Chip self-adaptive running method and device under low temperature condition

Abstract

The application relates to the technical field of Internet of Things chips, and discloses a chip self-adaptive running method and device under low-temperature conditions. In the running process of a first chip, current environment temperature data and a current running state of the first chip are acquired in real time; when the current environment temperature data is less than a preset low-temperature threshold value, it is determined that the first chip enters a low-temperature mode; in the low-temperature mode, a first running state of the first chip is determined according to the current environment temperature data of the first chip and temperature running state correlation information of the first chip; the first chip is adjusted from the current running state to the first running state; and based on a temperature change trend, the first chip is cyclically adjusted from the first running state to a second running state until the first chip is run completely. The application can ensure normal running of the chip while improving running efficiency, thereby effectively adapting to a low-temperature environment and improving the chip self-adaptive running efficiency under the low-temperature condition.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of Internet of Things chip, in particular to a chip adaptive running method and device under low temperature condition. BACKGROUND

[0002] Under low temperature environment, the chip often causes the increase of thermal stress and mechanical stress of the chip due to temperature, thereby affecting the service life of the chip, and the low temperature environment can cause the chip to not work, sealing failure, work efficiency reduction and other factors, therefore, how to ensure that the chip can normally run under low temperature condition is the current research focus.

[0003] The current chip running mode under low temperature condition is to add a temperature control device at the chip, so as to adjust the temperature environment of the chip in real time, so as to ensure that the chip can always work in a normal temperature environment, thereby ensuring the normal running of the chip in different running environments. However, this way increases the size of the chip in experience angle, and needs to adaptively adjust all circuit boards using the chip, so that the chip using range of this way is small, and this way cannot directly solve the situation that the chip is affected by temperature, thereby causing poor chip adaptive running efficiency under low temperature condition. SUMMARY

[0004] The present application provides a chip adaptive running method and device under low temperature condition, which can ensure normal running of the chip while improving running efficiency, thereby effectively adapting to low temperature environment and improving chip adaptive running efficiency under low temperature condition.

[0005] In order to solve the above technical problems, the present application provides a chip adaptive running method under low temperature condition, comprising:

[0006] In the running process of the first chip, the current environment temperature data and the current running state of the first chip are acquired in real time;

[0007] When the current environment temperature data is less than the preset low temperature threshold, it is determined that the first chip enters a low temperature mode;

[0008] In the low temperature mode, the first running state of the first chip is determined according to the current environment temperature data of the first chip and the temperature running state association information of the first chip, wherein the temperature running state association information of the first chip is obtained according to a preset historical database;

[0009] The first chip is adjusted from the current running state to the first running state.

[0010] Further, the first running state of the first chip is determined according to the current environment temperature data of the first chip and the temperature running state association information of the first chip, specifically:

[0011] querying a plurality of historical running information of the first chip in a preset historical database to form historical running data of the first chip;

[0012] identifying a current resistivity of the first chip based on the current running state;

[0013] identifying temperature running state correlation information of the first chip at the current resistivity in the historical running data;

[0014] identifying a temperature adjustment range of the first chip based on the historical running data and the current environmental temperature data;

[0015] determining a first running state of the first chip based on the temperature adjustment range and the temperature running state correlation information.

[0016] Further, the identifying the temperature running state correlation information of the first chip at the current resistivity in the historical running data specifically comprises:

[0017] obtaining chip resistivity, chip running state and chip temperature data of each of the historical running information in the historical running data;

[0018] screening a plurality of target historical running information with the chip resistivity being the current resistivity from each of the historical running information;

[0019] identifying the temperature running state correlation information of the first chip at the current resistivity based on the chip running state and the chip temperature data in each of the target historical running information.

[0020] Further, the identifying the temperature adjustment range of the first chip based on the historical running data and the current environmental temperature data specifically comprises:

[0021] obtaining a normal running temperature data range of the first chip; wherein the normal running temperature data range comprises a plurality of normal running temperature data;

[0022] calculating a difference between the current environmental temperature data and each of the normal running temperature data in the normal running temperature data range respectively to obtain the temperature adjustment range of the first chip.

[0023] Further, the determining the first running state of the first chip based on the temperature adjustment range and the temperature running state correlation information specifically comprises:

[0024] determining a plurality of first chip running states corresponding to each of the normal running temperature data in the temperature adjustment range in the temperature running state correlation information based on the temperature adjustment range.

[0025] querying, in a preset history database, a chip running power consumption corresponding to each of the first chip running states;

[0026] determining the first chip running state with the minimum chip running power consumption as the first running state of the first chip.

[0027] Further, after adjusting the first chip from the current running state to the first running state, the method further comprises:

[0028] based on the temperature change trend, repeatedly adjusting the first chip from the first running state to a second running state until the first chip finishes running;

[0029] wherein the adjusting the first chip from the first running state to a second running state comprises:

[0030] real-time collecting current temperature change information and current environmental temperature data of the first chip;

[0031] performing distribution sorting processing on the current temperature change information to obtain temperature change distribution information of the first chip;

[0032] performing gradient division on the temperature change distribution information to obtain a temperature change gradient of the first chip;

[0033] based on the current environmental temperature data, identifying change influence information of the current environmental temperature data on the temperature change gradient;

[0034] based on the change influence information and the temperature change gradient, identifying a temperature change trend of the first chip;

[0035] determining a second running state of the first chip according to the temperature change trend, and adjusting the first chip from the first running state to the second running state.

[0036] Further, the identifying the change influence information of the current environmental temperature data on the temperature change gradient based on the current environmental temperature data comprises:

[0037] in each of the historical running information of the first chip, each first historical running information corresponding to the first running state;

[0038] obtaining environmental temperature data corresponding to each of the first historical running information;

[0039] determining the first historical running information with the environmental temperature data being the current environmental temperature data as second historical running information;

[0040] Identify the temperature data changes of each second historical operation information, and distribute and arrange the temperature data changes according to the time series to obtain the distribution information affecting temperature changes;

[0041] Based on the temperature change distribution information and the information affecting the temperature change distribution information, calculate the gradient influence information between the temperature change distribution information and the information affecting the temperature change distribution information;

[0042] The gradient influence information is defined as the influence of the current ambient temperature data on the temperature change gradient.

[0043] Furthermore, the step of identifying the temperature change trend of the first chip based on the change impact information and the temperature change gradient specifically involves:

[0044] Based on the temperature change gradient, predict the first temperature distribution information of the first chip;

[0045] Based on the change impact information, the first temperature distribution information is adjusted to obtain the temperature change trend of the first chip.

[0046] Furthermore, determining the second operating state of the first chip based on the temperature change trend specifically involves:

[0047] Based on the temperature change trend, identify the chip adjustment time required for the first chip to move from the current temperature data to the normal operating temperature data range;

[0048] Obtain the preset temperature adjustment duration threshold of the first chip and the first operating duration of the first chip in the first operating state;

[0049] Based on the preset temperature adjustment time threshold and the first running time, calculate the remaining temperature adjustment time of the first chip;

[0050] When the remaining temperature adjustment time is less than the chip adjustment time, calculate the predicted chip adjustment time required to get from the current temperature data to the normal operating temperature data range under each of the first chip operating states.

[0051] The first chip operating state, in which the predicted chip adjustment time is less than the remaining temperature adjustment time, is determined as the second chip operating state;

[0052] Compare the chip operating power consumption corresponding to each of the second chip operating states, and determine the second chip operating state with the lowest chip operating power consumption as the second operating state of the first chip.

[0053] This invention provides a chip adaptive operation method under low-temperature conditions. By acquiring the chip's historical operating information, the correlation between the chip's temperature and operating state at the current resistivity is identified. Then, using this correlation, the first operating state of the chip under a target temperature difference is identified. By adjusting the chip's operating state, the chip can offset the influence of ambient temperature on its operation through self-heating. Furthermore, by real-time monitoring of chip temperature changes and the current ambient temperature data, the chip's operating state is adjusted to ensure that the chip remains within its normal operating temperature range through adaptive adjustment. This invention not only avoids the problem of adding hardware affecting chip compatibility but also, through adaptive adjustment of the operating state, ensures that the chip remains within its normal operating temperature range in real time while offsetting the temperature influence of the low-temperature environment, thereby improving the chip's adaptive operation efficiency under low-temperature conditions.

[0054] Accordingly, the present invention provides a chip adaptive operation device under low temperature conditions, comprising: a data acquisition module, a mode judgment module, a motion state determination module, and a first adjustment module;

[0055] The data acquisition module is used to acquire the current ambient temperature data and current operating status of the first chip in real time during the operation of the first chip.

[0056] The mode determination module is used to determine that the first chip enters low temperature mode when the current ambient temperature data is less than a preset low temperature threshold.

[0057] The motion state determination module is used to determine the first operating state of the first chip in low-temperature mode based on the current ambient temperature data of the first chip and the temperature operating state association information of the first chip; wherein, the temperature operating state association information of the first chip is obtained from a preset historical database.

[0058] The first adjustment module is used to adjust the first chip from the current operating state to the first operating state.

[0059] This invention provides a chip adaptive operation device under low-temperature conditions. Based on the organic integration of modules, it acquires historical operating information of the chip to identify the correlation between chip temperature and operating state at the current resistivity. Then, using this correlation information, it identifies the chip's first operating state under a target temperature difference. By adjusting the chip's operating state, the chip can offset the influence of ambient temperature on its operation through self-heating. Furthermore, by real-time monitoring of chip temperature changes and the current ambient temperature data, the chip's operating state is adjusted to ensure that the chip remains within its normal operating temperature range through adaptive adjustment. This invention not only avoids the problem of adding hardware affecting chip compatibility but also, through adaptive adjustment of the operating state, ensures that the chip remains within its normal operating temperature range in real time while offsetting the temperature influence of the low-temperature environment, thereby improving the chip's adaptive operation efficiency under low-temperature conditions. Attached Figure Description

[0060] Figure 1 A flowchart illustrating an embodiment of the chip adaptive operation method under low-temperature conditions provided by the present invention;

[0061] Figure 2 A flowchart illustrating another embodiment of the chip adaptive operation method under low-temperature conditions provided by the present invention;

[0062] Figure 3 A schematic flowchart of another embodiment of the chip adaptive operation method under low temperature conditions provided by the present invention;

[0063] Figure 4 A flowchart illustrating another embodiment of the chip adaptive operation method under low-temperature conditions provided by the present invention;

[0064] Figure 5 A schematic diagram of a structure of an embodiment of the chip adaptive operation device under low temperature conditions provided by the present invention;

[0065] Figure 6 A schematic diagram of the structure of an embodiment of the motion state determination module provided by the present invention;

[0066] Figure 7 A schematic diagram of another embodiment of the chip adaptive operation device under low temperature conditions provided by the present invention;

[0067] Figure 8 This is a schematic diagram of one embodiment of the second adjustment module provided by the present invention. Detailed Implementation

[0068] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0069] The flowchart shown in the attached diagram is for illustrative purposes only and does not necessarily include all content and operations / steps, nor does it necessarily have to be performed in the order described. For example, some operations / steps can be broken down, combined, or partially merged, so the actual execution order may change depending on the actual situation.

[0070] The following detailed description of some embodiments of the present invention is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0071] Example 1

[0072] See Figure 1 This is a flowchart illustrating an embodiment of the chip adaptive operation method under low-temperature conditions provided by the present invention. The method includes steps 101 to 104, each of which is detailed below:

[0073] Step 101: During the operation of the first chip, acquire the current ambient temperature data and current operating status of the first chip in real time.

[0074] In the first embodiment of the present invention, the current ambient temperature data of the environment in which the first chip is located can be acquired in real time using a temperature detection device. The current ambient temperature data is used to determine whether the first chip is operating under low-temperature conditions.

[0075] Step 102: When the current ambient temperature data is less than the preset low temperature threshold, it is determined that the first chip enters the low temperature mode.

[0076] In the first embodiment of the present invention, a low-temperature threshold is preset, which is the lowest temperature at which the first chip can operate normally. If the ambient temperature is lower than the preset low-temperature threshold, it is determined that the operating efficiency of the first chip will decrease. Therefore, when acquiring the current ambient temperature data of the first chip during operation, it is compared with the preset low-temperature threshold. If the current ambient temperature data is lower than the preset low-temperature threshold, it is determined that the first chip is in a low-temperature environment, and the operating mode of the first chip needs to be switched to low-temperature mode, and the operating state of the first chip needs to be adjusted to adapt to the low-temperature conditions.

[0077] Step 103: In low temperature mode, the first operating state of the first chip is determined based on the current ambient temperature data of the first chip and the temperature operating state association information of the first chip; wherein, the temperature operating state association information of the first chip is obtained from a preset historical database.

[0078] Furthermore, in the first embodiment of the present invention, see... Figure 2 This is a flowchart illustrating another embodiment of the chip adaptive operation method under low-temperature conditions provided by the present invention. Step 103 includes steps 201 to 205, each of which is detailed below:

[0079] Step 201: Query several historical operation information records of the first chip in the preset historical database to form the historical operation data of the first chip.

[0080] Furthermore, in the first embodiment of the present invention, when it is determined that the first chip has entered a low-temperature mode, several historical operating information entries of the first chip are queried from a preset historical database to form historical operating data of the first chip. The historical operating information includes: the historical operating status of the first chip, the ambient temperature data of the first chip, the temperature change information of the first chip, and the operating power consumption of the first chip, etc.

[0081] Step 202: Identify the current resistivity of the first chip based on the current operating state.

[0082] Furthermore, in the first embodiment of the present invention, by collecting the current operating state of the first chip, the current resistivity of the first chip can be identified. Then, based on the current resistivity, the correlation information between the chip temperature and operating state of the first chip under the current resistivity can be filtered from the historical operating data of the first chip.

[0083] Step 203: Identify the temperature-dependent operating status information of the first chip at the current resistivity from the historical operating data.

[0084] Furthermore, in the first embodiment of the present invention, identifying the temperature-dependent operating status information of the first chip at the current resistivity from the historical operating data specifically involves:

[0085] The chip resistivity, chip operating status, and chip temperature data of each historical operating information are obtained from the historical operating data.

[0086] From the historical operating information, select several target historical operating information entries whose chip resistivity is the current resistivity;

[0087] Based on the chip operating status and chip temperature data in the historical operating information of each target, the temperature operating status association information of the first chip at the current resistivity is identified.

[0088] In the first embodiment of the present invention, the temperature operating state association information is the temperature change distribution information of the first chip under different operating states. The specific method for obtaining the temperature operating state association information is as follows: In the historical operating data of the first chip, identify the chip operating state of each historical operating information, the chip temperature data corresponding to each historical operating information, and the chip resistivity corresponding to each historical operating information; in each historical operating information, filter out target historical operating information where the chip resistivity is the current resistivity; based on the chip temperature data and the chip operating state in each target historical operating information, the association information between the chip temperature and the operating state of the first chip under the current resistivity can be identified.

[0089] This invention identifies the correlation between the operating status of each chip and chip temperature data by filtering the target historical operating information of the current resistivity, which can improve the comprehensiveness and accuracy of the identification of correlation information.

[0090] Step 204: Based on the historical operating data and the current ambient temperature data, identify the temperature adjustment range of the first chip.

[0091] Furthermore, in the first embodiment of the present invention, based on the historical operating data and the current ambient temperature data, the temperature adjustment range of the first chip is identified, specifically as follows:

[0092] Obtain the normal operating temperature data range of the first chip; wherein, the normal operating temperature data range includes several normal operating temperature data;

[0093] The temperature adjustment range of the first chip is obtained by calculating the difference between the current ambient temperature data and each normal operating temperature data within the normal operating temperature data range.

[0094] In the first embodiment of the present invention, the temperature adjustment range of the chip can be identified based on the current ambient temperature data of the first chip. Specifically, the temperature data range of the first chip during normal operation is first obtained, and the difference between the current ambient temperature data and each temperature data in the temperature data range is calculated to obtain the temperature adjustment range of the first chip. The temperature adjustment range of the first chip is the temperature change range of the first chip from the current temperature data to the temperature data range of the first chip during normal operation.

[0095] This invention uses the normal operating temperature data range as a reference to identify the temperature adjustment range of the first chip, thereby improving the comprehensiveness of the target temperature difference information of the chip.

[0096] Step 205: Based on the temperature adjustment range and the temperature operating status association information, determine the first operating status of the first chip.

[0097] Furthermore, in the first embodiment of the present invention, the first operating state of the first chip is determined based on the temperature adjustment range and the temperature operating state association information, specifically as follows:

[0098] Based on the temperature adjustment range, several first chip operating states corresponding to each normal operating temperature data in the temperature adjustment range are determined in the temperature operating state association information.

[0099] Query the chip operating power consumption corresponding to each operating state of the first chip in the preset historical database;

[0100] The first operating state of the chip with the lowest chip power consumption is determined as the first operating state of the first chip.

[0101] In the first embodiment of the present invention, the first operating state of the first chip can be identified based on the temperature adjustment range and the temperature operating state association information. Specifically: based on the temperature adjustment range, the chip operating state range corresponding to the temperature adjustment range is identified in the temperature operating state association information; each chip operating state in the chip operating state range of the first chip is determined as the first chip operating state; the chip operating power consumption corresponding to each first chip operating state is queried, and the first chip operating state corresponding to the minimum chip operating power consumption is selected and determined as the first operating state of the chip.

[0102] This invention selects chip operating states that can be adjusted to the temperature adjustment range and have low chip power consumption. This not only ensures that the chip can generate its own heat to offset the effects of low temperature, but also reduces the chip's operating power consumption, thereby improving the resource optimization effect of the chip in the process of generating its own heat.

[0103] Step 104: Adjust the first chip from the current operating state to the first operating state.

[0104] In the first embodiment of the present invention, after determining a first operating state that can be adjusted to the temperature adjustment range of the first chip and has low chip power consumption, the operating state of the first chip is adjusted so that it switches from the current operating state to the first operating state, thereby realizing the adaptive operation of the first chip under low temperature conditions.

[0105] See Figure 3This is a flowchart illustrating another embodiment of the chip adaptive operation method under low-temperature conditions provided by the present invention. In the first embodiment of the present invention, after adjusting the first chip from the current operating state to the first operating state, step 105 is further included, specifically:

[0106] Step 105: Based on the temperature change trend, the first chip is cyclically adjusted from the first operating state to the second operating state until the first chip completes operation.

[0107] In the first embodiment of the present invention, after adjusting the operating state of the first chip to a first operating state, a second operating state of the first chip is re-identified based on the temperature change trend of the first chip, and the second operating state replaces the first operating state. At this time, the second operating state is essentially the new chip operating state of the first chip. The operating state of the first chip is iteratively adjusted by changing the ambient temperature data after the chip operating state is changed, until the first chip completes operation, at which point the iteration operation stops. The present invention ensures the adaptive operating efficiency of the first chip by iteratively changing its operating state to adapt to iterative ambient temperature data.

[0108] Furthermore, in the first embodiment of the present invention, see... Figure 4 This is a flowchart illustrating another embodiment of the chip adaptive operation method under low-temperature conditions provided by the present invention. Step 105 includes steps 301 to 306, each of which is detailed below:

[0109] Step 301: Collect the current temperature change information of the first chip and the current ambient temperature data in real time.

[0110] In the first embodiment of the present invention, after the first chip is converted to a first operating state, a temperature detection device is used to collect the temperature change information of the first chip. The temperature change information of the first chip refers to the temperature data of the first chip within a unit time interval.

[0111] Step 302: Perform distribution sorting processing on the current temperature change information to obtain the temperature change distribution information of the first chip.

[0112] In the first embodiment of the present invention, the temperature change information of the first chip is sorted and distributed to obtain the temperature change distribution information of the first chip. Specifically, a curve fitting algorithm is used to process the temperature data between each unit time interval in the temperature change information to generate the temperature change distribution information of the first chip.

[0113] Step 303: Divide the temperature change distribution information into gradients to obtain the temperature change gradient of the first chip.

[0114] In the first embodiment of the present invention, the temperature change gradient of the first chip can be identified based on the temperature change distribution information of the first chip. Specifically, the temperature change curve corresponding to the temperature change distribution information of the first chip is obtained, and the temperature change gradient of the first chip can be obtained by dividing the temperature change curve into gradients. The temperature deviation value between each gradient in the temperature change gradient of the first chip is a pre-set deviation value.

[0115] Step 304: Based on the current ambient temperature data, identify the impact of the current ambient temperature data on the temperature change gradient.

[0116] Furthermore, in the first embodiment of the present invention, based on the current ambient temperature data, the influence of the current ambient temperature data on the temperature change gradient is identified, specifically as follows:

[0117] In each of the historical operation information of the first chip, the first historical operation information corresponding to the first operation state;

[0118] Obtain the ambient temperature data corresponding to each of the first historical operation information;

[0119] The first historical operating information, which is based on the current ambient temperature data, is determined as the second historical operating information.

[0120] Identify the temperature data changes of each second historical operation information, and distribute and arrange the temperature data changes according to the time series to obtain the distribution information affecting temperature changes;

[0121] Based on the temperature change distribution information and the information affecting the temperature change distribution information, calculate the gradient influence information between the temperature change distribution information and the information affecting the temperature change distribution information;

[0122] The gradient influence information is defined as the influence of the current ambient temperature data on the temperature change gradient.

[0123] In the first embodiment of the present invention, based on the current ambient temperature data, the influence of the current ambient temperature data on the temperature change gradient of the first chip can be identified. Specifically: In the historical operating information of the first chip, the first historical operating information corresponding to the first operating state of the first chip is queried; in the first historical operating information, the second historical operating information with ambient temperature data as the current ambient temperature data is selected; the temperature data change information in the second historical operating information is identified, and the temperature data change information is distributed and arranged according to the time series to obtain the influence temperature change distribution information corresponding to the current ambient temperature data. The gradient influence information refers to the degree of influence of the current ambient temperature data of the first chip on different temperature change gradients. Each change in ambient temperature data corresponds to the temperature change of multiple chips, and the average value of the temperature change of multiple chips corresponding to each change in ambient temperature data is calculated to obtain the target temperature change corresponding to each change in ambient temperature data. Then, based on the distribution information of the change in ambient temperature data, the distribution information of the target temperature change is constructed, and the gradient influence information of the temperature change distribution information corresponding to the distribution information of the change in ambient temperature data is calculated using a curve fitting algorithm based on discrete points.

[0124] Step 305: Based on the change impact information and the temperature change gradient, identify the temperature change trend of the first chip.

[0125] Furthermore, in the first embodiment of the present invention, based on the change impact information and the temperature change gradient, the temperature change trend of the first chip is identified, specifically as follows:

[0126] Based on the temperature change gradient, predict the first temperature distribution information of the first chip;

[0127] Based on the change impact information, the first temperature distribution information is adjusted to obtain the temperature change trend of the first chip.

[0128] In the first embodiment of the present invention, by identifying the current temperature data of the first chip and based on the temperature change gradient of the first chip, the first temperature distribution information of the first chip can be predicted; based on the gradient influence information, the first temperature distribution information of the first chip is adjusted to obtain the temperature change trend of the first chip.

[0129] This invention improves the accuracy of the chip's temperature change trend by identifying the impact of current ambient temperature data on the temperature change gradient of the first chip and determining the degree of influence of the current ambient temperature data on different temperature change gradients by identifying the change impact information.

[0130] Step 306: Based on the temperature change trend, determine the second operating state of the first chip, and adjust the first chip from the first operating state to the second operating state.

[0131] Furthermore, in the first embodiment of the present invention, the second operating state of the first chip is determined based on the temperature change trend, specifically as follows:

[0132] Based on the temperature change trend, identify the chip adjustment time required for the first chip to move from the current temperature data to the normal operating temperature data range;

[0133] Obtain the preset temperature adjustment duration threshold of the first chip and the first operating duration of the first chip in the first operating state;

[0134] Based on the preset temperature adjustment time threshold and the first running time, calculate the remaining temperature adjustment time of the first chip;

[0135] When the remaining temperature adjustment time is less than the chip adjustment time, calculate the predicted chip adjustment time required to get from the current temperature data to the normal operating temperature data range under each of the first chip operating states.

[0136] The first chip operating state, in which the predicted chip adjustment time is less than the remaining temperature adjustment time, is determined as the second chip operating state;

[0137] Compare the chip operating power consumption corresponding to each of the second chip operating states, and determine the second chip operating state with the lowest chip operating power consumption as the second operating state of the first chip.

[0138] In the first embodiment of the present invention, based on the temperature change trend of the first chip, the second operating state of the first chip can be iteratively identified, thereby adjusting the operating state of the first chip. Specifically, based on the temperature change trend of the first chip, the chip adjustment time between the current temperature data of the first chip and the temperature data range of the chip's normal operation is identified. A preset temperature adjustment time threshold and the first operating time of the first chip in the first operating state are collected, and the preset temperature adjustment time threshold is subtracted from the first operating time to obtain the remaining temperature adjustment time of the first chip.

[0139] In the first embodiment of the present invention, since the chip's operating speed slows down under low temperature conditions, if the chip's adjustment time is too long, the actual temperature data of the chip will differ significantly from the detected temperature data after the chip adjustment is completed. Therefore, it is necessary to speed up the chip's temperature adjustment process. Thus, after obtaining the chip adjustment time and the remaining temperature adjustment time of the first chip, the two are compared. When the remaining temperature adjustment time is less than the chip adjustment time, the temperature of the first chip is adjusted.

[0140] In the first embodiment of the present invention, when it is determined that the temperature of the first chip needs to be adjusted, the temperature change distribution information of each chip operating state within the operating state range is identified based on the historical operating information of the first chip at the current ambient temperature. Based on the current temperature data of the first chip, the predicted chip adjustment time from the current temperature data of the first chip to the normal operating temperature data range of the chip is calculated for each chip operating state; and based on the chip operating power consumption corresponding to each chip operating state, the chip operating state with the lowest chip operating power consumption is selected from the initial chip operating states corresponding to the predicted chip adjustment time that is less than the remaining temperature adjustment time, and this is determined as the second operating state of the first chip.

[0141] This invention reduces the impact of low temperatures on the chip by controlling the temperature adjustment time, thereby improving the adjustment efficiency of the chip's adaptive adjustment of its operating state.

[0142] The first embodiment of this invention can be applied to low-temperature operating environments for IoT chips and integrated circuit chips. This method can be applied to terminals, servers, and systems including both terminals and servers, and is implemented through interaction between the terminal and the server. The terminal can be, but is not limited to, various personal computers, laptops, smartphones, tablets, etc. Based on changes in chip temperature and operating status, this invention generates heat through changes in the chip's operating status, thereby improving operating efficiency while ensuring normal chip operation. This effectively adapts to low-temperature environments and enhances the adaptive operating efficiency of the chip under low-temperature conditions.

[0143] In summary, the first embodiment of this invention provides a chip adaptive operation method under low-temperature conditions. By acquiring the chip's historical operating information, it identifies the correlation between the chip temperature and its operating state at the current resistivity. Then, using this correlation information, it identifies the chip's first operating state under a target temperature difference. By adjusting the chip's operating state, the chip can offset the influence of ambient temperature on its operation through self-heating. Furthermore, by real-time monitoring of chip temperature changes and the current ambient temperature data, the chip's operating state is adjusted to ensure that the chip remains within its normal operating temperature range through adaptive adjustment. This invention not only avoids the problem of adding hardware affecting chip compatibility but also, through adaptive adjustment of the operating state, ensures that the chip remains within its normal operating temperature range while offsetting the temperature influence of the low-temperature environment, thereby improving the chip's adaptive operation efficiency under low-temperature conditions.

[0144] Example 2

[0145] SeeFigure 5 This is a schematic diagram of a chip adaptive operation device under low temperature conditions provided by the present invention. The device includes a data acquisition module 401, a mode judgment module 402, a motion state determination module 403, and a first adjustment module 404.

[0146] The data acquisition module 401 is used to acquire the current ambient temperature data and current operating status of the first chip in real time during the operation of the first chip;

[0147] The mode determination module 402 is used to determine that the first chip enters a low temperature mode when the current ambient temperature data is less than a preset low temperature threshold.

[0148] The motion state determination module 403 is used to determine the first operating state of the first chip in low temperature mode based on the current ambient temperature data of the first chip and the temperature operating state association information of the first chip; wherein, the temperature operating state association information of the first chip is obtained from a preset historical database.

[0149] The first adjustment module 404 is used to adjust the first chip from the current operating state to the first operating state.

[0150] Furthermore, in the second embodiment of the present invention, see... Figure 6 This is a schematic diagram of the structure of an embodiment of the motion state determination module provided by the present invention. The motion state determination module 403 includes: a query unit 501, a resistivity identification unit 502, an associated information identification unit 503, an adjustment range identification unit 504, and a running state determination unit 505.

[0151] The query unit 501 is used to query several historical operating information records of the first chip in a preset historical database to form historical operating data of the first chip;

[0152] The resistivity identification unit 502 is used to identify the current resistivity of the first chip based on the current operating state;

[0153] The associated information identification unit 503 is used to identify the temperature operating status associated information of the first chip at the current resistivity in the historical operating data;

[0154] The adjustment range identification unit 504 is used to identify the temperature adjustment range of the first chip based on the historical operating data and the current ambient temperature data;

[0155] The operating status determination unit 505 is used to determine the first operating status of the first chip based on the temperature adjustment range and the temperature operating status association information.

[0156] Furthermore, in the second embodiment of the present invention, the associated information identification unit 503 includes: acquiring chip resistivity, chip operating status and chip temperature data of each piece of historical operating information from the historical operating data;

[0157] From the historical operating information, select several target historical operating information entries whose chip resistivity is the current resistivity;

[0158] Based on the chip operating status and chip temperature data in the historical operating information of each target, the temperature operating status association information of the first chip at the current resistivity is identified.

[0159] Furthermore, in the second embodiment of the present invention, the adjustment range identification unit 504 includes:

[0160] Obtain the normal operating temperature data range of the first chip; wherein, the normal operating temperature data range includes several normal operating temperature data;

[0161] The temperature adjustment range of the first chip is obtained by calculating the difference between the current ambient temperature data and each normal operating temperature data within the normal operating temperature data range.

[0162] Furthermore, in the second embodiment of the present invention, the operating state determination unit 505 includes:

[0163] Based on the temperature adjustment range, several first chip operating states corresponding to each normal operating temperature data in the temperature adjustment range are determined in the temperature operating state association information.

[0164] Query the chip operating power consumption corresponding to each operating state of the first chip in the preset historical database;

[0165] The first operating state of the chip with the lowest chip power consumption is determined as the first operating state of the first chip.

[0166] See Figure 7 This is a schematic diagram of another embodiment of the chip adaptive operation device under low temperature conditions provided by the present invention. In the second embodiment of the present invention, the chip adaptive operation device under low temperature conditions further includes a second adjustment module 405, specifically:

[0167] The second adjustment module 405 is used to cyclically adjust the first chip from the first operating state to the second operating state based on the temperature change trend until the first chip completes operation.

[0168] Furthermore, in the second embodiment of the present invention, see... Figure 8This is a structural diagram of an embodiment of the provided second adjustment module 405, which includes: a data acquisition unit 601, a distribution processing unit 602, a gradient division unit 603, an influence information identification unit 604, a trend identification unit 605, and an adjustment unit 606.

[0169] The acquisition unit 601 is used to acquire the current temperature change information of the first chip and the current ambient temperature data in real time;

[0170] The distribution processing unit 602 is used to perform distribution sorting processing on the current temperature change information to obtain the temperature change distribution information of the first chip;

[0171] The gradient partitioning unit 603 is used to perform gradient partitioning on the temperature change distribution information to obtain the temperature change gradient of the first chip.

[0172] The influence information identification unit 604 is used to identify, based on the current ambient temperature data, the influence information of the current ambient temperature data on the temperature change gradient.

[0173] The trend recognition unit 605 is used to recognize the temperature change trend of the first chip based on the change impact information and the temperature change gradient;

[0174] The adjustment unit 606 is used to determine the second operating state of the first chip according to the temperature change trend, and adjust the first chip from the first operating state to the second operating state.

[0175] Furthermore, in the second embodiment of the present invention, the influence information identification unit 604 includes:

[0176] In each of the historical operation information of the first chip, the first historical operation information corresponding to the first operation state;

[0177] Obtain the ambient temperature data corresponding to each of the first historical operation information;

[0178] The first historical operating information, which is based on the current ambient temperature data, is determined as the second historical operating information.

[0179] Identify the temperature data changes of each second historical operation information, and distribute and arrange the temperature data changes according to the time series to obtain the distribution information affecting temperature changes;

[0180] Based on the temperature change distribution information and the information affecting the temperature change distribution information, calculate the gradient influence information between the temperature change distribution information and the information affecting the temperature change distribution information;

[0181] The gradient influence information is defined as the influence of the current ambient temperature data on the temperature change gradient.

[0182] Furthermore, in the second embodiment of the present invention, the trend recognition unit 605 includes:

[0183] Based on the change impact information and the temperature change gradient, the temperature change trend of the first chip is identified, specifically as follows:

[0184] Based on the temperature change gradient, predict the first temperature distribution information of the first chip;

[0185] Based on the change impact information, the first temperature distribution information is adjusted to obtain the temperature change trend of the first chip.

[0186] Furthermore, in the second embodiment of the present invention, the adjustment unit 606 includes:

[0187] Based on the temperature change trend, the second operating state of the first chip is determined as follows:

[0188] Based on the temperature change trend, identify the chip adjustment time required for the first chip to move from the current temperature data to the normal operating temperature data range;

[0189] Obtain the preset temperature adjustment duration threshold of the first chip and the first operating duration of the first chip in the first operating state;

[0190] Based on the preset temperature adjustment time threshold and the first running time, calculate the remaining temperature adjustment time of the first chip;

[0191] When the remaining temperature adjustment time is less than the chip adjustment time, calculate the predicted chip adjustment time required to get from the current temperature data to the normal operating temperature data range under each of the first chip operating states.

[0192] The first chip operating state, in which the predicted chip adjustment time is less than the remaining temperature adjustment time, is determined as the second chip operating state;

[0193] Compare the chip operating power consumption corresponding to each of the second chip operating states, and determine the second chip operating state with the lowest chip operating power consumption as the second operating state of the first chip.

[0194] In summary, the second embodiment of this invention provides a chip adaptive operation device under low-temperature conditions. Based on the organic integration of modules, it acquires historical operating information of the chip to identify the correlation between the chip temperature and operating state under the current resistivity. Then, using this correlation information, it identifies the first operating state of the chip under the target temperature difference. By adjusting the chip's operating state, the chip can offset the influence of ambient temperature on chip operation through self-heating. Furthermore, by real-time detection of chip temperature changes and the current ambient temperature data, the chip's operating state is adjusted to ensure that the chip can maintain its normal operating temperature range in real time through adaptive adjustment of its operating state. This invention not only avoids the problem of adding hardware affecting chip compatibility but also, through adaptive adjustment of the operating state, ensures that the chip is within its normal operating temperature range in real time while offsetting the temperature influence of the low-temperature environment, thereby improving the chip's adaptive operation efficiency under low-temperature conditions.

[0195] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above descriptions are merely specific embodiments of the present invention and are not intended to limit the scope of protection of the present invention. In particular, it should be noted that any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention for those skilled in the art.

Claims

1. A chip adaptive operation method under low-temperature conditions, characterized in that, include: During the operation of the first chip, the current ambient temperature data and current operating status of the first chip are acquired in real time; When the current ambient temperature data is less than a preset low temperature threshold, it is determined that the first chip enters low temperature mode; In low-temperature mode, the first operating state of the first chip is determined based on the current ambient temperature data of the first chip and the temperature operating status correlation information of the first chip, specifically as follows: The historical operation information of the first chip is queried from a preset historical database to form the historical operation data of the first chip; The current resistivity of the first chip is identified based on the current operating state; Identify the temperature-dependent operating status information of the first chip at the current resistivity from the historical operating data; Based on the historical operating data and the current ambient temperature data, the temperature adjustment range of the first chip is identified; Based on the temperature adjustment range and the temperature operating status association information, the first operating state of the first chip is determined; Adjust the first chip from the current operating state to the first operating state.

2. The chip adaptive operation method under low temperature conditions according to claim 1, characterized in that, The step of identifying the temperature-dependent operating status information of the first chip at the current resistivity from the historical operating data specifically involves: The chip resistivity, chip operating status, and chip temperature data of each historical operating information are obtained from the historical operating data. From the historical operating information, select several target historical operating information entries whose chip resistivity is the current resistivity; Based on the chip operating status and chip temperature data in the historical operating information of each target, the temperature operating status association information of the first chip at the current resistivity is identified.

3. The chip adaptive operation method under low temperature conditions according to claim 2, characterized in that, The step of identifying the temperature adjustment range of the first chip based on the historical operating data and the current ambient temperature data specifically involves: Obtain the normal operating temperature data range of the first chip; wherein, the normal operating temperature data range includes several normal operating temperature data; The temperature adjustment range of the first chip is obtained by calculating the difference between the current ambient temperature data and each normal operating temperature data within the normal operating temperature data range.

4. The chip adaptive operation method under low temperature conditions according to claim 3, characterized in that, The determination of the first operating state of the first chip based on the temperature adjustment range and the temperature operating state association information specifically includes: Based on the temperature adjustment range, several first chip operating states corresponding to each normal operating temperature data in the temperature adjustment range are determined in the temperature operating state association information. Query the chip operating power consumption corresponding to each operating state of the first chip in the preset historical database; The first operating state of the chip with the lowest chip power consumption is determined as the first operating state of the first chip.

5. The chip adaptive operation method under low temperature conditions according to claim 4, characterized in that, After adjusting the first chip from the current operating state to the first operating state, the method further includes: Based on the temperature change trend, the first chip is cyclically adjusted from the first operating state to the second operating state until the first chip completes operation; Specifically, adjusting the first chip from the first operating state to the second operating state involves: Real-time acquisition of the current temperature change information of the first chip and the current ambient temperature data; The current temperature change information is sorted and distributed to obtain the temperature change distribution information of the first chip; The temperature change distribution information is divided into gradients to obtain the temperature change gradient of the first chip. Based on the current ambient temperature data, identify the impact of the current ambient temperature data on the temperature change gradient; Based on the information on the impact of the changes and the temperature change gradient, the temperature change trend of the first chip is identified; Based on the temperature change trend, the second operating state of the first chip is determined, and the first chip is adjusted from the first operating state to the second operating state.

6. The chip adaptive operation method under low temperature conditions according to claim 5, characterized in that, The step of identifying the impact of the current ambient temperature data on the temperature change gradient based on the current ambient temperature data specifically includes: In each of the historical operation information of the first chip, the first historical operation information corresponding to the first operation state; Obtain the ambient temperature data corresponding to each of the first historical operation information; The first historical operating information, which is based on the current ambient temperature data, is determined as the second historical operating information. Identify the temperature data changes of each second historical operation information, and distribute and arrange the temperature data changes according to the time series to obtain the distribution information affecting temperature changes; Based on the temperature change distribution information and the information affecting the temperature change distribution information, calculate the gradient influence information between the temperature change distribution information and the information affecting the temperature change distribution information; The gradient influence information is defined as the influence of the current ambient temperature data on the temperature change gradient.

7. The chip adaptive operation method under low temperature conditions according to claim 6, characterized in that, The step of identifying the temperature change trend of the first chip based on the change impact information and the temperature change gradient specifically involves: Based on the temperature change gradient, predict the first temperature distribution information of the first chip; Based on the change impact information, the first temperature distribution information is adjusted to obtain the temperature change trend of the first chip.

8. The chip adaptive operation method under low temperature conditions according to claim 7, characterized in that, The step of determining the second operating state of the first chip based on the temperature change trend is as follows: Based on the temperature change trend, identify the chip adjustment time required for the first chip to move from the current temperature data to the normal operating temperature data range; Obtain the preset temperature adjustment duration threshold of the first chip and the first operating duration of the first chip in the first operating state; Based on the preset temperature adjustment time threshold and the first running time, calculate the remaining temperature adjustment time of the first chip; When the remaining temperature adjustment time is less than the chip adjustment time, calculate the predicted chip adjustment time required to get from the current temperature data to the normal operating temperature data range under each of the first chip operating states. The first chip operating state, in which the predicted chip adjustment time is less than the remaining temperature adjustment time, is determined as the second chip operating state; Compare the chip operating power consumption corresponding to each of the second chip operating states, and determine the second chip operating state with the lowest chip operating power consumption as the second operating state of the first chip.

9. A chip adaptive operation device under low temperature conditions, characterized in that, include: The module comprises a data acquisition module, a pattern determination module, a motion state determination module, and a first adjustment module. The data acquisition module is used to acquire the current ambient temperature data and current operating status of the first chip in real time during the operation of the first chip. The mode determination module is used to determine that the first chip enters low temperature mode when the current ambient temperature data is less than a preset low temperature threshold. The motion state determination module is used to determine the first operating state of the first chip in low-temperature mode based on the current ambient temperature data of the first chip and the temperature operating state association information of the first chip, specifically: The historical operation information of the first chip is queried from a preset historical database to form the historical operation data of the first chip; The current resistivity of the first chip is identified based on the current operating state; Identify the temperature-dependent operating status information of the first chip at the current resistivity from the historical operating data; Based on the historical operating data and the current ambient temperature data, the temperature adjustment range of the first chip is identified; Based on the temperature adjustment range and the temperature operating status association information, the first operating state of the first chip is determined; The first adjustment module is used to adjust the first chip from the current operating state to the first operating state.

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