Mounting structure of resistor body

Abstract

This mounting structure is provided with: a substrate; conductive parts (a first conductive part and a second conductive part); a resistor disposed on a path through which a current flows in the conductive part; and detection wiring sections (first detection wiring and second detection wiring) that are electrically connected to the resistor, the first conductive section having a first pad section disposed on one side in a first direction, and the second conductive section having a second pad section disposed on the other side in the first direction so as to be separated from the first pad section. The semiconductor device is provided with: a first conductive bonding material that bonds the first pad main surface and the resistor (first part); and a second conductive bonding material that bonds the second pad main surface and the resistor (second portion), and the first wiring main surface (second wiring main surface) is positioned on the other side in the thickness direction than the first pad main surface (second pad main surface).

Description

Technical Field

[0001] The present invention relates to a mounting structure of a resistor. Background Art

[0002] In the past, semiconductor devices having power switching elements such as MOSFET (Metal Oxide Semiconductor Field Effect Transistor) and IGBT (Insulated Gate Bipolar Transistor) are known. Such semiconductor devices are mounted on all electronic devices from industrial equipment to home appliances, information terminals, and automotive equipment. Patent document 1 discloses a conventional semiconductor device. The semiconductor device described in patent document 1 includes a substrate (substrate), a conduction plate (conductive portion), and a semiconductor element. The conduction plate is supported by the substrate and constitutes a conduction path for the current flowing in the semiconductor element to flow. The semiconductor element is supported by the substrate and is conductively connected to the conduction plate.

[0003] When the semiconductor device is mounted on a circuit substrate such as a PCB (Printed Circuit Board) substrate, for example, a shunt resistor is mounted on the circuit substrate and the shunt resistor is used as a shunt to detect current. However, on the circuit substrate side, it is necessary to mount a shunt resistor and route the wiring for the resistor, so that the space occupied by the current detection increases, which is a major factor in the cost increase.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2015-220429 Summary of the invention

[0007] Problems to be solved by the invention

[0008] One object of the present invention is to provide a semiconductor device that is improved compared to the conventional semiconductor device. In particular, in view of the above-mentioned situation, one object of the present invention is to provide a mounting structure of a resistor that is suitable for detecting a current with high accuracy.

[0009] The mounting structure of a resistor provided by one embodiment of the present invention comprises: a substrate; a conductive portion supported by the substrate; a resistor arranged on a path where current flows in the conductive portion; and a detection wiring portion, which is conductive with the resistor. The substrate has a first main surface facing one side in the thickness direction. The conductive portion includes a first conductive portion and a second conductive portion respectively arranged on the first main surface. The first conductive portion has a first pad portion, which is arranged on one side of a first direction orthogonal to the thickness direction. The second conductive portion has a second pad portion, which is arranged on the other side of the first direction away from the first pad portion. The resistor has: a first portion, which overlaps with the first pad portion when viewed in the thickness direction; and a second portion, which overlaps with the second pad portion when viewed in the thickness direction. The first pad portion has a first pad main surface facing one side in the thickness direction. The second pad portion has a second pad main surface facing one side in the thickness direction, and the mounting structure of the resistor body includes: a first conductive bonding material, which is sandwiched between the first pad main surface and the first portion, and the first pad main surface and the first portion are bonded; and a second conductive bonding material, which is sandwiched between the second pad main surface and the second portion, and the second pad main surface and the second portion are bonded. The detection wiring portion includes: a first detection wiring, which is conductively connected to the first pad portion; and a second detection wiring, which is conductively connected to the second pad portion. The first detection wiring has a first wiring main surface facing one side in the thickness direction. The second detection wiring has a second wiring main surface facing one side in the thickness direction. The first wiring main surface is located on the other side of the first pad main surface in the thickness direction. The second wiring main surface is located on the other side of the second pad main surface in the thickness direction.

[0010] Effects of the Invention

[0011] According to the above configuration, it is possible to provide a structure that is suitable for detecting current with high accuracy.

[0012] Other features and advantages of the present invention will become more apparent from the following detailed description made with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a diagram showing a schematic configuration example of a mounting structure having a resistor mounting structure according to the present invention.

[0014] Figure 2 It is an enlarged plan view of a main part showing a mounting structure according to a first embodiment of the present invention.

[0015] Figure 3 It is along Figure 2Cross-sectional view along line III-III.

[0016] Figure 4 It is an enlarged plan view of a main part showing a mounting structure according to a first modification of the first embodiment.

[0017] Figure 5 It is along Figure 4 A cross-sectional view of line VV.

[0018] Figure 6 It is an enlarged plan view of a main part showing a mounting structure according to a second modified example of the first embodiment.

[0019] Figure 7 It is along Figure 6 A cross-sectional view taken along line VII-VII.

[0020] Figure 8 It is an enlarged plan view of a main part showing a mounting structure according to a third modified example of the first embodiment.

[0021] Fig. 9 It is along Figure 8 A cross-sectional view taken along line IX-IX. DETAILED DESCRIPTION

[0022] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

[0023] The terms “first”, “second”, and “third” in the present invention are used only for identification and do not necessarily intend to add a sequence to these objects.

[0024] In the present invention, unless otherwise specified, “something A is formed on something B” and “something A is formed on something B” include “something A is directly formed on something B” and “something A is formed on something B while something else is interposed between something A and something B”. Similarly, unless otherwise specified, “something A is configured on something B” and “something A is configured on something B” include “something A is directly configured on something B” and “something A is configured on something B while something else is interposed between something A and something B”. Similarly, unless otherwise specified, “something A is located on something B” includes “something A is in contact with something B and something A is located on something B” and “something A is located on something B while something else is interposed between something A and something B”. In addition, unless otherwise specified, “something A overlaps with something B when viewed in a certain direction” includes “something A completely overlaps with something B” and “something A partially overlaps with something B”. In the present invention, “a certain surface A faces (one side or the other side) of direction B” is not limited to the case where the angle of surface A with respect to direction B is 90°, but also includes the case where surface A is inclined with respect to direction B.

[0025] First embodiment:

[0026] Figure 1 to Figure 3 A mounting structure including the mounting structure of the resistor according to the first embodiment of the present invention is shown. Figure 1 It is a diagram showing a schematic structure of the mounting structure A1. Figure 2 It is an enlarged plan view showing a main part of the mounting structure A1. Figure 3 It is along Figure 2 Cross-sectional view along line III-III.

[0027] The mounting structure A1 of the present embodiment includes a substrate 1, a conductive portion 2, a resistor 5, a detection wiring portion 6, terminals 71 and 72, detection terminals 73 and 74, and a sealing resin 8. The mounting structure A1 detects a current flowing in the conductive portion 2 between the two terminals 71 and 72.

[0028] In the description of the mounting structure A1, the thickness direction (top view direction) of the substrate 1 is an example of the "thickness direction" of the present invention, and is referred to as the "thickness direction z". The direction perpendicular to the thickness direction z is an example of the "first direction" of the present invention, and is referred to as the "first direction x". The direction perpendicular to both the thickness direction z and the first direction x is an example of the "second direction" of the present invention, and is referred to as the "second direction y". Figure 2 In the figure, the left side is an example of "one side of the first direction" of the present invention, called "x1 side of the first direction x", and the right side is an example of "the other side of the first direction" of the present invention, called "x2 side of the first direction x". Figure 2 In the figure, the lower side is an example of "one side of the second direction" of the present invention, called "y1 side of the second direction y", and the upper side is an example of "the other side of the second direction" of the present invention, called "y2 side of the second direction y". Figure 3 In the figure, the upper side is an example of the "one side in the thickness direction" of the present invention, referred to as the "z1 side in the thickness direction z", and the lower side is an example of the "other side in the thickness direction" of the present invention, referred to as the "z2 side in the thickness direction z".

[0029] The substrate 1 has electrical insulation properties. The substrate 1 is made of, for example, ceramics containing aluminum oxide (Al2O3). The constituent material of the substrate 1 is preferably a material with relatively high thermal conductivity. Figure 2 , Figure 3 As shown, the substrate 1 has a first major surface 101. The first major surface 101 faces the z1 side in the thickness direction z.

[0030] The conductive part 2 constitutes a path for the current to flow. The current of the object to be detected flows in the conductive part 2 between the two terminals 71 and 72. Figure 2 , Figure 3 As shown, the conductive part 2 is supported on the substrate 1. The conductive part 2 is composed of, for example, a lead frame. The lead frame is composed of a material containing Cu (copper) or a Cu alloy. In this embodiment, the conductive part 2 includes a first conductive part 2A and a second conductive part 2B. The first conductive part 2A and the second conductive part 2B are respectively arranged on the first main surface 101 of the substrate 1. The details of the first conductive part 2A and the second conductive part 2B will be described later.

[0031] The resistor 5 is a passive element that performs the function of detecting current in the mounting structure A1. The resistor 5 is arranged on a path where current flows in the conductive portion 2. The resistor 5 will be described in detail later.

[0032] The detection wiring section 6 is connected to the resistor 5 and is a wiring section that shunts and flows the detection current by being connected in parallel with the resistor 5. The detection wiring section 6 includes a first detection wiring 6A and a second detection wiring 6B. The details of the detection wiring section 6 (the first detection wiring 6A and the second detection wiring 6B) will be described later.

[0033] The terminals 71 and 72 are respectively connected to the conductive portion 2. The terminals 71 and 72 are connected to devices for passing current through the conductive portion 2.

[0034] The detection terminals 73 and 74 are respectively connected to the first detection wiring 6A and the second detection wiring 6B, and are connected to, for example, a voltmeter for current measurement.

[0035] The sealing resin 8 covers at least a portion of each of the substrate 1, the conductive portion 2, and the detection wiring portion 6, and the resistor 5. The external connection terminals 71, 72 and the detection terminals 73, 74 include portions exposed from the sealing resin 8. Figure 2 , Figure 3 In the embodiment, the sealing resin 8 is omitted.

[0036] like Figure 2 and Figure 3 As shown, the first conductive portion 2A has a first pad portion 21A. The first pad portion 21A is arranged on the x1 side of the first direction x. The first pad portion 21A has a first pad main surface 210a. The first pad main surface 210a faces the z1 side of the thickness direction z. The second conductive portion 2B has a second pad portion 21B. The second pad portion 21B is arranged away from the first pad portion 21A on the x2 side of the first direction x. The second pad portion 21B has a second pad main surface 210b. The second pad main surface 210b faces the z1 side of the thickness direction z.

[0037] In the present embodiment, the mounting structure A1 includes a first bonding layer 25A and a second bonding layer 25B. The first bonding layer 25A is sandwiched between the first main surface 101 and the first pad portion 21A, and the first main surface 101 and the first pad portion 21A are bonded. The second bonding layer 25B is sandwiched between the first main surface 101 and the second pad portion 21B, and the first main surface 101 and the second pad portion 21B are bonded. The first bonding layer 25A and the second bonding layer 25B are respectively conductive. The first bonding layer 25A and the second bonding layer 25B are, for example, composed of a material containing Ag (silver), which is fired silver. The first bonding layer 25A (the second bonding layer 25B) has an area on the first bonding layer 25A (the second bonding layer 25B) where the first conductive portion 2A (the second conductive portion 2B) is not configured, and plays the role of wiring formed on the first main surface 101.

[0038] The resistor 5 is a plate-like component having a predetermined thickness. The resistor 5 is a rectangular shape with the first direction x as the long side when viewed in the thickness direction z. The resistor 5 is made of a metal plate, specifically, a NI (nickel)-Cr (chromium) alloy, a Cu-Mn (manganese) alloy, a Cu-Ni alloy, a Cu-Mn-Sn (tin) alloy, or a Fe (iron)-Cr alloy. In addition, the constituent material of the resistor 5 is not limited to these as long as it is a metal plate.

[0039] The resistor 5 is arranged so as to straddle the first pad portion 21A and the second pad portion 21B. The resistor 5 includes a first portion 5A and a second portion 5B. The first portion 5A and the second portion 5B are located at both ends of the resistor 5 in the length direction (first direction x). The first portion 5A is located on the x1 side of the first direction x, and overlaps with the first pad portion 21A when viewed in the thickness direction z. The second portion 5B is located on the x2 side of the first direction x, and overlaps with the second pad portion 21B when viewed in the thickness direction z.

[0040] The mounting structure A1 includes a first conductive bonding material 29A and a second conductive bonding material 29B. The resistor 5 is bonded to the first pad portion 21A and the second pad portion 21B via the first conductive bonding material 29A and the second conductive bonding material 29B. The first conductive bonding material 29A is sandwiched between the first pad main surface 210a and the first portion 5A to bond the first pad main surface 210a and the first portion 5A. The second conductive bonding material 29B is sandwiched between the second pad main surface 210b and the second portion 5B to bond the second pad main surface 210b and the second portion 5B. The first conductive bonding material 29A and the second conductive bonding material 29B are composed of, for example, solder.

[0041] In the present embodiment, the first bonding layer 25A includes a first detection wiring 6A. The first detection wiring 6A has a first wiring main surface 60a. The first wiring main surface 60a faces the z1 side in the thickness direction z. The first wiring main surface 60a is located on the z2 side in the thickness direction z relative to the first pad main surface 210a of the first pad portion 21A.

[0042] The first detection wiring 6A has a first extension portion 611 and a third extension portion 613. Figure 2 and Figure 3 As shown, the first extension portion 611 extends from the first pad portion 21A to the x2 side of the first direction x when viewed in the thickness direction z. The first extension portion 611 overlaps with the resistor 5 when viewed in the thickness direction z. The third extension portion 613 is connected to the first extension portion 611 and extends to the y1 side of the second direction y. The third extension portion 613 has a portion that overlaps with the resistor 5 and a portion that does not overlap with the resistor 5 when viewed in the thickness direction z. According to the above structure, the first detection wiring 6A (first extension portion 611) is conductively connected to the first pad portion 21A. The first detection wiring 6A is conductively connected to the first portion 5A of the resistor 5 via the first pad portion 21A and the first conductive bonding material 29A. In addition, the first detection wiring 6A (third extension portion 613) is connected to the detection terminal 73 (see FIG. 7 ) not shown in the figure. Figure 1 ) is turned on.

[0043] In the present embodiment, the second bonding layer 25B includes a second detection wiring 6B. The second detection wiring 6B has a second wiring main surface 60b. The second wiring main surface 60b faces the z1 side in the thickness direction z. The second wiring main surface 60b is located on the z2 side in the thickness direction z relative to the second pad main surface 210b of the second pad portion 21B.

[0044] The second detection wiring 6B has a second extension portion 612 and a fourth extension portion 614. Figure 2 and Figure 3 As shown, the second extension portion 612 extends from the second pad portion 21B to the x1 side of the first direction x when viewed in the thickness direction z. The second extension portion 612 overlaps with the resistor 5 when viewed in the thickness direction z. The fourth extension portion 614 is connected to the second extension portion 612 and extends to the y1 side of the second direction y. The fourth extension portion 614 has a portion that overlaps with the resistor 5 and a portion that does not overlap with the resistor 5 when viewed in the thickness direction z. According to the above structure, the second detection wiring 6B (second extension portion 612) is conductively connected to the second pad portion 21B. The second detection wiring 6B is conductively connected to the second portion 5B of the resistor 5 via the second pad portion 21B and the second conductive bonding material 29B. In addition, the second detection wiring 6B (fourth extension portion 614) is connected to the detection terminal 74 (see FIG. 7 ) outside the figure. Figure 1 ) is turned on.

[0045] Next, the operation of this embodiment will be described.

[0046] The mounting structure A1 includes a substrate 1, a conductive portion 2, a resistor 5, and a detection wiring portion 6. The resistor 5 is arranged on a path where a current flows in the conductive portion 2. The detection wiring portion 6 is electrically connected to the resistor 5. According to the mounting structure A1, the current flowing in the conductive portion 2 can be detected by the built-in resistor 5. In addition, in the circuit substrate on which the mounting structure A1 is mounted, it is not necessary to route a separate resistor or wiring for the resistor, and space saving can be achieved.

[0047] The conductive portion 2 includes a first conductive portion 2A and a second conductive portion 2B arranged on the first main surface 101 of the substrate 1. The first conductive portion 2A includes a first pad portion 21A arranged on the x1 side of the first direction x, and the second conductive portion 2B includes a second pad portion 21B arranged away from the first pad portion 21A on the x2 side of the first direction x. The resistor 5 includes a first portion 5A overlapping the first pad portion 21A when viewed in the thickness direction z, and a second portion 5B overlapping the second pad portion 21B when viewed in the thickness direction z. A first conductive bonding material 29A is interposed between the first pad portion 21A (first pad main surface 210a) and the first portion 5A, and the first conductive bonding material 29A bonds the first pad portion 21A (first pad main surface 210a) and the first portion 5A. A second conductive bonding material 29B is interposed between the second pad portion 21B (second pad main surface 210b) and the second portion 5B, and the second conductive bonding material 29B bonds the second pad portion 21B (second pad main surface 210b) and the second portion 5B. With such a structure, the resistor 5 can be appropriately arranged on the path where the current flows in the conductive portion 2.

[0048] A first conductive bonding layer 25A is sandwiched between the first main surface 101 and the first pad portion 21A, and the first bonding layer 25A bonds the first main surface 101 and the first pad portion 21A. The first bonding layer 25A includes a first detection wiring 6A. The first detection wiring 6A has a first extension portion 611, which extends from the first pad portion 21A to the x2 side of the first direction x when viewed in the thickness direction z. A second conductive bonding layer 25B is sandwiched between the first main surface 101 and the second pad portion 21B, and the second bonding layer 25B bonds the first main surface 101 and the second pad portion 21B. The second bonding layer 25B includes a second detection wiring 6B. The second detection wiring 6B has a second extension portion 612, which extends from the second pad portion 21B to the x1 side of the first direction x when viewed in the thickness direction z.

[0049] According to the above structure, a conductive path is formed from the first portion 5A of the resistor 5 through the first conductive bonding material 29A and the first pad portion 21A to the first extension portion 611. The first detection wiring 6A has a first wiring main surface 60a facing the z1 side of the thickness direction z. The first wiring main surface 60a is located closer to the z2 side of the thickness direction z than the first pad main surface 210a of the first pad portion 21A. According to such a structure, Figure 3 As shown, at the end of the first pad portion 21A on the x2 side of the first direction x, there is a step in the thickness direction z between the first extension portion 611 (first detection wiring 6A). As a result, for the first conductive bonding material 29A composed of solder, it is possible to prevent improper flow to the x2 side of the first direction x on the first pad portion 21A during molten bonding. Similarly, a conductive path is formed on the second portion 5B side of the resistor 5, which reaches the second extension portion 612 via the second conductive bonding material 29B and the second pad portion 21B. The second detection wiring 6B has a second wiring main surface 60b facing the z1 side of the thickness direction z. The second wiring main surface 60b is located closer to the z2 side of the thickness direction z than the second pad main surface 210b of the second pad portion 21B. At the end of the second pad portion 21B on the x1 side of the first direction x, there is a step in the thickness direction z between the second extension portion 612 (second detection wiring 6B). Thus, the second conductive bonding material 29B composed of solder can be prevented from improperly flowing to the x1 side of the first direction x on the second pad portion 21B during molten bonding. According to such a structure, the contact point of the first conductive bonding material 29A on the x2 side of the first direction x with the first portion 5A (resistor 5) can be set based on the position of the end on the x2 side of the first direction x of the first pad portion 21A. In addition, the contact point of the second conductive bonding material 29B on the x1 side of the first direction x with the second portion 5B (resistor 5) can be set based on the position of the end on the x1 side of the first direction x of the second pad portion 21B. Therefore, the resistance value of the resistor 5 is correctly displayed, and the current flowing in the conductive portion 2 can be detected with high accuracy.

[0050] The first detection wiring 6A has a third extension portion 613. The third extension portion 613 is connected to the first extension portion 611 and extends to the y1 side of the second direction y. The second detection wiring 6B has a fourth extension portion 614. The fourth extension portion 614 is connected to the second extension portion 612 and extends to the y1 side of the second direction y. According to such a structure, the first detection wiring 6A and the second detection wiring 6B can be appropriately led from the bottom of the resistor 5 to its periphery while preventing short circuits between each other. In addition, in the present embodiment, the third extension portion 613 and the fourth extension portion 614 are configured to extend to the same side (the y1 side of the second direction y) in the second direction y, but the third extension portion 613 and the fourth extension portion 614 can also be configured to extend to opposite sides in the second direction y.

[0051] First modification of the first embodiment:

[0052] Figure 4 and Figure 5 A mounting structure according to a first modified example of the first embodiment is shown. Figure 4 It is an enlarged plan view of the main parts showing a mounting structure A11 according to the present modification. Figure 5 It is along Figure 4 In addition, Figure 4 In the following drawings, the same or similar elements as those of the mounting structure A1 of the above embodiment are denoted by the same reference numerals as those of the above embodiment, and the description thereof is omitted as appropriate. Figure 4 The configurations of the various components in the following modifications and embodiments can be appropriately combined with each other within a range where no technical contradiction occurs.

[0053] Compared with the mounting structure A1 of the above embodiment, the mounting structure A11 of the present modification is additionally provided with an insulating film 9. The specific structure of the insulating film 9 is not limited at all, and is composed of, for example, a resist layer or a polyimide resin.

[0054] The insulating film 9 is arranged in a predetermined region on the first main surface 101 and the detection wiring portion 6 (the first detection wiring 6A and the second detection wiring 6B). Figure 5 As shown, the insulating film 9 is sandwiched between the first extension portion 611 (first detection wiring 6A) and the resistor 5, and between the second extension portion 612 (second detection wiring 6B) and the resistor 5. The insulating film 9 is in contact with the end of the first pad portion 21A on the x2 side of the first direction x and the end of the second pad portion 21B on the x1 side of the first direction x. The first conductive bonding material 29A and the second conductive bonding material 29B are in contact with the insulating film 9, respectively. The insulating film 9 of the above structure is formed before the resistor 5 is arranged on the first pad portion 21A and the second pad portion 21B.

[0055] According to the mounting structure A11 of this variation, by having a built-in resistor 5, it is possible to detect the current flowing in the conductive portion 2. In addition, in the circuit substrate on which the mounting structure A11 is mounted, it is not necessary to route another resistor or wiring for the resistor, which can achieve space saving. In the mounting structure A11, an insulating film 9 is additionally provided. The insulating film 9 is sandwiched between the first extension portion 611 (first detection wiring 6A) and the resistor 5, and between the second extension portion 612 (second detection wiring 6B) and the resistor 5. The first conductive bonding material 29A and the second conductive bonding material 29B are in contact with the insulating film 9, respectively. According to such a structure, the contact point of the first conductive bonding material 29A on the x2 side of the first direction x with the first portion 5A (resistor 5) and the contact point of the second conductive bonding material 29B on the x1 side of the first direction x with the second portion 5B (resistor 5) can be more accurately set based on the formation position of the insulating film 9. Therefore, the resistance value of the resistor 5 is expressed more accurately, and the current flowing through the conductive portion 2 can be detected with higher accuracy. In addition, the same effects as those of the mounting structure A1 of the above-mentioned embodiment are achieved.

[0056] Second modification of the first embodiment:

[0057] Figure 6 and Figure 7 A mounting structure according to a second modified example of the first embodiment is shown. Figure 6 It is an enlarged plan view of the main parts showing the mounting structure A12 according to the present modification. Figure 7 It is along Figure 6 In the mounting structure A12 of the present modification, the structures of the substrate 1, the conductive portion 2, and the detection wiring portion 6 are different from those of the mounting structure A1 of the above-described embodiment.

[0058] In the mounting structure A12, the conductive portion 2 is directly bonded to the first principal surface 101 of the substrate 1. Therefore, in this variant, unlike A1 of the above-mentioned embodiment, the first bonding layer 25A and the second bonding layer 25B are not provided. A back metal layer 23 is bonded to the surface of the substrate 1 on the side opposite to the first principal surface 101 (the surface on the z2 side facing the thickness direction z). The conductive portion 2 is a metal layer formed on the surface side (first principal surface 101) of the substrate 1, and the back metal layer 23 is a metal layer formed on the back side (the surface on the side opposite to the first principal surface 101) of the substrate 1. The substrate 1 is, for example, a ceramic with excellent thermal conductivity. Examples of such ceramics include SiN (silicon nitride) and aluminum oxide. The constituent materials of the conductive portion 2 and the back metal layer 23 include, for example, Cu. The constituent materials may also include materials other than Cu, such as Al (aluminum). The substrate 1 , the conductive portion 2 , and the back metal layer 23 having such a structure can be formed of, for example, a DBC (Direct Bonded Copper) substrate or an AMB (Active Metal Brazing) substrate.

[0059] In the mounting structure A12, the conductive portion 2 is patterned to form a conductive path for current to flow. In this modification, the first conductive portion 2A has a first detection wiring 6A. Figure 7 As shown, the first detection wiring 6A is connected to the first pad portion 21A, and the thickness (dimension in the thickness direction z) is smaller than that of the first pad portion 21A. The first wiring main surface 60a of the first detection wiring 6A is located on the z2 side of the thickness direction z than the first pad main surface 210a of the first pad portion 21A. The second conductive portion 2B has a second detection wiring 6B. The second detection wiring 6B is connected to the second pad portion 21B, and the thickness is smaller than that of the second pad portion 21B. The second wiring main surface 60b of the second detection wiring 6B is located on the z2 side of the thickness direction z compared to the second pad main surface 210b of the second pad portion 21B. In the example shown in the figure, the thickness of the first detection wiring 6A (the second detection wiring 6B) is about half the thickness of the first pad portion 21A (the second pad portion 21B). The first detection wiring 6A and the second detection wiring 6B are formed, for example, by half-etching the conductive portion 2.

[0060] The first detection wiring 6A has a fifth extension portion 615 and a seventh extension portion 617. Figure 6 and Figure 7As shown, the fifth extension portion 615 is connected to the first pad portion 21A, and extends from the first pad portion 21A to the x2 side of the first direction x when viewed in the thickness direction z. The fifth extension portion 615 overlaps with the resistor 5 when viewed in the thickness direction z. The seventh extension portion 617 is connected to the fifth extension portion 615 and extends to the y1 side of the second direction y. The seventh extension portion 617 has a portion that overlaps with the resistor 5 and a portion that does not overlap with the resistor 5 when viewed in the thickness direction z. According to the above structure, the first detection wiring 6A (fifth extension portion 615) is conductively connected to the first pad portion 21A. The first detection wiring 6A is conductively connected to the first portion 5A of the resistor 5 via the first pad portion 21A and the first conductive bonding material 29A. In addition, the first detection wiring 6A (seventh extension portion 617) is connected to the detection terminal 73 (see FIG. 7 ) outside the figure. Figure 1 ) is turned on.

[0061] The second detection wiring 6B has a sixth extension portion 616 and an eighth extension portion 618. Figure 6 and Figure 7 As shown, the sixth extension portion 616 is connected to the second pad portion 21B, and extends from the second pad portion 21B to the x1 side of the first direction x when viewed in the thickness direction z. The sixth extension portion 616 overlaps with the resistor 5 when viewed in the thickness direction z. The eighth extension portion 618 is connected to the sixth extension portion 616 and extends to the y1 side of the second direction y. The eighth extension portion 618 has a portion that overlaps with the resistor 5 and a portion that does not overlap with the resistor 5 when viewed in the thickness direction z. According to the above structure, the second detection wiring 6B (sixth extension portion 616) is conductively connected to the second pad portion 21B. The second detection wiring 6B is conductively connected to the second portion 5B of the resistor 5 via the second pad portion 21B and the second conductive bonding material 29B. In addition, the second detection wiring 6B (eighth extension portion 618) is connected to the detection terminal 74 (see FIG. 7 ) outside the figure. Figure 1 ) is turned on.

[0062] According to the mounting structure A12 of this modification, the current flowing in the conductive portion 2 can be detected by the built-in resistor 5. In addition, in the circuit board on which the mounting structure A12 is mounted, it is not necessary to route a separate resistor or wiring for the resistor, thereby achieving space saving.

[0063] The conductive portion 2 includes a first conductive portion 2A and a second conductive portion 2B arranged on the first main surface 101 of the substrate 1. The first conductive portion 2A includes a first pad portion 21A arranged on the x1 side of the first direction x, and the second conductive portion 2B includes a second pad portion 21B arranged away from the first pad portion 21A on the x2 side of the first direction x. The resistor 5 includes a first portion 5A overlapping the first pad portion 21A when viewed in the thickness direction z, and a second portion 5B overlapping the second pad portion 21B when viewed in the thickness direction z. A first conductive bonding material 29A is interposed between the first pad portion 21A (first pad main surface 210a) and the first portion 5A, and the first conductive bonding material 29A bonds the first pad portion 21A (first pad main surface 210a) and the first portion 5A. A second conductive bonding material 29B is interposed between the second pad portion 21B (second pad main surface 210b) and the second portion 5B, and the second conductive bonding material 29B bonds the second pad portion 21B (second pad main surface 210b) and the second portion 5B. With such a structure, the resistor 5 can be appropriately arranged on the path where the current flows in the conductive portion 2.

[0064] The first conductive portion 2A has a first detection wiring 6A. The first detection wiring 6A has a fifth extension portion 615, which extends from the first pad portion 21A to the x2 side of the first direction x when viewed in the thickness direction z. The second conductive portion 2B has a second detection wiring 6B. The second detection wiring 6B has a sixth extension portion 616, which extends from the second pad portion 21B to the x1 side of the first direction x when viewed in the thickness direction z. According to the above structure, a conductive path is formed from the first portion 5A of the resistor 5 via the first conductive bonding material 29A and the first pad portion 21A to the fifth extension portion 615. The thickness (dimension in the thickness direction z) of the first detection wiring 6A is smaller than that of the first pad portion 21A, and the first wiring main surface 60a of the first detection wiring 6A is located on the z2 side of the thickness direction z than the first pad main surface 210a of the first pad portion 21A. According to such a structure, Figure 7As shown, at the end of the first pad portion 21A on the x2 side of the first direction x, there is a step in the thickness direction z between the fifth extension portion 615 (first detection wiring 6A). Thus, for the first conductive bonding material 29A composed of solder, it is possible to prevent improper flow to the x2 side of the first direction x on the first pad portion 21A during molten bonding. Similarly, a conductive path is formed on the second portion 5B side of the resistor 5, which reaches the sixth extension portion 616 via the second conductive bonding material 29B and the second pad portion 21B. The thickness of the second detection wiring 6B is smaller than that of the second pad portion 21B, and the second wiring main surface 60b of the second detection wiring 6B is located on the z2 side of the thickness direction z than the second pad main surface 210b of the second pad portion 21B. At the end of the second pad portion 21B on the x1 side of the first direction x, there is a step in the thickness direction z between the sixth extension portion 616 (second detection wiring 6B). Thus, the second conductive bonding material 29B composed of solder can be prevented from improperly flowing to the x1 side of the first direction x on the second pad portion 21B during molten bonding. According to such a structure, the contact point of the first conductive bonding material 29A on the x2 side of the first direction x with the first portion 5A (resistor 5) can be set based on the position of the end on the x2 side of the first direction x of the first pad portion 21A. In addition, the contact point of the second conductive bonding material 29B on the x1 side of the first direction x with the second portion 5B (resistor 5) can be set based on the position of the end on the x1 side of the first direction x of the second pad portion 21B. Therefore, the resistance value of the resistor 5 is correctly displayed, and the current flowing in the conductive portion 2 can be detected with high accuracy.

[0065] The first detection wiring 6A has a seventh extension portion 617. The seventh extension portion 617 is connected to the fifth extension portion 615 and extends to the y1 side of the second direction y. The second detection wiring 6B has an eighth extension portion 618. The eighth extension portion 618 is connected to the sixth extension portion 616 and extends to the y1 side of the second direction y. According to such a structure, the first detection wiring 6A and the second detection wiring 6B can be appropriately led from the bottom of the resistor 5 to its periphery while preventing short circuits between each other. In addition, in the present embodiment, the seventh extension portion 617 and the eighth extension portion 618 are configured to extend to the same side (the y1 side of the second direction y) in the second direction y, but the seventh extension portion 617 and the eighth extension portion 618 can also be configured to extend to opposite sides in the second direction y.

[0066] Third modification of the first embodiment:

[0067] Figure 8 and Fig. 9 A mounting structure according to a third modified example of the first embodiment is shown. Figure 8It is an enlarged plan view of the main parts showing the mounting structure A13 according to the present modification. Fig. 9 It is along Figure 8 IX-IX line cross-sectional view. In the mounting structure A13 of this modification, compared with the mounting structure A12 of the second modification, an insulating film 9 is additionally provided. The specific structure of the insulating film 9 is not limited in any way, and is composed of, for example, a resist layer or a polyimide resin.

[0068] The insulating film 9 is arranged in a predetermined region on the first main surface 101 and the detection wiring portion 6 (the first detection wiring 6A and the second detection wiring 6B). Fig. 9 As shown, the insulating film 9 is sandwiched between the fifth extension portion 615 (first detection wiring 6A) and the resistor 5 and between the sixth extension portion 616 (second detection wiring 6B) and the resistor 5. The insulating film 9 is in contact with the end of the first pad portion 21A on the x2 side of the first direction x and the end of the second pad portion 21B on the x1 side of the first direction x. The first conductive bonding material 29A and the second conductive bonding material 29B are in contact with the insulating film 9, respectively. The insulating film 9 of the above structure is formed before the resistor 5 is arranged on the first pad portion 21A and the second pad portion 21B.

[0069] According to the mounting structure A13 of this variation, by the built-in resistor 5, the current flowing in the conductive part 2 can be detected. In addition, in the circuit substrate equipped with the mounting structure A13, it is not necessary to lead another resistor or wiring for the resistor, which can achieve space saving. In the mounting structure A13, an insulating film 9 is additionally provided. The insulating film 9 is sandwiched between the fifth extension 615 (first detection wiring 6A) and the resistor 5 and between the sixth extension 616 (second detection wiring 6B) and the resistor 5. The first conductive bonding material 29A and the second conductive bonding material 29B are in contact with the insulating film 9, respectively. According to such a structure, the contact point of the first conductive bonding material 29A on the x2 side of the first direction x with the first part 5A (resistor 5) and the contact point of the second conductive bonding material 29B on the x1 side of the first direction x with the second part 5B (resistor 5) can be more accurately set based on the formation position of the insulating film 9. Therefore, the resistance value of the resistor 5 is expressed more accurately, and the current flowing through the conductive portion 2 can be detected with higher accuracy. In addition, the same effects as those of the mounting structure A12 of the above-mentioned modification example are achieved.

[0070] The mounting structure (mounting structure of a resistor) of the present invention is not limited to the above-mentioned embodiment. The specific structure of each part of the mounting structure of a resistor of the present invention can be freely changed in various designs.

[0071] In the above-mentioned embodiment, the resistor 5 is set to have a structure with two terminals corresponding to the first part 5A and the second part 5B, but it can also be set to a structure with four terminals including two additional terminals for detection. The resistor 5 can be appropriately changed without depending on the number of terminals. In the case where the resistor 5 has four terminals, the structure of the first pad portion 21A and the second pad portion 21B and the detection wiring portion 6 (the first detection wiring 6A and the second detection wiring 6B) can be appropriately changed in a manner suitable for the structure of the resistor 5.

[0072] The present invention includes the structures related to the following additional notes.

[0073] Note 1:

[0074] A resistor mounting structure, comprising:

[0075] substrate;

[0076] a conductive portion supported on the substrate;

[0077] a resistor disposed on a path through which current flows in the conductive portion; and

[0078] a detection wiring portion, which is electrically connected to the resistor,

[0079] The substrate has a first main surface facing one side in the thickness direction,

[0080] The conductive portion includes a first conductive portion and a second conductive portion respectively disposed on the first main surface,

[0081] The first conductive portion has a first pad portion, the first pad portion being arranged on one side in a first direction orthogonal to the thickness direction.

[0082] The second conductive portion has a second pad portion, and the second pad portion is arranged at the other side of the first direction away from the first pad portion.

[0083] The resistor has:

[0084] a first portion overlapping the first pad portion when viewed in the thickness direction; and

[0085] a second portion overlapping the second pad portion when viewed in the thickness direction,

[0086] The first pad portion has a first pad main surface facing one side in the thickness direction,

[0087] The second pad portion has a second pad main surface facing one side in the thickness direction,

[0088] The mounting structure of the resistor body comprises:

[0089] a first conductive bonding material interposed between the first pad main surface and the first portion to bond the first pad main surface and the first portion; and

[0090] a second conductive bonding material, which is interposed between the second pad main surface and the second portion, bonding the second pad main surface and the second portion;

[0091] The detection wiring section includes:

[0092] a first detection wiring line that is electrically connected to the first pad portion; and

[0093] a second detection wiring line, which is electrically connected to the second pad portion;

[0094] The first detection wiring has a first wiring main surface facing one side in the thickness direction.

[0095] The second detection wiring has a second wiring main surface facing one side in the thickness direction.

[0096] The first wiring main surface is located on the other side of the first pad main surface in the thickness direction,

[0097] The second wiring main surface is located on the other side in the thickness direction relative to the second pad main surface.

[0098] Note 2:

[0099] The resistor mounting structure according to Supplementary Note 1 further comprises:

[0100] a first bonding layer, which is interposed between the first main surface and the first pad portion and bonds the first main surface and the first pad portion; and

[0101] The second bonding layer is interposed between the first main surface and the second pad portion and bonds the first main surface and the second pad portion.

[0102] Note 3:

[0103] According to the resistor installation structure described in Supplement 2,

[0104] The first bonding layer and the second bonding layer are respectively conductive.

[0105] The first bonding layer includes the first detection wiring.

[0106] The second bonding layer includes the second detection wiring.

[0107] Note 4:

[0108] According to the resistor installation structure described in Supplementary Note 3,

[0109] The first detection wiring has a first extension portion extending from the first pad portion toward the other side of the first direction when viewed in the thickness direction.

[0110] The second detection wiring has a second extension portion extending from the second pad portion to one side in the first direction when viewed in the thickness direction.

[0111] Note 5:

[0112] According to the installation structure of the resistor body described in Supplementary Note 4,

[0113] The first detection wiring has a third extension portion, the third extension portion is connected to the first extension portion and extends in a second direction orthogonal to the thickness direction and the first direction.

[0114] The second detection wiring has a fourth extension portion that is connected to the second extension portion and extends in the second direction.

[0115] Note 6:

[0116] According to the mounting structure of the resistor body described in any one of Supplementary Notes 2 to 5,

[0117] The substrate is made of ceramic.

[0118] Note 7:

[0119] According to the mounting structure of the resistor body described in Supplementary Note 1,

[0120] The first conductive portion has the first detection wiring,

[0121] The second conductive portion has the second detection wiring,

[0122] The first detection wiring is connected to the first pad portion and has a thickness smaller than that of the first pad portion.

[0123] The second detection wiring is connected to the second pad portion and has a thickness smaller than that of the second pad portion.

[0124] Note 8:

[0125] According to the installation structure of the resistor body described in Supplementary Note 7,

[0126] The first detection wiring has a fifth extension portion, the fifth extension portion is connected to the first pad portion and extends from the first pad portion to the other side of the first direction,

[0127] The second detection wiring has a sixth extension portion connected to the second pad portion and extending from the second pad portion toward one side in the first direction.

[0128] Note 9:

[0129] According to the mounting structure of the resistor body described in Supplementary Note 8,

[0130] The first detection wiring has a seventh extension portion, the seventh extension portion is connected to the fifth extension portion and extends in a second direction orthogonal to the thickness direction and the first direction,

[0131] The second detection wiring has an eighth extending portion that is connected to the sixth extending portion and extends in the second direction.

[0132] Note 10:

[0133] The resistor mounting structure according to any one of Supplementary Notes 7 to 9,

[0134] further comprising a back metal layer bonded to a surface of the substrate facing the side opposite to the first main surface,

[0135] The substrate is made of ceramic.

[0136] Note 11:

[0137] The resistor installation structure according to any one of Supplementary Notes 1 to 10,

[0138] further comprising an insulating film interposed between the first detection wiring and the resistor and between the second detection wiring and the resistor,

[0139] The first conductive bonding material and the second conductive bonding material are respectively in contact with the insulating film.

[0140] Note 12:

[0141] The resistor installation structure according to any one of Supplementary Notes 1 to 11,

[0142] The first conductive bonding material and the second conductive bonding material are made of solder.

[0143] Explanation of symbols

[0144] A1, A11, A12, A13—mounting structure; 1—substrate; 2—conductive part; 2A—first conductive part; 2B—second conductive part; 21A—first pad part; 21B—second pad part; 210a—first pad main surface; 210b—second pad main surface; 23—back metal layer; 25A—first bonding layer; 25B—second bonding layer; 29A—first conductive bonding material; 29B—second conductive bonding material; 5—resistor; 5A—first part; 5B—second Part; 6—detection wiring part; 6A—first detection wiring; 6B—second detection wiring; 60a—first wiring main surface; 60b—second wiring main surface; 611—first extension part; 612—second extension part; 613—third extension part; 614—fourth extension part; 615—fifth extension part; 616—sixth extension part; 617—seventh extension part; 618—eighth extension part; 71, 72—terminals; 73, 74—detection terminals; 8—sealing resin; 9—insulating film.

Claims

1. A resistor installation structure, characterized in that: have: substrate; a conductive portion supported on the substrate; a resistor disposed on a path through which current flows in the conductive portion; and a detection wiring portion, which is electrically connected to the resistor, The substrate has a first main surface facing one side in the thickness direction, The conductive portion includes a first conductive portion and a second conductive portion respectively disposed on the first main surface, The first conductive portion has a first pad portion, the first pad portion being arranged on one side in a first direction orthogonal to the thickness direction. The second conductive portion has a second pad portion, and the second pad portion is arranged at the other side of the first direction away from the first pad portion. The resistor has: a first portion overlapping the first pad portion when viewed in the thickness direction; and a second portion overlapping the second pad portion when viewed in the thickness direction, The first pad portion has a first pad main surface facing one side in the thickness direction, The second pad portion has a second pad main surface facing one side in the thickness direction, The mounting structure of the resistor body comprises: a first conductive bonding material, which is interposed between the first pad main surface and the first portion, bonding the first pad main surface and the first portion; as well as a second conductive bonding material, which is interposed between the second pad main surface and the second portion, bonding the second pad main surface and the second portion; The detection wiring section includes: a first detection wiring line that is electrically connected to the first pad portion; and a second detection wiring line, which is electrically connected to the second pad portion; The first detection wiring has a first wiring main surface facing one side in the thickness direction. The second detection wiring has a second wiring main surface facing one side in the thickness direction. The first wiring main surface is located on the other side of the first pad main surface in the thickness direction, The second wiring main surface is located on the other side in the thickness direction relative to the second pad main surface.

2. The resistor mounting structure according to claim 1, characterized in that: Also available: a first bonding layer, which is interposed between the first main surface and the first pad portion and bonds the first main surface and the first pad portion; and The second bonding layer is interposed between the first main surface and the second pad portion and bonds the first main surface and the second pad portion.

3. The resistor mounting structure according to claim 2, characterized in that: The first bonding layer and the second bonding layer are respectively conductive. The first bonding layer includes the first detection wiring. The second bonding layer includes the second detection wiring.

4. The resistor mounting structure according to claim 3, characterized in that: The first detection wiring has a first extension portion extending from the first pad portion toward the other side of the first direction when viewed in the thickness direction. The second detection wiring has a second extension portion extending from the second pad portion to one side in the first direction when viewed in the thickness direction.

5. The resistor mounting structure according to claim 4, characterized in that: The first detection wiring has a third extension portion, the third extension portion is connected to the first extension portion and extends in a second direction orthogonal to the thickness direction and the first direction. The second detection wiring has a fourth extension portion that is connected to the second extension portion and extends in the second direction.

6. The resistor mounting structure according to any one of claims 2 to 5, characterized in that: The substrate is made of ceramic.

7. The resistor mounting structure according to claim 1, characterized in that: The first conductive portion has the first detection wiring, The second conductive portion has the second detection wiring, The first detection wiring is connected to the first pad portion and has a thickness smaller than that of the first pad portion. The second detection wiring is connected to the second pad portion and has a thickness smaller than that of the second pad portion.

8. The resistor mounting structure according to claim 7, characterized in that: The first detection wiring has a fifth extension portion, the fifth extension portion is connected to the first pad portion and extends from the first pad portion to the other side of the first direction, The second detection wiring has a sixth extension portion connected to the second pad portion and extending from the second pad portion toward one side in the first direction.

9. The resistor mounting structure according to claim 8, characterized in that: The first detection wiring has a seventh extension portion, the seventh extension portion is connected to the fifth extension portion and extends in a second direction orthogonal to the thickness direction and the first direction, The second detection wiring has an eighth extending portion that is connected to the sixth extending portion and extends in the second direction.

10. The resistor mounting structure according to any one of claims 7 to 9, characterized in that: further comprising a back metal layer bonded to a surface of the substrate facing the side opposite to the first main surface, The substrate is made of ceramic.

11. The resistor mounting structure according to any one of claims 1 to 10, characterized in that: further comprising an insulating film interposed between the first detection wiring and the resistor and between the second detection wiring and the resistor, The first conductive bonding material and the second conductive bonding material are respectively in contact with the insulating film.

12. The resistor mounting structure according to any one of claims 1 to 11, characterized in that: The first conductive bonding material and the second conductive bonding material are made of solder.

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