Helmet refrigeration method and refrigeration helmet

Abstract

The helmet refrigeration method is characterized in that a semiconductor refrigeration mode is adopted, and an air supply cavity located in a shell structure and a plurality of air supply openings meeting the requirement for uniform air distribution in the helmet are designed according to the shape of a helmet shell; according to the semiconductor refrigeration mode, external air exchanges heat with a cold air fin arranged on one side of a semiconductor refrigeration sheet, and cooled air is fed into the helmet. Heat is discharged on the other side of the semiconductor chilling plate through radiating fins and a fan, so that the operating temperature of the hot end is ensured; a sensor is arranged in a helmet shell to obtain temperature and humidity data of a point location, the temperature and humidity data are gathered to a controller, and then the programs of controlling the air supply temperature and controlling the refrigeration power of a semiconductor refrigeration sheet are executed. Air supply is uniform, and the temperature of each point in the inner space of the helmet is effectively controlled and adjusted; the device is suitable for various helmets; no condensate water is separated out, so that a human body feels comfortable.

Description

Technical Field

[0001] The invention relates to helmet technology, in particular to a helmet refrigeration method and a refrigeration helmet which utilize the semiconductor refrigeration principle and are combined with the helmet structure. Background Art

[0002] Helmets are widely used as necessary protective equipment for driving motorcycles, electric vehicles, bicycles and other life scenes, as well as necessary protective equipment for working scenes such as factories and construction sites. However, in summer or during high-intensity physical activities, helmets affect the heat dissipation of the human head. The head is the concentrated part of the human body's heat dissipation, and in this case, it will feel hot and stuffy. Therefore, there is a phenomenon that people are unwilling to wear helmets because they are not comfortable enough, which brings safety hazards.

[0003] In order to solve this problem, the designs represented by the cooling helmet with patent publication number CN103120434A and the cooling helmet with patent publication number CN105559229A both use liquid cooling to cool the helmet. The difference between the two lies in the preparation method of the refrigerant. However, there are obvious problems with the use of liquid cooling in helmets, such as the complexity of the process for handling the liquid cooling pipe in the narrow space of the helmet, the risk of leakage in the liquid cooling pipe, and a large amount of condensed water on the surface of the liquid cooling pipe that cannot be discharged.

[0004] Another example is a helmet with a refrigeration function represented by patent publication number CN114190641A and a refrigeration helmet with patent announcement number CN210043266U. Although semiconductor refrigeration and other methods are used to cool the helmet, the application method of semiconductor refrigeration only uses cold end radiation cooling. As a result, the cooling effect cannot be completely evenly distributed, resulting in uneven hot and cold inside the helmet. At the same time, the cold end of the semiconductor refrigeration plate is directly set in the helmet, which also has the problem of condensed water precipitation and inability to discharge.

[0005] In addition, there are usually two ways of cooling, one is radiation heat exchange and the other is convection heat exchange. The cooling method used in the above-mentioned comparative documents is usually radiation heat exchange, but for a small space like a helmet, the temperature difference needs to be strictly controlled considering the problem of condensation water, so a more reasonable cooling method is needed to complete the cooling function in the helmet. Summary of the invention

[0006] The purpose of the present invention is to solve the above-mentioned problems and to provide a helmet cooling method and a cooling helmet, which cools the fresh air through a semiconductor refrigeration device and uniformly delivers the cooled fresh air into the helmet through the unique structure of the helmet, thereby avoiding the occurrence of condensed water precipitation, and effectively combines the helmet with the refrigeration device, with the characteristics of modular assembly, easy installation, and on-demand adjustment.

[0007] The above technical problems of the present invention are mainly solved by the following technical solutions: a helmet cooling method, characterized in that: a semiconductor cooling method is adopted, an air supply cavity located inside the shell structure is designed according to the shape of the helmet shell, and a plurality of air supply vents that meet the requirement of uniform air distribution in the helmet are arranged.

[0008] The semiconductor refrigeration method is to perform heat exchange between the external air and the cold air fins provided on one side of the semiconductor refrigeration plate, and the cooled air is sent into the helmet; on the other side of the semiconductor refrigeration plate, heat is discharged through the heat dissipation fins and the fan to ensure the operating temperature of the hot end.

[0009] By setting sensors in the helmet shell, the temperature and humidity data of the location are obtained, and the controller summarizes them, and then executes the program to control the air supply temperature and the cooling power of the semiconductor refrigeration plate.

[0010] In the aforementioned helmet cooling method, preferably, the cold air obtained after cooling from the semiconductor refrigeration plate is sent into the air supply cavity by changing the wind direction through a vortex fan.

[0011] In the aforementioned helmet cooling method, preferably, at the hot end of the semiconductor refrigeration plate, natural air is introduced through a plurality of locations arranged in different directions of the heat dissipation vents and then discharged through heat exchange with the heat dissipation fins.

[0012] In the aforementioned helmet cooling method, preferably, the temperature and humidity data obtained by the controller includes at least the current temperature and humidity that the user is in direct contact with, the temperature and humidity of the air supply cavity in the helmet, and the temperature and humidity on both sides of the semiconductor refrigeration plate.

[0013] In the aforementioned helmet cooling method, preferably, the positive and negative poles of the power supply of the semiconductor refrigeration plate are switched so that the cold end and hot end working conditions are changed to obtain the cooling-heating function interchangeability.

[0014] A cooling helmet made by the helmet cooling method as described in any one of the above items is characterized in that it includes a full helmet structure shell, the shell forms an air supply cavity through a double-layer structure, and a plurality of air supply outlets are provided on the inner wall of the air supply cavity; a cold and heat source temperature control module is provided at the rear of the shell, the temperature control module includes a semiconductor refrigeration plate, and the temperature control module is connected to the air supply cavity in the shell through an air supply duct.

[0015] In the aforementioned refrigeration helmet, preferably, the temperature control module includes an air supply cabin, a ventilation cabin, a control cabin and a power supply cabin; the semiconductor refrigeration sheet is arranged between the air supply cabin and the ventilation cabin, the semiconductor refrigeration sheet is provided with cold air fins on the side facing the air supply cabin, and the semiconductor refrigeration sheet is provided with heat dissipation fins on the side facing the ventilation cabin.

[0016] In the aforementioned refrigeration helmet, preferably, the temperature control module is provided with a controller, and the controller combines with several sensors to obtain temperature and humidity data to complete temperature control. The sensors include an in-helmet sensor located in the helmet, an air supply sensor located in the air supply cavity, and a cold end sensor and a hot end sensor located on both sides of the semiconductor refrigeration plate.

[0017] In the aforementioned refrigeration helmet, preferably, the temperature control module is an integrated structure, and is connected and cooperated with the shell in a module assembly manner.

[0018] In the aforementioned refrigeration helmet, preferably, a cushion layer and an inner liner pad are sequentially provided on the inner side of the shell, wherein the cushion layer is provided with a first hollow that matches the air supply vent on the shell, and the inner liner pad is provided with a second hollow that matches the air supply vent and the first hollow.

[0019] This technical solution utilizes semiconductor refrigeration to perform air supply processing inside the helmet, sets an air supply cavity according to the special structure of the helmet shell, and arranges air supply vents inside the air supply cavity according to ergonomics, thereby achieving the purpose of uniform air supply inside the helmet.

[0020] In this solution, a vortex fan is installed for the air supply inside the helmet to change the air supply direction. Outdoor air enters the air supply channel through the fresh air outlet, and exchanges heat with the cold air fins inside the semiconductor refrigeration plate. After the air temperature is reduced, it is sent into the air supply cavity by the vortex fan, and then into the helmet, ensuring that the helmet user feels a comfortable and clean airflow.

[0021] On the other side of the semiconductor refrigeration chip, the heat of the heat dissipation fins is taken out by the axial flow fan, thus ensuring that the operating temperature of the hot end meets the use requirements. The hot and cold sides do not interfere with each other, allowing the semiconductor refrigeration chip to achieve the best heat exchange efficiency.

[0022] In order to ensure the cooling effect of the helmet and the effective operation of the semiconductor refrigeration system, this method sets multiple sensors. All sensors have temperature and humidity monitoring and data transmission functions, and all kinds of data input are integrated into the controller. Through the setting of sensors, not only the cooling effect inside the helmet is guaranteed, but also the dew point temperature inside the helmet can be monitored to ensure that no condensed water is precipitated, and the feedback control system adjusts the air supply temperature, the cooling power of the semiconductor refrigeration plate and other parameters. At the same time, the temperature at both ends of the semiconductor refrigeration plate is monitored to prevent damage to the refrigeration plate due to overcooling or overheating.

[0023] This solution is designed mainly for summer working conditions, but it also has the corresponding operating logic for winter working conditions. As long as the positive and negative poles of the semiconductor refrigeration power supply are switched, the cold end can be in a heating condition and the hot end can be in a cooling condition. In combination with the operation of the fan and the sensor, the heating effect inside the helmet can be achieved.

[0024] Compared with the prior art, the beneficial effects of the present invention are: utilizing the semiconductor refrigeration principle to process air supply, and maintaining air supply uniformity through the special structure of the helmet; and effectively controlling and adjusting the temperature of each point in the internal space of the helmet to achieve a good refrigeration effect that meets the requirements of the user; the method can be applied to various types of helmets and has a wide range of adaptability; the helmet thus produced not only has a good refrigeration effect, but also has no condensation water precipitation phenomenon, making the human body feel comfortable. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a refrigeration principle diagram of the present invention.

[0026] Figure 2 It is a structural schematic diagram of a temperature control module of the present invention.

[0027] Figure 3 The present invention is a schematic diagram of the appearance effect structure of a cooling helmet.

[0028] Figure 4 It is a schematic diagram of an overall cross-sectional structure of the present invention.

[0029] Figure 5 yes Figure 4 Schematic diagram of the local enlarged structure at M in the middle.

[0030] Figure 6 It is a schematic diagram of a shell structure of the present invention.

[0031] Figure 7 It is a schematic diagram of the structure of an inner liner liner of the present invention.

[0032] In the figure: 1-shell, 101-air supply cavity, 102-air supply outlet, 2-temperature control module, 201-controller, 202-power supply cabin, 203-axial flow fan, 204-heat dissipation fins, 205-semiconductor refrigeration sheet, 206-cold air fins, 207-vortex fan, 208-hot end sensor, 209-cold end sensor, 210-helmet sensor, 211-air supply sensor, 212-fresh air outlet, 213-air inlet, 214-heat dissipation outlet, 215-air supply cabin, 216-control cabin, 217-ventilation cabin, 3-goggles, 4-breathing hole, 5-buffer layer, 501-first hollow, 6-liner liner, 601-second hollow. DETAILED DESCRIPTION

[0033] The technical solution of the present invention is further specifically described below through embodiments and in conjunction with the accompanying drawings.

[0034] This embodiment is a helmet cooling method, which uses semiconductor cooling, and designs an air supply cavity 101 located inside the shell structure according to the structural shape of the helmet shell 1, and a plurality of air supply vents 102 that can evenly distribute air in the helmet. Note: The names with reference numbers can refer to the drawings in the specification.

[0035] The semiconductor cooling method is to exchange heat between the outside air and the cold air fins 206 arranged on one side (inside) of the semiconductor cooling plate 205, and the cooled air is sent into the helmet. On the other side (outside) of the semiconductor cooling plate 205, the heat is discharged through the heat dissipation fins 204 and the fan to ensure the normal operating temperature of the hot end.

[0036] The method obtains the temperature and humidity data of the point by setting a sensor in the helmet shell 1, and collects the data to the controller 2, and then executes the procedures of controlling the air supply temperature and controlling the cooling power of the semiconductor refrigeration plate. The temperature and humidity data obtained by the controller 2 at least include the current temperature and humidity directly contacted by the user, the temperature and humidity of the air supply cavity in the helmet, and the temperature and humidity on both sides of the semiconductor refrigeration plate 205.

[0037] In order to satisfy and ensure uniform air supply in the limited space of the helmet shell 1 , the cold air obtained after cooling from the semiconductor refrigeration plate 205 is sent into the air supply cavity 101 by changing the wind direction through the vortex fan 207 .

[0038] In order to ensure that the semiconductor refrigeration plate 205 can fully exert the heat exchange effect, at the hot end of the semiconductor refrigeration plate 205, multiple natural air intakes arranged in different directions of the heat dissipation air outlet 214 are used to exchange heat with the heat dissipation fins 204 and then discharged.

[0039] This method can change the working conditions of the cold end and the hot end by switching the positive and negative poles of the power supply of the semiconductor refrigeration plate 205, thereby achieving the interchangeability of the cooling and heating functions.

[0040] A cooling helmet made by the above method has an appearance as follows Figure 3 As shown, it includes a helmet shell 1 with a full helmet structure. The shell 1 is made of materials such as carbon fiber or glass fiber. Goggles 3 are provided at the front end of the helmet. Breathing holes 4 are provided at the nose mask portion below the goggles 3. A temperature control module 2 is provided at the rear of the helmet, which is the cold and heat source for cooling and heating the helmet in this embodiment.

[0041] See also Figures 4 to 7The shell 1 forms an air supply cavity 101 through a double-layer structure, and a plurality of air supply vents 102 are arranged on the inner wall of the air supply cavity 101; a cushion layer 5 and an inner liner pad 6 are installed in the shell 1, wherein the cushion layer 5 is made of materials such as EPS, which can be squeezed and deformed when the helmet is impacted, absorb impact force, and reduce the impact on the head, and EPS materials are lightweight materials and easy to process. In order to meet the air supply requirements, a first hollow 501 structure is arranged in combination with the air supply vents 102 on the inner side of the air supply cavity 101, corresponding to the air supply vents 102; the inner liner pad 6 is mainly considered for wearing comfort, and velvet and other materials can be used. The inner liner pad 6 also has a second hollow 601 setting, and the second hollow 601 is adapted to the air supply vents 102 and the first hollow 501, but the range of the second hollow 601 can be more flexible, and the main principle is not to block the air supply. In this way, the helmet shell 1 is combined with the hollowing out of the buffer layer 5 and the hollowing out of the inner liner 6 to ensure the uniformity of air supply of the overall structure.

[0042] The schematic diagram and structure diagram of temperature control module 2 are as follows: Figure 1 , Figure 2 As shown, the entire temperature control module 2 is an integrated structure, and in actual application, it is connected and assembled with the shell 1 in a modular assembly manner, wherein the air supply is connected by the air supply duct and the air supply cavity 101 in the shell 1. Of course, the temperature control module 2 can also be set by partially combining with the helmet shell.

[0043] The temperature control module 2 includes a mutually separated air supply cabin 215, a ventilation cabin 217, a control cabin 216 and a power supply cabin 202. The heat exchange main body semiconductor cooling sheet 205 of the temperature control module 2 is arranged between the air supply cabin 215 and the ventilation cabin 217. The partition material between the air supply cabin 215 and the ventilation cabin 217 adopts a heat insulation material to strengthen the isolation and prevent the loss of heat exchange. The number of semiconductor cooling sheets 205 can be set according to actual needs, for example, 1 sheet, 2 sheets, etc.

[0044] The semiconductor cooling sheet 205 is provided with a cold air fin 206 on the side facing the air supply cabin 215, and the semiconductor cooling sheet 205 is provided with a heat dissipation fin 204 on the side facing the ventilation cabin 217. The cold air fin 206 is parallel to the air flow direction and is arranged vertically. Outdoor air enters from the fresh air vent 212, and is fully heat exchanged through the cold air fin 206. The air that has completed the heat exchange is sent into the air supply cavity 101 of the helmet through the vortex fan 207 through the air duct, thereby completing the preparation and transportation of the air supply.

[0045] The device is combined with the shape of the air supply cabin 215, and a control cabin 216 is arranged inside the air supply cabin 215. The control cabin 216 is provided with a controller 201, etc. The controller 201 is combined with sensors arranged in multiple places to realize the temperature control function of the refrigeration helmet. The sensors include an in-helmet sensor 210 located in the helmet, an air supply sensor 211 located in the air supply cavity 101, and a cold end sensor 209 and a hot end sensor 208 located on both sides of the semiconductor cooling plate 205.

[0046] A control cabin cover is provided inside the control cabin 216 to facilitate maintenance when the controller 206 fails.

[0047] Furthermore, the direction of the heat dissipation fins 204 of the semiconductor refrigeration plate 205 can be flexibly arranged, because there can be multiple directions for outdoor air to enter the ventilation cabin 217, such as entering from the bottom air inlet 213, or entering from all around the side heat dissipation vents 214, and after heat exchange at the heat dissipation fins 204, it is blown out of the heat dissipation vents 214 through the axial flow fan 203 to complete the heat dissipation of the hot end of the semiconductor refrigeration plate 205.

[0048] A power source is provided in the power source compartment 202. The power source may be a rechargeable lithium battery or the like. Alternatively, the battery may be concealed as a whole, with a charging interface reserved on the outside, so that the helmet can be continuously supplied with power by an external power source when used for a long time. A cover is provided on the outside of the power source compartment 202 to facilitate battery replacement. When the battery is concealed as a whole with a charging interface reserved, the cover may not be provided.

[0049] Furthermore, the helmet in this embodiment can be a half helmet, a 3 / 4 helmet, an off-road helmet, etc., and its technical solutions can be inspired by the design principles of this embodiment.

[0050] The above embodiments are for explanation of the present invention, not for limitation of the present invention, and the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

Claims

1. A helmet cooling method, characterized in that: A semiconductor refrigeration method is adopted, and an air supply cavity (101) located inside the shell structure and a plurality of air supply vents (102) that meet the requirement of uniform air distribution in the helmet are designed according to the shape of the helmet shell (1); The semiconductor refrigeration method is to perform heat exchange between the external air and the cold air fins (206) provided on one side of the semiconductor refrigeration plate (205), and the cooled air is sent into the helmet; on the other side of the semiconductor refrigeration plate, the heat is discharged through the heat dissipation fins (204) and the fan to ensure the operating temperature of the hot end; By arranging a sensor in the helmet shell, the temperature and humidity data of the location are obtained and summarized by the controller (2), and then the program of controlling the air supply temperature and the cooling power of the semiconductor refrigeration plate is executed.

2. A helmet cooling method according to claim 1, characterized in that: The cold air obtained after cooling down the semiconductor refrigeration plate (205) is sent into the air supply cavity (101) after the wind direction is changed by the vortex fan (207).

3. A helmet cooling method according to claim 1 or 2, characterized in that The hot end of the semiconductor cooling plate (205) is discharged after heat is exchanged with the heat dissipation fins (204) through a plurality of natural air intakes arranged in different directions of the heat dissipation air outlet (214).

4. A helmet cooling method according to claim 1, characterized in that: The temperature and humidity data obtained by the controller (2) at least include the current temperature and humidity that the user is in direct contact with, the temperature and humidity of the air supply cavity in the helmet, and the temperature and humidity on both sides of the semiconductor cooling plate.

5. A helmet cooling method according to claim 1, characterized in that: By switching the positive and negative poles of the power supply of the semiconductor refrigeration plate (205), the cold end and hot end working conditions are changed, thereby achieving the exchange of cooling and heating functions.

6. A refrigerated helmet made by the helmet refrigeration method according to any one of claims 1 to 5, characterized in that The invention comprises a full-face helmet structure shell (1), wherein the shell forms an air supply cavity (101) through a double-layer structure, and a plurality of air supply vents (102) are arranged on the inner wall of the air supply cavity; a cold and hot source temperature control module (2) is arranged at the rear of the shell, wherein the temperature control module comprises a semiconductor cooling plate (205), and the temperature control module is connected to the air supply cavity in the shell through an air supply duct.

7. A cooling helmet according to claim 6, characterized in that: The temperature control module (2) comprises an air supply cabin (215), a ventilation cabin (217), a control cabin (216) and a power supply cabin (202); a semiconductor refrigeration sheet (205) is arranged between the air supply cabin and the ventilation cabin, a cooling air fin (206) is arranged on the side of the semiconductor refrigeration sheet facing the air supply cabin, and a heat dissipation fin (204) is arranged on the side of the semiconductor refrigeration sheet facing the ventilation cabin.

8. A cooling helmet according to claim 6 or 7, characterized in that: The temperature control module (2) is provided with a controller (201), which combines with a plurality of sensors to obtain temperature and humidity data to complete temperature control, wherein the sensors include an in-helmet sensor (210) located in the helmet, an air supply sensor (211) located in the air supply cavity (101), and a cold end sensor (209) and a hot end sensor (208) located on both sides of the semiconductor cooling plate (205).

9. A cooling helmet according to claim 6 or 7, characterized in that: The temperature control module (2) is an integrated structure and is connected and matched with the housing (1) in a module assembly manner.

10. A cooling helmet according to claim 6, characterized in that: The inner side of the shell (1) is provided with a cushion layer (5) and an inner liner pad (6) in sequence, wherein the cushion layer is provided with a first hollow (501) matching with an air supply vent (102) on the shell, and the inner liner pad is provided with a second hollow (601) matching with the air supply vent and the first hollow.

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