High-performance liquid cooling system for electric control equipment

Abstract

The invention relates to a high-performance liquid cooling system for electric control equipment, which is characterized in that the upper end of a box body is provided with a capacitor cooling flow channel, the left end of the capacitor cooling flow channel is connected with a first inlet connector, and a capacitor is arranged above the capacitor cooling flow channel; a power module cooling flow channel is arranged in the middle of the box body, the left end of the power module cooling flow channel is connected with a second inlet connector, and a plurality of power modules are installed above the power module cooling flow channel; the lower end of the box body is provided with an inductor cooling flow channel, the right ends of the power module cooling flow channel and the capacitor cooling flow channel converge and are communicated with the right end of the inductor cooling flow channel, the left end of the inductor cooling flow channel is connected with a first outlet connector and a second outlet connector in parallel, and an inductor is installed above the inductor cooling flow channel. The capacitor, the inductor and the box body are integrated through glue pouring to form closer contact, and higher heat dissipation efficiency is achieved; the power module is fixedly arranged in the box body and then becomes a part of the flow channel to directly participate in heat dissipation, so that higher heat dissipation efficiency is achieved, and the liquid cooling efficiency of the electric control equipment is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of liquid cooling of electric control equipment, and in particular relates to a high-performance liquid cooling system for electric control equipment. Background Art

[0002] Electronic control equipment will emit heat during operation, so electronic control equipment needs to be equipped with a cooling and heat dissipation system. In traditional liquid-cooled electronic control equipment, the capacitor is filled with glue in an independent container to become a capacitor assembly, and the inductor is filled with glue in an independent container to become an inductor assembly. The capacitor assembly, power module, and inductor assembly are fixed in a box designed with a heat dissipation channel. The capacitor assembly, inductor assembly, power module and other heating components are in contact with the box for heat dissipation, and there may be gaps on the contact surface, resulting in reduced heat dissipation efficiency. Summary of the invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a high-performance liquid cooling system for electronic control equipment to improve the heat dissipation efficiency of the electronic control equipment.

[0004] The present invention solves the technical problem by the following technical solutions:

[0005] A high-performance liquid cooling system for electric control equipment comprises a box, a capacitor, a power module and an inductor, wherein a capacitor cooling channel is arranged at the upper end of the box, the left end of the capacitor cooling channel is connected to a first inlet joint, the capacitor is installed by glue filling at the upper part of the capacitor cooling channel corresponding to the capacitor installation position of the box, and the capacitor and the box form an integrated structure through glue filling; a power module cooling channel is arranged at the middle part of the box, the left end of the power module cooling channel is connected to a second inlet joint, a plurality of power modules are installed at the upper part of the power module cooling channel corresponding to the power module installation position of the box; an inductor cooling channel is arranged at the lower end of the box, the power module cooling channel merges with the right end of the capacitor cooling channel and is connected to the right end of the inductor cooling channel, the left end of the inductor cooling channel is connected in parallel to the first outlet joint and the second outlet joint, the inductor is installed by glue filling at the upper part of the inductor cooling channel corresponding to the inductor installation position of the box, and the inductor and the box form an integrated structure through glue filling.

[0006] Moreover, the capacitor cooling channel and the inductor cooling channel are both closed channels, and a plurality of protruding structures are evenly arranged inside the capacitor cooling channel and the inductor cooling channel.

[0007] Moreover, the power module cooling channel is an open structure of three series and three parallels. The box body is provided with a groove at the bottom corresponding to each power module. The power module is embedded in the groove, and the upper and lower ends of the groove are provided with grooves. After the power module is installed in the groove, it becomes a part of the power module cooling channel.

[0008] Moreover, a sealing ring is arranged between the power module and the box body, and pressure blocks are press-fitted at both ends of the power module.

[0009] Moreover, the bottom of the power module is evenly provided with protruding structures.

[0010] Furthermore, temperature measuring elements are installed on the capacitor, the power module and the inductor, and flow regulating controllers are installed outside the first inlet connector and the second inlet connector.

[0011] The advantages and beneficial effects of the present invention are:

[0012] 1. In the high-performance liquid-cooling system for electronic control equipment of the present invention, the capacitor is directly glued in the box body, and becomes one with the box body after glue filling. The capacitor and the box body form a closer contact through the internal glue filling, and have a higher heat dissipation efficiency; the power module becomes a part of the flow channel after being fixed in the box body, and directly participates in the heat dissipation, and has a higher heat dissipation efficiency; the inductor is directly glued in the box body, and becomes one with the box body after glue filling. The inductor and the box body form a closer contact through the internal glue filling, and have a higher heat dissipation efficiency.

[0013] 2. In the high-performance liquid-cooling system for electronic control equipment of the present invention, the capacitor cooling channel and the inductor cooling channel are both closed channels, a number of raised structures are evenly arranged inside the capacitor cooling channel and the inductor cooling channel, and the bottom of the power module is evenly arranged with raised structures to increase the flow resistance and the contact area between the box and the cooling medium, thereby improving the heat dissipation efficiency of the capacitor, inductor and power module.

[0014] 3. The high-performance liquid-cooling system for electronic control equipment of the present invention designs separate cooling medium inlet joints for power modules and capacitor modules with larger heat dissipation. The cooling medium flows into the inductor after passing through the capacitor and the power module, ensuring full contact between the cooling medium and the capacitor, inductor and power module in the capacitor cooling channel, the inductor cooling channel and the power module cooling channel, thereby improving heat dissipation efficiency.

[0015] 4. In the high-performance liquid-cooling system for electronically controlled equipment of the present invention, temperature measuring elements are installed on capacitors, power modules and inductors, and flow regulating controllers are installed outside the first inlet connector and the second inlet connector, which can adjust the flow of the cooling medium according to the real-time temperature of the temperature measuring element to ensure the stable operation of the cooling system. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of the present invention;

[0017] Figure 2 It is a structural schematic diagram of the box body of the present invention;

[0018] Figure 3It is a schematic diagram of the box flow channel of the present invention;

[0019] Figure 4 Another schematic diagram of the structure of the box flow channel of the present invention;

[0020] Figure 5 This is a schematic diagram of the flow channel of the power module of the present invention;

[0021] Figure 6 It is a schematic diagram of the structure of the power module of the present invention.

[0022] Description of Reference Numerals

[0023] 1-first inlet joint, 2-second inlet joint, 3-first outlet joint, 4-second outlet joint, 5-capacitor, 6-power module, 7-inductor, 8-housing, 9-capacitor installation position, 10-power module installation position, 11-inductor installation position, 12-capacitor cooling channel, 13-groove, 14-slot, 15-inductor cooling channel, 16-power module cooling channel, 17-pressing block, 18-sealing ring, 19-protruding structure. DETAILED DESCRIPTION

[0024] The present invention is further described in detail below through specific examples. The following examples are only illustrative and not restrictive, and the protection scope of the present invention cannot be limited thereto.

[0025] A high-performance liquid cooling system for electronic control equipment, comprising a box 8, a capacitor 5, a power module 6 and an inductor 7, wherein a capacitor cooling channel 12 is arranged at the upper end of the box, the left end of the capacitor cooling channel is connected to a first inlet joint 1, the capacitor is installed by glue filling at a capacitor installation position 9 of the box corresponding to the upper part of the capacitor cooling channel, and the capacitor and the box are integrated into a structure by glue filling; a power module cooling channel 16 is arranged in the middle of the box, the left end of the power module cooling channel is connected to a second inlet joint 2, and the power module A plurality of power modules are installed above the cooling channel at a power module installation position 10 of the box body; an inductor cooling channel 15 is provided at the lower end of the box body, the power module cooling channel merges with the right end of the capacitor cooling channel and is connected with the right end of the inductor cooling channel, the left end of the inductor cooling channel is connected in parallel to the first outlet connector 3 and the second outlet connector 4, the inductor is installed by glue filling at an inductor installation position 11 of the box body above the inductor cooling channel, and the inductor and the box body become an integrated structure through glue filling.

[0026] The capacitor cooling channel and the inductor cooling channel are both closed channels, and a number of protrusion structures 19 are evenly arranged inside the capacitor cooling channel and the inductor cooling channel. The bottom of the power module is evenly arranged with protrusion structures to increase flow resistance and increase the contact area between the box and the cooling medium, which can improve the heat dissipation efficiency of the capacitor, inductor and power module.

[0027] A sealing ring 18 is arranged between the power module and the box body, and pressure blocks 17 are pressed at both ends of the power module. The cooling channel of the power module is an open structure of three series and three parallels. A groove 13 is arranged at the bottom of the box body corresponding to each power module. The power module is embedded in the groove, and slots 14 are arranged at the upper and lower ends of the groove. After the power module is installed in the groove, it becomes a part of the cooling channel of the power module, directly participates in heat dissipation, and has higher heat dissipation efficiency.

[0028] Temperature measuring elements are installed on the capacitor, power module and inductor, and flow regulating controllers are installed outside the first inlet joint and the second inlet joint. The flow of the cooling medium can be adjusted according to the real-time temperature of the temperature measuring elements. When the temperature of the capacitor is low (high), the system will reduce (increase) the flow of the first inlet joint. When the temperature of the power module is low (high), the system will reduce (increase) the flow of the second inlet joint. When the temperature of the inductor is low (high), the system will reduce (increase) the flow of the first inlet joint and the second inlet joint until the entire cooling system reaches a stable working state, thereby ensuring the stable operation of the cooling system.

[0029] In the high-performance liquid-cooling system for electric control equipment of the present invention, the capacitor is directly glued in the box body, and becomes one with the box body after glue filling. The capacitor and the box body are in closer contact through the internal glue filling, and have higher heat dissipation efficiency; the power module becomes part of the flow channel after being fixed in the box body, and directly participates in the heat dissipation, and has higher heat dissipation efficiency; the inductor is directly glued in the box body, and becomes one with the box body after glue filling. The inductor and the box body are in closer contact through the internal glue filling, and have higher heat dissipation efficiency.

[0030] Although the embodiments and drawings of the present invention are disclosed for illustrative purposes, those skilled in the art will appreciate that various substitutions, changes and modifications are possible without departing from the spirit and scope of the present invention and the appended claims. Therefore, the scope of the present invention is not limited to the contents disclosed in the embodiments and drawings.

Claims

1. A high-performance liquid cooling system for electronic control equipment, comprising a box, a capacitor, a power module and an inductor, characterized in that: A capacitor cooling channel is provided at the upper end of the box body, the left end of the capacitor cooling channel is connected to the first inlet joint, the capacitor is installed by glue filling at the capacitor installation position of the box body above the capacitor cooling channel, and the capacitor and the box body are integrated into a structure through glue filling; a power module cooling channel is provided at the middle part of the box body, the left end of the power module cooling channel is connected to the second inlet joint, and a plurality of power modules are installed at the power module installation position of the box body above the power module cooling channel; an inductor cooling channel is provided at the lower end of the box body, the power module cooling channel merges with the right end of the capacitor cooling channel and is connected to the right end of the inductor cooling channel, the left end of the inductor cooling channel is connected in parallel to the first outlet joint and the second outlet joint, the inductor is installed by glue filling at the inductor installation position of the box body above the inductor cooling channel, and the inductor and the box body are integrated into a structure through glue filling.

2. The high-performance liquid cooling system for electronic control equipment according to claim 1, characterized in that: The capacitor cooling channel and the inductor cooling channel are both closed channels, and a plurality of protruding structures are evenly arranged inside the capacitor cooling channel and the inductor cooling channel.

3. The high-performance liquid cooling system for electronic control equipment according to claim 1, characterized in that: The power module cooling channel is an open structure of three series and three parallels. The box body is provided with a groove at the bottom corresponding to each power module. The power module is embedded in the groove, and the upper and lower ends of the groove are provided with grooves. After the power module is installed in the groove, it becomes a part of the power module cooling channel.

4. The high-performance liquid cooling system for electronic control equipment according to claim 1, characterized in that: A sealing ring is arranged between the power module and the box body, and pressure blocks are press-fitted at both ends of the power module.

5. The high-performance liquid cooling system for electronic control equipment according to claim 1, characterized in that: The bottom of the power module is evenly provided with protrusion structures.

6. The high-performance liquid cooling system for electronic control equipment according to claim 1, characterized in that: Temperature measuring elements are installed on the capacitor, power module and inductor, and flow regulating controllers are installed outside the first inlet connector and the second inlet connector.

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