Dispensing method of electronic equipment

Abstract

The invention relates to the technical field of electronic equipment, and provides a dispensing method of the electronic equipment, the electronic equipment can comprise a plastic middle frame and a metal frame, and the circumferential side wall of the plastic middle frame is provided with a first function port; the metal frame is arranged on the circumferential outer side of the plastic middle frame in a surrounding mode, the metal frame is provided with a second function opening, and the second function opening and the first function opening are oppositely arranged; wherein the peripheral surface of the plastic middle frame comprises a first dispensing area corresponding to the first functional port and other dispensing areas; the dispensing method comprises the following steps: obtaining the plastic middle frame and the metal frame; hot melt glue is dispensed in the first glue dispensing area of the plastic middle frame, and AB glue is dispensed in the other glue dispensing areas of the plastic middle frame; and assembling the plastic middle frame after dispensing and the metal frame. According to the dispensing method of the electronic equipment provided by the embodiment of the invention, the bonding stability between the plastic middle frame and the metal frame can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic equipment, and in particular to a glue dispensing method for electronic equipment. Background Art

[0002] Electronic devices such as tablet computers and mobile phones generally include a plastic middle frame and a metal frame. The metal frame is arranged around the outer side of the plastic middle frame to form an appearance surface. The plastic middle frame and the metal frame are generally connected by dispensing AB glue.

[0003] In order to meet the normal use of electronic devices, electronic devices need to be provided with charging ports, buttons, etc. Therefore, holes need to be opened on the peripheral walls of the plastic middle frame and the metal frame to meet the setting of the charging port and buttons. However, during the dispensing process of the plastic middle frame and the metal frame, due to the holes in the plastic middle frame and the metal frame, the AB glue at the opening position will overflow in large quantities during the assembly process of the plastic middle frame and the metal frame, affecting the bonding stability of the plastic middle frame and the metal frame at the opening position. Summary of the invention

[0004] In order to solve the above technical problem or at least partially solve the above technical problem, the present invention provides a glue dispensing method for electronic equipment.

[0005] The present application provides a method for dispensing glue for an electronic device, which may include: a plastic middle frame, a circumferential side wall of the plastic middle frame being provided with a first functional opening; a metal frame, the metal frame being arranged around the circumferential outer side of the plastic middle frame, the metal frame being provided with a second functional opening, the second functional opening being arranged opposite to the first functional opening; wherein the outer peripheral surface of the plastic middle frame includes a first dispensing glue area corresponding to the first functional opening and other dispensing glue areas; the dispensing glue method includes: obtaining the plastic middle frame and the metal frame; dispensing hot melt glue on the first dispensing glue area of ​​the plastic middle frame, and dispensing AB glue on the other dispensing glue areas of the plastic middle frame; and assembling the plastic middle frame after dispensing glue with the metal frame.

[0006] It should be noted that in the prior art, AB glue is used in both the first glue spotting area and the remaining glue spotting areas. In order to ensure the stability of the bonding between the plastic middle frame and the metal frame corresponding to the remaining glue spotting areas, the preset glue injection amount of the AB glue is the first glue injection amount. However, due to the existence of the first functional port and the second functional port, the glue spotting area between the plastic middle frame and the metal frame corresponding to the first glue spotting area is relatively small, and the required glue injection amount is less than the first glue injection amount. In the process of the plastic middle frame being inserted into the metal frame, a large amount of AB glue will overflow. The curing time of the AB glue is relatively short. After the overflowed AB glue is cured, the assembler needs to spend a lot of time scraping the glue, which seriously affects the assembly efficiency. At the same time, the AB glue retained in the first glue spotting area cannot ensure the stability of the bonding between the plastic middle frame and the metal frame corresponding to the first glue spotting area.

[0007] In the present application, AB glue is used to bond the plastic middle frame and the metal frame positions corresponding to the remaining glue spotting areas to ensure the stability of the bonding between the plastic middle frame and the metal frame, and hot melt glue is used for glue spotting in the first glue spotting area. The curing time of hot melt glue is much longer than that of AB glue. The hot melt glue can ensure fluidity over a longer period of time. In the process of the plastic middle frame being inserted into the metal middle frame, after the hot melt glue overflows, since the hot melt glue still has fluidity, part of the overflowed hot melt glue will flow back to the first glue spotting area, so that the first glue spotting area retains sufficient hot melt glue to ensure the stability of the bonding between the plastic middle frame and the metal frame positions corresponding to the first glue spotting area. In addition, since the overflowed hot melt glue is still fluid, it can be directly wiped with a dust-free cloth, saving time in cleaning the overflowed glue and improving assembly efficiency.

[0008] In some embodiments of the present application, the dispensing method of an electronic device includes: maintaining pressure on the assembled plastic middle frame and the metal frame.

[0009] In some embodiments of the present application, the holding temperature is greater than or equal to 80°C and less than or equal to 90°C.

[0010] In some embodiments of the present application, the duration of holding pressure is greater than or equal to 50 seconds and less than or equal to 60 seconds.

[0011] In some embodiments of the present application, a method for dispensing glue for an electronic device includes: obtaining the plastic middle frame and the metal frame after pressure maintenance; and wiping the overflowed hot melt glue corresponding to the first dispensing glue area with a dust-free cloth.

[0012] In some embodiments of the present application, after wiping the overflowed hot melt adhesive corresponding to the first glue dispensing area with a dust-free cloth, the glue dispensing method of the electronic device also includes: obtaining the plastic middle frame and the metal frame after wiping with the dust-free cloth; and using an air gun to blow off the hot melt adhesive on the plastic middle frame.

[0013] In some embodiments of the present application, after the assembled plastic middle frame and the metal frame are pressurized, the gluing method of the electronic device also includes: obtaining the plastic middle frame and the metal frame after heat pressurization; judging whether the remaining gluing areas overflow with AB glue, and if the remaining gluing areas overflow with AB glue, using iron tweezers to scrape the glue.

[0014] In some embodiments of the present application, the glue dispensing method of the electronic device includes: obtaining the plastic middle frame and the metal frame after the glue is scraped with iron tweezers; using an air gun to blow away the AB glue residue on the plastic middle frame.

[0015] In some embodiments of the present application, the gluing method of an electronic device includes: obtaining the plastic middle frame and the metal frame; removing dust from the plastic middle frame, applying hot melt glue to the first gluing area of ​​the plastic middle frame, and applying AB glue to the remaining gluing areas of the plastic middle frame; removing dust from the metal frame, and assembling the glued plastic middle frame with the metal frame. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0018] Figure 1 A schematic diagram of an electronic device provided for some embodiments of the present application;

[0019] Reference numerals:

[0020] 100. Electronic equipment;

[0021] 110, plastic middle frame; 111, other glue spotting areas; 112, first glue spotting area;

[0022] 120. Metal frame. DETAILED DESCRIPTION

[0023] In order to more clearly understand the above-mentioned objectives, features and advantages of the present invention, the scheme of the present invention will be further described below. It should be noted that the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

[0024] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein; it is obvious that the embodiments in the specification are only part of the embodiments of the present invention, rather than all of the embodiments.

[0025] Electronic devices such as tablet computers and mobile phones generally include a plastic middle frame and a metal frame. The metal frame is arranged around the outer side of the plastic middle frame to form an appearance surface. The plastic middle frame and the metal frame are generally connected by dispensing AB glue.

[0026] In order to meet the normal use of electronic devices, electronic devices need to be provided with charging ports, buttons, etc. Therefore, holes need to be opened on the peripheral walls of the plastic middle frame and the metal frame to meet the setting of the charging port and buttons. However, during the dispensing process of the plastic middle frame and the metal frame, due to the holes in the plastic middle frame and the metal frame, the AB glue at the opening position will overflow in large quantities during the assembly process of the plastic middle frame and the metal frame, affecting the bonding stability of the plastic middle frame and the metal frame at the opening position.

[0027] To solve the above technical problems, please refer to Figure 1 The present application provides a dispensing method for an electronic device 100, wherein the electronic device 100 may be a mobile phone, a tablet computer, etc. The electronic device 100 may include a plastic middle frame 110 and a metal shell, the metal shell may include a metal frame 120, the metal frame 120 is arranged around the outer circumference of the plastic middle frame 110, the circumferential side wall of the plastic middle frame 110 is provided with a first functional opening, the metal frame 120 is provided with a second functional opening, and the second functional opening is arranged opposite to the first functional opening.

[0028] It should be noted that the plastic middle frame 110 may have multiple first function ports and multiple second function ports, and the multiple first function ports correspond one to one to the multiple second function ports. Among them, the first function port can be a charging port, a volume plus or minus key, a power key, a one-touch mute key, a sound outlet, a sound receiving hole, a card slot, etc.

[0029] Among them, the outer peripheral surface of the plastic middle frame 110 may include a first glue dot area 112 corresponding to the first functional port and the remaining glue dot areas 111, the first glue dot area 112 refers to the area on the circumferential edge of the first functional port, and the remaining glue dot areas 111 refer to other areas on the circumferential side of the plastic middle frame 110 excluding the first glue dot area 112.

[0030] The glue dispensing method of the electronic device 100 provided in the present application may include: obtaining a plastic middle frame 110 and a metal frame 120; applying hot melt glue to a first glue dispensing area 112 of the plastic middle frame 110, and applying AB glue to the remaining glue dispensing areas 111 of the plastic middle frame 110; and assembling the glued plastic middle frame 110 and the metal frame 120.

[0031] It should be noted that, in the prior art, AB glue is used in both the first glue spot area 112 and the remaining glue spot areas 111. In order to ensure the stability of the bonding between the plastic middle frame 110 and the metal frame 120 corresponding to the remaining glue spot areas 111, the preset glue injection amount of the AB glue is the first glue injection amount. However, due to the existence of the first functional port and the second functional port, the glue spot area between the plastic middle frame 110 and the metal frame 120 corresponding to the first glue spot area 112 is relatively small, and the required glue injection amount is less than the first glue injection amount. In the process of the plastic middle frame 110 being inserted into the metal frame 120, a large amount of AB glue will overflow. The curing time of the AB glue is relatively short. After the overflowed AB glue is cured, the assembler needs to spend a lot of time scraping the glue, which seriously affects the assembly efficiency. At the same time, the AB glue retained in the first glue spot area 112 cannot ensure the stability of the bonding between the plastic middle frame 110 and the metal frame 120 corresponding to the first glue spot area 112.

[0032] In the present application, AB glue is used to bond the plastic middle frame 110 and the metal frame 120 at the positions corresponding to the remaining glue spot areas 111 to ensure the stability of the bonding between the plastic middle frame 110 and the metal frame 120. Hot melt glue is used for glue spotting in the first glue spot area 112. The curing time of hot melt glue is much longer than that of AB glue. The hot melt glue can ensure fluidity over a longer period of time. In the process of the plastic middle frame 110 being inserted into the metal middle frame, after the hot melt glue overflows, since the hot melt glue still has fluidity, part of the overflowed hot melt glue will flow back to the first glue spot area 112, so that the first glue spot area 112 retains sufficient hot melt glue to ensure the stability of the bonding between the plastic middle frame 110 and the metal frame 120 at the positions corresponding to the first glue spot area 112.

[0033] In some embodiments of the present application, the glue dispensing method of the electronic device 100 may include: maintaining pressure on the assembled plastic middle frame 110 and the metal frame 120, and the pressure maintaining measure can ensure better curing of the AB glue.

[0034] The holding temperature is greater than or equal to 80°C and less than or equal to 90°C. In the specific implementation process, the holding temperature can be selected according to the curing characteristics of the AB glue to ensure the curing of the AB glue. Specifically, the holding temperature can be 80°C, 82°C, 84°C, 86°C, 88°C, or 90°C.

[0035] The duration of the pressure holding is greater than or equal to 50 seconds and less than or equal to 60 seconds. In the specific implementation process, the duration of the pressure holding can be selected according to the curing characteristics of the AB glue to ensure the curing of the AB glue. Specifically, the duration of the pressure holding can be 50 seconds, 52 seconds, 54 seconds, 56 seconds, 58 seconds or 60 seconds.

[0036] In some embodiments of the present application, the glue dispensing method of the electronic device 100 may further include: obtaining the plastic middle frame 110 and the metal frame 120 after pressure maintenance; and wiping the overflowed hot melt glue corresponding to the first glue dispensing area 112 with a dust-free cloth.

[0037] It should be noted that due to the long curing time of hot melt adhesive, the overflowed hot melt adhesive is still fluid and can be directly wiped with a dust-free cloth, saving time in cleaning the overflowed adhesive and improving assembly efficiency.

[0038] In the specific experimental test process, when applying AB glue to the first glue application area 112, the assembler needs to use iron tweezers to scrape the AB glue overflowing from the first glue application area 112. Since there is a lot of overflowing AB glue, it generally takes 2 minutes and 30 seconds to 2 minutes and 40 seconds. In the present application, for the hot melt glue applied to the first glue application area 112, the assembler only needs to use a dust-free cloth to wipe it, and the glue cleaning time is generally 1 minute and 20 seconds to 1 minute and 30 seconds, so it can greatly save the time for cleaning the overflowed glue and improve the assembly efficiency of the staff.

[0039] In some embodiments of the present application, after wiping the overflowed hot melt adhesive corresponding to the first glue dispensing area 112 with a dust-free cloth, the glue dispensing method of the electronic device 100 may also include: obtaining the plastic middle frame 110 and the metal frame 120 after wiping with a dust-free cloth; and using an air gun to blow off the hot melt adhesive on the plastic middle frame 110.

[0040] In some embodiments of the present application, after the assembled plastic middle frame 110 and the metal frame 120 are pressurized, the glue dispensing method of the electronic device 100 may also include: obtaining the plastic middle frame 110 and the metal frame 120 after heat pressurization; judging whether the remaining glue dispensing areas 111 overflow with AB glue, if the remaining glue dispensing areas 111 overflow with AB glue, using iron tweezers to scrape the glue to ensure that the surface of the corresponding position of the remaining glue dispensing areas 111 is flat.

[0041] In some embodiments of the present application, the glue dispensing method of the electronic device 100 may also include: obtaining the plastic middle frame 110 and the metal frame 120 after the glue is scraped with iron tweezers; using an air gun to blow away the AB glue residue on the plastic middle frame 110 to ensure the smoothness of the surface of the plastic middle frame 110 and the metal frame 120 after the glue is scraped, and to prevent the AB glue residue from entering the plastic middle frame 110 and affecting the subsequent normal use of the plastic middle frame 110.

[0042] In some embodiments of the present application, the glue dispensing method of the electronic device 100 may further include: obtaining the plastic middle frame 110 and the metal frame 120; removing dust from the plastic middle frame 110, applying hot melt glue to the first glue dispensing area 112 of the plastic middle frame 110, and applying AB glue to the remaining glue dispensing areas 111 of the plastic middle frame 110; removing dust from the metal frame 120, and assembling the glued plastic middle frame 110 and the metal frame 120. In this way, the dust removal process of the plastic middle frame 110 and the metal frame 120 can ensure the bonding effect of the AB glue and the hot melt glue on the plastic middle frame 110 and the metal frame 120, and reduce the influence of debris on the bonding effect.

[0043] In the description of the present invention, it is necessary to understand that the orientations or positional relationships indicated by terms such as "center", "up", "down", "front", "back", "bottom", "inside" and "outside" are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0044] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0045] In the description of the embodiments of the present invention, the term "and / or" refers to and covers any and all possible combinations of one or more of the associated listed items. The term "and / or" is a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in the present invention generally indicates that the associated objects before and after are in an "or" relationship.

[0046] In the description of the embodiments of the present invention, the terms "comprises", "comprising" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprising a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element. In the absence of further restrictions, an element defined by the statement "comprising a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element.

[0047] The above description is only a specific embodiment of the present invention, so that those skilled in the art can understand or implement the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments described herein, but should conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for dispensing glue for electronic equipment, characterized in that: The electronic device comprises: A plastic middle frame, wherein a circumferential side wall of the plastic middle frame is provided with a first functional opening; A metal frame, the metal frame is arranged around the outer side of the plastic middle frame, the metal frame is provided with a second functional opening, and the second functional opening is arranged opposite to the first functional opening; Wherein, the outer peripheral surface of the plastic middle frame includes a first glue spotting area corresponding to the first functional port and other glue spotting areas; The dispensing method comprises: Obtain the plastic middle frame and the metal frame; Apply hot melt glue to the first glue application area of ​​the plastic middle frame, and apply AB glue to the remaining glue application areas of the plastic middle frame; The glue-dispensed plastic middle frame is assembled with the metal frame.

2. The method for dispensing glue for electronic equipment according to claim 1, characterized in that: include: The assembled plastic middle frame and the metal frame are pressurized.

3. The method for dispensing glue for electronic equipment according to claim 2, characterized in that: The holding temperature is greater than or equal to 80°C and less than or equal to 90°C.

4. The method for dispensing glue for electronic equipment according to claim 2, characterized in that: The holding time is greater than or equal to 50 seconds and less than or equal to 60 seconds.

5. The method for dispensing glue for electronic equipment according to claim 2, characterized in that: include: Obtaining the plastic middle frame and the metal frame after pressure maintenance; The hot melt adhesive overflowing from the first glue dispensing area is wiped with a dust-free cloth.

6. The method for dispensing glue for electronic equipment according to claim 5, characterized in that: After wiping the hot melt adhesive overflowing from the first glue dispensing area with a dust-free cloth, the method further includes: Obtain the plastic middle frame and the metal frame after wiping with a dust-free cloth; Use an air gun to blow off the hot melt adhesive on the plastic middle frame.

7. The method for dispensing glue for electronic equipment according to claim 2, characterized in that: After the assembled plastic middle frame and the metal frame are pressurized, the method further includes: Obtaining the plastic middle frame and the metal frame after heat-pressing; Determine whether the remaining glue dispensing areas overflow with AB glue. If the remaining glue dispensing areas overflow with AB glue, use iron tweezers to scrape the glue.

8. The method for dispensing glue for electronic equipment according to claim 7, characterized in that: include: Obtain the plastic middle frame and the metal frame after scraping the glue with iron tweezers; Use an air gun to blow away the AB glue residue on the plastic middle frame.

9. The method for dispensing glue for electronic equipment according to claim 1, characterized in that: include: Obtain the plastic middle frame and the metal frame; Dust the plastic middle frame, apply hot melt glue to the first glue application area of ​​the plastic middle frame, and apply AB glue to the remaining glue application areas of the plastic middle frame; The metal frame is dusted, and the glue-dispensed plastic middle frame is assembled with the metal frame.

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