Temperature control method and temperature control system
By setting up multiple temperature control units and temperature sensors in the work space, adjusting the power distribution ratio, establishing a mapping relationship between temperature and power distribution, the problem of uneven temperature in actual applications of semiconductor refrigeration sheets is solved, and more efficient temperature control.
Patent Information
- Application Number
- CN202310979071.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-08-04
- Publication Date
- 2025-02-14
Smart Images

Figure CN119440125A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to a temperature control method and a temperature control system capable of controlling the temperature uniformity of a working space and reducing temperature fluctuation. Background Art
[0002] At present, many industrial processing and test operations need to be carried out in a constant temperature and humidity environment, so a constant temperature and humidity control system is needed to control the temperature and humidity in the test chamber. The constant temperature and humidity chamber in traditional technology usually uses a compressor for temperature control, but the compressor is noisy, vibrates strongly, consumes a lot of energy, and generates high working heat when working.
[0003] Semiconductor constant temperature technology is a new type of constant temperature technology that uses semiconductor refrigeration chips to perform DC cooling or heating. Semiconductor refrigeration chips use the Peltier effect of semiconductor materials. When direct current passes through a couple made of two different semiconductor materials in series, a cold end and a hot end are formed at both ends of the couple, and the purpose of cooling or heating is achieved by exchanging heat.
[0004] However, in actual applications, semiconductor refrigerators often experience overshoot, that is, the actual working temperature often oscillates significantly above and below the normal temperature, affecting the actual effect of temperature control and the accuracy of processing and test operations.
[0005] Therefore, in the prior art, how to control the temperature uniformity of the working space and reduce the temperature fluctuation has become a technical issue. Summary of the invention
[0006] The purpose of the present application is to provide a temperature control method and a temperature control system that can control the temperature uniformity of a working space and reduce temperature fluctuation. In order to achieve the above purpose, one scheme of the present application is a temperature control method for controlling the temperature uniformity of a working space, wherein a plurality of temperature control units are arranged in the working space; the temperature control method comprises the following steps: S1: a sensor arrangement step, wherein temperature sampling points are respectively arranged at different positions of the working space, and a temperature sensor is respectively arranged at each of the temperature sampling points to form a sensor group for detecting the temperature in the working space; S2: a power allocation step, wherein different set temperatures are preset, and at each of the set temperatures, the power allocation ratio of at least one of the plurality of temperature control units is adjusted, and the temperature data of the corresponding temperature sampling points is collected to find the power allocation ratio corresponding to the minimum temperature fluctuation amplitude of the temperature sampling point; S3: a data fitting step, wherein a data fitting method is adopted based on the power allocation ratio obtained at each of the set temperatures to establish a mapping relationship between the set temperature and the power allocation ratio.
[0007] According to the aforementioned technical solution, a mapping relationship between the set temperature and the power distribution ratio can be established based on the measured data. According to the mapping relationship, the corresponding power distribution ratio can be easily obtained, and then the output power of the temperature control unit can be controlled to control the temperature uniformity of the working space.
[0008] In a preferred embodiment, in the power allocation step, the temperature data of the temperature sampling points are collected according to the temperature sampling step; the temperature sampling step is to start the multiple temperature control units so that the temperature of the working space reaches each of the set temperatures respectively, and at each of the set temperatures, the multiple temperature control units are stably operated for a specified time, and then the temperature data of each of the temperature sampling points within a specified time interval is collected via the sensor group.
[0009] According to the aforementioned technical solution, the actual temperature of each sampling point can be collected more comprehensively and accurately by waiting until the test chamber reaches the set temperature and runs stably for a period of time before testing.
[0010] In a preferred embodiment, according to the mapping relationship, the set temperature is input to obtain the corresponding power allocation ratio.
[0011] According to the aforementioned technical solution, the output power of the temperature control unit is controlled according to the corresponding power distribution ratio, thereby controlling the temperature uniformity of the working space.
[0012] In a preferred embodiment, the arrangement direction of the plurality of temperature control units is taken as a first direction, and the sensor group includes a first sensor group, a second sensor group, and a third sensor group that are spaced apart in the first direction.
[0013] According to the aforementioned technical solution, multiple groups of temperature sensors are arranged in sequence according to the arrangement direction of the temperature control units, so that the temperature change situation at the corresponding position of each temperature control unit can be collected more accurately.
[0014] In a preferred embodiment, in a second direction perpendicular to the first direction, the first sensor group, the second sensor group, and the third sensor group respectively include a plurality of temperature sensors distributed at intervals.
[0015] In a preferred embodiment, one of the temperature sensors is arranged at the geometric center of the working space, and at least two of the temperature sensors are arranged at the edge of the working space away from the geometric center thereof.
[0016] According to the aforementioned technical solution, multiple temperature sensors are evenly distributed in the box, which can more comprehensively detect the temperature data of every corner of the box.
[0017] In a preferred embodiment, in the second direction, the plurality of temperature control units include a first temperature control unit group and a second temperature control unit group which are arranged at intervals and each include a plurality of temperature control units.
[0018] According to the aforementioned technical solution, multiple groups of temperature control units are arranged at different positions in the box, so that the temperature change in the box can be controlled more evenly.
[0019] In a preferred manner, in different temperature control modes, the output power of the temperature control units in the first temperature control unit group / the second temperature control unit group is adjusted according to the power allocation ratio obtained from the mapping relationship.
[0020] In a preferred embodiment, the temperature control mode includes a cooling mode and a heating mode.
[0021] According to the aforementioned technical solution, two groups of temperature control units are arranged in the upper and lower directions in the box. The output power of the lower temperature control unit can be adjusted in the cooling mode, and the output power of the upper temperature control unit can be adjusted in the heating mode.
[0022] In a preferred embodiment, the first temperature control unit group includes a first temperature control unit, a second temperature control unit, and a third temperature control unit arranged along the first direction; the second temperature control unit group includes a fourth temperature control unit, a fifth temperature control unit, and a sixth temperature control unit arranged along the first direction.
[0023] In addition, another aspect of the present application is a temperature control system for controlling the temperature uniformity of a working space, wherein the working space is provided with multiple temperature control units and multiple temperature sensors; the temperature control system controls the output power of at least one of the multiple temperature control units according to the power distribution ratio in accordance with the above-mentioned temperature control method. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] In order to more clearly illustrate the present application, the following description and drawings of the present application are described and illustrated. Obviously, the drawings in the following description only illustrate certain aspects of some exemplary embodiments of the present application, and it is possible for a person of ordinary skill in the art to obtain other drawings based on these drawings without creative work.
[0025] Figure 1 is a perspective view of an exemplary test chamber.
[0026] Figure 2 is an exemplary floor sensor distribution map.
[0027] Figure 3 is an exemplary temperature control unit distribution diagram.
[0028] Figure 4This is a flow chart of an exemplary temperature control.
[0029] Caption of the attached figure:
[0030] 100 Test Chamber
[0031] 101 First sensor group
[0032] 102 Second sensor group
[0033] 103 Third sensor group
[0034] 11 Bottom Plate
[0035] 111 First Sensor
[0036] 112 Second sensor
[0037] 113 Third Sensor
[0038] 114 Fourth Sensor
[0039] 115 Fifth Sensor
[0040] 116 Sixth Sensor
[0041] 117 Seventh Sensor
[0042] 118 Eighth Sensor
[0043] 119 Ninth Sensor
[0044] 12 Middle Layer
[0045] 13 Upper
[0046] 2 Inner wall
[0047] 51 First temperature control unit group
[0048] 511 First Temperature Control Unit
[0049] 512 Second temperature control unit
[0050] 513 The third temperature control unit
[0051] 52 Second temperature control unit group
[0052] 524 Fourth temperature control unit
[0053] 525 Fifth temperature control unit
[0054] 526 Sixth Temperature Control Unit DETAILED DESCRIPTION
[0055] Various exemplary embodiments of the present application are described in detail below with reference to the accompanying drawings. The description of the exemplary embodiments is merely illustrative and is by no means intended to limit the present application and its application or use. The present application can be implemented in many different forms and is not limited to the embodiments described herein. These embodiments are provided to make the present application thorough and complete and to fully express the scope of the present application to those skilled in the art. It should be noted that unless otherwise stated, the relative arrangement of the components and steps, numerical expressions, and numerical values, etc., described in these embodiments should be interpreted as being merely exemplary, rather than as limitations.
[0056] The words “include” or “comprising” and the like used in this application mean that the elements preceding the words include the elements listed after the words, and do not exclude the possibility of also including other elements.
[0057] All terms (including technical terms or scientific terms) used in this application have the same meaning as those understood by ordinary technicians in the field to which this application belongs, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be understood to have meanings consistent with their meanings in the context of the relevant technology, and should not be interpreted in an idealized or extremely formal sense, unless explicitly defined in this article.
[0058] Components not described in detail in this section, parameters such as specific models of components, relationships between components, and control circuits may be considered as technologies, methods, and equipment known to ordinary technicians in the relevant fields, but in appropriate circumstances, such technologies, methods, and equipment should be considered as part of the specification.
[0059] Test Chamber
[0060] First refer to Figure 1-3 The overall structure of the test box 100 of the present application and the distribution of the temperature sensors and the temperature control units are described. Figure 1 This is a perspective view of the test chamber. Figure 2 is the sensor distribution diagram of the bottom plate 11, Figure 3 It is the temperature control unit distribution diagram.
[0061] See also Figure 1For the sake of convenience, the working space described in this application is the space inside the test box 100. The test box 100 is usually a constant temperature and humidity box. As an example, the temperature range in the box is 5°C-70°C, the relative humidity range is 10%-90%, the temperature fluctuation range is ±0.1°C, and the relative humidity fluctuation range is ±1.5%. When using the box for experiments, experimenters sometimes culture and breed fruit flies, bacteria, cells, etc., and require high temperature uniformity in the box. For this reason, in this embodiment, a semiconductor refrigeration chip is used as a temperature control unit to achieve cooling / heating in the box, thereby achieving temperature control. The cooling and heating modes are switched by relay control.
[0062] It is understandable that the working space is not limited to the above-mentioned test box 100, but can also be other spaces with high requirements for temperature uniformity. The temperature control unit for achieving cooling and heating is not limited to semiconductor refrigeration plates, the temperature range in the box is not limited to 5°C-70°C, and the temperature fluctuation range is not limited to ±0.1°C. The above data is only used as an example for explanation and is not specifically limited. In addition, the shape of the test box 100 can also be various styles. For the sake of simplicity, only the cube shown in the figure is used as an example for explanation.
[0063] For ease of explanation, the X-axis and Y-axis directions shown in the figure are horizontal directions, and the Z-axis direction is the up-down direction. In the X-axis direction, the origin O is the left side, and the X-axis extends horizontally to the right from the origin O. In the Y-axis direction, the origin O is the outside, and the Y-axis extends horizontally to the inside from the origin O. The test box 100 is placed in a horizontal manner with the bottom plate 11 facing downward. Inside the test box 100 and above the bottom plate 11, a middle layer 12 and an upper layer 13 are horizontally arranged, and a plurality of temperature sensors are dispersedly arranged on the bottom plate 11, the middle layer 12, and the upper layer 13, respectively.
[0064] Specifically, as a preferred method, in order to more comprehensively detect the temperature changes in each corner of the box, the present application sets a total of 9 temperature sensors in the box. Among them, the first sensor 111, the second sensor 112, and the third sensor 113 are arranged at intervals on the bottom plate 11, the fourth sensor 114, the fifth sensor 115, and the sixth sensor 116 are arranged at intervals on the middle layer 12, and the seventh sensor 117, the eighth sensor 118, and the ninth sensor 119 are arranged at intervals on the upper layer 13.
[0065] More preferably, see Figure 2, taking the temperature sensor distribution of the bottom plate 1 as an example, the first sensor 11 is arranged at the inner left side of the bottom plate 1. For example, the inner wall lengths of the test box 100 along the X-axis and Y-axis directions are a and b respectively, and the distances of the first sensor 11 from the vertex P on the inner left side of the box in the X-axis and Y-axis directions are a / 10 and b / 10 respectively. The second sensor 112 is arranged at the center of the bottom plate 1, and the third sensor 113 is symmetrically distributed with the first sensor 111 relative to the second sensor 112, and is located on the outer right side of the box.
[0066] Similarly, the seventh sensor 117, the eighth sensor 118, and the ninth sensor 119 of the upper layer 13 are distributed at the same positions as the first sensor 111, the second sensor 112, and the third sensor 113 on the bottom plate 11. The fifth sensor 115 is also located at the center of the middle layer 12, and the fourth sensor 114 and the sixth sensor 116 are symmetrically distributed relative to the fifth sensor 115. However, the difference from the bottom plate 1 and the upper layer 13 is that the fourth sensor 114 is located on the left side of the box, and the sixth sensor 116 is located on the right side of the box. That is, the arrangement direction of the temperature sensors of the middle layer 12 intersects with the arrangement direction of the temperature sensors of the bottom plate 1 and the upper layer 13, so that the temperature sensors can be distributed more evenly in the box, which is convenient for detecting the temperature changes in the entire box.
[0067] For the sake of convenience of explanation, the first sensor 111, the fourth sensor 114, and the seventh sensor 117 located on the left side of the box are organized as the first sensor group 101, the second sensor 112, the fifth sensor 115, and the eighth sensor 118 located in the middle are organized as the second sensor group 102, and the third sensor 113, the sixth sensor 116, and the ninth sensor 119 located on the right side of the box are organized as the third sensor group 103.
[0068] It can be seen that the first sensor group 101, the second sensor group 102, and the third sensor group 103 are spaced apart along the X-axis direction as the first direction. At the same time, the multiple temperature sensors in each sensor group are spaced apart along the Z-axis direction as the second direction, for detecting temperature uniformity at different temperatures.
[0069] It is understood that the temperature sensors in the box are not limited to the above 9, and the arrangement of the temperature sensors is not limited to the above method, as long as multiple temperature sensors are distributed in different positions in the box and can detect the temperature changes in the box. However, usually, one temperature sensor is set at the geometric center of the box, that is, the location of the fifth sensor 115, and at least two temperature sensors are set at the edge of the box away from its geometric center, which will not be described in detail here.
[0070] Next, the temperature uniformity in the test box 100 is described. Temperature uniformity refers to the difference between the maximum and minimum values in the measured average values of the temperatures at each sampling point in the space inside the box within a specified time after the test box 100 runs stably. In this embodiment, 9 temperature sensors are respectively set at 9 temperature sampling points, so 9 sets of temperature data will be detected at a specified time interval, and then the temperature average value of each of the 9 sampling points will be obtained. Among these 9 temperature average values, the difference between the maximum and minimum values is observed. The temperature uniformity in the box is specifically expressed by the following formula:
[0071]
[0072] In this embodiment, the temperature variation range in the box is between 5-70°C, the temperature span is relatively large, and the cooling and heating characteristics are inconsistent. The cold air generated in the cooling mode is relatively heavy and will flow to the lower half of the space in the box. The hot air generated in the heating mode is relatively light and will flow to the upper half of the space in the box, both of which will cause differences in the temperature uniformity of the space in the box.
[0073] Next, the setting of the temperature control unit is described in detail.
[0074] See also Figure 3 As an example, a plurality of temperature control units are provided on the inner wall 2 of the test box 100 perpendicular to the bottom plate 11 to achieve different controls according to different temperature zones. Preferably, a total of 6 temperature control units are provided in this embodiment. Specifically, a first temperature control unit group 51 and a second temperature control unit group 52 are arranged at intervals along the Z axis, i.e., in the up and down direction. The first temperature control unit group 51 includes a first temperature control unit 511, a second temperature control unit 512, and a third temperature control unit 513 arranged in sequence along the X axis direction. The second temperature control unit group 52 includes a fourth temperature control unit 524, a fifth temperature control unit 525, and a sixth temperature control unit 526 arranged in sequence along the X axis direction.
[0075] That is, in this embodiment, the six temperature control units are arranged in a manner of three on top and three on the bottom in sequence, and the arrangement direction is the X-axis direction. Further preferably, the first temperature control unit group 51 and the second temperature control unit group 52 are symmetrically distributed in the vertical direction relative to the horizontal center line of the test box 100, and the three temperature control units in each temperature control unit group are symmetrically distributed relative to the vertical center line of the test box 100 as shown in the figure. In addition, each temperature control unit is correspondingly provided with a fan for heat dissipation to ensure that it is in a normal working state.
[0076] It is understood that the actual number of temperature control units is not limited to this, and can be less than or more than 6, at least two of which are arranged at intervals along the X-axis direction. The multiple temperature control units are not limited to being arranged only on the inner wall 2, and can be arranged on other inner walls of the test box 100, or multiple temperature control units are dispersedly arranged on different inner walls of the test box 100. For simplicity, only the illustrated method of being arranged on the inner wall 2 and being spaced apart along the X-axis direction and the Z-axis direction is used as an example for description.
[0077] Temperature control method
[0078] Next, combine Figure 4 The temperature control method will be described. Figure 4 It is a flow chart of temperature control.
[0079] In the sensor arrangement step, temperature sampling points are respectively arranged at different positions of the working space, and a temperature sensor is correspondingly arranged at each of the temperature sampling points to form a sensor group for detecting the temperature in the working space.
[0080] Specifically, as mentioned above, 9 temperature sampling points are set in the box, and 9 temperature sensors are set accordingly, forming the first sensor group 101, the second sensor group 102, and the third sensor group 103 for detecting the temperature in the box. Multiple sensors are distributed at intervals to cover different positions and corners in the box as comprehensively as possible.
[0081] Preferably, the temperature data of each temperature sampling point is collected according to the temperature sampling step. The temperature sampling step is to preset different set temperatures, start the multiple temperature control units, make the temperature of the working space reach each of the set temperatures respectively, and at each of the set temperatures, stably operate the multiple temperature control units for a specified time, and then collect the temperature data of each of the temperature sampling points within a specified time interval through the sensor group.
[0082] Specifically, according to the preset temperature range, for example, within the range of 5°C to 70°C, 5°C is used as the initial set temperature, and then multiple set temperatures are preset according to the gradient of +5°C each time until the highest 70°C is reached, so that a set of set temperature values is obtained. At each set temperature, the first temperature control unit group 51 and / or the second temperature control unit group 52 are started, so that the sampling temperature in the box reaches the set temperature and runs stably for a certain period of time, such as 2 hours, and the temperature data of each temperature sampling point is collected through 9 temperature sensors. Based on the temperature data of these 9 temperature sampling points, a data model of temperature uniformity can be built.
[0083] It can be understood that the gradient of +5°C each time is only a preferred embodiment. The smaller the temperature gradient, the more set temperatures will be preset within a specific temperature range, thereby obtaining more sets of temperature data. The operator can also preset the set temperature at different intervals such as 5°C, 10°C, 20°C, and 35°C, and flexibly adjust the size of the temperature gradient according to actual needs. In addition, after the sampling temperature in the box reaches the set temperature, the stable operation time is not limited to 2 hours, mainly to make the overall temperature in the box tend to be stable, so that the temperature data of each temperature sampling point is more accurate.
[0084] In the power allocation step, different set temperatures are preset. At each set temperature, the power allocation ratio of at least one of the multiple temperature control units is adjusted, and the temperature data of the corresponding temperature sampling points are collected to find the power allocation ratio corresponding to the minimum temperature fluctuation amplitude of the temperature sampling point.
[0085] Specifically, taking the first temperature sampling point T1 where the first sensor 111 is located as an example, under the same set temperature, the power allocation ratio of the corresponding temperature control units in the heating / cooling mode, such as the first temperature control unit 511 / the fourth temperature control unit 524, is adjusted respectively. Suppose the power allocation ratio is Mi, and the temperature uniformity is Si, and the corresponding [Mi, Si] is obtained, and then the corresponding power allocation ratio when the temperature fluctuation amplitude is the smallest can be obtained.
[0086] It should be noted that the temperature uniformity Si of each temperature sampling point preferably satisfies the following formula:
[0087] Si=±(Tmax-Tmin) / 2
[0088] Wherein, Tmax represents the maximum temperature value of the temperature sampling point within the specified time interval, and Tmin represents the minimum temperature value of the temperature sampling point within the specified time interval.
[0089] Preferably, the power distribution ratio of the temperature control unit is set in a manner that the heating mode is low at the top and high at the bottom, and the cooling mode is high at the top and low at the bottom, so as to meet the up and down flow of cold and hot air in the box.
[0090] Exemplarily, according to the above method, the following correspondence table of Mi and Si at different set temperatures is obtained.
[0091] Table 1
[0092] Set temperature(℃) Power distribution ratio Optimum temperature uniformity (℃) 5 M1 S1 10 M2 S2 15 M3 S3 20 M4 S4 25 M5 S5 30 M6 S6 35 M7 S7 40 M8 S8 45 M9 S9 50 M10 S10 55 M11 S11 60 M12 S12 65 M13 S13 70 M14 S14
[0093] Taking the second temperature control unit group 52 in the cooling mode as an example, for example, the power allocation ratio corresponding to the fourth temperature control unit 524, the fifth temperature control unit 525, and the sixth temperature control unit 526 can be [40% 20% 40%], which means that the output power of the fourth temperature control unit 524 is 40% of its maximum power, the output power of the fifth temperature control unit 525 is 20% of its maximum power, and the output power of the sixth temperature control unit 526 is 40% of its maximum power. It can also be understood that when the required total power is constant, the output power of the fourth temperature control unit 524, the fifth temperature control unit 525, and the sixth temperature control unit 526 are respectively a certain proportion of the total power, and at this time, the output power of each temperature control unit can still be converted into a percentage of its own maximum output power.
[0094] In addition, the power regulation of each temperature control unit is mainly achieved by adjusting the voltage. In this embodiment, the voltage of the temperature control unit is adjusted within the range of 0-24V by using the duty cycle 0-100% calculated by fuzzy PID.
[0095] In this embodiment, each temperature sensor corresponds to a temperature sampling point, that is, the first sensor 111 to the ninth sensor 119 correspond to the first temperature sampling point T1 to the ninth temperature sampling point T9 respectively. According to the above power allocation steps, for each temperature sampling point T1 to T9, at the same set temperature, the power allocation ratio of the temperature control unit corresponding to the temperature sampling point is adjusted respectively, and then the power allocation ratio of the temperature control unit corresponding to each temperature sampling point T1 to T9 when the temperature fluctuation is the smallest is obtained. Taking the first temperature sampling point T1 as an example, the following Table 2 can be obtained according to the measured results:
[0096] Table 2
[0097]
[0098] Thus, a power allocation ratio table of the temperature control unit corresponding to the minimum temperature fluctuation of each temperature sampling point T1 to T9 can be constructed, which will not be listed one by one here.
[0099] In this embodiment, the temperature sampling points T1, T4, and T7 on the left are responsible for the power distribution ratio of the temperature control unit on the left (the first temperature control unit 511 / the fourth temperature control unit 524), and the temperature sampling points T1, T4, and T7 correspond to the first sensor group 101 on the left. The temperature sampling points T2, T5, and T8 in the middle are responsible for the power distribution ratio of the temperature control unit in the middle (the second temperature control unit 512 / the fifth temperature control unit 525), and the temperature sampling points T2, T5, and T8 correspond to the second sensor group 102 in the middle. The temperature sampling points T3, T6, and T9 on the right are responsible for the power distribution ratio of the temperature control unit on the right (the third temperature control unit 513 / the sixth temperature control unit 526), and the temperature sampling points T3, T6, and T9 correspond to the third sensor group 103 on the right.
[0100] Taking the set temperature of 5°C as an example, the power allocation ratio corresponding to the first temperature sampling point T1 on the left is MT1_1, the power allocation ratio corresponding to the fourth temperature sampling point T4 is MT4_1, and the power allocation ratio corresponding to the seventh temperature sampling point T7 is MT7_1. The middle value MP1_1 of MT1_1, MT4_1, and MT7_1 is taken as the power allocation ratio of the temperature control unit on the left (the first temperature control unit 511 / the fourth temperature control unit 524).
[0101] Similarly, at the set temperature of 5°C, the power allocation ratio corresponding to the second temperature sampling point T2 in the middle is MT2_1, the power allocation ratio corresponding to the fifth temperature sampling point T5 is MT5_1, and the power allocation ratio corresponding to the eighth temperature sampling point T8 is MT8_1. The middle value MP1_2 of MT2_1, MT5_1, and MT8_1 is taken as the power allocation ratio of the middle temperature control unit (the second temperature control unit 512 / the fifth temperature control unit 525). The power allocation ratio corresponding to the third temperature sampling point T3 on the right is MT3_1, the power allocation ratio corresponding to the sixth temperature sampling point T6 is MT6_1, and the power allocation ratio corresponding to the ninth temperature sampling point T9 is MT9_1. The middle value MP1_3 of MT3_1, MT6_1, and MT9_1 is taken as the power allocation ratio of the temperature control unit on the right (the third temperature control unit 513 / the sixth temperature control unit 526).
[0102] According to the above method, the power allocation ratio corresponding to each set temperature in the full temperature range of 5°C to 70°C at the temperature sampling points T1, T4, and T7 is fitted, the power allocation ratio corresponding to each set temperature in the full temperature range of 5°C to 70°C at the temperature sampling points T2, T5, and T8 is fitted, and the power allocation ratio corresponding to each set temperature in the full temperature range of 5°C to 70°C at the temperature sampling points T3, T6, and T9 is fitted. The fitting formula is:
[0103] Let the equation be:
[0104] f(x)=ax 4 +bx 3 +cx 2 +dx+e
[0105] According to the least squares method, we get the formula:
[0106] ∈=∑(f(x i )-y i ) 2 =∑(ax 4 +bx 3 +cx 2 +dx+ey i ) 2
[0107] Then, according to the multivariate differential equation, we can find the partial derivatives of the four constant terms respectively, that is, solve the equation
[0108]
[0109] Substituting the known data in the power allocation ratio table corresponding to T1 to T9, the sampling value-error curve and the power allocation ratio and preset target value curve can be obtained respectively.
[0110] Among them, the left temperature control unit curve fitting is formula (1):
[0111] y=0.0031x 4 -0.0018x 3 +0.5236x 2 +0.0425x-0.4169∈[0,1] Formula (1)
[0112] The semiconductor curve of the middle side is fitted as formula (2):
[0113] y=0.0024x 4 -0.0024x 3 +0.3586x 2 +0.0335x-0.4354∈[0,1] Formula (2)
[0114] The semiconductor curve on the right is fitted as formula (3):
[0115] y=0.0035x 4 -0.0029x 3 +0.7243x 2 +0.0536x-0.1273∈[0,1] Formula (3)
[0116] The above fitting process essentially establishes a mapping relationship between the set temperature and the power allocation ratio. According to the mapping relationship, the corresponding power allocation ratio is obtained by inputting the set temperature.
[0117] During operation, when the controller receives the corresponding set temperature, it determines the current operating mode. If it is a heating mode, the three temperature control units 511 to 513 in the first temperature control unit group 51 located at the top respectively perform power distribution according to the above formula (1), formula (2), and formula (3); if it is a cooling mode, the three temperature control units 524 to 526 in the second temperature control unit group 52 located at the bottom respectively perform power distribution according to the above formula (1), formula (2), and formula (3).
[0118] In summary, the temperature control method mainly adjusts the output power of the temperature control unit at different set temperatures, and collects the temperature data of the corresponding temperature sampling points to find the corresponding power distribution ratio when the temperature fluctuation is minimum, and then establishes the mapping relationship between the set temperature and the power distribution ratio through data fitting. Therefore, the power distribution ratio of the temperature control unit can be easily obtained by inputting the set temperature, and then the output power of the corresponding temperature control unit is controlled according to the power distribution ratio, so as to ensure the uniformity of the temperature in the box and improve the efficiency of temperature control.
[0119] It should be understood that the specific embodiments described above are only used to explain the present application, and the protection scope of the present application is not limited thereto. Any technical personnel familiar with the technical field can make changes, substitutions, and combinations within the technical scope disclosed in the present application according to the technical solution and inventive concept of the present application, which should be covered by the protection scope of the present application.
Claims
1. A temperature control method for controlling the temperature uniformity of a working space, wherein the working space is provided with a plurality of temperature control units; the temperature control method is characterized in that it comprises the following steps: S1: a sensor arrangement step, in which temperature sampling points are respectively arranged at different positions of the working space, and a temperature sensor is respectively arranged at each temperature sampling point to form a sensor group for detecting the temperature in the working space; S2: a power allocation step, presetting different set temperatures, adjusting the power allocation ratio of at least one of the multiple temperature control units at each set temperature, collecting temperature data of the corresponding temperature sampling points, and finding the power allocation ratio corresponding to the minimum temperature fluctuation amplitude of the temperature sampling point; S3: a data fitting step, based on the power allocation ratio obtained at each set temperature, adopting a data fitting method to establish a mapping relationship between the set temperature and the power allocation ratio.
2. The temperature control method according to claim 1, characterized in that: In the power allocation step, collecting temperature data of the temperature sampling points according to the temperature sampling step; The temperature sampling step is to start the multiple temperature control units to make the temperature of the working space reach each of the set temperatures respectively, and at each of the set temperatures, stably operate the multiple temperature control units for a specified time, and then collect the temperature data of each of the temperature sampling points within a specified time interval through the sensor group.
3. The temperature control method according to claim 1, characterized in that: According to the mapping relationship, the set temperature is input to obtain the corresponding power allocation ratio.
4. The temperature control method according to claim 1, characterized in that: The arrangement direction of the plurality of temperature control units is taken as a first direction, and the sensor group includes a first sensor group, a second sensor group, and a third sensor group which are spaced apart in the first direction.
5. The temperature control method according to claim 4, characterized in that: In a second direction perpendicular to the first direction, the first sensor group, the second sensor group, and the third sensor group respectively include a plurality of temperature sensors distributed at intervals.
6. The temperature control method according to claim 5, characterized in that: One of the temperature sensors is arranged at the geometric center of the working space, and at least two of the temperature sensors are arranged at the edge of the working space away from the geometric center thereof.
7. The temperature control method according to claim 6, characterized in that: In the second direction, the plurality of temperature control units include a first temperature control unit group and a second temperature control unit group which are arranged at intervals and each include a plurality of temperature control units.
8. The temperature control method according to claim 7, characterized in that: In different temperature control modes, the output power of the temperature control units in the first temperature control unit group / the second temperature control unit group is adjusted according to the power allocation ratio obtained from the mapping relationship.
9. The temperature control method according to claim 8, characterized in that: The temperature control mode includes a cooling mode and a heating mode.
10. The temperature control method according to claim 9, characterized in that: The first temperature control unit group includes a first temperature control unit, a second temperature control unit, and a third temperature control unit arranged along the first direction; The second temperature control unit group includes a fourth temperature control unit, a fifth temperature control unit, and a sixth temperature control unit arranged along the first direction.
11. A temperature control system for controlling the temperature uniformity of a working space, wherein: The working space is provided with multiple temperature control units and multiple temperature sensors; the temperature control system controls the output power of at least one of the multiple temperature control units according to the power allocation ratio in accordance with the temperature control method described in any one of claims 1-10.