Golden finger manufacturing method and PCB

Abstract

The invention discloses a golden finger manufacturing method and a PCB, and the method comprises the steps: providing a substrate which is provided with a circuit layer, and the circuit layer at least comprises a bonding pad or a hole exposed out of the surface of the substrate; pasting a conductive film on the surface of the substrate so as to enable the conductive film to be connected with a bonding pad or a hole on the surface of the substrate; windowing the surface of the conductive film to remove the conductive film on the surface of the golden finger area; connecting an electroplating power supply to the conductive film so as to plate gold on the golden finger area; and removing the conductive film. By adopting the golden finger manufacturing method, the problem of copper leakage and nickel gold suspension caused by lead etching can be solved, the technological process can be shortened, and the problem of copper surface glue dirt can be solved.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and in particular to a gold finger manufacturing method and a PCB. Background Art

[0002] In the related art, the production of gold fingers in PCB can usually be achieved by etching leads or four-sided gold plating. For example, the etching lead method is to connect the gold fingers by setting leads, cover the leads with a wet film, remove the wet film after gold plating, expose the copper surface of the leads, and then remove the leads with alkaline etching solution. However, this method will cause copper leakage and nickel-gold hanging after etching at the junction of the leads and gold plating. The position of copper leakage is prone to corrosion, and the position of nickel-gold hanging may be affected by the copper thickness. When the copper thickness is large, it will also cause the nickel-gold hanging part to collapse easily, affecting the production effect and performance of the gold fingers. The four-sided gold plating method is used to make gold fingers, which requires adding leads inside the board. The leads need to avoid being set at the top of the gold fingers. This process is complicated, resulting in a long production cycle of the gold fingers, and it is necessary to produce the gold-plated area before making the green oil, which will cause more glue stains on the same surface. The glue stains are difficult to remove by grinding the plate. Summary of the invention

[0003] In order to solve at least one of the above-mentioned technical problems, the present application provides a gold finger manufacturing method, which can solve the problem of copper leakage and nickel-gold hanging caused by etching leads, shorten the process flow, and solve the problem of glue contamination on the copper surface. The technical solution adopted is as follows.

[0004] In the first aspect, the gold finger manufacturing method provided in the present application comprises:

[0005] Providing a substrate, wherein the substrate is provided with a circuit layer, and the circuit layer at least includes a pad or a hole exposed on the surface of the substrate;

[0006] A conductive film is attached to the surface of the substrate so that the conductive film is connected to the pad or hole on the surface of the substrate;

[0007] Opening a window on the surface of the conductive film to remove the conductive film on the surface of the gold finger area;

[0008] Connecting an electroplating power source to the conductive film to plate gold on the gold finger area;

[0009] The conductive film is removed.

[0010] In some embodiments of the first aspect of the present application, attaching a conductive film to the surface of the substrate so that the conductive film is connected to a pad or a hole on the surface of the substrate comprises:

[0011] The surface of the conductive film is pressed by a laminator so that the conductive film is attached to the surface of the pad or hole of the substrate.

[0012] In certain embodiments of the first aspect of the present application, the step of extruding the surface of the conductive film by using a laminator includes:

[0013] While the surface of the conductive film is pressed by a laminator, heating the substrate and the conductive film; and / or

[0014] Before using a laminator to press the surface of the conductive film, heating the substrate and the conductive film;

[0015] The substrate and the conductive film are heated to 90° C. to 100° C., the extrusion force of the laminating machine is 3 kg to 5 kg, and the extrusion time is 2 s to 5 s.

[0016] In certain embodiments of the first aspect of the present application, before attaching a conductive film to the surface of the substrate, the gold finger manufacturing method further includes:

[0017] The substrate is surface treated by sandblasting to increase the roughness of the substrate surface.

[0018] In certain embodiments of the first aspect of the present application, opening a window on the surface of the conductive film comprises:

[0019] transferring the window pattern to the surface of the conductive film;

[0020] exposing the surface of the conductive film;

[0021] The surface of the conductive film is developed to expose the gold finger area that needs to be gold plated.

[0022] In certain embodiments of the first aspect of the present application, opening a window on the surface of the conductive film comprises:

[0023] Tear off the conductive film in the gold finger area to expose the gold finger area that needs to be gold plated.

[0024] In some embodiments of the first aspect of the present application, removing the conductive film comprises:

[0025] The conductive film is soaked in an alkaline solution to remove the conductive film, wherein the soaking temperature is 45° C. to 50° C. and the soaking time is 10 min to 15 min.

[0026] In some embodiments of the first aspect of the present application, the substrate includes an isolated gold finger, the isolated gold finger is not connected to the pad or hole of the substrate, and the gold finger manufacturing method further includes:

[0027] Before a conductive film is attached to the surface of the substrate, a window pad is provided on the substrate, and the window pad is electrically connected to the isolated gold finger;

[0028] After removing the conductive film, the window pad is covered by inkjet to insulate the window pad.

[0029] In certain embodiments of the first aspect of the present application, after the conductive film is attached to the surface of the substrate, the gold finger manufacturing method further includes:

[0030] In any process of the gold finger manufacturing method, a bubble film is inserted between two adjacent stacked substrates.

[0031] In a second aspect, the present application further provides a PCB, which is manufactured by the gold finger manufacturing method provided in the first aspect.

[0032] The embodiments of the present application have at least the following beneficial effects: utilizing the conductive effect of the conductive film, the conductive film is electrically connected to the pad or hole on the surface of the substrate, thereby realizing electrical conduction between the conductive film and the gold finger area, so that the conductive film can be used to connect the electroplating power supply and the gold finger to realize gold plating in the gold finger area, and after the gold plating is completed, the conductive film is removed to complete the gold finger production. In this way, the gold finger can be made without connecting the gold finger through the lead wire, thereby solving the problem of copper leakage or nickel gold hanging at the front end of the gold finger when the lead wire is etched and removed, and obtaining a gold finger with four-sided gold plating; secondly, compared with the four-sided gold plating production method, the gold finger production method of the present application does not need to add a lead wire to connect the gold finger inside the substrate in advance, but uses the pad or hole on the surface of the substrate to connect through the conductive film, so it can simplify the production process, shorten the production cycle of the gold finger, and improve the PCB production efficiency. In addition, the conductive film is covered after the green oil is made in the present application, so it can solve the problem of glue stains on the copper surface that cannot be removed. Furthermore, compared with the solution of setting additional leads inside the substrate to connect to the gold fingers, the present application can reduce redundant internal circuit design, thereby avoiding the influence of redundant internal leads on the signal, reducing the signal transmission loss of the PCB, and improving the performance of the PCB. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The aspects and advantages described and / or attached in the embodiments of the present application will become apparent and easy to understand in conjunction with the following drawings. It should be noted that the embodiments embodied in the following drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0034] Figure 1 A flow chart of the method for making a gold finger provided in an embodiment of the present application;

[0035] Figure 2A schematic diagram of a substrate in step S100 provided in an embodiment of the present application;

[0036] Figure 3 A schematic diagram of a substrate in step S200 provided in an embodiment of the present application;

[0037] Figure 4 A side view of a substrate provided in an embodiment of the present application before step S210;

[0038] Figure 5 A side view of a substrate provided in an embodiment of the present application after step S210;

[0039] Figure 6 A schematic diagram of a substrate in step S300 provided in an embodiment of the present application;

[0040] Figure 7 A schematic diagram of a substrate in step S400 provided in an embodiment of the present application;

[0041] Figure 8 A schematic diagram of a substrate in step S500 provided in an embodiment of the present application;

[0042] Fig. 9 A schematic diagram of a substrate in step S620 provided in an embodiment of the present application.

[0043] Figure numerals: 100, substrate; 11, pad; 12, hole; 13, window pad; 20, conductive film; 30, gold finger; 31, isolated gold finger; 40, solder mask; 200, conductive clip; 300, PCB. DETAILED DESCRIPTION

[0044] Combine the following Figures 1 to 9 Embodiments of the present application are described in detail, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0045] In the description of the present application, it should be understood that if the terms "center", "middle", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, "multiple" means two or more.

[0046] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0047] In the related art, the production of gold fingers in PCB can usually be achieved by etching leads or four-sided gold coating. However, whether it is etching leads or four-sided gold coating, there are certain shortcomings in the production of gold fingers, which makes it difficult to improve the quality and efficiency of PCB production. For example, the production of gold fingers by etching leads will cause copper leakage and nickel gold hanging after etching the junction of the lead and the gold plating. The position of copper leakage is prone to corrosion, and the position of nickel gold hanging may be affected by the copper thickness. When the copper thickness is large, it will also cause the nickel gold hanging part to collapse easily, affecting the production effect and performance of the gold fingers. The production of gold fingers by four-sided gold coating technology has the problem of complex process flow, resulting in a long production cycle of gold fingers. Moreover, this production method requires the production of the gold-plated area before the production of the green oil (solder mask), which will lead to more glue stains on the same surface and other problems, and the glue stains are difficult to remove by grinding the plate.

[0048] On this basis, some related technologies use the method of using the guide hole to conduct electricity to make the gold finger, and use the guide hole and the grounding line in the board to conduct electricity with the gold finger to achieve gold plating. After the gold plating is completed, the line between the guide hole and the grounding line needs to be disconnected by drilling. However, using this production method, on the one hand, there is a hidden danger of copper leakage at the drilling position, and on the other hand, after the grounding line is disconnected, it still remains in the board and becomes a redundant line. These redundant lines remain in the board and cannot be eliminated, which will affect the signal of the PCB, which is not conducive to improving the performance of the PCB.

[0049] Based on this, see Figure 1 The first aspect of the present application proposes a method for making a gold finger, comprising the following steps:

[0050] S100. Providing a substrate 100, the substrate 100 is provided with a circuit layer, the circuit layer at least includes a pad 11 or a hole 12 exposed on the surface of the substrate 100;

[0051] S200. A conductive film 20 is attached to the surface of the substrate 100 so that the conductive film 20 is connected to the pad 11 or the hole 12 on the surface of the substrate 100;

[0052] S300. Opening a window on the surface of the conductive film 20 to remove the conductive film 20 on the surface of the gold finger 30 region;

[0053] S400. Connecting the electroplating power supply to the conductive film 20 to plate the gold finger 30 region with gold;

[0054] S500 . Remove the conductive film 20 .

[0055] See also Figure 2 It can be understood that the circuit layer of the substrate 100 can be located in the inner layer or the surface layer of the substrate 100, and the circuit layer of the surface layer can be covered by the solder resist layer 40. The pad 11 or hole 12 exposed on the surface of the substrate 100 means that one end of the pad 11 or the hole 12 can be electrically connected with the circuit layer of the substrate 100, and the other end is exposed on the surface of the substrate 100, so as to contact with the conductive film 20 to form electrical conduction. The pad 11 or the hole 12 can be exposed in the solder resist layer 40 by opening a window. According to the circuit design of the PCB, the gold finger 30 and the circuit layer are mutually conductive, thereby forming a conductive path between the gold finger 30, the circuit layer, the pad 11 or the hole 12, so as to realize the electrical conduction between the electroplating power supply and the gold finger 30 by using the conductive path. It can be understood that the conductive film 20 itself contains a conductive substance, so that electrical conduction can be achieved. The conductive film 20 can react with the film stripping reagent, so that the conductive film 20 is removed from the surface of the substrate 100.

[0056] See also Figure 3 , Figure 6 and Figure 7, utilizing the conductive effect of the conductive film 20, on the one hand, the conductive film 20 is electrically connected to the pad 11 or the hole 12 on the surface of the substrate 100, thereby realizing electrical conduction between the conductive film 20 and the gold finger 30 area, so that the conductive film 20 can be used to connect the electroplating power supply and the gold finger 30 to realize gold plating in the gold finger 30 area. On the other hand, after the conductive film 20 has a window, the window area (the position of the gold finger 30) can be exposed to allow the gold finger 30 to be gold plated, while the conductive film 20 can protect the covered area (the area outside the gold finger 30) to avoid gold plating in the area. It can be seen that the conductive film 20 can not only play a conductive role for the gold finger 30, but also play a covering and protective role for the non-gold-plated area. Therefore, compared with the method of using a wet film to cover the lead, the method of using the conductive film 20 to make the gold finger 30 does not require the additional setting of a wet film. Compared with the method of setting the lead inside the substrate 100, the conductive film 20 can cover the surface of the substrate 100 and can be easily removed after the gold plating is completed, thereby simplifying the process flow. At the same time, please refer to Figure 7 By utilizing the covering effect of the conductive film 20 on the surface of the substrate 100, when the electroplating power supply needs to be turned on, the conductive clip 200 only needs to be clamped at any position of the conductive film 20 to enable the conductive film 20 to be energized. Therefore, the power connection position between the electroplating power supply and the substrate 100 can be flexibly set without restriction, thereby improving the flexibility and convenience of the electroplating operation.

[0057] By adopting this method to make the gold finger 30, firstly, the gold finger 30 can be connected without a lead, thereby solving the problem of copper leakage or nickel gold hanging at the front end of the gold finger 30 when the lead is etched and removed, and obtaining a gold finger 30 with four-sided gold coating; secondly, compared with the four-sided gold coating production method, the gold finger production method of the present application does not need to add a lead to connect the gold finger 30 inside the substrate 100 in advance, but uses the pad 11 or hole 12 on the surface of the substrate 100 to connect through the conductive film 20, so it can simplify the production process, shorten the production cycle of the gold finger 30, and improve the PCB production efficiency. In addition, in the present application, the conductive film 20 is covered on the surface of the substrate 100, so it can be done after the green oil (solder mask 40) is made on the substrate 100, so it can solve the problem of glue stains on the copper surface that cannot be removed. Furthermore, compared with the solution of setting an additional lead inside the substrate 100 to conduct to the gold finger 30, the present application can reduce redundant internal circuit design, thereby avoiding the influence of redundant internal leads on the signal, reducing the signal transmission loss of the PCB, and improving the performance of the PCB.

[0058] In order to improve the connection strength between the conductive film 20 and the surface of the substrate 100, in some embodiments, before performing the above step S200 and attaching the conductive film 20 to the surface of the substrate 100, the gold finger manufacturing method further includes:

[0059] S201 . Performing surface treatment on the substrate 100 by sandblasting to increase the surface roughness of the substrate 100 .

[0060] By treating the surface of the substrate 100 by sandblasting, the roughness of the surface of the substrate 100 can be increased, thereby improving the bonding force between the conductive film 20 and the substrate 100, thereby preventing the conductive film 20 from falling off due to insufficient bonding force, and also avoiding the problem of the gold plating reagent penetrating into the gap due to the presence of a gap between the surface of the substrate 100 and the conductive film 20, thereby improving the effect of the conductive film 20 being attached.

[0061] See also Figure 4 and Figure 5 Since the solder resist layer 40 is coated on the surface of the substrate 100, the pad 11 or the hole 12 is exposed by opening a window in the solder resist layer 40. The solder resist layer 40 at the window position usually protrudes from the surface of the pad 11 or the hole 12, for example, the protrusion height is about 15-20μm. Therefore, when the surface of the substrate 100 is covered with the conductive film 20, the solder resist layer 40 will lift the conductive film 20, so that the conductive film 20 cannot contact the surface of the pad 11 or the hole 12, thereby making it difficult to form an effective electrical connection (such as Figure 4 To solve this problem, the fluidity of the conductive film 20 can be utilized to perform an extrusion process on the conductive film 20, so that the conductive film 20 contacts the surface of the pad 11 or the hole 12.

[0062] Specifically, in some embodiments, the above step S200 of attaching the conductive film 20 to the surface of the substrate 100 so that the conductive film 20 is connected to the pad 11 or the hole 12 on the surface of the substrate 100 includes:

[0063] S210 . Use a laminator to press the surface of the conductive film 20 so that the conductive film 20 adheres to the surface of the pad 11 or the hole 12 of the substrate 100 .

[0064] By squeezing the surface of the conductive film 20 and utilizing the fluidity and ductility of the conductive film 20 itself, the conductive film 20 can be attached to the surface of the pad 11 or the hole 12 under the squeezing effect to achieve contact, thereby achieving the effect of electrical connection between the conductive film 20 and the pad 11 or the hole 12 (such as Figure 5 As shown). It is understandable that the conductive film 20 itself has a certain thickness and ductility, so after the conductive film 20 is extruded, the conductive film 20 can still remain continuous, ensuring that the portion of the conductive film 20 that is attached to the surface of the pad 11 or the hole 12 and the portion that is attached to the surface of the solder resist layer 40 can be connected to each other, so that the entire conductive film 20 has a continuous conductive effect. Exemplarily, the thickness of the conductive film 20 is ≥30μm, for example, it can be 30μm, 40μm, 50μm, etc., which is not limited here.

[0065] For example, a roller-type laminator can be used, and the part of the laminator that contacts the conductive film 20 has a certain degree of softness, so as to avoid scratching the conductive film 20 and to avoid damage to the substrate 100 caused by excessive pressure. As an optional example, the roller of the laminator can be made of rubber material, for example, the thickness of the rubber can be about 15 μm, and the hardness of the rubber ranges from 50 to 60 shore. The laminator is selected based on whether it can achieve the extrusion of the conductive film 20 without damaging the conductive film 20 and the substrate 100. It can be flexibly selected according to actual conditions, and this embodiment does not limit this.

[0066] In order to improve the extrusion effect of the conductive film 20 so that the conductive film 20 is better attached to the surface of the pad 11 or the hole 12, in some embodiments, the above step S210 of extruding the surface of the conductive film 20 by using a laminator includes:

[0067] S211. While the surface of the conductive film 20 is squeezed by a laminator, the substrate 100 and the conductive film 20 are heated;

[0068] By utilizing the simultaneous effects of heating and pressure squeezing, the fluidity of the conductive film 20 can be improved so that the conductive film 20 can more fully contact the surface of the pad 11 or the hole 12, thereby ensuring the conductivity reliability between the conductive film 20 and the pad 11 or the hole 12.

[0069] In some embodiments, the above step S210 of extruding the surface of the conductive film 20 by using a laminator includes:

[0070] S212 . Before using a laminator to press the surface of the conductive film 20 , heat the substrate 100 and the conductive film 20 .

[0071] Before extruding the conductive film 20, the conductive film 20 is heated to improve the fluidity of the conductive film 20, so that the conductive film 20 can be better attached to the surface of the pad 11 or the hole 12 during the extrusion process. Optionally, the conductive film 20 can be heated only before the conductive film 20 is extruded, or only during the extrusion process of the conductive film 20, or both before and during the extrusion process, which is not limited here.

[0072] Exemplarily, the substrate 100 and the conductive film 20 are heated to 90°C to 100°C, for example, 90°C, 93°C, 95°C, 98°C, 100°C, etc. The extrusion pressure of the laminator is 3kg to 5kg, for example, 3kg, 3.5kg, 4kg, 4.5kg, 5kg, etc. The extrusion time is 2s to 5s, for example, 2s, 2.5s, 3s, 3.5s, 4s, 5s, etc. The specific selection can be flexibly based on the thickness of the conductive film 20, the fluidity of the conductive film 20, etc., and is not limited here.

[0073] Optionally, see Figure 6 and Figure 7 The step of opening a window on the conductive film 20 can be achieved by exposure and development, or by film tearing, which will be explained below respectively.

[0074] In some embodiments, the above step S300 of opening a window on the surface of the conductive film 20 includes:

[0075] S310. The window pattern is transferred to the surface of the conductive film 20;

[0076] S320. Exposing the surface of the conductive film 20;

[0077] S330. Develop the surface of the conductive film 20 to expose the region of the gold finger 30 that needs to be gold plated.

[0078] The window opening is realized by exposure and development, which can improve the accuracy of the window opening position, thereby revealing the gold finger 30 area.

[0079] Exemplarily, the window pattern can be transferred to the surface of the conductive film 20 by an exposure machine. Specifically, the window position is set in the area of ​​the gold finger 30 that needs to be gold-plated. Specifically, a photosensitive material can be added to the conductive film 20 so that the conductive film 20 has photosensitivity and can be cured under the irradiation of UV ultraviolet light. After the window pattern is transferred to the conductive film 20, the surface of the conductive film 20 is photocured using UV light of a certain intensity. Then, the surface of the conductive film 20 is developed with a developer (for example, sodium carbonate or carbonic acid reagent with a concentration of 0.9% to 1.2%). At this time, the uncured area of ​​the surface will react with the developer, thereby revealing the area that needs to be gold-plated.

[0080] In some embodiments, the above step S300 of opening a window on the surface of the conductive film 20 includes:

[0081] S340 . Tear off the conductive film 20 in the gold finger 30 region to expose the gold finger 30 region that needs to be gold plated.

[0082] The window opening is realized by tearing off, which can omit the operation of exposing and developing the conductive film 20, thereby simplifying the window opening process and improving the window opening efficiency. For example, the tearing off method can be realized by manual operation.

[0083] It is understandable that the window opening method using exposure and development and the window opening method using film tearing are independent of each other, and either method can be used. Therefore, the above steps S310-S330 and step S340 are performed in parallel.

[0084] In some embodiments, see Figure 8The above step S500 of removing the conductive film 20 includes:

[0085] The conductive film 20 is soaked in an alkaline solution to remove the conductive film 20 , wherein the soaking temperature is 45° C. to 50° C. and the soaking time is 10 min to 15 min.

[0086] By soaking the conductive film 20 in an alkaline solution, on the one hand, the conductive film 20 can react with the alkaline solution, thereby removing the conductive film 20 from the surface of the substrate 100. On the other hand, the solder resist layer 40 can be prevented from reacting with the alkaline solution, thereby preventing the solder resist layer 40 from being damaged, thereby ensuring the integrity of the substrate 100 after the gold finger 30 is manufactured.

[0087] Exemplarily, the alkaline solution may be a 10% to 15% sodium hydroxide solution, the soaking temperature may be 45° C., 48° C., 50° C., etc., and the soaking time may be 10 min, 12 min, 15 min, etc.

[0088] When designing the circuit of the PCB, some gold fingers 30 are not connected to the pads 11 or holes 12 exposed on the surface of the substrate 100. These gold fingers 30 are isolated gold fingers 31 (such as Figure 1 As shown in FIG. 1 , it is difficult to achieve electrical conduction of the gold fingers 30 using the pads 11 or holes 12 on the surface of the substrate 100. Therefore, it is necessary to first modify the isolated gold fingers 30 to change the isolated gold fingers 31 into a non-isolated state, and then use the conductive film 20 to conduct electricity and electroplate them.

[0089] For details, please refer to Figure 1 , Figure 8 and Fig. 9 In some embodiments, the substrate 100 includes an isolated gold finger 31, and the isolated gold finger 31 is not connected to the pad 11 or the hole 12 of the substrate 100. The gold finger manufacturing method further includes:

[0090] S610. Before attaching the conductive film 20 to the surface of the substrate 100, a window pad 13 is provided on the substrate 100, and the window pad 13 is electrically connected to the isolated gold finger 31 (eg Figure 8 shown);

[0091] After removing the conductive film 20 in step S500, the gold finger manufacturing method further includes:

[0092] S620. The window pad 13 is covered with inkjet to insulate the window pad 13 (eg Fig. 9 shown).

[0093] Although the isolated gold finger 31 is not connected to the existing pad 11 or hole 12 exposed on the surface of the substrate 100, the isolated gold finger 31 is always connected to at least a part of the circuit inside the substrate 100. Therefore, the window pad 13 is set for the position of these circuits, so that the isolated gold finger 31 can be electrically connected to the window pad 13, so that the isolated gold finger 31 can be electrically connected to the conductive film 20 by using the window pad 13. At this time, the isolated gold finger 31 can be changed into a non-isolated gold finger 31, so that the conductive effect of the conductive film 20 can be used to realize the electroplating of the gold finger 30. After the electroplating is completed, in order to avoid the short circuit of the window pad 13, it is covered by inkjet, and the insulating effect of the oil film can be used to insulate the window pad 13, so that the non-isolated gold finger 30 is changed back into an isolated gold finger 31, and the PCB is restored to the original circuit design state.

[0094] Optionally, the color of the oil film covering the window pad 13 can be flexibly selected according to design requirements. For example, when the position of the window pad 13 needs to be more hidden, a color similar to or the same as the color of the solder resist layer 40 is selected. When the position of the window pad 13 needs to be more obvious, an oil film color that is significantly different from the color of the solder resist layer 40 is selected.

[0095] In the process of PCB manufacturing (including the production of gold finger 30), it is usually necessary to stack the PCBs in each process to facilitate temporary storage or transportation during the production process. When the substrates 100 are stacked, it is easy to scratch the conductive film 20. Therefore, in order to prevent the conductive film 20 from being scratched and affecting the production effect of the gold finger 30, in some embodiments, after implementing the above step S200 and pasting the conductive film 20 on the surface of the substrate 100, the gold finger production method further includes:

[0096] S700. In any process of the gold finger manufacturing method, insert a bubble film between two adjacent stacked substrates 100.

[0097] That is, in any step after step S200, whenever two substrates 100 need to be stacked, a bubble film is inserted between two adjacent substrates 100. By utilizing the spacing effect of the bubble film, the surfaces of the two adjacent stacked substrates 100 can be separated, thereby protecting the conductive film 20 attached to the surface of the substrate 100, avoiding scratches between the two adjacent substrates 100 that may damage the conductive film 20, and avoiding the problem that it is difficult to protect the non-gold-plated area after the conductive film 20 is damaged, resulting in the non-gold-plated area being plated with nickel-gold. Therefore, the bubble film can solve the problem of scratches on the substrates 100 when they are stacked, thereby improving the effect of making the gold finger 30.

[0098] Second, see Figure 8 and Fig. 9The present application also provides a PCB, which is manufactured by the gold finger manufacturing method provided in the first aspect.

[0099] In the description of this specification, if the reference terms "one embodiment", "some examples", "some embodiments", "illustrative embodiment", "example", "specific example", or "some examples" appear, it means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0100] The above describes the implementation methods of the present application in detail in conjunction with the accompanying drawings, but the present application is not limited to the above implementation methods. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present application.

[0101] In the description of this application, if "," appears in the patent name, it means an "and" relationship, not an "or" relationship. For example, if the patent name is "a kind of A, B", it means that the content required to be protected by this application is: the technical solution with the subject name A and the technical solution with the subject name B.

Claims

1. A method for making a gold finger, characterized in that: include Providing a substrate, wherein the substrate is provided with a circuit layer, and the circuit layer at least includes a pad or a hole exposed on the surface of the substrate; A conductive film is attached to the surface of the substrate so that the conductive film is connected to the pad or hole on the surface of the substrate; Opening a window on the surface of the conductive film to remove the conductive film on the surface of the gold finger area; Connecting an electroplating power source to the conductive film to plate gold on the gold finger area; The conductive film is removed.

2. The method for making a gold finger according to claim 1, characterized in that: The step of attaching a conductive film to the surface of the substrate so that the conductive film is connected to the pad or hole on the surface of the substrate comprises: The surface of the conductive film is pressed by a laminator so that the conductive film is attached to the surface of the pad or hole of the substrate.

3. The method for making a gold finger according to claim 2, characterized in that: The method of extruding the surface of the conductive film by using a laminating machine comprises: While the surface of the conductive film is pressed by a laminator, heating the substrate and the conductive film; and / or Before using a laminator to press the surface of the conductive film, heating the substrate and the conductive film; The substrate and the conductive film are heated to 90° C. to 100° C., the extrusion force of the laminating machine is 3 kg to 5 kg, and the extrusion time is 2 s to 5 s.

4. The method for making a gold finger according to claim 1, characterized in that: Before attaching the conductive film to the surface of the substrate, the gold finger manufacturing method further includes: The substrate is surface treated by sandblasting to increase the roughness of the substrate surface.

5. The method for making a gold finger according to any one of claims 1 to 4, characterized in that: Opening a window on the surface of the conductive film comprises: transferring the window pattern to the surface of the conductive film; exposing the surface of the conductive film; The surface of the conductive film is developed to expose the gold finger area that needs to be gold plated.

6. The method for making a gold finger according to any one of claims 1 to 4, characterized in that: Opening a window on the surface of the conductive film comprises: Tear off the conductive film in the gold finger area to expose the gold finger area that needs to be gold plated.

7. The method for making a gold finger according to any one of claims 1 to 4, characterized in that: The removing of the conductive film comprises: The conductive film is soaked in an alkaline solution to remove the conductive film, wherein the soaking temperature is 45° C. to 50° C. and the soaking time is 10 min to 15 min.

8. The method for making a gold finger according to any one of claims 1 to 4, characterized in that: The substrate includes an isolated gold finger, and the isolated gold finger is not connected to the pad or hole of the substrate. The gold finger manufacturing method further includes: Before a conductive film is attached to the surface of the substrate, a window pad is provided on the substrate, and the window pad is electrically connected to the isolated gold finger; After removing the conductive film, the window pad is covered by inkjet to insulate the window pad.

9. The method for making a gold finger according to any one of claims 1 to 4, characterized in that: After the conductive film is attached to the surface of the substrate, the gold finger manufacturing method further includes: In any process of the gold finger manufacturing method, a bubble film is inserted between two adjacent stacked substrates.

10. A PCB, characterized in that: The gold finger is manufactured by the gold finger manufacturing method according to any one of claims 1 to 9.

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