Chip mounting rotating mechanism, chip mounter and chip mounting method

Abstract

The invention discloses a chip mounting rotating mechanism, a chip mounter and a chip mounting method, and belongs to the technical field of semiconductor chip mounting. Comprising a working frame and a chip mounting assembly, the chip mounting assembly comprises an adsorption part, and the adsorption part is communicated with external gas equipment through a gas circuit structure; the rotating assembly is connected to one side of the working frame, and the rotating assembly is used for driving the adsorption part to rotate; the patch assembly further comprises a first connecting piece used for being connected with the adsorption piece, and a second connecting piece used for being connected with the adsorption piece. The second connecting piece is used for being connected with a lifting mechanism; and when the lifting mechanism drives the base material adsorbed by the adsorption piece to abut against the base plate, the second connecting piece can slide relative to the first connecting piece. According to the technical scheme, through the sliding effect of the first connecting piece and the second connecting piece, the adsorption piece can apply a relatively constant pressure to the base material after being in contact with the base material, the height difference of different base material thicknesses is counteracted, and the problem that the chip mounter is not convenient to use due to the influence of the thickness of the semiconductor base material is solved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor chip mounting technology, and more specifically, to a chip mounting rotation mechanism, a chip mounting machine and a chip mounting method. Background Art

[0002] Semiconductor bonding is a technology that attaches a semiconductor substrate to a substrate and protects and fixes it through packaging; this technology is mainly used in the manufacturing process of integrated circuits to ensure that the substrate can work stably and connect with other electronic components.

[0003] In the related art, when the semiconductor substrate is mounted, the substrate is adsorbed by a suction nozzle, and the semiconductor is driven to adjust the mounting angle by rotating the suction nozzle. In order to prevent the air tube from twisting and winding when the suction nozzle rotates, for example, the patent with the prior art publication number CN118352279A provides a mounting rotation mechanism, a mounting device, and a chip loading machine. The device enables the air tube to be connected to the suction nozzle through the mounting rotation mechanism, thereby avoiding the influence of the rotation of the suction nozzle mounting rod on the air tube, and also avoiding the deformation of the air tube reacting on the suction nozzle mounting rod, avoiding the influence of the air tube on the movement of the suction nozzle mounting rod, thereby improving the accuracy and stability of the movement of the suction nozzle mounting rod, and also improving the service life of the air tube.

[0004] Although the above-mentioned prior art solution can achieve the effect that the rotation of the suction nozzle and the air tube do not affect each other by connecting the air tube and the suction nozzle through the patch rotating mechanism, in order to ensure that the suction nozzle can adsorb and bond the substrate, it is necessary to control the suction start and stop action of the air tube according to the moving distance of the air nozzle during the adsorption and bonding process. For substrates of different thicknesses, the moving distance of the suction nozzle will also change accordingly. Therefore, before each bonding, the control program of the placement machine needs to be re-adjusted according to the thickness of the substrate. Therefore, the placement machine is affected by the thickness of the semiconductor substrate and is not convenient to use.

[0005] In view of this, we propose a patch rotation mechanism, a patch machine and a patch method. Summary of the invention

[0006] The purpose of the present application is to provide a chip rotation mechanism, a chip mounter and a chip mount method, which solve the technical problem that the chip mounter is inconvenient to use due to the influence of the thickness of the semiconductor substrate, and achieve the technical effect of adapting to the bonding of substrates of different thicknesses without debugging the chip mounter control program.

[0007] One aspect of the present application provides a patch rotation mechanism, comprising: A working frame, used for installation and support of various components, and the working frame can be arranged on one side of the substrate fixing mechanism in the working state; A patch assembly is connected to one side of the workbench, and the patch assembly includes an adsorbent, which is connected to an external gas device through an air path structure, and the adsorbent can adsorb and release the substrate in cooperation with the external gas device; A rotating assembly connected to one side of the working frame, the rotating assembly is used to drive the adsorption member to rotate; Wherein, the patch component also includes: A first connecting member, used to connect with the adsorption member; The second connecting member is used to be connected to a lifting mechanism, and the second connecting member is connected to the first connecting member; and when the lifting mechanism drives the substrate adsorbed by the adsorbent to contact the base plate, the first connecting member can slide relative to the second connecting member.

[0008] Preferably, a cavity is provided inside the first connecting member, and the cavity is communicated with the gas path structure; The patch assembly further comprises a first sealing structure disposed on the outer side of the first connecting member, wherein the inner side of the first sealing structure is slidably disposed on the outer side of the second connecting member; The outer side of the first sealing structure is connected to the first connecting member, and the first sealing structure can seal one end of the cavity.

[0009] Preferably, the patch assembly further comprises: A communication hole is provided on the outer side of the first connecting member, and the communication hole extends to the cavity; The second sealing structure is arranged on the outer side of the connecting piece, and the second sealing structure can block the communicating hole in the first state, and the second sealing structure can make the cavity communicate with the outside through the communicating hole in the second state.

[0010] Preferably, the second sealing structure comprises a sealing body, and in the first state, the sealing body is embedded in the communicating hole; The sealing body is driven to move along the communicating hole and switch to a second state, so that the cavity is communicated with the outside of the first connecting member.

[0011] Preferably, a pressure-bearing surface is provided on a side of the sealing body facing the cavity, and in the first state, the pressure-bearing surface extends into the cavity; The second sealing structure further comprises a moving member movably disposed in the cavity, wherein the shape of the moving member is adapted to the cavity; An extrusion surface is arranged on one side of the moving member corresponding to the pressure-bearing surface. When the moving member moves in the cavity, the extrusion surface contacts and is pressed against the pressure-bearing surface of the sealing body.

[0012] Preferably, the sealing body is connected to one side of the first connecting member through a first elastic member; The moving member is arranged in the cavity through a second elastic member.

[0013] Preferably, the patch assembly further comprises a pressing structure disposed in the cavity; Wherein, the pressing structure comprises: A lower pressing plate connected to the bottom end of the second connecting member; A driving member, disposed on a side of the lower pressing plate facing the inner wall of the cavity; A guide member is arranged in the cavity and connected to the first connecting member, and the guide member includes a guide surface arranged corresponding to the driving member; when the first connecting member rotates, the guide surface can drive the driving member from a first relative position with the first connecting member to a second relative position with the first connecting member.

[0014] Preferably, the rotating assembly includes a power member, and the second connecting member is transmission-connected to one side of the power member.

[0015] Another aspect of the present application provides a chip mounter, comprising the aforementioned chip rotation mechanism, and further comprising: Workbench, providing a carrier for patch work; A substrate fixing mechanism, arranged on one side of the workbench, for fixing the substrate to be mounted; A lateral movement mechanism, arranged at the top of the workbench, for driving the patch rotation mechanism to move lateral to the workbench; The longitudinal moving mechanism is arranged at the top of the workbench and is used to drive the patch rotating mechanism to move along the longitudinal direction of the workbench.

[0016] The third aspect of the present application discloses a chip placement method of the aforementioned chip placement machine, comprising: The lateral moving mechanism and / or the longitudinal moving mechanism drives the patch rotating mechanism to move along the workbench until the adsorption member is aligned with the substrate to be bonded; The adsorption member is driven by the lifting mechanism to move longitudinally until it contacts the top of the substrate to adsorb the substrate; The adsorption member is driven by the driving component to adjust the angle of the substrate so as to make it fit with the base plate; The lateral moving mechanism and / or the longitudinal moving mechanism drives the laminating rotating mechanism to move along the workbench to a laminating position corresponding to the position where the substrate adsorbed by the adsorbent is aligned with the substrate; The adsorption member is driven by the lifting mechanism to move longitudinally until the substrate contacts the corresponding bonding position of the base plate; The adsorption member is continuously driven by the lifting mechanism until the substrate is pressed against the bonding position corresponding to the base plate, and at this time, the first connecting member moves relative to the second connecting member.

[0017] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages: (1) The present application adopts a patch assembly. Through the sliding effect of the first connecting member and the second connecting member, the adsorbent can apply a relatively constant pressure to the substrate after contacting the substrate, thereby offsetting the height difference of different substrate thicknesses, thereby solving the problem that the placement machine is inconvenient to use due to the influence of the thickness of the semiconductor substrate, and thus achieving the technical effect of adapting to the bonding of substrates of different thicknesses without debugging the placement machine control program.

[0018] (2) By setting a first sealing structure on the top of the first connecting member, the present application can enable the first connecting member to maintain a sealed state inside while moving and rotating, which is beneficial to the stability of the device's function of adsorbing the substrate and ensures the stability of the device during use.

[0019] (3) By setting a second sealing structure inside the first connecting member, the present application can realize the function of automatic deflation through the movement of the first connecting member, so that the adsorption member releases the fixation of the substrate, thereby improving the practicality of the device and improving the use effect of the device.

[0020] (4) The present application provides a rotating component on one side of the patch component to drive the patch component to rotate, so that the adsorbent drives the substrate to rotate and adjusts the angle of the substrate when patching, thereby increasing the practicality of the device and improving the use effect of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the overall structure of the patch rotation mechanism disclosed in the embodiment of the present application; Figure 2 It is a schematic diagram of the structure of the working frame in the patch rotating mechanism disclosed in the embodiment of the present application; Figure 3 It is a structural schematic diagram of a patch assembly in a patch rotation mechanism disclosed in an embodiment of the present application; Figure 4 It is a schematic diagram of the assembly structure of the pressing structure and the second sealing structure in the patch rotating mechanism disclosed in the embodiment of the present application; Figure 5 It is a structural schematic diagram of the adsorption slot in the patch rotation mechanism disclosed in the embodiment of the present application; Figure 6 It is a structural schematic diagram of a moving part in a patch rotation mechanism disclosed in an embodiment of the present application; Figure 7 A schematic diagram of the internal structure of the connecting hole in the patch rotating mechanism disclosed in the embodiment of the present application; Figure 8 It is a structural schematic diagram of a rotating component in a patch rotating mechanism disclosed in an embodiment of the present application; Fig. 9 It is a structural schematic diagram of the first transmission component in the patch rotation mechanism disclosed in the embodiment of the present application; Fig.10 It is a schematic diagram of the assembly structure of the replacement component and the second transmission component in the patch rotation mechanism disclosed in the embodiment of the present application; Fig.11 This is a schematic diagram of the cooperation between the driving member and the guiding member in the patch rotating mechanism disclosed in the embodiment of the present application.

[0022] Description of the numbers in the figure: 100. Work stand; 200, patch assembly; 210, adsorption member; 211, adsorption groove; 220, first connecting member; 230, second connecting member; 221, cavity; 240, air path structure; 250, first sealing structure; 251, sealing ring; 252, sealing sleeve; 260, pressing structure; 261, pressing plate; 262, driving member; 263, guiding member; 2631, guiding surface; 270, second sealing structure; 271, moving member; 2711, extrusion surface; 272, second elastic member; 2721, connecting ring; 273, sealing body; 274, first elastic member; 275, protective shell; 280, connecting hole; 300, rotating assembly; 310, power member; 320, first transmission rod; 330, first one-way mechanism; 340, sliding ring; 350, driving rod; 400, first transmission assembly; 410, connecting plate; 420, lifting plate; 430, supporting frame; 500, replacement component; 510, rotating table; 520, placement opening; 530, notch; 600, second transmission assembly; 610, second transmission rod; 620, second one-way mechanism; 630, transmission column; 700. Lifting mechanism. DETAILED DESCRIPTION

[0023] The present application is further described in detail below in conjunction with the accompanying drawings.

[0024] Reference Figure 1 , Figure 2 and Figure 3The present application embodiment discloses a patch rotating mechanism, including a workbench 100, a patch assembly 200 is arranged on the outside of the workbench 100, and is used to adsorb the substrate and attach the substrate to the top of the substrate. The patch assembly 200 includes an adsorbent 210, and a first connecting member 220 and a second connecting member 230 are arranged on the top of the adsorbent 210; wherein the first connecting member 220 slides on the second connecting member 230, and the patch assembly 200 also includes an air path structure 240, and the air path structure 240, the second connecting member 230, the first connecting member 220 and the adsorbent 210 are connected. A connected air path channel can be formed in the middle part, and when the other side of the air path structure 240 is connected to the external gas equipment, it can provide suction for the adsorbent 210. A rotating assembly 300 is provided on the inner side of the working frame 100, and the rotating assembly 300 is used to drive the adsorbent 210 to rotate the substrate to an angle that matches the position to be bonded on the substrate. A first transmission assembly 400 is provided on the top of the patch assembly 200, and the first transmission assembly 400 is connected to the patch assembly 200 to drive the patch assembly 200 to rise and fall to realize the adsorption of the substrate by the adsorbent 210 and the patch work after adsorption.

[0025] In the above technical scheme, when adsorbing the substrate, the first transmission component 400 drives the patch component 200 to descend, so that the adsorption component 210 adsorbs the substrate, and then the first transmission component 400 drives the patch component 200 to rise; then the patch component 200 is driven to rotate by the rotating component 300, so that the substrate is rotated to an angular position that is compatible with the position to be bonded, which is convenient for subsequent patch work.

[0026] By sliding the first connecting member 220 on the second connecting member 230, the bottom of the adsorption member 210 can apply a relatively constant pressure to the substrate after contacting the substrate to offset the height difference of different substrate thicknesses, so that the substrate and the adsorption member 210 can be closely fitted when the substrate is adsorbed; at the same time, it is also beneficial for the adsorption member 210 to apply a relatively constant fitting pressure to the substrate during chip mounting so that the substrate can be better fitted on the substrate, which solves the technical problem that the chip mounter is inconvenient to use due to the influence of the thickness of the semiconductor substrate, and achieves the technical effect of adapting to the fitting of substrates of different thicknesses without debugging the control program of the chip mounter.

[0027] Reference Figure 1 , Figure 3 and Figure 4The first connector 220 is provided with a cavity 221 on the inner side thereof, and the cavity 221 is communicated with the air path structure 240. The patch assembly 200 further includes a first sealing structure 250 for sealing the first connector 220. The first sealing structure 250 can ensure the sealing of one side of the cavity 221 to ensure the normal adsorption function of the adsorbent 210. The bottom of the first sealing structure 250 is provided with a pressing structure 260 for controlling the operation of the second sealing structure 270. The outer side of the first connector 220 is provided with a communicating hole 280, and the second sealing structure 270 is arranged at the communicating hole 280. 0; wherein, the second sealing structure 270 can seal the cavity 221 during the adsorption and patch process to ensure the normal progress of the adsorption and patch process. When explaining the embodiment of the present application, this state of the second sealing structure 270 is defined as the first state. After the patch is completed, the cavity 221 can be connected with the outside of the first connecting member 220 through the connecting hole 280 to allow gas to enter the cavity 221. When explaining the embodiment of the present application, this state of the second sealing structure 270 is defined as the second state, so that the adsorption member 210 releases the adsorption of the substrate.

[0028] In the above technical solution, when the substrate is adsorbed, under the action of the first sealing structure 250 and the second sealing structure 270, the internal cavity 221 of the first connecting member 220 is in a sealed state, so that the adsorbent 210 can adsorb the substrate under the action of external gas equipment; when the patch is completed, the second sealing structure 270 can be driven to operate by the descent of the downward pressure structure 260, so that the gas in the working environment can enter the cavity 221 through the connecting hole 280, so that the cavity 221 of the first connecting member 220 is automatically released from the sealed state, thereby allowing the adsorbent 210 to release the adsorption of the substrate, preventing the adsorbent 210 from sucking away the bonded substrate again.

[0029] In a specific scenario, refer to Figure 3 and Figure 4 The first sealing structure 250 includes a sealing ring 251, the inner side of the sealing ring 251 is slidably arranged with the second connecting member 230, the outer side of the sealing ring 251 is rotatably arranged with the top of the first connecting member 220, and a sealing sleeve 252 is fixedly arranged at the bottom of the sealing ring 251, and the sealing sleeve 252 is connected to the top of the first connecting member 220.

[0030] The sealing ring 251 can enable the first connecting member 220 and the second connecting member 230 to be slidably arranged, thereby ensuring that the device is suitable for substrates of different thicknesses. The sealing sleeve 252 can improve the sealing effect of the top of the first connecting member 220 .

[0031] Reference Figure 3 and Figure 4The pressing structure 260 includes a pressing plate 261, a driving member 262 is fixedly provided on the outer side of the pressing plate 261, a guiding member 263 is provided on one side of the driving member 262, the bottom of the guiding member 263 is fixedly provided on the inner side of the first connecting member 220, wherein the guiding member 263 and the driving member 262 are correspondingly provided with guiding surfaces 2631, and when the first connecting member 220 rotates, the guiding surface 2631 can drive the driving member 262 from a first relative position to the first connecting member 220 to a second relative position to the first connecting member 220.

[0032] Among them, refer to Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 The second sealing structure 270 includes a moving member 271, a second elastic member 272 is fixedly connected to the bottom of the moving member 271, a connecting ring 2721 is fixedly arranged at the bottom of the second elastic member 272, the bottom of the connecting ring 2721 is fixedly arranged with the inner side of the first connecting member 220, an extrusion surface 2711 is arranged at the bottom of the moving member 271, a sealing body 273 is arranged at the outer side of the extrusion surface 2711 corresponding to the connecting hole 280, and the sealing body 273 can seal the connecting hole 280 to seal the inner cavity of the first connecting member 220; A first elastic member 274 is disposed on the outer side of the sealing body 273 . The bottom of the first elastic member 274 is fixedly disposed on the outer side of the first connecting member 220 . A protective shell 275 is also fixedly disposed on the outer side of the first connecting member 220 .

[0033] It is understandable that in the above explanation, the first elastic member 274 is a connecting member made of a material with good resilience, such as a magnesium alloy, a copper alloy, etc., one end of which is connected to the outside of the first connecting member 220, and the other end of which is fixedly connected to the sealing body 273. The sealing body 273 is a spherical body that can move in the connecting hole 280.

[0034] In the above scheme, when the downward pressing structure 260 moves, it can drive the moving part 271 to descend, so that the extrusion surface 2711 squeezes the corresponding sealing body 273, so that a gap is generated between the sealing body 273 and the corresponding connecting hole 280, so that the gas enters the cavity 221 to release the substrate adsorbed by the adsorption part 210; when resetting, since the downward pressing structure 260 releases the squeezing of the moving part 271, the moving part 271 is reset under the elastic effect of the second elastic part 272, and the first elastic part 274 squeezes the corresponding sealing body 273, so that the sealing body 273 seals the corresponding connecting hole 280.

[0035] It can be understood that the second elastic member 272 is arranged so that the movable member 271 can be deformed when it is pressed to adapt to the movement of the movable member 271; when the pressing structure 260 no longer contacts the top of the movable member 271, the movable member 271 can be reset under the action of the second elastic member 272. Therefore, in the actual working process, the second elastic member 272 can be selected from elastic members with deformation and recovery functions, such as silicone pads, pneumatic members, and the like. Figure 6 Springs etc. shown.

[0036] In the above technical solution, combined with the accompanying drawings of the specification Fig.11 As shown, when the driving member 262 moves along the top of the moving member 271 to just contact the guide surface 2631, the relative position of the driving member 262 and the first connecting member 220 is defined as the first relative position; when the driving member 262 is relatively located at the highest point of the guide surface 2631, the relative position of the driving member 262 and the first connecting member 220 is defined as the second relative position.

[0037] In the above technical solution, the position of the first connecting member 220 is positioned at its initial position (i.e. Fig.11 The first transmission assembly 400 drives the second connecting member 230 to descend during adsorption, which can drive the pressing structure 260 to descend as a whole. After the adsorption member 210 contacts the substrate, the first transmission assembly 400 continues to operate, and the first connecting member 220 moves upward relative to the second connecting member 230. At this time, the pressing plate 261 is still some distance away from the second sealing structure 270. Then, the first transmission assembly 400 drives the second connecting member 230 and the first connecting member 220 to rise, and the rotating assembly 300 drives the first connecting member 220 to move upward. Fig.11 The substrate 260 rotates in the direction of the arrow shown in the figure (the rotation direction of the power member 310 described later is the positive direction in this rotation mode). During this process, the driving member 262 does not contact the guiding member 263, that is, the second connecting member 230 and the first connecting member 220 do not move relative to each other. Only the angle of the substrate is adjusted so that the angle of the substrate matches the bonding position on the substrate, which is convenient for the subsequent patch work. The first transmission component 400 drives the first connection member 220 and the second connection member 230 to descend again for patching. During the patching, the adsorption member 210 first drives the substrate to move to the top of the base plate until the substrate is attached to the corresponding attachment position. Then, the first transmission component 400 drives the second connection member 230 to continue to descend. At this time, the first connection member 220 moves relative to the second connection member 230 until the lower pressing plate 261 contacts the second sealing structure 270, so that the second sealing structure 270 releases the seal of the connecting hole 280, so as to release the adsorption of the substrate by the adsorption member 210. The first transmission assembly 400 drives the first connecting member 220 and the second connecting member 230 to rise and reset; The rotating assembly 300 drives the first connecting member 220 to rotate (still according to Fig.11 The guide member 263 rotates to the driving member 262, and as the first connecting member 220 continues to rotate, the driving member 262 moves from the first relative position to the second relative position, so that the second connecting member 230 and the first connecting member 220 move relative to each other, so that the first connecting member 220 moves to the initial position (i.e. Fig.11 for the next adsorption.

[0038] Reference Figure 1 and Figure 8 The rotating assembly 300 includes a power member 310, which is fixedly arranged on one side of the work frame 100. A first transmission rod 320 is fixedly arranged on one driving end of the power member 310. The first transmission rod 320 is transmission-connected to the first connecting member 220 via a first one-way mechanism 330. Specifically, a first gear is fixedly disposed on the top of the first transmission rod 320, a second gear is meshedly disposed on the outer side of the first gear, a first one-way mechanism 330 is disposed on the inner side of the second gear, and an outer ring of the first one-way mechanism 330 is fixedly disposed on the inner side of the second gear; A sliding ring 340 is fixedly provided on the inner ring of the first one-way mechanism 330, a driving rod 350 is slidingly provided on the inner side of the sliding ring 340, a tooth column is fixedly provided on the bottom of the driving rod 350, and a plurality of tooth blocks are fixedly provided on the outer side of the first connecting member 220, and the plurality of tooth blocks mesh with the tooth column.

[0039] The power member 310 drives the first transmission rod 320 to rotate in the positive direction, thereby driving the first gear to rotate, and the first gear drives the second gear to rotate. Under the unidirectional effect of the first unidirectional mechanism 330, the driving rod 350 is driven to rotate, thereby driving the gear column to rotate, and the gear column engages with multiple gear blocks to drive the first connecting member 220 to rotate.

[0040] Reference Figure 1 and Fig. 9 The first transmission assembly 400 includes two connecting plates 410, and the two connecting plates 410 are fixedly connected with a lifting plate 420. One side of the lifting plate 420 is fixedly set with the top of the second connecting member 230, and the other side of the lifting plate 420 is fixedly set with a support frame 430. The support frame 430 is used to support the gear column, and one side of the support frame 430 is slidably set with the other side of the support frame 430.

[0041] By lifting and lowering the connecting plate 410, the lifting plate 420 can be driven to lift and lower, thereby driving the supporting frame 430 and the patch assembly 200 to lift and lower, thereby ensuring the lifting effect of the equipment.

[0042] Reference Figure 1 , Figure 5 and Fig.10 A replacement component 500 is provided at the bottom of the patch component 200, which is used for replacing the adsorption component 210 of the device. The replacement component 500 is linked with the power component 310 through the second transmission component 600. The replacement component 500 includes two rotating tables 510. The inner sides of the two rotating tables 510 are provided with multiple groups of placement openings 520 matching the adsorption component 210. One side of the two rotating tables 510 is located at the bottom of the patch component 200 and a notch 530 is provided. The bottom of the first connecting member 220 is provided with an adsorption groove 211, and the adsorption groove 211 is electromagnetically adsorbed and connected to the adsorption component 210.

[0043] When the adsorbent 210 needs to be replaced, first rotate the placement port 520 where the new adsorbent 210 is not placed to the bottom of the patch assembly 200, so that the adsorption groove 211 releases the electromagnetic adsorption of the adsorbent 210, and the adsorbent 210 falls into the empty placement port 520, and then rotate the rotating table 510 to make the adsorption groove 211 adsorb the new adsorbent 210, completing the operation of replacing the adsorbent 210 of the equipment.

[0044] Reference Figure 1 and Fig.10 The second transmission assembly 600 includes a second transmission rod 610, the top of the second transmission rod 610 is fixedly arranged on the driving end of the power member 310, a third gear is fixedly arranged on the bottom of the second transmission rod 610, a fourth gear is meshedly arranged on the outer side of the third gear, a second one-way mechanism 620 is arranged inside the fourth gear, the outer ring of the second one-way mechanism 620 is fixedly arranged on the inner side of the fourth gear, a transmission column 630 is fixedly arranged on the inner ring of the second one-way mechanism 620, and the outer side of the transmission column 630 is fixedly arranged on the two rotating tables 510.

[0045] In the above technical solution, the power member 310 runs in the reverse direction (with Fig.11 The second transmission rod 610 is driven to rotate, thereby driving the third gear and the fourth gear to rotate. Under the unidirectional effect of the second unidirectional mechanism 620, the transmission column 630 is driven to rotate, thereby driving the two rotating tables 510 to rotate, completing the linkage effect of the rotating table 510 and the power part 310.

[0046] The embodiment of the present application discloses a patch machine, including the above-mentioned patch rotating mechanism, and also includes a workbench to provide a carrier for the patch work; a substrate fixing mechanism, which is arranged on one side of the workbench and is used to fix the substrate to be patched; a lateral moving mechanism, which is configured at the top of the workbench and is used to drive the patch rotating mechanism to move horizontally along the workbench; and a longitudinal moving mechanism, which is configured at the top of the workbench and is used to drive the patch rotating mechanism to move longitudinally along the workbench.

[0047] The workbench, substrate fixing mechanism, lateral movement mechanism and longitudinal movement in the above technical scheme can all adopt mechanisms in the existing technology; the substrate fixing mechanism can be a clamp that can realize substrate fixing, and the lateral movement mechanism and longitudinal movement mechanism can be mechanisms such as linear guides that can drive the patch rotating mechanism to move horizontally and vertically along the workbench; wherein the moving directions of the lateral movement mechanism and the longitudinal movement mechanism are perpendicular to the surface where the workbench is located.

[0048] The patch methods involved in the above patch mechanism are: The lateral moving mechanism and / or the longitudinal moving mechanism drives the patch rotating mechanism to move along the workbench until the adsorption member 210 is aligned with the substrate to be bonded; The adsorption member 210 is driven by the lifting mechanism 700 to move longitudinally until it contacts the top of the substrate to adsorb the substrate; The adsorption member 210 is driven by the driving assembly to adjust the angle of the substrate so as to make it fit with the base plate; The lateral moving mechanism and / or the longitudinal moving mechanism drives the laminating rotating mechanism to move along the workbench to a laminating position corresponding to the position where the substrate adsorbed by the adsorbent 210 is aligned with the substrate; The adsorption member 210 is driven by the lifting mechanism 700 to move in the longitudinal direction until the substrate contacts the corresponding bonding position of the base plate; The suction member 210 is continuously driven by the lifting mechanism 700 until the substrate is pressed against the bonding position corresponding to the base plate. At this time, the first connecting member 220 moves relative to the second connecting member 230 .

[0049] In summary, when the patch rotating mechanism disclosed in the embodiment of the present application is used: Adsorbing the substrate: The lifting mechanism 700 drives the connecting plate 410 to descend, which can drive the lifting plate 420 to descend, thereby driving the support frame 430 and the patch assembly 200 to descend, so that the adsorbent 210 contacts the substrate for adsorption; After the adsorbent 210 contacts the substrate, the first transmission assembly 400 continues to operate, so that the first connecting member 220 slides relative to the second connecting member 230. After the bottom of the adsorbent 210 contacts the substrate, it can apply a relatively constant pressure to the substrate, which can offset the height difference of different substrate thicknesses, and is conducive to the substrate and the adsorbent 210 to fit closely. Then the lifting mechanism 700 drives the adsorption member 210 to rise.

[0050] During patching: the connection plate 410 descends, driving the lifting plate 420 to descend, thereby driving the support frame 430 and the patch assembly 200 to descend, allowing the adsorption component 210 to perform patching. When the substrate contacts the substrate, the first transmission assembly 400 continues to operate to allow the first connection component 220 to slide relative to the second connection component 230, which is beneficial for the adsorption component 210 to apply a relatively constant fitting pressure to the substrate, and the lower pressure plate 261 can press down the moving part 271, so that the extrusion surface 2711 squeezes the sealing body 273, so that a gap is generated between the sealing body 273 and the corresponding connecting hole 280, so that air can enter the first connection component 220, thereby releasing the adsorption of the substrate by the adsorption component 210.

[0051] When the first connecting member 220 is reset: The first transmission assembly 400 drives the first connecting member 220 and the second connecting member 230 to rise and reset; The rotating assembly 300 drives the first connecting member 220 to rotate, so that the guide member 263 rotates to the driving member 262, and as the first connecting member 220 continues to rotate, the driving member 262 moves from the first relative position to the second relative position, so that the second connecting member 230 and the first connecting member 220 move relative to each other, so that the first connecting member 220 moves to the initial position for the next adsorption.

Claims

1. The patch rotating mechanism is characterized by: include: A working frame (100) is used for installing and supporting various components. In a working state, the working frame (100) can be arranged on one side of the substrate fixing mechanism; A patch assembly (200) is connected to one side of the work frame (100), the patch assembly (200) comprising an adsorbent (210), the adsorbent (210) being connected to an external gas device via an air path structure (240), and the adsorbent (210) being able to adsorb and release a substrate in cooperation with the external gas device; A rotating assembly (300) connected to one side of the working frame (100), the rotating assembly (300) being used to drive the adsorption component (210) to rotate; Wherein, the patch assembly (200) further comprises: A first connecting member (220), used for connecting to the adsorption member (210); The second connecting member (230) is used to be connected to a lifting mechanism (700), and the second connecting member (230) is connected to the first connecting member (220); and when the lifting mechanism (700) drives the substrate adsorbed by the adsorption member (210) to contact the base plate, the first connecting member (220) can slide relative to the second connecting member (230).

2. The patch rotation mechanism according to claim 1, characterized in that: A cavity (221) is provided inside the first connecting member (220), and the cavity (221) is in communication with the gas path structure (240); The patch assembly (200) further comprises a first sealing structure (250) arranged on the outside of the first connecting member (220), the inner side of the first sealing structure (250) being slidably arranged on the outer side of the second connecting member (230); Furthermore, the outer side of the first sealing structure (250) is connected to the first connecting member (220), and the first sealing structure (250) is capable of sealing one end of the cavity (221).

3. The patch rotation mechanism according to claim 2, characterized in that: The patch assembly (200) further includes: A communication hole (280) is formed on the outer side of the first connecting member (220), and the communication hole (280) extends to the cavity (221); The second sealing structure (270) is arranged on the outside of the first connecting member (220), and the second sealing structure (270) is capable of blocking the connecting hole (280) in the first state, and the second sealing structure (270) is capable of allowing the cavity (221) to communicate with the outside through the connecting hole (280) in the second state.

4. The patch rotating mechanism according to claim 3, characterized in that: The second sealing structure (270) comprises a sealing body (273), and in a first state, the sealing body (273) is embedded in the communicating hole (280); The sealing body (273) is driven to move along the communicating hole (280) and switch to a second state, so that the cavity (221) is communicated with the outside of the first connecting member (220).

5. The patch rotating mechanism according to claim 4, characterized in that: A pressure-bearing surface is provided on a side of the sealing body (273) facing the cavity (221), and in a first state, the pressure-bearing surface extends into the cavity (221); The second sealing structure (270) further comprises a moving member (271) movably disposed in the cavity (221), wherein the shape of the moving member (271) is adapted to the cavity (221); An extrusion surface (2711) is provided on one side of the moving member (271) corresponding to the pressure-bearing surface; when the moving member (271) moves in the cavity (221), the extrusion surface (2711) contacts and presses the pressure-bearing surface of the sealing body (273).

6. The patch rotating mechanism according to claim 5, characterized in that: The sealing body (273) is connected to one side of the first connecting member (220) via a first elastic member (274); The moving member (271) is arranged in the cavity (221) via a second elastic member (272).

7. The patch rotating mechanism according to claim 2, characterized in that: The patch assembly (200) further comprises a pressing structure (260) arranged in the cavity (221); Wherein, the pressing structure (260) comprises: A lower pressing plate (261) connected to the bottom end of the second connecting member (230); A driving member (262) is arranged on a side of the lower pressing plate (261) facing the inner wall of the cavity (221); A guide member (263) is arranged in the cavity (221) and connected to the first connecting member (220), and the guide member (263) includes a guide surface (2631) arranged corresponding to the driving member (262); when the first connecting member (220) rotates, the guide surface (2631) can drive the driving member (262) from a first relative position to the first connecting member (220) to a second relative position to the first connecting member (220).

8. The patch rotating mechanism according to claim 7, characterized in that: The rotating assembly (300) comprises a power member (310), and the second connecting member (230) is drivingly connected to one side of the power member (310).

9. A chip mounter, characterized in that: The patch rotating mechanism comprises the patch rotating mechanism according to any one of claims 1 to 8, further comprising: Workbench, providing a carrier for patch work; A substrate fixing mechanism, arranged on one side of the workbench, for fixing the substrate to be mounted; A lateral movement mechanism, arranged at the top of the workbench, for driving the patch rotation mechanism to move lateral to the workbench; The longitudinal moving mechanism is arranged at the top of the workbench and is used to drive the patch rotating mechanism to move along the longitudinal direction of the workbench.

10. The chip placement method of the chip placement machine according to claim 9, characterized in that: include: The lateral moving mechanism and / or the longitudinal moving mechanism drives the patch rotating mechanism to move along the workbench until the adsorption member (210) is aligned with the substrate to be bonded; The adsorption member (210) is driven by the lifting mechanism (700) to move in the longitudinal direction until it contacts the top of the substrate to adsorb the substrate; The adsorption member (210) is driven by the driving component to adjust the angle of the substrate so as to make it fit with the base plate; The lateral moving mechanism and / or the longitudinal moving mechanism drives the laminating rotating mechanism to move along the workbench to a laminating position corresponding to the position where the substrate adsorbed by the adsorbing member (210) is aligned with the substrate; The adsorption member (210) is driven by the lifting mechanism (700) to move in the longitudinal direction until the substrate contacts the corresponding bonding position of the base plate; The adsorption member (210) continues to be driven by the lifting mechanism (700) until the substrate is pressed against a corresponding bonding position of the base plate, and at this time, the first connection member (220) moves relative to the second connection member (230).

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