Processing box

Abstract

The invention discloses a processing box which is detachably mounted on imaging equipment, and is characterized in that the processing box comprises a box body which is provided with a chip accommodating part, and the chip accommodating part is provided with a first positioning part, a second positioning part and a clamping part; the chip rack is detachably mounted in the chip accommodating part, and the chip rack is provided with a first positioned part and a second positioned part; the chip is mounted on the chip rack; when the chip rack is installed on the chip accommodating part, the first positioning part is matched with the first positioned part, the second positioning part is matched with the second positioned part, the chip rack is positioned on the chip accommodating part, and the clamping part is clamped with the chip rack to fix the chip rack on the chip accommodating part. According to the processing box disclosed by the invention, the positioning part is arranged on the chip accommodating part, so that the chip rack is correctly positioned relative to the position of the box body, and compared with the mode that the chip rack is welded on the processing box, the flexibility is higher, and harmful electronic chip garbage generated by an old processing box which is used up can be avoided.

Description

Technical Field

[0001] The invention relates to the field of imaging equipment, in particular to a processing box. Background Art

[0002] Laser printers are currently widely used, wherein the process box is a main component of the laser printer. In the existing process box, a chip is installed, which has the function of enabling the printer to identify the model and service life of the process box, and is generally installed on the chip mounting part of the process box.

[0003] In the prior art, the chip is affixed to the chip rack by gluing, and then the chip rack is fixed to the housing of the processing box by welding. Since the processing box in the prior art is given to the end user together with the imaging device when the imaging device is first sold, the end user needs to purchase a new processing box to replace it when the life of the processing box ends. However, at this time, the chip in the processing box that has reached the end of its life will not become invalid due to the end of the life of the processing box, and it can still be replaced in a new processing box to continue working. On the other hand, the chip is a component that communicates information between the processing box and the imaging device. Without the chip, the processing box will not be recognized by the imaging device. Therefore, in order to protect the environment and reduce the production cost of the processing box, and at the same time to reduce the user's use cost, the chip on the old processing box needs to be removed and installed on the new processing box for reuse.

[0004] Therefore, a technical solution to the above problems is needed. Summary of the invention

[0005] In order to solve the technical problems existing in the prior art, an object of the present invention is to provide a processing box to solve the above-mentioned technical problems.

[0006] In order to achieve the purpose, the present invention adopts the following technical solutions:

[0007] The present invention provides a process cartridge which is detachably mounted on an imaging device, and the process cartridge comprises:

[0008] A box body, on which a chip accommodating portion is provided, and the chip accommodating portion is provided with a first positioning portion, a second positioning portion and a clamping portion;

[0009] a chip rack detachably mounted on the chip accommodating portion, the chip rack being provided with a first positioned portion and a second positioned portion; and

[0010] A chip, mounted on the chip rack;

[0011] When the chip rack is installed on the chip accommodating part, the first positioning part cooperates with the first positioned part, and the second positioning part cooperates with the second positioned part to position the chip rack on the chip accommodating part, and the clamping part clamps with the chip rack to fix the chip rack on the chip accommodating part.

[0012] The present invention provides another processing box, which is detachably mounted on an imaging device, and the processing box comprises:

[0013] A box body, on which a chip accommodating portion is provided, and the chip accommodating portion is provided with a first positioning portion and a second positioning portion;

[0014] a chip rack detachably mounted on the chip accommodating portion, wherein the chip rack is provided with a first positioned portion and a second positioned portion; and

[0015] A chip, mounted on the chip rack;

[0016] When the chip rack is installed on the chip accommodating portion, the first positioning portion cooperates with the first positioned portion to position the chip rack on the chip accommodating portion, and the second positioning portion and the second positioned portion are interference fit to fix the chip rack on the chip accommodating portion.

[0017] In some embodiments, the first positioning portion is a positioning hole provided on the chip accommodating portion, and the first positioned portion is a positioning column on the chip frame adapted to the positioning hole.

[0018] In some embodiments, the second positioning portion is a positioning protrusion provided on the chip accommodating portion, and the second positioned portion is a positioning groove on the chip frame that matches the positioning protrusion.

[0019] In some embodiments, the first positioning portion is located at one end of the chip receiving portion, and the second positioning portion is disposed near the other end of the chip receiving portion opposite to the first positioning portion.

[0020] In some embodiments, there are multiple positioning protrusions. When the chip rack is installed in the chip accommodating portion, the multiple positioning protrusions are all embedded in the positioning grooves and are interference-fitted with the positioning grooves.

[0021] In some embodiments, the second positioning portion is a positioning protrusion provided on the chip accommodating portion, and the second positioned portion is a positioning notch on the chip frame that is matched with the positioning protrusion.

[0022] In some embodiments, the first positioning portion is located at one end of the chip receiving portion, and the second positioning portion is disposed close to the end of the chip receiving portion where the first positioning portion is located.

[0023] In some embodiments, the number of the positioning protrusions is multiple, and the number of the positioning notches matches the number of the positioning protrusions.

[0024] In some embodiments, the chip rack is further provided with a notch portion, and the engaging portion is a snap-fit ​​structure. When the chip rack is installed in the chip accommodating portion, the snap-fit ​​structure is snapped onto the notch portion to fix the chip rack.

[0025] In some embodiments, a snap-fit ​​surface is provided on the notch portion, and a snap-fit ​​structure is provided with a snap hook, and the snap hook snaps into engagement with the snap-fit ​​surface to fix the chip frame on the chip accommodating portion.

[0026] In some embodiments, the engaging portion is rotatably disposed on the chip accommodating portion, and the engaging portion moves around a rotation axis between a position engaged with the chip frame and a position disengaged from the chip frame.

[0027] In some embodiments, an elastic member is further included, wherein the elastic member abuts against the chip accommodating portion and the clamping portion, and the force of the elastic member can cause the clamping portion to be located at a position to clamp the chip frame.

[0028] In some embodiments, the engaging portion is provided with a mounting post, and the chip accommodating portion is provided with a slot. When the engaging portion rotates, the mounting post can be inserted into the slot, so that the engaging portion is in a position to engage the chip frame.

[0029] In some embodiments, the buckle structure is fixedly disposed on the chip accommodating portion, and the buckle structure is an elastic buckle, and the buckle structure can clamp the chip frame under its own elastic action.

[0030] The present invention provides a processing box with a movably mounted chip, which can normally mount a chip removed from an old processing box that has run out of life. The processing box provides a positioning portion and a clamping portion on a chip accommodating portion so that the chip is correctly positioned relative to the box body and can stably contact an imaging device. Compared with the prior art of welding a chip rack to the processing box, the structure of a detachably mounted chip rack has higher flexibility and can avoid the generation of harmful electronic chip waste by old processing boxes that have run out of life. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0032] Figure 1It is a three-dimensional diagram of a processing box in the prior art;

[0033] Figure 2 for Figure 1 A schematic diagram of the enlarged structure of the A position in the middle;

[0034] Figure 3 A three-dimensional diagram of using a disassembly tool to disassemble a chip rack and a chip on a processing box in the prior art;

[0035] Figure 4 for Figure 3 A schematic diagram of the enlarged structure of position B in the middle;

[0036] Figure 5 is a three-dimensional diagram of a process cartridge in Embodiment 1 of the present invention;

[0037] Figure 6 for Figure 5 Schematic diagram of the enlarged structure of the C position in the middle;

[0038] Figure 7 Schematic diagram of the exploded structure of the process box in the first embodiment of the present invention;

[0039] Figure 8 It is a partial structural schematic diagram of the chip rack and chip position installed on the processing box in the first embodiment of the present invention;

[0040] Fig. 9 It is a three-dimensional diagram of the buckle structure in the first embodiment of the present invention;

[0041] Fig.10 The chip in the first embodiment of the present invention is mounted on the chip frame in a three-dimensional Figure 1 ;

[0042] Fig.11 The chip in the first embodiment of the present invention is mounted on the chip frame in a three-dimensional Figure 2 ;

[0043] Fig.12 The chip in the first embodiment of the present invention is mounted on the chip frame in a three-dimensional Figure 3 ;

[0044] Fig.13 Schematic diagram of a local structure of a clamping portion installed on a chip receiving portion in some other embodiments of the present invention Figure 1 ;

[0045] Fig.14 Schematic diagram of a local structure of a clamping portion installed on a chip receiving portion in some other embodiments Figure 2 ;

[0046] Fig.15 is a three-dimensional diagram of a process cartridge in Embodiment 2 of the present invention;

[0047] Fig.16 for Fig.15 A schematic diagram of the enlarged structure of the D position in the middle;

[0048] Fig.17 It is a partial structural schematic diagram of the position of the chip accommodating portion on the processing box in the second embodiment of the present invention;

[0049] Fig.18 is a three-dimensional diagram of a process cartridge in Embodiment 3 of the present invention;

[0050] Fig.19 for Fig.18 A schematic diagram of the enlarged structure of the E position in the middle;

[0051] Fig. 20 A schematic diagram of the local structure of the chip accommodating portion of the processing box in the third embodiment of the present invention

[0052] Fig.21 It is a partial structural schematic diagram of the chip rack and chip position installed on the processing box in the fourth embodiment of the present invention;

[0053] Fig. 22 It is a partial structural schematic diagram of the position of the chip accommodating portion on the processing box in the fourth embodiment of the present invention. DETAILED DESCRIPTION

[0054] The present invention is further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0055] It should be noted that the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0056] In the present invention, unless otherwise clearly specified and limited, the terms "installation", "connection", "fixation" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0057] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0058] In the above description, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0059] like Figures 1 to 4 As shown, the processing box is generally used to be installed in an imaging device (such as a printer), and the processing box stores a developer for development, such as toner. When the imaging device prints, the developer in the processing box will be displayed on a recording medium (such as paper, or other printing media that can carry the developer).

[0060] refer to Figure 1The processing box includes a box body 100, the box body 100 includes a developing box 110 and a drum box 120, the developing box 110 includes a developing frame 111 that can accommodate developer and support a developing roller, and the drum box 120 includes a drum frame 121 that can accommodate waste developer remaining after development and support a photosensitive drum, the developing frame 111 and the drum frame 121 are arranged side by side, the developing frame 111 is set on one side of the drum frame 121, and the developing frame 111 and the drum frame 121 are connected to each other. The box body 100 is roughly in the shape of a rectangular box, which has a length in the first direction (directions A1 and A2), a width in the second direction (directions B1 and B2), and a height in the third direction (directions C1 and C2); the developing box 110 and the drum box 120 are arranged opposite to each other in the second direction, the direction from the developing box 110 to the drum box 120 is the B1 direction, one end of the processing box along the C1 direction is the upper end, and one end along the C2 direction is the lower end, the photosensitive drum 220 is arranged at the upper end of the drum unit 200, and the developing roller is arranged at the upper end of the developing unit 100. One end of the processing box along the B1 direction is the front end, one end along the B2 direction is the rear end, one end of the processing box along the A1 direction is the driving end, and one end along the A2 direction is the non-driving end.

[0061] A chip 200 storing the processing box information and a chip rack 300 for installing the chip 200 are arranged on the drum frame 121. The chip rack 300 is installed on the drum frame 121. The chip 200 is installed on the chip rack 300 by welding or gluing. The chip 200 can be used to record information such as the amount of toner in the processing box and the number of times the processing box is used. When the processing box is installed in the imaging device, the chip 200 can be electrically connected to the imaging device to transmit the information on the chip 200 to the imaging device. In order to avoid waste of resources, after the developer on the processing box is exhausted, the chip 200 on the processing box can be removed and installed on a new processing box for reuse.

[0062] refer to Figure 2 , Figure 3 and Figure 4 The chip rack 300 is fixed to the box body 100 of the processing box by welding technology, and there is a certain distance between the lower left side of the chip rack 300 and the box body 100, forming a certain space a. The disassembly tool 400 is used to reach the space a between the chip rack 300 and the box body 100, and the chip rack 300 and the disassembly tool 400 are used as the supporting point. The chip rack 300 is disassembled from the box body 100 of the processing box by using the lever principle.

[0063] The present invention only improves the structure of the chip rack 300 detachably mounted on the box body 100. The other structures of the process box are prior art and will not be described here.

[0064] Embodiment 1:

[0065] like Figures 5 to 14 As shown, a processing box provided in this embodiment includes a box body 100 , a chip rack 300 mounted on the box body 100 , and a chip 200 mounted on the chip rack 300 .

[0066] like Figure 5 As shown, the box body 100 is provided with a chip accommodating portion 130, which is located at one end of the box body 100 in the A1 direction, and in the third direction, the chip accommodating portion 130 is arranged close to one end of the box body 100 in the C2 direction. The chip accommodating portion 130 is preferably arranged on the drum frame 121, and the chip accommodating portion 130 can be arranged on the drum frame in an integral manner.

[0067] like Figures 5 to 8 As shown, the chip receiving portion 130 and the chip rack 300 have mutually adapted shapes, and when the chip rack 300 is installed on the chip receiving portion 130, the chip 200 carried on the chip rack 300 can be oriented toward the end away from the drum frame 121 (i.e., toward the A1 direction), so that the chip 200 can abut and be electrically connected with the imaging device. The chip receiving portion 130 is provided with a first positioning portion 131, a second positioning portion 132 and a clamping portion 133. In the second direction, the first positioning portion 131 is located at the B1 end of the chip receiving portion 130, the clamping portion 133 is located at the B2 end of the chip receiving portion 130, and the second positioning portion 132 is arranged close to the clamping portion 133.

[0068] like Fig.10 As shown, the chip frame 300 is provided with a chip mounting portion 330, a first positioned portion 310, a second positioned portion 320 and a notch portion 360. The chip mounting portion 330 is protrudingly arranged on the side of the chip frame 300 in the A1 direction. The chip mounting portion 330 is arranged close to the B2 side of the chip frame 300 in the second direction, and the side of the chip mounting portion 330 in the B2 direction is flush with the side of the chip frame 300 in the B2 direction; in the third direction, the chip mounting portion 330 is located at a substantially central position of the chip frame 300. The chip mounting portion 330 is recessed on the surface in the A1 direction to provide a chip mounting groove for mounting the chip 200. The chip 200 can be fixed in the chip mounting groove by bonding, clamping, welding, etc., so that the chip 200 is mounted on the chip frame 300. The chip mounting portion 330 is also provided with an electrical contact guide rib 340, which is respectively connected to both sides of the chip mounting portion 330 in the third direction and extends along the third direction. The electrical contact guide rib 340 can guide the guided part set in the imaging device when the processing box is installed in the imaging device, so as to guide the electrical contacts set in the imaging device to make electrical contact with the chip 200.

[0069] refer to Figures 8 to 12The first positioned portion 310 is arranged on the B1 side of the chip frame 300, and the second positioned portion 320 is arranged close to the B2 side of the chip frame 300, and the first positioned portion 310 cooperates with the first positioning portion 131, and the second positioned portion 320 is adapted to the second positioning portion 132, so as to position the chip 200 on the chip accommodating portion 130.

[0070] refer to Figure 8 , the first positioning portion 131 is a positioning hole provided on the chip receiving portion 130, and the second positioning portion 132 is a first positioning protrusion provided on the chip receiving portion 130. Preferably, the positioning hole is a circular hole provided on the chip receiving portion 130, which penetrates the drum frame 121 along the first direction (A1 and A2 directions); the first positioning protrusion is a substantially rectangular block provided on the chip receiving portion 130, which protrudes from the surface of the chip receiving portion 130 along the direction away from the box body 100 (A1 direction). Optionally, the positioning hole and the first positioning protrusion may also be other geometric shapes, which are not limited in the present application.

[0071] refer to Figures 10 to 12 The first positioned portion 310 and the second positioned portion 320 are arranged on the same side (side in the A2 direction) of the chip frame 300. The first positioned portion 310 is a positioning column arranged on the chip frame 300. The positioning column is arranged on the surface of the chip frame 300 facing the box body 100 (the surface along the A2 direction) and protrudes along the A2 direction. The positioning column is a cylindrical positioning column arranged on the chip frame 300, and its diameter is slightly smaller than the diameter of the positioning hole (first positioning portion 131). The second positioned portion 320 is a positioning groove arranged on the chip frame 300. The positioning groove is a groove concavely arranged on the surface of the chip frame 300 facing the box body 100. Its shape is slightly larger than the size of the first positioning protrusion. When the chip 200 is installed on the chip frame 300, the positioning groove and the chip 200 are located on the two opposite sides of the chip frame 300, that is, in the first direction, the chip 200 faces away from the box body 100, and the positioning groove faces the box body 100. When the chip rack 300 is installed on the chip receiving portion 130, the positioning column on the chip rack 300 is inserted into the positioning hole, and the positioning groove is sleeved on the first positioning protrusion, so as to accurately position the chip rack 300 on the chip receiving portion 130 on the processing box.

[0072] like Figure 6 , Figures 8 to 12As shown, after the chip rack 300 is positioned in the chip accommodating portion 130, the notch portion 360 needs to be matched with the engaging portion 133 on the chip accommodating portion 130 to fix the chip rack 300 in the chip accommodating portion 130. Specifically, the notch portion 360 is a side notch provided on the side of the chip rack 300 in the B2 direction. The notch portion 360 is formed by being recessed in the B1 direction. The notch portion 360 is a substantially rectangular groove. A transverse protrusion 361 is provided in the notch portion 360. The transverse protrusion 361 extends in the third direction and extends from the C1 side of the notch portion 360 in the C2 direction to the approximately middle position of the notch portion 360. The transverse protrusion 361 is located on the A2 side of the notch portion 360 in the first direction. The side of the transverse protrusion 361 in the A1 direction is an engaging surface 363 for engaging. There is a certain distance between the engaging surface 363 and the side of the notch portion in the A1 direction.

[0073] like Figure 6 , Figure 8 , Fig. 9 As shown, the snap-fitting portion 133 is a snap-fitting structure disposed on the chip accommodating portion 130 , and the snap-fitting structure is partially inserted into the notch portion 360 and engages with the snap-fitting surface 133 of the transverse protrusion 361 , thereby fixing the chip frame 300 on the chip accommodating portion 130 . Specifically, the engaging portion 133 (snapping structure) is rotatably arranged on the chip accommodating portion 130, and pivot holes 1333 are provided on both the chip accommodating portion 130 and the engaging portion 133. After the pivot holes of the two are aligned, the engaging portion 133 is installed on one side of the chip accommodating portion 130 (the side in the B2 direction) by the rotating shaft 134 passing through the pivot hole 1333 in sequence and can be rotated along the rotating shaft 134. The rotating shaft 134 extends along the third direction (that is, the rotation axis of the engaging portion 133 is along the C1 and C2 directions). The pivot hole of the engaging portion 133 is opened at one end thereof (the end in the A2 direction), and a hook 1331 is provided at the other end (the end in the A1 direction) of the engaging portion 133. The hook 1331 is used to engage with the lateral protrusion 361 in the notch portion 360, and the engaging portion 133 can rotate around the rotating axis in the engaged and disengaged positions of the hook 1331. Optionally, the rotating shaft may be fixedly disposed on one of the engaging portion 133 and the chip accommodating portion 130 , and a corresponding pivot hole may be disposed on the other one, so that the rotational cooperation between the two can also be achieved.

[0074] Furthermore, a mounting post 1332 is provided on one end (the end in the A2 direction) of the engaging portion 133. When the engaging portion 133 is installed in the chip accommodating portion 130, an elastic member (not shown) is provided between the chip accommodating portion 130 and the engaging portion 133. One end of the elastic member (such as a spring) can be sleeved on the mounting post 1332 of the engaging portion 133, and the other end abuts against the chip accommodating portion 130, so that the elastic member can exert an elastic force on the engaging portion 133. When in use, the engaging portion 133 (snapping structure) is pried open to overcome the elastic force and rotate on the chip accommodating portion 130 to a position where the hook 1331 is disengaged. When the engaging portion 133 is not pried open, the engaging portion 13 is located at a position where the hook 1331 can clamp the chip frame 300 under the elastic force of the elastic member (engaged with the lateral protrusion 361 in the notch portion 360).

[0075] During the process of installing the chip rack 300 to the chip accommodating portion 130, the engaging portion 133 is first bend to overcome the elastic force and rotate, and then the chip rack 300 is accurately positioned on the chip accommodating portion 130 on the processing box by cooperating the positioning column on the chip rack 300 with the positioning hole on the chip accommodating portion 130 and the positioning protrusion with the positioning groove on the chip rack 300. Then, the snap structure is released, so that the engaging portion 133 is engaged with the engaging surface 363 of the transverse protrusion 361 in the upper notch portion 360 on the side of the chip rack 300 under the action of elastic force, and the chip rack 300 is fixed on the chip accommodating portion 130, so that the chip 200 removed from the old processing box can be installed on the new processing box.

[0076] In some other embodiments, the snap-fitting portion 133 is a fixed snap-fit, that is, it cannot rotate relative to the chip accommodating portion 130. The snap-fitting portion 133 may be an elastic snap-fit, which may clamp the lateral protrusion 361 under its own elastic action, so that the chip frame 300 may also be smoothly installed and fixed. Preferably, the snap-fitting structure may be an integrally formed structure with the chip accommodating portion 130.

[0077] refer to Fig.13 and Fig.14 In some other embodiments, a pivot hole 1333 is provided at one end of the snap-fit ​​portion 133. The pivot hole 1333 is preferably a bar-shaped hole. The rotating shaft 134 passes through the bar-shaped hole and is installed on the chip receiving portion 130, so that the snap-fit ​​portion 133 can have a certain space to move in the radial direction (the direction intersecting the axis of rotation) while rotating. The chip receiving portion 130 is also provided with a slot 135. When the snap-fit ​​structure is installed in the chip receiving portion 130, the mounting column 1332 can be inserted into the slot 135. When in use, the mounting column 1332 is moved diagonally ( Fig.13The engaging portion 133 is moved along the P direction, the P direction intersecting the first direction and the second direction, so that the engaging portion 133 rotates and moves on the chip accommodating portion 130, and the mounting post 1332 on the engaging portion 133 moves in the direction of disengaging from the slot 135, so that the hook 1331 is disengaged from the transverse protrusion 361 in the notch 360 of the chip frame 300; and when the engaging portion 133 is not moved, the mounting post 1332 is clamped in the slot 135, so that the engaging portion 133 is in the position of the hook 1331 (along the Fig.13 The chip rack 300 is clamped in the N direction, where the N direction is parallel to the first direction.

[0078] In some other embodiments, in order to further fix the chip rack 300 on the chip rack 300 accommodating portion, the snap-fitting portion 133 may also be a backing adhesive provided on the chip rack 300 or the chip rack 300 accommodating portion, so that the chip rack 300 and the chip accommodating portion 130 are fixed by adhesion with the backing adhesive instead of being fixed by a snap-fit ​​structure.

[0079] In this embodiment, when the processing box chip frame 300 and the chip 200 are recycled and used again:

[0080] First, on the recycled processing box, the engaging portion 133 is moved to disengage the hook 1331 of the engaging portion 133 from the transverse protrusion 361 of the notch 360 on the chip frame 300 , and then the chip frame 300 and the chip 200 are pulled out in a direction away from the box body 100 .

[0081] Afterwards, the chip rack 300 is positioned on the chip accommodating portion 130 of the new processing box by cooperating with the first positioning portion 131 and the first positioned portion 310, and the second positioning portion 132 and the second positioned portion 320, and then the engaging portion 133 on the chip accommodating portion 130 of the new processing box is rotated so that the hook 1331 of the engaging portion 133 enters the notch portion 360 of the chip rack 300 and engages with the engaging surface 363 of the lateral protrusion 361, so that the chip rack 300 is fixed on the chip accommodating portion 130 and can be reused.

[0082] The solution of this embodiment is provided with a first positioned portion 310 and a second positioned portion 320 on the chip rack 300. The chip rack 300 is positioned on the chip accommodating portion 130 by the cooperation of the first positioning portion 131 and the first positioned portion 310, and the cooperation of the second positioning portion 132 and the second positioned portion 320. The chip rack 300 can be fixed on the chip accommodating portion 130 by the locking portion 133, so that the chip rack 300 can be detachably installed on the box body 100, which is convenient for disassembly of the chip rack 300 and the chip 200 on the processing box. The structure is simple and the operation is convenient, which solves the problem of difficulty in operation during installation or disassembly of the chip 200 on the processing box in the prior art and greatly improves the reusability of the chip 200.

[0083] Embodiment 2:

[0084] like Fig.12 , 15 to Fig.17 As shown, another processing box is provided in this embodiment, which is different from the first embodiment in that the second positioned portion on the chip rack 300 is a positioning notch 350 set on the chip rack 300, and the chip accommodating portion 130 is provided with a second positioning portion 132a, and the second positioning portion 132a is a second positioning protrusion, and the positioning notch 350 cooperates with the second positioning protrusion to position the chip rack 300 into the chip accommodating portion 130.

[0085] Specifically, the positioning notch 350 is arranged near the first positioned portion 310 in the second direction. The positioning notch 350 is a square through hole arranged on the chip rack 300, which penetrates the chip rack 300 in the length direction (first direction) of the box body 100, and two positioning notches 350 are arranged on the chip rack 300, and the two positioning notches 350 are arranged at intervals along the third direction. Correspondingly, two second positioning portions 132a (second positioning protrusions) on the chip receiving portion 130 are also arranged, and the two second positioning protrusions are arranged at intervals along the third direction, and the size of the second positioning protrusion is slightly smaller than the size of the positioning notch 350 (square through hole). When the chip rack 300 is installed in the chip receiving portion 130, the positioning notch 350 can be sleeved on the second positioning protrusion, so that the chip rack 300 is positioned on the chip receiving portion 130. Optionally, the positioning notch 350 and the second positioning protrusion can also be other geometric shapes, which are not limited by the present application.

[0086] In this embodiment, when the process box is used:

[0087] First, on the recycled processing box, the engaging portion 133 is moved to disengage from the transverse protrusion 361 , and then the chip frame 300 and the chip 200 are pulled out in a direction away from the box body 100 .

[0088] Afterwards, the chip rack 300 is positioned on the chip accommodating portion 130 of the new processing box by cooperating with the first positioning portion 131 and the first positioned portion 310, and the second positioning portion 132a and the second positioned portion (positioning notch 350), and then the chip accommodating portion 130 of the new processing box is engaged with the notch 360 of the chip rack 300, so that the chip rack 300 is fixed on the chip accommodating portion 130 and can be reused.

[0089] In this embodiment, the box body 100 and the chip 200 are consistent with those in the first embodiment and will not be described again here.

[0090] Embodiment three:

[0091] like Fig.12 , 18 to Fig. 20As shown, another processing box is provided in this embodiment. The difference between this embodiment and embodiment 1 is that: in this embodiment, the locking portion 133 is not provided on the chip accommodating portion 130. When the chip rack 300 is installed in the chip accommodating portion 130, the chip rack 300 is positioned on the chip accommodating portion 130 by the cooperation of the first positioning portion 131 and the second positioning portion 132, and the chip rack 300 is fixed on the chip accommodating portion 130 by the interference fit between the second positioning portion 132 and the second positioned portion 320.

[0092] The structures of the first positioning portion 131 and the first positioned portion 310 are the same as those in the first embodiment, and are not described again.

[0093] like Figure 8 As shown, the second positioning portion 132 is a first positioning protrusion provided on the chip receiving portion 130. The first positioning protrusion is a substantially rectangular protrusion provided on the chip receiving portion 130, which protrudes from the chip receiving portion 130 away from the box body 100 along the length direction (direction A1) of the drum frame 121.

[0094] like Fig.12 As shown, the second positioned portion 320 is a positioning groove provided on the chip frame 300. The positioning groove is a groove provided on the chip frame 300, and its size is equal to or slightly smaller than the size of the first positioning protrusion. When the chip 200 is mounted on the chip frame 300, the positioning groove corresponds to the position of the first positioning protrusion, and the positioning groove can be interference-fitted with the positioning protrusion to fix the chip frame 300 on the chip accommodating portion 130.

[0095] Optional, such as Fig. 20 As shown, the second positioning portion 132b is a third positioning protrusion arranged on the chip accommodating portion 130, and the number of the third positioning protrusions is two. The two third positioning protrusions are arranged at intervals in the third direction, and the third positioning protrusion is a roughly rectangular protrusion. The combined size of the outer contours of the two third positioning protrusions is adapted to the size of the positioning groove on the chip rack 300. When the chip rack 300 is installed on the chip accommodating portion 130, the two positioning protrusions are both embedded in the positioning groove (the second positioned portion 320) and are interference fit with the positioning groove.

[0096] Furthermore, a ridge may be provided in the first positioned portion 310 of the chip rack 300, the size of the ridge being adapted to the interval between the two third positioning protrusions. When the chip rack 300 is installed on the chip accommodating portion 130, the ridge is inserted between the two third positioning protrusions and has an interference fit with the third positioning protrusions, thereby better fixing the chip rack 300.

[0097] Optionally, the number of the third positioning protrusions can be more, such as three, four, etc., as long as the size of the outer contour combination of the plurality of third positioning protrusions matches the size of the positioning groove. The plurality of third positioning protrusions can also be arranged along the second direction, and can be arranged in an array in various ways, as long as they can match the size of the positioning groove.

[0098] In this embodiment, when the process box is used:

[0099] First, on the recycled processing box, use a tool to lift out the chip frame 300 and the chip 200 in a direction away from the box body 100;

[0100] Afterwards, the chip rack 300 is fixed to the chip accommodating portion 130 of the new processing box by fitting the first positioning portion 131 and the first positioned portion 310, and the second positioning portion 132b and the second positioned portion 320 are interference fit, so that the chip rack 300 is fixed on the chip accommodating portion 130 and can be reused.

[0101] In this embodiment, the box body 100 and the chip 200 are consistent with those in the first embodiment and will not be described again here.

[0102] Embodiment 4:

[0103] like Fig.21 , Fig. 22 As shown, another processing box is provided in this embodiment, and the difference between this embodiment and the third embodiment is that the second positioned portion on the chip frame 300 is a positioning notch 350 as in the second embodiment, and the second positioning portion 132a is a second positioning protrusion as in the second embodiment. When the chip frame 300 is installed in the chip receiving portion 130, the positioning notch 350 on the chip frame 300 and the second positioning protrusion are interference-fitted, so that the chip frame 300 is positioned and fixed in the chip receiving portion 130.

[0104] In this embodiment, when the process box is used:

[0105] First, on the recycled processing box, use a tool to lift out the chip frame 300 and the chip 200 in a direction away from the box body 100;

[0106] Afterwards, the chip rack 300 is positioned to the chip accommodating portion 130 of the new processing box through the first positioning portion 131 and the first positioned portion 310, and the second positioning portion 132a and the second positioned portion (positioning notch 350) are fixed to the chip accommodating portion 130 of the new processing box by interference fit, so that the chip rack 300 is fixed to the chip accommodating portion 130 and can be reused.

[0107] In this embodiment, the box body 100 and the chip 200 are consistent with those in the first embodiment and will not be described again here.

[0108] In some other implementations, the chip receiving portion 130 may also be disposed on the developing frame 111 .

[0109] The present invention provides a processing box with a movably mounted chip, which can normally mount a chip removed from an old processing box that has run out of life. The processing box provides a positioning portion on a chip accommodating portion so that the chip is correctly positioned relative to the box body and can stably contact an imaging device. Compared with the prior art of welding a chip rack to the processing box, the structure of a detachably mounted chip rack has higher flexibility and can avoid the generation of harmful electronic chip waste by an old processing box that has run out of life.

[0110] The above are only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the creative concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A process cartridge, detachably mounted on an imaging device, characterized in that: The processing box comprises: A box body, on which a chip accommodating portion is provided, and the chip accommodating portion is provided with a first positioning portion, a second positioning portion and a clamping portion; a chip rack detachably mounted on the chip accommodating portion, the chip rack being provided with a first positioned portion and a second positioned portion; and A chip, mounted on the chip rack; When the chip rack is installed on the chip accommodating part, the first positioning part cooperates with the first positioned part, and the second positioning part cooperates with the second positioned part to position the chip rack on the chip accommodating part, and the clamping part clamps with the chip rack to fix the chip rack on the chip accommodating part.

2. A process cartridge, detachably mounted on an imaging device, characterized in that: The processing box comprises: A box body, on which a chip accommodating portion is provided, and the chip accommodating portion is provided with a first positioning portion and a second positioning portion; a chip rack detachably mounted on the chip accommodating portion, wherein the chip rack is provided with a first positioned portion and a second positioned portion; and A chip, mounted on the chip rack; When the chip rack is installed on the chip accommodating portion, the first positioning portion cooperates with the first positioned portion to position the chip rack on the chip accommodating portion, and the second positioning portion and the second positioned portion are interference fit to fix the chip rack on the chip accommodating portion.

3. The process cartridge according to claim 1 or 2, wherein: The first positioning portion is a positioning hole provided on the chip accommodating portion, and the first positioned portion is a positioning column on the chip frame adapted to the positioning hole.

4. The process cartridge according to claim 3, wherein: The second positioning portion is a positioning protrusion provided on the chip accommodating portion, and the second positioned portion is a positioning groove on the chip frame that matches the positioning protrusion.

5. The process cartridge according to claim 4, wherein: The first positioning portion is located at one end of the chip accommodating portion, and the second positioning portion is disposed close to the other end of the chip accommodating portion opposite to the first positioning portion.

6. The process cartridge according to claim 4, wherein: There are multiple positioning protrusions. When the chip rack is installed in the chip accommodating portion, the multiple positioning protrusions are all embedded in the positioning grooves and are interference-fitted with the positioning grooves.

7. The process cartridge according to claim 3, wherein: The second positioning portion is a positioning protrusion provided on the chip accommodating portion, and the second positioned portion is a positioning notch on the chip frame that is matched with the positioning protrusion.

8. The process cartridge according to claim 7, wherein: The first positioning portion is located at one end of the chip accommodating portion, and the second positioning portion is disposed close to the end of the chip accommodating portion where the first positioning portion is located.

9. The process cartridge according to claim 7, wherein: The number of the positioning protrusions is multiple, and the number of the positioning notches matches the number of the positioning protrusions.

10. The process cartridge according to any one of claims 1, 4 to 9, characterized in that: The chip rack is also provided with a notch portion, and the engaging portion is a buckle structure. When the chip rack is installed in the chip accommodating portion, the buckle structure is engaged with the notch portion to fix the chip rack.

11. The process cartridge according to claim 10, wherein: The notch portion is provided with a snap-fit ​​surface, the snap-fit ​​structure is provided with a snap hook, and the snap hook is snap-fitted with the snap-fit ​​surface to fix the chip frame on the chip accommodating portion.

12. The process cartridge according to claim 10, wherein: The engaging portion is rotatably arranged on the chip accommodating portion, and the engaging portion moves around a rotation axis between a position engaged with the chip frame and a position disengaged from the engagement.

13. The process cartridge according to claim 12, wherein: It also includes an elastic member, which is in contact with the chip accommodating portion and the clamping portion. The force of the elastic member can make the clamping portion be located at a position that clamps the chip frame.

14. The process cartridge according to claim 12, wherein: The engaging portion is provided with a mounting post, and the chip accommodating portion is provided with a slot. When the engaging portion rotates, the mounting post can be inserted into the slot, so that the engaging portion is in a position to clamp the chip frame.

15. The process cartridge according to claim 10, wherein: The buckle structure is fixedly arranged on the chip accommodating portion. The buckle structure is an elastic buckle. The buckle structure can clamp the chip frame under its own elastic action.

Images