Electronic component bonding device

Abstract

The invention provides an electronic component bonding device capable of bonding a chip to a substrate at a high speed and with high precision without damaging the chip. An electronic component bonding device (1) is provided with a first camera (80), a second camera (81), a third camera (82), and a fourth camera (83). The fourth camera recognizes the pick-up nozzles 42, 62 after recognizing the recognition marks 49, 69 on the pick-up head 40 and the bonding head 60, and determines the coordinate differences of the pick-up nozzles 42, 62 with respect to the recognition marks 49, 69. The position of the pick-up nozzle 42, 62 is determined from the coordinate difference. A pick-up head 40 picks up a chip 20 from a wafer stage 10 and transfers the chip 20 to a pre-alignment stage 30. The bonding head 60 picks up the chip 20 from the pre-alignment stage 30, conveys the chip 20 to a substrate stage, and bonds the chip 20 to a substrate 70.

Description

Technical Field

[0001] The present invention relates to an electronic component bonding device. Background Art

[0002] An electronic component bonding device is a device that uses a nozzle to absorb a chip such as a semiconductor chip from a chip supply device and bonds it to a specified position on a substrate. In recent years, the chips to be bonded have gradually become smaller and thinner, for example, one side of a plane is less than 1 mm and the thickness is several tens of μm. Therefore, a higher bonding position accuracy is required for electronic component bonding devices. In addition, such a thin chip may be cracked or defective due to the positional offset between the pickup nozzle and the chip when the pickup nozzle picks it up. Therefore, in order to suppress the relative positional offset between the pickup nozzle and the chip, an electronic component bonding device is proposed, which uses a camera to identify the position of the pickup nozzle and the chip during the pickup action and the chip bonding action and corrects the positional offset.

[0003] As an example of an electronic component bonding device, first, a vacuum suction cup absorbs the chip from a chip supply tray and transfers it to a relay station (called a pre-alignment station). On the pre-alignment station, a camera arranged above identifies the position of the chip and compares the position information of the chip with the pre-set reference position information. Next, the pre-alignment station is moved and rotated so that the position of the chip is consistent with the reference position. Then, the chip positioned on the pre-alignment station is picked up with a bonding tool, and after being transferred to the bonding station, the bonding tool is lowered to bond the chip to the substrate (for example, refer to patent document 1).

[0004] As another example of an electronic component bonding device, there is the following device. First, the pickup nozzle adsorbs the chip on the wafer attached to the chip supply stage and transfers it to the pre-alignment stage. Then, the pre-alignment stage moves in a direction orthogonal to the chip transfer direction, and the welding tool adsorbs the chip from the moved pre-alignment stage and transfers it to the welding stage to be bonded to the substrate. The wafer chip stage has a chip loading stage for loading and adsorbing the chip. The first camera is arranged above the chip supply stage, and the first camera identifies the position of the chip to be picked up. The second camera is located on the pre-alignment platform, and the second camera identifies the chip and corrects the posture of the chip around the X direction, Y direction and θ axis. A third camera is arranged above the bonding stage, and the third camera identifies the reference mark of the substrate, aligns the chip with the substrate, and lowers the bonding tool to bond the chip to the substrate (for example, refer to patent document 2).

[0005] The electronic component bonding apparatus described in Patent Document 2 has a push pin on the wafer supply stage to push the chip toward the pickup nozzle via the wafer. The pickup nozzle absorbs the chip pushed by the push pin and transfers it to the pre-alignment stage.

[0006] In addition, as another example of an electronic component bonding device, there is the following device. The electronic component bonding device has an upper and lower two-view field recognition mechanism (for example, an upper and lower two-view field camera, etc.) between the bonding head and the bonding table, and a third recognition mechanism (third camera) below the bonding table. The upper and lower dual-view field recognition unit aligns the position of the bonding head with the position of the bonding table and retreats. Then, the third recognition unit recognizes the position of the chip adsorbed on the bonding head, corrects the chip position, and lowers the bonding head to bond the chip to the substrate (for example, refer to patent document 3).

[0007]

Prior technical literature

[0008] [Patent Document 1] Japanese Patent Application Laid-Open No. 63-18326

[0009] [Patent Document 2] Japanese Patent Application Publication No. 2007-158102

[0010] [Patent Document 3] International Publication No. 2002-41384

[0011] In the electronic component bonding apparatus described in Patent Document 1, a camera disposed above the pre-alignment stage recognizes the position of the chip, and the chip whose position and posture have been corrected is transferred to the bonding stage and bonded to the substrate. However, since a camera as a position recognition unit is not disposed at the position where the chip is bonded to the substrate, there is a problem that the chip bonding position accuracy cannot be obtained.

[0012] In the electronic component bonding device described in the above-mentioned patent document 2, a first camera is arranged above the chip supply stage, and a second camera is arranged on the pre-alignment stage. In addition, a third camera is arranged on the bonding stage. The first camera, the second camera and the third camera can correct the position of the chip at their respective operating positions. However, since the position correction of the chip at each operating position is performed each time each action is performed, it is impossible to expect to shorten the cycle time. In addition, since the pre-alignment stage moves in a manner that switches the chip transfer path between the chip supply stage and the bonding stage, there is a problem that the production cycle time is further extended due to this movement.

[0013] In addition, the electronic component bonding device of Patent Document 2 has an upward push pin for pushing the chip from the wafer, and the pick-up nozzle absorbs the chip pushed up by the upward push pin. At this time, since there is no position recognition mechanism for the upward push pin, the chip may be broken or damaged due to the positional deviation of the pick-up nozzle and the upward push pin.

[0014] In addition, the electronic component bonding device described in the above-mentioned patent document 3 inserts an upper and lower field of view recognition unit between the bonding head and the bonding table to perform position correction between the bonding head and the bonding table. After the position correction, the upper and lower field of view recognition unit retreats from between the bonding head and the bonding table. Then, the position of the chip adsorbed by the bonding head is recognized by the third recognition unit, and after the position of the bonding table is corrected, the chip is bonded to the substrate. Therefore, the action of the upper and lower field of view recognition unit and the action of the third recognition unit cannot be performed simultaneously, resulting in a problem of a longer production cycle time.

[0015] The present invention has been made to solve at least one of the above problems, and an object of the present invention is to realize an electronic component bonding apparatus that can bond a chip to a substrate at high speed and with high accuracy without damaging the chip. Summary of the invention

[0016] [1] The electronic component bonding device of the present invention comprises: a pick-up head, which picks up a solidified chip from a wafer on a wafer chip stage and transfers it to a pre-alignment stage; a bonding head, which picks up the chip from the pre-alignment stage, transfers it to a substrate on a substrate stage, and bonds the chip to a specified position on the substrate; an upper push pin, which is arranged below the wafer chip stage and pushes the chip toward the pick-up head; a first camera, which is arranged above the wafer chip stage and identifies the solidified chip; a second camera, which is arranged above the pre-alignment stage and identifies the pre-alignment stage and the chip transferred to the pre-alignment stage; a third camera, which is arranged above the substrate stage and identifies the substrate and the chip bonded to the substrate; and a fourth camera, which is arranged below the pick-up head and the bonding head, wherein the pick-up head and the bonding head respectively have a detection unit, which has a transparent plate for adsorbing the chip picking nozzle and forming an identification mark, the upper ejector pin has an upper ejector pin driving mechanism for aligning the front end position with the position of the central axis of the picking nozzle of the picking head, the fourth camera can recognize the respective identification marks of the picking head and the bonding head, and recognize the position of the picking nozzle after the picking head and the bonding head are moved respectively, and determine the position relative to the identification mark, the first camera, the second camera and the third camera have a calibration function, which recognizes the identification mark at their respective configuration positions, and based on the position information of the picking nozzle relative to the identification mark, regularly determines the relative position of the picking nozzle at each picking position before picking up the chip to bonding.

[0017] [2] In the electronic component bonding apparatus of the present invention, the pickup head and the bonding head preferably have a Y-axis drive mechanism for controlling movement of the chip in a transfer direction, and a Z-axis drive mechanism for controlling movement of the chip in a vertical direction.

[0018] [3] In the electronic component bonding device of the present invention, the wafer chip stage preferably has a wafer chip stage driving mechanism, which aligns the position of the chip identified by the first camera as a pickup object with the optical axis of the first camera based on the position information of the pickup nozzle relative to the predetermined identification mark.

[0019] [4] In the electronic component joining device of the present invention, it is preferred that the second camera can recognize the alignment mark on the pre-alignment stage, determine the rotation center in the horizontal direction through image processing, and recognize the position and posture of the chip on the pre-alignment stage. The pre-alignment stage has a pre-alignment stage driving mechanism, which corrects the position and posture of the chip based on the position and posture information of the chip.

[0020] [5] In the electronic component bonding device of the present invention, the substrate stage preferably has a substrate stage driving mechanism, which moves the bonding object position of the chip on the substrate identified by the third camera to the position of the center axis of the pickup nozzle of the bonding head.

[0021] [6] In the electronic component bonding device of the present invention, it is preferred that the bonding head can pick up the chip whose position and posture are corrected on the pre-alignment stage, move it to the specified position of the substrate recognized by the third camera, and lower the pickup nozzle to bond the chip to the substrate.

[0022] [7] In the electronic component bonding apparatus of the present invention, the fourth camera is preferably arranged outside the transfer path of the chip.

[0023] [8] In the electronic component joining device of the present invention, the third camera preferably has an image processing unit, which measures the position offset between the substrate and the chip each time the chip is joined to the substrate, calculates the offset of the position offset under a specified number of joining times and a correction value of the offset, and corrects the position of the substrate stage based on the correction value.

[0024] Effects of the Invention

[0025] The electronic component bonding device of the present invention has a first camera above the wafer chip stage, a second camera above the pre-alignment stage, and a third camera above the substrate stage. The first camera identifies the chip on the wafer chip stage and the push pin. The second camera identifies the pre-alignment stage and the chip on the pre-alignment stage. The third camera identifies the substrate on the substrate stage and the chip bonded to the substrate. The electronic component bonding device of the present invention can perform high-precision positioning when picking up and bonding the chip through the first camera, the second camera, and the third camera.

[0026] In addition, the electronic component bonding device has a fourth camera for calibration. The fourth camera recognizes the identification marks of the pickup head and the bonding head. And, after the pickup head and the bonding head are moved in the transfer direction of the chip, the fourth camera can recognize the pickup nozzles of the pickup head and the bonding head, and determine the relative position (coordinate difference) of the pickup nozzles with respect to the identification mark.

[0027] Before the bonding operation, the first camera, the second camera, and the third camera recognize the identification mark in their respective configuration positions, and perform calibration based on the relative position information to identify the position of the center axis of the pickup nozzle. In addition, calibration does not need to be performed for each chip bonding operation, thereby shortening the cycle time.

[0028] In addition, the first camera recognizes the push pin, and the push pin driving mechanism corrects the positional deviation from the center axis of the pickup nozzle determined by calibration, thereby preventing chip damage caused by the positional deviation of the pickup nozzle and the push pin.

[0029] As described above, the electronic component bonding apparatus can bond the chip to the substrate at high speed and with high accuracy without damaging the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a structural explanatory diagram showing a schematic structure of the electronic component joining apparatus 1 .

[0031] Figure 2 1 is a structural explanatory diagram showing the structures of the pickup head 40 and the bonding head 60 .

[0032] Figure 3 It is an explanatory diagram for explaining determination of the relative positions of the pickup head 40 and the pickup nozzle 42 with respect to the recognition mark 49 .

[0033] Figure 4 The figure shows a state where the position of the central axis P1 of the pickup nozzle 42 is determined when the pickup head 40 picks up the chip 20 from the wafer chip stage 10 .

[0034] Figure 5 It is a diagram for explaining a state in which the center position P2 of the planned alignment stage 30 is determined.

[0035] Figure 6 This is a diagram showing how the relative positions of the recognition mark 69 of the bonding head 60 and the pickup nozzle 62 are determined.

[0036] Figure 7 1 and 2 are diagrams showing a state in which the position of the central axis P3 of the pickup nozzle 62 on the pre-alignment stage 30 is determined.

[0037] Figure 8 1 and 2 are diagrams showing a state in which the position of the central axis P3 of the pickup nozzle 62 on the substrate stage 50 is determined.

[0038] Fig. 9 It is a figure which shows the state of the pickup head 40 at the time of starting the bonding operation after calibration.

[0039] Fig.10 1 is a diagram for explaining a state in which the pickup head 40 picks up the chip 20 from the wafer chip stage 10 .

[0040] Fig.11 The figure shows a state when the pickup head 40 transfers the chip 20 to the pre-alignment stage 30 .

[0041] Fig.12 The diagram shows a state of correcting the position and posture of the chip transferred to the pre-alignment stage 30 .

[0042] Fig.13 This is a diagram showing a state in which the bonding head 60 picks up the chip 20 transferred to the pre-alignment stage 30 .

[0043] Fig.14 This is a diagram showing a state where the bonding head 60 transfers the chip 20 to the substrate stage 50 and the pickup head 40 transfers the chip 20 to the pre-alignment stage 30 .

[0044] Fig.15 This is a diagram showing a situation where the third camera 82 recognizes a deviation in the chip bonding position. DETAILED DESCRIPTION

[0045] Below, refer to Figure 1 to Figure 15 The electronic component joining apparatus 1 according to the embodiment of the present invention will be described. In addition, each of the drawings described below is a schematic diagram for explaining the configuration of the electronic component joining apparatus 1 .

[0046] (Structure of Electronic Component Joining Apparatus 1)

[0047] Figure 1It is a structural explanation diagram showing the schematic structure of the electronic component bonding device 1. The electronic component bonding device 1 has a pickup head 40 that picks up the solidified chip (Chip) 20 placed on the wafer chip stage (WaferchipStage) 10 and transfers it to the pre-alignment stage 30. The electronic component bonding device 1 also has a bonding head 60, which picks up the chip 20 from the pre-alignment stage 30 and transfers it to the substrate stage 50. The chip 20 is formed by cutting a wafer (Wafer) 13 attached to a wafer sheet (WaferSheet) 11 into solidified chips, wherein the outer peripheral edge of the wafer 11 is attached to a wafer ring (WaferRing) 12. The chip 20 in a state of being attached to the wafer 11 is called a wafer chip (WaferChip) 14. In addition, in Figure 1 In FIG. 1 , for the purpose of explaining the structure, the pickup head 40 and the bonding head 60 are shown to be arranged at arbitrary positions.

[0048] The wafer chip stage 10 has a Y-axis drive mechanism 15 and an X-axis drive mechanism 16 as wafer chip stage drive mechanisms, which can move the wafer chip stage 10 in the Y-axis direction and the X-axis direction. The Y-axis drive mechanism 15 and the X-axis drive mechanism 16 move the wafer chip stage 10 to a position where the pickup head 40 can pick up the center of the object chip 20. In addition, the wafer chip stage 10 has a θ-axis drive mechanism 21 for aligning the rotational position of the chip 20 around the Z-axis. In addition, in the following description of each figure, the Y-axis represents the left and right direction of the paper, the X-axis represents the depth direction of the paper, and the Z-axis represents the direction perpendicular to the XY plane. The Y-axis direction is the moving direction of the pickup head 40 and the bonding head 60, and is the transfer direction of the chip 20. In other words, the pickup head 40 and the bonding head 60 only move in the Y-axis direction.

[0049] The wafer chip stage 10, the Y-axis drive mechanism 15, the X-axis drive mechanism 16 and the θ-axis drive mechanism 21 have a circular ring shape, and an upward push pin 17 is arranged on the inner side of the circular ring and the lower side of the wafer chip stage 10. The upward push pin 17 is arranged so that the top of the cone faces the chip 20 to be picked up. The upward push pin 17 has a Z-axis drive mechanism 18 and an X-axis drive mechanism 19 as an upward push pin drive mechanism. When the pickup head 40 picks up the chip 20, the Z-axis drive mechanism 18 pushes the chip 20, which is the pickup object, toward the pickup head 40. The X-axis drive mechanism 19 moves the upward push pin 17 along the X-axis direction to prevent the upward push pin 17 and the pickup nozzle 42 from being offset in the plane direction. Note that although the illustration is omitted, a Y-axis drive mechanism that moves the upward push pin 17 in the Y-axis direction may also be provided.

[0050] The pre-alignment stage 30 has a θ-axis drive mechanism 31, a Y-axis drive mechanism 32, and an X-axis drive mechanism 33 as pre-alignment stage drive mechanisms. The θ-axis drive mechanism 31 rotates the pre-alignment stage 30 with its rotation center (referred to as the θ-axis) as the rotation axis. The Y-axis drive mechanism 32 moves the pre-alignment stage 30 in the Y-axis direction, and the X-axis drive mechanism 33 moves the pre-alignment stage 30 in the X-axis direction. Although not shown in the figure, the pre-alignment stage 30 has a mechanism for fixing the position of the chip 20, such as a clamping mechanism for clamping the chip 20 with a chip adsorption hole or two plates.

[0051] The pickup head 40 includes a detection portion 41 and a pickup nozzle 42 that protrude in parallel to each other toward the lower side in the Z-axis direction. The pickup head 40 can move in the Y-axis direction along the horizontally extending Y-axis guide rail 35. For a detailed structure of the pickup head 40, refer to Figure 2 To explain.

[0052] The bonding head 60 has the same structure as the pickup head 40. The bonding head 60 has a detection portion 61 and a pickup nozzle 62 that protrude in parallel to each other toward the lower side of the Z axis. The bonding head 60 can move in the Y-axis direction along the Y-axis guide rail 35. The pickup nozzle 62 picks up the chip 20 from the pre-alignment stage 30, transfers it to the substrate stage 50, and bonds it to the substrate 70. Therefore, in the bonding head 60, the pickup nozzle 62 is also called a bonding nozzle. For the detailed structure of the bonding head 60, refer to Figure 2 To explain.

[0053] Although not shown in the figure, the substrate stage 50 has a clamping mechanism for clamping the substrate 70 with a substrate suction hole or two plates as a mechanism for fixing the position of the substrate 70 to be bonded to the chip 20. The substrate stage 50 has a Y-axis drive mechanism 51 and an X-axis drive mechanism 52 as substrate stage drive mechanisms, and can move the substrate stage 50 in the Y-axis direction and the X-axis direction. That is, the Y-axis drive mechanism 51 and the X-axis drive mechanism 52 move the substrate 70 to a position where the pickup nozzle 62 of the bonding head 60 can be bonded to the chip 20. In addition, although not shown in the figure, the wafer chip stage 10 is connected to a wafer supply device that supplies the wafer chip 14, and the substrate stage 50 is connected to a substrate supply device that supplies the substrate 70 and a substrate unloading device for unloading the substrate 70.

[0054] The electronic component bonding apparatus 1 has a first camera 80, a second camera 81, a third camera 82, and a fourth camera 83 with predetermined position coordinates. The first camera 80 is arranged above the wafer chip stage 10 and above the pickup head 40. The first camera 80 is arranged at a position within a range in which its field of view can recognize the chip 20 to be picked up and the push pin 17.

[0055] The second camera 81 is arranged above the pre-alignment stage 30 and above the pickup head 40 and the bonding head 60. The second camera 81 is arranged at a position where its field of view can recognize two alignment marks (not shown) on the pre-alignment stage 30 and the outer shape of the transfer mounted chip 20.

[0056] The third camera 82 is arranged above the substrate stage 50 and above the bonding head 60. The third camera 82 is arranged at a position where its field of view can recognize alignment marks, reference patterns (not shown), etc. of the substrate 70, and the outer shape of the bonded chip 20 can be recognized. That is, they are arranged at a position where the chip bonding position can be captured as an image on the substrate 70.

[0057] The fourth camera 83 is arranged outside the transfer path of the chip 20 and below the pickup head 40 and the bonding head 60. That is, the fourth camera 83 is arranged at a position where the field of view of the fourth camera 83 is directed upward to recognize the front ends of the detection units 41 and 61 and the pickup nozzles 42 and 62 of the pickup head 40 and the bonding head 60, respectively. Figure 1 The two-dot chain line L in FIG. 1 represents the lower front end position of the pickup nozzles 42 and 62 when the pickup head 40 and the bonding head 60 transfer the chip 20 .

[0058] In addition, the electronic component bonding apparatus 1 includes an image processing unit 85. The image processing unit 85 calculates the position coordinates of the pickup head 40 and the bonding head 60 in each operation based on the image data captured by the first camera 80, the second camera 81, the third camera 82, and the fourth camera 83. In addition, the image processing unit 85 calculates the position and posture of the bonding target chip 20 and the position deviation of the bonded chip 20 and the substrate 70. The various data calculated by the image processing unit 85 are stored in a storage unit (not shown), and the driving of the electronic component bonding apparatus 1 is controlled based on the various data.

[0059] Next, refer to Figure 2 The structures of the pickup head 40 and the bonding head 60 will be described.

[0060] Figure 2 4 is a structural diagram showing the structure of the pickup head 40 and the bonding head 60. Figure 2 (a) is a stereogram, Figure 2 (b) is from Figure 2 (a) is a plan view when viewed from the bottom side (bold arrow direction). The pickup head 40 and the bonding head 60 are of the same replaceable structure, so the pickup head 40 is used as a representative for description. Figure 2In the figure, on the right side of the reference numeral of the pickup head 40, the reference numerals in brackets are recorded for the components of the bonding head 60. Therefore, the structure of the bonding head 60 can be replaced by the symbols in brackets. The pickup head 40 has a Y-axis drive mechanism 43 that moves along the Y-axis guide 35 extending in the transfer direction (Y-axis direction) of the chip 20. In addition, the pickup head 40 has a Z-axis drive mechanism 44, which is installed on the Y-axis drive mechanism 43 and can move the detection unit 41 and the pickup nozzle 42 in the vertical direction.

[0061] The detection unit 41 and the pickup nozzle 42 are fixed to the Z-axis driving mechanism 44, and both the detection unit 41 and the pickup nozzle 62 extend toward the Z-axis below the Z-axis of the Z-axis driving mechanism 44. A cartridge 45 is installed at the front end of the pickup nozzle 42 so that it can be easily loaded and unloaded. The pickup nozzle 42 has a chip adsorption hole 46 that penetrates along the length direction including the open cartridge 45. The chip adsorption hole 46 is connected to a vacuum device (not shown in the figure) at the end of the pickup nozzle 42 on the opposite side of the cartridge 45. It should be noted that, at least on the pickup nozzle 62 of the bonding head 60, a heater for chip bonding (not shown in the figure) is provided above the cartridge 45.

[0062] The detection unit 41 has a support portion 47 protruding in the horizontal direction at the lower front end portion in the Z-axis direction. A transparent plate, that is, a calibration glass plate 48, is embedded in the support portion 47. A cross identification mark 49 is formed on the calibration glass plate 68. In addition, the material of the calibration glass plate 48 is not limited to glass as long as it has high light transmittance and low thermal expansion coefficient. Figure 2 As shown in (b), dy1 represents the distance between the identification mark 49 and the center axis P1 of the pickup nozzle 42. For example, if the position coordinates of the identification mark 49 are (0, 0), the position coordinates of the center axis P1 of the pickup nozzle 42 can be represented by (0, -dy1). In addition, dy2 represents the distance between the identification mark 69 of the bonding head 60 and the center axis P3 of the pickup nozzle 62 (the center of the chip adsorption hole 66). For example, if the position coordinates of the identification mark 69 are (0, 0), the position coordinates of the center axis P3 of the pickup nozzle 62 can be represented by (0, -dy2).

[0063] In addition, the position of the center axis P1 of the pickup nozzle 42 is sometimes not on the extension line passing through the identification mark 49 and parallel to the Y-axis guide rail 35. In this case, the center axis P1 of the pickup nozzle 42 relative to the identification mark 49 can be expressed as (+dx, -dy1) or (-dx, -dy1) as the coordinate difference of the coordinate relative to the identification mark 49. At the bonding head 60, the center axis P3 of the pickup nozzle 62 relative to the identification mark 69 can be expressed as (+dx, -dy2) or (-dx, -dy2) as the coordinate difference of the coordinate relative to the identification mark 69.

[0064] The electronic component bonding device 1 described above requires high-precision alignment when picking up the chip 20 and bonding it to the substrate 70. At this time, if alignment is performed for each bonding action, the cycle time becomes correspondingly longer. Therefore, by pre-determining the calibration function of the relative position of the pickup nozzle 42, 62 with respect to the chip 20 pickup position and the bonding position with high precision before the bonding action, the chip 20 can be bonded to the substrate 70 with high precision and high speed. Figures 3 to 8 To describe the calibration method.

[0065] (Calibration method)

[0066] Figure 3 4 is a diagram for explaining the state of identifying the relative position of the pickup nozzle 42 with respect to the identification mark 49 of the pickup head 40. First, as Figure 3 As shown in (a), the pickup head 40 is moved until the fourth camera 83 recognizes the identification mark 49 and the image processing unit 85 (see Figure 1 ) image processing recognizes the position of the mark 49. Since the position of the fourth camera 83 is determined, the position of the recognition mark 49 can be determined.

[0067] Next, if Figure 3 As shown in (b), the pickup head 40 moves in the Y(+) direction, so that the fourth camera 83 recognizes the front end of the pickup nozzle 42, that is, the front end of the collet 45. The position of the pickup nozzle 42 is determined based on the movement amount of the pickup head 40, that is, the movement distance of the center axis P1 of the pickup nozzle 42 in the Y(+) direction, and the captured image, and the position (coordinate difference) of the center axis P1 of the pickup nozzle 42 relative to the identification mark 49.

[0068] Figure 4 1 is a diagram showing a state in which the position of the central axis P1 of the pickup nozzle 42 is determined when the pickup head 40 picks up the chip 20 from the wafer chip stage 10. First, the pickup head 40 recognizes the position of the pickup nozzle 42 from the fourth camera 83 along the Y-axis guide 35 (see FIG. 1 ). Figure 3 (b)) moves to the bottom of the first camera 80, and the first camera 80 stops at the position where the identification mark 49 is recognized. Since the position of the center axis P1 of the pickup nozzle 42 relative to the first camera 80 and the coordinate difference of the identification mark 49 are known, the position coordinates of the pickup nozzle 42 relative to the first camera 80 can be determined. That is, the position of the pickup nozzle 42 is determined as the position coordinates when the chip 20 is picked up from the wafer chip stage 10.

[0069] Next, the center position P2 of the alignment stage 30 is determined.

[0070] Figure 5 1 and 2 are diagrams showing a state in which the center position P2 of the preliminary alignment stage 30 is determined. Figure 5 (a) in FIG. 1 shows a case where the center position P2 of the pre-alignment stage 30 is obtained in image processing. Figure 5 (b) shows the situation of determining the position coordinates of the center axis P1 of the pickup nozzle 42 on the pre-alignment stage 30. First, as Figure 5 As shown in (a), the second camera 81 captures images of two alignment marks or chip adsorption holes (not shown) set on the predetermined alignment stage 30. Then, the second camera 81 calculates the center position P2 of the alignment stage 30 through image processing to determine the center position P2 of the image processing. Assume that the pickup head 40 stops below the first camera 80 (refer to Figure 4 ).

[0071] Then, if Figure 5 As shown in (b), the pickup head 40 moves along the Y-axis guide 35 in the Y(-) direction from below the first camera 80 until the second camera 81 recognizes the position of the identification mark 49. The position coordinates of the second camera 81 are predetermined, and the coordinate difference of the center axis P1 of the pickup nozzle 42 relative to the identification mark 49 is known, so the position of the center axis P1 can be determined as the position coordinate.

[0072] exist Figure 3 to Figure 5 In the above, the calibration related to the operation of the pickup head 40 picking up the chip 20 from the wafer chip stage 10 and transferring it to the pre-alignment stage 30 is described. Next, the calibration related to the bonding head 60 is described.

[0073] Figure 6 4 is a diagram for explaining the situation of determining the relative position of the identification mark 69 of the bonding head 60 and the pickup nozzle 62. In addition, the pickup head 40 moves to an arbitrary position between the first camera 80 and the second camera 81. First, as Figure 6 As shown in (a), the fourth camera 83 moves the bonding head 60 in the Y(+) direction until the identification mark 69 of the bonding head 60 is recognized, and the image processing unit 85 (see Figure 1 ) to determine the position of the identification mark 69. Since the position of the fourth camera 83 is predetermined, it is possible to determine the position of the identification mark 69. The fourth camera 83 recognizes that the position of the identification mark 69 of the bonding head 60 coincides with the position of the identification mark 49 of the pickup head 40.

[0074] Then, if Figure 6As shown in FIG. 2( b), the bonding head 60 is moved in the Y(+) direction, and the fourth camera 83 recognizes the front end of the pickup nozzle 62, that is, the front end of the collet 65. The position of the pickup nozzle 62 can be determined based on the movement amount of the bonding head 60, that is, the movement distance of the center axis P3 of the pickup nozzle 62 in the Y(+) direction, and the captured image, so as to determine the position (coordinate difference) of the center axis P3 of the pickup nozzle 62 relative to the recognition mark 69.

[0075] Figure 7 1 is a diagram showing a state where the position of the center axis P3 of the pickup nozzle 62 on the pre-alignment stage 30 is determined. The bonding head 60 is positioned from the position of the fourth camera 83 (see Figure 6 (b)) Move along the Y(+) direction to the position where the second camera 81 recognizes the identification mark 69. Since the position coordinates of the second camera 81 are predetermined and the coordinate difference relative to the identification mark 69 is known, the position of the central axis P3 of the pickup nozzle 62 can be determined as the position coordinates.

[0076] Figure 8 1 is a diagram showing a state where the position of the central axis P3 of the pickup nozzle 62 on the substrate stage 50 is determined. The bonding head 60 moves from the position of the second camera 81 (see FIG. 1 ) in the Y(−) direction. Figure 7 ) is moved to the position where the third camera 82 recognizes the recognition mark 69. Since the third camera 82 has predetermined position coordinates, the position coordinates of the recognition mark 69 can be determined by recognizing the recognition mark 69 of the bonding head 60. In addition, since the coordinate difference between the recognition mark 69 and the central axis P3 of the pickup nozzle 62 is known, the position coordinates of the central axis P3 of the pickup nozzle 62 at the position where the third camera 82 recognizes the recognition mark 69 can be calculated and determined.

[0077] In the above reference Figure 3 to Figure 8 After the calibration described above, the chip 20 is bonded to the substrate 70. Note that the calibration is not performed in the middle of the action involved in bonding.

[0078] (Method of Bonding Chip 20 to Substrate 70)

[0079] Fig. 9: is a diagram showing the state of the pickup head 40 when the bonding operation starts after the aforementioned calibration. First, before the bonding action, the wafer supply device (not shown) supplies the wafer chip 14 to the wafer chip stage 10 in a prescribed posture. Then, the first camera 80 identifies the chip 20 to be picked up, and moves the wafer chip stage 10 to a position relative to the central axis P1 of the pickup nozzle 42 through the Y-axis drive mechanism 15, the X-axis drive mechanism 16, and the θ-axis drive mechanism 21. At this time, the pickup head 40 stands by at a position that does not block the field of view of the first camera 80. The upper push pin 17 is located at a position away from the wafer chip 14 to the lower side. The first camera 80 identifies the upper push pin 17, and identifies the tip position by image processing before supplying the wafer chip 14. Then, the upper push pin 17 is moved by the X-axis drive mechanism 19 to the position of the central axis P1 along which the pickup nozzle 42 picks up the chip 20 obtained by calibration.

[0080] On the other hand, a substrate 70 is supplied to the substrate stage 50 from a substrate supply device (not shown). The third camera 82 recognizes the substrate 70 and captures the target position of the chip 20 as an image from the configuration of the substrate pattern (not shown) or the alignment mark (not shown). The third camera 82 has recognized the position of the pickup nozzle 62 of the bonding head 60 by calibration. Therefore, the position of the substrate stage 50 is adjusted by the Y-axis drive mechanism 51 and the X-axis drive mechanism 52 so that the chip bonding target position of the substrate 70 is in a position facing the pickup nozzle 62. At this time, the bonding head 60 waits at an arbitrary position that does not block the field of view of the third camera 82 between the second camera 81 and the third camera 82. The pickup head 40 moves to be directly above the chip 20 to be picked up and the upper push pin 17.

[0081] Fig.10 : is a diagram illustrating the pickup head 40 picking up the chip 20 from the wafer chip stage 10. The pickup nozzle 42 moves to the chip 20 to be picked up, and quietly descends through the Z-axis drive mechanism 44 to contact the chip 20 to be picked up. At the same time, the upward push pin 17 rises through the Z-axis drive mechanism 18, pushing up the chip 20 to be picked up. Then, the pickup nozzle 42 adsorbs and picks up the chip 20. The pickup nozzle 42 only picks up the chip 20 to be picked up. When the pickup nozzle 42 picks up the chip 20, the upward push pin 17 descends to the original position. Since the pickup nozzle 42 and the upward push pin 17 can be aligned with high precision, the chip 20 will not be damaged due to the positional offset between the pickup nozzle 42 and the upward push pin 17 when the chip 20 is clamped. Next, as Fig.11 As shown, the pick-up head 40 transfers the chip 20 to the pre-alignment stage 30 .

[0082] Fig.11is a diagram showing the state in which the pickup head 40 transfers the chip 20 to the pre-alignment stage 30. The center axis P1 of the pickup nozzle 42 stops at a position above the center position P2 of the pre-alignment stage 30, and is lowered by the Z-axis drive mechanism 44 to place the chip 20 on the pre-alignment stage 30. The chip 20 is adsorbed and held at a chip adsorption hole (not shown) provided on the pre-alignment stage 30. And, after the chip 20 is adsorbed onto the pre-alignment stage 30, the pickup head 40 moves to a position below the first camera 80, that is, a position capable of picking up the chip 20 from the wafer chip 14. Then, as shown in FIG. Fig.12 As shown, the second camera 81 recognizes the outer shape of the chip 20 .

[0083] Fig.12 : is a diagram showing the situation of correcting the position and posture of the chip 20 transferred to the pre-alignment stage 30. The second camera 81 recognizes the outer shape of the chip 20, calculates the center position P4 of the chip 20 by image processing, corrects the offset of the chip 20 in the X-axis direction by the X-axis drive mechanism 33, corrects the offset in the Y-axis direction by the Y-axis drive mechanism 32, and corrects the tilt θ in the plane direction by the θ-axis drive mechanism 31. As a result, the bonding head 60 can pick up the chip 20 in a posture that the center axis P3 of the pickup nozzle 62 is consistent with the center position P4 of the chip 20 and can be bonded to the substrate 70, and transfer it to the substrate 70. As described above, in the wafer chip stage 10, the position of the chip 20 around the Z axis (θ axis) is aligned. Therefore, the position accuracy of the chip 20 on the pre-alignment stage 30 can be improved.

[0084] Fig.13 FIG. 6 is a diagram showing a state in which the bonding head 60 picks up the chip 20 transferred to the pre-alignment stage 30. The bonding head 60 moves from the standby position (see FIG. 6 ). Fig.12 ) moves to the top of the alignment stage 30 and stops. The stop position of the pickup nozzle 62 is previously determined by calibration. Then, the pickup nozzle 62 is lowered by the Z-axis drive mechanism 64 to adsorb and pick up the chip 20. In synchronization with the action of the bonding head 60 picking up the chip 20, the pickup head 40 picks up the chip 20 from the wafer chip stage 10 (refer to Fig.10 ).

[0085] Fig.141 is a diagram showing a situation where the bonding head 60 transfers the chip 20 to the substrate stage 50 and the pickup head 40 transfers the chip 20 to the pre-alignment stage 30. The bonding head 60 picks up the chip 20 from the pre-alignment stage 30, transfers it to the substrate stage 50, and bonds the chip 20 to a predetermined position on the substrate 70. Specifically, the collet 65 installed at the front end of the pickup nozzle 62 is heated by a heater (not shown) and the chip 20 is pressed to bond the chip 20 to the substrate 70. Alternatively, the chip 20 can be fixed to the substrate 70 by pressing the chip 20 against a bonding material pre-coated on the substrate 70. The pickup head 40 transfers the chip 20 from the wafer chip stage 10 to the pre-alignment stage 30 in synchronization with the action of the bonding head 60. The positions where the pickup head 40 and the bonding head 60 pick up the chip 20 and the positions where the chip 20 is transferred are determined by calibration.

[0086] When the bonding head 60 finishes bonding the chip 20, the bonding head 60 moves to the pre-alignment stage 30 to pick up the chip 20. In addition, the pickup head 40 moves to the wafer chip stage 10 after transferring the chip 20 to the pre-alignment stage 30. The actions of the bonding head 60 and the pickup head 40 are synchronized. The pickup head 40 picks up the chip 20 from the wafer chip stage 10 and transfers it to the pre-alignment stage 30, and the bonding head 60 picks up the chip 20 from the pre-alignment stage 30 and transfers it to the substrate stage 50, thereby bonding with the substrate 70. Note that the synchronization described above may not be completely synchronized.

[0087] Fig.15 1 is a diagram illustrating a situation where the third camera 82 identifies the offset of the chip bonding position. After the chip is bonded, when the bonding head 60 moves to the predetermined calibration stage 30, the third camera 82 identifies the substrate 70 to which the chip 20 is bonded. Next, the third camera 82 obtains the measurement data of the pattern of the substrate 70, the alignment mark (all omitted in the figure) and the position deviation amount of the chip 20 through image processing. The measurement data of the position deviation amount and direction are stored in a storage unit (omitted in the figure), and a distribution map of the position deviation is prepared. Even if the position deviation amount is within the specification, when the distribution of the position deviation deviates, the position of the substrate stage 50 is finely adjusted in the direction of reducing the deviation by the Y-axis drive mechanism 51 and the X-axis drive mechanism 52. Therefore, the accuracy of the chip 20 bonding position can be improved, and the deviation of the bonding accuracy can be suppressed.

[0088] In addition, it is preferred to at least periodically perform Figure 3 to Figure 8 The periodic calibration may also be defined as, for example, a predetermined number of chip bonds, a predetermined number of bonded substrates, or a predetermined number of wafer chips 14 after a predetermined operating time of the electronic component bonding apparatus 1 has elapsed. Furthermore, calibration is also performed when the position deviation of the chip 20 does not meet the standard.

[0089] As described above, the electronic component bonding apparatus 1 includes the first camera 80 above the wafer chip stage 10, the second camera 81 above the pre-alignment stage 30, and the third camera 82 above the substrate stage 50. The first camera 80 recognizes the chip 20 on the wafer chip stage 10 and the push pin 17. The second camera 81 recognizes the pre-alignment stage 30 and the chip 20 on the pre-alignment stage 30. The third camera 82 recognizes the substrate 70 on the substrate stage 50 and the chip 20 bonded to the substrate 70. In this way, since the electronic component bonding apparatus 1 includes the first camera 80, the second camera 81, and the third camera 82, high-precision positioning can be performed when the chip 20 is picked up and bonded.

[0090] In addition, the electronic component bonding apparatus 1 has a fourth camera 83 for calibration. The fourth camera 83 recognizes the identification marks 49, 69 of the pickup head 40 and the bonding head 60, respectively. After the fourth camera 83 moves the pickup head 40 and the bonding head 60 in the transfer direction of the chip 20, the pickup nozzles 42, 62 of the pickup head 40 and the bonding head 60 are recognized, and the relative positions of the pickup nozzles 42, 62 with respect to the identification marks 49, 69 are determined.

[0091] Before the bonding operation, the first camera 80, the second camera 81, and the third camera 82 recognize the identification marks 49, 69 at their respective configuration positions, and can determine the positions of the central axes P1, P3 of the pickup nozzles 42, 62 based on the relative position information. In addition, calibration does not need to be performed for each chip bonding operation, thereby shortening the cycle time.

[0092] In addition, the first camera 80 recognizes the push pin 17 and corrects the position deviation from the center axis P1 of the pickup nozzle 42 determined by calibration through the push pin driving mechanism, i.e., the X-axis driving mechanism 19. In this way, damage to the chip 20 caused by the positional deviation between the pickup nozzle 42 and the push pin 17 can be prevented.

[0093] As described above, the electronic component bonding apparatus 1 can bond the chip 20 to the substrate 70 at high speed and with high precision without damaging the chip 20 .

[0094] In addition, the pickup head 40 and the bonding head 60 respectively have a Y-axis driving mechanism 43, 63 for controlling the movement of the chip 20 in the transfer direction (Y-axis direction), and a Z-axis driving mechanism 44, 64 mounted on the Y-axis driving mechanism 43, 63 and moving in the vertical direction. Such a configuration can simplify and lighten each driving mechanism, so that the chip 20 can be transferred in the Y-axis direction at high speed.

[0095] The wafer stage 10 has a Y-axis drive mechanism 15, an X-axis drive mechanism 16, and a θ-axis drive mechanism 21 as wafer stage drive mechanisms, which align the position of the chip 20 as the pickup target recognized by the first camera 80 based on the position information of the central axis P1 of the pickup nozzle 42 determined by calibration. According to such a structure, the pickup head 40 can pick up the chip 20 with high accuracy and high speed.

[0096] In addition, the second camera 81 can determine the rotation center of the alignment stage 30 in the horizontal direction by image processing. The pre-alignment stage 30, as a pre-alignment stage driving mechanism, has a Y-axis driving mechanism 32 for controlling the movement of the chip 20 in the Y-axis direction, an X-axis driving mechanism 33 for controlling the movement in the X-axis direction, and a θ-axis driving mechanism 31 for controlling the rotation around the Z-axis (θ-axis). According to this structure, the bonding head 60 can pick up and transfer the chip 20 to the substrate 70 in a state where the chip 20 can be bonded to the substrate 70. Therefore, the chip 20 does not need to be aligned during the bonding operation, and high-speed operation can be performed.

[0097] The substrate stage 50 has a Y-axis drive mechanism 51 and an X-axis drive mechanism 52 as substrate stage drive mechanisms, and the Y-axis drive mechanism 51 and the X-axis drive mechanism 52 move the chip bonding target position of the substrate 70 recognized by the third camera 82 to the position of the central axis P3 of the pickup nozzle 62 of the bonding head 60. The position of the pickup nozzle 62 of the bonding head 60 has been determined by calibration. Therefore, the position of the substrate stage 50 is adjusted by the Y-axis drive mechanism 51 and the X-axis drive mechanism 52 so that the chip bonding target position of the substrate 70 is located at a position facing the pickup nozzle 62. This can be performed during the action of the bonding head 60 picking up the chip 20 to the pre-alignment stage 30, and since no additional time is required, the chip 20 can be bonded to the substrate 70 with high precision without affecting the tact time.

[0098] Furthermore, the bonding head 60 picks up the chip 20 whose position and posture have been corrected on the pre-alignment stage 30, transfers it to a predetermined position of the substrate 70 recognized by the third camera 82, and lowers the pickup nozzle 62 to bond the chip 20 to the substrate 70. In this structure, the bonding head 60 only needs to pick up and transfer the chip 20 and bond it to the substrate 70. The time associated with the position correction of the chip 20 and the position correction of the substrate 70 does not affect the operation of the bonding head 60 itself. Therefore, the bonding head 60 can bond the chip 20 to the substrate 70 with high precision without affecting the production tact time.

[0099] In addition, a fourth camera 83 is provided for calibration. The fourth camera 83 is provided outside the transfer path of the chip 20. Therefore, the fourth camera 83 does not hinder the movement of the pickup head 40 and the bonding head 60 during the bonding operation, and no additional space is required for the movement of the pickup head 40 and the bonding head 60.

[0100] In addition, each time the chip 20 is bonded to the substrate 70, the third camera 82 measures the position deviation between the substrate 70 and the chip 20 by image processing, and calculates the deviation of the position deviation in the specified number of bonding times and the correction value of the deviation, and corrects the position of the substrate stage 50 according to the correction value. The measured data of the position deviation and the direction of the position deviation are recorded in a normal distribution diagram, for example. Moreover, even if the position deviation and the direction of the position deviation are within the specification, in the case of deviation in the distribution of the position deviation, the position of the substrate stage 50 can be finely adjusted in the direction of reducing the deviation by the Y-axis drive mechanism 51 and the X-axis drive mechanism 52. Therefore, the accuracy of the bonding position of the chip 20 can be improved, and the deviation of the bonding accuracy can be suppressed.

[0101]

Explanation of symbols

[0102] 1…electronic component bonding device; 10…wafer chip stage; 11…wafer; 13…wafer; 14…wafer chip; 15, 32, 43, 51, 63…Y-axis driving mechanism; 16, 19, 33, 52…X-axis driving mechanism; 18, 44, 64…Z-axis driving mechanism; 20…chip; 21, 31…θ-axis driving mechanism; 30…pre-alignment stage; 40…pick-up head; 41, 61…detection unit; 42, 62…pick-up nozzle; 48, 68…calibration glass plate (transparent plate); 49, 69…identification mark; 50…substrate stage; 60…bonding head; 70…substrate; 80…first camera; 81…second camera; 82…third camera; 83…fourth camera; 85…image processing unit; P1, P3…center axis; P2, P4…center position; θ…tilt in the plane direction.

Claims

1. An electronic component bonding device, characterized in that: include: The pick-up head picks up the solidified chips from the wafer on the wafer chip stage and transfers them to the pre-alignment stage; A bonding head picks up the chip from the pre-alignment stage, moves it to the substrate on the substrate stage, and bonds the chip to a specified position on the substrate; An upper push pin is disposed below the wafer chip stage to push the chip toward the pickup head; A first camera is disposed above the wafer chip stage to identify the chip that has been solidified; A second camera is disposed above the pre-alignment stage to identify the pre-alignment stage and the chip transferred to the pre-alignment stage; A third camera is disposed above the substrate stage to identify the substrate and the chip bonded to the substrate; as well as A fourth camera is disposed below the pickup head and the bonding head, The pickup head and the bonding head each have a detection unit, and the detection unit has a transparent plate for adsorbing the chip pickup nozzle and forming an identification mark. The upper ejector pin has an upper ejector pin driving mechanism that aligns the front end position with the position of the central axis of the pickup nozzle of the pickup head, The fourth camera is capable of recognizing the respective identification marks of the pickup head and the bonding head, recognizing the position of the pickup nozzle after the pickup head and the bonding head are moved respectively, and determining the position relative to the identification mark. The first camera, the second camera and the third camera have a calibration function, which identifies the identification mark at their respective configuration positions and, based on the position information of the pickup nozzle relative to the identification mark, regularly determines the relative position of the pickup nozzle at each pickup position before picking up the chip and bonding.

2. The electronic component bonding device according to claim 1, wherein: in, The pickup head and the bonding head include a Y-axis driving mechanism for controlling the movement of the chip in a transfer direction, and a Z-axis driving mechanism for controlling the movement of the chip in a vertical direction.

3. The electronic component bonding device according to claim 1, wherein: in, The wafer chip stage has a wafer chip stage driving mechanism that aligns the position of the chip as a pickup target recognized by the first camera with the optical axis of the first camera based on the position information of the pickup nozzle relative to the predetermined recognition mark.

4. The electronic component bonding device according to claim 1, wherein: in, The second camera can identify the alignment mark on the pre-alignment stage, determine the rotation center in the horizontal direction through image processing, and identify the position and posture of the chip on the pre-alignment stage. The pre-alignment stage includes a pre-alignment stage driving mechanism that corrects the position and posture of the chip based on the position and posture information of the chip.

5. The electronic component bonding device according to claim 1, wherein: in, The substrate stage includes a substrate stage driving mechanism that moves the bonding target position of the chip on the substrate recognized by the third camera to the position of the central axis of the pickup nozzle of the bonding head.

6. The electronic component bonding device according to claim 1, wherein: in, The bonding head can pick up the chip whose position and posture are corrected on the pre-alignment stage, transfer it to the predetermined position of the substrate recognized by the third camera, and lower the pickup nozzle to bond the chip to the substrate.

7. The electronic component bonding device according to claim 1, wherein: in, The fourth camera is arranged outside a transfer path of the chip.

8. The electronic component bonding device according to claim 1, wherein: in, The third camera has an image processing unit, which measures the positional offset between the substrate and the chip each time the chip is bonded to the substrate, calculates the offset of the positional offset under a specified number of bonding times and a correction value of the offset, and corrects the position of the substrate stage based on the correction value.

Images