Chip packaging piece

Abstract

The invention discloses a chip packaging piece, and relates to the field of semiconductor packaging, the chip packaging piece comprises a substrate, the top of the substrate is provided with a chip, the top of the chip is provided with a heat dissipation layer, the bottom of the substrate is provided with a heat dissipation groove, and the heat dissipation groove penetrates from the front side of the substrate to the rear side of the substrate. A plurality of heat dissipation fins are fixedly connected to the top of the heat dissipation groove at equal intervals. Copper columns are arranged on the left side and the right side of the top of the substrate, the copper columns and the chips are arranged at intervals, and the left side and the right side of the top of each chip are connected with wires. According to the invention, the heat dissipation layer realizes heat dissipation of the top of the chip, the front, rear, left and right sides of the chip are in an exposed state, heat dissipation is facilitated, the substrate at the bottom of the chip can also realize heat dissipation of the chip, the heat on the substrate is conducted out by the heat dissipation fins and is discharged through the heat dissipation grooves, the heat dissipation effect of the chip is greatly improved, and the heat dissipation efficiency of the chip is improved. Normal operation of functions of the chip packaging piece is guaranteed, and meanwhile the service life of the chip packaging piece is guaranteed.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor packaging, in particular to a chip packaging component. Background Art

[0002] A chip package is a component that encapsulates an integrated circuit chip in a certain material to protect the chip, provide electrical connections, and facilitate plugging or installation on a circuit board. The package can also dissipate heat for the chip and prevent static electricity. Common chip packaging forms include bare die packaging, surface mount packaging, QFN packaging, BGA packaging, etc.

[0003] After searching, a utility model patent of China Patent Application with publication number CN212848366U discloses a chip package, including a substrate, a chip, a wiring layer and a heat dissipation layer for heat dissipation of the chip; the substrate is provided with a chip through hole for accommodating the chip; the chip is provided with a pin for connecting the chip circuit with an external circuit; the heat dissipation layer is provided on the top surface of the substrate, and the heat dissipation layer includes a silicone grease layer, a first metal layer and a second metal layer connected in sequence; the first metal layer is connected to the chip through the silicone grease layer; the first metal layer is provided with a cavity for filling heat dissipation gel; the second metal layer is composed of foam metal sintered on the first metal layer; the wiring layer is provided on the bottom surface of the substrate and is electrically connected to the chip, and the chip is electrically connected to external components through the wiring layer. This application can effectively dissipate heat for the chip and has a protective effect on the chip.

[0004] In the above patent application documents, the heat dissipation of the chip is mainly achieved through the heat dissipation layer on the top of the chip. The heat dissipation structure is single, resulting in a weak overall heat dissipation result of the chip package and failure to achieve good heat dissipation, thereby affecting the function and service life of the chip package. For this reason, the present invention provides a chip package. Summary of the invention

[0005] The technical problem solved by the present invention is: in the prior art, the heat dissipation of the chip is mainly achieved through the heat dissipation layer on the top of the chip. The heat dissipation structure is single, resulting in weak overall heat dissipation of the chip package and failure to achieve good heat dissipation, thereby affecting the function and service life of the chip package.

[0006] The present invention can be implemented through the following technical scheme: a chip package includes a substrate, a chip is arranged on the top of the substrate, a heat dissipation layer is arranged on the top of the chip, a heat dissipation groove is opened at the bottom of the substrate, the heat dissipation groove runs through from the front side of the substrate to the back side of the substrate, and a plurality of heat dissipation fins are fixedly connected at equal intervals on the top of the heat dissipation groove; copper columns are arranged on the left and right sides of the top of the substrate, the copper columns are arranged at intervals from the chip, and the left and right sides of the top of the chip are connected with wires.

[0007] A further technical improvement of the present invention is that the substrate and the chip are connected by a thermally conductive adhesive, and the chip and the heat dissipation layer are also connected by a thermally conductive adhesive.

[0008] A further technical improvement of the present invention is that: the substrate is installed in a lower packaging shell, and the top of the lower packaging shell is detachably connected to the upper packaging shell; the left and right sides of the bottom of the lower packaging shell are fixed with supporting feet, and the bottom of the lower packaging shell is provided with multiple heat sinks between the two supporting feet.

[0009] A further technical improvement of the present invention is that a first connecting plate is fixedly connected to the top periphery of the lower packaging shell, and a second connecting plate is fixedly connected to the bottom periphery of the upper packaging shell. Threaded holes are provided at corresponding positions of the first connecting plate and the second connecting plate, and the first connecting plate and the second connecting plate are connected by screws.

[0010] A further technical improvement of the present invention lies in that rectangular blocks are fixedly connected to the left and right inner walls of the lower packaging shell, the distance between the opposite surfaces of the two rectangular blocks is equal to the horizontal length of the substrate, a through hole is opened on the horizontal side of the rectangular block, one end of the through hole passes through the side wall of the lower packaging shell, and a limit rod is slidably arranged in the through hole.

[0011] A further technical improvement of the present invention lies in that: a chamfered surface obliquely pointing downward is provided at one end of the limit rod located inside the lower packaging shell, and a chamfered surface obliquely pointing downward is also provided at the bottom corner of the substrate; a first spring is connected between the shoulder of the limit rod located outside the lower packaging shell and the outer wall of the lower packaging shell; when the first spring is at its original length, one end of the limit rod is located above the substrate and is tightly attached to the top of the substrate.

[0012] A further technical improvement of the present invention is that a through slot is provided on the top of the upper packaging shell, a heat dissipation frame is inserted into the through slot, and a heat dissipation net is fixedly connected to the inner wall of the heat dissipation frame.

[0013] A further technical improvement of the present invention is that: the outer wall of the heat dissipation frame is provided with a U-shaped card plate, and the U-shaped card plate includes a vertical plate and two mutually parallel horizontal plates, the two horizontal plates are fixedly connected to the top and bottom of the vertical plate, and the outer wall of the heat dissipation frame is provided with a U-shaped U-shaped slide groove, and the U-shaped card plate is slidably set in the U-shaped slide groove, and a second spring is fixedly connected to one side of the vertical plate, and the other end of the second spring is fixedly connected to the inner wall of the U-center slide groove; when the second spring is at its original length, the two horizontal plates extend out of the U-shaped slide groove, and the two horizontal plates respectively abut against the side walls of the upper packaging shell.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] 1. In the present invention, the heat dissipation layer realizes the heat dissipation of the top of the chip, and the front, back, left and right sides of the chip are in an exposed state, which is convenient for heat dissipation. In addition, the substrate at the bottom of the chip can also realize the heat dissipation of the chip. The heat dissipation fins conduct the heat on the substrate and discharge it through the heat dissipation groove, which greatly improves the heat dissipation effect of the chip, ensures the normal operation of the chip package, and at the same time ensures the service life of the chip package.

[0016] 2. In the present invention, by placing the substrate downward into the lower packaging shell, the bottom of the substrate squeezes the end of the limit rod, causing the two limit rods to move in the direction away from the substrate. At this time, the first spring is stretched and deformed. When the bottom of the substrate contacts the bottom inner wall of the lower packaging shell, the horizontal restriction of the limit rod by the substrate disappears. At this time, under the action of the elastic force of the first spring, the limit rod will retreat and move to the top of the substrate, that is, the bottom of the limit rod is tightly attached to the top of the substrate, thereby realizing the restriction of the vertical displacement of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to facilitate understanding by those skilled in the art, the present invention is further described below with reference to the accompanying drawings.

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0019] Figure 2 For the present invention Figure 1 A partial enlarged view of the substrate and chip;

[0020] Figure 3 For the present invention Figure 1 A partial enlarged view of the middle A;

[0021] Figure 4 For the present invention Figure 1 A partial enlarged view of point B in the middle;

[0022] Figure 5 For the present invention Figure 1 A partial enlarged view of point C in the middle.

[0023] In the figure: 1. substrate; 2. chip; 3. heat dissipation layer; 4. heat dissipation groove; 5. heat dissipation fins; 6. copper pillars; 7. thermal conductive adhesive; 8. lower package shell; 9. upper package shell; 10. support feet; 11. heat sink; 12. first connecting plate; 13. second connecting plate; 14. screws; 15. rectangular block; 16. limit rod; 17. first spring; 18. heat dissipation frame; 19. U-shaped card plate; 20. U-shaped slide groove; 21. second spring. DETAILED DESCRIPTION

[0024] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the specific implementation method, structure, characteristics and effects of the present invention are described in detail below in combination with the accompanying drawings and preferred embodiments.

[0025] See also Figure 1-Figure 5 As shown, a chip package comprises a substrate 1, a chip 2 is arranged on the top of the substrate 1, a heat dissipation layer 3 is arranged on the top of the chip 2, a heat dissipation groove 4 is opened at the bottom of the substrate 1, the heat dissipation groove 4 runs through the front side of the substrate 1 to the back side of the substrate 1, and a plurality of heat dissipation fins 5 are fixedly connected to the top of the heat dissipation groove 4 at equal intervals; copper pillars 6 are arranged on the left and right sides of the top of the substrate 1, the copper pillars 6 are arranged at intervals from the chip 2, and the left and right sides of the top of the chip 2 are connected with wires; the heat dissipation layer 3 realizes the heat dissipation of the top of the chip 2, the front, back, left and right sides of the chip 2 are in a bare state, which is convenient for heat dissipation, and the substrate 1 at the bottom of the chip 2 can also realize the heat dissipation of the chip 2, the heat dissipation fins 5 export the heat on the substrate 1, and discharge it through the heat dissipation groove 4, which greatly improves the heat dissipation effect of the chip 2, ensures the normal operation of the function of the chip 2 package, and at the same time ensures the service life of the chip 2 package.

[0026] The materials of the heat dissipation layer 3 can be the following:

[0027] Copper: Copper is a metal with excellent heat transfer performance and is widely used in heat dissipation devices such as radiators and heat sinks11.

[0028] Aluminum: Aluminum also has a high thermal conductivity, is lightweight and low cost, and is often used to make heat sinks and heat sinks11.

[0029] Graphite: Graphite has good thermal conductivity and is used to manufacture heat dissipation materials such as thermal pads and thermal conductive sheets.

[0030] Metal oxide thermal conductive fillers: such as aluminum oxide, silicon oxide, etc., are usually added as fillers to thermal conductive materials such as heat sink glue and thermal paste to improve their thermal conductivity.

[0031] In the above, the substrate 1 and the chip 2 are connected by the thermally conductive adhesive 7, and the chip 2 and the heat dissipation layer 3 are also connected by the thermally conductive adhesive 7. Thermally conductive adhesive is a material used for heat conduction, and is commonly used in heat dissipation design in electronic products. Thermally conductive adhesive improves thermal conductivity by filling fine particles, and can effectively transfer heat from one surface to another. Common thermally conductive adhesives include silicone grease, silicone grease materials, thermally conductive silicone, etc., which are usually composed of the following structures:

[0032] Matrix: The main material of thermal conductive adhesive, which plays an important role in conducting heat and providing insulation protection.

[0033] Filler: Filler is usually a thermally conductive material, such as metal powder, oxide, etc., which is used to improve the thermal conductivity of thermal conductive adhesive.

[0034] Additives: Some special ingredients may be added to thermal conductive adhesives to improve fluidity, adhesion, heat resistance and other properties.

[0035] Solvent: During the preparation process, the thermal conductive adhesive may contain a certain proportion of solvent to facilitate volatilization after coating or applying it to the surface that requires heat conduction.

[0036] Furthermore, the substrate 1 is installed in the lower packaging shell 8, and the top of the lower packaging shell 8 is detachably connected to the upper packaging shell 9; the left and right sides of the bottom of the lower packaging shell 8 are fixed with support feet 10, and the bottom of the lower packaging shell 8 is provided with a plurality of heat sinks 11 between the two support feet 10; through the coordinated use of the upper packaging shell 9 and the lower packaging shell 8, the substrate 1 and the chip 2 are both located in the space formed by the upper packaging shell 9 and the lower packaging shell 8, thereby realizing dust protection for the chip 2.

[0037] The connection structure of the upper packaging shell 9 and the lower packaging shell 8 is as follows: a first connecting plate 12 is fixedly connected to the top periphery of the lower packaging shell 8, and a second connecting plate 13 is fixedly connected to the bottom periphery of the upper packaging shell 9. Threaded holes are provided at corresponding positions of the first connecting plate 12 and the second connecting plate 13, and the first connecting plate 12 and the second connecting plate 13 are connected by screws 14; by aligning the threaded holes on the first connecting plate 12 and the second connecting plate 13, and then screwing the screws 14 into the threaded holes, the connection between the upper packaging shell 9 and the lower packaging shell 8 can be achieved.

[0038] In order to fix the position of the substrate 1 in the lower packaging shell 8, rectangular blocks 15 are fixedly connected to the inner walls of the left and right sides of the lower packaging shell 8, and the distance between the opposite surfaces of the two rectangular blocks 15 is equal to the horizontal length of the substrate 1. A through hole is opened on the horizontal side of the rectangular block 15, and one end of the through hole passes through the side wall of the lower packaging shell 8. A limit rod 16 is penetrated and slidably arranged in the through hole; the end of the limit rod 16 located in the lower packaging shell 8 is provided with a chamfered surface obliquely downward, and the bottom corner of the substrate 1 is also provided with a chamfered surface obliquely downward; the limit rod 16 is located at the shoulder of one end outside the lower packaging shell 8, and a first spring 17 is connected between the outer wall of the lower packaging shell 8; when the first spring 17 is at the original length, one end of the limit rod 16 is located above the substrate 1 and is tightly attached to the top of the substrate 1;

[0039] When the above scheme is implemented, the substrate 1 is placed downwardly into the lower packaging shell 8, so that the bottom of the substrate 1 squeezes the end of the limit rod 16, so that the two limit rods 16 move in the direction away from the substrate 1. At this time, the first spring 17 is stretched and deformed. When the bottom of the substrate 1 contacts the bottom inner wall of the lower packaging shell 8, the horizontal restriction of the limit rod 16 by the substrate 1 disappears. At this time, under the action of the elastic force of the first spring 17, the limit rod 16 will retreat and move to the top of the substrate 1, that is, the bottom of the limit rod 16 is tightly attached to the top of the substrate 1, so as to limit the displacement of the substrate 1 in the vertical direction.

[0040] In order to further improve the stability of the substrate 1 , an anti-slip layer may be provided at the bottom of the substrate 1 to increase the friction between the substrate 1 and the inner wall of the bottom of the lower packaging shell 8 .

[0041] Furthermore, a through groove is provided at the top of the upper packaging shell 9, a heat dissipation frame 18 is inserted in the through groove, and a heat dissipation net is fixedly connected to the inner wall of the heat dissipation frame 18; a U-shaped card plate 19 is provided on the outer wall of the heat dissipation frame 18, the U-shaped card plate 19 includes a vertical plate and two mutually parallel horizontal plates, the two horizontal plates are fixedly connected to the top and bottom of the vertical plate, and a U-shaped U-shaped slide groove 20 is provided on the outer wall of the heat dissipation frame 18, the U-shaped card plate 19 is slidably set in the U-shaped slide groove 20, a second spring 21 is fixedly connected to one side of the vertical plate, and the other end of the second spring 21 is fixedly connected to the inner wall of the U-center slide groove; when the second spring 21 is at its original length, the two horizontal plates extend out of the U-shaped slide groove 20, and the two horizontal plates respectively abut against the side walls of the upper packaging shell 9;

[0042] When the above scheme is implemented, the two horizontal plates of the U-shaped card plate 19 are first pressed into the U-shaped slide groove 20, at which time the second spring 21 is in a compressed state, and then the heat dissipation frame 18 is inserted into the through groove, and then the U-shaped card plate 19 is released, so that the U-shaped card plate 19 extends out from the U-shaped slide groove 20 under the action of the elastic force of the second spring 21, and finally the top wall of the upper packaging shell 9 is just stuck between the two horizontal plates, thereby fixing the heat dissipation frame 18.

[0043] When the present invention is in use, the heat dissipation layer 3 realizes heat dissipation on the top of the chip 2, and the front, back, left, and right sides of the chip 2 are in a bare state, which is convenient for heat dissipation. In addition, the substrate 1 at the bottom of the chip 2 can also realize heat dissipation for the chip 2. The heat dissipation fins 5 conduct heat from the substrate 1 and discharge it through the heat dissipation grooves 4, which greatly improves the heat dissipation effect of the chip 2, ensures the normal operation of the chip 2 package, and ensures the service life of the chip 2 package; by aligning the threaded holes on the first connecting plate 12 and the second connecting plate 13, and then screwing the screws 14 into the threaded holes, the connection between the upper packaging shell 9 and the lower packaging shell 8 can be achieved; by using the upper packaging shell 9 and the lower packaging shell 8 in coordination, the substrate 1 and the chip 2 are both located in the space formed by the upper packaging shell 9 and the lower packaging shell 8, so as to achieve dust prevention for the chip 2;

[0044] By placing the substrate 1 downward into the lower packaging shell 8, the bottom of the substrate 1 squeezes the end of the limit rod 16, so that the two limit rods 16 move in the direction away from the substrate 1. At this time, the first spring 17 is stretched and deformed. When the bottom of the substrate 1 contacts the bottom inner wall of the lower packaging shell 8, the horizontal restriction of the limit rod 16 by the substrate 1 disappears. At this time, under the action of the elastic force of the first spring 17, the limit rod 16 will retreat and move to the top of the substrate 1, that is, the bottom of the limit rod 16 is tightly attached to the top of the substrate 1, thereby realizing the restriction of the vertical displacement of the substrate 1.

[0045] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0046] The above are only preferred embodiments of the present invention, and are not intended to limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not intended to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A chip package, characterized in that: The invention comprises a substrate (1), a chip (2) is arranged on the top of the substrate (1), a heat dissipation layer (3) is arranged on the top of the chip (2), a heat dissipation groove (4) is provided on the bottom of the substrate (1), the heat dissipation groove (4) runs from the front side of the substrate (1) to the rear side of the substrate (1), and a plurality of heat dissipation fins (5) are fixedly connected to the top of the heat dissipation groove (4) at equal intervals; copper pillars (6) are arranged on the left and right sides of the top of the substrate (1), the copper pillars (6) are arranged at intervals from the chip (2), and the left and right sides of the top of the chip (2) are connected to wires.

2. The chip package according to claim 1, characterized in that: The substrate (1) and the chip (2) are connected via a thermally conductive adhesive (7), and the chip (2) and the heat dissipation layer (3) are also connected via a thermally conductive adhesive (7).

3. The chip package according to claim 1, characterized in that: The substrate (1) is installed in a lower packaging shell (8), and the top of the lower packaging shell (8) is detachably connected to an upper packaging shell (9); the bottom of the lower packaging shell (8) is fixedly connected to legs (10) on both left and right sides, and the bottom of the lower packaging shell (8) is provided with a plurality of heat sinks (11) between the two legs (10).

4. The chip package according to claim 3, characterized in that: A first connecting plate (12) is fixedly connected to the top periphery of the lower packaging shell (8), and a second connecting plate (13) is fixedly connected to the bottom periphery of the upper packaging shell (9). Threaded holes are provided at corresponding positions of the first connecting plate (12) and the second connecting plate (13), and the first connecting plate (12) and the second connecting plate (13) are connected by screws (14).

5. The chip package according to claim 3, characterized in that: Rectangular blocks (15) are fixedly connected to the inner walls on the left and right sides of the lower packaging shell (8), the distance between the opposite surfaces of the two rectangular blocks (15) is equal to the horizontal length of the substrate (1), a through hole is opened on the horizontal side of the rectangular block (15), one end of the through hole passes through the side wall of the lower packaging shell (8), and a limit rod (16) is slidably arranged in the through hole.

6. The chip package according to claim 5, characterized in that: One end of the limit rod (16) located inside the lower packaging shell (8) is provided with a chamfered surface inclined downward, and the bottom corner of the substrate (1) is also provided with a chamfered surface inclined downward; a first spring (17) is connected between the shoulder of one end of the limit rod (16) located outside the lower packaging shell (8) and the outer wall of the lower packaging shell (8); when the first spring (17) is at its original length, one end of the limit rod (16) is located above the substrate (1) and is in close contact with the top of the substrate (1).

7. The chip package according to claim 6, characterized in that: A through slot is provided on the top of the upper packaging shell (9), a heat dissipation frame (18) is inserted into the through slot, and a heat dissipation net is fixedly connected to the inner wall of the heat dissipation frame (18).

8. The chip package according to claim 7, characterized in that: The outer wall of the heat dissipation frame (18) is provided with a U-shaped card plate (19), and the U-shaped card plate (19) includes a vertical plate and two mutually parallel horizontal plates, and the two horizontal plates are fixedly connected to the top and bottom of the vertical plate. The outer wall of the heat dissipation frame (18) is provided with a U-shaped U-shaped slide groove (20), and the U-shaped card plate (19) is slidably set in the U-shaped slide groove (20). A second spring (21) is fixedly connected to one side of the vertical plate, and the other end of the second spring (21) is fixedly connected to the inner wall of the U-center slide groove; when the second spring (21) is at its original length, the two horizontal plates extend out of the U-shaped slide groove (20), and the two horizontal plates respectively abut against the side walls of the upper packaging shell (9).

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