Antenna assembly with directional antenna for communication device

Abstract

An apparatus and an accompanying antenna assembly are described. The apparatus includes circuitry that processes communication signals wirelessly received and / or transmitted over a network and an antenna assembly. The antenna assembly includes a printed circuit board having a set of conductive elements forming an antenna structure on at least one of a top surface and a bottom surface of the printed circuit board, the printed circuit board further including one or more additional conductive elements at least partially surrounding the antenna structure. The antenna assembly also includes an electrically conductive plate positioned parallel to the bottom surface of the printed circuit board, the electrically conductive plate supporting the printed circuit board at a fixed distance from the electrically conductive plate using one or more electrically conductive mechanical support elements. One or more additional conductive elements are coupled to the conductive plate through one or more conductive mechanical support elements.

Description

Technical Field

[0001] The present disclosure relates generally to antenna assemblies, and more particularly to antenna assemblies including reflectors for use as part of electronic assemblies in devices, such as communications equipment. Background Art

[0002] Any background information described herein is intended to introduce the reader to various aspects of the technology that may be related to the present embodiments described below. It is believed that this discussion helps to provide the reader with background information to facilitate a better understanding of various aspects of the present disclosure. Therefore, it should be understood that these statements should be interpreted from this perspective.

[0003] Today, wireless communication networks exist in many communication systems. Many communication devices used in these systems include multiple antennas for connecting to multiple networks. These communication devices typically include, but are not limited to, set-top boxes, gateways, cellular or wireless phones, televisions, home computers, media content players, etc. In addition, many of these communication devices may include multiple interfaces for different types of networks. Therefore, one or more antennas may be present on or within the structure of the communication device.

[0004] Many of these communication devices continue to shrink in size. As a result, any antenna or antenna assembly located inside the structure of the communication device needs to fit into a smaller area. The problem is further compounded in communication devices where multiple antennas must be embedded inside the structure in order to operate wirelessly over multiple wide area networks (WANs) as well as local area networks (LANs). Such requirements often lead to significant integration issues due to limited space and the need to minimize interference between antennas during operation. Compact antenna designs and assemblies are necessary to meet these requirements.

[0005] Newer and more sophisticated wireless WANs are also becoming commonplace at customer premises or homes, and these WANs are characterized by providing high-speed Internet access with performance similar to more traditional wired networks. To achieve this level of performance, many of these WANs require more complex, higher-gain antennas to ensure minimum user performance levels when used indoors in the home. For example, in cellular fifth-generation (5G) indoor fixed wireless access (FWA) applications, antennas must have antenna gains approaching 10 decibels (dB) to achieve the link budget required for 5G base stations.

[0006] In many antenna designs, the antenna gain and corresponding antenna directivity performance of an antenna radiating element can be improved by including a reflective element or reflector surface located at a fixed distance from one or more radiating elements. In many cases, the larger the area of ​​the reflector, the higher the antenna gain and directivity. However, the ability to increase the size of the reflector and / or the distance from (one or more) antenna radiating elements may be limited by the space limitations of the structure of the communication device as described above. The requirement to increase the antenna gain of the antenna may conflict with the space allocated to the antenna assembly. Therefore, there is a need for an improved antenna assembly for use within a communication device to provide high antenna gain performance in a compact size. Summary of the invention

[0007] The principles of the present disclosure address these and other drawbacks and deficiencies of antenna assemblies for communication devices. However, those skilled in the art will appreciate that the present principles may also provide advantages in other types of devices and systems.

[0008] According to one embodiment, an antenna assembly is described. The antenna assembly includes a printed circuit board having a set of conductive elements that form an antenna structure on at least one of a top surface and a bottom surface of the printed circuit board, and the printed circuit board also includes at least one additional conductive element that at least partially surrounds the antenna structure. The antenna assembly also includes a conductive plate positioned parallel to the bottom surface of the printed circuit board, the conductive plate supporting the printed circuit board at a fixed distance from the conductive plate using at least one conductive mechanical support element. The at least one additional conductive element is coupled to the conductive plate via the at least one conductive mechanical support element.

[0009] According to one embodiment, a device is described. The device includes a circuit capable of processing at least one of a communication signal wirelessly received from a network and a communication signal wirelessly sent to a network. The device also includes an antenna assembly coupled to the circuit. The antenna assembly includes a printed circuit board having a set of conductive elements that form an antenna structure on at least one of a top surface and a bottom surface of the printed circuit board, and the printed circuit board also includes at least one additional conductive element that at least partially surrounds the antenna structure. The antenna assembly also includes a conductive plate positioned parallel to the bottom surface of the printed circuit board, the conductive plate using at least one conductive mechanical support element to support the printed circuit board at a fixed distance from the conductive plate. The at least one additional conductive element is coupled to the conductive plate via the at least one conductive mechanical support element. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The above and other aspects, features and advantages of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0011] Figure 1 is a block diagram of an exemplary communication device to which the principles of the present disclosure may be applied;

[0012] Figure 2 is a block diagram of an exemplary gateway device to which the principles of the present disclosure may be applied;

[0013] Figure 3A and Figure 3B are two perspective views of an exemplary electronic assembly including multiple integrated antennas and antenna assemblies for use in a gateway device to which the principles of the present disclosure may be applied;

[0014] Figure 4 is a diagram of an exemplary antenna assembly to which the principles of the present disclosure may be applied;

[0015] Figure 5A and Figure 5B are graphs illustrating a set of characteristics of an exemplary antenna assembly and a similar exemplary antenna, respectively, to which the principles of the present disclosure may be applied;

[0016] Fig. 6A and Figure 6B are graphs illustrating another set of characteristics of an exemplary antenna assembly and a similar exemplary antenna, respectively, to which the principles of the present disclosure may be applied;

[0017] Fig. 7A and Figure 7B are graphs illustrating yet another set of characteristics of an exemplary antenna assembly and a similar exemplary antenna, respectively, to which the principles of the present disclosure may be applied;

[0018] Fig. 8A and Fig. 8A are graphs illustrating yet another set of characteristics of an exemplary antenna assembly and a similar exemplary antenna, respectively, to which the principles of the present disclosure may be applied;

[0019] Fig. 9 is a diagram of another exemplary antenna assembly to which the principles of the present disclosure may be applied;

[0020] Fig.10 is a diagram of yet another exemplary antenna assembly to which the principles of the present disclosure may be applied;

[0021] Fig.11 is a diagram of yet another exemplary antenna assembly to which the principles of the present disclosure may be applied;

[0022] Fig.12 is a diagram of yet another exemplary antenna assembly to which the principles of the present disclosure may be applied;

[0023] Fig.13 is an illustration of yet another exemplary antenna assembly to which the principles of the present disclosure may be applied; and

[0024] Fig.14is an illustration of yet another exemplary antenna assembly to which the principles of the present disclosure may be applied. DETAILED DESCRIPTION

[0025] The present disclosure may be applied to electronic devices or apparatuses described as assembled devices or apparatuses having one or more integrated antenna assemblies. The present disclosure also addresses manufacturing and assembly issues associated with the use of one or more of the various available integrated antenna assemblies that may be used in electronic devices or apparatuses.

[0026] This specification illustrates the principles of the present disclosure. It will therefore be appreciated that those skilled in the art will be able to design various arrangements that, although not explicitly described or shown herein, embody the principles of the present disclosure and are included within the scope of the claims.

[0027] All examples and conditional language described herein are intended for teaching purposes to help readers understand the principles of the present disclosure and the concepts contributed by the inventors to advance the art, and should be construed as not being limited to these specifically described examples and conditions.

[0028] In addition, all statements recording the principles and various aspects of the present disclosure and its specific embodiments and examples are intended to cover their structural and functional equivalents. In addition, such equivalents are intended to include currently known equivalents as well as equivalents developed in the future, i.e., any elements that perform the same function, regardless of structure.

[0029] In the embodiments herein, any element directly or indirectly expressed or described as a device for performing a specified function is intended to cover any way of performing the function, including, for example: a) a combination of elements that perform the function, or b) any mechanism having a combination of electrical or mechanical elements for performing the function. The disclosure defined by such claims lies in the fact that the functions provided by the various described devices are combined and brought together in the manner required by the claims. Therefore, it can be considered that any device capable of providing these functions is equivalent to those shown herein.

[0030] The present embodiments address problems associated with improving the performance (particularly gain and / or directivity) of antenna structures or assemblies while still maintaining the mechanical compactness and ease of manufacturing required of customer premises equipment (CPE) (e.g., gateway devices) and other similar communications equipment. The improvement in performance may be necessitated by the need to improve link performance of a network connection, or may be due to the inclusion of additional network interfaces and antenna structures in an already limited area within the CPE and communications equipment. In many cases, improving the performance of an antenna structure or assembly requires additional elements (often collectively referred to as parasitic elements) that increase antenna gain and directivity. However, achieving improved performance while meeting both the mechanical compactness requirements and the ease of manufacturing requirements of a CPE or communications equipment design is often very difficult.

[0031] The present disclosure solves these problems by utilizing characteristics associated with the use of additional conductive elements that are located near the radiating elements of an antenna structure on a printed circuit board that includes the radiating elements. The additional conductive elements are electrically connected to a conductive plate configured as a reflector that has approximately the same size as the printed circuit board and is located a small distance away from the printed circuit board. In addition, the electrical connection is achieved using conductive elements that are used to mechanically attach to the printed circuit board and support the printed circuit board from the conductive plate. The additional conductive elements improve operating performance, particularly improving the antenna gain and directivity of the antenna assembly over the performance of an antenna assembly that only configures the conductive plate as a reflector. In addition, by integrating the additional conductive elements as part of a printed circuit board assembly that includes the radiating elements of the antenna structure, a low-cost, compact, and easy-to-manufacture solution to the problem is achieved.

[0032] Go to Figure 1 , a block diagram of an embodiment of a communication device 100 according to various aspects of the present disclosure is shown. The communication device 100 can be used as part of a communication receiver, transmitter and / or transceiver device, including but not limited to a handheld radio, a set-top box, a gateway, a modem, a router, a cellular or wireless telephone, a cellular or wireless outdoor unit, a television, a home computer, a tablet computer, and a media content player. The communication device 100 may include one or more interfaces to wireless networks, including but not limited to third generation (3G), LTE or fifth generation (5G) cellular, Institute of Electrical and Electronics Engineers (IEEE) standard 802.11, Wi-Fi or other similar wireless communication protocols. It is worth noting that for the sake of brevity, several components and interconnections necessary for the complete operation of the communication device 100 (as a stand-alone device or included as part of another device) are not shown, as the components not shown are well known to those skilled in the art.

[0033] The communication device 100 includes a communication circuit 110 that interfaces with other processing circuits (e.g., a processor, memory, and a user interface) not shown. The communication circuit 110 is connected to an antenna 120. The antenna 120 provides an interface to radio waves for sending and receiving signals to and from the communication device 100.

[0034] The communication circuit 110 includes a circuit for performing signal transmission and reception of the following signal: the signal is connected to another device via the antenna 120 through the wireless network. The received signal from the antenna 120 can be processed by a low noise amplifier and tuned by a set of filters, mixers and oscillators included in the communication circuit 110. The tuned signal can be digitized and further demodulated and decoded. The decoded signal can be provided to other processing circuits. In addition, the communication circuit 110 generates, converts and / or formats input signals (e.g., audio, video or data signals) from other processing circuits for transmission through the antenna 120. The communication circuit 110 may include a power amplifier for increasing the transmission signal level of the signal sent from the communication device 100 through the wireless network. The amplification applied to the signal received from the antenna 120 and the adjustment of the amplification of the signal sent by the antenna 120 can be controlled by the control circuit in the communication circuit 110, or can be controlled by other processing circuits.

[0035] The communication circuit 110 also includes an interface for sending and receiving data (e.g., audio and / or video signals) to other processing circuits (not shown). The communication circuit 110 further amplifies and processes the data so as to provide the data to the antenna 120 for transmission or to provide the data to other processing circuits. The communication circuit 110 can receive or send audio, video, and / or data signals in analog or digital signal formats. In one embodiment, the communication circuit 110 has an Ethernet interface for transmitting data to other processing circuits and a wireless network interface for communicating with the antenna 120. The communication circuit 110 includes processing circuits for converting signals between Ethernet formats and wireless formats (e.g., 3G, LTE, or 5G cellular formats).

[0036] Antenna 120 interfaces signals between communication circuit 110 and an over-the-air wireless network (e.g., a 3G or LTE cellular network). In some embodiments, antenna 120 may be configured to send and receive wireless signals present within a certain frequency range. For example, antenna 120 may be configured to send and receive wireless signals within a frequency range of 3300 megahertz (MHz) to 4200 (MHz), referred to as the N77 / N78 band. In one embodiment, antenna 120 may be configured to optimally send and receive wireless signals present in the N77 / N78 band used within the frequency range of LTE cellular services, while reducing the ability to send and receive wireless signals at frequencies outside of the frequency band.

[0037] The antenna 120 may be physically separated from the communication circuit 110 in the communication device 100. Separation may be necessary to prevent interference between the operation of the antenna 120 and the communication circuit 110. Separation may additionally or alternatively be necessary to allow the operation of the antenna 120 to be properly or optimally positioned relative to an area or space within the communication device 100. In these cases, the antenna 120 may be referred to as an antenna assembly. The antenna 120 may include a connection interface for communicating transmit and receive signals with the communication circuit 110. In some embodiments, the connection interface may utilize a coaxial cable for signal connections and associated ground reference connections between the antenna 120 and the interface at the communication circuit 110.

[0038] It is worth noting that more than one antenna 120 may be used in the communication device 100. Using more than one antenna provides additional performance capabilities and control options. For example, in one embodiment, a first antenna may be oriented along a first direction or axis, while a second antenna may be oriented along a second direction or axis different from the first direction or axis. In another embodiment, the two antennas may be physically located at opposite ends of the communication device 100 or a larger device that includes the communication device 100.

[0039] Figure 1 The communication device 100 in the embodiment is primarily described as operating in accordance with a cellular wireless network (e.g., 3G, LTE, or 5G). It will be appreciated by those skilled in the art that other network standards and protocols that include wireless physical interfaces may be used. For example, the communication device 100 may be easily configured to operate in accordance with the standards and protocols of a Bluetooth network, a WiMax network, a Wi-Fi network, or any number of wireless network standards or protocols that are or will be available. In addition, more than one of these networks may be used interchangeably or simultaneously.

[0040] Go to Figure 2 , a block diagram of an exemplary gateway device 200 according to various aspects of the present disclosure is shown. The gateway device 200 may be similar to Figure 1 The gateway device 200 is operated in the manner of the communication device 100 described in . The gateway device 200 can be used in a customer's premises or home to connect a WAN outside the premises with a LAN operating within the premises. In the gateway device 200, a wide area network (WAN) is coupled to a WAN transceiver 270 via antennas 272 and 274. The WAN transceiver 270 is coupled to a processor 210. The processor 210 is coupled to a memory 290. The processor 210 is also coupled to an audio / video interface 220, a local area network (LAN) transceiver 240, a LAN transceiver 250, and an Ethernet interface 260. The LAN transceiver 240 is coupled to an antenna 242. The LAN transceiver 250 is coupled to an antenna 252 and an antenna 254. The user interface 280 is also coupled to the processor 210. It should be understood that for the sake of brevity, several components and interconnections necessary for the complete operation of the gateway device 200 are not shown, as the components not shown are well known to those skilled in the art. The gateway device 200 can operate as an interface to a WAN (eg, a cellular, satellite, microwave, or terrestrial communications network) and can also provide an interface to one or more devices used in the home and connected through wired and wireless home networks or LANs.

[0041] WAN transceiver 270 includes circuits for performing network radio frequency (RF) signal modulation and transmission functions for signals provided to the WAN from gateway 200 via antennas 272 and 274, and performing RF signal tuning and demodulation functions for signals received from the WAN at gateway 200 via antennas 272 and 274. RF modulation and demodulation functions are the same as those commonly used in communication systems (e.g., wireless, cellular, satellite, and terrestrial systems). It is worth noting that in some embodiments, WAN transceiver 270 can be referred to as a tuner, even though the tuner can also include modulation and transmission circuits and functions. Processor 210 receives demodulated network communication signals from WAN transceiver 270 and provides any data or content formatted for network transmission to WAN transceiver 270 for modulation and transmission on an external network. WAN transceiver 270 can also include circuits for signal conditioning, filtering, and / or signal conversion (e.g., optoelectronic signal conversion). Antennas 272 and 274 can be any type of antenna suitable for sending and / or receiving signals within the frequency range used by the WAN. In some embodiments, one or both of antennas 272 and 274 may be included in the structure of gateway device 200. In some embodiments, one or both of antennas 272 and 274 may be high gain dual polarized antennas. In some embodiments, one or both of antennas 272 and 274 may utilize additional elements (e.g., reflectors) to improve antenna performance. In some embodiments, antenna 272 may be used to send signals over a WAN, and antenna 274 may be used to receive signals over a WAN. In some embodiments, antennas 272 and 274 may be configured to operate using an antenna diversity mechanism. In some embodiments, antennas 272 and 274 may be configured to operate using a cooperative multiple input multiple output (MIMO) antenna mechanism.

[0042] System memory 290 supports content and data processing and Internet Protocol (IP) functions in processor 210, and is also used as a storage device for applications, programs, control codes and media content and data information. System memory 290 may include one or more of the following storage elements, including but not limited to RAM, ROM, electrically erasable programmable ROM (EEPROM) and flash memory. System memory 290 may also include one or more integrated memory elements, including but not limited to magnetic media hard drives and optical media disk drives. Digital content and / or data stored in memory 290 can be retrieved, processed and provided to one or more of audio / video interface 220, telephone interface 230, transceivers 240 and 250, Ethernet interface 260, WAN transceiver 270 and user interface 280 by processor 210.

[0043] The audio / video interface 220 allows connection to an audio / video reproduction device, such as the above-mentioned television display device or other media device, such as a set-top box, etc. The audio / video interface 220 may include additional signal processing circuits, including but not limited to digital-to-analog converters, signal filters, digital and / or analog signal format converters, modulators, demodulators, etc. The audio / video interface 220 also includes one or more physical connectors to connect to the audio / video reproduction device using one or more of several different types of audio / video connection cables. The one or more physical connectors may include but are not limited to RCA or telephone type connectors, HDMI connectors, digital video interface (DVI) connectors, Sony / Philips digital interface (S / PDIF) connectors, Toshiba Link (Toslink) connectors, and F-type coaxial connectors.

[0044] Ethernet interface 260 allows connection to external devices that conform to IEEE 802.3 or similar communication protocols (e.g., Figure 1 The Ethernet interface 260 includes an RJ-45 type physical interface connector or other standard interface connector to allow connection to an external local computer or other Ethernet connected device.

[0045] The processor 210 may be a programmable microprocessor that can be reconfigured using downloadable instructions or software codes stored in the memory 290. The processor 210 may also be a specially programmed controller and data processor having internal control codes for controlling, managing and processing all functions and data in the gateway 200. The processor 210 may also be operable to receive and process user input signals provided via the user interface 280. The user interface 280 may include a user input or input mechanism, such as a set of buttons, a keyboard, or a microphone. The user interface 280 may also include a circuit for converting user input signals into a data communication format to provide to the processor 210. The user interface 280 may also include some form of user notification mechanism to show device functions or states, such as indicator lights, speakers, or displays. The user interface 280 may also include a circuit for converting data received from the processor 210 into a signal that can be used with a user notification mechanism.

[0046] LAN transceiver 240 together with antenna 242 and LAN transceiver 250 together with antennas 252 and 254 provide a wireless communication interface to other devices in a home network or LAN. LAN transceiver 240 and LAN transceiver 250 may include various electronic circuits for receiving signals and sending signals to other devices through antenna 242 and antennas 252 and 254, respectively. The various electronic circuits may include, but are not limited to, antenna switches, signal amplifiers, signal meters, frequency converters, modulators, demodulators, and transmission processors. Further details regarding the configuration and operation of transceivers similar to LAN transceiver 240 and LAN transceiver 250 will be described below.

[0047] It is worth noting that the LAN transceiver 240 and the LAN transceiver 250 can operate using two different communication protocols. In some embodiments, the LAN transceiver 240 transmits signals with other wireless devices through the antenna 242 using the IEEE 802.11 protocol. The LAN transceiver 250 also transmits signals with other wireless devices through the antennas 252 and 254 using the Zigbee protocol. It is worth noting that in other embodiments, the LAN transceiver 240 and the LAN transceiver 250 can be configured to operate using other wireless communication protocols, such as Thread, Bluetooth, Z-Wave, and Wi-Fi. Antennas 242, 252, and 254 can be any type of antenna suitable for sending and / or receiving signals within the frequency range used by the LAN. In some embodiments, one or more of the antennas 242, 252, and 254 can be included in the structure of the gateway device 200. In some embodiments, one or more of the antennas 242, 252, and 254 can be high-gain dual-polarized antennas. In some embodiments, one or more of the antennas 242, 252, and 254 can utilize additional elements (e.g., reflectors) to improve antenna performance. In some embodiments, antennas 252 and 254 may also be configured for one or more of transmit / receive, antenna diversity, and MIMO operations.

[0048] Now go to Figure 3A and Figure 3B , showing first and second perspective views of an exemplary electronic assembly 300 including multiple antennas and an integrated antenna assembly according to aspects of the present disclosure. The electronic assembly 300 may be included as a device for wireless communication (e.g., Figure 2 The gateway device 200 described in Figure 1 300). The electronic assembly 300 is configured to be completely contained within the housing of the device. However, in some embodiments, some portions of the electronic assembly 300 (including some or all of the one or more antenna assemblies) may be located outside the housing. For reference purposes, Figure 3AA perspective view from the front of the electronic assembly 300 is shown, and Figure 3B 300 is shown as a perspective view from the opposite side or back of the electronic assembly 300. It is worth noting that not all antennas or antenna assemblies may be shown in FIG. Figure 3A and Figure 3B However, when Figure 3A and Figure 3B When an antenna or antenna assembly is shown in both perspective views, the antenna or antenna assembly is provided with the same reference numeral.

[0049] Electronic assembly 300 includes antenna assemblies 305, 310, 315, and 320. Antenna assemblies 305, 310, 315, and 320 are configured to send and receive signals in the 5 GHz frequency band for the Institute of Electrical and Electronics Engineers (IEEE) 802.11 wireless communication protocol (commonly known as Wi-Fi). Antenna assemblies 305, 310, 315, and 320 can operate independently as part of an antenna diversity system, or can operate in coordination as part of a multiple-input multiple-output (MIMO) antenna system. Antenna assemblies 305, 310, 315, and 320 can be physically located at different locations and can be oriented at different locations to improve diversity or MIMO performance.

[0050] Electronic assembly 300 also includes antenna assemblies 325, 330, 335, and 340. Antenna assemblies 325, 330, 335, and 340 are configured to send and receive signals in the 2.4 GHz frequency band for IEEE 802.11 wireless communication protocol or Wi-Fi. Antenna assemblies 325, 330, 335, and 340 can operate as part of an antenna diversity system or a MIMO antenna system. Antenna assemblies 325, 330, 335, and 340 can be physically located at different locations and can be oriented at different locations in a manner similar to that described above.

[0051] Electronic assembly 300 also includes antenna assemblies 350, 355, 360, and 365. Antenna assemblies 350, 355, 360, and 365 are configured to send and receive signals in a frequency range of 600 MHz to 2700 MHz (referred to as the global cellular 4G-LTE band) and a frequency range of 3300 MHz to 4200 MHz (N77 / N78 band) for cellular 5G communication protocols. Antenna assemblies 350, 355, 360, and 365 are configured as low-gain broadband antennas. Antenna assemblies 350, 355, 360, and 365 can operate as part of an antenna diversity system or a MIMO antenna system as described above. Antenna assemblies 350, 355, 360, and 365 can be physically located at different locations and can be oriented at different locations in a manner similar to that described above.

[0052] Electronic assembly 300 also includes antenna assemblies 370 and 375. Antenna assemblies 370 and 375 are configured to send and receive signals in the frequency range of 3300 MHz to 4200 MHz (N77 / N78) for cellular 5G communication protocols. Antenna assemblies 370 and 375 are configured to operate as high gain dual polarized directional antennas. Antenna assemblies 370 and 375 can operate as part of the described antenna diversity system or MIMO antenna system. Antenna assemblies 370 and 375 can be physically located in different locations and can be oriented in different locations in a manner similar to that described above.

[0053] The electronic assembly 300 may include Figure 3A and Figure 3B Additional antennas not shown in the figure. In some embodiments, these additional antennas can be printed or formed as patterns on a printed circuit board in the electronic component 300. In some embodiments, these additional antennas can be formed of a conductive material (e.g., copper) and attached to the printed circuit board. For example, the electronic component 300 may include an antenna printed on a circuit board that operates in a 2.4 GHz frequency band for a communication protocol associated with an Internet of Things (IoT) network. The electronic component 300 may also include two antennas mounted to the printed circuit board and formed of a conductive material (e.g., copper) and operating in a 1500 MHz frequency band (referred to as the B32 band) for using a cellular LTE / 4G communication protocol. It is worth noting that in some embodiments, the number of antennas and / or antenna assemblies included as part of the electronic component may be more or less than that described herein for the electronic component 300.

[0054] Now go to Figure 4 , a diagram of an exemplary antenna assembly 400 according to aspects of the present disclosure is shown. The antenna assembly 400 may be included as a device for wireless communication (e.g., Figure 1 The communication device 100 described in Figure 2 3). More specifically, the antenna assembly 400 can be used for one or more antenna assemblies 370, 375 described in FIG. 3. The antenna assembly 400 can be referred to as a dual-polarized high-gain antenna for use in a frequency range or frequency band associated with wireless network communications as described above.

[0055] The antenna assembly 400 includes a printed circuit board 405, which provides a base material for supporting a set of conductive traces in a pattern layout. The printed circuit board 405 is made of a non-conductive rigid laminate material that is typically designed for use in radio frequency (RF) circuits. The thickness of the laminate material is typically between 0.5 millimeters (mm) and 1.625 mm. In this embodiment, the thickness of the laminate material is 0.6 mm. The printed circuit board 405 also has a layer of conductive material, such as copper, laminated on both surfaces of the laminate, from which a pattern of conductive elements can be etched. This arrangement of the printed circuit board 405 can be referred to as a double-layer or double-sided printed circuit board. The patterned conductive elements are antenna elements, which, together with the additional elements used in the antenna assembly 400, form an antenna structure.

[0056] Although antenna assembly 400 uses a double layer printed circuit board for printed circuit 405, other embodiments may use a single layer printed circuit board in which the conductive layer is laminated on only one surface of the laminate material. In other embodiments, a multilayer printed circuit board may be used. A multilayer printed circuit board is constructed using two or more laminates having conductive layers attached to the outer layers and between two or more laminates, all of which are bonded together. Each conductive layer may have the same or different conductive element patterns etched from the conductive material.

[0057] The antenna assembly 400 also includes a first set of conductive elements 410a and 410b located on a first surface or top surface of the printed circuit board 405. The conductive elements 410a and 410b are shown as triangles with one vertex of each element pointing toward each other. The conductive element 420 is included on a second surface or bottom surface at or near the center of the printed circuit board 405. The conductive element 420 is coupled between the vertices of the conductive elements 410a and 410b pointing toward each other. The conductive element 420 is connected to the conductive elements 410a and 410b from top to bottom through the laminate material using an electrical connection mechanism (e.g., a solder connection or a plated through hole). The conductive elements 410a and 410b, together with the conductive element 420, form an active element of a first bow-tie antenna structure oriented in a first polarization direction.

[0058] The antenna assembly 400 also includes a second set of conductive elements 415a and 415b located on a second or bottom surface of the printed circuit board 405. The conductive elements 415a and 415b are shown as having a similar shape to the conductive elements 410a and 410b, but are positioned orthogonal to the conductive elements 410a and 410b. The conductive element 425 is included on the first or top surface at or near the center of the printed circuit board 405. The conductive element 425 is coupled between the vertices of the conductive elements 415a and 415b in a manner similar to that described above. The conductive elements 415a and 415b, together with the conductive element 425, form an active element of a second bow-tie antenna structure that is oriented in a second polarization direction orthogonal to the first bow-tie antenna structure.

[0059] The dimensions of conductive elements 410a and 410b and conductive elements 415a and 415b can be determined empirically and / or experimentally based on the desired or desired operating characteristics of the antenna structure (e.g., a bow-tie antenna structure). For example, conductive elements 410a and 410b and conductive elements 415a and 415b span an area of ​​approximately 35mm x 35mm so as to operate optimally in the frequency range of 3300MHz to 4200MHz. Additional details can be added to one or more of conductive elements 410a and 410b and conductive elements 415a and 415b to fine-tune the operating frequency range and other operating characteristics of the antenna structure. As shown, conductive element 410b is a triangle, while conductive elements 410a, 415a, and 415b are triangles (where a portion of one side of the triangle is extended to make the shape more like an arrow). The extension of the points along one side extends the operating frequency bandwidth or frequency range of the antenna structure.

[0060] Antenna assembly 400 also includes coaxial cables 430 and 435 for respectively connecting to communication circuits (e.g., Figure 1The antenna assembly 400 also includes a conductive plate 450 that is positioned parallel to and below the bottom surface of the printed circuit board 405. The conductive plate 450 is positioned or spaced a predetermined distance from the bottom surface of the printed circuit board 405. The predetermined distance can be determined empirically and / or experimentally based on the desired or expected operating characteristics of the plate 450 and the first and second bow-tie antenna structures. In one embodiment, the distance is 8.4 mm. In other embodiments, the distance may be different and is part of the characteristics used to determine the operating performance of the antenna assembly 400. The conductive plate 450 is electrically and / or mechanically coupled to the printed circuit board 405 using a conductive structure to maintain the distance. As shown, the conductive structure is a set of four conductive sheets that are cut and / or formed from the conductive plate 450 and are oriented perpendicular to the surface of the conductive plate 450. The ends of the conductive sheet are fixed (e.g., soldered) to the printed circuit board 405 at connection points 475a, 475b, 475c, and 475d. In other embodiments, other structures can be used to position and fix the conductive plate 450 to the printed circuit board at a defined spacing or distance from the printed circuit board 405, including but not limited to conductive screws, conductive screw-in brackets, wires, etc.

[0061] The size of the conductive plate 450 can be determined based on the operating characteristics of the antenna assembly (e.g., frequency range). The thickness can range from 0.1 mm to 1 mm. In one embodiment, the thickness is 0.3 mm. The conductive plate 450 can also include a non-conductive backing material (e.g., plastic) to provide additional rigidity. The length and width dimensions can be similar to the dimensions of the printed circuit board 405, although it may be advantageous for the conductive plate 450 to be larger in area than the printed circuit board 405. As described above, the size of the conductive plate partially determines the antenna of the antenna assembly 400, and the size may actually be limited by the available space within the communication device (e.g., the electronic assembly 300 in Figure 3). In one embodiment, the conductive plate 450 spans an area of ​​59 mm x 59 mm, while the printed circuit board 405 spans an area of ​​49 mm x 49 mm.

[0062] The conductive plate 450 may be referred to as a reflective element or reflector. The operating characteristics of the first and second bow-tie antenna structures may be modified, adjusted or tuned based on the shape and size of the conductive plate 450 and the distance between the conductive plate 450 and the first and second bow-tie antenna structures.

[0063] It is noteworthy that the area of ​​the printed circuit board 405 is larger than the area required or desired to implement the first and second bow-tie antenna structures described above. The additional area allows for connection and fixing points for the conductive sheet or similar support mechanism of the conductive plate 450 to support the printed circuit board 405. The additional area also allows for the inclusion of additional conductive traces around the first and second bow-tie antenna structures. It is also noteworthy that while four conductive sheets located near the four corners of the conductive plate 450 are used to support the printed circuit board 405, in other embodiments, more or fewer conductive sheets and different sheet placements may be used.

[0064] Coaxial cables 430 and 435 are positioned to pass through a space (not shown) between conductive plate 450 and the bottom surface of printed circuit board 405. The center conductor of coaxial cable 430 is attached to a first bow-tie antenna structure at a signal interface point 440 near the connection of the vertex of conductive element 410a with conductive element 420. The center conductor of coaxial cable 435 is attached to a second bow-tie antenna structure at a signal interface point 445 near the connection of the vertex of conductive element 415a with conductive element 425. The outer ground shield of coaxial cable 430 is attached to conductive plate 450 at a ground interface point 455. Similarly, the outer ground shield of coaxial cable 435 is attached to conductive plate 450 at a ground interface point 460. The connection can be made using a soldering mechanism or a plug and socket interface mechanism suitable for RF.

[0065] The antenna assembly 400 also includes conductive elements 465a and 465b on the top surface of the printed circuit board 405. The conductive elements 465a and 465b are each shown as two linear sections that form a right angle (with their vertices located at diagonally opposite corners) and extend along the edge of the printed circuit board 405. Further connections are made between the vertices of each of the conductive elements 465a and 465b and the connection points 475b and 475d. In this way, the conductive elements 465a and 465b are electrically coupled to the conductive plate 450 by positioning the conductive plate 450 and the conductive structures of the printed circuit board 405.

[0066] The antenna assembly 400 also includes conductive elements 470a and 470b on the bottom surface of the printed circuit board 405. The conductive elements 470a and 470b are each shown as two linear sections that form a right angle (with their vertices located at the other two diagonally opposite corners) and extend along the edge of the printed circuit board 405 relative to the conductive elements 465a and 465b. Further connections are made between the vertices of each of the conductive elements 470a and 470b and the connection points 475a and 475c. In this way, the conductive elements 465a and 465b are electrically coupled to the conductive plate 450 as described above.

[0067] The conductive elements 465a, 465b, 470a, and 470b may be referred to as reflective elements in a manner similar to that described above for the conductive plate 450. As with the conductive plate 450, the shape and size of the conductive elements 465a, 465b, 470a, and 470b and the distance between the elements and the first and second bow-tie antenna structures may be adjusted to tune the operating performance of the antenna assembly 400. The conductive plate 450 and the conductive elements 465a, 465b, 470a, and 470b electrically connected to the conductive plate 450 by the conductive support mechanism form an inexpensive and easy to manufacture three-dimensional open reflector structure, similar to an open box reflector or reflective cavity, which effectively surrounds the first and second bow-tie antenna structures from the sides and below the printed circuit board 405. As will be seen, the addition of the conductive elements 465a, 465b, 470a, and 470b as described herein improves the operating performance of the antenna assembly 400, particularly the antenna gain and directivity, compared to the same design without these conductive elements.

[0068] It is noteworthy that the corners of the printed circuit board 405 near the conductive element 465b and the conductive element 465b have radial or curved corner shapes to conform to the size and space constraints of the antenna assembly 400 in the communication device (e.g., the electronic assembly 300 in Figure 3). The presence of this modification has minimal impact on the operating performance of the antenna assembly 400. In addition, the impact on the operating performance can be further adjusted or eliminated to account for this modification.

[0069] Now go to Figure 5A and Figure 5B , shows a pair of graphs 500 illustrating a set of electrical characteristics associated with the operational performance of two similar antenna structures according to aspects of the present disclosure. Each graph 500 represents the design simulation results of the magnitude of the peak antenna gain values ​​displayed over a frequency range. More specifically, Figure 5A The graph 500 in FIG. 1 shows the peak antenna gain values ​​versus frequency for each antenna structure (ie, a bow-tie antenna structure) included in an antenna assembly similar to FIG. Figure 4 , but does not include an open-box reflector or reflective cavity structure (eg, conductive elements 465a, 465b, 470a, and 470b and conductive plate 450). Figure 5B The graph 500 in FIG. 1 shows the peak antenna gain values ​​versus frequency for each antenna structure included in an antenna assembly similar to Figure 4 The antenna assembly 400 including the open box reflector or reflective cavity structure described in . The peak antenna gain value of each antenna structure was measured at the coaxial cables connected to the antenna assembly (ie, coaxial cables 430 and 435).

[0070] Graph 500 includes an x-axis 510 showing frequency measured in gigahertz (GHz). Graph 500 also includes a y-axis 520 showing the peak gain magnitude of each antenna structure relative to an omnidirectional antenna (dBi) measured in decibels. Figure 5A In FIG. 5 , line 530 shows the relationship between the peak gain value and the frequency of the first bow-tie antenna structure included in the antenna assembly without the out-of-box reflector or reflective cavity structure. In addition, line 540 shows the relationship between the peak gain value and the frequency of the second bow-tie antenna structure included in the antenna assembly without the out-of-box reflector or reflective cavity structure. Figure 5B , line 535 shows something like Figure 4 The peak gain value versus frequency of the first bow-tie antenna structure included in the antenna assembly described in (i.e., having an open-box reflector or reflective cavity structure) is shown in FIG. 545. In addition, line 545 shows a peak gain value similar to Figure 4 The relationship between the peak gain value and frequency of the second bow-tie antenna structure included in the antenna assembly described in the specification. Figure 5B The peak antenna gain performance shown in the graph 500 is particularly good in the 5G cellular N77 / N78 frequency band (i.e., 3.3 GHz to 4.2 GHz). Figure 5A The peak antenna gain performance shown in graph 500 is 1 to 1.5 dBi higher or more.

[0071] Now go to Fig. 6A and Figure 6B , shows a pair of graphs 600 illustrating another set of electrical characteristics associated with the operational performance of two similar antenna structures according to aspects of the present disclosure. Each graph 600 represents the design simulation results of the magnitude of the peak directivity value displayed over a frequency range. More specifically, Fig. 6A and Figure 6B The curve diagram 600 in FIG. Figure 5A and Figure 5B The peak directivity value of the same antenna assembly versus frequency. The peak directivity value of each antenna structure is measured in the same manner as described above.

[0072] Graph 600 includes an x-axis 610 that displays frequency in gigahertz (GHz). Graph 600 also includes a y-axis 620 that displays the peak directivity magnitude of each antenna structure in dBi. Fig. 6A , line 630 shows something like Figure 4 The peak directivity value versus frequency of the first bow-tie antenna structure included in the antenna assembly without a reflective element described in . In addition, line 640 shows a value similar to Figure 4 The relationship between the peak directivity value and frequency of the second bow-tie antenna structure included in the antenna assembly without a reflective element described in . Figure 6B , line 635 shows something like Figure 4 The relationship between the peak directivity value and frequency of the first bow-tie antenna structure included in the antenna assembly described in FIG. 645 shows a similar Figure 4 The relationship between the peak directivity value and frequency of the second bow-tie antenna structure included in the antenna assembly described in FIG. Figure 6B The peak directivity performance shown in graph 600 in FIG. 1 is, in particular, higher than that in the cellular 5G N77 / N78 frequency bands. Fig. 6A The peak directivity performance shown in graph 600 is 1 to 1.5 dBi or more higher.

[0073] Now go to Fig. 7A and Figure 7B , shows a pair of graphs 700 illustrating yet another set of electrical characteristics associated with the operational performance of two similar antenna structures according to aspects of the present disclosure. Each graph 700 represents the design simulation results of antenna efficiency values ​​displayed over a frequency range. More specifically, Fig. 7A and Figure 7B The curve diagram 700 in FIG. 7 shows the curve diagrams of Figure 5A and Figure 5B The relationship between the antenna efficiency value and the frequency of the same antenna assembly. The antenna efficiency value of each antenna structure is measured in the same manner as above.

[0074] Graph 700 includes an x-axis 710 that displays frequency in gigahertz (GHz). Graph 700 also includes a y-axis 720 that displays the magnitude of antenna efficiency for each antenna structure in percent (%). Fig. 7A , line 730 shows something like Figure 4 The relationship between the antenna efficiency value and frequency of the first bow-tie antenna structure included in the antenna assembly without an open-box reflector or reflective cavity structure described in FIG. 7 and FIG. 8 . In addition, line 740 shows a value similar to Figure 4 The relationship between the antenna efficiency value and the frequency of the second bow-tie antenna structure included in the antenna assembly without an open-box reflector or a reflective cavity structure described in . Figure 7B , line 735 shows something like Figure 4 The relationship between the antenna efficiency value and the frequency of the first bow-tie antenna structure included in the antenna assembly described in FIG. 745 shows a similar Figure 4 The relationship between the antenna efficiency value and frequency of the second bow-tie antenna structure included in the antenna assembly described in the specification. Fig. 7A The antenna efficiency performance shown in the graph 700 in FIG. Figure 7B The antenna efficiency performance shown in graph 700 in FIG. 7 has similar antenna efficiency and both exceed 80% antenna efficiency, especially in the cellular 5G N77 / N78 frequency bands.

[0075] Now go to Fig. 8A and Figure 8B , shows a pair of graphs 800 illustrating another set of electrical characteristics associated with the operational performance of two similar antenna structures according to aspects of the present disclosure. Each graph 800 represents the design simulation results of return loss values ​​and antenna signal isolation values ​​displayed over a frequency range. More specifically, Fig. 8A and Figure 8B The curve diagram 800 in FIG. 8 shows the above-mentioned Figure 5A and Figure 5B The relationship between the return loss value and antenna signal isolation value of the same antenna assembly and the frequency. The antenna return loss value and antenna isolation value of each antenna structure are measured in the same manner as described above.

[0076] Graph 800 includes an x-axis 810 that displays frequency in gigahertz (GHz). Graph 800 also includes a y-axis 820 that displays the magnitude of return loss for each antenna structure and the magnitude of antenna signal isolation between each antenna structure in dB. Fig. 8A , line 830 shows something like Figure 4 The relationship between the return loss value and frequency of the first bow-tie antenna structure included in the antenna assembly without an open-box reflector or reflective cavity structure described in . In addition, line 840 shows a relationship similar to Figure 4 The relationship between the return loss value and frequency of the second bow-tie antenna structure included in the antenna assembly without an open-box reflector or reflective cavity structure described in . In addition, line 850 shows a relationship similar to Figure 4 The antenna signal isolation value between the first bow-tie antenna structure and the second bow-tie antenna structure included in the antenna assembly without a reflective element described in . Figure 8B , line 835 shows something like Figure 4 The relationship between the return loss value and frequency of the first bow-tie antenna structure included in the antenna assembly described in FIG. 845 shows a similar Figure 4 The relationship between the return loss value and frequency of the second bow-tie antenna structure included in the antenna assembly described in FIG. 8 and FIG. 9 . In addition, line 855 shows a value similar to Figure 4 Antenna signal isolation value between the first bow-tie antenna structure and the second bow-tie antenna structure included in the antenna assembly described in. Fig. 8A The return loss and antenna isolation performance shown in the graph 800 and Figure 8B The return loss and antenna isolation performance shown in the curve graph 800 in both achieve a return loss of less than -10dB and an antenna signal isolation of less than -20dB, especially in the cellular 5G N77 / N78 frequency bands.

[0077] Now go to Fig. 9 , showing a diagram of another exemplary antenna assembly 900 according to aspects of the present disclosure. The antenna assembly 900 may be included as a device for wireless communication (e.g., Figure 1 The communication device 100 described in Figure 2 More specifically, antenna assembly 900 may be used with one or more antenna assemblies 370, 375 described in FIG. 3. Antenna assembly 900 may be referred to as a dual-polarized high-gain antenna for use in a frequency range or frequency band associated with the wireless network communications described above. Except as described below, the structure, orientation, and operation of any element not described for antenna assembly 900 are similar to those described above. Figure 4 The structure, orientation, and operation of the same elements as those described for antenna assembly 400 in and will not be described in further detail herein.

[0078] The antenna assembly 900 includes conductive elements 965a and 965b located on the top surface of the printed circuit board 905 and conductive elements 970a and 970b located on the bottom surface of the printed circuit board 905. The shapes of the conductive elements 965a and 965b and the conductive elements 970a and 970b are similar to those of the same elements in the antenna assembly 400, except that the length of each linear portion overlaps each other in the x and y directions in the region 995. The overlapping region 995 is not electrically connected to each other, in part because the conductive elements 965a and 965b and the conductive elements 970a and 970b are located on opposite sides of the printed circuit board. The conductive elements 965a and 965b and the conductive elements 970a and 970b operate as reflective elements together with the reflector formed by the conductive plate 950 in a manner similar to that described above. The dimensions, including the length and position of the overlapping region 995, can be adjusted to change or tune the operating performance of the antenna assembly 900.

[0079] Now go to Fig.10 , a diagram of another exemplary antenna assembly 1000 according to aspects of the present disclosure is shown. The antenna assembly 1000 may be included as a device for wireless communication (eg, Figure 1 The communication device 100 described in Figure 2 More specifically, antenna assembly 1000 may be used with one or more antenna assemblies 370, 375 described in FIG. 3. Antenna assembly 1000 may be referred to as a dual-polarized high-gain antenna for use in a frequency range or frequency band associated with the wireless network communications described above. Except as described below, the structure, orientation, and operation of any element not described for antenna assembly 1000 are similar to those described above. Figure 4 The structure, orientation, and operation of the same elements as those described for antenna assembly 400 in and will not be described in further detail herein.

[0080] The antenna assembly 1000 includes a conductive element 1090 located on the top surface of the printed circuit board 1005. The conductive element 1090 is shown as a rectangular loop around the first bow-tie antenna structure and the second bow-tie antenna structure, which follows the shape of the printed circuit board 1005. Further connections are made between the vertices at each corner of the rectangular loop formed by the conductive element 1090 and the connection points 1075a, 1075b, 1075c, and 1075d. In this way, the conductive element 1090 is electrically coupled to the conductive plate 1050 by positioning the conductive plate 1050 and the conductive structures of the printed circuit board. The conductive element 1090 operates as a reflective element in a manner similar to the conductive elements 465a and 465b and the combination of the conductive elements 470a and 470b and the conductive plate 1050 described above. The conductive element 1090 can be adjusted in a manner similar to that described above to change or tune the operating performance of the antenna assembly 1000.

[0081] It is worth noting that although the antenna assembly 1000 depicts the conductive element 1090 being located on the top surface of the printed circuit board 1005, in other embodiments, the conductive element 1090 may be located on the bottom surface of the printed circuit board 1005. Moreover, in some embodiments, conductive elements similar to the conductive element 1090 may be located on both the top surface and the bottom surface and may be further electrically connected together through the printed circuit board 1005 using one or more techniques similar to those described above.

[0082] Now go to Fig.11 , a diagram of another exemplary antenna assembly 1100 according to aspects of the present disclosure is shown. The antenna assembly 1100 may be included as a device for wireless communication (eg, Figure 1 The communication device 100 described in Figure 2 More specifically, antenna assembly 1100 may be used with one or more antenna assemblies 370, 375 described in FIG. 3. Antenna assembly 1100 may be referred to as a dual-polarized high-gain antenna for use in a frequency range or frequency band associated with the wireless network communications described above. Except as described below, the structure, orientation, and operation of any element not described for antenna assembly 1100 are similar to those described above. Figure 4 The structure, orientation, and operation of the same elements as those described for antenna assembly 400 in and will not be described in further detail herein.

[0083] The antenna assembly 1100 includes a first set of conductive elements 1110a and 1110b located on the top surface of the printed circuit board 1105. The conductive elements 1110a and 1110b are shown as teardrop-shaped with an oval opening in the middle, with one of the tips of each teardrop pointing toward each other. The antenna assembly 1100 also includes a second set of conductive elements 1115a and 1115b located on the bottom surface of the printed circuit board 1105. The conductive elements 1115a and 1115b are shown as having a similar shape to the conductive elements 1110a and 1110b, but are positioned orthogonal to the conductive elements 1110a and 1110b. The conductive elements 1110a and 1110b and the conductive elements 1115a and 1115b are each shaped in a manner similar to the conductive elements 1110a and 1110b. Figure 4 The antenna assembly also includes a conductive element 1190 and connection points 1175a, 1175b, 1175c and 1175d, which are similar in structure and operation to those of the embodiment of the present invention. Fig.10 The conductive element 1090 and the connection points 1075a, 1075b, 1075c and 1075d described in are the same.

[0084] Conductive elements 1110a and 1110b and conductive elements 1115a and 1115b may be referred to as a first loop dipole antenna structure and a second loop dipole antenna structure, respectively. The antenna operation characteristics of the first loop dipole antenna structure and the second loop dipole antenna structure are different from Figure 4 However, the reflective element 1190 in combination with the reflector formed by the conductive plate 1150 will produce a similar effect to the loop dipole antenna structure. Figure 5A and Figure 5B as well as Fig. 6A and Figure 6B Similar improvements in operating performance are shown in .

[0085] It is worth noting that although the antenna assembly utilizing bow-tie antenna structures and loop dipole antenna structures is described using various aspects of the present disclosure, other antenna structures may also be utilized. These antenna structures include, but are not limited to, patch antennas, printed inverted F antennas, dipole antennas, Yagi antennas, planar horn antennas, etc. In addition, embodiments utilizing various aspects of the present disclosure are not limited to dual-polarized antenna structures, and may also be used with multi-band antenna structures as well as single-polarized antenna structures.

[0086] Now go to Fig.12 , showing a diagram of another exemplary antenna assembly 1200 according to aspects of the present disclosure. The antenna assembly 1200 may be included as a device for wireless communication (e.g., Figure 1 The communication device 100 described in Figure 2More specifically, antenna assembly 1200 may be used with one or more antenna assemblies 370, 375 described in FIG. 3. Antenna assembly 1200 may be referred to as a dual-polarized high-gain antenna for use in a frequency range or frequency band associated with the wireless network communications described above. Except as described below, the structure, orientation, and operation of any element not described for antenna assembly 1200 are similar to those described above. Figure 4 The structure, orientation, and operation of the same elements as those described for antenna assembly 400 in and will not be described in further detail herein.

[0087] The antenna assembly 1200 includes a conductive element 1290 located on the top surface of the printed circuit board 1205. The conductive element 1290 is shown as a rectangular loop surrounding the first and second bow-tie antenna structures, which follows the shape of the printed circuit board 1205. Further connections are made between the vertices of the rectangular loop formed by the conductive element 1290 and the connection points 1275a, 1275b, 1275c, and 1275d. The conductive element 1290 is connected to the conductive plate 1250 and is connected to the conductive plate 1250. Fig.10 The conductive element 1090 described in operates as a reflective element in a similar manner.

[0088] The antenna assembly 1200 also includes a set of conductive elements 1290a, 1290b, 1290c, and 1290d located on the bottom surface of the printed circuit board 1205. Each conductive element 1290a, 1290b, 1290c, and 1290d spans a portion of the length parallel to each side of the printed circuit board 1205. Each conductive element 1290a, 1290b, 1290c, and 1290d is positioned on the printed circuit board 1205 between the conductive element 1290 and one of the elements of the first bow-tie antenna structure or the second bow-tie antenna structure and is not electrically connected. As shown, the conductive elements 1290a, 1290b, 1290c, and 1290d act as parasitic elements, which in combination with the reflectors and reflective elements described above can be used to change or tune the operating performance of the antenna assembly.

[0089] It is worth noting that although the antenna assembly 1200 describes the conductive element 1290 being located on the top surface of the printed circuit board, in other embodiments, the conductive element 1290 can be located on the bottom surface of the printed circuit board. In addition, in some embodiments, conductive elements similar to the conductive element 1290 can be located on both the top surface and the bottom surface, and can be further electrically connected together through the printed circuit board using one or more techniques similar to the techniques described above. In some embodiments, one or more of the conductive elements 1290a, 1290b, 1290c, and 1290d can be electrically connected to the conductive element 1290 or the conductive plate 1250. In these embodiments, the conductive element(s) connected to the conductive element 1290 or the conductive plate 1250 operate as a reflective element.

[0090] Now go to Fig.13 , a diagram of another exemplary antenna assembly 1300 according to aspects of the present disclosure is shown. The antenna assembly 1300 may be included as a device for wireless communication (e.g., Figure 1 The communication device 100 described in Figure 2 More specifically, antenna assembly 1300 may be used with one or more antenna assemblies 370, 375 described in FIG. 3. Antenna assembly 1300 may be referred to as a dual-polarized high-gain antenna for use in a frequency range or frequency band associated with the wireless network communications described above. Except as described below, the structure, orientation, and operation of any element not described for antenna assembly 1300 are similar to those described above. Figure 4 The structure, orientation, and operation of the same elements as those described for antenna assembly 400 in and will not be described in further detail herein.

[0091] The antenna assembly 1300 includes conductive elements 1365a and 1365b located on the top surface of the printed circuit board 1305 and conductive elements 1370a and 1370b located on the bottom surface of the printed circuit board 1305. The shapes of the conductive elements 1365a and 1365b and the conductive elements 1370a and 1370b form three linear sections with an angle vertex therebetween, and a longer central section connected to one of the two shorter sections at each end. Each of the longer sections is at a certain angle relative to the side of the printed circuit board. Each of the shorter sections is positioned parallel to the side of the printed circuit board 1305 and one side of the first bow-tie antenna structure or the second bow-tie antenna structure with an angle vertex therebetween. In addition, the shorter sections of the conductive elements 1365a and 1365b are each shaped similar to Fig. 91395 overlaps the shorter portion of the adjacent conductive elements 1370a and 1370b at region 1395 in a manner described for antenna assembly 900 in the foregoing. The combination of conductive elements 1365a and 1365b and conductive elements 1370 and 1370b forms an irregular octagon around the first bow-tie antenna structure or the second bow-tie antenna structure. Conductive elements 1365a and 1365b and conductive elements 1370a and 1370b are coupled to conductive plate 1350 at the midpoint of the longer portion through connection points 1375a, 1375b, 1375c, and 1375d in a manner similar to that described above. Conductive elements 1365a and 1365b and conductive elements 1370a and 1370b operate as reflective elements together with the reflector formed by conductive plate 1350 in a manner similar to that described above. The dimensions, including the length and location of overlapping region 1395, can be adjusted to adjust or tune the operating performance of antenna assembly 1300.

[0092] The antenna assembly 1300 includes a printed circuit board 1305 having a square or rectangular shape. In other embodiments, the printed circuit board 1305 can have other polygonal shapes, such as an irregular octagonal shape that follows the outline formed by the combination of the conductive elements 1365a and 1365b and the conductive elements 1370a and 1370b. In addition, in some embodiments, the conductive plate 1350 can also have a different shape and can be the same or different from the shape of the printed circuit board 1305. It is worth noting that the shape of one or both of the printed circuit board 1305 and the conductive plate 1350 can be adapted to the manufacturing constraints of the communication device (e.g., the electronic assembly 300 in Figure 3).

[0093] Now go to Fig.14 , a diagram of another exemplary antenna assembly 1400 according to aspects of the present disclosure is shown. The antenna assembly 1400 may be included as a device for wireless communication (e.g., Figure 1 The communication device 100 described in Figure 2 More specifically, antenna assembly 1400 may be used with one or more antenna assemblies 370, 375 described in FIG. 3. Antenna assembly 1400 may be referred to as a dual-polarized high-gain antenna for use in a frequency range or frequency band associated with the wireless network communications described above. Except as described below, the structure, orientation, and operation of any element not described for antenna assembly 1400 are similar to those described above. Figure 4 The structure, orientation, and operation of the same elements as those described for antenna assembly 400 in and will not be described in further detail herein.

[0094] The antenna assembly 1400 includes a printed circuit board 1405, which is connected to the Figure 4The printed circuit board 1405 is mounted at a distance above the conductive plate 1450 in a manner similar to that described in . The printed circuit board 1405 is enlarged so that the length and width dimensions extend beyond the length and width dimensions of the conductive plate 1450 . Figure 4 The dimensions of the first and second bow-tie antenna structures and the reflective elements described in the drawings remain unchanged relative to the dimensions of the conductive plate 1450. The antenna assembly 1400 also includes a conductive element 1480 located on the top surface of the printed circuit board 1405. The conductive element 1480 is shown as a rectangular ring around the reflective elements, which further surround the first and second bow-tie antenna structures, and the rectangular ring follows the shape of the printed circuit board 1405. The antenna assembly 1400 also includes a conductive element 1485 located on the bottom surface. The conductive element 1485 is shown as a rectangular ring around the conductive element 1480, which also follows the shape of the printed circuit board 1400. One or both of the conductive elements 1480 and 1485 can be positioned on a portion of the printed circuit board 1405 that is outside the dimensions of the conductive plate 1450. As shown, the conductive elements 1480 and 1485 are not electrically connected to the conductive plate 1450 directly or through one of the reflective elements. Thus, conductive elements 1480 and 1485 act as parasitic elements that, in combination with conductive plate 1450 and reflective elements, may be used to alter or tune the operating performance of antenna assembly 1400, as described above.

[0095] It is worth noting that although antenna assembly 1400 depicts conductive element 1480 located on the top surface of the printed circuit board and conductive element 1485 located on the bottom surface of the printed circuit board, in other embodiments, one or both of conductive elements 1480 and 1485 can be located on the bottom surface of the printed circuit board. In some embodiments, conductive elements similar to conductive elements 1480 or 1485 can be located on both the top surface and the bottom surface, and can further be electrically connected together through the printed circuit board using one or more techniques similar to those described above.

[0096] In some embodiments, one or both of the conductive elements 1480 and 1485 may be segmented or discontinuous, for example, in a manner similar to a reflective element. In addition, the size (e.g., width) of each conductive element 1480 and 1485 is shown as different. In some embodiments, one or more sizes (e.g., width) may be the same. In addition, although the antenna assembly 1400 includes two conductive elements 1480 and 1485 that operate as parasitic elements, more or fewer conductive elements that operate as parasitic elements may be used. In addition, in some embodiments, one or more conductive elements 1480 and 1485 may be electrically connected to one or more of the conductive elements or conductive plates that operate as reflective elements in a manner similar to that described above. For example, the conductive elements 1480 and 1485 may be electrically connected to each other and may also be electrically connected to the conductive plate through a support mechanism element. Additional conductive elements may also be included on the bottom of the printed circuit board, near and below the conductive element 1480, and the additional conductive elements are also electrically connected to the conductive plate in a similar manner.

[0097] Now go to Fig.15 , a diagram of another exemplary antenna assembly 1500 according to aspects of the present disclosure is shown. The antenna assembly 1500 may be included as a device for wireless communication (e.g., Figure 1 The communication device 100 described in Figure 2 More specifically, antenna assembly 1500 may be used with one or more antenna assemblies 370, 375 described in FIG. 3. Antenna assembly 1500 may be referred to as a dual-polarized high-gain antenna for use in a frequency range or frequency band associated with the wireless network communications described above. Except as described below, the structure, orientation, and operation of any element not described for antenna assembly 1500 are similar to those described above. Figure 4 The structure, orientation, and operation of the same elements as those described for antenna assembly 400 in and will not be described in further detail herein.

[0098] The antenna assembly 1500 includes conductive elements 1565a and 1565b located on the top surface of the printed circuit board 1505 and conductive elements 1570a and 1570b located on the bottom surface of the printed circuit board 1505. The conductive elements 1565a and 1565b and the conductive elements 1570a and 1570b are each shown as being connected to the printed circuit board 1505. Figure 4 The two linear parts are similar to the linear parts in Figure 4Unlike the antenna assembly 400 in FIG. 1 , each of the conductive elements 1565a and 1565b and the conductive elements 1570a and 1570b is not directly or electrically connected to the connection points 1575a, 1575b, 1575c, and 1575d. Instead, the conductive portion of each of the connection points 1575a, 1575b, 1575c, and 1575d is enlarged to form a circle. Each of the conductive elements 1565a and 1565b and the conductive elements 1570a and 1570b also includes conductive elements 1566a, 1566b, 1571a, and 1571b. The shape of the conductive elements 1566a, 1566b, 1571a and 1571b is formed as a part of a ring, which surrounds the circular part of the connection points 1575a, 1575b, 1575c and 1575d that are not adjacent to the conductive elements 1565a and 1565b and the conductive elements 1570a and 1570b. The conductive elements 1566a, 1566b, 1571a and 1571b and the conductive elements 1565a, 1565b, 1570a and 1570b form a capacitive coupling structure with 1575a, 1575b, 1575c and 1575d, respectively. As such, conductive elements 1565a and 1565b and conductive elements 1570a and 1570b are electromagnetically coupled to conductive plate 1550 via connection points 1575a, 1575b, 1575c, and 1575d, rather than being directly or electrically coupled. Thus, antenna assembly 1500 utilizes conductive elements 1565a, 1565b, 1570a, and 1570b in conjunction with a conductive plate, electromagnetically coupled together via a conductive support mechanism to form an open-box reflector or reflective cavity surrounding the first and second bow-tie antenna structures, as described above.

[0099] It is noteworthy that the dimensions of the connection points 1575a, 1575b, 1575c and 1575d and the corresponding conductive elements 1566a, 1566b, 1571a and 1571b can be adjusted or tuned in a manner similar to that described above to change the operating performance of the antenna assembly 1500. In some embodiments, the connection points 1575a, 1575b, 1575c and 1575d can use other shapes, such as rectangles or rectangular strips, where the corresponding conductive elements 1566a, 1566b, 1571a and 1571b surround all or part of these shapes. In addition, some or all of the connection points 1575a, 1575b, 1575c and 1575d and / or the conductive elements 1566a, 1566b, 1571a and 1571b can be formed on one or both of the top surface and the bottom surface of the printed circuit board. In addition, portions of the connection points 1575a, 1575b, 1575c, and 1575d may be formed on a surface of the printed circuit board that is opposite to a surface that includes one or more of the conductive elements 1565a and 1565b and the conductive elements 1570a and 1570b. Portions of the connection points 1575a, 1575b, 1575c, and 1575d on the opposite surface may also overlap portions of one or more of the conductive elements 1565a and 1565b and the conductive elements 1570a and 1570b.

[0100] According to the present disclosure, an antenna assembly is described, the antenna assembly comprising a printed circuit board and a conductive plate, the printed circuit board having a set of conductive elements, the set of conductive elements forming an antenna structure on at least one surface of the printed circuit board, the printed circuit board further comprising one or more additional conductive elements partially or completely surrounding the set of conductive elements, the conductive plate using one or more conductive mechanical support elements to support the printed circuit board at a fixed distance from the conductive plate. The (one or more) additional conductive elements are electrically connected to the conductive plate through the (one or more) conductive mechanical support elements.

[0101] According to the present disclosure, a device is described that includes a circuit capable of processing communication signals wirelessly received from a network and / or processing communication signals for wirelessly sending to a network. The device also includes an antenna assembly coupled to the circuit. The antenna assembly includes a printed circuit board and a conductive plate, the printed circuit board having a set of conductive elements that form an antenna structure on at least one surface of the printed circuit board, the printed circuit board also including one or more additional conductive elements that partially or completely surround the set of conductive elements, and the conductive plate uses one or more conductive mechanical support elements to support the printed circuit board at a fixed distance from the conductive plate. (One or more) additional conductive elements are electrically connected to the conductive plate through (one or more) conductive mechanical support elements.

[0102] In some embodiments, the apparatus may be a gateway device for coupling a wide area network with a local area network at a customer's premises.

[0103] In some embodiments, one or more additional conductive elements in the antenna assembly may be electrically and / or electromagnetically coupled to the conductive plate via one or more conductive mechanical support elements.

[0104] In some embodiments, the one or more conductive support elements may be pins formed from the conductive plate and oriented orthogonal to the conductive plate and the printed circuit board.

[0105] In some embodiments, the conductive plate and one or more additional conductive elements may be configured as a three-dimensional open reflector structure surrounding the antenna structure, which increases the antenna gain of the antenna structure.

[0106] In some embodiments, the antenna structure may be a dual polarized high gain antenna.

[0107] In some embodiments, the antenna structure may be formed by conductive elements located on both the top and bottom surfaces of a double-sided printed circuit board. In some embodiments, the conductive elements located on the top surface of the double-sided printed circuit board may form part of a first bow-tie antenna structure, and the conductive elements located on the bottom surface of the double-sided printed circuit board may form part of a second bow-tie antenna structure, the conductive elements forming part of the second bow-tie antenna structure being orthogonal to the conductive elements forming part of the first bow-tie antenna structure.

[0108] In some embodiments, at least one of the one or more additional conductive elements may be formed on the top surface of the double-sided printed circuit board, and at least one of the one or more additional conductive elements may be formed on the bottom surface of the double-sided printed circuit board. In some embodiments, at least one additional conductive element located on the top surface of the double-sided printed circuit board includes a first additional conductive element formed at a first corner of the double-sided printed circuit board and a second additional conductive element, the first additional conductive element extending from the first corner and spanning at least a portion of the length of each edge of the top surface of the double-sided printed circuit board adjacent to the first corner, the second additional conductive element extending from a second corner opposite to the first corner and spanning at least a portion of the length of each edge of the top surface of the double-sided printed circuit board adjacent to the second corner, and wherein at least one additional conductive element located on the bottom surface of the double-sided printed circuit board includes a third additional conductive element formed at a third corner of the double-sided printed circuit board adjacent to the first corner and a fourth additional conductive element, the third additional conductive element extending from a third corner and spanning at least a portion of the length of each edge of the bottom surface of the double-sided printed circuit board adjacent to the third corner, and the fourth additional conductive element extending from a fourth corner opposite to the third corner and spanning at least a portion of the length of each edge of the bottom surface of the double-sided printed circuit board adjacent to the fourth corner. In some embodiments, the length spanned by the first additional conductive element and the second additional conductive element is less than half the length of each edge of the top surface of the double-sided printed circuit board, and wherein the length spanned by the third additional conductive element and the fourth additional conductive element is less than half the length of each edge of the bottom surface of the double-sided printed circuit board.

[0109] In some embodiments, the antenna assembly may also include one or more coaxial cables coupled to the antenna structure, the one or more coaxial cables providing a signal interface between the antenna assembly and the communication circuit, and the one or more coaxial cables mechanically coupled to the conductive plate and exiting the antenna assembly between the conductive plate and the printed circuit board.

[0110] In some embodiments, the antenna structures included in the antenna assembly are configured to transmit and receive wireless signals within a frequency range of 3300 megahertz (MHz) to 4200 MHz.

[0111] It should be understood that the various features shown and described are interchangeable, that is, features shown in one embodiment may be incorporated in another embodiment, unless explicitly stated otherwise in the above description.

[0112] Although embodiments incorporating the teachings of the present disclosure have been shown and described in detail herein, those skilled in the art can readily devise numerous other varied embodiments that still incorporate these teachings. Having described preferred embodiments of an antenna assembly with a directional antenna for a communication device, it should be noted that modifications and variations may be made by those skilled in the art in accordance with the above teachings. Therefore, it should be understood that changes may be made to the specific embodiments of the present disclosure that are within the scope of the present disclosure as outlined by the appended claims.

Claims

1. An antenna assembly, comprising: a printed circuit board having a set of conductive elements forming an antenna structure on at least one of a top surface and a bottom surface of the printed circuit board, the printed circuit board further comprising at least one additional conductive element at least partially surrounding the antenna structure; as well as an electrically conductive plate positioned parallel to a bottom surface of the printed circuit board, the electrically conductive plate supporting the printed circuit board at a fixed distance from the electrically conductive plate using at least one electrically conductive mechanical support element; Wherein, the at least one additional conductive element is coupled to the conductive plate via the at least one conductive mechanical support element.

2. The antenna assembly according to claim 1, wherein: The at least one additional conductive element is coupled to the conductive plate through the at least one conductive mechanical support element with at least one of an electrical coupling and an electromagnetic coupling.

3. The antenna assembly according to claim 1, wherein: The at least one conductive support element is a pin formed from the conductive plate and oriented orthogonally to the conductive plate and the printed circuit board.

4. The antenna assembly according to claim 1, wherein: The conductive plate and the at least one additional conductive element are configured as a three-dimensional open reflector structure surrounding the antenna structure, the reflector structure increasing the antenna gain of the antenna structure.

5. The antenna assembly according to claim 1, wherein: The antenna structure is a dual-polarization high-gain antenna.

6. The antenna assembly according to claim 1, wherein: The antenna structure is formed from conductive elements located on both the top and bottom surfaces of a double-sided printed circuit board.

7. The antenna assembly according to claim 6, wherein: The conductive elements located on the top surface of the double-sided printed circuit board form part of a first bow-tie antenna structure, and the conductive elements located on the bottom surface of the double-sided printed circuit board form part of a second bow-tie antenna structure, and the conductive elements forming part of the second bow-tie antenna structure are orthogonal to the conductive elements forming part of the first bow-tie antenna structure.

8. The antenna assembly according to claim 6, wherein: The at least one additional conductive element includes at least one additional conductive element located on a top surface of the double-sided printed circuit board and at least one additional conductive element located on a bottom surface of the double-sided printed circuit board.

9. The antenna assembly according to claim 8, wherein: The at least one additional conductive element located on the top surface of the double-sided printed circuit board includes a first additional conductive element and a second additional conductive element, wherein the first additional conductive element is formed at a first corner of the double-sided printed circuit board, extends from the first corner and spans at least a portion of the length of each edge of the top surface of the double-sided printed circuit board adjacent to the first corner, and the second additional conductive element extends from a second corner opposite to the first corner and spans at least a portion of the length of each edge of the top surface of the double-sided printed circuit board adjacent to the second corner, and wherein the at least one additional conductive element located on the bottom surface of the double-sided printed circuit board includes a third additional conductive element and a fourth additional conductive element, wherein the third additional conductive element is formed at a third corner of the double-sided printed circuit board adjacent to the first corner, extends from the third corner and spans at least a portion of the length of each edge of the bottom surface of the double-sided printed circuit board adjacent to the third corner, and the fourth additional conductive element extends from a fourth corner opposite to the third corner and spans at least a portion of the length of each edge of the bottom surface of the double-sided printed circuit board adjacent to the fourth corner.

10. The antenna assembly according to claim 9, wherein: The length spanned by the first additional conductive element and the second additional conductive element is less than half the length of each edge of the top surface of the double-sided printed circuit board, and wherein the length spanned by the third additional conductive element and the fourth additional conductive element is less than half the length of each edge of the bottom surface of the double-sided printed circuit board.

11. The antenna assembly of claim 1 , further comprising: At least one coaxial cable is coupled to the antenna structure, the at least one coaxial cable providing a signal interface between the antenna assembly and communication circuitry, the at least one coaxial cable being mechanically coupled to the conductive plate and exiting the antenna assembly between the conductive plate and the printed circuit board.

12. The antenna assembly according to claim 1, wherein: The antenna structure is configured to transmit and receive wireless signals within a frequency range of 3300 megahertz (MHz) to 4200 MHz.

13. An apparatus comprising: Circuitry capable of at least one of: processing communication signals wirelessly received from a network, and processing communication signals for wireless transmission to the network; as well as An antenna assembly is coupled to the circuit, the antenna assembly comprising: a printed circuit board having a set of conductive elements forming an antenna structure on at least one of a top surface and a bottom surface of the printed circuit board, the printed circuit board further comprising at least one additional conductive element at least partially surrounding the antenna structure; and an electrically conductive plate positioned parallel to a bottom surface of the printed circuit board, the electrically conductive plate supporting the printed circuit board at a fixed distance from the electrically conductive plate using at least one electrically conductive mechanical support element; Wherein, the at least one additional conductive element is coupled to the conductive plate via the at least one conductive mechanical support element.

14. The antenna assembly according to claim 1, wherein: The conductive plate and the at least one additional conductive element are configured as a three-dimensional open reflector structure surrounding the antenna structure, the reflector structure increasing the antenna gain of the antenna structure.

15. The antenna assembly according to claim 1, wherein: The antenna structure is formed from conductive elements located on both the top and bottom surfaces of a double-sided printed circuit board.

16. The antenna assembly according to claim 15, wherein: The conductive elements located on the top surface of the double-sided printed circuit board form part of a first bow-tie antenna structure, and the conductive elements located on the bottom surface of the double-sided printed circuit board form part of a second bow-tie antenna structure, and the conductive elements forming part of the second bow-tie antenna structure are orthogonal to the conductive elements forming part of the first bow-tie antenna structure.

17. The antenna assembly according to claim 15, wherein: The at least one additional conductive element includes at least one additional conductive element located on a top surface of the double-sided printed circuit board and at least one additional conductive element located on a bottom surface of the double-sided printed circuit board.

18. The antenna assembly according to claim 17, wherein: The at least one additional conductive element located on the top surface of the double-sided printed circuit board includes a first additional conductive element formed at a first corner of the double-sided printed circuit board and a second additional conductive element, the first additional conductive element extending from the first corner and spanning at least a portion of the length of each edge of the top surface of the double-sided printed circuit board adjacent to the first corner, the second additional conductive element extending from a second corner opposite to the first corner and spanning at least a portion of the length of each edge of the top surface of the double-sided printed circuit board adjacent to the second corner, and wherein the at least one additional conductive element located on the bottom surface of the double-sided printed circuit board includes a third additional conductive element formed at a third corner of the double-sided printed circuit board adjacent to the first corner and a fourth additional conductive element, the third additional conductive element extending from the third corner and spanning at least a portion of the length of each edge of the bottom surface of the double-sided printed circuit board adjacent to the third corner, and the fourth additional conductive element extending from a fourth corner opposite to the third corner and spanning at least a portion of the length of each edge of the bottom surface of the double-sided printed circuit board adjacent to the fourth corner.

19. The antenna assembly of claim 13, further comprising: At least one coaxial cable is coupled to the antenna structure, the at least one coaxial cable providing a signal interface between the antenna assembly and communication circuitry, the at least one coaxial cable being mechanically coupled to the conductive plate and exiting the antenna assembly between the conductive plate and the printed circuit board.

20. The device according to claim 13, wherein: The apparatus is a gateway device for joining a wide area network to a local area network in a customer's premises.

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