Gasification device, water vapor treatment system, and water vapor treatment method

Abstract

The invention provides a gasification device, a water vapor treatment system and a water vapor treatment method which can promote miniaturization of the device and stably supply water vapor. The gasification device is used for generating steam. The gasification device includes: a first cylindrical portion having a central axis extending in a vertical direction; and two second cylindrical parts having a water storage space therein, the two second cylindrical parts symmetrically extending in a direction orthogonal to the central axis, and forming a T-shape between the two second cylindrical parts and the first cylindrical part. In addition, the gasification device comprises a plurality of water vapor release pipes which are connected with the upper end of the first cylindrical part and are used for releasing water vapor from the water storage space; and a heating device which is in contact with the lower parts of the two second cylindrical parts and is used for heating the two second cylindrical parts.

Description

Technical Field

[0001] The invention relates to a gasification device, a water vapor treatment system and a water vapor treatment method. Background Art

[0002] Patent document 1 discloses a water vapor treatment system, which can generate water vapor using a gasifier (gasifier), and supply the generated water vapor to a processing container, so that the water vapor reacts with the chlorine and / or chlorine compounds remaining on the substrate in the processing container to remove the chlorine and / or chlorine compounds. In this water vapor treatment system, in order to improve the efficiency of water vapor treatment of multiple substrates, it is possible to consider setting up multiple processing containers. However, when multiple gasifiers are set corresponding to multiple processing containers, the occupied space and cost will increase.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2023-22938 Summary of the invention

[0006] Technical problem to be solved by the invention

[0007] The present invention provides a technology capable of stably supplying water vapor while promoting miniaturization of an apparatus.

[0008] Means for solving technical problems

[0009] According to one embodiment of the present invention, there is provided a vaporization device for generating water vapor, comprising: a first cylindrical portion having a central axis extending in a vertical direction; two second cylindrical portions having water storage spaces therein, which extend symmetrically in a direction perpendicular to the central axis to form a T-shape between the two second cylindrical portions and the first cylindrical portion; a plurality of water vapor release pipes connected to the upper end of the first cylindrical portion for releasing water vapor from the water storage space; and a heating device in contact with the lower portions of the two second cylindrical portions for heating the two second cylindrical portions.

[0010] Effects of the Invention

[0011] According to one embodiment of the present invention, it is possible to stably supply water vapor while promoting miniaturization of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a block diagram schematically showing the overall configuration of the water vapor treatment system according to the embodiment.

[0013] Figure 2This is a side view schematically showing an installation example of a treatment device main body and a vaporization device in a water vapor treatment system.

[0014] Figure 3 (A) is a side cross-sectional view of the longitudinal cylindrical portion and the cylindrical portion of the main box along the central axis. Figure 3 (B) is Figure 3 (A) is a cross-sectional view along line IIIB-IIIB. Figure 3 (C) is the plan view of the main box.

[0015] Figure 4 (A) is a side view showing a water vapor release pipe according to an embodiment. Figure 4 (B) is a graph showing the relationship between the diameter of the orifice and the flow rate of water vapor.

[0016] Figure 5 : is a flowchart showing the water vapor treatment method according to the embodiment.

[0017] Figure 6 (A) is a cross-sectional view illustrating a water level sensor of a gasification device. Figure 6 (B) is a diagram showing changes in the water temperature and pressure of liquid water accompanying the replenishment of liquid water to the main tank.

[0018] Figure 7 (A) is a diagram showing changes in the flow rate of water vapor and the water temperature in the alternating mode of two processing containers. Figure 7 (B) is a diagram showing changes in the flow rate of water vapor and the water temperature in the synchronization mode of two processing containers.

[0019] Description of Reference Numerals

[0020] 1 water vapor treatment system, 11A first treatment container, 11B second treatment container, 30 vaporization device, 311 longitudinal cylindrical portion, 312, 313 transverse cylindrical portions, 33 heating device, 38 water vapor release pipe, G substrate. DETAILED DESCRIPTION

[0021] Hereinafter, the mode for implementing the present invention will be described with reference to the drawings. In each of the drawings, the same components are sometimes denoted by the same reference numerals, and repeated descriptions are omitted.

[0022] Figure 1 1 is a block diagram schematically showing the overall structure of the water vapor treatment system 1 according to the embodiment. Figure 1As shown, it is set in a substrate processing system 100, which can form a plurality of light-emitting elements and semiconductor devices for driving the light-emitting elements on the surface of a substrate G. For example, the substrate processing system 100 has a substrate processing device 2, which can form electrodes of a plurality of semiconductor devices using a processing gas containing chlorine (Cl). The water vapor treatment system 1 is incorporated into the process after the substrate processing device 2 to perform water vapor treatment to remove residues of the substrate G using water vapor.

[0023] As an example of a substrate G to which water vapor treatment is applied, a glass substrate used in a flat panel display (FPD) such as a liquid crystal display (LCD). In this case, a thin film transistor as a semiconductor device is formed on the surface of the substrate G. In the thin film transistor, an electrode is formed by dry etching a metal film stacked on an insulating layer of the substrate G using a treatment gas containing chlorine (Cl) such as chlorine (Cl2), boron trichloride (BCl3), or carbon tetrachloride (CCl4). Therefore, chlorine remains on the substrate G after the electrode is formed. As a metal film for forming an electrode, for example, a stacked film of Ti / Al / Ti or the like can be used.

[0024] The water vapor treatment system 1 includes a treatment device body 10 for performing water vapor treatment on the substrate G as post-treatment after electrode formation. In the water vapor treatment, the treatment device body 10 exposes the substrate G to water vapor to react chlorine and / or chlorine compounds remaining on the surface of the substrate G with the water vapor to generate hydrogen chloride (HCl). The generated hydrogen chloride is separated from the substrate G. Thus, chlorine and / or chlorine compounds can be removed from the surface of the substrate G, thereby suppressing the generation of substances that cause corrosion, such as aluminum hydroxide, on the substrate G.

[0025] In order to perform the above-mentioned water vapor treatment, the water vapor treatment system 1 includes, in addition to the treatment device body 10, a supply unit 20 for supplying water vapor to the treatment device body 10; and a discharge unit 50 for discharging an exhaust containing water vapor from the treatment device body 10. In addition, the water vapor treatment system 1 has a control unit 70 for controlling the water vapor treatment system 1. The control unit 70 can control the treatment of the water vapor treatment system 1 based on instructions from a control device (not shown) that controls the entire substrate treatment system 100. In addition, the control device of the substrate treatment system 100 may also serve as the control unit 70 of the water vapor treatment system 1.

[0026] The processing device body 10 includes a plurality of substrates G that can be stored therein and subjected to water vapor treatment (in Figure 1Each processing container 11 has, for example, a processing space 11s for performing water vapor treatment on the substrate G, and has an inlet and outlet 12 (see FIG. 1 ) that can carry the substrate G in and out between the outside of each processing container 11 and the processing space 11s. Figure 2 ). The delivery port 12 can be opened and closed by a gate valve not shown. In addition, the processing device body 10 preferably includes a plurality of processing containers 11 to improve the efficiency of water vapor processing, but the number is not particularly limited and may include more than 3. Each processing container 11 is connected to the supply path 20L of the supply unit 20 and the discharge path 50L of the discharge unit 50.

[0027] The supply unit 20 of the water vapor treatment system 1 is an upstream portion of the water vapor treatment system 1 that can generate water vapor from liquid water (H2O: hereinafter referred to as liquid water) and supply the water vapor to the treatment device main body 10 via the supply path 20L. The supply unit 20 includes a factory water supply source 21, a water storage tank 22, and a vaporizer 30 in order from the upstream side to the downstream side of the flow direction of liquid water in the supply path 20L.

[0028] The factory water supply source 21 is a supply source of liquid water in the factory, and various structures that can generate liquid water without impurities or with less impurities can be applied. For example, the factory water supply source 21 is connected to an external supply source that supplies tap water, and has an impurity removal unit (not shown) such as a filter and a pump (not shown) for pressurizing liquid water. The factory water supply source configured in this way can use a pump to stably send liquid water from the upstream side of the supply unit 20 to the downstream side after impurities are removed from the tap water.

[0029] The water storage tank 22 is formed as a bottomed cylindrical body that is long in the vertical direction, has an internal space of a predetermined volume, and can temporarily store the supplied liquid water.

[0030] On the other hand, the vaporizer 30 of the supply unit 20 heats the liquid water supplied from the water storage tank 22 to vaporize it into water vapor and causes the water vapor to flow out to the supply path 20L on the downstream side. The structure of the vaporizer 30 will be described in detail later.

[0031] On the other hand, the discharge unit 50 forms a downstream portion of the water vapor treatment system 1 that can discharge the discharge (water vapor supplied to the treatment space 11s of the treatment container 11 and / or hydrogen chloride as a product of water vapor treatment) of each treatment container 11 of the treatment device body 10 through the discharge path 50L. The discharge unit 50 includes a plurality of dry pumps 51, a heat exchanger 52, a discharge side tank 53, a drainage pump 54, a plant drainage unit 55, and a plant exhaust unit 56 in order from the upstream side to the downstream side of the flow direction of the discharge in the discharge path 50L.

[0032] The plurality of dry pumps 51 are connected to the plurality of processing containers 11 via branched discharge paths 50L, respectively. Each dry pump 51 can give a negative pressure to the processing space 11s of the connected processing container 11 (suction the processing space 11s) under the control of the control unit 70. Thus, each dry pump 51 can make the processing space 11s of the connected processing container 11 a vacuum atmosphere (decompression atmosphere), so that the discharge flows out from the processing device body 10 to the discharge unit 50. In addition, each dry pump 51 can pressure-feed the discharge flowing out of the processing device body 10 to the discharge path 50L on the downstream side of the dry pump 51.

[0033] The heat exchanger 52 is a gas-liquid separation unit that can separate the exhaust into exhaust (gas) and exhaust (liquid) by cooling the exhaust flowing in from the exhaust path 50L. The heat exchanger 52 can apply a known structure. For example, the heat exchanger 52 can be configured to include: a main body, which is arranged around a common exhaust pipe not shown in the figure and can perform heat exchange through a refrigerant; a cooling unit, which can cool the refrigerant; and a circulation path, which has a pump that can circulate the refrigerant between the main body and the cooling unit (both not shown). In addition, the heat exchanger 52 is preferably capable of adjusting the temperature of the exhaust based on the control of the control unit 70. Alternatively, instead of setting the main body around the common exhaust pipe, a circulation path for the exhaust to flow directly can be set in the main body, so that heat exchange can be performed efficiently. In addition, the gas-liquid separation unit is not limited to the heat exchanger 52, and various structures that can separate the exhaust into exhaust and exhaust can also be applied.

[0034] The discharge side tank 53 is arranged at a position lower than the heat exchanger 52 in the vertical direction, and is formed into a vertically long cylindrical body with a bottom. The exhaust gas and the drain liquid separated by the heat exchanger 52 can flow into the discharge side tank 53 through the discharge path 50L. The exhaust gas and the drain liquid are kept separated in the internal space, the drain liquid is accumulated on the bottom side, and the exhaust gas is accumulated on the upper end side. A coating for suppressing corrosion caused by hydrogen chloride is formed on the inner surface of the discharge side tank 53.

[0035] The discharge unit 50 connects the discharge side tank 53 and the factory drain unit 55 by means of a drainage path 61 (a part of the drainage path 50L). The drainage path 61 is connected to the bottom side of the discharge side tank 53, and can allow the liquid stored in the discharge side tank 53 to flow. In addition, a drainage pump 54 is provided in the drainage path 61, which can suck the drainage stored in the drainage side tank 53 and send it to the factory drain unit 55. The control unit 70 can control the operation, stop of operation, and the amount of drainage sent by the drainage pump 54.

[0036] The factory drain 55 is a place or device that can continuously receive the drain discharged from the discharge side tank 53. The factory drain 55 is set inside or outside the factory, for example, and can be a drainage treatment device that can centrally treat the liquid discharged from other equipment in the factory, or a drainage pipe connected to the outside of the factory.

[0037] The exhaust path 62 (a part of the exhaust path 50L) connects the exhaust tank 53 and the factory exhaust part 56. The exhaust path 62 is connected to the upper end of the exhaust tank 53 to allow the gas stored in the exhaust tank 53 to flow.

[0038] The factory exhaust section 56 is a place or device that can continuously receive the gas exhausted from the exhaust tank 53. The factory exhaust section 56 is installed inside or outside the factory, and can be an exhaust treatment device that can centrally treat the gas exhausted from other equipment in the factory.

[0039] Next, refer to Figure 2 The installation state of the processing device main body 10 and the gasification device 30 will be described. Figure 2 1 is a side view schematically showing an example of the installation of the treatment device body 10 and the gasification device 30 in the water vapor treatment system 1. Figure 2 As shown, the gasification device 30 is arranged on the lower side of the processing device body 10 in the vertical direction, and can supply the generated water vapor to the upper processing device body 10. In addition, the gasification device 30 is not limited to being arranged on the lower side of the processing device body 10 in the vertical direction, and can also be arranged on the lower side of the side. In addition, as long as the water vapor can be smoothly supplied, it is not limited to being arranged on the lower side.

[0040] As described above, the processing device body 10 includes two processing containers 11. Figure 2 The upper processing container 11 is also referred to as the first processing container 11A. Figure 2 The lower processing container 11 in FIG. 1 is also referred to as a second processing container 11B. The first processing container 11A and the second processing container 11B have the same shape and structure as each other.

[0041] For example, the first processing container 11A and the second processing container 11B include: a mounting table 13 for mounting the substrate G; and a shower head 14 for releasing water vapor to the entire surface of the substrate G mounted on the mounting table 13. The mounting table 13 includes a plurality of lifting pins (not shown) capable of receiving and delivering the substrate G to a conveying device (not shown) for conveying the substrate G. In addition, the mounting table 13 may also include a temperature adjustment mechanism (not shown) capable of adjusting the temperature of the mounted substrate G to a temperature corresponding to the water vapor treatment.

[0042] The shower head 14 is arranged on the upper side of the mounting table 13 in the vertical direction, and can diffuse the water vapor supplied from the water vapor inlet 15 of each processing container 11 in the horizontal direction, and can evenly release the water vapor to the processing space 11s through a plurality of holes. In addition, in addition to the above-mentioned structure, the processing device body 10 may also include a purge gas supply unit (not shown) and the like, which can supply a purge gas (inert gas) such as nitrogen to the processing space 11s to purge the exhaust of the processing space 11s.

[0043] The water vapor inlet 15 of the first processing container 11A and the water vapor inlet 15 of the second processing container 11B are respectively connected to the supply path 20L of the supply unit 20. Specifically, the first water vapor supply pipe 20L1 is connected to the first processing container 11A. The second water vapor supply pipe 20L2 is connected to the second processing container 11B. The first water vapor supply pipe 20L1 and the second water vapor supply pipe 20L2 are connected to a plurality of (two) water vapor release pipes 38 of the gasification device 30 described later.

[0044] The vaporization device 30 includes: a main tank 31 for supplying water vapor to the two processing containers 11 ; a sub-tank 32 connected to the main tank 31 ; a heating device 33 for heating the main tank 31 ; and a heating driving unit 34 for driving the heating device 33 .

[0045] The main tank 31 is a part that actually generates water vapor from liquid water in the vaporization device 30. The main tank 31 is formed in a T-shape when viewed from the side. Specifically, the main tank 31 has: a longitudinal cylindrical portion 311 extending in the vertical direction; and two (a pair of) transverse cylindrical portions 312 and 313 connected to the lower portion of the longitudinal cylindrical portion 311 and extending in the horizontal direction. The two transverse cylindrical portions 312 and 313 are connected in a manner that the central axes of each other are arranged in a straight line, forming a continuous cylindrical portion 314.

[0046] In addition, the main tank 31 has an internal space 31a which is also in a T-shape in accordance with the T-shaped outer shape. That is, the internal space 31a is continuously connected inside the one vertical cylindrical portion 311 and the two horizontal cylindrical portions 312 and 313.

[0047] Figure 3 (A) is a side cross-sectional view of the longitudinal cylindrical portion 311 and the cylindrical portion 314 of the main case 31 along the central axis. Figure 3 (B) is Figure 3 (A) is a cross-sectional view along line IIIB-IIIB.

[0048] Figure 3 (C) is a plan view of the main box 31. Figure 3 (A)~ Figure 3As shown in (C), the T-shape of the main box 31 can be formed by punching. As a result, the welding parts can be reduced, and a smoothly curved portion 316 (a neat R surface) can be formed between the longitudinal cylindrical portion 311 and the cylinder 314 (the transverse cylindrical portions 312 and 313). The curved portion 316 can reduce the resistance to the movement of water vapor in the transverse cylindrical portions 312 and 313, so that the water vapor can smoothly flow to the longitudinal cylindrical portion 311. In addition, the longitudinal cylindrical portion 311 and the cylinder 314 can also be connected by welding. In addition, the inner surface of the main box 31, including the welding parts, is electrolytically polished to form a passivation state.

[0049] The longitudinal cylindrical portion 311 has a central axis extending in the vertical direction, and constitutes the first cylindrical portion of the main box 31. The longitudinal cylindrical portion 311 is formed as a cylinder having a perfect circular shape when viewed in a cross section perpendicular to the central axis, and has a flow space 311a constituting the internal space 31a on the inside. The axial length (vertical direction) of the longitudinal cylindrical portion 311 is shorter than the axial length of each of the transverse cylindrical portions 312 and 313.

[0050] In addition, although the outer diameter of the longitudinal cylindrical portion 311 also depends on the overall shape and / or volume of the main box 31, it is preferably set to a range of about 200 mm to 400 mm, for example. The outer diameter of the longitudinal cylindrical portion 311 of the embodiment is 318.5 mm. Here, the main box 31 is designed to have a thickness in the range of about 3 mm to 10 mm, and has sufficient rigidity to maintain its shape. In this embodiment, the thickness of the wall of the main box 31 is 4.5 mm. Therefore, the inner diameter of the longitudinal cylindrical portion 311 is set to 309.5 mm.

[0051] The cover 35 having a plurality of ports 36 gathered therein is mounted on the upper end 315 of the vertical cylindrical portion 311, so that the flow space 311a can be closed. The upper end 315 may be formed of a flange extending outward in the horizontal direction, for example.

[0052] On the other hand, the two transverse cylindrical portions 312 and 313 constitute two second cylindrical portions that protrude symmetrically (protrude in opposite directions with the central axis of the longitudinal cylindrical portion 311 as a base point) in a direction (horizontal direction) perpendicular to the central axis of the longitudinal cylindrical portion 311. Each transverse cylindrical portion 312 and 313 is formed as a cylinder having a perfect circular shape when viewed in a cross section perpendicular to the central axis.

[0053] The axial lengths of the transverse cylindrical portions 312 and 313 are set to be the same. The axial lengths of the transverse cylindrical portions 312 and 313 can be formed into appropriate dimensions in consideration of the amount of water vapor supplied, and are preferably set in a range of about 300 mm to 1200 mm, for example. The axial lengths of the transverse cylindrical portions 312 and 313 of the embodiment are 734 mm. Therefore, the overall length of the cylinder 314 obtained by adding the transverse cylindrical portions 312 and 313 is 1468 mm. In addition, the thickness of the end wall of the protruding end of each transverse cylindrical portion 312 and 313 is set to 14 mm. Therefore, the axial length of the internal space 31a of the cylinder 314 is 1440 mm.

[0054] In addition, the outer diameters of the transverse cylindrical portions 312 and 313 of the embodiment are the same as each other, and are set to be the same as the outer diameter of the longitudinal cylindrical portion 311. That is, the outer diameter of each transverse cylindrical portion 312 and 313 of the embodiment is 318.5 mm, and the inner diameter of each transverse cylindrical portion 312 and 313 is 309.5 mm. In addition, the outer diameter and inner diameter of each transverse cylindrical portion 312 and 313 may be different from the outer diameter and inner diameter of the longitudinal cylindrical portion 311.

[0055] By configuring as described above, each of the horizontal cylindrical portions 312 and 313 has a symmetrical structure with the central axis of the vertical cylindrical portion 311 as a base point. As a result, the main tank 31 can be easily provided with the heating device 33, and the convection of water vapor in the internal space 31a can be promoted to improve the gasification efficiency. In addition, the water storage space 314a formed by the two horizontal cylindrical portions 312 and 313 constitutes most of the internal space 31a and has a volume that can sufficiently store liquid water.

[0056] The vaporizer 30 can adjust the water level of the liquid water stored in the water storage space 314a to approximately half of the height direction of the cylinder 314 under the control of the control unit 70. The vertical cross section of the cylinder 314 is circular, so Figure 3 As can be seen from (B), by adjusting the water level to approximately half of the cylinder 314, the evaporation surface of the liquid water coincides with the central axis of the cylinder 314, and the evaporation area of ​​the liquid water is maximized.

[0057] The amount of water vapor generated from the liquid water in the cylinder 314 (evaporation rate) varies according to the evaporation area of ​​the liquid water and the surface velocity of the water vapor flowing on the surface (water surface) of the liquid water. At a position approximately halfway in the height direction of the water storage space 314a, the axial length is 1440 mm, the diameter of the water storage space 314a is 309.5 mm, and the evaporation area of ​​the liquid water is 0.4457 m 2 Thus, the main tank 31 can supply water vapor of 240 slm or more required for water vapor treatment, for example, in a state where the temperature of the liquid water is approximately 84°C.

[0058] On the other hand, the cover 35 mounted on the upper end 315 of the longitudinal cylindrical portion 311 is formed in a disk shape, and a ring-shaped sealing member 351 is provided between the upper end 315 and the cover 35. The cover 35 is airtightly mounted relative to the upper end 315 by the sealing member 351. In addition, the cover 35 is provided with a plurality of (at least one) holes for connecting the internal space 31a of the main box 31 to the outside of the main box 31. Figure 3 (C) has 8) ports 36.

[0059] The plurality of ports 36 have holding holes for preventing the leakage of water vapor and holding the various structures of the gasification device 30. In addition, the plurality of ports 36 are provided with a water injection pipe 37, two water vapor release pipes 38, two water level sensors 39, a temperature sensor 40, and a pressure sensor 41. Figure 3 In (C), seven ports 36 out of eight ports 36 are used, and one port 36 is used as a spare. Each tube and each sensor can be inserted into the internal space 31a through a holding hole provided in the upper end portion 315 .

[0060] The water injection pipe 37 connects the main tank 31 and the auxiliary tank 32 (see Figure 2 ) are connected between the auxiliary tank 32 and the main tank 31, and liquid water can be injected from the auxiliary tank 32 into the main tank 31. In the internal space 31a of the main tank 31, the lower end of the water injection pipe 37 has a gap with the bottom of the cylinder 314 to a degree that does not hinder the injection of liquid water into the internal space 31a, and extends to the vicinity of the bottom of the cylinder 314.

[0061] The two water vapor release pipes 38 constitute a part of the two supply paths 20L, and can supply water vapor from the main tank 31 to the first processing container 11A and the second processing container 11B. Figure 2 In the figure, two water vapor release pipes 38 are shown side by side for easy understanding, but Figure 3 As shown in (C), the two water vapor release pipes 38 are arranged in a direction orthogonal to the central axis of the cylinder 314. That is, each water vapor release pipe 38 is located at the exact center of the axial direction of the cylinder 314 (each transverse cylindrical portion 312, 313). As a result, the two water vapor release pipes 38 can reduce the deviation of the flow rate of water vapor flowing out of the internal space 31a. In addition, each water vapor release pipe 38 is arranged in a manner such that its lower end is at the same distance from the upper end 315 of the main box 31, for example.

[0062] The two water level sensors 39 are used to detect the water level of the liquid water stored in the water storage space 314a. The upper end of each water level sensor 39 protrudes outside the main tank 31 and is connected to the control unit 70 in a manner that can communicate with the control unit 70. Each water level sensor 39 is fixed near the center of the cover 35, and its lower end extends to the bottom of the cylinder 314. For example, it can be at the same level as the lower end of the water injection pipe 37. The structure of each water level sensor 39 and the control performed using the detection result will be described in detail later.

[0063] The temperature sensor 40 is used to detect the temperature (water temperature) of the liquid water stored in the water storage space 314a. The upper end of the temperature sensor 40 protrudes to the outside of the main tank 31 and is connected to the control unit 70 in a manner that can communicate with the control unit 70. On the other hand, the lower end of the temperature sensor 40 extends to the vicinity of the bottom of the cylinder 314. For example, it can be at the same level as the lower end of the water injection pipe 37.

[0064] The pressure sensor 41 is used to detect the pressure (internal pressure) of the internal space 31a of the main box 31. The upper end of the pressure sensor 41 protrudes to the outside of the main box 31 and is connected to the control unit 70 in a manner that can communicate with the control unit 70. On the other hand, the lower end of the pressure sensor 41 extends to a midway position in the flow space 311a of the longitudinal cylindrical portion 311.

[0065] As described above, the main tank 31 can gather these structures at the axial center position of the cylinder 314 by setting each tube and each sensor in a cover 35 and installing them on the upper end of the longitudinal cylindrical portion 311. As a result, the structure of the cylinder 314 of the main tank 31 can be simplified, so that the function of generating water vapor from the stored liquid water can be specialized (reducing the loss of heating, etc.). In addition, the main tank 31 can evenly supply water vapor to each processing container 11 from the upper end of the longitudinal cylindrical portion 311 where the water vapor is gathered, and can stabilize the detection result of the sensor.

[0066] Return to Figure 2 The sub-tank 32 of the gasification device 30 is arranged on the upstream side of the main tank 31, and can temporarily store the liquid water supplied from the external water storage tank 22, and supply it to the main tank 31 through the water injection pipe 37. A supply-side opening and closing valve 42 is provided at a midway position of the water injection pipe 37. The supply-side opening and closing valve 42 can open and close the flow path of the water injection pipe 37 under the control of the control unit 70. The gasification device 30 can supply liquid water from the sub-tank 32 to the main tank 31 by opening the supply-side opening and closing valve 42, and stop supplying liquid water to the sub-tank 32 by closing the supply-side opening and closing valve 42.

[0067] The heating device 33 of the gasification device 30 is installed outside the cylinder 314 of the main tank 31, and can heat the liquid water stored in the cylinder 314. The heating device 33 is formed in a semicircular shape that covers the entire portion of the cylinder 314 below the central axis (see also Figure 3 (B)). Thus, the heating device 33 can efficiently heat the entire liquid water stored in approximately half of the cylinder 314. The structure of the heating device 33 is not particularly limited, and it can be a hard component with a semicircular cross-section, or it can be a soft sheet component. The heating device 33 can also be a structure that covers the protruding ends (ends on the side opposite to the connecting portion) of each transverse cylindrical portion 312, 313. In addition, the heating device 33 can also be a jacket heater that covers the main box 31 and the cover 35 as a whole. The jacket heater can be, for example, a four-part structure that covers the connecting portion between the transverse cylindrical portion 312 and the transverse cylindrical portion 313 and the center portion of the longitudinal cylindrical portion 311, covers the two side portions of the remaining portions of the transverse cylindrical portion 312 and the transverse cylindrical portion 313 respectively, and covers the upper end portion 315 and the top of the cover 35. In addition, a heat insulating material can also be provided at the ends of each of the two side portions. In addition, the structure of the jacket heater is not limited to this.

[0068] The heating drive unit 34 of the vaporizer 30 is connected to a power source (not shown) and to the control unit 70, and can heat the liquid water stored in the main tank 31 to a target temperature by controlling the electric power supplied to the heating device 33 under the control of the control unit 70. For example, the control unit 70 can heat the heating device 33 via the heating drive unit 34 so that the heating device 33 is maintained at a target temperature of 85°C. In addition, the liquid water heated by the heating device 33 has its water temperature reduced by about 1°C from 85°C to about 84°C due to the release of evaporation heat.

[0069] In addition, the vaporizer 30 includes an outflow-side on-off valve 43 and an outflow-side on-off valve 44 at the two water vapor release pipes 38. The outflow-side on-off valve 43 can open and close the water vapor release pipe 38 connected to the first processing container 11A under the control of the control unit 70. The outflow-side on-off valve 44 can open and close the water vapor release pipe 38 connected to the second processing container 11B under the control of the control unit 70. The vaporizer 30 can supply water vapor from the main tank 31 by opening the outflow-side on-off valves 43 and 44, and stop supplying water vapor from the main tank 31 by closing the outflow-side on-off valves 43 and 44.

[0070] Figure 4 (A) is a side view showing the water vapor release pipe 38 according to the embodiment. Figure 4(B) is a diagram showing the relationship between the diameter of the throttle hole 45o and the flow rate of water vapor. Each water vapor release pipe 38 has a gasket 45 for throttling the flow path of water vapor at its midway position. For example, the water vapor release pipe 38 has a first pipe 381 between the main tank 31 and the outflow side opening and closing valve 43 (44), and has a second pipe 382 on the downstream side of the outflow side opening and closing valve 43 (44). The second pipe 382 of each water vapor release pipe 38 extends upward in the vertical direction and is connected to the first water vapor supply pipe 20L1 (second water vapor supply pipe 20L2).

[0071] Moreover, the gasket 45 is provided in the first pipe 381. The gasket 45 is formed in the shape of an annular plate having a throttle hole 45o in a perfect circular shape at the center. By providing the gasket 45 in each water vapor release pipe 38 (first pipe 381), water vapor is supplied to the first processing container 11A and the second processing container 11B through the throttle hole 45o narrower than the diameter of the flow path of each water vapor release pipe 38. That is, the throttle hole 45o acts as a physical structure that limits the flow rate of water vapor. Generally, the pressure of the gas on the upstream side of the throttle hole is not easily affected by the outflow of the gas on the downstream side of the throttle hole. Thus, water vapor can be stably supplied from the gasification device 30 to the processing space 11s.

[0072] like Figure 4 As shown in the figure (B), the diameter of the throttle hole 45o and the flow rate of water vapor passing through the throttle hole 45o are in a nonlinear increasing relationship with each other. In other words, the flow rate of water vapor can be controlled by making the diameter of the throttle hole 45o a size corresponding to the target flow rate of water vapor. For example, it can be cited that when the temperature of water vapor is 85°C and its target flow rate is set to 120slm, the diameter of the throttle hole 45o is set to 5.1mm. The vaporizer 30 can evenly supply water vapor of the target flow rate (120slm) from the main box 31 to the first processing container 11A and the second processing container 11B by providing a gasket 45 with the set throttle hole 45o on the two water vapor release pipes 38. In addition, even when water vapor is supplied from the main box 31, for example, only to the first processing container 11A, the target flow rate of 120slm can be stably maintained by using the throttle hole 45o. At this time, the vaporizer 30 needs to have the ability to supply a total of more than 240sml of water vapor.

[0073] Return to Figure 1The control unit 70 of the water vapor treatment system 1 is a computer having one or more processors 71, a memory 72, an input / output interface and a communication interface (not shown). The one or more processors 71 are one or a combination of a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), an ASIC (Application Specific Integrated Circuit), an FPGA (Field-Programmable Gate Array), a circuit composed of a plurality of discrete semiconductors, etc., and can execute a program stored in the memory 72. The memory 72 includes a main storage device composed of a semiconductor memory, etc., and an auxiliary storage device composed of a disk and / or a semiconductor memory (flash memory), etc.

[0074] The control unit 70 can control the water vapor treatment method of the water vapor treatment system 1 by executing the program stored in the memory 72 through one or more processors 71. For example, the control unit 70 can select a container that can perform water vapor treatment from the first processing container 11A and the second processing container 11B, and send the substrate G held by the conveying device into the processing container 11 (for example, the first processing container 11A) through the delivery port 12. Then, the control unit 70 can use the discharge unit 50 to adjust the processing space 11s of the first processing container 11A to a vacuum atmosphere (reduced pressure atmosphere), and then supply water vapor from the supply unit 20 to perform water vapor treatment on the substrate G in the processing space 11s. After the water vapor treatment, the substrate processing system 100 can use the conveying device to hold the substrate G and send it out of the first processing container 11A, for example, to the outside of the substrate processing system 100 or a new substrate processing device 2.

[0075] The control unit 70 can stably supply water vapor to the first processing container 11A and the second processing container 11B by controlling the state (supply timing, flow rate, temperature) of water vapor generation and supply by the vaporizer 30. In the embodiment, the control unit 70 of the water vapor treatment system 1 controls the vaporizer 30, but the water vapor treatment system 1 may include a dedicated control device (computer, etc.) for the vaporizer 30, and the control device controls the vaporizer 30 by receiving instructions from the control unit 70.

[0076] The water vapor treatment system 1 of the embodiment is basically configured as described above. Figure 5 The operation (steam treatment method) thereof will be described. Figure 5 : is a flowchart showing the water vapor treatment method according to the embodiment.

[0077] The control unit 70 of the water vapor treatment system 1 can control the process flow of steps S101 to S111 in the water vapor treatment method.

[0078] First, as a preliminary preparation for the water vapor treatment method, the control unit 70 opens the supply-side on-off valve 42, injects liquid water from the auxiliary tank 32 into the main tank 31, and accumulates the liquid water to half of the vertical direction of the cylinder 314 (step S101). It is not strictly limited to "half", and there may be an allowable range in which the water level of the liquid water slightly moves up and down from "half". Under the monitoring of the water level sensor 39, the control unit 70 closes the supply-side on-off valve 42 when it is determined that the storage of liquid water in the water storage space 314a is completed.

[0079] Next, the control unit 70 starts heating the main box 31 by driving the heating drive unit 34 using the heating device 33 (step S102). As a result, the temperature in the main box 31 rises to the target temperature (e.g., 85° C.), and water vapor is generated from the evaporation surface of the liquid water. However, before the substrate G is stored in each processing container 11, the control unit 70 closes the outflow side opening and closing valves 43 and 44 to stop the supply of water vapor from the vaporization device 30. In addition, the heating of the main box 31 by the heating device 33 is continued in the subsequent steps, and for example, the heating is stopped by judging the end of the water vapor treatment (step S109 described later).

[0080] When the preliminary preparation is completed, the control unit 70 selects the processing container 11 for water vapor treatment from the first processing container 11A and the second processing container 11B (step S103). Then, the control unit 70 uses the conveying device to convey the substrate G and delivers the substrate G to the selected first processing container 11A (step S104). In addition, in the case where water vapor treatment can be performed in both processing containers 11, the control unit 70 may select another processing container 11 to deliver the substrate G after delivering the substrate G to the first selected processing container 11.

[0081] The control unit 70 starts the water vapor treatment of the substrate G in the processing container 11 by opening the outflow-side opening and closing valves 43 and 44 corresponding to the processing container 11 into which the substrate G is introduced (step S105). In the water vapor treatment, as described above, the water vapor release pipe 38 has the orifice 45o, so that water vapor of a predetermined target flow rate (for example, 120 slm) can be continuously supplied from the main tank 31 to the processing container 11. The processing container 11 can remove chlorine attached to the substrate G by using the water vapor.

[0082] In addition, after executing the water vapor treatment, the control unit 70 determines whether the water vapor treatment is completed (step S106). For example, the control unit 70 measures the implementation time at the beginning and monitors whether the implementation time reaches a preset time threshold. If the implementation time does not reach the time threshold (step S106: No), the water vapor treatment is continued, and if the implementation time reaches the time threshold (step S106: Yes), it is determined that the water vapor treatment is completed.

[0083] The control unit 70 closes the outflow-side on-off valves 43 and 44 of the corresponding water vapor release pipe 38 for the processing container 11 determined to have completed the water vapor treatment (step S107). Furthermore, the control unit 70 uses the conveying device to convey the substrate G out of the processing container 11 that has completed the water vapor treatment (step S108).

[0084] Then, the control unit 70 determines whether there is a new substrate G to be treated with water vapor (step S109). If there is no new substrate G (step S109: No), the current water vapor treatment method is terminated. On the other hand, if there is a new substrate G (step S109: Yes), the process proceeds to step S110 in order to supply water vapor from the vaporization device 30 again.

[0085] In step S110, the control unit 70 determines whether the water level detected by the water level sensor 39 is lower than the water supply requirement position. When the water level is above the water supply requirement position (step S110: No), the control unit 70 directly returns to step S103 and repeats the same processing flow. On the other hand, when the water level detected by the water level sensor 39 is lower than the water supply requirement position (step S110: Yes), the control unit 70 proceeds to step S111. In step S111, the control unit 70 replenishes liquid water from the auxiliary tank 32 to the main tank 31.

[0086] Figure 6 (A) is a cross-sectional view illustrating a water level sensor 39 of the gasification device 30 . Figure 6 (B) is a diagram showing changes in the temperature and pressure of liquid water accompanying the replenishment of liquid water to the main tank 31. Figure 6As shown in (A), the two water level sensors 39 are composed of two sensors, a first water level sensor 391 and a second water level sensor 392, and constitute a floating switch capable of measuring the water level of liquid water in the water storage space 314a at four locations. For example, the first water level sensor 391 is used as an interlocking device and can detect the upper limit position HH and the lower limit position LL in the cylinder 314. On the other hand, the second water level sensor 392 is used to control the water level of the liquid water and can detect the water supply stop position H and the water supply request position L in the cylinder. The water supply stop position H detected by the second water level sensor 392 is set at a position slightly higher than the center position M (the center axis of the cylinder 314) as a reference. In addition, the water supply request position L detected by the second water level sensor 392 is set at a position slightly lower than the center position M (the same distance as the distance between the center position M and the water supply stop position H). The water supply stop position H and the water supply request position L are determined by obtaining the range of water levels that can stably supply water vapor in advance by using preliminary experiments or calculations.

[0087] The control unit 70 performs control using the detection result of the second water level sensor 392 when injecting liquid water into the main tank 31. For example, when the water level is lower than the water supply request position L, the control unit 70 opens the supply side on-off valve 42 after the water vapor treatment of the processing container 11, and replenishes liquid water into the main tank 31. Then, the control unit 70 monitors the second water level sensor 392 when injecting liquid water from the auxiliary tank 32, and when the water level is higher than the water supply stop position H, the control unit 70 closes the supply side on-off valve 42 to stop replenishing liquid water in the main tank 31. Then, the control unit 70 returns to step S103, and repeats the same processing flow.

[0088] like Figure 6 As shown in (B), by controlling the water level of the liquid water based on the water supply stop position H and the water supply request position L of the second water level sensor 392, the amount of liquid water added to the main tank 31 is small relative to the liquid water stored in the main tank 31. Therefore, the decrease in the water temperature of the liquid water in the water storage space 314a caused by the injected liquid water can be suppressed, and the water temperature can be kept roughly constant. In addition, the evaporation area of ​​the liquid water will not change significantly, so the pressure of the internal space 31a of the main tank 31 will not change significantly, and it will slowly decrease when water vapor is generated, so that the flow rate of water vapor can be stabilized. In addition, for example, in the event of an abnormality in the second water level sensor 392, the control unit 70 can use the detection result of the first water level sensor 391 to control the emergency stop of the water vapor treatment, etc.

[0089] As described above, the water vapor treatment method of the embodiment can stably supply water vapor at a target flow rate from the main tank 31 of the vaporization device 30 to the processing container 11. In particular, the main tank 31 can increase the amount of water vapor that can be delivered by generating water vapor in the two horizontal cylindrical parts 312 and 313, and can stably supply water vapor to each of the first processing container 11A and the second processing container 11B. In addition, the water level sensor 39 may be composed of not two sensors, the first water level sensor 391 and the second water level sensor 392, but a single sensor having four measurement positions.

[0090] Next, refer to Figure 7 Control when water vapor is supplied from one main tank 31 to two processing containers 11 (the first processing container 11A and the second processing container 11B) will be described. Figure 7 (A) is a diagram showing changes in the flow rate of water vapor and the water temperature in the alternating mode of the two processing containers 11 . Figure 7 (B) is a diagram showing changes in the flow rate of water vapor and the water temperature in the synchronization mode of the two processing containers 11 .

[0091] For example, the time of the water vapor treatment in the first processing container 11A and the second processing container 11B is set to 124 seconds respectively. In addition, for example, in the first processing container 11A and the second processing container 11B, the time spent on exhausting water vapor and sending in and out the substrate G (the time when the supply of water vapor is stopped) is set to 62 seconds respectively. In this case, in the water vapor treatment method, there are: an alternating mode in which the water vapor treatment is performed in one of the first processing container 11A and the second processing container 11B while the other is stopped; and a synchronous mode in which the water vapor treatment is performed in both the first processing container 11A and the second processing container 11B. In addition, in the treatment method of the embodiment, in the case of the alternating mode, the water vapor treatment in the first processing container 11A and the water vapor treatment in the second processing container 11B are not completely separated in time, and the water vapor treatment in the two processing containers overlaps in a part of the time. However, it is also possible to change the time of the water vapor treatment or the time of stopping the supply of water vapor so that they are completely separated in time.

[0092] exist Figure 6 In the alternating mode shown in (A), the flow rate of water vapor supplied from the main tank 31 repeatedly changes between 120 slm when supplied to either of the two processing containers 11 and 240 slm when supplied to both of the two processing containers 11. For example, the period of supply to either of the two processing containers 11 is 186 seconds, and the period of supply to both of the two processing containers 11 is 62 seconds.

[0093] In the case of the alternating mode, when water vapor is supplied to any one of the two processing containers 11, liquid water is replenished to the main tank 31. When the liquid water is replenished, the water temperature of the main tank 31 decreases, but as described above, the amount of liquid water replenished is small relative to the amount of liquid water stored. Therefore, the decrease in the temperature of the liquid water is also suppressed to within 1°C, and even when water vapor is supplied to the other processing container 11, a flow rate of 120 slm can be stably ensured.

[0094] exist Figure 6 In the synchronization mode shown in (B), the flow rate of water vapor supplied from the main tank 31 repeatedly changes between 240 slm when the water vapor is supplied to both of the two processing containers 11 and 0 slm when the water vapor is stopped from being supplied to both of the two processing containers 11. For example, the period of supplying to both of the two processing containers 11 is 124 seconds, and the period of stopping the supply to both of the two processing containers 11 is 62 seconds.

[0095] In the case of the synchronous mode, liquid water is replenished to the main tank 31 during the period when the supply to both the processing containers 11 is stopped. At this time, the replenishment amount of liquid water is greater than the replenishment amount of liquid water in the alternating mode, so that the water temperature in the synchronous mode is lower than the water temperature in the alternating mode. However, since water vapor is not supplied to both the processing containers 11, the water temperature is easily restored during the period when the supply is stopped. As a result, the flow rate of water vapor can be stably ensured regardless of the alternating mode or the synchronous mode.

[0096] In addition, the water vapor treatment system 1 and the water vapor treatment method of the embodiment are not limited to the above-mentioned embodiment, and various modifications can be adopted. For example, the main tank 31 is not limited to a structure having a cylindrical cylinder 314 (two transverse cylinders 312, 313), and may be a structure having a cylinder 314 formed as a square cylinder. Since each transverse cylinder 312, 313 is a square cylinder, even if the water level of the stored liquid water changes, its evaporation area can be maintained constant.

[0097] The technical ideas and effects of the present invention described in the above embodiments are described below.

[0098] The first embodiment of the present invention is a vaporization device 30 for generating water vapor, which includes: a first cylindrical portion (longitudinal cylindrical portion 311), which has a central axis extending in a vertical direction; two second cylindrical portions (transverse cylindrical portions 312, 313) having water storage spaces inside, which extend symmetrically in a direction orthogonal to the central axis to form a T-shape between the two second cylindrical portions and the first cylindrical portion; a plurality of water vapor release pipes 38, which are connected to the upper end of the first cylindrical portion and are used to release water vapor from the water storage space; and a heating device 33, which is in contact with the lower portions of the two second cylindrical portions and is used to heat the two second cylindrical portions.

[0099] By adopting the above technical solution, the vaporization device 30 can stably supply water vapor from multiple water vapor release pipes 38 while promoting the miniaturization of the device. That is, the first cylindrical portion (vertical cylindrical portion 311) and the two second cylindrical portions (horizontal cylindrical portions 312, 313) form a T-shaped box (main box 31), which can store a large amount of liquid water while fully ensuring the evaporation area of ​​the liquid water. Therefore, the vaporization device 30 can suppress the cost of including multiple tanks separately, and can suppress the extension of the horizontal cylindrical portions 312, 313 other than the direction connected, thereby fully reducing the occupied space of the device.

[0100] In addition, the plurality of water vapor release pipes 38 include valves (outflow-side opening and closing valves 43, 44) for opening and closing the flow paths of the plurality of water vapor release pipes 38, and a throttle hole 45o disposed between the valve and the upper end of the first cylindrical portion (vertical cylindrical portion 311). By using the throttle hole 45o, the vaporization device 30 can easily make the flow rate of the supplied water vapor consistent with the target flow rate and stably supply it.

[0101] In addition, a plurality of water vapor release pipes 38 are arranged in a row at the center of the connection direction of the two second cylindrical parts (lateral cylindrical parts 312, 313) and in a direction orthogonal to the connection direction. Thus, the vaporizer 30 can evenly release the water vapor generated in the two second cylindrical parts.

[0102] In addition, the cross-sectional shape of the first cylindrical portion (longitudinal cylindrical portion 311) and the cross-sectional shape of the two second cylindrical portions (transverse cylindrical portions 312, 313) are circular with the same diameter. Thus, the vaporization device 30 can stably generate water vapor in the two second cylindrical portions and can smoothly guide the water vapor to the first cylindrical portion using the buoyancy of the water vapor.

[0103] In addition, the first cylindrical portion (vertical cylindrical portion 311) and the two second cylindrical portions (horizontal cylindrical portions 312, 313) are connected via the bent portion 316. Thus, the vaporizer 30 can improve the efficiency of extracting water vapor and minimize the welded portions between the first cylindrical portion and the two second cylindrical portions to improve corrosion resistance.

[0104] In addition, a second embodiment of the present invention is a water vapor treatment system 1 capable of treating a substrate G using water vapor, comprising: a vaporizer 30 for generating water vapor; a first treatment container 11A and a second treatment container 11B, each of which can accommodate a substrate G therein and treat the substrate G using water vapor supplied from the vaporizer 30; a first water vapor supply pipe 20L1 connecting the vaporizer 30 to the first treatment container 11A; and a second water vapor supply pipe 20L2 connecting the vaporizer 30 to the second treatment container 11B, wherein the vaporizer 30 comprises: a first cylindrical portion (a longitudinal cylindrical portion); Part 311), which has a central axis extending in the vertical direction; two second cylindrical parts (horizontal cylindrical parts 312, 313) with water storage space inside, which extend symmetrically in a direction orthogonal to the central axis to form a T shape between the two second cylindrical parts and the first cylindrical part; a plurality of water vapor release pipes 38, which are connected to the upper end of the first cylindrical part and are respectively connected to the first water vapor supply pipe 20L1 and the second water vapor supply pipe 20L2, for releasing water vapor from the water storage space; and a heating device 33, which is in contact with the lower parts of the two second cylindrical parts and is used to heat the two second cylindrical parts. In this case, the water vapor treatment system 1 can also stably supply water vapor while promoting the miniaturization of the device.

[0105] In addition, the plurality of water vapor release pipes 38 include: valves (outflow-side opening and closing valves 43, 44) for opening and closing the flow paths of the plurality of water vapor release pipes 38; and a throttle hole 45o arranged between the valve and the upper end of the first cylindrical portion (vertical cylindrical portion 311).

[0106] In addition, the plurality of water vapor release pipes 38 are arranged side by side in a direction perpendicular to the direction in which the two second cylindrical portions (the horizontal cylindrical portions 312 and 313) are connected.

[0107] In addition, the cross-sectional shape of the first cylindrical portion (the vertical cylindrical portion 311 ) and the cross-sectional shapes of the two second cylindrical portions (the horizontal cylindrical portions 312 , 313 ) are circles having the same diameter as each other.

[0108] In addition, the first tubular portion (the vertical tubular portion 311 ) and the two second tubular portions (the horizontal tubular portions 312 , 313 ) are connected via a bent portion 316 .

[0109] The vaporizer 30 is disposed vertically below the first and second processing containers 11A and 11B, and a plurality of water vapor release pipes 38 extend vertically upward and are connected to the first and second water vapor supply pipes 20L1 and 20L2 , respectively.

[0110] In addition, a third embodiment of the present invention is a water vapor treatment method for treating a substrate G using water vapor in a water vapor treatment system 1, wherein the water vapor treatment system 1 includes: a vaporization device 30, which is used to generate water vapor; a first processing container 11A and a second processing container 11B, which can accommodate the substrate G inside and treat the substrate G using water vapor supplied from the vaporization device 30; a first water vapor supply pipe 20L1, which connects the vaporization device 30 with the first processing container 11A; and a second water vapor supply pipe 20L2, which connects the vaporization device 30 with the second processing container 11B, the vaporization device 30 includes: a first cylindrical portion (longitudinal cylindrical portion 311), which has a central axis extending in a vertical direction; two second cylindrical portions (horizontal cylindrical portions 312, 313) having a water storage space inside, which are symmetrical in a direction orthogonal to the central axis. The first and second tubular portions are provided with a plurality of water vapor release pipes 38 connected to the upper end of the first tubular portion and connected to the first and second water vapor supply pipes 20L1 and 20L2, respectively, for releasing water vapor from the water storage space; and a heating device 33 in contact with the lower parts of the two second tubular portions for heating the two second tubular portions, the water vapor treatment method comprising: a step of heating the water stored in the two second tubular portions by the heating device 33 to generate water vapor; and a step of supplying the water vapor generated in the step of generating water vapor to one or both of the first processing container 11A and the second processing container 11B via the plurality of water vapor release pipes 38, the first and second water vapor supply pipes 20L1 and 20L2, and treating the substrate G with water vapor. In this case, the water vapor treatment method can also stably supply water vapor while promoting miniaturization of the device.

[0111] In addition, in the step of treating the substrate G with water vapor, the water vapor supplied to the first processing container 11A and the second processing container 11B is adjusted to the same flow rate by using the throttle holes 45o provided in the plurality of water vapor release pipes 38. Thus, the water vapor treatment method can stably guide the same flow rate of water vapor to the first processing container 11A and the second processing container 11B.

[0112] The gasification device 30, the water vapor treatment system 1, and the water vapor treatment method of the embodiment disclosed herein are illustrative and non-restrictive in all aspects. The embodiment may be modified and improved in various ways without departing from the appended claims and the gist thereof. The matters described in the above-mentioned multiple embodiments may also adopt other configurations within the scope of non-contradiction, and may be combined within the scope of non-contradiction.

[0113] The substrate processing device 2 of the present invention can be applied to any type of device such as atomic layer deposition (ALD) device, capacitively coupled plasma (CCP), inductively coupled plasma (ICP), radial line slot antenna (RLSA), electron cyclotron resonance plasma (ECR), helicon wave plasma (HWP), etc.

Claims

1. A gasification device, which is a gasification device for generating water vapor, characterized in that: include: A first cylindrical portion having a central axis extending in a vertical direction; Two second cylindrical parts having water storage spaces therein, which extend symmetrically in a direction orthogonal to the central axis to form a T-shape between the two second cylindrical parts and the first cylindrical part; a plurality of water vapor release pipes connected to the upper end of the first cylindrical portion and used for releasing water vapor from the water storage space; and A heating device is in contact with the lower parts of the two second cylindrical parts and is used for heating the two second cylindrical parts.

2. The gasification device according to claim 1, characterized in that: The plurality of water vapor release pipes include: a valve for opening and closing the flow paths of the plurality of water vapor release pipes; and An orifice is disposed between the valve and the upper end of the first cylindrical portion.

3. The gasification device according to claim 1 or 2, characterized in that: The plurality of water vapor release tubes are arranged in a row at a center position in a connection direction of the two second cylindrical portions and in a direction orthogonal to the connection direction.

4. The gasification device according to claim 1 or 2, characterized in that: The cross-sectional shape of the first cylindrical portion and the cross-sectional shapes of the two second cylindrical portions are circles having the same diameter as each other.

5. The gasification device according to claim 1 or 2, characterized in that: The first tubular portion and the two second tubular portions are connected via a bent portion.

6. A water vapor treatment system capable of treating a substrate using water vapor, the water vapor treatment system comprising: A gasification device for generating the water vapor; a first processing container and a second processing container, which can accommodate the substrate inside and process the substrate using the water vapor supplied from the vaporization device; a first water vapor supply pipe connecting the vaporization device with the first processing container; and a second water vapor supply pipe connecting the vaporization device with the second processing container, The gasification device comprises: A first cylindrical portion having a central axis extending in a vertical direction; Two second cylindrical parts having water storage spaces therein, which extend symmetrically in a direction orthogonal to the central axis to form a T-shape between the two second cylindrical parts and the first cylindrical part; a plurality of water vapor release pipes connected to the upper end of the first cylindrical portion and respectively connected to the first water vapor supply pipe and the second water vapor supply pipe for releasing water vapor from the water storage space; and A heating device is in contact with the lower parts of the two second cylindrical parts and is used for heating the two second cylindrical parts.

7. The water vapor treatment system according to claim 6, characterized in that: The plurality of water vapor release pipes include: a valve for opening and closing the flow paths of the plurality of water vapor release pipes; and An orifice is disposed between the valve and the upper end of the first cylindrical portion.

8. The water vapor treatment system according to claim 6 or 7, characterized in that: The plurality of water vapor release tubes are arranged in a row at a center position in a connection direction of the two second cylindrical portions and in a direction orthogonal to the connection direction.

9. The water vapor treatment system according to claim 6 or 7, characterized in that: The cross-sectional shape of the first cylindrical portion and the cross-sectional shapes of the two second cylindrical portions are circles having the same diameter as each other.

10. The water vapor treatment system according to claim 6 or 7, characterized in that: The first tubular portion and the two second tubular portions are connected via a bent portion.

11. The water vapor treatment system according to claim 6 or 7, characterized in that: The gasification device is arranged at a lower side of the first processing container and the second processing container in a vertical direction, The plurality of water vapor release pipes extend upward in the vertical direction and are respectively connected to the first water vapor supply pipe and the second water vapor supply pipe.

12. A water vapor treatment method for treating a substrate using water vapor in a water vapor treatment system, wherein: The water vapor treatment system comprises: A gasification device for generating the water vapor; The first processing container and the second processing container are capable of accommodating the substrate therein and processing the substrate using the water vapor supplied from the vaporization device. a first water vapor supply pipe connecting the vaporization device with the first processing container; and a second water vapor supply pipe connecting the vaporization device with the second processing container, The gasification device comprises: A first cylindrical portion having a central axis extending in a vertical direction; Two second cylindrical parts having water storage spaces therein, which extend symmetrically in a direction orthogonal to the central axis to form a T-shape between the two second cylindrical parts and the first cylindrical part; a plurality of water vapor release pipes connected to the upper end of the first cylindrical portion and respectively connected to the first water vapor supply pipe and the second water vapor supply pipe for releasing water vapor from the water storage space; and a heating device, which contacts the lower parts of the two second cylindrical parts and is used to heat the two second cylindrical parts, The water vapor treatment method comprises: a step of heating the water stored in the two second cylindrical parts by using the heating device to generate the water vapor; and The water vapor generated in the step of generating the water vapor is supplied to one or both of the first processing container and the second processing container via the multiple water vapor release pipes, the first water vapor supply pipe and the second water vapor supply pipe, and the substrate is processed using the water vapor.

13. The steam treatment method according to claim 12, characterized in that: In the step of processing the substrate using the water vapor, the water vapor supplied to the first processing container and the second processing container is adjusted to have the same flow rate using throttling holes provided in the plurality of water vapor release pipes.

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