Signal acquisition device and signal acquisition assembly

Abstract

The invention provides a signal acquisition device and a signal acquisition assembly, the signal acquisition device comprises a substrate and an amplification circuit, the substrate is provided with a first sampling line, a second sampling line, a first installation position and a second installation position, and the first end of the first sampling line is connected with the first installation position; the first end of the second sampling line is connected with the second installation position. The first input end of the amplifying circuit is connected with the second end of the first sampling line, the second input end of the amplifying circuit is connected with the second end of the second sampling line, and the output end of the amplifying circuit is connected with the signal receiver through the first transmission line. The amplification circuit is used for collecting a first voltage of a first end of the to-be-measured resistor through the first sampling line, collecting a second voltage of a second end of the to-be-measured resistor through the second sampling line, carrying out differential amplification on the first voltage and the second voltage for a preset amplification factor, and then outputting the first voltage and the second voltage to the signal receiver through the first transmission line. According to the invention, an independent lead mode is adopted, so that the accuracy of voltage sampling is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of signal acquisition, and in particular to a signal acquisition device and a signal acquisition component. Background Art

[0002] At present, electronic products use single-ended acquisition to collect signals. Although this method can collect most signals, it is not accurate enough. In addition, it is even more difficult to guarantee the accuracy when collecting small signals, especially when there are large interference signals. The accuracy of the collected signals is greatly reduced. AR glasses are the cutting-edge products of current technology. There are many small signals that need to be collected in AR glasses. Since there are many substrate signals in AR glasses and they are easy to interfere with each other, it is very difficult to collect small signals. Summary of the invention

[0003] The main purpose of the present invention is to provide a signal acquisition device and a signal acquisition component, aiming to improve the accuracy of the sampling signal of the chip.

[0004] The present invention provides a signal acquisition device, which includes: a substrate, on which a first mounting position for accessing a first end of a resistor to be measured and a second mounting position for accessing a second end of the resistor to be measured are arranged; a first sampling line, which is arranged on the substrate, and the first end of the first sampling line is connected to the first mounting position; a second sampling line, which is arranged on the substrate, and the first end of the second sampling line is connected to the second mounting position; an amplifier circuit, a first input end of the amplifier circuit is connected to the second end of the first sampling line, a second input end of the amplifier circuit is connected to the second end of the second sampling line, and an output end of the amplifier circuit is connected to a signal receiver via a first transmission line; wherein the amplifier circuit is used to collect a first voltage at the first end of the resistor to be measured via the first sampling line, and to collect a second voltage at the second end of the resistor to be measured via the second sampling line; and the amplifier circuit is further used to differentially amplify the first voltage and the second voltage by a preset amplification factor and then output the differentially amplify the first voltage and the second voltage to the signal receiver via the first transmission line.

[0005] In one embodiment, the amplifier circuit includes a first resistor, a second resistor, a third resistor, a fourth resistor and a differential amplifier; the first end of the third resistor is the first input end of the amplifier circuit, the first end of the first resistor is the second input end of the amplifier circuit, the second end of the third resistor is connected to the input end of the differential amplifier, the connection point between the second end of the third resistor and the input end of the differential amplifier is connected to the first end of the fourth resistor, the second end of the fourth resistor is grounded, the second end of the first resistor is connected to the first end of the second resistor, the connection point between the second end of the first resistor and the first end of the second resistor is connected to the output end of the differential amplifier, and the output end of the differential amplifier is the output end of the amplifier circuit.

[0006] In one embodiment, the substrate has multiple wiring layers, the multiple wiring layers include a top wiring layer, a bottom wiring layer and at least one intermediate wiring layer arranged between the top wiring layer and the bottom wiring layer; the first sampling line has a first signal line, a second signal line and a third signal line electrically connected in sequence, the first signal line and the third signal line are both arranged in the top wiring layer or the bottom wiring layer of the substrate, the second signal line is arranged in any of the intermediate wiring layers, and a ground layer is laid on an adjacent layer of the intermediate wiring layer where the second signal line is arranged, corresponding to the position of the second signal line; the second sampling line has a fourth signal line, a fifth signal line and a sixth signal line electrically connected in sequence, the fourth signal line and the sixth signal line are both arranged in the top wiring layer or the bottom wiring layer of the substrate, the fifth signal line is arranged in any of the intermediate wiring layers, and a ground layer is laid on an adjacent layer of the intermediate wiring layer where the fifth signal line is arranged, corresponding to the position of the fifth signal line.

[0007] In one embodiment, a ground layer is disposed around the first signal line, a ground layer is disposed around the third signal line, a ground layer is disposed around the fourth signal line, and a ground layer is disposed around the sixth signal line.

[0008] In one embodiment, the first signal line and the fourth signal line are disposed in the same wiring layer, and the third signal line and the sixth signal line are disposed in the same wiring layer.

[0009] In one embodiment, the second signal line and the fifth signal line are in the same intermediate wiring layer.

[0010] In one embodiment, a ground layer is disposed around the second signal line, and a ground layer is disposed around the fifth signal line.

[0011] In one embodiment, the first signal line and the fourth signal line are symmetrically arranged on the substrate; the third signal line and the sixth signal line are symmetrically arranged on the substrate.

[0012] In one embodiment, the substrate is provided with a first via hole, a second via hole, a third via hole and a fourth via hole, the first via hole and the third via hole are symmetrically arranged on the circuit board, and the second via hole and the fourth via hole are symmetrically arranged on the circuit board; The first signal line is electrically connected to the second signal line through the first via hole, and the second signal line is electrically connected to the third signal line through the second via hole; The fourth signal line is electrically connected to the fifth signal line through the third via hole, and the fifth signal line is electrically connected to the sixth signal line through the fourth via hole.

[0013] In one embodiment, the length of the first transmission line is less than or equal to 5 cm.

[0014] In one embodiment, the first sampling line and the second sampling line are equal in length.

[0015] In one embodiment, a circuit to be tested connected to the first mounting position and the second mounting position is provided on the substrate; on the substrate, a spacing area is provided between the first mounting position and the second mounting position, and the first sampling line and / or the second sampling line are led out through the spacing area.

[0016] The present invention also provides a signal acquisition component, which includes a signal receiver and the signal acquisition device.

[0017] The present invention proposes a signal acquisition device and a signal acquisition component, the signal acquisition device includes: a substrate, a first installation position for accessing the first end of the resistor to be measured and a second installation position for accessing the second end of the resistor to be measured are set on the substrate; a first sampling line is set on the substrate, the first end of the first sampling line is connected to the first installation position; a second sampling line is set on the substrate, the first end of the second sampling line is connected to the second installation position; an amplifier circuit, the first input end of the amplifier circuit is connected to the second end of the first sampling line, the second input end of the amplifier circuit is connected to the second end of the second sampling line, and the output end of the amplifier circuit is connected to a signal receiver via a first transmission line. In practical applications, the amplifier circuit is used to collect a first voltage at the first end of the resistor to be measured via the first sampling line, and is used to collect a second voltage at the second end of the resistor to be measured via the second sampling line, and the first voltage and the second voltage are differentially amplified by a preset amplification factor and then output to the signal receiver via the first transmission line. The present invention adopts a separate lead method to connect the separate leads at both ends of the resistor to be measured to two installation positions, thereby avoiding the voltage sampling from being interfered by the main path of the resistor to be measured, making the voltage sampling more accurate, improving the precision and accuracy of the voltage sampling, and at the same time performing signal amplification processing on the collected voltage at both ends, thereby overcoming the problem that the voltage is difficult to be accurately detected and improving the accuracy of the voltage sampling. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0019] Figure 1 This is a structural diagram of a signal acquisition device of the present invention; Figure 2 It is the traditional signal acquisition circuit described in the specification; Figure 3 A circuit diagram of a signal acquisition device of the present invention; Figure 4 It is a structural diagram of another embodiment of a signal acquisition device of the present invention; Figure 5 It is a structural diagram of another embodiment of a signal acquisition device of the present invention; Figure 6 It is a structural diagram of another embodiment of a signal acquisition device of the present invention; Figure 7 This is a structural diagram of another embodiment of a signal acquisition device of the present invention.

[0020] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0023] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0024] In addition, in the present invention, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0025] It is understandable that signals play an important role in the application of electronic products. Signals are the link between various circuit systems. The circuit system obtains corresponding useful information by collecting, transmitting and processing signals, thereby realizing the monitoring of the entire system. In the process of monitoring the entire system, signal acquisition is the most important part. Only by ensuring the accuracy of signal acquisition can accurate and useful information be obtained. At present, electronic products are all collected through single-end acquisition. Although this method can collect most signals, there is a gap in accuracy, and the accuracy cannot be guaranteed when collecting small signals, especially in the presence of large interference signals. The accuracy of the collected signals is greatly reduced. AR glasses are currently cutting-edge products in science and technology. There will be many small signals in AR glasses that need to be collected. Since there are many substrate signals in AR glasses and they are easy to interfere with each other, it is particularly difficult to collect small signals.

[0026] Therefore, in order to improve the accuracy of the sampling signal of the chip, the present invention proposes a signal acquisition device, referring to Figure 1 , the signal acquisition device comprises: A substrate, on which a first mounting position for connecting to a first end of the resistor to be measured and a second mounting position for connecting to a second end of the resistor to be measured are provided; A first sampling line is disposed on the substrate, wherein a first end of the first sampling line is connected to the first mounting position; A second sampling line is arranged on the substrate, and a first end of the second sampling line is connected to the second mounting position; an amplifier circuit, wherein a first input end of the amplifier circuit is connected to a second end of the first sampling line, a second input end of the amplifier circuit is connected to a second end of the second sampling line, and an output end of the amplifier circuit is connected to a signal receiver via a first transmission line; Wherein, the amplifying circuit is used for collecting a first voltage at a first end of the resistor to be measured via the first sampling line, and for collecting a second voltage at a second end of the resistor to be measured via the second sampling line; The amplifier circuit is further used to differentially amplify the first voltage and the second voltage by a preset amplification factor and then output the amplified voltage to the signal receiver via the first transmission line.

[0027] It is understandable that in the process of collecting signals and transmitting and processing them, the "large" and "small" in large signals and small signals represent the amplitude of the signals, and small signals represent signals with smaller amplitudes. Small signals are more susceptible to various factors and attenuation during transmission. For example, in a long-distance signal transmission line, the energy of the signal will gradually be lost, and the small signal will become weaker due to the attenuation of the energy, making it difficult to be accurately detected during acquisition, thereby reducing the accuracy of acquisition. In addition, small signals are more susceptible to electromagnetic interference in the surrounding environment. For example, in the signal sampling process of the resistor to be measured, the main path of the current of the resistor to be measured usually carries a large working current, and there may be various electromagnetic fields of different frequencies and amplitudes in the surrounding area. For example, in a switching power supply circuit, the switch tube in the main path will generate a strong electromagnetic field when switching at high frequency, which will interfere with the voltage acquisition on the main path. The main path is often connected to multiple electronic components with different functions, and these components may generate various noise signals when working. For example, the clock signal, data signal, etc. of the digital circuit part may be coupled to the main path through parasitic capacitance or inductance, thereby interfering with the voltage measurement of the main path. In order to ensure that the signals in the AR glasses can be accurately detected and to improve the accuracy of collecting signals in the AR glasses, the present invention replaces the single-ended collection method with a double-ended collection method, so as to replace the process of collecting the main path voltage of the resistor to be measured with the process of collecting the voltage at both ends of the resistor to be measured. By collecting the voltage at both ends of the resistor to be measured, the interference signal of the main path of the resistor to be measured is avoided from affecting the voltage sampling accuracy. At the same time, the collected voltage at both ends is amplified, so as to overcome the problem that the voltage is difficult to detect accurately and improve the accuracy of voltage sampling.

[0028] In this embodiment, the signal acquisition device includes a substrate, a first installation position, a second installation position, a first sampling line, a second sampling line and an amplifier circuit. The first installation position, the second installation position, the first sampling line and the second sampling line are all arranged on the substrate, the first installation position is connected to the first end of the resistor to be measured, and the second installation position is connected to the second end of the resistor to be measured. The first sampling line is used to establish a connection relationship between the first installation position and the amplifier circuit, so that the first end of the resistor to be measured, the first installation position, the first end of the first sampling line, the second end of the first sampling line and the first input end of the amplifier circuit form a loop; the second sampling line is used to establish a connection relationship between the second installation position and the amplifier circuit, so that the second end of the resistor to be measured, the second installation position, the first end of the second sampling line, the second end of the second sampling line and the second input end of the amplifier circuit form a loop. In practical applications, the amplifier circuit is implemented by a differential amplifier, which is used to collect the first voltage of the first end of the resistor to be measured through the first sampling line, and collect the second voltage of the second end of the resistor to be measured through the second sampling line, and differentially amplify the first voltage and the second voltage by a preset amplification factor and output them to the signal receiver through the first transmission line. Among them, in the application of AR glasses, the signal receiver receives the voltage signal output by the amplification circuit, such as image signals, sensor signals and wireless communication signals, etc., for real-time interaction and enhanced immersion, receiving image data to present augmented reality scenes, receiving sensor signals to determine the user's head movement and position to adjust virtual content, and receiving Bluetooth and Wi-Fi signals to achieve connection and data exchange with other devices. In this embodiment, the two ends of the resistor to be measured use separate leads, so that the two ends of the resistor to be measured are connected to the two mounting positions to avoid the voltage sampling from being interfered by the main path of the resistor to be measured, so that the voltage sampling is more accurate, and the precision and accuracy of the voltage sampling are improved. At the same time, a differential amplifier is used to amplify the collected voltage to overcome the problem that the voltage sampling is difficult to accurately detect and improve the accuracy of the voltage sampling.

[0029] The present invention proposes a signal acquisition device, which includes: a substrate, a first installation position for accessing the first end of the resistor to be measured and a second installation position for accessing the second end of the resistor to be measured are set on the substrate; a first sampling line is set on the substrate, and the first end of the first sampling line is connected to the first installation position; a second sampling line is set on the substrate, and the first end of the second sampling line is connected to the second installation position; an amplifier circuit, a first input end of the amplifier circuit is connected to the second end of the first sampling line, a second input end of the amplifier circuit is connected to the second end of the second sampling line, and an output end of the amplifier circuit is connected to a signal receiver via a first transmission line. In practical applications, the amplifier circuit is used to collect a first voltage at the first end of the resistor to be measured via the first sampling line, and to collect a second voltage at the second end of the resistor to be measured via the second sampling line, and the first voltage and the second voltage are differentially amplified by a preset amplification factor and then output to the signal receiver via the first transmission line. The present invention adopts a separate lead method to connect the separate leads at both ends of the resistor to be measured to two installation positions, thereby avoiding the voltage sampling from being interfered by the main path of the resistor to be measured, making the voltage sampling more accurate, improving the precision and accuracy of the voltage sampling, and at the same time performing signal amplification processing on the collected voltage at both ends, thereby overcoming the problem that the voltage is difficult to be accurately detected and improving the accuracy of the voltage sampling.

[0030] In one embodiment, referring to Figure 3 , the amplifying circuit includes a first resistor R1, a second resistor R2, a third resistor R3, a fourth resistor R4 and a differential amplifier U1; The first end of the third resistor R3 is the first input end of the amplifier circuit, the first end of the first resistor R1 is the second input end of the amplifier circuit, the second end of the third resistor R3 is connected to the input end of the differential amplifier U1, the connection point between the second end of the third resistor R3 and the input end of the differential amplifier U1 is connected to the first end of the fourth resistor R4, the second end of the fourth resistor R4 is grounded, the second end of the first resistor R1 is connected to the first end of the second resistor R2, the connection point between the second end of the first resistor R1 and the first end of the second resistor R2 is connected to the output end of the differential amplifier U1, and the output end of the differential amplifier U1 is the output end of the amplifier circuit.

[0031] It is understandable that, referring to Figure 2The traditional signal acquisition circuit is a single-ended signal acquisition circuit that only acquires the voltage V+ at one end of the resistor Rs to be measured, and uses the ground loop as the reference voltage V-. This acquisition method is relatively simple, but it is easily interfered by external signals. Since the ground signal is used as the reference voltage, it is easy to introduce external electromagnetic interference signals, causing the collected signal to be mixed with too many clutter signals, and the final signal analysis is not accurate enough; moreover, this circuit greatly reduces the accuracy when acquiring small signals. In this embodiment, refer to Figure 3 , AR glasses include an LED driving circuit, and the first end of the resistor to be measured Rs is used to connect to the LED driving circuit. The feedback signal VFB of the LED driving circuit passes through the resistor to be measured Rs, and the current signal flowing through the resistor to be measured Rs is converted into a voltage signal and fed back to the LED driving circuit for internal calibration. In practical applications, due to the design defects of the driver chip in the LED driving circuit, it is necessary to collect the VFB voltage for external calibration of the driver chip. In addition, since the resistance value of the resistor to be measured Rs is generally several hundred milliohms, when the current flowing through the resistor to be measured Rs is several milliamperes, the voltage collected from the resistor to be measured Rs is several hundred millivolts, and a voltage of several hundred millivolts can be regarded as a small signal. On the other hand, there are many high-frequency signals in AR glasses, which will cause greater interference to small signals, so the design of the small signal acquisition circuit is particularly important.

[0032] Therefore, in order to make the voltage sampling more accurate and improve the precision and accuracy of voltage sampling, the signal acquisition device in this embodiment collects the V+ voltage signal and the V- voltage signal from both ends of the resistor Rs to be measured, so that the two voltage signals form a pair of differential signals, and the differential signal is integrated into a single-ended signal Vo after passing through the differential amplifier U1 and output to the signal receiver. It should be understood that the amplification circuit includes a first resistor R1, a second resistor R2, a third resistor R3, a fourth resistor R4 and a differential amplifier U1. The differential amplifier U1 has the function of signal amplification. When R1=R3 and R2=R4 are set, Vo=R2 / R1*(V+-V-). Therefore, as long as the resistance values ​​of the first resistor R1, the second resistor R2, the third resistor R3 and the fourth resistor R4 are accurately set, the amplification factor of the signal acquisition device can be accurately defined, so that the small signal can achieve the effect of signal amplification, thereby improving the anti-interference ability, and enabling the signal receiver to better analyze the single-ended signal Vo.

[0033] In one embodiment, referring to Figure 4 , the substrate has a plurality of wiring layers, the plurality of wiring layers comprising a top wiring layer, a bottom wiring layer and at least one intermediate wiring layer disposed between the top wiring layer and the bottom wiring layer; The first sampling line comprises a first signal line, a second signal line and a third signal line which are electrically connected in sequence, the first signal line and the third signal line are both arranged in the top wiring layer or the bottom wiring layer of the substrate, the second signal line is arranged in any of the middle wiring layers, and a ground layer is laid on a layer adjacent to the middle wiring layer where the second signal line is arranged, corresponding to the position of the second signal line; The second sampling line has a fourth signal line, a fifth signal line and a sixth signal line electrically connected in sequence, the fourth signal line and the sixth signal line are both arranged in the top wiring layer or the bottom wiring layer of the substrate, the fifth signal line is arranged in any of the intermediate wiring layers, and a ground layer is laid on an adjacent layer of the intermediate wiring layer where the fifth signal line is arranged, corresponding to the position of the fifth signal line.

[0034] It can be understood that, in this embodiment, referring to Figure 4 The plurality of wiring layers include a top wiring layer and a bottom wiring layer that are arranged opposite to each other, and at least one intermediate wiring layer is arranged between the top wiring layer and the bottom wiring layer. In addition, the first sampling line is composed of a first signal line, a second signal line, and a third signal line; and the second sampling line is composed of a fourth signal line, a fifth signal line, and a sixth signal line.

[0035] In practical applications, multiple wiring layers including a top wiring layer, a bottom wiring layer and an intermediate wiring layer are used as an example for explanation. Figure 5 , when the first signal line and the third signal line are both arranged in the top wiring layer, the second signal line is arranged in the middle wiring layer. From the perspective of the signal line, the first voltage at the first end of the resistor to be measured is output to the first input end of the amplifier circuit after passing through the first mounting position, the first signal line, the second signal line and the third signal line in sequence; from the perspective of the wiring layer, the first voltage at the first end of the resistor to be measured is output to the first input end of the amplifier circuit after passing through the top wiring layer, the middle wiring layer and the top wiring layer in sequence. Since the top wiring layer and the bottom wiring layer are adjacent layers of the middle wiring layer where the second signal line is arranged, a ground layer is laid at the position of the top wiring layer corresponding to the second signal line, and a ground layer is laid at the position of the bottom wiring layer corresponding to the second signal line. With this arrangement, the upper and lower ground layers form a shielding cavity to electromagnetically shield the second signal line of the middle wiring layer, reduce the entry of external electromagnetic interference, and improve the accuracy of the sampling signal. Reference Figure 5, when the fourth signal line and the sixth signal line are both arranged in the top wiring layer, the fifth signal line is arranged in the middle wiring layer. From the perspective of the signal line, the second voltage at the second end of the resistor to be measured is output to the second input end of the amplifier circuit after passing through the second mounting position, the fourth signal line, the fifth signal line and the sixth signal line in sequence; from the perspective of the wiring layer, the second voltage at the second end of the resistor to be measured is output to the second input end of the amplifier circuit after passing through the top wiring layer, the middle wiring layer and the top wiring layer in sequence. Since the top wiring layer and the bottom wiring layer are adjacent layers of the middle wiring layer provided with the fifth signal line, a ground layer is laid at the position of the top wiring layer corresponding to the fifth signal line, and a ground layer is laid at the position of the bottom wiring layer corresponding to the fifth signal line. With such a configuration, the upper and lower ground layers form a shielding cavity to electromagnetically shield the fifth signal line of the middle wiring layer, reduce the entry of external electromagnetic interference, and improve the accuracy of the sampling signal.

[0036] This embodiment shields the first sampling line and the second sampling line of the middle wiring layer by surrounding the upper and lower layers, reduces the entry of external electromagnetic interference, avoids the influence of the external environment on the voltage sampling accuracy, and improves the precision and accuracy of voltage sampling.

[0037] In another embodiment, referring to Figure 6 The first signal line and the third signal line are both arranged in the bottom wiring layer, the fourth signal line and the sixth signal line are both arranged in the bottom wiring layer, the second signal line and the fifth signal line are both arranged in the middle wiring layer. From the perspective of the wiring layer, the first voltage at the first end of the resistor to be measured passes through the bottom wiring layer, the middle wiring layer and the bottom wiring layer in sequence, and the second voltage at the second end of the resistor to be measured passes through the bottom wiring layer, the middle wiring layer and the bottom wiring layer in sequence.

[0038] In one embodiment, referring to Figure 7 A ground layer is arranged around the first signal line, and a ground layer is arranged around the third signal line; a ground layer is arranged around the fourth signal line, and a ground layer is arranged around the sixth signal line.

[0039] It can be understood that, in this embodiment, the surrounding side of the first signal line and the surrounding side of the third signal line are both provided with a grounding layer, and when the first signal line and the third signal line are both provided in the top wiring layer, the top wiring layer forms a shielding cover, which effectively blocks the influence of external electromagnetic interference sources on the second signal line of the middle wiring layer of the adjacent layer; the surrounding side of the fourth signal line and the surrounding side of the sixth signal line are both provided with a grounding layer, and when the fourth signal line and the sixth signal line are both provided in the top wiring layer, the top wiring layer forms a shielding cover, which effectively blocks the influence of external electromagnetic interference sources on the fifth signal line of the middle wiring layer of the adjacent layer. Conversely, when the first signal line and the third signal line are both provided in the bottom wiring layer, the bottom wiring layer forms a shielding cover to reduce the interference of the external environment on the second signal line; when the fourth signal line and the sixth signal line are both provided in the bottom wiring layer, the bottom wiring layer forms a shielding cover to reduce the interference of the external environment on the fifth signal line.

[0040] In one embodiment, referring to Figure 5 , Figure 6 and Figure 7 , the first signal line and the fourth signal line are set in the same wiring layer, and the third signal line and the sixth signal line are set in the same wiring layer.

[0041] It can be understood that, in this embodiment, the first signal line, the third signal line and the fourth signal line are all arranged in the top wiring layer or the bottom wiring layer; the third signal line, the fourth signal line and the sixth signal line are all arranged in the top wiring layer or the bottom wiring layer. For example, when the first signal line, the third signal line, the fourth signal line and the sixth signal line are all arranged in the top wiring layer, the second signal line and the fifth signal line are arranged in the middle wiring layer; when the first signal line, the third signal line, the fourth signal line and the sixth signal line are all arranged in the bottom wiring layer, the second signal line and the fifth signal line are arranged in the middle wiring layer.

[0042] In one embodiment, referring to Figure 5 , Figure 6 and Figure 7 , the second signal line and the fifth signal line are in the same intermediate wiring layer.

[0043] It can be understood that, in this embodiment, at least one intermediate wiring layer is provided between the top wiring layer and the bottom wiring layer, and the second signal line and the fifth signal line are provided in the same intermediate wiring layer. In practical applications, a grounding layer is laid on the adjacent layer of the intermediate wiring layer provided with the second signal line and the fifth signal line at the position corresponding to the second signal line and the fifth signal line. In this way, the upper and lower grounding layers form a shielding cavity to electromagnetically shield the second signal line and the fifth signal line of the intermediate wiring layer, reduce the entry of external electromagnetic interference, and improve the voltage sampling accuracy of the second signal line and the fifth signal line on the resistor to be measured.

[0044] In one embodiment, referring to Figure 7 A ground layer is provided on the surrounding side of the second signal line, and a ground layer is provided on the surrounding side of the fifth signal line.

[0045] It is understandable that, since the second signal line and the fifth signal line are arranged in the same wiring layer, and the second signal line and the fifth signal line are arranged adjacent to each other, the second signal line and the fifth signal line will generate an electromagnetic field during the signal sampling process, and the adjacent second signal line and the fifth signal line will be affected by the electromagnetic field, resulting in distortion or crosstalk of the sampled signal. In this embodiment, a ground layer is arranged on the peripheral side of the second signal line and the peripheral side of the fifth signal line, and the ground layer provides a low-impedance return path for the second signal line and the fifth signal line, so that the electromagnetic field of the collected first voltage and the second voltage is more concentrated between the signal line and the ground layer, reducing interference with adjacent signal lines.

[0046] In one embodiment, referring to Figure 7 , the first signal line and the fourth signal line are symmetrically arranged on the substrate; the third signal line and the sixth signal line are symmetrically arranged on the substrate.

[0047] The substrate is provided with a first via hole, a second via hole, a third via hole and a fourth via hole, the first via hole and the third via hole are symmetrically arranged on the circuit board, and the second via hole and the fourth via hole are symmetrically arranged on the circuit board; The first signal line is electrically connected to the second signal line through the first via hole, and the second signal line is electrically connected to the third signal line through the second via hole; The fourth signal line is electrically connected to the fifth signal line through the third via hole, and the fifth signal line is electrically connected to the sixth signal line through the fourth via hole.

[0048] It can be understood that, in this embodiment, the first signal line, the fourth signal line, the third signal line and the sixth signal line are all arranged on the top wiring layer, and the second signal line and the fifth signal line are arranged on the middle wiring layer, the first signal line and the fourth signal line are symmetrically arranged on the top wiring layer, and the third signal line and the sixth signal line are symmetrically arranged on the top wiring layer. At the same time, the first signal line is connected to the second signal line through the first via hole, the second signal line and the third signal line are connected through the second via hole, the fourth signal line and the fifth signal line are connected through the third via hole, and the fifth signal line and the sixth signal line are connected through the fourth via hole.

[0049] Since the differential signal is composed of a pair of complementary signals, synchronization needs to be maintained during the transmission process. In order to maintain the synchronous transmission of the two signals, this embodiment symmetrically arranges the first signal line and the fourth signal line on the top wiring layer, the third signal line and the sixth signal line on the top wiring layer, the first via and the third via are symmetrically arranged, and the second via and the fourth via are symmetrically arranged, so that the second signal line and the fifth signal line of the middle wiring layer are arranged in parallel and the lengths of the two are equal. In this way, the lengths of the second signal line and the fifth signal line are equal, ensuring that the transmission time of the first voltage of the second signal line and the second voltage of the fifth signal line are consistent, as well as ensuring amplitude balance, waveform integrity, reducing the probability of signal distortion, and improving the accuracy of signal transmission.

[0050] In one embodiment, referring to Figure 3 , the length of the first transmission line is less than or equal to 5 cm.

[0051] It is understandable that the signal will attenuate to a certain extent as the distance increases during transmission on the wiring layer. A shorter distance can reduce the loss of the signal on the transmission path, and a shorter distance can reduce the impact of external electromagnetic interference on the signal, so that the signal receiver can receive a stronger signal. In this embodiment, in order to ensure the accuracy and stability of the sampling signal, the length of the first transmission line between the amplification circuit and the signal receiver is set within a preset range, generally not exceeding 5 cm, and the quality of the signal can be effectively improved within the preset range.

[0052] In one embodiment, referring to Figure 7 , the lengths of the first sampling line and the second sampling line are equal.

[0053] It is understandable that the differential signal is composed of a pair of complementary signals, which need to be synchronized during transmission. In this embodiment, the lengths of the first sampling line and the second sampling line are equal, which can ensure that the first voltage time input to the first input end of the amplifier circuit by the first sampling line and the second voltage time input to the second input end of the second sampling line are consistent, and ensure that the amplitude of the sampling signal input to the amplifier circuit is balanced, the waveform is complete, the probability of signal distortion is reduced, and the accuracy of sampling signal transmission is improved.

[0054] In one embodiment, referring to Figure 3 and Figure 7 , a circuit to be tested connected to the first mounting position and the second mounting position is provided on the substrate; On the substrate, a spacing area is arranged between the first mounting position and the second mounting position, and the first sampling line and / or the second sampling line are led out through the spacing area.

[0055] It is understandable that, referring to Figure 3In this embodiment, a circuit to be tested is provided between the LED driving circuit, the resistor to be tested and the ground terminal, and the circuit to be tested is connected to the first mounting position and the second mounting position respectively. A spacing area is provided between the first mounting position and the second mounting position, and the first sampling line is led out through the spacing area between the first mounting position and the second mounting position, and the second sampling line is led out through the spacing area between the first mounting position and the second mounting position. In this way, the first sampling line and the second sampling line are routed separately, avoiding the main path of the resistor to be tested through which the current flows, and avoiding the introduction of interference signals caused by current fluctuations.

[0056] The present invention also provides a signal acquisition component, which includes a signal receiver and a signal acquisition device as described in the above embodiment. The specific structure of the signal acquisition component refers to the above embodiment. Since the signal acquisition component adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here one by one.

[0057] The above descriptions are only optional embodiments of the present invention, and are not intended to limit the patent scope of the present invention. All equivalent structural changes made using the contents of the present invention's specification and drawings, or directly / indirectly applied in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A signal acquisition device, characterized in that: The signal acquisition device comprises: A substrate, on which a first mounting position for connecting to a first end of the resistor to be measured and a second mounting position for connecting to a second end of the resistor to be measured are provided; A first sampling line is disposed on the substrate, wherein a first end of the first sampling line is connected to the first mounting position; A second sampling line is arranged on the substrate, and a first end of the second sampling line is connected to the second mounting position; an amplifier circuit, wherein a first input end of the amplifier circuit is connected to a second end of the first sampling line, a second input end of the amplifier circuit is connected to a second end of the second sampling line, and an output end of the amplifier circuit is connected to a signal receiver via a first transmission line; Wherein, the amplifying circuit is used for collecting a first voltage at a first end of the resistor to be measured via the first sampling line, and for collecting a second voltage at a second end of the resistor to be measured via the second sampling line; The amplifier circuit is further used to differentially amplify the first voltage and the second voltage by a preset amplification factor and then output the amplified voltage to the signal receiver via the first transmission line.

2. The signal acquisition device according to claim 1, characterized in that: The amplifying circuit includes a first resistor, a second resistor, a third resistor, a fourth resistor and a differential amplifier; The first end of the third resistor is the first input end of the amplifier circuit, the first end of the first resistor is the second input end of the amplifier circuit, the second end of the third resistor is connected to the input end of the differential amplifier, the connection point between the second end of the third resistor and the input end of the differential amplifier is connected to the first end of the fourth resistor, the second end of the fourth resistor is grounded, the second end of the first resistor is connected to the first end of the second resistor, the connection point between the second end of the first resistor and the first end of the second resistor is connected to the output end of the differential amplifier, and the output end of the differential amplifier is the output end of the amplifier circuit.

3. The signal acquisition device according to claim 1, characterized in that: The substrate has a plurality of wiring layers, the plurality of wiring layers including a top wiring layer, a bottom wiring layer and at least one middle wiring layer disposed between the top wiring layer and the bottom wiring layer; The first sampling line comprises a first signal line, a second signal line and a third signal line which are electrically connected in sequence, the first signal line and the third signal line are both arranged in the top wiring layer or the bottom wiring layer of the substrate, the second signal line is arranged in any of the middle wiring layers, and a ground layer is laid on a layer adjacent to the middle wiring layer where the second signal line is arranged, corresponding to the position of the second signal line; The second sampling line has a fourth signal line, a fifth signal line and a sixth signal line electrically connected in sequence, the fourth signal line and the sixth signal line are both arranged in the top wiring layer or the bottom wiring layer of the substrate, the fifth signal line is arranged in any of the intermediate wiring layers, and a ground layer is laid on an adjacent layer of the intermediate wiring layer where the fifth signal line is arranged, corresponding to the position of the fifth signal line.

4. The signal acquisition device according to claim 3, characterized in that: A ground layer is disposed around the first signal line, a ground layer is disposed around the third signal line, a ground layer is disposed around the fourth signal line, and a ground layer is disposed around the sixth signal line.

5. The signal acquisition device according to claim 3, characterized in that: The first signal line and the fourth signal line are provided in the same wiring layer, and the third signal line and the sixth signal line are provided in the same wiring layer.

6. The signal acquisition device according to claim 3, characterized in that: The second signal line and the fifth signal line are in the same intermediate wiring layer.

7. The signal acquisition device according to claim 3, characterized in that: A ground layer is disposed on a peripheral side of the second signal line, and a ground layer is disposed on a peripheral side of the fifth signal line.

8. The signal acquisition device according to claim 6, characterized in that: The first signal line and the fourth signal line are symmetrically arranged on the substrate; the third signal line and the sixth signal line are symmetrically arranged on the substrate.

9. The signal acquisition device according to claim 8, characterized in that: The substrate is provided with a first via hole, a second via hole, a third via hole and a fourth via hole, the first via hole and the third via hole are symmetrically arranged on the circuit board, and the second via hole and the fourth via hole are symmetrically arranged on the circuit board; The first signal line is electrically connected to the second signal line through the first via hole, and the second signal line is electrically connected to the third signal line through the second via hole; The fourth signal line is electrically connected to the fifth signal line through the third via hole, and the fifth signal line is electrically connected to the sixth signal line through the fourth via hole.

10. The signal acquisition device according to any one of claims 1 to 9, characterized in that: The length of the first transmission line is less than or equal to 5 cm.

11. The signal acquisition device according to claims 1 to 9, characterized in that: The first sampling line and the second sampling line have the same length.

12. The signal acquisition device according to claims 1 to 9, characterized in that: The substrate is provided with a circuit to be tested connected to the first mounting position and the second mounting position; On the substrate, a spacing area is arranged between the first mounting position and the second mounting position, and the first sampling line and / or the second sampling line are led out through the spacing area.

13. A signal acquisition component, characterized in that: The signal acquisition component comprises a signal receiver and a signal acquisition device as described in any one of claims 1-12.

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