Fluid control assembly

Abstract

The invention discloses a fluid control assembly which comprises a control box, a valve component and a flow channel component, the valve component is connected with the flow channel component, part of the valve component is located in the control box, the control box is provided with a containing cavity, a PCB is located in the containing cavity, the control box is provided with a heat conduction piece, the heat conduction piece is connected with the PCB, and the heat conduction piece is connected with the PCB. And part of the heat conduction piece extends out of the control box. According to the invention, a part of the heat conduction part is connected with the PCB, and a part of the heat conduction part extends out of the control box, so that heat generated by the PCB can be transmitted to the outside of the control box through the heat conduction part, and the heat dissipation efficiency of the PCB in the control box is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of fluid control, and in particular to a fluid control component. Background Art

[0002] In the related art, the control box of the fluid control assembly is used to control the valve components to open or close the flow channel. The PCB board and other components in the control box are prone to generate heat, and the heat is difficult to transfer and diffuse out of the control box, causing the PCB board to have a high temperature during use, thereby affecting the performance of the PCB board. Therefore, how to transfer the heat of the PCB board to the outside of the control box is a technical issue that needs to be considered. Summary of the Invention

[0003] The purpose of the present invention is to at least solve the problems in the background technology and to provide a fluid control assembly.

[0004] In order to achieve the above object, the present invention adopts the following technical solutions:

[0005] A fluid control assembly includes a control box, a valve component, and a flow channel component, wherein the valve component is connected to the flow channel component, and part of the valve component is located inside the control box. The control box has a accommodating cavity, and the PCB board is located in the accommodating cavity. The control box is provided with a heat conductor, which is connected to the PCB board, and part of the heat conductor is located outside the control box.

[0006] In the fluid control assembly of the above technical solution, the heat conductor is connected to the PCB board, and part of the heat conductor is located outside the control box, so that the heat generated by the PCB board can be transferred to the outside of the control box through the heat conductor, thereby improving the heat dissipation efficiency of the PCB board located in the control box.

[0007] The features and advantages of the present invention will be disclosed in detail in the following specific embodiments and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The present invention will be further described below with reference to the accompanying drawings and specific embodiments:

[0009] Figure 1 A schematic diagram of the exploded structure of a fluid control assembly according to an embodiment;

[0010] Figure 2 A schematic diagram of the exploded structure of a control box of a fluid control assembly according to one embodiment;

[0011] Figure 3 Schematic diagram of the cross-sectional structure of a control box according to an embodiment;

[0012] Figure 4 for Figure 3 Schematic diagram of the enlarged structure at A in the middle;

[0013] Figure 5 A schematic diagram showing the structural relationship between a PCB board and a heat collecting plate in one embodiment;

[0014] Figure 6 is a schematic cross-sectional structural diagram of a control box according to another embodiment;

[0015] Figure 7 for Figure 6 Schematic diagram of the enlarged structure at B in the middle;

[0016] Figure 8 is a schematic cross-sectional structural diagram of a control box according to another embodiment;

[0017] Figure 9 for Figure 8 Schematic diagram of the enlarged structure at C in the middle;

[0018] Figure 10 A structural schematic diagram showing the installation relationship between the first heat-conducting column and the second heat-conducting column in an embodiment;

[0019] Figure 11 This is a schematic structural diagram of a PCB board in one embodiment;

[0020] Figure 12 A schematic diagram showing a split structure of multiple PCB boards in one embodiment;

[0021] Figure 13 This is a schematic structural diagram of a control box according to an embodiment;

[0022] Figure 14 A schematic structural diagram of a control box according to another embodiment;

[0023] Figure 15 A schematic diagram showing the structure of a stator injection molded part in an embodiment;

[0024] Figure 16 Schematic diagram of the structure of a valve component of an embodiment.

[0025] Reference numerals:

[0026] 1. Control box, 101. Box body, 1011. Opening, 102. Box cover, 1021. Through hole, 103. Accommodating cavity, 104. PCB board, 1041. Main control chip, 1042. Spacing, 1043. Electronic component gathering area, 1044. Empty board area, 1045. Mounting hole, 105. Thermal conductor, 1051. Heat collector, 1052. Thermal column, 1053. First thermal column, 10531. First stud end, 10532. First screw hole end, 1054 , second thermal conductive column, 10541, second stud end, 10542, second screw hole end, 106, stator injection molding part, 1061, stator, 1062, inner ring mouth, 1063, opening, 1064, shell, 107, heat sink, 1071, heat dissipation fin, 1072, heat pipe, 10721, heating section, 10722, condensing section, 108, insulating thermal conductive silicone 108, 2, valve component, 201, rotor, 202, valve core, 203, outlet, 3, flow channel component. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Other embodiments obtained by those skilled in the art without making creative work all fall within the scope of protection of the present invention. In addition, it should be understood that the following words indicating orientation or positional relationship such as "up", "down", "left", "right", "longitudinal", "lateral", "inside", "outside", "vertical", "horizontal", "top", "bottom", etc. are only based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device / element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0028] like Figures 1-16 As shown, a fluid control assembly of this embodiment includes a control box 1, a valve component 2, and a flow channel component 3. The valve component 2 is connected to the flow channel component 3, and part of the valve component 2 is located in the control box 1. The control box 1 includes a box body 101, a box cover 102, and a PCB board 104. The box body 101 has a accommodating cavity 103, the box cover 102 covers the accommodating cavity 103, the PCB board 104 is located in the accommodating cavity 103, the control box 1 has a heat conductor 105, the heat conductor 105 is connected to the PCB board 104, and part of the heat conductor 105 is located outside the control box 1.

[0029] The fluid control assembly can be applied to a heat pipe system, wherein the heat pipe system can be a vehicle heat pipe system, such as a new energy vehicle heat pipe system. The control box 1 can drive the valve component 2 to operate, and the valve component 2 is connected to the flow channel component 3. The flow channel component 3 has a flow channel. Under the control of the control box 1, the valve component 2 can realize the opening and closing of the flow channel. For example, when the control box 1 controls the valve component 2 to realize the connection of the flow channel, the valve component 2 can be directly connected or throttled. It can be understood that the direct connection does not change or tends not to change the pressure of the working fluid before and after flowing through the valve component 2 (such as the pressure loss range is less than 1%), and the throttle connection means that the pressure of the working fluid before flowing through the valve component 2 is greater than the pressure after flowing through the valve component 2.

[0030] In this embodiment, at least a portion of the heat conducting member 105 is connected to the PCB board 104, and part of the heat conducting member 105 extends outside the control box 1, so that the heat generated by the PCB board 104 can be transferred to the outside of the control box 1 by the heat conducting member 105 in a heat transfer manner, thereby improving the heat dissipation efficiency of the PCB board 104 located in the control box 1.

[0031] The flow channel component 3 can adopt a conventional structure in the art, and the protection focus of the present invention is on the heat dissipation structure of the control box 1, so the structure of the flow channel component 3 will not be described in detail. The relevant structure of the fluid control component will be further described in detail below.

[0032] In one embodiment, Figure 2-Figure 5 As shown, the heat conducting member 105 includes a heat collecting sheet 1051 and a heat conducting column 1052. At least a portion of the heat collecting sheet 1051 is in contact with at least a portion of the PCB 104. One end of the heat conducting column 1052 is connected to the heat collecting sheet 1051, and the other end of the heat conducting column 1052 extends out of the control box 1. The purpose of the heat collecting sheet 1051 and the PCB 104 being in contact with each other is to ensure that a certain area of ​​contact exists between the PCB 104 and the heat collecting sheet 1051, thereby achieving a good heat transfer effect. An insulating layer or adhesive layer may also be present between the heat collecting sheet 1051 and the PCB 104. If the insulating layer or adhesive layer is relatively thin, it will have little effect on the heat transfer between the heat collecting sheet 1051 and the PCB 104, and the heat collecting sheet 1051 and the PCB 104 can still be considered to be in contact with each other. Specifically, a portion of the heat collecting sheet 1051 may be in contact with a portion or all of the PCB board 104 , or the entire heat collecting sheet 1051 may be in contact with a portion or all of the PCB board 104 .

[0033] The heat collecting sheet 1051 is bonded to the PCB board 104 to collect most of the heat generated by the PCB board 104. The heat is transferred from the PCB board 104 to the heat collecting sheet 1051, and then transferred to the outside of the control box 1 via the heat conducting pillars 1052, thereby improving the heat dissipation efficiency of the PCB board 104 and effectively dissipating the heat generated by the PCB board 104 to the outside of the control box 1, thereby reducing the adverse effects of heat accumulation within the control box 1 on the PCB board 104 and other internal components of the control box 1. It is understood that in this embodiment, the heat collecting sheet 1051 and the PCB board 104 are bonded together, which should be understood as the heat collecting sheet 1051 and the PCB board 104 being close together, or being closely bonded together without electrical conduction, or being separated by a thin insulating member or glue, etc., which should still be understood as the heat collecting sheet 1051 and the PCB board 104 being bonded together.

[0034] like Figure 5 As shown, the heat collecting sheet 1051 is in the form of a sheet and is arranged facing the PCB board 104. The heat collecting sheet 1051 can be made of metal materials such as copper and aluminum with excellent heat transfer efficiency, so that heat can be effectively transferred from the PCB board 104 to the outside of the control box 1; an insulating thermal conductive silicone rubber 108 is set between the heat collecting sheet 1051 and the PCB board 104, or the heat collecting sheet 1051 is directly attached to the PCB board 104 after applying a layer of insulating thermal conductive layer to prevent leakage. The heat collecting sheet 1051 can also be set to other shapes, such as a block. The heat collecting sheet 1051 has a fitting surface facing the PCB board 104 and fitting with the insulating thermal conductive silicone rubber 108. The fitting surface has a certain coverage area to facilitate collecting most of the heat generated by the PCB board 104. The heat generated by the PCB board 104 enters the heat collecting sheet 1051 through the fitting surface and is transferred to the outside of the control box 1 through the thermal conductive column 1052. The heat collecting sheet 1051 or the insulating heat-conductive silica gel 108 can be fixed to the PCB board 104 by gluing or other methods.

[0035] One end of the heat-conducting column 1052 can be connected to the heat collecting sheet 1051 by fitting, abutting, gluing, or screwing, and the other end of the heat-conducting column 1052 extends out of the control box 1. Figure 3 、 Figure 4 As shown, the PCB board 104 is arranged facing the box cover 102, and the heat collecting sheet 1051 is located on the side of the PCB board 104 facing the box cover 102. The box cover 102 is provided with a through hole 1021 for the heat conducting column 1052 to be screwed and installed. Part of the heat conducting column 1052 passes through the through hole 1021 and fits or abuts against the heat collecting sheet 1051. In another embodiment, as Figure 6 、 Figure 7As shown, the heat collecting sheet 1051 is located on the side of the PCB board 104 facing away from the box cover 102. In this case, the PCB board 104 is also provided with a mounting hole 1045 for the end of the heat conducting column 1052 facing the heat collecting sheet 1051 to pass through. The heat conducting column 1052 sequentially passes through the through hole 1021 and the mounting hole 1045 of the box cover 102 and is aligned with or abuts against the heat collecting sheet 1051. The heat conducting column 1052 can be fixedly provided in the through hole 1021 or the mounting hole 1045. In other embodiments, the PCB board 104 can be provided facing the side wall of the box body 101, and the heat conducting column 1052 can extend out of the side wall of the box body 101. The end of the heat conducting column 1052 facing the heat collecting sheet 1051 can also be provided with a threaded hole to be fastened to the heat collecting sheet 1051 by threading, or glue can be applied between the heat collecting sheet 1051 and the end of the heat conducting column 1052 to form a gluing connection.

[0036] In one embodiment, Figure 7 、 Figure 9 、 Figure 11 As shown, the PCB board 104 has a main control chip 1041, and at least a portion of the heat collecting sheet 1051 is bonded to at least a portion of the main control chip 1041. Insulating thermally conductive silicone rubber 108 is provided between the heat collecting sheet 1051 and the main control chip 1041. It should be noted that the purpose of bonding the heat collecting sheet 1051 to the main control chip 1041 is to ensure a good heat transfer effect between the main control chip 1041 and the heat collecting sheet 1051. In this embodiment, the insulating thermally conductive silicone rubber 108 may be provided between the heat collecting sheet 1051 and the main control chip 1041, which has minimal effect on the heat transfer between the heat collecting sheet 1051 and the main control chip 1041. Therefore, the heat collecting sheet 1051 can still be considered to be bonded to the main chip 1041. Specifically, part or all of the heat collecting sheet 1051 is bonded to part or all of the main chip 1041.

[0037] The main control chip 1041 is responsible for the main calculation or instruction output of the PCB board 104, and generates a lot of heat during operation. At least part of the heat collecting plate 1051 is in contact with at least part of the main control chip 1041 to dissipate heat and cool the main control chip 1041 in a targeted manner.

[0038] In one embodiment, Figure 1 、 Figure 3 、 Figure 6 、 Figure 8 As shown, the control box 1 includes a heat sink 107 , which is disposed outside the box cover 102 or the box body 101 . At least part of the heat conducting member 105 controls the box 1 and is connected to the heat sink 107 .

[0039] Heat from the PCB 104 is transferred to the exterior of the control box 1 via the heat conductor 105 and rapidly dissipated to the outside world via the heat sink 107. Heat sink 107 has high heat dissipation efficiency, rapidly dissipating heat from the heat conductor 105. This improves the efficiency of dissipating heat from the PCB 104 to the outside world while preventing heat from accumulating in the heat conductor 105 and causing it to overheat. Heat sink 107 can be located on either the cover 102 or the sidewall of the box body 101.

[0040] In one embodiment, Figure 13 As shown, the heat sink 107 includes heat dissipation fins 1071, which are fixed to the outside of the box cover 102 by means of threaded connection, adhesive connection, or welding. The heat conducting column 1052 passes through the box cover 102 from the inside of the control box 1 and is connected to the heat dissipation fins 1071. Of course, the heat dissipation fins 1071 can also be fixedly provided on the outside of the cover.

[0041] In other embodiments, Figure 14 As shown, heat sink 107 can also be a heat pipe 1072, which is fixed to the outside of cover 102 by threading, gluing, or welding. Heat-conducting column 1052 extends from the interior of control box 1 through cover 102 and connects to heating section 10721 of heat pipe 1072. Heat pipe 1072 fully utilizes the principles of heat conduction and the rapid heat transfer properties of phase change media to quickly transfer heat from a heating object to the heat source. Its thermal conductivity is superior to that of metal materials. The heat pipe 1072 has a heating section 10721 and a condensing section 10722. The condensing section 10722 deviates from the control box 1. The heating section 10721 absorbs the heat of the heat-conducting column 1052. The medium in the heating section 10721 absorbs the heat and evaporates to form steam, taking away the heat. When the steam flows to the condensing section 10722, it condenses into liquid and releases heat at the same time. Under the action of capillary force, the liquid flows back to the heating section 10721, thereby forming a working cycle of the heat pipe 1072, effectively diffusing the heat transferred from the PCB board 104 through the heat conductor 105 to the outside world; it can be understood that Specifically, the condensing section 10722 deviates from the control box 1, that is, the heating section 10721 of the heat pipe 1072 is closer to the control box 1 than the condensing section 10722. For example, the heating section 10721 is located above the box cover 102, and the condensing section 10722 is located to the side of the box cover 102. The heating section 10721 and the box cover 102 are opposite each other, and the condensing section 10722 and the box cover 102 are staggered. In this way, the heating section 10721 can effectively absorb the heat of the control box 1, and the heat discharged by the condensing section 10722 has less impact on the control box 1, which can effectively cool the control box 1. Of course, the heat pipe 1072 can also be set on the outside of the box body 101; in other embodiments, the heat sink 107 can also be a heat dissipation component such as a refrigerant pipe.

[0042] In one embodiment, the heating section 10721 of the heat pipe 1072 is located in the accommodating cavity 103 of the control box 1 and is connected to the PCB board 104 (not marked in the accompanying drawings), and the condensing section 10722 extends out of the control box 1. In this case, the heat pipe 1072 acts as a heat conductor 105, directly exchanging heat from the PCB board to the outside of the control box 1. The heat pipe 1072 can be connected to the PCB board 104 via insulating thermally conductive silicone. Specifically, insulating thermally conductive silicone can be provided on the surface of the PCB board 104, and the heat pipe 1072 can then be directly in contact with the insulating thermally conductive silicone; or the heat pipe 1072 can be directly in contact with a non-conductive area of ​​the PCB board 104. Furthermore, the heating section 10721 is arranged parallel to the PCB board 104, and the heating section 10721 or the condensing section 10722 of the heat pipe 1072 is fixedly connected to the side wall of the cover body, specifically by welding or threading.

[0043] In one embodiment, Figures 8-10 The heat conducting column 1052 includes a first heat conducting column 1053 and a second heat conducting column 1054 . The first heat conducting column 1053 is connected to the PCB board 104 . One end of the second heat conducting column 1054 is connected to the first heat conducting column 1053 , and the other end of the second heat conducting column 1054 extends out of the control box 1 .

[0044] Specifically, the first heat-conducting column 1053 and the second heat-conducting column 1054 can be integrated or separated. When the first heat-conducting column 1053 and the second heat-conducting column 1054 are integrated, the integrated heat-conducting column 1052 passes through the box cover 102 of the control box 1 and is connected to the PCB board 104. The PCB board 104 is provided with a mounting hole 1045. The heat-conducting column 1052 is inserted into the mounting hole 1045 and extends out of the side of the PCB board 104 away from the box cover 102. The heat-conducting column 1052 and the PCB board 104 can be fixed by screw connection or adhesive connection, etc. The main control chip 1041 is located on the PCB board 104. 04 is on the side of the box cover 102, and the heat collecting sheet 1051 is also located on the side of the PCB board 104 away from the box cover 102. Part of the heat collecting sheet 1051 covers the main control chip 1041, and part of the heat collecting sheet 1051 and the heat conducting column 1052 extending out of the PCB board 104 are connected by being pressed against each other; of course, when the heat collecting sheet 1051 completely covers the main control chip 1041, an additional heat conducting component (such as a long sheet of heat conducting copper, not marked in the figure) is also used to connect the heat collecting sheet 1051 and the heat conducting column 1052.

[0045] When the first thermally conductive column 1053 and the second thermally conductive column 1054 are arranged separately, the first thermally conductive column 1053 is connected to the PCB board 104 through the mounting hole 1045, and part of the first thermally conductive column 1053 is located in the mounting hole 1045. The first thermally conductive column 1053 is fixed to the PCB board by threaded cooperation with the mounting hole 1045. The second thermally conductive column 1054 is connected to the box cover 102 through the through hole 1021. The first thermally conductive column 1053 and the second thermally conductive column 1054 are positioned opposite to each other, so that the first thermally conductive column 1053 can be fitted, plugged, or threadedly connected to the two opposite end surfaces of the second thermally conductive column 1054.

[0046] like Figures 8-10 As shown, further, the first heat-conducting column 1053 and the second heat-conducting column 1054 can both be made of copper columns, and the two can be fixedly connected by threads. On the one hand, it can ensure uninterrupted heat transfer, and on the other hand, it can also fix the PCB board 104 and the box cover 102. Specifically, the first heat-conducting column 1053 includes an integrated first stud end 10531 and a first screw hole end 10532. The first stud end 10531 is located in the mounting hole 1045 of the PCB board 104 and is fixedly connected to the hole wall opposite to the mounting hole 1045 by threads; the second heat-conducting column 1054 includes a second stud end 10541 and a second screw hole end 10542. The through hole 1021 matches the second stud end 10541. The second stud end 10541 passes through the channel and is located at the first screw hole end 10532 and is fixedly connected to it by threads. The diameter of the second screw hole end 10542 is larger than that of the through hole

[0047] 1021, so the second screw hole end 10542 is located on the outside of the box cover 102, and a gasket can be set between the second screw hole end 10542 and the box cover 102 to reduce wear; the heat sink 107 can be fixed to the second screw hole end 10542 by fixing the screw and the second screw hole end 10542, or the second screw hole end 10542 and the heat sink 107 can be fixed by welding or other methods.

[0048] In one embodiment, Figure 11 As shown, PCB 104 has an electronic component cluster area 1043 and a blank area 1044. Mounting holes 1045 are located in blank area 1044, and main control chip 1041 is located in electronic component cluster area 1043. Main control chip 1041 and other electronic components are concentrated in electronic component cluster area 1043, while blank area 1044 has sufficient space for mounting holes 1045 and connection to thermal posts 1052, preventing the connection between PCB 104 and thermal posts 1052 from affecting the electronic components.

[0049] In one embodiment, Figure 2 、 Figure 3 、 Figure 6 、 Figure 8As shown, the fluid control assembly includes multiple PCBs 104 and multiple heat conductors 105. The PCBs 104 correspond to the heat conductors 105 in a one-to-one manner, and the PCBs 104 are integrally arranged. The PCBs 104 can control multiple valve components 2, thereby controlling the opening and closing of multiple flow channels of the flow channel plate. The integrated arrangement of the PCBs 104 facilitates installation, and the PCBs 104 have corresponding heat conductors 105, ensuring efficient heat dissipation from the PCBs 104.

[0050] In one embodiment, the plurality of PCB boards 104 are all located in the accommodating cavity 103. The plurality of PCB boards 104 are integrally arranged and parallel to the box cover 102. Therefore, the distances between the plurality of PCB boards 104 and the box cover 102 are equal, so that the heat transfer of the plurality of PCB boards 103 is uniform, thereby making the heat inside the control box 1 more uniform, reducing the pressure difference caused by uneven heat in the control box 1 and thus affecting the precision of the valve component 2 on and off, and the plurality of heat conducting members 103 can be used alternately without distinguishing the corresponding PCB boards 104.

[0051] It should be noted that multiple PCB boards do not refer to circuit boards with exactly the same electronic components or circuit parts. For example, when the control box 1 controls different valve parts 2, there are differences between the multiple PCB boards. A single PCB board 104 should be understood as a circuit board that can control the on and off of a valve part 2.

[0052] Of course, in one embodiment, the fluid control assembly includes one PCB board 104 and multiple valve components 2, with portions of the multiple valve components 2 located in the control box. In this case, a single PCB board 104 can control the on / off of multiple valve components 2, and related electronic components are integrated into the single PCB board 104, reducing the number of PCB boards in the control box 1 and the complexity of the connecting wires in the control box 1. Of course, in one embodiment, the fluid control assembly may also include one PCB board 104 and one valve component 2, in which case the fluid control assembly is used for single-valve control.

[0053] In other embodiments, Figure 12As shown, multiple PCB boards 104 can also be arranged separately, with a spacing 1042 between adjacent PCB boards 104, and a portion of the heat conducting member 105 located within the spacing 1042. When the main control chip 1041 is located on the side of the PCB board 104 facing away from the box cover 102, a portion of the heat collecting sheet 1051 covers the main control chip 1041, and another portion of the heat collecting sheet 1051 extends to the spacing 1042. The heat collecting sheet 1051 includes a first bend and a second bend. The first bend passes through the spacing 1042 and approaches the box cover 102, while the second bend is aligned with or parallel to the inner surface of the box cover 102. The heat conducting column 1052 passes through the box cover 102 and abuts or aligns with the second bend. In this way, the installation holes 1045 on the PCB board 104 can be eliminated, and electronic components such as the main control chip 1041 can be freely distributed on the PCB board 104.

[0054] In one embodiment, Figure 6 、 Figure 8 、 Figure 12 、 Figure 15 As shown, the fluid control assembly includes a stator injection molded part 106, at least partially located in the accommodating chamber 103. The stator injection molded part 106 includes a stator 1061 and a housing 1064. A PCB board 104 is located between the stator injection molded part 106 and the box cover 102, and a portion of the heat conductive member 105 is located between the PCB board 104 and the box cover 102. The stator injection molded part 106 is electrically connected to the PCB board 104, and the main control chip 1041 is located on the side of the PCB board 104 facing the stator injection molded part 106. This arrangement facilitates the electrical connection between the PCB board 104 and the stator injection molded part 106, and when the two are connected via connecting wires, the connecting wires between the two are avoided from being too cumbersome. The stator injection molded part 106 can be partially located in the accommodating chamber 103, or it can be located entirely in the accommodating chamber 103.

[0055] In one embodiment, Figure 1 、 Figure 15 、 Figure 16As shown, the stator 1061 can be fixed to the housing 1064 by means of gluing or welding, and the housing 1064 of the stator injection molded part 106 can be fixed to the box body 101 by means of gluing, screwing or welding. The housing 1064 of the stator injection molded part 106 is provided with an opening 1063. The bottom end of the box body 101 is provided with an opening 1011 connected to the opening 1063. The inner diameter of the opening 1011 is smaller than the size of the housing 1064 of the stator injection molded part 106. The stator 1061 has an inner ring opening 1062, and the inner ring opening 1062 is connected to the opening 1063. 63 and the opening 1011 are all connected. The valve component 2 includes a rotor 201. A portion of the valve component 2 passes through the opening 1011 and the opening 1063 and is located at the inner ring opening 1062. The PCB board 104 is electrically connected to the stator 1061. The PCB board 104 controls the current change of the stator 1061, thereby controlling the change of the magnetic field generated by the stator 1061, and further controlling the rotational movement of the rotor 201. The rotational movement of the rotor 201 can realize the opening and closing of the valve component 2, and further realize the opening and closing of the flow channel in the flow channel component 3 and the valve component 2. In other embodiments, a portion of the stator injection molded part 106 can also extend out of the opening 1011, so that only a portion of the stator injection molded part 106 is located in the accommodating cavity 103.

[0056] Furthermore, if Figure 16 As shown, the stator injection molded part 106 and the valve component 2 form a structure similar to an electronic expansion valve. The rotation of the rotor 201 drives the valve core 202 to move up and down, thereby opening or closing the inlet or outlet 203 of the valve component 2, thereby achieving the connection and disconnection between the flow channel in the flow channel component 3 and the valve component 2. Of course, those skilled in the art can adopt other valve components 2 that can achieve the connection and disconnection of the flow channel in the flow channel component 3 according to conventional techniques in this field, and this application will not elaborate on them one by one; this application mainly aims to improve the heat dissipation problem of the PCB board of the control board in the fluid control assembly.

[0057] The above are only preferred specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any technical solution, conception, and design obtained by equivalent replacement or modification of the technical solution and inventive concept of the present invention by any technician familiar with this technical field within the technical scope disclosed by the present invention should be covered by the scope of protection of the present invention.

Claims

1. A fluid control assembly, comprising a control box (1), a valve component (2), and a flow channel component (3), wherein the valve component (2) is connected to the flow channel component (3), and part of the valve component (2) is located in the control box (1), characterized in that: The control box (1) comprises a PCB board (104), the control box (1) has a receiving cavity (103), the PCB board (104) is located in the receiving cavity (103), the control box (1) has a heat conducting member (105), the heat conducting member (105) is connected to the PCB board (104), and part of the heat conducting member (105) is located outside the control box (1).

2. The fluid control assembly according to claim 1, characterized in that: The heat-conducting member (105) comprises a heat-collecting sheet (1051) and a heat-conducting column (1052); at least a portion of the heat-collecting sheet (1051) is in contact with at least a portion of the PCB board (104); one end of the heat-conducting column (1052) is connected to the heat-collecting sheet (1051); and the other end of the heat-conducting column (1052) extends out of the control box (1).

3. The fluid control assembly according to claim 2, characterized in that: The PCB board (104) has a main control chip (1041), at least a portion of the heat collection sheet (1051) is bonded to at least a portion of the main control chip (1041), and insulating thermally conductive silica gel (108) is provided between the heat collection sheet (1051) and the main control chip (1041).

4. The fluid control assembly according to claim 1, 2 or 3, characterized in that: The control box (1) comprises a box body (101) and a box cover (102), the control box (1) comprises a heat sink (107), the heat sink (107) is arranged outside the box cover (102) or outside the box body (101), and a portion of the heat conducting element (105) extends out of the control box (1) and is connected to the heat sink (107).

5. The fluid control assembly according to claim 4, characterized in that: The heat dissipation element (107) includes a heat pipe (1072) arranged on the outside of the box cover (102), the heat pipe (1072) includes a heating section (10721) and a condensing section (10722), the condensing section (10722) deviates from the control box (1), and the portion of the heat conductive element (105) extending out of the box cover (102) is connected to the heating section (10721) of the heat pipe (1072); or, the heat dissipation element (107) includes a heat dissipation fin (1071) arranged on the outside of the box cover (102), and the portion of the heat conductive element (105) extending out of the box cover (102) is connected to the heat dissipation fin (1071).

6. The fluid control assembly according to claim 2 or 3, characterized in that: The heat-conducting column (1052) comprises a first heat-conducting column (1053) and a second heat-conducting column (1054); the first heat-conducting column (1053) is connected to the PCB board (104); one end of the second heat-conducting column (1054) is connected to the first heat-conducting column (1053); the other end of the second heat-conducting column (1054) extends out of the control box (1); the first heat-conducting column (1053) comprises an integrated first stud end (10531) and a first screw hole end (10532), the second heat-conducting column (1054) includes a second stud end (10541) and a second screw hole end (10542), the box cover (102) is provided with a through hole (1021) matching the second stud end (10541), the second stud end (10541) passes through the through hole (1021) and is threadedly connected to the first screw hole end (10532), and the first stud end (10531) is fixed to the PCB board (104).

7. The fluid control assembly according to claim 6, characterized in that: The PCB board (104) has an electronic component gathering area (1043) and an empty board area (1044); the PCB board (104) is provided with a mounting hole (1045); the mounting hole (1045) is located in the empty board area (1044); a portion of the first heat-conducting column (1053) is located in the mounting hole (1045); and the first heat-conducting column and the PCB board are fixed.

8. The fluid control assembly according to claim 1 or 2 or 3 or 5 or 7, characterized in that: The fluid control component comprises a plurality of the PCB boards (104) and a plurality of the heat-conducting parts (105), and the plurality of the PCB boards (104) and the plurality of the heat-conducting parts (105) correspond one to one; or, the fluid control component comprises one PCB board (104) and a plurality of valve components (2), and parts of the plurality of valve components (2) are all located in the control box (1); or, the fluid control component comprises one PCB board (104) and one valve component (2).

9. The fluid control assembly according to claim 8, characterized in that: The plurality of PCB boards (104) are all located in the accommodating cavity (103), and the plurality of PCB boards (104) are arranged in an integrated manner and are arranged in parallel with the box cover (102); or, the plurality of PCB boards (104) are arranged separately, and a spacing (1042) exists between two adjacent PCB boards (104), and a portion of the heat conducting member (105) is located in the spacing (1042).

10. The fluid control assembly according to claim 1 or 2 or 3 or 5 or 7 or 9, characterized in that: The fluid control component comprises a stator injection molded part (106), at least a portion of the stator injection molded part (106) is located in the accommodating cavity (103), and the stator injection molded part (106) comprises a stator (1061) and a housing (1064); The stator (1061) has an inner ring opening (1062), the housing (1064) has an opening (1063), the opening (1063) is in communication with the inner ring opening (1062), the valve component (2) comprises a rotor (201), a portion of the rotor (201) is located between the opening (1063) and the inner ring opening (1062); and / or, the control box (1) comprises a box cover (102), the PCB board (104) is located between the stator injection molded part (106) and the box cover (102), a portion of the heat conducting member (105) is located between the PCB board (104) and the box cover (102), the stator injection molded part (106) is electrically connected to the PCB board (104), and the main control chip (1041) is located on a side of the PCB board (104) facing the stator injection molded part (106).

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