This invention relates to a liquid
tension control method for improving
wafer drying efficiency, comprising: First, placing a
wafer cassette connected to a oscillating mechanism into a
drying tank, loading wafers into the cassette, and ensuring the
drying tank and its dome are sealed together, with a small amount of gas evacuated; Second, injecting room-temperature
nitrogen gas through the dome and injecting
ultrapure water into the drying tank to wet the
wafer surface; Third, after the wafer surface is wetted, performing the following operations: S1: Injecting a mixture of isopropanol and heated
nitrogen gas into the drying tank using a dedicated integrated module, while simultaneously discharging
ultrapure water at a controlled rate from the bottom of the drying tank; S2: During the
ultrapure water discharge, operating the oscillating mechanism to carry the wafer in a planetary oscillation, accelerating the removal of water molecules from the wafer; Fourth, repeating the wafer drying process. This invention utilizes planetary arc-shaped oscillation drying technology to accelerate the removal of
residual moisture from the wafer surface, achieving rapid wafer drying through effective control of liquid tension.