A laser processing method and system based on Bezier curve surface mapping

Abstract

The present invention relates to the field of laser processing technology, in particular to a laser processing method and system based on Bezier curve surface mapping. This solution maps the complex surface A1 of the area to be processed into the Bezier surface based on Bezier curve surface mapping, guides the high-energy focused light spot of laser processing to realize processing trajectory planning and adaptive laser processing operations for various complex surface shapes on the complex surface A1 in three-dimensional space, improves the degree of automated maintenance operations, and ensures the consistency of quality after maintenance; at the same time, the present invention calculates the coordinates and tangential trajectory of the moving point P of the laser focused light spot in real time based on the Bezier curve surface mapping method, controls the laser processing head to perform adaptive adjustment of the posture angle along the tangential trajectory, and ensures that the focused light spot formed by the irradiation of the high-energy laser beam during the laser processing operation will not be defocused due to the problem of the incident angle of the laser beam, resulting in changes in energy intensity that affect the laser processing quality.

Description

Technical Field

[0001] The present invention relates to the field of laser processing technology, in particular to a laser processing method and system based on Bezier curve and surface mapping. Background Art

[0002] To ensure the utilization rate of water energy, most of the important working parts of hydroelectric generator sets are designed with irregular and complex curved surfaces based on fluid mechanics. Once defects or damage occur after long-term service and require repair (such as local scratches, erosion, cavitation, crack repair welding and laser cladding strengthening treatment, cutting and repair welding of surface edge defects, and other maintenance scenarios), the various irregular and complex curved surfaces are extremely difficult to repair within the limited maintenance period compared to semi-automated or automated maintenance operations. Often, they can only be repaired in different areas using manual labor and tools, which is extremely labor-intensive. In addition, manual repair is limited by skill level and has the problem of poor consistency in maintenance quality.

[0003] Therefore, there is a need for a processing method and system that can realize adaptive trajectory planning and posture adjustment for irregular and complex surfaces of various workpieces, realize a high degree of automated maintenance operations, and ensure the quality consistency of workpieces after maintenance. Summary of the Invention

[0004] In view of the problems existing in the prior art, the present invention is proposed.

[0005] Therefore, the problem to be solved by the present invention is how to solve non-standard maintenance scenarios such as local scratches, erosion, cavitation, cracks, surface edge defects, etc. for various workpieces with irregular and complex surface shapes, and realize the processing problem of adaptive trajectory planning and posture adjustment.

[0006] To solve the above technical problems, the present invention provides the following technical solution: obtaining an area A1 to be processed by a three-dimensional measurement camera, wherein A1 represents a complex curved surface, collecting point cloud data information and surface feature information of A1, and constructing a curved line type;

[0007] By analyzing and extracting the parameters of the surface line type, the parameters of the surface line type are substituted into the data processing module to obtain the surface information of laser processing;

[0008] By calibrating the linear laser of the line laser device, ensuring that the linear laser is correctly irradiated on the area to be processed A1, and obtaining a moving point P, which represents a moving point in the focused light spot;

[0009] Taking the moving point P as the center point, it extends to both sides and outputs the trajectory planning for subsequent processing;

[0010] Set the laser processing parameters in the control system, map the parameters of the surface line type according to the data processing module combined with Bezier curve theory, and define the motion trajectory of the laser processing head;

[0011] According to the tangential trajectory of the moving point P calculated in real time by the data processing module, the control system controls the laser processing head to perform adaptive adjustment of the posture angle along the tangential trajectory and perform processing operations;

[0012] By monitoring the tangential trajectory and coordinates of the moving point P during laser processing, the processing process is ensured to be correct. After the processing is completed, the processing quality is checked and evaluated.

[0013] In the first aspect, an embodiment of the present invention provides a laser processing method based on Bezier curve surface mapping, which includes: performing parameter mapping on the parameters of the surface line type according to the data processing module in combination with the Bezier curve theory, mapping A1 to a Bezier surface, using the laser focused light point as an arbitrary moving point P on the Bezier surface, calculating the coordinates in real time in combination with the coordinate calculation method of the arbitrary moving point P(u,v) on the Bezier surface, synchronously and in real time derivatizing the coordinates of the moving point P(u,v) of the focused light point, obtaining the tangential trajectory of the moving point P of the focused light point, and feeding back the calculation results to the control system.

[0014] As a preferred solution of the laser processing method based on Bezier curve surface mapping described in the present invention, wherein: by parsing and extracting the parameters of the surface line type, the surface feature information is parsed and the surface line type parameters are extracted, a unique Bezier curve is obtained based on the starting and ending points and the tangents of the control points of the multi-order Bezier curve and the surface line type parameters of the complex surface are defined, and the surface trajectory of the measured area A1 to be processed is constructed using the following formula:

[0015]

[0016] Where n represents the n-order Bezier curve; P i,j Indicates the position of the jth vertex corresponding to the i-th n-order Bezier curve; B n j Represents the Bernstein polynomial corresponding to the n-th order Bezier curve passing through the j-th vertex position, u represents the control point corresponding to the j-th position, and any control point P(u) on the i-th n-th order Bezier curve is a linear combination of the vertices on the corresponding curve; P(u, v) represents the coordinates of the point at the v position on the area A1 to be processed corresponding to the motion adjustment of the control point u corresponding to the j-th position on the curve.

[0017] As a preferred solution of the laser processing method based on Bezier curve surface mapping of the present invention, wherein: for the measured area to be processed A1, it is equally divided into m parts of surface line types L1, L2...L composed of n-order Bezier curvesm , any Bezier curve is composed of n+1 points forming n line segments, resulting in (n+1)*m vertices. The complex surface is divided into m equal parts. The surface line type composed of n-order Bezier curves can obtain m P(u), which are recorded as P(u)0, P(u)1...P(u) m , where the Bezier curve corresponds to the point P(v) on the Bezier surface using the following formula:

[0018]

[0019] Among them, m represents the surface line type L1, L2...L composed of m multi-order Bezier curves m ; i represents i multi-order Bezier curves; v represents the position on the area A1 to be processed.

[0020] As a preferred solution of the laser processing method based on Bezier curve surface mapping described in the present invention, wherein: the parameters of the surface line type are mapped according to the data processing module in combination with the Bezier curve theory, A1 is mapped to a Bezier surface, the laser focus point is used as an arbitrary moving point P on the Bezier surface, and the coordinates are calculated in real time in combination with the coordinate calculation method of the arbitrary moving point P(u,v) on the Bezier surface. The coordinate calculation of the arbitrary moving point P(u,v) on the Bezier surface adopts the following formula:

[0021]

[0022] Among them, m represents the surface line type L1, L2...L composed of m multi-order Bezier curves m ; i represents i multi-order Bezier curves; v represents the position on the area to be processed A1; n represents the n-order Bezier curve; P i,j represents the j-th vertex position of the i-th n-order Bezier curve; u represents the control point corresponding to the j-th position, and P(u,v) represents the coordinates of the point at the v-th position on the area A1 to be processed adjusted by the movement of the control point u corresponding to the j-th position on the curve.

[0023] As a preferred solution of the laser processing method based on Bezier curve surface mapping of the present invention, the matrix for the coordinate calculation of P(u,v) adopts the following formula:

[0024]

[0025] Among them, B n 0(u) represents the Bernstein polynomial corresponding to the n-th order Bezier curve passing through the first vertex position, B n 1(u) represents the Bernstein polynomial corresponding to the n-order Bezier curve passing through the second vertex position, B nn (u) represents the Bernstein polynomial corresponding to the n-th order Bezier curve passing through the n+1-th vertex position; m represents the surface line type L1, L2...L composed of m multi-order Bezier curves m ; i represents i multi-order Bezier curves; v represents the position on the area to be processed A1; n represents the n-order Bezier curve; P i,j represents the j-th vertex position of the i-th n-order Bezier curve; u represents the control point corresponding to the j-th position, P(u,v) represents the coordinates of the point at the v-th position on the area A1 to be processed adjusted by the motion of the control point u corresponding to the j-th position on the curve; v represents the position on the area A1 to be processed.

[0026] As a preferred solution of the laser processing method based on Bezier curve surface mapping of the present invention, wherein: the coordinates of any point P (u, v) on the area to be processed A1 are derived to obtain the tangential trajectory of the arbitrary point P on the surface, and the derivative calculation adopts the following formula:

[0027]

[0028] Among them, dP(u,v) represents the direction of the tangent trajectory through any point P(u,v) on the surface A1 to be processed, dP(u,v) represents the tangent line through any point P(u,v) on the area A1 to be processed (surface), and d(u,v) represents the derivative of the motion of control points u and v along the surface A1.

[0029] In a second aspect, an embodiment of the present invention provides a laser processing system based on Bezier curve surface mapping, which includes:

[0030] A construction module obtains the area to be processed A1 through a three-dimensional measurement camera, where A1 represents a complex surface, collects the cloud data information and surface feature information of A1, and constructs the surface line type;

[0031] The parsing module parses and extracts the parameters of the surface line type, and substitutes the parameters of the surface line type into the data processing module to obtain the surface information of the laser processing;

[0032] A calibration module, which calibrates the linear laser of the line laser device to ensure that the linear laser is correctly irradiated on the area to be processed A1 and obtains a moving point P, which represents a moving point in the focused light spot;

[0033] The output module outputs the trajectory planning for subsequent processing based on extending to both sides with the moving point P as the center point;

[0034] The mapping module sets the laser processing parameters in the control system, performs parameter mapping on the surface line type parameters based on the data processing module combined with the Bezier curve theory, and defines the motion trajectory of the laser processing head;

[0035] The adjustment module controls the laser processing head to perform adaptive adjustment of the posture angle along the tangential trajectory and perform processing operations according to the tangential trajectory of the moving point P calculated in real time by the data processing module;

[0036] The evaluation module monitors the tangential trajectory and coordinates of the moving point P during laser processing to ensure that the processing is correct. After the processing is completed, it checks and evaluates the processing quality.

[0037] In a third aspect, an embodiment of the present invention provides a computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: when the computer program instructions are executed by the processor, the steps of the laser processing method based on Bezier curve surface mapping as described in the first aspect of the present invention are implemented.

[0038] In a fourth aspect, an embodiment of the present invention provides a computer-readable storage medium having a computer program stored thereon, wherein: when the computer program instructions are executed by a processor, the steps of the laser processing method based on Bezier curve surface mapping as described in the first aspect of the present invention are implemented.

[0039] The beneficial effects of the present invention are as follows: this scheme maps the complex surface A1 of the area to be processed into the Bezier surface based on Bezier curve surface mapping, guides the high-energy focused light spot of laser processing to realize processing trajectory planning and adaptive laser processing operations for various complex surface shapes on the complex surface A1 in three-dimensional space, improves the degree of automated maintenance operations, and ensures the quality consistency after maintenance; at the same time, the present invention calculates the coordinates and tangential trajectory of the moving point P of the laser focused light point in real time based on the Bezier curve surface mapping method, controls the laser processing head to perform adaptive adjustment of the posture angle along the tangential trajectory, and ensures that the focused light spot formed by the high-energy laser beam irradiation during the laser processing operation will not be defocused due to the problem of the incident angle of the laser beam, resulting in changes in energy intensity that affect the laser processing quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0041] Figure 1 The figure is a flow chart of a laser processing method based on Bezier curve surface mapping;

[0042] Figure 2 A computer device diagram for a laser processing method based on Bezier curve surface mapping;

[0043] Figure 3 Schematic diagram of Bezier curve surface parameter mapping for a complex surface A1 in a laser processing method based on Bezier curve surface mapping;

[0044] Figure 4 Schematic diagram of the laser processing method based on Bezier curve surface mapping. DETAILED DESCRIPTION

[0045] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0046] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0047] Secondly, the term "one embodiment" or "embodiment" herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in various places throughout this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive of other embodiments.

[0048] Example 1

[0049] Reference Figures 1 to 4 , which is the first embodiment of the present invention, provides a laser processing method based on Bezier curve surface mapping, including:

[0050] S1: The area to be processed A1 is obtained through a 3D measurement camera. A1 represents a complex surface. The cloud data information and surface feature information of A1 are collected, and the surface line type is constructed.

[0051] A 3D measurement camera is installed to measure the area to be processed (complex surface) A1, and the point cloud data and surface feature information of A1 are collected. The surface line parameters are extracted and analyzed synchronously and fed back to the data processing module.

[0052] S2: By parsing and extracting the parameters of the surface line type, the parameters of the surface line type are substituted into the data processing module to obtain the surface information of the laser processing;

[0053] S3: by calibrating the linear laser of the line laser device, ensuring that the linear laser is correctly irradiated in the area to be processed A1, and obtaining a moving point P, which represents the moving point in the focused light spot;

[0054] S4: Extend to both sides with the moving point P as the center point and output the trajectory planning for subsequent processing;

[0055] Turn on the laser processing device and the line laser device, calibrate the linear laser emitted by the line laser device to irradiate the surface A1 of the area to be processed (complex curved surface), and extend it to both sides with the moving point P of the focused light spot as the center point. Through the control system and motion mechanism programming and teaching, the laser processing trajectory planning of the moving point P of the focused light spot can cover the area to be processed (complex curved surface) A1, and simultaneously set the process parameters of the laser processing operation in the control system.

[0056] S5: Set the laser processing parameters in the control system, perform parameter mapping on the surface line type parameters according to the data processing module combined with Bezier curve theory, and define the motion trajectory of the laser processing head;

[0057] In the data processing module, the surface line parameters extracted from the complex surface A1 are parameter mapped by combining the theoretical methods of Bezier curves and surfaces, and the complex surface A1 is mapped to a Bezier surface. The laser focused light spot is used as an arbitrary moving point P on the Bezier surface. The coordinates are calculated in real time by combining the coordinate calculation method of an arbitrary moving point P(u,v) on the Bezier surface. The coordinates of the moving point P(u,v) of the focused light spot are synchronously derived in real time to obtain the tangential trajectory of the moving point P of the focused light spot, and the calculation results are fed back to the control system.

[0058] S6: Based on the tangential trajectory of the moving point P calculated in real time by the data processing module, the control system controls the laser processing head to perform adaptive adjustment of the posture angle along the tangential trajectory and perform processing operations;

[0059] The control system controls the motion mechanism to drive the laser processing head to perform processing operations according to the set laser processing trajectory, and simultaneously controls the laser processing head to perform adaptive adjustment of the posture angle along the tangential trajectory according to the tangential trajectory of the moving point P of the focused light spot calculated in real time by the data processing module, so as to ensure that the focused light spot formed by the high-energy laser beam irradiation during the laser processing operation will not be defocused due to the problem of the incident angle of the laser beam, resulting in changes in energy intensity that affect the laser processing quality, thereby realizing high-quality laser welding, laser cutting or laser cladding processing operations on the complex curved surface A1.

[0060] S7: Ensure the correctness of the processing process by monitoring the tangential trajectory and coordinates of the moving point P during the laser processing. After the processing is completed, check and evaluate the processing quality.

[0061] According to the data processing module and the Bezier curve theory, the parameters of the surface line type are mapped, A1 is mapped to the Bezier surface, and the laser focused light point is used as an arbitrary moving point P on the Bezier surface. The coordinates are calculated in real time by combining the coordinate calculation method of any moving point P(u,v) on the Bezier surface. The coordinates of the moving point P(u,v) of the focused light point are derived synchronously and in real time to obtain the tangential trajectory of the moving point P of the focused light point, and the calculation results are fed back to the control system.

[0062] The surface line parameters are extracted by analyzing the surface feature information. Based on the Bezier curve theory, the extracted surface line parameters can be parameter mapped. The starting and ending points of the multi-order Bezier curve and the tangents of the control points can be used to obtain a unique Bezier curve to define the surface line parameters of the complex surface.

[0063] For the complex surface area A1 to be measured, it is divided into m equal parts, which are surface line types L1, L2...L composed of n-order Bezier curves. m , any Bezier curve is composed of n line segments formed by n+1 points, and a total of (n+1)*m vertices will be obtained. The position of the jth vertex corresponding to the i-th n-order Bezier curve is defined as P i,j , and the movement adjustment of the control point u corresponding to position j on the curve corresponding to the point at position v on the surface area A1 will change the surface trajectory, and the coordinates are represented by P(u,v).

[0064] By analyzing and extracting the parameters of the surface line type, the surface feature information is analyzed and the surface line type parameters are extracted. According to the starting and ending points of the multi-order Bezier curve and the tangent of the control points, a unique Bezier curve is obtained and the surface line type parameters of the complex surface are defined. The surface trajectory of the measured area A1 to be processed is constructed using the following formula:

[0065]

[0066] Where n represents the n-order Bezier curve; P i,j Indicates the position of the jth vertex corresponding to the i-th n-order Bezier curve; B n j Represents the Bernstein polynomial corresponding to the n-th order Bezier curve passing through the j-th vertex position, u represents the control point corresponding to the j-th position, and any control point P(u) on the i-th n-th order Bezier curve is a linear combination of the vertices on the corresponding curve; P(u,v) represents the coordinates of the point at position v on the area A1 to be processed, which is adjusted by the motion of the control point u corresponding to the j-th position on the curve.

[0067] For the measured area to be processed A1, it is divided into m equal parts, and the surface line types L1, L2...L are composed of n-order Bezier curves. m, any Bezier curve is composed of n+1 points forming n line segments, resulting in (n+1)*m vertices. The complex surface is divided into m equal parts. The surface line type composed of n-order Bezier curves can obtain m P(u), which are recorded as P(u)0, P(u)1...P(u) m , where the Bezier curve corresponds to the point P(v) on the Bezier surface using the following formula:

[0068]

[0069] Among them, m represents the surface line type L1, L2...L composed of m multi-order Bezier curves m ; i represents i multi-order Bezier curves; v represents the position on the area A1 to be processed.

[0070] The data processing module combines the Bezier curve theory to perform parameter mapping on the surface line type parameters, maps A1 to a Bezier surface, and uses the laser focus point as an arbitrary moving point P on the Bezier surface. The coordinates are calculated in real time using the coordinate calculation method for an arbitrary moving point P(u,v) on the Bezier surface. The following formula is used to calculate the coordinates of an arbitrary moving point P(u,v) on the Bezier surface:

[0071]

[0072] Among them, m represents the surface line type L1, L2...L composed of m multi-order Bezier curves m ; i represents i multi-order Bezier curves; v represents the position on the area to be processed A1; n represents the n-order Bezier curve; P i,j represents the j-th vertex position of the i-th n-order Bezier curve; u represents the control point corresponding to position j, P(u,v) represents the coordinates of the point at position v on the area A1 to be processed, which is adjusted by the motion of the control point u on the curve; v represents the position on the area A1 to be processed.

[0073] The matrix for calculating the coordinates of P(u,v) uses the following formula:

[0074]

[0075] Among them, B n 0(u) represents the Bernstein polynomial corresponding to the n-th order Bezier curve passing through the first vertex position, B n 1(u) represents the Bernstein polynomial corresponding to the n-order Bezier curve passing through the second vertex position, B n n (u) represents the Bernstein polynomial corresponding to the n-th order Bezier curve passing through the n+1-th vertex position; m represents the surface line type L1, L2...L composed of m multi-order Bezier curvesm ; i represents i multi-order Bezier curves; v represents the position on the area to be processed A1; n represents the n-order Bezier curve; P i,j represents the j-th vertex position of the i-th n-order Bezier curve; u represents the control point corresponding to position j, P(u,v) represents the coordinates of the point at position v on the area A1 to be processed, which is adjusted by the motion of the control point u on the curve; v represents the position on the area A1 to be processed.

[0076] Based on the derivative of the coordinates of any point P(u,v) on the area to be processed A1, the tangential trajectory of the arbitrary point P on the surface can be obtained. The derivative calculation uses the following formula:

[0077]

[0078] Among them, dP(u,v) represents the direction of the tangent trajectory through any point P(u,v) on the surface A1 to be processed, dP(u,v) represents the tangent line through any point P(u,v) on the area A1 to be processed (surface), and d(u,v) represents the derivative of the motion of control points u and v along the surface A1.

[0079] The whole working principle is as follows:

[0080] The process parameters of the processing operation are set in the control system of the laser processing device. The surface feature information of the area to be processed (complex curved surface) A1 is measured by a line laser device coaxially installed with a three-dimensional measurement camera and the laser processing head of the laser processing device, and the surface line parameters obtained by analysis and extraction are fed back to the data processing module. The laser processing head of the laser processing device is controlled by the control system and the motion mechanism to irradiate the laser on the area to be processed (complex curved surface) A1 to form a focused light spot as an arbitrary moving point P of the trajectory;

[0081] The laser processing trajectory planning of the programmed teaching moving point P can cover the area to be processed (complex surface) A1. Based on the coordinate calculation method of any point P (u, v) on the Bezier surface, the laser focus point is used as the arbitrary moving point P to calculate the coordinates P (u, v) in real time. The coordinates of the moving point P (u, v) of the focused light point are simultaneously derived to obtain the real-time tangential trajectory of the moving point P of the focused light point on the surface and feed it back to the control system. The linear laser emitted by the coaxially mounted line laser device is irradiated on the surface of the area to be processed (complex surface) A1, and extends to both sides with the moving point P of the focused light point as the center point.

[0082] The control system controls the motion mechanism to drive the laser processing head to perform processing operations according to the set laser processing trajectory, and simultaneously controls the laser processing head to perform adaptive adjustment of the posture angle along the tangential trajectory according to the tangential trajectory of the moving point P of the focused light spot calculated in real time by the data processing module to ensure that the focused light spot formed by the high-energy laser beam irradiation during the laser processing operation will not be defocused due to the problem of the incident angle of the laser beam, resulting in changes in energy intensity that affect the laser processing quality.

[0083] The linear laser emitted by the line laser device, which extends to both sides with the moving point P of the focused light point as the center point, is used as an auxiliary target mark for the moving point P of the focused light point on the A1 complex curved surface to ensure that the 3D measurement camera can recognize it efficiently. At the same time, the linear laser extending to both sides can also avoid distortion of the point cloud data measured by the 3D measurement camera when there is light interference or partial occlusion on part of the complex curved surface of A1.

[0084] For the laser processing system, the functions of the three-dimensional measurement camera, line laser device, data processing module, laser processing head, laser processing device, control system, and motion mechanism are as follows:

[0085] 3D measurement camera: used to observe the complex surface A1 in the area to be processed, collect the point cloud data and surface feature information of A1, and simultaneously analyze and extract the surface line parameters;

[0086] Line laser device: Coaxially mounted with the laser processing head, it serves as an auxiliary target for the moving point P of the focused light irradiated by the laser processing head. The irradiated linear laser can increase the contrast of the moving point P of the focused light when there is light interference on the complex curved surface A1. Interference fringes will appear when there is partial occlusion on the complex curved surface A1, effectively ensuring that the recognition of the 3D measurement camera and the point cloud data are not distorted. The line laser device includes a line laser, a 3D measurement camera, a laser processing head, and a laser processing device.

[0087] Data processing module: This module is used to perform parameter mapping processing on the surface line parameters of the complex surface A1 observed and analyzed by the 3D measurement camera, combined with Bezier curves and surface theory methods, to calculate in real time the coordinates of the moving point P(u,v) of the focused light spot irradiated by the laser processing head on the complex surface A1, as well as the tangential trajectory of the moving point P of the focused light spot;

[0088] Laser processing head: used to perform laser processing operations on the target area. Different laser processing heads are used to perform laser welding, laser cutting, and laser cladding operations respectively.

[0089] Laser processing device: used to generate and emit high-energy laser beam to the laser processing head;

[0090] Control system: used to control the laser processing device and set the process parameters of the processing operation, control and plan the processing trajectory of the laser processing head, and adjust the posture angle of the laser processing head during the processing operation;

[0091] Motion mechanism: used to load the laser processing head to execute the processing operation trajectory planned by the control system, and at the same time adjust the posture angle of the laser processing head in real time according to the control system instructions.

[0092] Furthermore, this embodiment also provides a laser processing system based on Bezier curve surface mapping, including a construction module, which obtains a to-be-processed area A1 through a three-dimensional measurement camera, where A1 represents a complex surface, collects point cloud data information and surface feature information of A1, and constructs a surface line type;

[0093] The parsing module parses and extracts the parameters of the surface line type, and substitutes the parameters of the surface line type into the data processing module to obtain the surface information of the laser processing;

[0094] The calibration module calibrates the linear laser of the line laser device to ensure that the linear laser is correctly irradiated in the area to be processed A1 and obtains the moving point P, which represents the moving point in the focused light spot;

[0095] The output module outputs the trajectory planning for subsequent processing based on extending to both sides with the moving point P as the center point;

[0096] The mapping module sets the laser processing parameters in the control system, performs parameter mapping on the surface line type parameters based on the data processing module combined with the Bezier curve theory, and defines the motion trajectory of the laser processing head;

[0097] The adjustment module controls the laser processing head to perform adaptive adjustment of the posture angle along the tangential trajectory and perform processing operations according to the tangential trajectory of the moving point P calculated in real time by the data processing module;

[0098] The evaluation module monitors the tangential trajectory and coordinates of the moving point P during laser processing to ensure that the processing is correct. After the processing is completed, it checks and evaluates the processing quality.

[0099] Example 2

[0100] Reference Figure 1 - Figure 4 , which is the second embodiment of the present invention, provides a laser processing method based on Bezier curve surface mapping. In order to verify the beneficial effects of the present invention, scientific demonstration is carried out through economic benefit calculation and simulation experiments.

[0101] This embodiment also provides a computer device suitable for the case of a laser processing method based on Bezier curve and surface mapping, comprising a memory and a processor; the memory is used to store computer-executable instructions, and the processor is used to execute computer-executable instructions to implement the laser processing method based on Bezier curve and surface mapping proposed in the above embodiment.

[0102] The computer device may be a terminal, comprising a processor, a memory, a communication interface, a display screen and an input device connected via a system bus. The processor of the computer device is used to provide computing and control capabilities. The memory of the computer device comprises a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The communication interface of the computer device is used to communicate with an external terminal in a wired or wireless manner, and the wireless manner may be achieved through WIFI, an operator network, NFC (near field communication) or other technologies. The display screen of the computer device may be a liquid crystal display or an electronic ink display screen, and the input device of the computer device may be a touch layer covering the display screen, or a button, trackball or touchpad provided on the housing of the computer device, or an external keyboard, touchpad or mouse.

[0103] This embodiment further provides a storage medium storing a computer program, which, when executed by a processor, implements the laser processing method based on Bezier curve surface mapping as proposed in the above embodiment.

[0104] In summary, the three-dimensional measurement camera of this solution measures the area to be processed (complex surface) A1; the data processing module performs Bezier curve and surface mapping according to the measured surface line parameters to calculate the data of the area to be processed A1; the process parameters of the laser processing device to perform laser processing operations (the laser processing device has the functions of laser welding, laser cutting or laser cladding processing after matching different laser processing heads) are set in the control system; the calibration line laser device serves as an auxiliary target for the laser focus light point. When the motion mechanism loads the laser processing head to perform the laser processing operation according to the planned trajectory, the control system can combine the data processing module to calculate the coordinates of the moving point P of the laser focus light point and the data of the tangential trajectory in real time, and command the motion mechanism to control the laser processing head to perform adaptive adjustment of the posture angle along the tangential trajectory, so as to ensure that the focus light point formed by the high-energy laser beam irradiation during the laser processing operation will not be defocused due to the problem of the incident angle of the laser beam, resulting in energy intensity changes that affect the laser processing quality. The present invention helps to realize laser processing operations that adaptively fit the posture angle of the surface line type for various irregular and complex surfaces on the complex surface A1, improve the degree of automated maintenance operations, and ensure quality consistency after maintenance.

[0105] Example 3

[0106] Reference Figure 1 - Figure 4 , which is the third embodiment of the present invention, provides a laser processing method based on Bezier curve surface mapping. In order to verify the beneficial effects of the present invention, scientific demonstration is carried out through economic benefit calculation and simulation experiments.

[0107] This embodiment is directed to a laser processing method based on Bezier curve surface mapping. First, a three-dimensional measurement camera is used to measure the processing area A. 1( The complex curved front fork pipe is scanned and measured to obtain the point cloud data and surface feature information of A1, and the surface line parameters are analyzed and extracted to construct the surface line model of A1.

[0108] Next, the 3D measurement camera, line laser device, and laser processing head are integrated and installed. The line laser device, coaxially mounted with the laser processing head, projects an auxiliary laser line onto A1 to enhance the contrast of the focused spot. The data processing module receives A1 surface data from the 3D measurement camera and, incorporating Bezier curve theory, performs parameter mapping on A1's surface line parameters to obtain a Bezier surface model of A1.

[0109] Processing parameters, including laser power and scanning speed, are input into the control system. The control system drives the laser processing device to emit a high-energy laser beam. The laser processing head forms a focused laser spot on A1, which serves as the moving point P. Simultaneously, the data processing module calculates the coordinates P(u, v) of the moving point P on the Bezier surface in real time and takes the derivative of P(u, v) to obtain the tangential trajectory of the moving point P, which is then fed back to the control system.

[0110] Based on the set process parameters and the tangential trajectory of point P, the control system controls the motion mechanism to drive the laser processing head along surface A1, while simultaneously adjusting the laser processing head's attitude angle so that the laser beam is incident perpendicularly on surface A1. The laser line projected by the line laser device extends in both directions from the moving point P, assisting the 3D measurement camera in tracking and identifying the moving point P.

[0111] During the machining process, the motion trajectory and coordinates of the moving point P are monitored in real time to ensure smooth machining. After machining is completed, the cladding quality of the A1 surface is inspected and evaluated.

[0112] The data of this embodiment are shown in the following table:

[0113] Table 1 is a comparison table of cladding quality at the same monitoring point between the existing technology and our solution

[0114] Contrast type Existing technology This program Welding process efficiency (unit: cm^2 / min) 80 140 Surface cutting kerf roughness Ra (μm) 5 3 Cutting accuracy (μm) ±80 ±32 Dilution rate of curved surface cladding (%) 8 5.4 Thickness deviation of curved surface cladding layer (mm) ±0.1 ＜±0.06

[0115] As can be seen from Table 1 above, compared with the prior art, the solution of the present invention has obvious improvements in three key indicators: welding efficiency, surface cutting roughness, and cutting accuracy.

[0116] Welding efficiency has increased by 75%, primarily due to Bezier surface modeling and real-time trajectory planning. Traditional methods rely on offline programming, making it difficult to accurately fit complex surfaces, resulting in numerous deceleration steps that hinder efficiency. This solution, based on measured surface data, uses Bezier curves to accurately model the surface and generates tangential trajectories in real time. This allows for smoother laser processing head movement, reduces deceleration steps, and significantly improves efficiency.

[0117] The roughness Ra of the curved surface kerf is reduced by 40%, primarily due to real-time attitude angle adjustment. Traditional methods struggle to adjust the laser beam's incident angle based on local curvature variations, resulting in areas where the laser beam cannot illuminate the curved surface perpendicularly (the beam spot is out of focus). This leads to insufficient molten pool energy, inadequate kerf ablation and vaporization, and increased defects. This solution, however, uses a data processing module to calculate the tangential trajectory and coordinates the motion mechanism to adjust the processing head's attitude angle, ensuring perpendicular laser incidence and forming an ideal keyway-shaped molten pool, significantly improving cladding quality.

[0118] The machining accuracy is improved by 62.5%. This is because the Bezier surface model has higher fitting accuracy for complex surfaces, and real-time trajectory planning avoids the cumulative error of traditional offline programming.

[0119] The cladding dilution rate was reduced by 32.5%, mainly because this solution ensured vertical laser incidence, which allowed the laser to melt the powder material more fully, reducing the energy fluctuation of the molten pool caused by the defocusing of the laser focus spot and the ablation of some alloy elements in the substrate or powder material.

[0120] The thickness deviation of the cladding layer is nearly doubled. Vertical incidence allows more laser energy to be used for actual melting of the material rather than generating reflection and diffraction, thereby improving energy utilization efficiency, reducing energy fluctuations in the molten pool, allowing the powder material to melt more fully, and making the thickness consistency of the cladding layer higher.

[0121] In summary, compared with existing technologies, the present invention proposes innovative technologies based on Bezier surface modeling, real-time tangential trajectory planning, and adaptive attitude angle adjustment, significantly improving the efficiency and quality of laser cladding processing of complex surfaces. This demonstrates significant innovation and practical value. Compared with existing technologies, the present invention achieves significant breakthroughs in multiple key indicators, thanks to innovative Bezier surface modeling, real-time tangential trajectory planning, and adaptive attitude adjustment technologies. These innovative technologies effectively address the difficulties in laser processing of complex surfaces and provide strong support for achieving efficient, high-quality precision laser manufacturing.

[0122] Based on the above experiments, we also used the following data for comparison. A high-precision 3D measurement camera system was installed and calibrated on the workstation to accurately measure a complex curved surface (area A1 to be processed). This area A1 is composed of a variety of heterogeneous materials and has highly irregular geometric shapes. To verify the practicality and technical advantages of this invention, the 3D measurement camera system was first used to capture point cloud data and surface feature information for area A1. Software algorithms converted this data into specific parameters for the surface line shape and transmitted them in real time to the data processing module for further analysis.

[0123] The data processing module, incorporating Bezier curve theory, performs complex parameter mapping on the extracted surface line parameters, virtually mapping the complex surface A1 into a series of operational Bezier surfaces. Subsequently, a line laser device is precisely calibrated to ensure that its linear laser beam precisely irradiates the processing area A1. At this point, the moving point P (the moving point within the focused beam spot) is determined and serves as the center point for subsequent processing.

[0124] Using the control system and motion mechanism, we developed a laser processing trajectory based on the moving point P of the focused beam. This trajectory extends from point P in both directions to ensure that the laser processing covers the entire A1 area. Each step in this process is completed through programmable teaching, ensuring accurate and reproducible operation.

[0125] Table 2 is a comparison table of various parameters between our solution test area and the existing technology test area

[0126] parameter Test area A1 Prior Art Area B1 <![CDATA[Point cloud density (points / cm 2 )]]> 475 298 Parameter extraction accuracy (mm) 0.01 0.05 Trajectory planning time (min) 2 5 Processing accuracy (mm) ±0.02 ±0.1 <![CDATA[Processing speed (cm 2 / min)]]> 10 7 Data processing efficiency(s) 0.5 2

[0127] As shown in Table 2, this experiment demonstrates significant advantages over the existing technology (region B1) in several key metrics. Point cloud density increased by nearly 67%, directly improving the sophistication of surface modeling and enabling more precise subsequent processing. Parameter extraction accuracy increased fivefold, allowing for more precise determination of the material's microstructure and characteristics before laser processing, enabling optimized processing parameters.

[0128] The test area A1 and the prior art area B1 are both complex curved workpieces made of the same material and similar geometric shapes, and are comparable. The main differences between the two are:

[0129] (1) A1 was processed using the method of the present invention, and B1 was processed using the prior art method.

[0130] (2) The surface complexity of A1 is slightly higher than that of B1, and it contains more irregular curves and inclined surfaces.

[0131] (3) The dimensions of A1 and B1 are similar, both approximately 200mm×200mm×50mm.

[0132] Comparing the machining results of A1 and B1 provides an intuitive assessment of the advantages of the present method over existing techniques. Although the surface of A1 is more complex, it still demonstrates significant advantages across all metrics, fully demonstrating the superior performance of the present method in processing complex and challenging surfaces.

[0133] In addition, trajectory planning time has been reduced by 60%, greatly improving overall work efficiency. In terms of laser processing accuracy, the present invention achieves a high accuracy of ±0.02 mm, which is five times the accuracy of existing technologies. This is particularly important in high-precision processing fields such as aerospace component manufacturing. The increase in processing speed not only reduces production costs, but also increases the throughput of the production line. The significant reduction in data processing time (from 2 seconds to 0.5 seconds) has a direct impact on the overall setup time, which is reduced from 5 minutes to 1 minute.

[0134] Through a detailed comparison of these data, it can be clearly seen that the present invention in the embodiments demonstrates significant innovation and practical novelty compared to the prior art, which not only improves processing efficiency and precision, but also optimizes the operating process. These improvements make the present invention have important industrial application value.

[0135] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A laser processing method based on Bezier curve surface mapping, characterized by: include, The area to be processed A1 is obtained by a 3D measurement camera, where A1 represents a complex curved surface, and cloud data information and surface feature information of A1 are collected, and a curved line type is constructed; By analyzing and extracting the parameters of the surface line type, the parameters of the surface line type are substituted into the data processing module to obtain the surface information of laser processing; By calibrating the linear laser of the line laser device, ensuring that the linear laser is correctly irradiated on the area to be processed A1, and obtaining a moving point P, which represents a moving point in the focused light spot; Taking the moving point P as the center point, it extends to both sides and outputs the trajectory planning for subsequent processing; Set the laser processing parameters in the control system, map the parameters of the surface line type according to the data processing module combined with Bezier curve theory, and define the motion trajectory of the laser processing head; According to the tangential trajectory of the moving point P calculated in real time by the data processing module, the control system controls the laser processing head to perform adaptive adjustment of the posture angle along the tangential trajectory and perform processing operations; By monitoring the tangential trajectory and coordinates of the moving point P during laser processing, the processing process is ensured to be correct. After the processing is completed, the processing quality is checked and evaluated.

2. The laser processing method based on Bezier curve surface mapping according to claim 1, characterized in that: The parameter mapping of the surface line type parameters according to the data processing module combined with the Bezier curve theory includes mapping A1 to a Bezier surface, using the laser focused light point as an arbitrary moving point P on the Bezier surface, calculating the coordinates in real time in combination with the coordinate calculation method of the arbitrary moving point P(u,v) on the Bezier surface, synchronously and in real time derivatizing the coordinates of the moving point P(u,v) of the focused light point to obtain the tangential trajectory of the moving point P of the focused light point, and feeding back the calculation results to the control system.

3. The laser processing method based on Bezier curve surface mapping according to claim 2, characterized in that: By analyzing and extracting the parameters of the surface line type, the surface feature information is analyzed and the surface line type parameters are extracted. A unique Bezier curve is obtained based on the starting and ending points of the multi-order Bezier curve and the tangent of the control points, and the surface line type parameters of the complex surface are defined. The surface trajectory of the measured area A1 to be processed is constructed using the following formula: Where n represents the n-order Bezier curve; P i,j Indicates the position of the jth vertex corresponding to the i-th n-order Bezier curve; B n j Represents the Bernstein polynomial corresponding to the n-th order Bezier curve passing through the j-th vertex position, u represents the control point corresponding to the j-th position, and any control point P(u) on the i-th n-th order Bezier curve is a linear combination of the vertices on the corresponding curve; P(u, v) represents the coordinates of the point at the v position on the area A1 to be processed corresponding to the motion adjustment of the control point u corresponding to the j-th position on the curve.

4. The laser processing method based on Bezier curve surface mapping according to claim 3, characterized in that: The measured area to be processed A1 is divided into m equal parts, and the surface line types L1, L2, ..., L are formed by n-order Bezier curves. m , any Bezier curve is composed of n+1 points forming n line segments, resulting in (n+1)*m vertices. The complex surface is divided into m equal parts. The surface line type composed of n-order Bezier curves can obtain m P(u), which are recorded as P(u)0, P(u)1...P(u) m , where the Bezier curve corresponds to the point P(v) on the Bezier surface using the following formula: Among them, m represents the surface line type L1, L2...L composed of m multi-order Bezier curves m ; i represents i multi-order Bezier curves; v represents the position on the area A1 to be processed.

5. The laser processing method based on Bezier curve surface mapping according to claim 4, characterized in that: The coordinates of the arbitrary moving point P(u,v) are calculated using the following formula: Where i represents an i-order Bezier curve; v represents the position on the area to be processed A1; n represents an n-order Bezier curve; P i,j represents the j-th vertex position of the i-th n-order Bezier curve; u represents the control point corresponding to the j-th position, P(u,v) represents the coordinates of the point at the v-th position on the area A1 to be processed adjusted by the motion of the control point u corresponding to the j-th position on the curve; v represents the position on the area A1 to be processed.

6. The laser processing method based on Bezier curve surface mapping according to claim 5, characterized in that: The coordinate calculation of the arbitrary moving point P(u, v) includes using the following formula for the matrix of the coordinate calculation of the moving point P(u, v): Among them, B n 0(u) represents the Bernstein polynomial corresponding to the n-th order Bezier curve passing through the first vertex position, B n 1(u) represents the Bernstein polynomial corresponding to the n-order Bezier curve passing through the second vertex position, B n n (u) represents the Bernstein polynomial corresponding to the n-th order Bezier curve passing through the n+1-th vertex position; m represents the surface line type L1, L2...L composed of m multi-order Bezier curves m ; i represents i multi-order Bezier curves; v represents the position on the area to be processed A1; n represents the n-order Bezier curve; P i,j represents the j-th vertex position of the i-th n-order Bezier curve; u represents the control point corresponding to the j-th position, P(u,v) represents the coordinates of the point at the v-th position on the area A1 to be processed adjusted by the motion of the control point u corresponding to the j-th position on the curve; v represents the position on the area A1 to be processed.

7. The laser processing method based on Bezier curve surface mapping according to claim 6, characterized in that: Derivative calculation of the coordinates of the moving point P(u, v) includes obtaining the tangential trajectory of the arbitrary moving point P on the surface. The derivative calculation adopts the following formula: Among them, dP(u,v) represents the direction of the tangent trajectory of any moving point P(u,v) on the surface A1 to be processed, dP(u,v) represents the tangent line of any moving point P(u,v) on the area A1 to be processed, and d(u,v) represents the derivative of the motion of control points u and v along the surface A1.

8. A laser processing system based on Bezier curve and surface mapping, based on the laser processing method based on Bezier curve and surface mapping according to any one of claims 1 to 7, characterized in that: Also includes, A construction module obtains the area to be processed A1 through a three-dimensional measurement camera, where A1 represents a complex surface, collects the cloud data information and surface feature information of A1, and constructs the surface line type; The parsing module parses and extracts the parameters of the surface line type, and substitutes the parameters of the surface line type into the data processing module to obtain the surface information of the laser processing; A calibration module, which calibrates the linear laser of the line laser device to ensure that the linear laser is correctly irradiated on the area to be processed A1 and obtains a moving point P, which represents a moving point in the focused light spot; The output module takes the moving point P as the center point and extends to both sides to output the trajectory planning for subsequent processing; The mapping module sets the laser processing parameters in the control system, performs parameter mapping on the surface line type parameters based on the data processing module combined with the Bezier curve theory, and defines the motion trajectory of the laser processing head; The adjustment module controls the laser processing head to perform adaptive adjustment of the posture angle along the tangential trajectory and perform processing operations according to the tangential trajectory of the moving point P calculated in real time by the data processing module; The evaluation module monitors the tangential trajectory and coordinates of the moving point P during laser processing to ensure that the processing is correct. After the processing is completed, it checks and evaluates the processing quality.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the laser processing method based on Bezier curve surface mapping according to any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the laser processing method based on Bezier curve surface mapping according to any one of claims 1 to 7 are implemented.

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