An integrated MEMS chip and a method of manufacturing the same

Abstract

The embodiment of the application discloses an integrated MEMS chip and a manufacturing method thereof, wherein the manufacturing method comprises the following steps: providing a first substrate and a second substrate, manufacturing an auxiliary opening structure on the surface of the second substrate, and opening a first through air hole on the auxiliary opening structure; manufacturing a sensor structure on the surface of the first substrate with a movable groove; connecting the first substrate and the second substrate, and each sensor structure has a movable interval between the surface away from the first substrate and the surface of the second substrate with the auxiliary opening structure, and the movable interval and the movable groove jointly form a deformation space of the corresponding sensor structure; and opening a second through air hole on the second substrate, which is in one-to-one correspondence with the first through air hole and is in communication with the first through air hole. The application can adjust the air pressure of the corresponding deformation space through the second through air hole and the first through air hole in communication, and seal the first through air hole and the second through air hole after the air pressure is adjusted, so that the air pressure in the deformation space is maintained at a preset air pressure.

Description

Technical Field

[0001] This invention relates to the technical field of manufacturing methods for integrated MEMS chips, and particularly to an integrated MEMS chip and its manufacturing method. Background Technology

[0002] Integrated MEMS chips refer to the integration of multiple sensors with different functions onto the same MEMS chip. This trend of integration can not only reduce the physical size of the system and reduce power consumption, but also improve the overall system reliability and performance.

[0003] Some sensor structures integrated on MEMS chips need to operate in a sealed cavity, which is typically achieved through wafer bonding to encapsulate the sensor within the sealed cavity. However, different sensors require different cavity pressures, and wafer bonding can only achieve a given cavity pressure, making it impossible to set the pressure separately for different sensor structures integrated on the same wafer. Summary of the Invention

[0004] Embodiments of the present invention provide an integrated MEMS chip and a method for manufacturing the same, so as to set corresponding air pressures for different sensor structures on the same MEMS chip.

[0005] To address the aforementioned technical problems, embodiments of the present invention disclose the following technical solutions:

[0006] On the one hand, a method for manufacturing an integrated MEMS chip is provided, including:

[0007] A first substrate and a second substrate are provided, wherein a plurality of physically isolated movable grooves are formed on one side surface of the first substrate;

[0008] At least one auxiliary opening structure is fabricated, the at least one auxiliary opening structure is located on one side surface of the second substrate, and the thickness of each auxiliary opening structure is less than the thickness of the second substrate;

[0009] A first vent hole is made through each of the auxiliary opening structures;

[0010] Multiple sensor structures are fabricated, and the multiple sensor structures are located on the surface of the first substrate where the multiple movable grooves are formed, with each of the multiple sensor structures corresponding to one of the multiple movable grooves;

[0011] The first substrate and the second substrate are connected. Each sensor structure has a movable gap between the side surface of the sensor structure facing away from the first substrate and the surface of the second substrate with the auxiliary opening structure. Adjacent movable gaps are physically isolated. The movable gaps and the movable grooves together constitute the deformation space of the corresponding sensor structure.

[0012] At least one second vent hole is formed on the second substrate, and the at least one second vent hole corresponds one-to-one with the at least one auxiliary opening structure. The second vent hole is connected to the first vent hole of the corresponding auxiliary opening structure, so that the corresponding deformation space is connected to the outside of the MEMS chip, and the air pressure of the corresponding deformation space is adjusted through the connected second vent hole and the first vent hole.

[0013] Seal the first vent and the second vent.

[0014] In addition to one or more of the features disclosed above, or alternatively, blocking the first vent and the second vent includes:

[0015] A first sealing structure is fabricated, which covers the inner wall of the second vent and seals the first vent.

[0016] A second sealing structure is fabricated and filled into the second vent hole.

[0017] In addition to one or more of the features disclosed above, or alternatively, each of the sensor structures includes a working area and a non-working area, wherein, in the thickness direction of the first substrate, the projection of each of the auxiliary aperture structures onto the corresponding sensor structure is located in the non-working area of ​​the sensor structure.

[0018] In addition to one or more of the features disclosed above, or alternatively, the fabrication of at least one auxiliary opening structure includes:

[0019] At least one groove structure is formed on one side surface of the second substrate, and the depth of each groove structure is less than the thickness of the second substrate. When there are at least two groove structures, the at least two groove structures are spaced apart.

[0020] An insulating material is deposited in each of the groove structures to form the at least one auxiliary opening structure, wherein the side surface of each auxiliary opening structure facing away from the bottom of the groove structure is flush with the surface of the second substrate.

[0021] In addition to one or more of the features disclosed above, or alternatively, the fabrication of at least one auxiliary opening structure includes:

[0022] An insulating material is deposited on one side surface of the second substrate, wherein the thickness of the insulating material is less than the thickness of the second substrate;

[0023] A portion of the insulating material is removed intermittently to form at least one bump structure, each of the bump structures constituting one of the auxiliary opening structures.

[0024] In addition to one or more of the features disclosed above, or alternatively, the manufacturing method further includes, prior to bonding the first substrate and the second substrate,

[0025] At least one protective structure is fabricated, the protective structure being located on the side surface of the sensor structure facing away from the first substrate;

[0026] The at least one protective mechanism corresponds one-to-one with the at least one auxiliary opening structure, and after the first substrate and the second substrate are bonded, the projections of the corresponding auxiliary opening structure and the protective structure overlap on the corresponding sensor structure in the thickness direction of the first substrate.

[0027] In addition to one or more of the features disclosed above, or as an alternative, the aperture of the first vent is 0.2 μm-1 μm.

[0028] In addition to one or more of the features disclosed above, or as an alternative, the diameter of the first vent is smaller than the diameter of the second vent at the end near the first vent, and the side surface of the auxiliary opening structure facing away from the sensor structure is exposed in the second vent.

[0029] On the other hand, an integrated MEMS chip is provided, including:

[0030] A first substrate, wherein a plurality of physically isolated movable grooves are formed on one side surface of the first substrate;

[0031] Multiple sensor structures are provided, each of which corresponds to a multiple movable groove and is connected to one side surface of the first substrate on which the movable groove is formed. In the thickness direction of the first substrate, the corresponding movable groove and the sensor structure project to overlap.

[0032] The second substrate is connected to the side of the sensor structure opposite to the first substrate. Each sensor structure has a movable gap between the side opposite to the first substrate and the second substrate. Adjacent movable gaps are physically isolated from each other. The movable gaps and the movable groove together constitute the deformation space of the corresponding sensor structure.

[0033] At least one auxiliary opening structure is provided, wherein the at least one auxiliary opening structure is connected to one side surface of the second substrate relative to the sensor structure, each auxiliary opening structure has a first vent hole that passes through it, and the thickness of each auxiliary opening structure is less than the thickness of the second substrate. In the thickness direction of the first substrate, the projections of the auxiliary opening structure and the first vent hole are located within the projection of the movable interval.

[0034] The second substrate also has a second vent hole corresponding to the at least one auxiliary opening structure. Each second vent hole is connected to a first vent hole on the corresponding auxiliary opening structure. The air pressure in the deformation space where the auxiliary opening structure is located is adjusted through the first vent hole and the second vent hole. After the pressure is adjusted, the first vent hole and the second vent hole are blocked.

[0035] In addition to one or more of the features disclosed above, or as an alternative, the system may include a sealing structure comprising a first sealing structure and a second sealing structure, wherein the first sealing structure covers the inner wall of the second vent and fills within the first vent, and the second sealing structure fills within the second vent. In addition to one or more of the features disclosed above, or as an alternative, the system may include: the diameter of the first vent is smaller than the diameter of the second vent at the end closest to the first vent, and the surface of the auxiliary opening structure facing away from the sensor structure is exposed in the second vent.

[0036] In addition to one or more of the features disclosed above, or alternatively, each of the sensor structures includes a working area and a non-working area, wherein, in the thickness direction of the first substrate, the projection of each of the auxiliary aperture structures onto the corresponding sensor structure is located in the non-working area of ​​the sensor structure.

[0037] In addition to one or more of the features disclosed above, or as an alternative, a protective structure is also connected to the surface of the sensor structure opposite to the first substrate on the side of the sensor structure corresponding to the auxiliary aperture structure, wherein the projection of the auxiliary aperture structure onto the corresponding sensor structure overlaps with the projection of the protective structure onto the corresponding sensor structure in the thickness direction of the first substrate.

[0038] One of the above technical solutions has the following advantages or beneficial effects: Multiple sensor structures are fabricated on one side surface of the first substrate disclosed in this application. When one or more of the multiple sensor structures need to adjust the air pressure in their deformation space, an auxiliary opening structure is provided on one side surface of the second substrate corresponding to each sensor structure requiring air pressure adjustment. Before bonding the first and second substrates, this application first opens a first vent hole through the auxiliary opening structure. After bonding the first and second substrates, a second vent hole connected to the first vent hole is opened on the second substrate. This allows the deformation space where the sensor structure requiring air pressure adjustment is located to be connected to the outside through the first and second vent holes, thereby adjusting the air pressure in the deformation space. After the air pressure adjustment is completed, the first and second vent holes are then sealed.

[0039] Furthermore, by pre-fabricating an auxiliary opening structure with a thickness less than that of the second substrate, this application creates a first vent hole on the auxiliary opening structure before bonding, compared to directly opening a hole on the second substrate. This allows for the creation of a first vent hole with a smaller diameter. The first vent hole is directly connected to the deformation space, and its smaller diameter facilitates sealing the first vent hole after voltage regulation, thereby improving the airtightness of the deformation space. Attached Figure Description

[0040] The technical solution and other beneficial effects of the present invention will become apparent from the following detailed description of specific embodiments of the invention, in conjunction with the accompanying drawings.

[0041] Figure 1 This is a step diagram of a method for manufacturing an integrated MEMS chip according to an embodiment of this application;

[0042] Figure 2-11 This is a process diagram of a manufacturing method for an integrated MEMS chip according to an embodiment of this application;

[0043] Figure 12-14 This is a process diagram of an auxiliary opening structure provided according to an embodiment of this application;

[0044] Figure 15-16 This is a schematic diagram of a protective structure provided according to an embodiment of this application.

[0045] Explanation of reference numerals in the attached figures:

[0046] 100. First substrate; 101. Movable groove;

[0047] 110. Sensor structure; 111. Working area; 112. Non-working area; 113. Protective structure;

[0048] 120. First connecting ring structure;

[0049] 200, Second substrate; 201, Groove structure; 202, Bump structure; 203, Auxiliary opening structure; 204, First vent hole; 205, Second vent hole;

[0050] 210. First sealing structure; 220. Second sealing structure; 230. Second connecting ring structure;

[0051] 300. Activity interval. Detailed Implementation

[0052] To make the objectives, technical solutions, and beneficial effects of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described in this specification are merely for explaining the invention and are not intended to limit the invention.

[0053] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0054] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, a direct connection, or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0055] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0056] This invention discloses a method for manufacturing an integrated MEMS chip, referring to... Figure 1 The manufacturing method of this integrated MEMS chip includes:

[0057] S100. A first substrate and a second substrate are provided, wherein a plurality of movable grooves physically isolated from each other are formed on one side surface of the first substrate;

[0058] S200. Fabricate at least one auxiliary opening structure, wherein the at least one auxiliary opening structure is located on one side surface of the second substrate, and the thickness of each auxiliary opening structure is less than the thickness of the second substrate;

[0059] S300. A first vent hole is made through each auxiliary opening structure;

[0060] S400. Fabricate multiple sensor structures, with the multiple sensor structures located on the surface of the first substrate having multiple movable grooves, and the multiple sensor structures corresponding one-to-one with the multiple movable grooves;

[0061] S500. Connect the first substrate and the second substrate. Each sensor structure has a movable gap between the side surface of the sensor structure facing away from the first substrate and the surface of the second substrate with the auxiliary opening structure. In the thickness direction of the first substrate, the projections of the auxiliary opening structure and the first vent are located within the projection of the movable gap. Adjacent movable gaps are physically isolated. The movable gaps and the movable groove together constitute the deformation space of the corresponding sensor structure.

[0062] S600. At least one second vent hole is formed on the second substrate, the at least one second vent hole corresponds one-to-one with at least one auxiliary opening structure, and the second vent hole is connected to the first vent hole of the corresponding auxiliary opening structure, so that the corresponding deformation space is connected to the outside of the MEMS chip, and the air pressure of the corresponding deformation space is adjusted through the connected second vent hole and the first vent hole.

[0063] S700. Block the first and second vent holes.

[0064] The first substrate 100 provided in step S100 is as follows Figure 2 As shown. Specifically, the number of multiple physically isolated movable grooves 101 is set based on the number of sensor structures 110 integrated in the MEMS chip. Each sensor structure 110 is provided with one movable groove 101. The figures disclosed in this application take two sensor structures 110 integrated in the MEMS chip as an example.

[0065] In step S200, at least one auxiliary opening structure 203 is formed on one side surface of the second substrate 200. In different embodiments, the manufacturing steps of the auxiliary opening structure 203 are different. The manufacturing steps of the auxiliary opening structure 203 will be described in detail below with reference to different embodiments:

[0066] Reference Figures 3-4 An embodiment of manufacturing the auxiliary opening structure 203 is as follows: First, at least one groove structure 201 is formed on one side surface of the second substrate 200, and the depth of each groove structure 201 is less than the thickness of the second substrate 200. When there are at least two groove structures 201, they are spaced apart. Then, insulating material is deposited in each groove structure 201 to form at least one auxiliary opening structure 203. The side surface of each auxiliary opening structure 203 facing away from the bottom of the groove structure 201 is flush with the surface of the second substrate 200. It should be noted that after the first substrate 100 and the second substrate 200 are bonded, in the thickness direction of the first substrate 100, the projection of the groove structure 201 lies within the projection range of the sensor structure 110 whose air pressure needs to be adjusted in the deformation space. When there are at least two groove structures 201, the projection of each groove structure 201 lies within the projection range of a different sensor structure 110 whose air pressure needs to be adjusted in the deformation space. (Refer to...) Figure 5 After the auxiliary opening structure 203 is manufactured, a first vent 204 is made through the auxiliary opening structure 203, and the bottom of the groove structure 201 is exposed through the first vent 204. The diameter of the first vent 204 is between 0.2um and 1um, and the first vent 204 can serve as part of the air pressure regulation channel in the deformation space of the sensor structure 110 corresponding to the auxiliary opening structure 203.

[0067] Reference Figures 12-13In a second embodiment of manufacturing the auxiliary aperture structure 203, an insulating material is first deposited on one side surface of the second substrate 200, wherein the deposition thickness of the insulating material is less than the thickness of the second substrate 200. Then, portions of the insulating material are removed at intervals to form at least one bump structure 202, each bump structure 202 constituting an auxiliary aperture structure 203. Similarly, if the air pressure in the deformation space of multiple sensor structures 110 integrated in a MEMS chip needs to be adjusted, after the first substrate 100 and the second substrate 200 are bonded, the projections of the multiple bump structures 202 formed by removing portions of the insulating material at intervals are respectively located within the projection range of different sensor structures 110 whose deformation space air pressure needs to be adjusted. It should be noted that the material of the above-mentioned auxiliary aperture structure 203 can preferably be SiO2, SiN, or a combination thereof. Similarly, referring to... Figure 14 After the auxiliary opening structure 203 is manufactured, a first vent 204 is opened on the auxiliary opening structure 203 to penetrate the auxiliary opening structure 203. The surface of the second substrate 200 is exposed through the first vent 204. The diameter of the first vent 204 is between 0.2um and 1um.

[0068] It should be noted that, in both Embodiment 1 and Embodiment 2 of the manufacturing of the auxiliary opening structure 203, the thickness of the auxiliary opening structure 203 is less than the thickness of the second substrate 200. Compared to directly opening the first vent hole 204 on the second substrate 200 to communicate with the outside, this application opens the first vent hole 204 on the auxiliary opening structure 203 before bonding, which can create a first vent hole 204 with a smaller aperture. In the thickness direction of the first substrate 100, the projections of the auxiliary opening structure 203 and the first vent hole 204 are both located within the projection of the movable interval 300, so that the first vent hole 204 is directly connected to the corresponding deformation space. Because the aperture of the first vent hole 204 is small, it can be quickly sealed by vapor deposition or PVD, improving the airtightness in the deformation space while avoiding the deposition of sealing material in the working area 111 of the sensor structure 110.

[0069] In step 400, a plurality of sensor structures 110 are fabricated on the surface of the first substrate 100 having a plurality of movable grooves 101. (Refer to...) Figure 6Multiple sensor structures 110 correspond one-to-one with multiple movable grooves 101, and cover the openings of the movable grooves 101. Specifically, the sensor structures 110 are typically fabricated by bonding a silicon wafer to the surface of the first substrate 100 where multiple movable grooves 101 are formed, then thinning and planarizing the silicon wafer, and finally patterning and etching the silicon wafer to form the sensor structure 110 above each movable groove 101. Further, each sensor structure 110 includes a working area 111 and a non-working area 112. The non-working area 112 is connected to the surface of the first substrate 100, and the projection of the working area 111 in the thickness direction of the first substrate 100 overlaps with the projection of the corresponding movable groove 101. After the first substrate 100 and the second substrate 200 are bonded, the projection of each auxiliary opening structure 203 on the corresponding sensor structure 110 is located in the non-working area 112 of the sensor structure 110.

[0070] In step S500, the first substrate 100 and the second substrate 200 are connected, referring to... Figure 7After the first substrate 100 and the second substrate 200 are bonded, each sensor structure 110 has a movable gap 300 between its surface facing away from the first substrate 100 and the surface of the second substrate 200 where the auxiliary opening structure 203 is provided. Adjacent movable gaps 300 are physically isolated from each other. The movable gaps 300 and the movable grooves 101 together constitute the deformation space of the corresponding sensor structure 110, and the movable gaps 300 and the movable grooves 101 are connected through the corresponding sensor structures 110. Specifically, the movable interval 300 can be formed by the following method: Before connecting the first substrate 100 and the second substrate 200, a first connecting ring structure 120 is formed on the surface of each sensor structure 110 facing away from the first substrate 100, with the working area 111 of the sensor structure 110 located within the first connecting ring structure 120. A second connecting ring structure 230 corresponding to the first connecting ring structure 120 is formed on the surface of the second substrate 200 where the auxiliary opening structure 203 is formed. When connecting the first substrate 100 and the second substrate 200, the corresponding first connecting ring structures 120 and second connecting ring structures 230 abut against each other, thus forming a movable interval 300 between the surface of each sensor structure 110 facing away from the first substrate 100 and the surface of the second substrate 200 where the auxiliary opening structure 203 is provided. Multiple pairs of abutting first connecting ring structures 120 and second connecting ring structures 230 separate the second substrate 200 and the sensor structure 110 into multiple physically isolated movable intervals 300. It should be noted that when the first connecting ring structure 120 and the second connecting ring structure 230 are made of conductive material, there is a gap between adjacent first connecting ring structures 120 and between adjacent second connecting ring structures 230. When the first connecting ring structure 120 and the second connecting ring structure 230 are made of insulating material, adjacent first connecting ring structures 120 can be connected. Thus, the embodiments disclosed in this application, through the first connecting ring structure 120 and the second connecting ring structure 230, not only enable the first substrate 100 and the second substrate 200 to be bonded, ensuring the airtightness of the deformation space, but also allow the sensor structure 110 to have a flexible space 300 for deformation on the side away from the first substrate 100 without slotting the second substrate 200. At the same time, the first connecting ring structure 120 and the second connecting ring structure 230 can also act as electrical signal transmission terminals to output the electrical signal detected by the sensor structure 110.

[0071] It should also be noted that in the second embodiment of manufacturing the auxiliary opening structure 203, the thickness of the auxiliary opening structure 203 is less than the sum of the thicknesses of the first connecting ring structure 120 and the second connecting ring structure 230. A narrow ventilation channel is formed between the side surface of the auxiliary opening structure 203 facing away from the second substrate 200 and the side surface of the sensor structure 110 facing the auxiliary opening structure 203, which can further prevent metal material from being deposited in the working area 111 of the sensor structure 110 when the first ventilation hole 204 is blocked. (Refer to...) Figure 8 In step S600, at least one second vent hole 205 is formed on the second substrate 200, penetrating through itself. The number of second vent holes 205 is the same as the number of first vent holes 204, and they correspond one-to-one.

[0072] Reference Figure 11 In step S700, after adjusting the air pressure in the corresponding deformation space through the connected second vent 205 and first vent 204, the first vent 204 and second vent 205 are sealed. In some embodiments, the first vent 204 and second vent 205 are sealed by the following steps: Refer to Figure 9 First, a first sealing structure 210 is fabricated, which covers the inner wall of the second vent 205 and seals the first vent 204. Specifically, the first sealing structure 210 can be fabricated using vapor deposition or PVD processes. Both vapor deposition and PVD are thin-film deposition techniques. In the embodiments disclosed in this application, the pore size of the first vent 204 is between 0.2µm and 1µm. Through the aforementioned thin-film deposition techniques, a dense and uniform first sealing structure 210 can be formed both inside and outside the first vent 204, ensuring that the sealed first vent 204 has good airtightness. Compared with laser sealing, the thin-film deposition technique used in this application to seal the first vent 204 has a smaller thermal impact, avoiding thermal damage to the MEMS chip during the sealing process. (Refer to...) Figure 10Then, a second sealing structure 220 is fabricated, which fills the second vent hole 205. The second sealing structure 220 can be formed by electroplating, which improves its adhesion and ensures uniform metal filling of the second vent hole 205. Sealing the second vent hole 205 further improves the airtightness of the deformation space. It should be noted that the first sealing structure 210 can partially or completely seal the first vent hole 204, and the second sealing structure 220 can partially or completely seal the second vent hole 205. The first sealing structure 210 can be made of Ti, Cu, Cr, TiW, or related alloys. The second sealing structure 220 can be made of Cu, Ni, Ag, Al, or a combination thereof. Ti, Cu, Cr, TiW, or related alloys can be vapor-deposited or PVD-deposited under low pressure or even high vacuum conditions, thus maintaining a high vacuum level in the deformation space after voltage regulation. Maintaining a high vacuum level in the deformation space helps reduce the gas content within the deformation space after packaging, preventing gas molecules from causing corrosion or chemical reactions on the sensor structure 110.

[0073] When fabricating the first sealing structure 210 and the second sealing structure 220, the first sealing structure 210 may cover the surface of the second substrate 200 on the side away from the auxiliary opening structure 203. Therefore, after fabricating the first sealing structure 210 and the second sealing structure 220, the first sealing structure 210 and the second sealing structure 220 covering the surface of the second substrate 200 can be removed by chemical etching or CMP process.

[0074] To further improve the airtightness of the deformation space, in some embodiments, the diameter of the first vent 204 is smaller than the diameter of the second vent 205 at the end near the first vent 204, and the surface of the auxiliary opening structure 203 facing away from the sensor structure 110 is exposed in the second vent 205. Thus, the first sealing structure 210 can cover the inner wall of the second vent 205, and the surface of the auxiliary opening structure 203 facing away from the sensor structure 110, as well as sealing the first vent 204. Compared to the case where the diameter of the first vent 204 is equal to the diameter of the second vent 205 at the end near the first vent 204, this arrangement provides a larger contact area and structural support, enhancing the mechanical strength of the first sealing structure 210 and reducing the risk of detachment or cracking of the sealing material due to external forces or temperature changes during use. Especially for sealing thin film materials, a larger contact area can reduce stress concentration and extend the service life of the sealing structure.

[0075] To prevent etching solution from falling onto sensor structure 110 through first vent 204 and causing damage during the etching of second vent 205, please refer to... Figure 15 and Figure 16 In some embodiments, before the first substrate 100 and the second substrate 200 are bonded, the method for manufacturing the integrated MEMS chip further includes fabricating at least one protective structure 113 on the surface of the sensor structure 110 facing away from the first substrate 100. Specifically, refer to Figure 16 The protective structure 113 corresponds one-to-one with the auxiliary aperture structure 203. The fabrication steps of the protective structure 113 are as follows: a protective material is deposited on the surface of the sensor structure 110 facing away from the first substrate 100. The protective material can typically be an insulating material such as SiO2 or SiN. Then, the deposited protective material is etched so that the formed protective structure 113 is a protrusion protruding from one side surface of the first substrate 100. After the first substrate 100 and the second substrate 200 are bonded, the projections of the corresponding auxiliary aperture structure 203 and the protective structure 113 overlap on the corresponding sensor structure 110 in the thickness direction of the first substrate 100. It should be noted that the projection of each auxiliary aperture structure 203 on the corresponding sensor structure 110 is located in the non-working area 112 of the sensor structure 110. Therefore, the protective structure 113 corresponding to each auxiliary aperture structure 203 is also located in the non-working area 112 of the sensor structure 110. It should also be noted that the thickness of the protective structure 113 is less than the thickness of the first connecting ring structure 120, and there is a gap between the protective structure 113 and the corresponding auxiliary opening structure 203.

[0076] This invention also discloses an integrated MEMS chip, as described in the embodiments of the present invention. Figure 11The integrated MEMS chip includes: a first substrate 100, multiple sensor structures 110, a second substrate 200, and at least one auxiliary aperture structure 203. Multiple physically isolated movable grooves 101 are formed on one side surface of the first substrate 100. Each sensor structure 110 corresponds to one of the movable grooves 101 and is connected to the side surface of the first substrate 100 with the movable grooves 101. In the thickness direction of the first substrate 100, the corresponding movable grooves 101 and sensor structures 110 project and overlap. The second substrate 200 is connected to the side of the sensor structures 110 facing away from the first substrate 100. Each sensor structure 110 has a movable gap 300 between its side facing away from the first substrate 100 and the second substrate 200. Adjacent movable gaps 300 are physically isolated. The movable gaps 300 and the movable grooves 101 together constitute the deformation space of the corresponding sensor structure 110. At least one auxiliary opening structure 203 is connected to one side surface of the second substrate 200 relative to the sensor structure 110. Each auxiliary opening structure 203 has a first vent hole 204 that passes through it. The thickness of each auxiliary opening structure 203 is less than the thickness of the second substrate 200. In the thickness direction of the first substrate 100, the projections of the auxiliary opening structure 203 and the first vent hole 204 are located within the projection of the movable interval 300. The second substrate 200 also has a second vent hole 205 corresponding to each of the at least one auxiliary opening structure 203. Each second vent hole 205 is connected to the first vent hole 204 on the corresponding auxiliary opening structure 203. The air pressure in the deformation space where the auxiliary opening structure 203 is located is adjusted through the first vent hole 204 and the second vent hole 205. After the pressure is adjusted, the first vent hole 204 and the second vent hole 205 are blocked.

[0077] In some embodiments, the aperture of the first vent 204 is 0.2 μm-1 μm. In some embodiments, the aperture of the first vent 204 is smaller than the aperture of the second vent 205 at the end near the first vent 204, and the surface of the auxiliary opening structure 203 facing away from the sensor structure 110 is exposed in the second vent 205.

[0078] In some embodiments, the first vent 204 and the second vent 205 are blocked by a blocking structure. The blocking structure includes a first blocking structure 210 and a second blocking structure 220. The first blocking structure 210 covers the inner wall of the second vent 205 and fills the first vent 204, while the second blocking structure 220 fills the second vent (205).

[0079] In some embodiments, each sensor structure 110 includes a working area 111 and a non-working area 112. In the thickness direction of the first substrate 100, the projection of each auxiliary aperture structure 203 onto the corresponding sensor structure 110 is located in the non-working area 112 of the sensor structure 110. In some embodiments, a protective structure 113 is also connected to the surface of the sensor structure 110 corresponding to the auxiliary aperture structure 203 away from the first substrate 100. In the thickness direction of the first substrate 100, the projection of the auxiliary aperture structure 203 onto the corresponding sensor structure 110 overlaps with the projection of the protective structure 113 onto the corresponding sensor structure 110.

[0080] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0081] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A method for manufacturing an integrated MEMS chip, characterized in that, include: A first substrate and a second substrate are provided, wherein a plurality of physically isolated movable grooves are formed on one side surface of the first substrate; At least one auxiliary opening structure is fabricated, the at least one auxiliary opening structure is located on one side surface of the second substrate, and the thickness of each auxiliary opening structure is less than the thickness of the second substrate; A first vent hole is made through each of the auxiliary opening structures; Multiple sensor structures are fabricated, and the multiple sensor structures are located on the surface of the first substrate where the multiple movable grooves are formed, with each of the multiple sensor structures corresponding to one of the multiple movable grooves; The first substrate and the second substrate are connected. Each sensor structure has a movable gap between the side surface of the sensor structure facing away from the first substrate and the surface of the second substrate with the auxiliary opening structure. In the thickness direction of the first substrate, the projection of the auxiliary opening structure and the first vent hole is located within the projection of the movable gap. Adjacent movable gaps are physically isolated. The movable gap and the movable groove together constitute the deformation space of the corresponding sensor structure. At least one second vent hole is formed on the second substrate, and the at least one second vent hole corresponds one-to-one with the at least one auxiliary opening structure. The second vent hole is connected to the first vent hole of the corresponding auxiliary opening structure, so that the corresponding deformation space is connected to the outside of the MEMS chip, and the air pressure of the corresponding deformation space is adjusted through the connected second vent hole and the first vent hole. Seal the first vent and the second vent.

2. The method for manufacturing an integrated MEMS chip according to claim 1, characterized in that, The blocking of the first vent and the second vent includes: A first sealing structure is fabricated, which covers the inner wall of the second vent and seals the first vent. A second sealing structure is fabricated and filled into the second vent hole.

3. The method for manufacturing an integrated MEMS chip according to claim 1, characterized in that, Each of the sensor structures includes a working area and a non-working area. In the thickness direction of the first substrate, the projection of each of the auxiliary aperture structures onto the corresponding sensor structure is located in the non-working area of ​​the sensor structure.

4. The method for manufacturing an integrated MEMS chip according to claim 1, characterized in that, The fabrication of at least one auxiliary opening structure includes: At least one groove structure is formed on one side surface of the second substrate, and the depth of each groove structure is less than the thickness of the second substrate. When there are at least two groove structures, the at least two groove structures are spaced apart. An insulating material is deposited in each of the groove structures to form the at least one auxiliary opening structure, wherein the side surface of each auxiliary opening structure facing away from the bottom of the groove structure is flush with the surface of the second substrate.

5. The method for manufacturing an integrated MEMS chip according to claim 1, characterized in that, The fabrication of at least one auxiliary opening structure includes: An insulating material is deposited on one side surface of the second substrate, wherein the thickness of the insulating material is less than the thickness of the second substrate; A portion of the insulating material is removed intermittently to form at least one bump structure, each of the bump structures constituting one of the auxiliary opening structures.

6. The method for manufacturing an integrated MEMS chip according to claim 3, characterized in that, Before the first substrate and the second substrate are bonded, the manufacturing method further includes, At least one protective structure is fabricated, the protective structure being located on the side surface of the sensor structure facing away from the first substrate; The at least one protective structure corresponds one-to-one with the at least one auxiliary opening structure, and after the first substrate and the second substrate are bonded, the projections of the corresponding auxiliary opening structure and the protective structure overlap on the corresponding sensor structure in the thickness direction of the first substrate.

7. The method for manufacturing an integrated MEMS chip according to claim 1, characterized in that, The diameter of the first vent is 0.2μm-1μm.

8. The method for manufacturing an integrated MEMS chip according to claim 1, characterized in that, The diameter of the first vent is smaller than the diameter of the second vent at the end closest to the first vent, and the side surface of the auxiliary opening structure facing away from the sensor structure is exposed in the second vent.

9. An integrated MEMS chip, characterized in that, include: A first substrate (100) has a plurality of physically isolated movable grooves (101) formed on one side surface of the first substrate (100); Multiple sensor structures (110) are provided, each of which corresponds to a multiple movable groove (101) and is connected to the side surface of the first substrate (100) where the movable groove (101) is provided. In the thickness direction of the first substrate (100), the corresponding movable groove (101) and the sensor structure (110) are projected to overlap. The second substrate (200) is connected to the side of the sensor structure (110) away from the first substrate (100). Each side of the sensor structure (110) away from the first substrate (100) has a movable interval (300) between it and the second substrate (200). Adjacent movable intervals (300) are physically isolated from each other. The movable intervals (300) and the movable grooves (101) together constitute the deformation space of the corresponding sensor structure (110). At least one auxiliary opening structure (203) is connected to one side surface of the second substrate (200) relative to the sensor structure (110). Each auxiliary opening structure (203) has a first vent hole (204) that passes through it. The thickness of each auxiliary opening structure (203) is less than the thickness of the second substrate (200). In the thickness direction of the first substrate (100), the projections of the auxiliary opening structure (203) and the first vent hole (204) are located within the projection of the movable interval (300). The second substrate (200) also has a second vent (205) corresponding to the at least one auxiliary opening structure (203). Each second vent (205) is connected to a first vent (204) on the corresponding auxiliary opening structure (203). The air pressure in the deformation space where the auxiliary opening structure (203) is located is adjusted by the first vent (204) and the second vent (205). After the pressure is adjusted, the first vent (204) and the second vent (205) are blocked.

10. The integrated MEMS chip according to claim 9, characterized in that, It also includes a sealing structure, which includes a first sealing structure (210) and a second sealing structure (220). The first sealing structure (210) covers the inner wall of the second vent (205) and fills the first vent (204), and the second sealing structure (220) fills the second vent (205).

11. The integrated MEMS chip according to claim 9, characterized in that, include: The diameter of the first vent (204) is smaller than the diameter of the second vent (205) at the end near the first vent (204), and the auxiliary opening structure (203) on the side facing away from the sensor structure (110) is exposed in the second vent (205).

12. The integrated MEMS chip according to claim 9, characterized in that, Each of the sensor structures (110) includes a working area (111) and a non-working area (112). In the thickness direction of the first substrate (100), the projection of each of the auxiliary aperture structures (203) onto the corresponding sensor structure (110) is located in the non-working area (112) of the sensor structure (110).

13. The integrated MEMS chip according to claim 12, characterized in that, A protective structure (113) is also connected to the side surface of the sensor structure (110) opposite to the first substrate (100) of the auxiliary aperture structure (203). In the thickness direction of the first substrate (100), the projection of the auxiliary aperture structure (203) on the corresponding sensor structure (110) overlaps with the projection of the protective structure (113) on the corresponding sensor structure (110).

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