and directly below the electromagnet 43; since it is difficult to accurately control whether the position of the workbench 13 returning to zero position when the gas blowing workbench 13 continues to rotate and return to zero position, before the workbench 13 that is powered off continues to rotate and return to zero position, the matching magnet 44 is used to electromagnetically attract the electromagnet 43. 3. The electromagnet 1 43 pulls the sliding block 41 down the inner wall of the sliding mounting seat 11, and the elastic member 2 42 is pulled and stressed. The paddle 4 is fixed on the workbench 13 and can rotate synchronously with the workbench 13. At this time, the paddle 4 rotates and does not contact the sliding block 41. After the rotating adsorption platform is powered off, the workbench 13 is driven by the squeezed gas to continue to rotate. The magnet 1 44 is powered off to release the electromagnet 1 43. The elastic force of the elastic member 2 42 pulls the sliding block 41 to slide up, so that the protruding part of the sliding block 41 can intercept the paddle 4. After the paddle 4 is blocked by the protruding part of the sliding block 41, the workbench 13 returns to zero position, which plays a role in assisting the rotating adsorption platform to return to zero position.

[0027] The outer wall of the paddle 4 is fixedly connected to a magnetic block 1 5; the outer wall of the sliding block 41 is fixedly connected to a magnetic block 2 51, and the magnetic block 1 5 is arranged opposite to the magnetic block 2 51; when the rotating adsorption platform is powered off and the sliding block 41 slides up to intercept the paddle 4, the paddle 4 is prone to collide with the sliding block 41 and return to the misalignment. The magnetic block 2 51 is fixed to one side of the sliding block 41, and when the paddle 4 continues to rotate close to the sliding block 41, the magnetic block 2 51 generates magnetic attraction to the close magnetic block 1 5, so that the workbench 13 connected to the paddle 4 can return to the zero position more accurately.

[0028] The outer wall of the mounting seat 11 is hinged with a friction block 6 through a torsion spring, and the friction block 6 and the paddle 4 are on the same horizontal line; an extrusion assembly is arranged on the outside of the mounting seat 11, and the extrusion assembly is used to squeeze the friction block 6 out of the outer wall of the friction paddle 4 when the power is off; when the workbench 13 continues to drive the paddle 4 to rotate after the rotating adsorption platform is powered off, the power off triggers the sliding block 41 to drive the extrusion assembly to move, and the extrusion assembly synchronously squeezes gas into the interior of the mounting seat 11, and then the squeezed gas pushes the tail of the friction block 6 hinged by the torsion spring close to the sliding block 41 to rotate, and the friction block 6 can locally rub the paddle 4 rotating with the workbench 13, play a role in buffering the paddle 4, and reduce the impact force of the direct collision between the paddle 4 and the sliding block 41. After power is turned on, the magnet 44 can magnetically attract the electromagnet 43 to reset, and the friction block 6 loses the push of the squeezing gas, and the friction block 6 is pulled and reset by the torsion spring.

[0029] The bottom end of the sliding block 41 is fixedly connected to an extension plate 7; the outer wall of the mounting seat 11 is fixedly connected to an air box 71; the inner wall of the air box 71 is slidably connected to an extrusion rod 72, the air box 71 is connected to the friction block 6 through a conduit, and the extrusion rod 72 is located above the extension plate 7; when the friction block 6 hinged to the torsion spring is pushed, the elastic force of the elastic member 42 pulls the sliding block 41 to drive the extension plate 7 to slide up, and the extension plate 7 squeezes the extrusion rod 72 to slide up synchronously, and the extrusion rod 72 squeezes the gas inside the air box 71 to be sent to the friction block 6 inside the mounting seat 11 through the conduit, and the gas can push the tail of the friction block 6 to extend outward from the friction paddle 4, thereby playing a role in resetting and buffering the paddle 4.

[0030] like Figures 1 to 4As shown, the outer wall of the extrusion plate 32 is fixedly connected with a guide block 8; a flow channel is provided inside the guide block 8; a sponge frame 81 is fixedly connected to the side of the guide block 8 away from the extrusion plate 32, and the sponge frame 81 is connected to the flow channel; a storage box 82 is fixedly connected to the end of the air cylinder 3, and a through hole is provided at the bottom of the storage box 82; a blocking component is provided inside the storage box 82, and the blocking component is used to control the lubricating oil inside the storage box 82 to flow down; when the extrusion plate 32 is stuck after long-term use, lubricating oil is added to the storage box 82 in advance, and the lubricating oil flows down to the inside of the guide block 8 through the blocking component and the through hole, and the lubricating oil wets the sponge frame 81 along the flow channel. As the elastic member 31 pushes the sponge frame 81, the guide block 8 and the extrusion plate 32 to slide, the lubricating oil attached to the sponge frame 81 can lubricate the inner wall of the air cylinder 3, and continue to slide on the inner wall of the air cylinder 3 after lubrication when the extrusion plate 32 is reset, thereby reducing the occurrence of jamming caused by the sliding of the extrusion plate 32.

[0031] The blocking assembly includes a magnetic block three 9, a fixing frame 91, a circulation channel 92 and a magnetic block four 93; the magnetic block three 9 is fixedly connected to the guide block 8; the fixing frame 91 is fixedly connected to the inner wall of the storage box 82, and the fixing frame 91 is located at the through hole; the circulation channel 92 is opened in the middle of the fixing frame 91; the magnetic block four 93 is slidably connected to the inner wall of the fixing frame 91, and a T-shaped channel is opened on the magnetic block four 93, the T-shaped channel corresponds to the circulation channel 92, and the magnetic block four 93 and the magnetic block three 9 can repel each other when they are close to each other; when the lubricating oil flows into the sponge frame 81, the magnetic block three 9 on the guide block 8 is close to the corresponding magnetic block four 93, and the magnetic Block three 9 utilizes magnetic force to repel magnetic block four 93 to slide up the inner wall of fixed frame 91, so that the T-shaped channel of magnetic block four 93 is connected with circulation channel 92, and the lubricating oil inside storage box 82 flows down to magnetic block three 9 through circulation channel 92 and T-shaped channel, and is sent to sponge frame 81 for lubrication along circulation channel 92 of guide block 8. When elastic member one 31 squeezes and pushes magnetic block three 9 on guide block 8 away from magnetic block four 93, magnetic block four 93 slides down by itself due to the disappearance of repulsive magnetic force, and T-shaped channel and circulation channel 92 are misaligned and blocked, and the lubricating oil inside storage box 82 no longer flows down, thereby controlling the flow of lubricating oil inside storage box 82.

[0032] like Figures 1 to 3 , Figure 5As shown, the middle inner wall of the workbench 13 is slidably connected with a push rod 94, and the push rod 94 is located at the bottom end of the adsorption platform 15; the outer wall of the push rod 94 is relatively fixedly connected to two side blocks 95; the middle upper surfaces of the two side blocks 95 are fixedly connected with elastic members 3 96, and the elastic members 3 96 are fixedly connected to the inner wall of the workbench 13; the bottom end of the push rod 94 is fixedly connected with electromagnet 2 97; the inner wall of the workbench 13 and below the electromagnet 2 97 are fixedly connected with matching magnet 2 98; when the rotating adsorption platform is powered off, the wafer is placed in the groove generated between the adsorption platform 15 and the workbench 13 and is difficult to take out, and the wafer is set After the power is turned off, the matching magnet 2 98 cancels the magnetic attraction of the electromagnet 2 97, and the two elastic parts 3 96 pull the two side blocks 95 and the push rod 94 up. The push rod 94 can push the wafer out above the upper surface of the workbench 13, and the protruding parts of the two side blocks 95 can assist in limiting the wafer, thereby reducing the occurrence of wafer falling off and damage during ejection. At the same time, when the rotating adsorption platform is powered on and the wafer is placed on the adsorption platform 15 for grinding, the matching magnet 2 98 is powered on to magnetically attract the electromagnet 2 97 to pull the push rod 94 and the two side blocks 95 to reset, and the two elastic parts 3 96 are pulled by force, which plays a role in ejecting the wafer for easy picking.

[0033] Working process: When grinding the wafer, first place the wafer on the workbench 13 and locate it on the upper surface of the adsorption platform 15. The fixed base 1 is used as the main supporting mechanism of the wafer processing rotating adsorption platform, and cooperates with the mounting seat 11 and the driving member 12 to support the workbench 13. The precision grinding wheel is placed on the upper surface of the wafer. The vacuum pump cooperates with multiple connecting pipes 14 and multiple adsorption holes to tightly vacuum adsorb the wafer. As the output end of the driving member 12 drives the workbench 13 to rotate rapidly, the initial position of the wafer is zero. After the workbench 13 rotates, it leaves the zero position, and the precision grinding wheel grinds the wafer. During the grinding process, the power of the wafer processing rotating adsorption platform is cut off, and the transmission mechanism squeezes the gas into the interior of the air pipe 16, and then the gas is ejected from the nozzle 17 at one end of the air pipe 16, and the transmission mechanism drives the workbench 13 to continue to rotate, so that the workbench 13 can rotate and return to the zero position, thereby reducing the situation where the rotating adsorption platform loses the zero position due to power failure, and ensuring the grinding efficiency of the wafer after power is turned on; when the wafer processing rotating adsorption platform loses the zero position after power is cut off, the push component is used to squeeze the gas into the air pipe 16, and finally the gas is ejected from the nozzle 17, and the gas blows multiple stirring wheels on the circular frame 2 The moving fan blades 21 rotate, and then the multiple stirring fan blades 21 drive the workbench 13 to continue to rotate. The driving member 12 will not be locked due to power failure. The gas squeezed by the pushing component can drive the workbench 13 to rotate back to the zero position, which plays a role in returning the workbench 13 to the zero position after power failure. At the same time, the rotation of the multiple stirring fan blades 21 can blow air, and the wind blows the rotating adsorption platform to achieve the effect of heat dissipation. Before the workbench 13 returns to the zero position after power failure, the gas is first injected from the nozzle 17, and the injected gas reaches the interior of the gas cylinder 3 along the air pipe 16 through the solenoid valve 33 opened at this time, and as the gas continues Inject gas into the gas cylinder 3, and the gas pushes the extrusion plate 32 to slide and squeeze the elastic member 31 to contract and bear force, until the injected gas is sufficient to drive the workbench 13 to return to zero position after power failure, and the solenoid valve 33 is closed. When the rotating adsorption platform drives the wafer grinding to be powered off, the solenoid valve 33 automatically opens after power failure, and the elastic member 31 cooperates with the extrusion plate 32 to squeeze the gas injected into the gas cylinder 3. The gas is squeezed and sent to the nozzle 17 through the gas flow pipe 16 for spraying. The gas blows the multiple stirring blades 21 to drive the workbench 13 to continue to rotate and return to zero position, which plays the role of squeezing the gas to reset the workbench 13 after power failure. When the gas blows the workbench 13 and continues to rotate to return to the zero position, it is difficult to accurately control whether the position of the workbench 13 returns to exceed the zero position. Before the workbench 13 that is powered off continues to rotate to return to the zero position, the matching magnet 144 is used to electromagnetically attract the electromagnet 143. The electromagnet 143 pulls the sliding block 41 down the inner wall of the sliding mounting seat 11. The elastic member 2 42 is pulled and stressed. The paddle 4 is fixed on the workbench 13 and can rotate synchronously with the workbench 13. At this time, the paddle 4 rotates and does not contact the sliding block 41. After the rotating adsorption platform is powered off, the workbench 13 is driven by the squeezed gas to continue to rotate, and the matching magnet 144 is powered off to release the electromagnet 143. The elastic force of the second elastic member 42 pulls the sliding block 41 upward, so that the protruding portion of the sliding block 41 can intercept the paddle 4. After the paddle 4 is intercepted by the protruding portion of the sliding block 41, the workbench 13 returns to zero position, which plays a role in assisting the rotary adsorption platform to return to zero position; when the rotary adsorption platform is powered off and the sliding block 41 slides upward to intercept the paddle 4, the paddle 4 is prone to collide with the sliding block 41 and return to misalignment. The second magnetic block 51 is fixed to one side of the sliding block 41. When the paddle 4 continues to rotate close to the sliding block 41, the second magnetic block 51 generates magnetic attraction to the adjacent magnetic block 1 5, so that the workbench 13 connected to the paddle 4 can return to zero position more accurately. When the rotating adsorption platform is powered off, the workbench 13 continues to drive the paddle 4 to rotate, and the power off triggers the sliding block 41 to drive the extrusion component to move. The extrusion component synchronously squeezes gas into the interior of the mounting seat 11, and then the squeezed gas pushes the tail of the friction block 6 hinged on the torsion spring close to the sliding block 41 to rotate. The friction block 6 can locally rub the paddle 4 rotating with the workbench 13, and play a buffering role for the paddle 4, reducing the impact force of the direct collision between the paddle 4 and the sliding block 41. After power is turned on, the magnet 1 44 can magnetically attract the electromagnet 1 43 to reset, and the friction block 6 loses the push of the squeezing gas, and the friction block 6 is reset with the pulling of the torsion spring; when the friction block 6 hinged on the torsion spring is pushed, the elastic member 2 42 elastically pulls the sliding block 41 to drive the extension plate 7 to slide up, and the extension plate 7 squeezes the squeezing rod 72 to slide up synchronously, and the squeezing rod 72 squeezes the gas inside the gas box 71 and sends it to the friction block 6 inside the mounting seat 11 through the conduit. The gas can push the tail of the friction block 6 to extend outward from the friction paddle 4, playing a buffering role for the reset of the paddle 4; When the squeezing plate 32 becomes stuck after long-term use, lubricating oil is added to the storage box 82 in advance, and the lubricating oil flows down to the inside of the guide block 8 through the sealing component and the through hole, and the lubricating oil wets the sponge frame 81 along the flow channel. As the elastic member 31 pushes the sponge frame 81, the guide block 8 and the squeezing plate 32 to slide, the lubricating oil attached to the sponge frame 81 can lubricate the inner wall of the air cylinder 3. When the squeezing plate 32 is reset, it continues to slide on the inner wall of the lubricated air cylinder 3, thereby reducing the occurrence of squeezing plate 32 sliding and causing jamming. When the lubricating oil flows into the sponge frame 81, at this time, the magnetic block 3 9 on the guide block 8 is close to the corresponding magnetic block 4 93, and the magnetic Block three 9 uses magnetic force to repel magnetic block four 93 to slide on the inner wall of fixed frame 91, so that the T-shaped channel of magnetic block four 93 is connected with circulation channel 92, and the lubricating oil inside storage box 82 flows down to magnetic block three 9 through circulation channel 92 and T-shaped channel, and is sent to sponge frame 81 for lubrication along circulation channel 92 of guide block 8. When elastic member one 31 squeezes and pushes magnetic block three 9 on guide block 8 away from magnetic block four 93, magnetic block four 93 slides down by itself due to the disappearance of repulsive magnetic force, and T-shaped channel and circulation channel 92 are misaligned and blocked, and lubricating oil inside storage box 82 no longer flows down, which plays a role in controlling the downflow of lubricating oil inside storage box 82. When the rotating adsorption platform is powered off, the wafer is placed in the groove between the adsorption platform 15 and the workbench 13 and is difficult to take out. The matching magnet 2 98 is powered off to cancel the magnetic attraction of the electromagnet 2 97, and the two elastic parts 3 96 pull the two side blocks 95 and the push rod 94 up. The push rod 94 can push the wafer out above the upper surface of the workbench 13, and the protruding parts of the two side blocks 95 can assist in limiting the wafer and reduce the occurrence of wafer falling and damage when it is ejected. At the same time, when the rotating adsorption platform is powered on and the wafer is placed on the adsorption platform 15 for grinding, the matching magnet 2 98 is powered on to magnetically attract the electromagnet 2 97 to pull the push rod 94 and the two side blocks 95 to reset, and the two elastic parts 3 96 are pulled by force to eject the wafer for easy picking.

[0034] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A wafer processing rotating adsorption platform, characterized in that: The invention comprises a fixed base (1); a mounting base (11) is fixedly connected to the fixed base (1); a driving member (12) is fixedly connected inside the mounting base (11); a workbench (13) is fixedly connected to the output end of the driving member (12), and the driving member is used to drive the workbench to rotate; a vacuum pump is installed inside the workbench (13); a plurality of connecting pipes (14) are fixedly connected to the output end of the vacuum pump; an adsorption platform (15) is slidably connected to the inner wall of the workbench (13), and a plurality of adsorption holes are provided on the adsorption platform (15), and the plurality of adsorption holes are connected to the plurality of connecting pipes (14); an air pipe (16) is arranged outside the fixed base (1); a nozzle (17) is fixedly connected to the end of the air pipe (16); a transmission mechanism is arranged on the outer wall of the fixed base (1), and the transmission mechanism transports gas by squeezing gas into the air pipe (16), and finally the gas can be ejected by the nozzle (17) when the power is off to drive the workbench (13) to continue rotating and resetting.

2. The wafer processing rotating adsorption platform according to claim 1, characterized in that: The transmission mechanism comprises a circular frame (2), a stirring blade (21) and a pushing assembly; the circular frame (2) is fixedly connected to the outer wall of the workbench (13); a plurality of the stirring blades (21) are fixedly connected to the outer wall of the circular frame (2), and the plurality of stirring blades (21) and the nozzle (17) are on the same horizontal plane; the pushing assembly is arranged on the outer wall of the fixed base (1), and is used for squeezing gas to be ejected from the nozzle (17).

3. The wafer processing rotating adsorption platform according to claim 2, characterized in that: The pushing assembly comprises an air cylinder (3), an elastic member 1 (31), an extrusion plate (32) and an electromagnetic valve (33); the air cylinder (3) is fixedly connected to the outer wall of the fixed base (1); the elastic member 1 (31) is fixedly connected to the inner wall of the air cylinder (3) and the side away from the air pipe (16); the extrusion plate (32) is slidably connected to the inner wall of the air cylinder (3); and the electromagnetic valve (33) is fixedly connected between the air cylinder (3) and the air pipe (16).

4. The wafer processing rotating adsorption platform according to claim 2, characterized in that: A paddle (4) is fixedly connected to the outer wall of the workbench (13) and located below the circular frame (2); a sliding block (41) is slidably connected to the inner wall of the mounting seat (11); a second elastic member (42) is fixedly connected between the surface of the sliding block (41) and the inner wall of the mounting seat (11); an electromagnet (43) is fixedly connected to the bottom end of the sliding block (41); and a matching magnet (44) is fixedly connected to the inner wall of the mounting seat (11) and located directly below the electromagnet (43).

5. The wafer processing rotating adsorption platform according to claim 4, characterized in that: A first magnetic block (5) is fixedly connected to the outer wall of the plectrum (4); a second magnetic block (51) is fixedly connected to the outer wall of the sliding block (41), and the first magnetic block (5) and the second magnetic block (51) are arranged opposite to each other.

6. The wafer processing rotating adsorption platform according to claim 4, characterized in that: The outer wall of the mounting seat (11) is connected to a friction block (6) via a torsion spring, and the friction block (6) and the paddle (4) are on the same horizontal plane; an extrusion assembly is arranged outside the mounting seat (11), and the extrusion assembly is used to squeeze the friction block (6) out of the outer wall of the friction paddle (4) when power is off.

7. The wafer processing rotating adsorption platform according to claim 6, characterized in that: The bottom end of the sliding block (41) is fixedly connected to an extension plate (7); the outer wall of the mounting seat (11) is fixedly connected to an air box (71); the inner wall of the air box (71) is slidably connected to an extrusion rod (72); the air box (71) is connected to the friction block (6) through a conduit, and the extrusion rod (72) is located above the extension plate (7).

8. The wafer processing rotating adsorption platform according to claim 3, characterized in that: A guide block (8) is fixedly connected to the outer wall of the extrusion plate (32); a flow channel is provided inside the guide block (8); a sponge frame (81) is fixedly connected to a side of the guide block (8) away from the extrusion plate (32), and the sponge frame (81) is connected to the flow channel; a storage box (82) for storing lubricating oil is fixedly connected to the end of the air cylinder (3), and a through hole is provided at the bottom end of the storage box (82); a blocking component is provided inside the storage box (82), and the blocking component is used to control the downward flow of lubricating oil inside the storage box (82).

9. The wafer processing rotating adsorption platform according to claim 8, characterized in that: The blocking component comprises a third magnetic block (9), a fixing frame (91), a circulation channel (92) and a fourth magnetic block (93); the third magnetic block (9) is fixedly connected to the guide block (8); the fixing frame (91) is fixedly connected to the inner wall of the storage box (82), and the fixing frame (91) is located at the through hole; the circulation channel (92) is opened in the fixing frame (91); the fourth magnetic block (93) is slidably connected to the inner wall of the fixing frame (91), a T-shaped channel is opened on the fourth magnetic block (93), the T-shaped channel corresponds to the circulation channel (92), and the fourth magnetic block (93) and the third magnetic block (9) can repel each other when they are close to each other.

10. The wafer processing rotating adsorption platform according to claim 1, characterized in that: The middle inner wall of the workbench (13) is slidably connected to a push rod (94), and the push rod (94) is located at the bottom end of the adsorption platform (15); the outer wall of the push rod (94) is relatively fixedly connected to two side blocks (95); the middle upper surfaces of the two side blocks (95) are fixedly connected to an elastic member three (96), and the elastic member three (96) is fixedly connected to the inner wall of the workbench (13); the bottom end of the push rod (94) is fixedly connected to an electromagnet two (97); and a matching magnet two (98) is fixedly connected to the inner wall of the workbench (13) and located below the electromagnet two (97).

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