Electroplating clamping tool for circuit board processing
By designing an electroplating clamping tool with a clamping mechanism and magnet block, the problems of simple fixture structure and low installation and disassembly efficiency in the prior art are solved, and the circuit board is more stable and efficiently processed during the electroplating process is achieved. .
Patent Information
- Application Number
- CN202411924217.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-25
- Publication Date
- 2025-02-14
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The existing electroplating clamping tool has a simple structure, low installation and disassembly efficiency, and requires frequent disassembly and use, resulting in trouble in operation.
An electroplating clamping tool for circuit board processing is designed, using a combination of a clamping mechanism and a magnet block to achieve stable clamping and magnetic adsorption and fixation of the circuit board through the structure of the rotating shaft and sleeve.
It improves the stability and processing efficiency of the circuit board during the electroplating process, reduces the frequent replacement and installation and disassembly of fixtures, saves a lot of time, and only needs to rotate the shaft to use.
Smart Images

Figure CN119433669A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of circuit board electroplating, and in particular to an electroplating clamping tool for circuit board processing. Background Art
[0002] The names of circuit boards include: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, circuit boards, PCB boards, aluminum substrates, high-frequency boards, thick copper boards, impedance boards, PCBs, ultra-thin circuit boards, ultra-thin circuit boards, printed (copper etching technology) circuit boards, etc. Circuit boards make circuits miniaturized and intuitive, and play an important role in the mass production of fixed circuits and the optimization of electrical appliance layouts. Circuit boards can be called printed circuit boards or printed circuit boards, and the English name is PC circuit boards and the birth and development of soft-hard boards-FPC and PCBs have given rise to a new product, the soft-hard board. Therefore, the soft-hard board is a flexible circuit board and a rigid circuit board, which are combined together according to relevant process requirements after lamination and other processes to form a circuit board with FPC characteristics and PCB characteristics.
[0003] At present, circuit board electroplating refers to the process of depositing a layer of metal film on the metal surface (usually copper) of the circuit board through electrolytic reaction. This film is usually electroplated with gold, silver, copper or nickel to improve the conductivity, corrosion resistance, wear resistance and other properties of the circuit board.
[0004] However, the current electroplating process plays an important role in circuit board processing. The formation of small holes or traces for powering and connecting the circuit board depends on the clamping tooling used in the electroplating process. Most of the existing electroplating clamping tools adopt a simple structure, such as a pure clamping type clamp, or a screw-fixed clamp. It is often only one set of clamps on a production line, which requires reciprocating disassembly and use, which is more troublesome. In addition, the installation and disassembly efficiency is low when the clamp is fixed with screws. Summary of the invention
[0005] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a plating clamping tool for circuit board processing to solve the current electroplating process plays an important role in circuit board processing. The formation of small holes or traces for powering and connecting the circuit board relies on the clamping tool used in the electroplating process. Most of the existing electroplating clamping tools adopt a simple structure, such as a pure clamping type, or a clamp fixed with screws. It is often only one set of clamps on a production line, which needs to be disassembled and used reciprocally, which is more troublesome. In addition, the use of screw-fixed clamps has a technical problem of low installation and disassembly efficiency.
[0006] In order to solve the above technical problems, the present invention adopts the following technical solutions:
[0007] A plating clamping tool for processing a circuit board, comprising: a rotating shaft, a sleeve is fixedly installed on the outside of the rotating shaft, a clamping mechanism and a protective plate are fixedly installed on the outside of the sleeve, and the clamping mechanism is located on the inner side of the protective plate;
[0008] The clamping mechanism includes a fixing plate 1, a fixing plate 2, a splint, a fixing cylinder, a handle, a telescopic rod, a spring, a matching hole, a magnet block and a plug-in column. The clamping mechanism takes the vertical center line of the rotating shaft as the center of a circle. The fixing plate 1 and the fixing plate 2 are both fixedly mounted on the outer wall of the fixing cylinder, and the fixing plate 1 and the fixing plate 2 form an angle. The fixing cylinder is fixedly mounted on an outer wall of one side of the fixing plate 1. One end of the telescopic rod is movably plugged into the interior of the fixing cylinder. The other end of the telescopic rod is fixedly connected to an outer wall of one side of the splint. The plug-in column is fixedly mounted on an outer wall of one side of the splint. The magnet block is embedded in an outer wall of one side of the splint and is located on the inner side of the plug-in column. A matching hole is opened inside the fixing plate 2 and is adapted to the plug-in column.
[0009] Furthermore, the telescopic rod is arranged in an arc shape, and a limit block is fixedly installed on one end of the telescopic rod located inside the fixing tube.
[0010] Furthermore, the limit block is slidably connected to the inner wall of the fixed cylinder, the spring is movably arranged inside the fixed cylinder, and one end of the spring is clamped with the inner wall of the fixed cylinder, and the other end of the spring is clamped with one end of the limit block.
[0011] Furthermore, the plug-in columns and the plug-in holes are provided in multiple groups, and a handle is provided on an outer wall of one side of the clamping plate.
[0012] Furthermore, a bracket is provided on an outer wall of one side of the second fixing plate, and the bracket is configured as a groove and is located at two ends of one side of the second fixing plate.
[0013] Furthermore, the two groups of adjacent fixed plates are connected by a baffle, and a support plate is fixedly installed on the outer wall of one side of the fixed plates on both sides, and a gap is formed between the other end of the support plate and the protective plate.
[0014] Beneficial effects of the present invention:
[0015] By providing a clamping mechanism, when in use, the handle is pulled to rotate the clamping plate toward one place of the fixed plate, the circuit board is fitted to the second place of the fixed plate, and the internal hole is aligned with the adapter hole, and the handle is released, so that the telescopic rod moves under the action of the spring, thereby driving the clamping plate and the plug-in column to move, so that the plug-in column passes through the inner hole of the circuit board and extends into the adapter hole, thereby clamping and fixing the circuit board, and at the same time, a magnet block is used for magnetic adsorption and fixation, so that the circuit board is more stable during the electroplating process and the effect is better. At the same time, it is distributed in a circular shape, and multiple groups of circuit boards can be set for processing and use, avoiding frequent replacement, installation and disassembly of the clamp, saving a lot of time, and it can be used by just rotating the shaft. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.
[0017] Figure 1 This is a schematic diagram of the three-dimensional structure of an embodiment of the electroplating clamping tooling for circuit board processing;
[0018] Figure 2 This is a schematic diagram of the internal structure of the fixing cylinder of the embodiment of the electroplating clamping tool for processing circuit boards;
[0019] Figure 3 This is a schematic diagram of the sleeve installation structure of the embodiment of the electroplating clamping tooling for circuit board processing;
[0020] Figure 4 This is a schematic diagram of the installation structure of the clamping mechanism of the embodiment of the electroplating clamping tool for circuit board processing;
[0021] Figure 5 This is a three-dimensional schematic diagram of the clamping mechanism of the embodiment of the electroplating clamping tool for circuit board processing;
[0022] Figure 6 This is a schematic diagram of the bracket installation structure of an embodiment of the electroplating clamping tooling for circuit board processing.
[0023] Explanation of the markings in the figure: 1. rotating shaft; 2. sleeve; 3. bracket; 5. fixing plate 1; 6. protective plate; 7. fixing tube; 8. clamping plate; 9. handle; 10. telescopic rod; 11. spring; 12. fixing plate 2; 13. matching hole; 14. baffle; 15. support plate; 16. plug-in column; 17. magnet block. DETAILED DESCRIPTION
[0024] The following will be combined with the attached embodiment of the present invention Figure 1-6, the technical solutions in the embodiments of the present invention are clearly and completely described. Obviously, the described embodiments are part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0025] It should be understood that when used in this specification and the appended claims, the terms "include" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.
[0026] It should also be understood that the terms used in this specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. As used in the specification of the present invention and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.
[0027] It should be further understood that the term "and / or" used in the present description and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.
[0028] See also Figure 1-6 As shown, a plating clamping tool for circuit board processing includes: a rotating shaft 1, a sleeve 2 is fixedly installed on the outside of the rotating shaft 1, a clamping mechanism and a protective plate 6 are fixedly installed on the outside of the sleeve 2, and the clamping mechanism is located on the inner side of the protective plate 6;
[0029] The clamping mechanism includes a fixed plate 1 5, a fixed plate 2 12, a clamping plate 8, a fixed tube 7, a handle 9, a telescopic rod 10, a spring 11, a matching hole 13, a magnet block 17 and a plug-in column 16. The clamping mechanism takes the vertical center line of the rotating shaft 1 as the center of the circle. The fixed plate 1 5 and the fixed plate 2 12 are both fixedly mounted on the outer wall of the fixed tube 7, and the fixed plate 1 5 and the fixed plate 2 12 form an angle. The fixed tube 7 is fixedly mounted on one side outer wall of the fixed plate 1 5. One end of the telescopic rod 10 is movably plugged into the interior of the fixed tube 7. The other end of the telescopic rod 10 is fixedly connected to one side outer wall of the clamping plate 8. The plug-in column 16 is fixedly mounted on one side outer wall of the clamping plate 8. The magnet block 17 is embedded in one side outer wall of the clamping plate 8 and is located on the inner side of the plug-in column 16. The matching hole 13 is opened inside the fixed plate 2 12 and is adapted to the plug-in column 16.
[0030] Specifically, by providing a clamping mechanism, when in use, the handle 9 is pulled to rotate the clamping plate 8 toward the fixed plate 1 5, the circuit board is fitted on the fixed plate 2 12, and the internal hole is aligned with the adapter hole, and the handle 9 is released, so that the telescopic rod 10 moves under the action of the spring 11, thereby driving the clamping plate 8 and the plug-in column 16 to move, so that the plug-in column 16 passes through the inner hole of the circuit board and extends into the adapter hole, thereby clamping and fixing the circuit board, and at the same time, the magnet block 17 is used for magnetic adsorption and fixation, so that the circuit board is more stable during the electroplating process and the effect is better. At the same time, it is distributed in a circular shape, and multiple groups of circuit boards can be provided for processing and use, avoiding frequent replacement, installation and disassembly of the clamp, saving a lot of time, and it can be used by only rotating the rotating shaft 1.
[0031] In this embodiment, the telescopic rod 10 is arranged in an arc shape, and a limit block is fixedly installed at one end of the telescopic rod 10 located inside the fixing tube 7 .
[0032] Specifically, by adopting the telescopic rod 10, when in use, one only needs to pull the handle 9, and there is no need to frequently remove the screws, thereby greatly improving work efficiency.
[0033] The limit block is slidably connected to the inner wall of the fixed tube 7, the spring 11 is movably arranged inside the fixed tube 7, and one end of the spring 11 is clamped with the inner wall of the fixed tube 7, and the other end of the spring 11 is clamped with one end of the limit block, multiple groups of plug-in columns 16 and plug-in holes are provided, and a handle 9 is provided on the outer wall of one side of the splint 8.
[0034] Specifically, the limit block is slidably connected to the inner wall of the fixed tube 7, and the spring 11 is installed inside the fixed tube 7, and one end of the spring is clamped with the inner wall of the fixed tube 7, and the other end is clamped with one end of the limit block, so that the spring 11 provides resistance and limits the moving range of the limit block, thereby ensuring the precise positioning of the device, so that the clamping mechanism can be suitable for circuit boards of different sizes. At the same time, the multiple groups of settings of the plug-in columns 16 and the plug-in holes, and the installation positions of the splint 8 handles 9 make it convenient for users to adjust the position of the device and operate it more flexibly.
[0035] Two groups of adjacent fixed plates 5 are connected by a baffle 14, and a support plate 15 is fixedly installed on the outer wall of one side of the fixed plates 5 on both sides, and a gap is formed between the other end of the support plate 15 and the protective plate 6, and a bracket 3 is provided on the outer wall of one side of the fixed plate 2 12, and the bracket 3 is set as a groove and is located at both ends of one side of the fixed plate 2 12.
[0036] Specifically, a support plate 15, a protective plate 6 and a baffle 14 are used, and when the clamping mechanism rotates, the plating liquid on its surface can flow into the gap along the groove formed by the support plate 15 and the baffle 14, and then flow back again, preventing the plating liquid from flowing to other circuit boards, so that the electroplating effect is better. At the same time, a bracket 3 with a groove arrangement is used, and the plating liquid on the circuit board will flow along the two side edges to the grooves on the bracket 3, and then flow into the groove formed by the support plate 15 and the baffle 14.
[0037] In summary, compared with the prior art, the electroplating clamping tool for circuit board processing has at least the following beneficial effects: by providing a clamping mechanism, when in use, pull the handle 9 to rotate the clamping plate 8 toward the fixed plate 1 5, fit the circuit board to the fixed plate 2 12, and then align the internal hole with the adapter hole, and then release the handle 9, so that the telescopic rod 10 moves under the action of the spring 11, thereby driving the clamping plate 8 and the plug-in column 16 to move, so that the plug-in column 16 passes through the inner hole of the circuit board and extends into the adapter hole, thereby clamping and fixing the circuit board, and at the same time using the magnet block 17 for magnetic adsorption and fixation, so that the circuit board is more stable during the electroplating process and the effect is better. At the same time, it is distributed in a circular shape, and multiple groups of circuit boards can be provided for processing and use, avoiding frequent replacement, installation and disassembly of the clamp, saving a lot of time, and it can be used by only rotating the rotating shaft 1.
[0038] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.
Claims
1. A plating clamping tool for circuit board processing, characterized in that: include: A rotating shaft (1), a sleeve (2) being fixedly mounted on the outside of the rotating shaft (1), a clamping mechanism and a protective plate (6) being fixedly mounted on the outside of the sleeve (2), and the clamping mechanism being located on the inner side of the protective plate (6); The clamping mechanism comprises a fixing plate 1 (5), a fixing plate 2 (12), a clamping plate (8), a fixing tube (7), a handle (9), a telescopic rod (10), a spring (11), a matching hole (13), a magnet block (17) and a plug-in column (16). The clamping mechanism takes the vertical center line of the rotating shaft (1) as the center of a circle. The fixing plate 1 (5) and the fixing plate 2 (12) are both fixedly mounted on the outer wall of the fixing tube (7), and the fixing plate 1 (5) and the fixing plate 2 (12) form an angle. The fixing tube (7) is fixedly mounted Mounted on one side outer wall of the fixing plate (5), one end of the telescopic rod (10) is movably plugged into the interior of the fixing tube (7), the other end of the telescopic rod (10) is fixedly connected to one side outer wall of the clamping plate (8), the plug-in column (16) is fixedly mounted on one side outer wall of the clamping plate (8), the magnet block (17) is embedded in one side outer wall of the clamping plate (8) and is located on the inner side of the plug-in column (16), and a matching hole (13) is opened inside the fixing plate (12) and is adapted to the plug-in column (16).
2. The electroplating clamping tool for circuit board processing according to claim 1, characterized in that: The telescopic rod (10) is arranged in an arc shape, and a limit block is fixedly installed on one end of the telescopic rod (10) located inside the fixing cylinder (7).
3. The electroplating clamping tool for circuit board processing according to claim 2, characterized in that: The limit block is slidably connected to the inner wall of the fixed cylinder (7); the spring (11) is movably arranged inside the fixed cylinder (7); one end of the spring (11) is clamped with the inner wall of the fixed cylinder (7); and the other end of the spring (11) is clamped with one end of the limit block.
4. The electroplating clamping tool for circuit board processing according to claim 3, characterized in that: The plug-in columns (16) and the plug-in holes are provided in multiple groups, and a handle (9) is provided on an outer wall of one side of the clamping plate (8).
5. The electroplating clamping tool for circuit board processing according to claim 4, characterized in that: A bracket (3) is provided on an outer wall of one side of the second fixing plate (12); the bracket (3) is configured as a groove and is located at two ends of one side of the second fixing plate (12).
6. The electroplating clamping tool for circuit board processing according to claim 1, characterized in that: The two groups of adjacent fixed plates (5) are connected by a baffle (14), and a support plate (15) is fixedly installed on one side outer wall of the fixed plates (5) on both sides, and a gap is formed between the other end of the support plate (15) and the protective plate (6).