A room temperature curable resin composition and its preparation method and application

Abstract

The present invention discloses a room temperature curable resin composition and a preparation method and application thereof. The resin composition comprises composition A and composition B; in parts by mass, composition A comprises 50-80 parts of a benzaldehyde compound and 2-10 parts of a catalyst, and composition B comprises at least 90-135 parts of a polythiol compound; the benzaldehyde compound is an aromatic compound containing at least one aldehyde group on a benzene ring; the structure of the polythiol compound is as follows: #imgabs0# wherein, R 1 C 2‑18 Alkylene, R 2 R 3 ‑SH, R 3 C 2‑18 The resin composition provided by the present invention can not only be cured at room temperature, but also exhibits high bonding strength, low water absorption, excellent moisture and heat resistance, and chemical resistance after curing, and has good application prospects in industrial assembly and electronic assembly.

Description

Technical Field

[0001] The present invention relates to the technical field of adhesives, and in particular to a room temperature curable resin composition, a preparation method and an application thereof. Background Art

[0002] Benzaldehyde resin, as a thermosetting resin, is widely used in industrial production due to its excellent mechanical properties, heat resistance and chemical stability. Benzaldehyde resin is generally liquid or semi-solid at room temperature and requires the addition of a curing agent to promote the curing reaction. Curing agents are key components that promote the transformation of resins from liquid or semi-solid to solid. They initiate polymerization reactions, cross-linking reactions or other chemical reactions, forming chemical bonds between resin molecular chains, thereby achieving curing. The type and amount of curing agent directly affect the curing temperature, curing time and curing process of the resin. At the same time, its chemical structure and reactivity determine the properties of the cured material, including mechanical strength, heat resistance, chemical corrosion resistance, water resistance, electrical insulation, etc., thereby affecting the quality and application range of the resin products cured by it.

[0003] Traditional benzaldehyde resin curing agents typically require high temperatures or prolonged heating to cure, which limits their applicability in specific application scenarios, such as bonding heat-sensitive materials or addressing energy consumption issues during large-scale construction. Mercaptan curing agents, due to their unique chemical structure and reactivity, can cure resins at relatively low temperatures and are commonly used to cure epoxy resins. However, existing mercaptan curing agents have significant limitations in their resistance to acids, alkalis, and moisture and heat. Resin products cured with these agents exhibit relatively poor resistance to acids, alkalis, moisture and heat, limiting their widespread application in industrial equipment or electronic devices used in hot and humid environments.

[0004] Based on this, there is an urgent need for a benzaldehyde resin composition that can be cured at room temperature and has high bonding strength, excellent acid and alkali resistance, and moisture and heat resistance to meet the performance requirements of high-performance industrial assembly and electronic assembly fields. Summary of the Invention

[0005] To solve the above problems, the present invention provides a room-temperature curable resin composition, a preparation method and application thereof, wherein a polythiol compound with a specific structure is used as a curing agent to cure benzaldehyde resin, which not only can achieve room-temperature curing of benzaldehyde resin, but also the cured benzaldehyde resin exhibits high bonding strength, low water absorption rate and excellent alkali resistance and moisture and heat resistance, and has good application prospects in the field of electronic packaging.

[0006] Specifically, the following technical solutions are provided:

[0007] A first aspect of the present invention provides a room temperature curable resin composition, comprising a composition A and a composition B; wherein, by weight, the composition A comprises 50-80 parts of a benzaldehyde compound and 2-10 parts of a catalyst, and the composition B comprises at least 90-135 parts of a polythiol compound;

[0008] The benzaldehyde compound is an aromatic compound containing at least one aldehyde group on the benzene ring;

[0009] The structure of the polythiol compound is as follows:

[0010]

[0011] Among them, R 1 C 2-18 Alkylene, R 2 -R 3 -SH, R 3 C 2-18 of alkylene.

[0012] At present, the curing conditions of benzaldehyde resin are relatively harsh, the energy consumption is large and it is not suitable for bonding heat-sensitive materials, and the acid and alkali resistance and thermal properties of the existing thiol curing agent for low-temperature curable resins are poor, which makes it difficult to meet the application requirements of industrial assembly and electronic devices used in hot and humid environments. To solve the above problems, the present invention adopts a polythiol compound of a specific structure as a curing agent for curing benzaldehyde compounds. The polythiol compound contains a rigid biphenyl structure and four flexible alkyl mercapto groups, which can form a stable thioether bond and a cross-linked network with a high cross-linking density through a condensation reaction between the mercapto group and the aldehyde group of the benzaldehyde compound at room temperature, thereby enhancing the bonding strength and durability of the adhesive; at the same time, the polythiol compound does not have an easily hydrolyzed group, and after the condensation reaction with the benzaldehyde compound, the hydrophilic group can be reduced and the hydrophobic structural unit can be increased, which can further improve the water resistance and chemical resistance of the resin composition after curing, thereby significantly improving the wet heat resistance, alkali resistance, etc. of the cured resin. The use of the polythiol compound with a specific structure as a curing agent not only enables room temperature curing of the benzaldehyde resin, but also the cured resin composition exhibits high bonding strength, low water absorption, high hydrophobicity, and excellent alkali resistance and moisture and heat resistance.

[0013] Furthermore, the benzaldehyde compound is selected from one or more of benzaldehyde, p-hydroxybenzaldehyde, p-aminobenzaldehyde, vanillin, p-anisaldehyde, 4-hydroxy-3-anisaldehyde, p-nitrobenzaldehyde, m-nitrobenzaldehyde, 2-thienylbenzaldehyde and 2-furylbenzaldehyde; preferably, the benzaldehyde compound contains at least p-hydroxybenzaldehyde, p-anisaldehyde and 4-hydroxy-3-anisaldehyde; more preferably, the mass ratio of 4-hydroxy-3-anisaldehyde to p-hydroxybenzaldehyde and p-anisaldehyde in the composition A is preferably (40-60):(5-10):(5-10).

[0014] Furthermore, the polythiol compound is a compound represented by the following structural formula:

[0015]

[0016] Among them, R 1 C 2-18 Alkylene, R 2 -R 3 -SH, R 3 C 2-18 of alkylene.

[0017] Furthermore, the preparation method of the polythiol compound comprises the following steps: under a protective atmosphere,

[0018] (1) reacting 4,4'-biphenyldiphenol and a compound represented by Formula I in the presence of a first base reagent, a first phase transfer catalyst, and a first solvent to obtain a first intermediate product represented by Formula II;

[0019] (2) heating the first intermediate product to obtain a second intermediate product represented by formula III;

[0020] (3) reacting the second intermediate product with the compound represented by formula IV in the presence of a second base reagent, a second phase transfer catalyst, and a second solvent to obtain a third intermediate product represented by formula V;

[0021] (4) reacting the third intermediate product with thioacetic acid in the presence of a free radical initiator and a third solvent to obtain a fourth intermediate product represented by Formula VI;

[0022] (5) reacting the fourth intermediate product with an acid reagent or a base reagent in the presence of a fourth solvent to obtain the thiol curing agent;

[0023] The structures of the above formula I to formula VI are as follows:

[0024]

[0025] Wherein, X is Cl or Br;

[0026] h is any integer from 0 to 16, and l is any integer from 0 to 15.

[0027] In some preferred embodiments, in step S1, the first alkaline reagent can be selected from one or more of potassium carbonate, sodium carbonate, potassium hydroxide, sodium hydroxide, triethylamine, and p-dimethylaminopyridine; the first phase transfer catalyst can be selected from one or more of crown ethers, onium salts, ammonium salts, sulfonium salts, arsenic salts, polyethers, non-cyclic polyethers, and tertiary amine catalysts; the first solvent can be selected from one or more of acetone, ethyl acetate, tetrahydrofuran, N,N'-dimethylformamide, dichloromethane, dioxane, ethanol, and methanol; the reaction temperature is 60-90°C, and the reaction time is 6-15h.

[0028] In some preferred embodiments, in step S2, the temperature of the heating reaction is 150-250° C., and the heating reaction time is 10-18 hours.

[0029] In some preferred embodiments, in step S3, the second alkaline reagent can be selected from one or more of potassium carbonate, sodium carbonate, potassium hydroxide, sodium hydroxide, triethylamine, and p-dimethylaminopyridine; the second phase transfer catalyst can be selected from one or more of crown ethers, onium salts, ammonium salts, sulfonium salts, arsenic salts, polyethers, non-cyclic polyethers, and tertiary amine catalysts; the second solvent can be selected from one or more of acetone, ethyl acetate, tetrahydrofuran, N,N'-dimethylformamide, dichloromethane, dioxane, ethanol, and methanol; the reaction temperature is 60-90°C, and the reaction time is 6-15h.

[0030] In some preferred embodiments, in step S4, the free radical initiator is selected from one or more of azo, organic peroxide and redox initiators, such as azobisisobutyronitrile or benzoyl peroxide; the third solvent is selected from one or more of acetone, ethyl acetate, tetrahydrofuran, N,N'-dimethylformamide, dichloromethane, dioxane, ethanol, and methanol; the reaction temperature is 60-90°C, and the reaction time is 15-25h.

[0031] In some preferred embodiments, in step S5, the acid reagent is hydrochloric acid and / or sulfuric acid, and the alkaline reagent includes but is not limited to sodium hydroxide; the fourth solvent is selected from one or more of acetone, ethyl acetate, tetrahydrofuran, N,N'-dimethylformamide, dichloromethane, dioxane, ethanol, and methanol; the reaction temperature is 55-95°C, and the reaction time is 25-40h.

[0032] Furthermore, the molar ratio of aldehyde functional groups to thiol functional groups in the resin composition is 1:(1.6-2.4), for example, 1:1.6, 1:1.7, 1:1.8, 1:1.9, 1:2, 1:2.1, 1:2.2, 1:2.3, 1:2.4, etc., including but not limited to the molar ratios listed above, more preferably 1:(1.8-2.2).

[0033] Furthermore, the catalyst is selected from one or more of an acidic catalyst, a basic catalyst, an organic photocatalyst, a phase transfer catalyst, and a metal catalyst; in some preferred embodiments, the catalyst is trifluoroacetic acid and / or zirconium chloride, more preferably trifluoroacetic acid.

[0034] Furthermore, the composition B further comprises 2-30 parts of a filler and / or 0.1-15 parts of an auxiliary agent; the filler is selected from one or more of carbon black, silica, aluminum oxide, magnesium oxide, zinc oxide, boron nitride, silicon carbide, talc, calcium carbonate, glass microspheres, graphite powder, metal powder, and polytetrafluoroethylene; and the auxiliary agent is selected from one or more of a dehydrating agent, a flame retardant, a diluent, a pigment, an antioxidant, an adhesion promoter, a defoaming agent, a leveling agent, a thixotropic agent, a leveling agent, and an ion scavenger.

[0035] In some preferred embodiments, the composition A comprises 40-60 parts of 4-hydroxy-3-methoxybenzaldehyde, 5-10 parts of p-hydroxybenzaldehyde, 5-10 parts of p-methoxybenzaldehyde and 2-10 parts of trifluoroacetic acid; the composition B comprises 90-135 parts of a polythiol compound, 2-30 parts of a filler, and 0.1-15 parts of an auxiliary agent; the filler comprises carbon black and silica, and the auxiliary agent comprises a molecular sieve dehydrating agent.

[0036] The second aspect of the present invention provides a method for preparing the room temperature curable resin composition described in the first aspect, comprising weighing the components according to the formula, uniformly mixing the benzaldehyde compound and the catalyst to obtain composition A; and uniformly mixing the remaining components to obtain composition B.

[0037] Furthermore, when the room temperature curable resin composition is used, composition A and composition B are mixed evenly and then cured at room temperature.

[0038] A third aspect of the present invention provides a use of a room temperature curable resin composition in an adhesive or sealant for bonding or sealing industrial equipment and electronic devices.

[0039] Compared with the prior art, the present invention has the following beneficial effects:

[0040] The present invention provides a room-temperature-curable resin composition, comprising a benzaldehyde compound, a catalyst, and a polythiol compound having a rigid biphenyl structure and four flexible alkylthiol groups. The resin composition can be cured at room temperature, thereby reducing curing energy consumption, and is suitable for bonding heat-sensitive materials. More importantly, the resin composition exhibits high bonding strength, high hydrophobicity, and low water absorption after room-temperature curing, maintains high bonding strength after high-temperature and high-humidity aging, and has good chemical resistance under alkaline conditions. It can be used as an adhesive or sealant for bonding or encapsulating industrial equipment and electronic components, thereby improving the performance and service life of equipment products.

[0041] The present invention adopts a mercaptan curing agent with low preparation cost and is suitable for industrial mass production. In addition, the mercaptan curing agent is in a liquid state at room temperature and has relatively low viscosity. It can be directly applied as a curing agent in the curing process of the resin combination, realizing room temperature curing of the benzaldehyde resin composition, and the internal stress and shrinkage generated during curing are relatively small. Compared with other mercaptan curing agents, the polythiol compound does not have an easily hydrolyzed group, and the benzaldehyde resin cured by the polythiol compound has a high cross-linking density and a hydrophobic structural unit, which can effectively improve the bonding strength, chemical resistance and wet heat resistance of the resin combination after curing. It is more suitable for preparing adhesives, sealing materials, etc. for industrial equipment and electronic products used in wet and hot environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 4,4'-bis(3-mercaptopropoxy)-3,3'-bis(3-mercaptopropyl)biphenyl prepared in Example 1 1 H-NMR spectrum;

[0043] Figure 2 4,4'-bis(3-mercaptopropoxy)-3,3'-bis(3-mercaptopropyl)biphenyl prepared in Example 1 13 C-NMR;

[0044] Figure 3 This is the IR spectrum of 4,4'-bis(3-mercaptopropoxy)-3,3'-bis(3-mercaptopropyl)biphenyl prepared in Example 1. DETAILED DESCRIPTION

[0045] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used in this specification are for the purpose of describing specific embodiments only and are not intended to limit the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items. The symbol "-" between two numbers herein means "to," for example, "50-80 parts of a benzaldehyde compound" means "50 to 80 parts of a benzaldehyde compound."

[0046] The present invention will be further described below with reference to the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it. However, the embodiments are not intended to limit the present invention.

[0047] The sources of some of the raw materials used in the following examples and comparative examples are as follows:

[0048]

[0049]

[0050] The structure of commercial polythiol PEMP is shown below:

[0051]

[0052] The biphenyl-type polythiol compound 4,4'-bis(3-mercaptopropoxy)-3,3'-bis(3-mercaptopropyl)biphenyl used in the following examples and comparative examples was prepared as follows:

[0053] (1) 18.6 g of 4,4'-dihydroxybiphenyl and 36.3 g of allyl bromide were dissolved in 250 mL of acetone, and then 55.3 g of anhydrous potassium carbonate and 2.6 g of 18-crown ether-6 were added. The mixture was stirred at 80°C under N2 protection for 15 h. After filtering, the solvent and excess raw materials in the filtrate were removed by vacuum distillation, and the mixture was washed with water and dried to obtain a first intermediate product.

[0054] (2) 26.6 g of the first intermediate product was heated to 200° C. under N2 protection and reacted for 13 h, and purified to obtain the second intermediate product;

[0055] (3) 26.6 g of the second intermediate product and 36.3 g of allyl bromide were dissolved in 250 mL of acetone, 55.3 g of anhydrous potassium carbonate and 2.6 g of 18-crown ether-6 were added, and the mixture was stirred at 70° C. under N2 protection for 10 h. After filtering, the solvent and excess raw materials in the filtrate were removed by vacuum distillation, and the filtrate was washed with water and dried to obtain a third intermediate product;

[0056] (4) 34.7 g of the third intermediate product and 45.7 g of thioacetic acid were dissolved in 300 mL of tetrahydrofuran, and 3.3 g of azobisisobutyronitrile was added. The mixture was stirred at 80° C. under N2 protection for 20 h. After filtering, the solvent and excess raw materials in the filtrate were removed by vacuum distillation, and the mixture was washed with water and dried to obtain a fourth intermediate product.

[0057] (5) 65.1 g of the fourth intermediate product and 10 g of concentrated hydrochloric acid were dissolved in 150 mL of tetrahydrofuran and 150 mL of methanol, and the mixture was stirred at 80° C. for 30 h under N2 protection. After filtration, the solvent and excess raw materials in the filtrate were removed by vacuum distillation. The mixture was washed with water and dried to obtain a liquid product, 4,4'-bis(3-mercaptopropoxy)-3,3'-bis(3-mercaptopropyl)biphenyl. Its H NMR spectrum, C NMR spectrum and IR spectrum were as follows: Figure 1-3 As shown, 4,4'-bis(3-mercaptopropoxy)-3,3'-bis(3-mercaptopropyl)biphenyl was prepared.

[0058] Example 1

[0059] This embodiment provides a room temperature curable resin composition, including composition A and composition B, where, by mass, composition A contains 47 parts of 4-hydroxy-3-methoxybenzaldehyde, 8 parts of 4-hydroxybenzaldehyde, 8 parts of 4-methoxybenzaldehyde, and 6 parts of trifluoroacetic acid; composition B contains 100 parts of a polythiol compound 4,4'-bis(3-mercaptopropoxy)-3,3'-bis(3-mercaptopropyl)biphenyl, 0.1 parts of carbon black, 5 parts of gaseous silica, and 5 parts of a dehydrating agent (Additive TI).

[0060] The raw materials of components A and B are mixed evenly at room temperature, and then deaerated. The discharged materials are divided and packaged into sealed double tubes A and B to obtain a resin composition.

[0061] Examples 2-13 and Comparative Examples 1-3

[0062] Examples 2-13 and Comparative Examples 1-3 respectively provide a room temperature curable resin composition, which differs from Example 1 only in that the type or content of the benzaldehyde compound, catalyst and / or curing agent in the resin composition formula is different, and the rest are the same.

[0063] The types of benzaldehyde compounds, catalysts and curing agents in the room temperature curable resin compositions prepared in Examples 1-13 and Comparative Examples 1-3 are shown in Table 1 below, wherein the thiol curing agent A is a homemade biphenyl type polythiol compound 4,4'-bis(3-mercaptopropoxy)-3,3'-bis(3-mercaptopropyl)biphenyl, the thiol curing agent B is 5,5'-bis(3-mercaptopropyl)-2,2'-bis(3-mercaptopropoxy)biphenyl, and the thiol curing agent C is a commercial polythiol PEMP:

[0064] Table 1

[0065]

[0066] In the table, a / b is the molar ratio of aldehyde functional groups to thiol functional groups in the resin composition.

[0067] Performance Testing

[0068] The performance tests of the resin compositions prepared in the above examples and comparative examples are as follows:

[0069] Curing conditions: The resin compositions prepared in the examples and comparative examples were extruded from double-tube packaging using a dispensing machine, mixed in a static mixer, and then cured at room temperature for 24 hours to obtain cured samples.

[0070] Bond strength (MPa): The resin compositions prepared in the above embodiments and comparative examples were respectively coated on sheets to prepare test samples with a bonding area of ​​25.4 mm × 5 mm and a thickness of the adhesive layer of 0.1 mm. The test samples were cured respectively, and then the two sheets of the completely cured samples were pulled apart in opposite directions using a universal testing machine. The tests were carried out at an ambient temperature of 25°C, and the measured force values ​​were recorded as strength (MPa). The cured samples were subjected to heating and humidification conditions of 85°C / 85% RH / 750 h, and the shear bond strength (MPa) of the samples was tested again at an ambient temperature of 25°C and recorded.

[0071] Chemical Resistance: The resin compositions prepared in the above Examples and Comparative Examples were each formed into block samples measuring 20 × 10 × 5 mm. The test samples were then cured. The fully cured samples were placed in a 10 wt% aqueous sodium hydroxide solution at 80°C for 48 hours. The samples were then removed, dried, and weighed, and the mass loss (%) was calculated.

[0072] Water drop angle (°): The resin compositions obtained in the above examples and comparative examples were added to a syringe and tested using a fully automatic water drop angle tester using the sitting drop method. The amount of glue was 3 μL and a PCB with a 30-32 dyne value was used as the substrate. The sample was dropped onto the substrate and allowed to stand for 5 seconds before the water drop angle data was read. Five samples were tested for each example, and the average of the test results was used to determine the water drop angle of the resin composition.

[0073] Water Absorption (%): The resin compositions prepared in the above Examples and Comparative Examples were each formed into block samples measuring 20 × 10 × 5 mm. The test samples were then cured. The fully cured samples were placed in 80°C distilled water and immersed for 24 hours. The samples were removed and weighed, and their water absorption was calculated according to the formula: Waterabsorption = (mt - m0) / m0; where m0 is the original mass of the sample and mt is the mass of the sample after time t.

[0074] The above test results are shown in Table 2 below:

[0075] Table 2

[0076]

[0077]

[0078] As shown in Table 2, compared to Comparative Example 1, the resin composition prepared by using a polythiol compound having a rigid biphenyl structure and four flexible alkyl mercapto groups as a curing agent not only has high bonding strength after curing, but also can maintain high bonding strength after high humidity and high heat aging test, showing excellent resistance to moisture and heat. In addition, the resin composition prepared in Comparative Example 1 is placed in a 10wt% sodium hydroxide aqueous solution after curing, and after soaking for 48h under 80°C, it is completely dissolved, while the resin compositions prepared in Examples 1-13 are placed in a 10wt% sodium hydroxide aqueous solution after curing, and taken out after soaking under the same conditions, with a mass loss of less than 7%. It can be seen that the resin composition provided by the present invention has excellent alkali resistance. In addition, as shown in the water drop angle and water absorption test results, compared to the resin composition prepared in Comparative Example 1, the resin compositions prepared in Examples 1-13 have a larger water drop angle and lower water absorption after room temperature curing.

[0079] It can be seen from Examples 3 and 12 that the type of catalyst affects the bonding strength, moisture and heat resistance, chemical resistance, etc. of the resin composition after curing. Compared with Example 12, the resin composition prepared with trifluoroacetic acid as a catalyst (Example 3) has a higher bonding strength, chemical resistance and lower water absorption after curing; and it can be seen from Examples 3 and 13 that the substitution position of the mercaptoalkyl chain on the phenyl group in the polythiol compound affects the bonding strength and chemical resistance of the resin composition after curing, among which the resin composition cured with the ortho-substituted polythiol compound as a curing agent has significantly better bonding strength, chemical resistance and low water absorption.

[0080] In addition, it can be seen from Examples 1-7 and Comparative Examples 2 and 3 that the ratio of aldehyde functional groups to thiol functional groups in the resin composition affects the bonding strength, moisture and heat resistance, and chemical resistance of the adhesive layer after curing. When the ratio of the two is controlled to be in the range of 1: (1.6-2.4), the room temperature bonding strength of the adhesive layer of the resin composition prepared in Examples 1-7 after room temperature curing is not less than 14.5 MPa, and after being treated under heating and humidification conditions of 85°C / 85% RH / 750h, the bonding strength is not less than 1 2.0MPa; more preferably, the resin composition having a ratio of aldehyde functional groups to thiol functional groups in the range of 1:(1.8-2.2) (Examples 1-5) has better room temperature bonding strength and moisture and heat resistance, and the mass loss under alkaline conditions is less than 5%, and the hydrophobicity is better; in the above embodiments, when the ratio of aldehyde functional groups to thiol functional groups is 1:2 (Example 1), the prepared resin composition has the best properties such as bonding strength, moisture and heat resistance, chemical resistance, and hydrophobicity after curing.

[0081] The above-described embodiments are merely preferred examples for fully illustrating the present invention, and the scope of protection of the present invention is not limited thereto. Equivalent substitutions or modifications made by those skilled in the art based on the present invention are all within the scope of protection of the present invention. The scope of protection of the present invention shall be subject to the claims.

Claims

1. A room temperature curable resin composition, characterized in that The resin composition comprises composition A and composition B; in parts by mass, the composition A comprises 50-80 parts of a benzaldehyde compound and 2-10 parts of a catalyst, and the composition B comprises at least 90-135 parts of a polythiol compound; The benzaldehyde compound is an aromatic compound containing at least one aldehyde group on the benzene ring; The polythiol compound is a compound represented by the following general structural formula: ， Among them, R 1 C 2-18 Alkylene, R 2 -R 3 -SH, R 3 C 2-18 alkylene; The molar ratio of aldehyde functional groups to thiol functional groups in the resin composition is 1:(1.8-2.2); The benzaldehyde compound is selected from one or more of benzaldehyde, p-hydroxybenzaldehyde, p-aminobenzaldehyde, vanillin, p-methoxybenzaldehyde, 4-hydroxy-3-methoxybenzaldehyde, p-nitrobenzaldehyde, m-nitrobenzaldehyde, 2-thienylbenzaldehyde and 2-furylbenzaldehyde; The catalyst is trifluoroacetic acid.

2. The room temperature curable resin composition according to claim 1, characterized in that The benzaldehyde compound at least includes p-hydroxybenzaldehyde, p-methoxybenzaldehyde and 4-hydroxy-3-methoxybenzaldehyde.

3. The room temperature curable resin composition according to claim 2, characterized in that The mass ratio of 4-hydroxy-3-methoxybenzaldehyde to p-hydroxybenzaldehyde and p-methoxybenzaldehyde in the resin composition is (40-60): (5-10): (5-10).

4. The room temperature curable resin composition according to claim 1, characterized in that The composition B further comprises 2-30 parts of a filler and / or 0.1-15 parts of an auxiliary agent; The filler is selected from one or more of carbon black, silicon dioxide, aluminum oxide, magnesium oxide, zinc oxide, boron nitride, silicon carbide, talc, calcium carbonate, glass microspheres, graphite powder, metal powder, and polytetrafluoroethylene; The auxiliary agent is selected from one or more of a dehydrating agent, a flame retardant, a diluent, a pigment, an antioxidant, an adhesion promoter, a defoaming agent, a leveling agent, a thixotropic agent, a leveling agent, and an ion capture agent.

5. A method for preparing the room temperature curable resin composition according to any one of claims 1 to 4, characterized in that: Weigh each component according to the formula, mix the benzaldehyde compound and the catalyst evenly to obtain composition A; The remaining components were mixed uniformly to obtain composition B.

6. Use of the room temperature curable resin composition according to any one of claims 1 to 4 in an adhesive or sealant for bonding or sealing industrial equipment and electronic devices.

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