Wafer support seat, rotation support device, cleaning device, wafer rotation speed measurement method and wafer cleaning method

Abstract

The embodiments of the present application provide a wafer support seat, a rotating support device, a cleaning device, a wafer rotation speed measurement method and a wafer cleaning method. The wafer support seat includes: a support assembly; a support shaft, the support assembly is swingably connected to the support shaft; a driving wheel, mounted on the support assembly; a speed measuring wheel, mounted on the support assembly, and the driving wheel is arranged parallel to the rotating shaft of the speed measuring wheel, and the circumferential outer edges of the driving wheel and the speed measuring wheel are provided with an annular groove for supporting the wafer; a counterweight, connected to the support assembly, is used to apply a swingable force to the support assembly. In the present application, under the action of the wafer's own gravity, the swinging driving wheel and the speed measuring wheel will automatically align the support position of the wafer, the insertion depth of the wafer in the driving wheel and the speed measuring wheel can remain stable, and the driving wheel and the speed measuring wheel can stably support the wafer and reduce the probability of the wafer dropping.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of semiconductor processing technology, and in particular to a wafer support seat, a rotation support device, a cleaning device, a wafer rotation speed measurement method, and a wafer cleaning method. Background Art

[0002] In the chip manufacturing process, cleaning is the key to removing residual abrasive particles and chemical residues on the wafer surface, and it is a process that is used frequently. Cleaning is achieved by a combination of a series of cleaning technologies, such as megasonic cleaning, brushing and drying. The cleaning effect directly affects the chip yield. During the cleaning process, the wafer rotation speed will directly affect the cleaning effect.

[0003] The cleaning device in the related art relies on two driving wheels at the bottom to drive the wafer, and at the same time, the two driving wheels also play the role of supporting the wafer. A tachometer wheel is set between the two driving wheels to monitor the speed of the wafer, which has the problem of unstable speed measurement. In addition, the tachometer wheel will also cause the contact position between the wafer and the driving wheel to be unstable, thus causing the speed to drop. Summary of the invention

[0004] In view of this, the embodiments of the present application provide a wafer support seat, a rotation support device, a cleaning device, a wafer rotation speed measurement method and a wafer cleaning method to at least partially solve the above-mentioned problems.

[0005] According to the first aspect of the embodiment of the present application, a wafer support seat is provided, which includes: a support assembly; a support shaft, the support assembly is swingably connected to the support shaft; a driving wheel installed on the support assembly; a tachometer wheel installed on the support assembly, and the driving wheel is arranged parallel to the rotating shaft of the tachometer wheel, and the circumferential outer edges of the driving wheel and the tachometer wheel are provided with annular grooves for supporting the wafer; a counterweight is connected to the support assembly, and is used to apply a swingable force to the support assembly.

[0006] Furthermore, in the above-mentioned wafer support seat, the support assembly includes: a support body, which is swingably connected to the support shaft; a first support member, which is connected to the support body, and the driving wheel is installed on the first support member; a second support member, which is connected to the support body and arranged at an angle to the first support member, and the speed measuring wheel is installed on the second support member; the counterweight is connected to the first support member or the second support member.

[0007] Furthermore, the wafer support seat also includes: a driven wheel mounted on the rotating shaft of the driving wheel; a driving wheel rotatably connected to the supporting assembly, and the driving wheel is used to be connected to the driving device to drive the driving wheel to rotate through the driven wheel.

[0008] Furthermore, in the above-mentioned wafer support seat, the driven wheel is meshingly connected with the driving wheel; or, the driven wheel is connected with the driving wheel through a transmission member.

[0009] Furthermore, in the above-mentioned wafer support seat, the support body, the first support member and the second support member are integrally formed into a bent structure.

[0010] Furthermore, in the above-mentioned wafer support seat, the support body is an angle adjustment member, and the first support member and the second support member are connected through the angle adjustment member, which is used to adjust the angle between the first support member and the second support member.

[0011] Furthermore, in the above-mentioned wafer support seat, the angle adjustment member includes: a bolt and a nut, the support body, the first support member and the second support member are all provided with connecting holes, and the bolt passes through each of the connecting holes to be connected to the nut.

[0012] Furthermore, the wafer support seat also includes: a speed measuring component for measuring the rotation speed of the speed measuring wheel.

[0013] Furthermore, in the above-mentioned wafer support seat, the speed measuring component includes: a magnet installed on the speed measuring wheel; a bracket connected to the support component; and a Hall sensor installed on the bracket and corresponding to the position of the magnet in the radial direction of the speed measuring wheel.

[0014] Furthermore, in the above wafer support seat, the support shaft is a hollow shaft, the bracket includes a first support part and a second support part arranged at an angle and connected to each other, the first support part passes through the hollow shaft, and the Hall sensor is installed on the second support part.

[0015] Furthermore, in the above-mentioned wafer support seat, a cover body is formed at the connection between the first support part and the second support part; a gap is provided between the first support part and the hollow shaft, and the cover body covers the end of the hollow shaft to seal the gap.

[0016] Furthermore, in the above-mentioned wafer support seat, a gas for sealing is introduced into the gap.

[0017] Furthermore, in the above-mentioned wafer support seat, the interior of the support is a hollow structure, and the connecting wire of the Hall sensor is passed through the hollow structure.

[0018] Furthermore, in the above-mentioned wafer support seat, the counterweight is arranged on a side of the first support member facing away from the second support member; or, the counterweight is arranged on a side of the second support member facing away from the first support member.

[0019] Furthermore, in the above-mentioned wafer support seat, the counterweight member includes: a connecting member and a counterweight block; wherein the connecting member is connected to the side of the first support member facing away from the second support member, and the counterweight block is connected to the connecting member; or; the connecting member is connected to the side of the second support member facing away from the first support member, and the counterweight block is connected to the connecting member.

[0020] Furthermore, in the above-mentioned wafer support seat, the counterweight blocks are at least two and are detachably connected to the connecting piece.

[0021] Furthermore, in the above wafer support seat, the angle between the first support member and the second support member ranges from 80° to 120°.

[0022] Furthermore, in the above-mentioned wafer support seat, the distance between the rotating shaft of the driving wheel and the supporting shaft is equal to the distance between the rotating shaft of the speed measuring wheel and the supporting shaft.

[0023] Furthermore, in the above-mentioned wafer support seat, the support shaft is a hollow shaft, and the rotating shaft of the driving wheel is rotatably disposed through the hollow shaft.

[0024] Furthermore, in the above-mentioned wafer support seat, the diameter of the driving wheel and the speed measuring wheel are the same.

[0025] Furthermore, the wafer support seat also includes: a motor; a driving active wheel connected to the output shaft of the motor; and a driving driven wheel installed on the rotating shaft of the driving wheel and connected to the driving active wheel through a transmission member.

[0026] In this embodiment, under the effect of the wafer's own gravity, the swingable driving wheel and the speed measuring wheel will automatically find the supporting position of the wafer, the insertion depth of the wafer in the driving wheel and the speed measuring wheel can be kept stable, and the driving wheel and the speed measuring wheel can stably support the wafer. In addition, this stable swing support can also reduce the probability of the wafer dropping.

[0027] According to the second aspect of an embodiment of the present application, a wafer rotation support device is provided, which includes: a base; two wafer support seats of any one of the above-mentioned types, the support shaft of each of the wafer support seats is connected to the base, and the counterweights of the two wafer support seats are arranged back to back.

[0028] Furthermore, the wafer rotation support device further includes: two first limiting members, which are respectively arranged on the inner sides of the two wafer support seats relative to each other and fixedly connected to the base, and are used to limit the wafer support seats when they rotate inward.

[0029] Furthermore, the wafer rotation support device further includes: two second limiting members, which are respectively arranged on the outer sides of the two wafer support seats opposite to each other and fixedly connected to the base, and are used to limit the wafer support seats when they rotate outward.

[0030] Furthermore, in the above-mentioned wafer rotation support device, the two first position-limiting members and the two second position-limiting members are both connected to the base in an adjustable manner.

[0031] Furthermore, in the above-mentioned wafer rotation support device, the first limiting member is a first limiting pin, the base is provided with at least two first plug-in holes, and the first limiting pin can be plugged into any one of the first plug-in holes; correspondingly; the second limiting member is a second limiting pin, the base is provided with at least two second plug-in holes, and the second limiting pin can be plugged into any one of the second plug-in holes.

[0032] Furthermore, in the above-mentioned wafer rotation support device, the swing range of each wafer support seat relative to the base is 10° to 45°.

[0033] Furthermore, in the above-mentioned wafer rotation support device, at least one of the wafer support seats is adjustably connected to the base to adjust the angle between the support axes of the two wafer support seats.

[0034] Furthermore, in the above-mentioned wafer rotation support device, the two wafer support seats have the same structure.

[0035] According to a third aspect of an embodiment of the present application, a wafer cleaning device is provided, which includes a supply device, a spray device and any one of the above-mentioned wafer rotation support devices.

[0036] According to the fourth aspect of an embodiment of the present application, a method for measuring the speed of wafer rotation is provided, the method comprising: placing a wafer into any one of the above-mentioned wafer rotation support devices and driving the wafer to rotate; obtaining the rotation speed of the tachometer wheels in the two wafer support seats in the wafer rotation support device; and determining the rotation speed of the wafer based on the rotation speed of the two tachometer wheels.

[0037] Furthermore, in the above wafer rotation speed measurement method, determining the rotation speed of the wafer according to the rotation speeds of the two tachometer wheels further includes: comparing the rotation speeds of the two tachometer wheels; and taking the faster rotation speed as the rotation speed of the wafer.

[0038] According to a fifth aspect of the present application, a wafer cleaning method is provided, comprising a cleaning step and a speed measurement step performed simultaneously, wherein the speed measurement step comprises detecting the wafer rotation speed by the wafer rotation speed measurement method as described in the above aspects.

[0039] Since the wafer support seat has the above-mentioned effects, the wafer rotation support device, wafer cleaning device, wafer rotation speed measurement method and wafer cleaning method having or using the wafer support seat also have corresponding technical effects.

[0040] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] The above and other objects, features and advantages of the present application will become more apparent by describing in more detail exemplary embodiments of the present application in conjunction with the accompanying drawings, wherein the same reference numerals generally represent the same components in the exemplary embodiments of the present application.

[0042] Figure 1 This is a schematic diagram of the structure of a wafer support seat shown in an embodiment of the present application;

[0043] Figure 2 Another structural schematic diagram of a wafer support seat shown in an embodiment of the present application;

[0044] Figure 3 This is another structural schematic diagram of a wafer support seat shown in an embodiment of the present application;

[0045] Figure 4 This is another structural schematic diagram of a wafer support seat shown in an embodiment of the present application;

[0046] Figure 5 for Figure 4 A cross-sectional view taken along line AA of the wafer support shown;

[0047] Figure 6 for Figure 4 A cross-sectional view of BB of the wafer support shown;

[0048] Figure 7 This is a schematic structural diagram of a wafer rotation support device according to an embodiment of the present application;

[0049] Figure 8 Another structural schematic diagram of a wafer rotation support device shown in an embodiment of the present application;

[0050] Fig. 9 This is another structural schematic diagram of the wafer rotation support device shown in the embodiment of the present application;

[0051] Fig.10 A schematic diagram of the wafer rotation support device in use according to an embodiment of the present application;

[0052] Fig.11 This is a schematic diagram of another use state of the wafer rotation support device shown in an embodiment of the present application;

[0053] Fig.12 It is a structural schematic diagram of a wafer rotation support device shown in an embodiment of the present application;

[0054] Fig.13 It is a schematic flow chart of a wafer rotation speed measurement method shown in an embodiment of the present application;

[0055] Reference numerals:

[0056] Wafer support seat 100; support assembly 110; support body 111; first support member 112, second support member 113; support shaft 120; driving wheel 130; first annular groove 131; speed measuring wheel 140; second annular groove 141; counterweight 150; connecting member 151; counterweight block 152; first bearing 150A; second bearing 160A; rotating shaft 160B; driven wheel 150B; driving wheel 150C; third bearing 170A; speed measuring assembly 18 0; transmission member 180A; magnet 181; bracket 182; Hall sensor 183; first support portion 1821; second support portion 1822; first mounting portion 113A; second mounting portion 113B; motor 191; driving active wheel 192; driving driven wheel 193; driving belt 194; support bearing 190A; wafer 200; wafer rotation support device 300; base 310; roller brush 320; first limit member 340; second limit member 350. DETAILED DESCRIPTION

[0057] The preferred embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the preferred embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.

[0058] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The singular forms of "a", "said" and "the" used in this application and the appended claims are also intended to include plural forms unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0059] It should be understood that although the terms "first", "second", "third", etc. may be used in the present application to describe various components, these components should not be limited to these terms. These terms are only used to distinguish components of the same type from each other. For example, without departing from the scope of the present application, the first component may also be referred to as the second component, and similarly, the second component may also be referred to as the first component. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0060] In the description of the present application, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0061] Unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0062] The cleaning device in the related art relies on two driving wheels at the bottom to drive the wafer, and the two driving wheels also play a supporting role. A tachometer wheel is set between the two driving wheels to monitor the speed of the wafer, which has the problem of unstable speed measurement. In addition, the tachometer wheel will also cause the contact position between the wafer and the driving wheel to be unstable, thus causing the speed to drop.

[0063] In response to the above problems, an embodiment of the present application provides a wafer support seat that can stably support the wafer and reduce the probability of wafer speed drop.

[0064] The technical solution of the embodiments of the present application is described in detail below with reference to the accompanying drawings.

[0065] See also Figures 1 to 6 According to one embodiment of the present application, a wafer support base 100 includes a support assembly 110 , a support shaft 120 , a driving wheel 130 , a speed measuring wheel 140 and a counterweight 150 .

[0066] The support assembly 110 is swingably connected to the support shaft 120, the driving wheel 130 is mounted on the support assembly 110, and the speed wheel 140 is mounted on the support assembly 110. The driving wheel 130 and the speed wheel 140 are arranged parallel to the rotation axis, and the circumferential outer edges of the driving wheel 130 and the speed wheel 140 are both provided with an annular groove for supporting the wafer. The counterweight 150 is connected to the support assembly 110 and is used to apply a swingable force to the support assembly 110.

[0067] In a specific implementation, a first annular groove 131 is formed on the circumferential outer edge of the driving wheel 130, and a second annular groove 141 is formed on the circumferential outer edge of the tachometer wheel 140. The wafer 200 is embedded in the first annular groove 131 and the second annular groove 141. The driving wheel 130 and the tachometer wheel 140 can support the wafer 200. The driving wheel 130 also drives the wafer 200 to rotate. The rotation of the wafer 200 drives the tachometer wheel 140 to rotate synchronously. The rotation speed of the wafer 200 can be obtained by measuring the rotation speed of the tachometer wheel 140.

[0068] See also Fig.10 Before the wafer 200 is placed into the driving wheel 130 and the speed measuring wheel 140, the wafer support 100 is moved outward (relative to Fig.10 After the wafer 200 is placed in the driving wheel 130 and the speed measuring wheel 140, the wafer support 100 is moved inward ( Fig.10 The wafer 200 is automatically aligned with the contact point by swinging in the direction of the arrow shown in the figure. At this time, contact point A, contact point B, contact point C and contact point D are in contact with the wafer 200 at the same time. Fig.11 , stably supporting the wafer 200.

[0069] In this embodiment, under the effect of the weight of the wafer 200 itself, the swinging driving wheel 130 and the tachometer wheel 140 will automatically find the supporting position of the wafer 200, the insertion depth of the wafer 200 in the driving wheel 130 and the tachometer wheel 140 can be kept stable, and the driving wheel 130 and the tachometer wheel 140 can stably support the wafer 200. In addition, the relative position displacement of the wafer 200 and the tachometer wheel 140 changes little, which can reduce the speed drop probability of the wafer 200.

[0070] In some embodiments, the support assembly 110 includes: a support body 111 , a first support member 112 , and a second support member 113 .

[0071] The support body 111 is swingably connected to the support shaft 120. The first support member 112 is connected to the support body 111, and the driving wheel 130 is installed on the first support member 112. The second support member 113 is connected to the support body 111 and is arranged at an angle with the first support member 112, and the speed measuring wheel 140 is installed on the second support member 113. The counterweight 150 is connected to the first support member 112 or the second support member 113. The first support member 112, the second support member 113 and the support body 111 can swing relative to the support shaft 120 as a whole.

[0072] Specifically, the first support member 112 and the support body 111, and the second support member 113 and the support body 111 are all fixedly connected, for example, by welding, riveting, etc., and the fixed connection fixes the support body 111, the first support member 112, and the second support member 113 as a whole, so that the three can swing together around the support shaft 120. The support body 111 can be connected to the support shaft 120 through the third bearing 170A, so that the support body 111 can swing relative to the support shaft 120.

[0073] The driving wheel 130 is mounted on the first support member 112, and the speed measuring wheel 140 is mounted on the second support member 113.

[0074] For measuring the rotation speed of the wafer 200, see Figure 1 and Fig.11 .

[0075] In a specific implementation, the driving wheel 130 is mounted on the first support member 112 through the first bearing 150A, and the speed measuring wheel 140 is mounted on the first support member 112 through the first bearing 150A.

[0076] The second bearing 160A is mounted on the second support member 113. The weight member 150 is connected to the first support member 112 or the second support member 113.

[0077] Specifically, the counterweight 150 is disposed on a side of the first support member 112 facing away from the second support member 113; or, the counterweight 150 is disposed on a side of the second support member 113 facing away from the first support member 112, so as to apply a force that allows the support body 111, the first support member 112 and the second support member 113 to swing as a whole.

[0078] In a specific implementation, see Figure 1 , the counterweight 150 is connected to the first support member 112, the driving wheel 130 is placed on the left, and the speed measuring wheel 140 is placed on the right.

[0079] In another specific implementation, see Figure 2 , the counterweight 150 is connected to the first support member 112, the driving wheel 130 is placed on the right side, and the speed measuring wheel 140 is placed on the left side.

[0080] In yet another specific implementation, see Figure 3 The counterweight 150 is connected to the second support member 113, the driving wheel 130 is placed on the right side, and the speed measuring wheel 140 is placed on the left side.

[0081] In yet another specific implementation, see Figure 4 The counterweight 150 is connected to the second support member 113, the driving wheel 130 is placed on the left, and the speed measuring wheel 140 is placed on the right.

[0082] It should be noted that the above-mentioned left and right are relative to the states shown in the figures and do not impose any limitation on the present application.

[0083] When using, see Fig.10 and Fig.11 , you can Figures 1 to 4 Any two counterweights 150 shown in the figure are arranged opposite to each other and are used in combination on the wafer support base 100 .

[0084] For example, Figure 1 The wafer support pedestal 100 shown in FIG. Figure 2 and Figure 4 The wafer support 100 shown in FIG. Fig.10 Shown Figure 1 and Figure 2 Use with status, Fig.11 Shown Figure 1 and Figure 4 Use with status), Figure 2 The wafer support pedestal 100 shown can be used with Figure 3 The wafer support 100 shown is used in conjunction with Figure 3 The wafer support pedestal 100 shown can be used with Figure 4 The wafer support 100 shown is used in conjunction with.

[0085] In some embodiments, the diameters of the driving wheel 130 and the tachometer wheel 140 are different. In other embodiments, the diameters of the driving wheel 130 and the tachometer wheel 140 are the same.

[0086] See also Figure 1 and Figure 5 , in some embodiments, further comprising: a driven wheel 150B and a driving wheel 150C. The driven wheel 150B is mounted on the rotating shaft of the driving wheel 130 and is coaxially arranged with the driving wheel 130. The driving wheel 150C is rotatably connected to the first support member 112 or the second support member 113, and the driving wheel 150C is used to be connected to a driving device (not shown in the figure), and the driving wheel 150C drives the driving wheel 130 to rotate through the driven wheel 150B.

[0087] In a specific implementation, the driven wheel 150B and the driving wheel 150C are both gears and can be directly meshed and connected.

[0088] In another specific implementation, the driven wheel 150B is connected to the driving wheel 150C through the transmission member 180A. Specifically, the driven wheel 150B and the driving wheel 150C are both pulleys, the transmission member 180A is a synchronous belt, and the driven wheel 150B and the driving wheel 150C are connected through the synchronous belt. Furthermore, the material of the synchronous belt can be corrosion-resistant material, such as polyurethane, fluororubber, etc.

[0089] In another specific implementation, the driven wheel 150B and the driving wheel 150C may also be gears, and the transmission member 180A may be a transmission chain.

[0090] In this embodiment, the active wheel 150C drives the driving wheel 130 to rotate through the driven wheel 150B, so that the driving wheel 130 runs more smoothly, thereby better ensuring the stability of wafer support and rotation.

[0091] In some embodiments, the support body 111, the first support member 112 and the second support member 113 may be integrally formed into a bent structure to increase the strength of the overall structure. For example, the support body 111, the first support member 112 and the second support member 113 form a V-shaped structure.

[0092] In some embodiments, the support body 111 is an angle adjustment member (not shown in the figure), wherein the first support member 112 and the second support member 113 are connected via the angle adjustment member, which is used to adjust the angle between the first support member 112 and the second support member 113 .

[0093] In a specific implementation, the angle adjustment member may include: an adjustment member and a locking member, the adjustment member is used to adjust the angle between the first support member 112 and the second support member 113, and the locking member is used to lock and fix the support body 111, the first support member 112 and the second support member 113.

[0094] For example, the angle adjustment member may include a bolt and a nut. The support body 111, the first support member 112 and the second support member 113 are all provided with connection holes, the bolts pass through the connection holes and are connected with the nuts, the first support member 112 and the second support member 113 can rotate around the bolts to adjust the angle, and the nuts can lock and fix them.

[0095] In specific implementation, a suitable angle can be selected according to the wafer size. For example, when the wafer size is large, the angle between the first support member 112 and the second support member 113 should also be large; when the wafer size is small, the angle between the first support member 112 and the second support member 113 should also be small. The specific value of the angle can be determined according to actual conditions, and this embodiment does not limit it.

[0096] In this embodiment, the angle between the first supporting member 112 and the second supporting member 113 is adjusted to adapt to wafers 200 of different sizes.

[0097] Furthermore, in some embodiments, the angle α between the first support member 112 and the second support member 113 (see Figure 2 , that is, the angle between the driving wheel 130 and the speed measuring wheel 140 ) ranges from 80° to 120°, for example, 90°, so as to provide more stable support for the wafer 200 .

[0098] See also Figure 6 In some embodiments, the invention further includes: a speed measuring component 180 for measuring the rotation speed of the speed measuring wheel 140 .

[0099] In a specific implementation, the speed measuring assembly 180 includes: a magnet 181, a bracket 182 and a Hall sensor 183. The magnet 181 is mounted on the speed measuring wheel 140, the bracket 182 is connected to the support body 111 and the second support member 113, and the Hall sensor 183 is mounted on the bracket 182 and corresponds to the position of the magnet 181 in the radial direction of the speed measuring wheel 140.

[0100] Specifically, the bracket 182 includes a first support portion 1821 and a second support portion 1822 that are arranged at an angle (e.g., arranged vertically) and fixedly connected, and the support shaft 120 is a hollow shaft (e.g., the diameter of the hollow hole can be 3 to 10 mm, preferably 6 mm). The first support portion 1821 is inserted into the hollow shaft, and the second support portion 1822 can be arranged at an angle (e.g., arranged vertically) to the rotating shaft of the speed wheel 140. It can be understood that the second support member 113 is provided with a first mounting portion 113A and a second mounting portion 113B for mounting the speed wheel 140, see Figure 6 The rotating shaft 160B of the speed wheel 140 is installed on the first mounting part 113A and the second mounting part 113B through the second bearing 160A, and the speed wheel 140 is placed between the first mounting part 113A and the second mounting part 113B. A mounting hole is provided on the side of the speed wheel 140 close to the first mounting part 113A, and a magnet 181 (for example, the magnet 181 is a cylindrical package with a diameter of 1.5 to 6 mm and a thickness of 1 to 2 mm, preferably with a diameter of 4 mm and a thickness of 1.5 mm) is provided in the mounting hole, and the mounting hole is covered by an end cover. The second support part 1822 is provided on the side of the first mounting part 113A away from the second mounting part 113B, and is connected to the second support member 113. The first mounting portion 113A has a through hole at a position corresponding to the magnet 181 . The Hall sensor 183 is mounted on the second supporting portion 1822 and extends into the through hole to cooperate with the magnet 181 to measure the rotation speed of the tachometer wheel 140 , that is, the rotation speed of the wafer 200 .

[0101] Furthermore, in some embodiments, a cover body is formed at the connection between the first support part 1821 and the second support part 1822, and a gap is set between the first support part 1821 and the hollow shaft. The cover body covers the end of the hollow shaft to seal the gap and prevent the wafer cleaning liquid from entering the gap.

[0102] Furthermore, in some embodiments, a gas for sealing is introduced into the gap between the first support portion 1821 and the hollow shaft.

[0103] Furthermore, in some embodiments, the interior of the bracket 182 is a hollow structure, and a connecting line of the Hall sensor 183 is passed through the hollow structure. The connecting line may be a signal transmission line of the Hall sensor 183, etc.

[0104] In some embodiments, see Figures 1 to 4 The counterweight 150 includes a connecting member 151 and a counterweight block 152 .

[0105] In a specific implementation, the connecting member 151 is connected to the side of the first supporting member 112 facing away from the second supporting member 113, and the counterweight 152 is connected to the connecting member 151. For example, the counterweight 152 is connected to an end of the connecting member 151 away from the second supporting member 113.

[0106] In another specific implementation, the connecting member 151 is connected to the side of the second supporting member 113 facing away from the first supporting member 112, and the counterweight 152 is connected to the connecting member 151. For example, the counterweight 152 is connected to one end of the connecting member 151 away from the first supporting member 112.

[0107] In a specific implementation, the connecting member 151 may be a connecting rod, and the counterweight block 152 may be a metal block, such as an iron block.

[0108] In this embodiment, the connection distance between the counterweight block 152 and the first support member 112 or the second support member 113 is increased to reduce the weight that the counterweight block 152 needs to be equipped with.

[0109] Furthermore, in some embodiments, the counterweight blocks 152 are at least two and are detachably connected to the connecting member 151 .

[0110] In a specific implementation, a sleeve rod is provided on the connecting member 151, and a sleeve hole is opened on the counterweight block 152. Each counterweight block 152 can be sequentially sleeved on the sleeve rod through the sleeve hole.

[0111] It can be understood that the weight setting of the counterweight block 152 is related to the weight of the wafer and the angle between the first support member 112 and the second support member 113. Generally speaking, the heavier the wafer, the greater the counterweight required. The greater the angle between the first support member 112 and the second support member 113, the greater the counterweight required. The specific selection of the weight of the counterweight member 150 can be determined according to actual conditions and is not limited here.

[0112] This embodiment can adapt to the weight requirements of wafers of different weights and the first support members 112 and the second support members 113 of different angles by setting the weight counterweight 150 to be adjustable, and has a wider range of applications.

[0113] In some embodiments, the distance from the rotating axis of the driving wheel 130 to the support axis 120 is equal to the distance from the rotating axis of the tachometer wheel 140 to the support axis 120, that is, the two swing arms swinging relative to the support axis 120 have the same length, which can provide more stable support for the wafer 200.

[0114] In some embodiments, the support shaft 120 is a hollow shaft, and the rotating shaft of the driving wheel 150C is rotatably disposed in the hollow shaft. Specifically, the driving wheel 150C and the support shaft 120 can be connected through a bearing.

[0115] In this embodiment, the rotating shaft of the driving wheel 150C is disposed inside the supporting shaft 120 to make the overall structure more compact.

[0116] See also Fig.12 In some embodiments, the driving wheel 192 further includes a motor 191, a driving active wheel 192, and a driving driven wheel 193. The driving active wheel 192 is connected to the output shaft of the motor 191, and the driving driven wheel 193 is installed on the rotating shaft of the driving wheel 150C and connected to the driving active wheel 192 through a synchronous belt or a transmission chain, etc. The motor 191 can drive the driving wheel 150C to rotate.

[0117] See also Figure 8 The embodiment of the present application also proposes a wafer rotation support device 300. As shown in the figure, the embodiment includes: a base 310, two wafer support seats 100 of any of the above-mentioned types, the support shaft 120 of each wafer support seat 100 is connected to the base 310, and the counterweights 150 of the two wafer support seats 100 are connected to the support assembly 110 and are arranged back to back.

[0118] It should be noted that the specific implementation process of the wafer support seat 100 can be found in the above description, and this embodiment will not be repeated here.

[0119] like Fig.10 and Fig.11As shown, before the wafer 200 is placed in the wafer support seat 100, the wafer support seat 100 swings outwards by the counterweight 150. Fig.11 The contact points A and C shown in the figure move upward. After the wafer 200 is placed in the wafer support 100, the wafer support 100 swings inwards by the gravity of the wafer 200 to automatically align the contact points with the wafer 200. At this time, the contact points A, B, C and D are in contact at the same time to stably support the wafer 200.

[0120] It should be noted that the inside and outside in this embodiment are relative to the state shown in the figure.

[0121] Since the wafer support seat 100 has the above-mentioned effects, the wafer rotation support device having the wafer support seat 100 also has corresponding technical effects.

[0122] Understandably, see Fig. 9 and Fig.12 In some embodiments, two motors 191 are installed on a side of the base 310 facing away from the wafer rotation support device 300, and the support shaft 120 is rotatably supported on the base 310 through a support bearing 190A.

[0123] The motor 191 drives the driving wheel 192 to rotate, and the driving wheel 192 drives the driven wheel 193 through the driving belt 194, thereby driving the driven wheel 150B to rotate.

[0124] In some embodiments, see Fig.10 , the structures of the two wafer support seats 100 are exactly the same.

[0125] In other embodiments, see Fig.11 , the two wafer support bases 100 have different structures.

[0126] In specific implementation, the angle β between the two wafer support seats 100 can be determined according to actual conditions. In one example, β is 89.5°.

[0127] See also Fig.11 When the wafer 200 is placed in the wafer support 100, the wafer support 100 swings by gravity to correct the insertion amount and contact state of the wafer 200. In this embodiment, contact points A and D are speed measuring wheels, and contact points C and B are driving wheels. When the wafer 200 rotates, at least one speed measuring wheel 140 and one driving wheel 130 are in contact with the wafer 200 at the same time, thereby reducing the speed drop of the wafer 200 and the inaccurate speed measurement phenomenon.

[0128] In some embodiments, the swing angle θ of each wafer support 100 relative to the base is 10° to 45°, see Fig.10 , the wafer 200 can be supported more stably within this swing angle.

[0129] Understandably, see Figure 8 and Fig. 9 In some embodiments, two rolling brushes 320 may be included. There is a preset distance between the two rolling brushes 320 and both are connected to the base 310. The wafer 200 is placed between the two rolling brushes 320 to make the wafer 200 more stable.

[0130] It should be noted that, during specific implementation, the preset distance can be determined according to actual conditions, and this embodiment does not impose any limitation thereto.

[0131] See also Figure 7 , Fig.10 and Fig.11 In some embodiments, two first limiting members 340 are also included, which are respectively arranged on the inner sides of the two wafer support seats 100 (relative to the state shown in the figure) and fixedly connected to the base 310 for limiting the wafer support seat 100 when rotating inward.

[0132] During specific implementation, the first limiting member 340 may be a limiting block, a limiting plate, or the like.

[0133] See also Fig.10 Before the wafer 200 is placed in the wafer support 100, the wafer support 100 is moved outward (relative to Fig.10 As shown in the state) swing, Fig.11 The four contact points A, B, C, and D shown move upward (relative to Fig.11 After the wafer 200 is placed in the wafer support 100, see Fig.11 , relying on the gravity of the wafer 200 to move the wafer support 100 inward (relative to Fig.10 As for the state shown in the figure, the wafer 200 is automatically aligned with the contact point when swinging, and the contact point A and the contact point B are in contact at the same time, and the first limit member 340 limits the wafer support seat 100 when swinging inward.

[0134] In this embodiment, selecting a suitable weight of the counterweight 150 can control the outward swing angle of the wafer support seat 100. During specific implementation, the weight of the counterweight 150 can be determined according to actual conditions.

[0135] Further, see Figure 7 , Fig.10 and Fig.11 In some embodiments, two second stoppers 350 are provided on opposite sides of the two wafer support seats 100 and are fixedly connected to the base 310 to move the wafer support seat 100 outward (relative to the wafer support seat 100). Fig.10 , Fig.11 The position is limited when rotating (for the state shown in FIG).

[0136] In this embodiment, each wafer support seat 100 can swing between the first limit member 340 and the second limit member 350. When the distance between the two first limit members 340 and the distance between the two second limit members 350 are larger, the size of the supported wafer 200 is also larger. In specific implementation, the position between the two first limit members 340 and the two second limit members 350 can be determined according to actual conditions.

[0137] In addition, the positions of the first stopper 340 and the second stopper 350 may be determined according to the weight of the wafer 200 .

[0138] Furthermore, the two first stoppers 340 and the two second stoppers 350 are connected to the base 310 in an adjustable manner. In a specific implementation, the base 310 is provided with at least two first plug holes, and the first stoppers 340 are first stoppers.

[0139] The first limiting pin can be inserted into any of the first plugging holes. Correspondingly, the base 310 is provided with at least two second plugging holes, and the second limiting member 350 is a second limiting pin, which can be inserted into any of the second plugging holes.

[0140] In this embodiment, by adjusting the insertion positions of the first stopper 340 and the second stopper 350 , the swing range of the wafer support seat 100 can be adjusted, thereby being able to adapt to wafers 200 of different sizes.

[0141] In some embodiments, a wafer support seat 100 is adjustably connected to the base 310 to adjust the angle between the support shafts 120 of two wafer support seats 100, thereby supporting wafers of different sizes.

[0142] Specifically, at least three mounting holes for the wafer support seat 100 are opened on the base 310, and one wafer support seat 100 can be installed in any mounting hole.

[0143] In some other embodiments, both wafer support bases 100 are connected to the base 310 in an adjustable manner.

[0144] Specifically, at least three mounting holes for the wafer support seat 100 are opened on the base 310, and two wafer support seats 100 can be installed in any two mounting holes.

[0145] In this embodiment, the distance between the two wafer support seats 100 is adjusted by selecting different mounting holes, and the angle β between the two wafer support seats 100 can also be adjusted to accommodate wafers 200 of different sizes.

[0146] An embodiment of the present application also proposes a wafer cleaning device, which includes a supply device, a spray device and any of the above-mentioned wafer rotation support devices.

[0147] Among them, the specific implementation process of the wafer rotation support device can refer to the above description, and this embodiment will not be repeated here.

[0148] Since the wafer rotation support device has the above-mentioned effects, the wafer cleaning device having the wafer rotation support device also has corresponding technical effects.

[0149] The present application also proposes a wafer rotation speed measurement method, see Fig.13 , the method comprises the following steps:

[0150] In step S100 , a wafer 200 is placed into any one of the above-mentioned wafer rotation support devices 300 and the wafer 200 is driven to rotate.

[0151] Step S200 , obtaining the rotation speeds of the tachometer wheels 140 in the two wafer support seats 100 .

[0152] Specifically, the rotation speed of the speed measuring wheel 140 is obtained through the speed measuring component.

[0153] Step S300 , determining the rotation speed of the wafer 200 according to the rotation speeds of the two tachometer wheels 140 .

[0154] In one implementation, the rotational speeds of the two tachometer wheels 140 may be compared, and the faster rotational speed may be used as the rotational speed of the wafer 200 .

[0155] Since the wafer 200 drives the tachometer wheel 140 to rotate, the measured speed of the tachometer wheel 140 is less than or equal to the rotation speed of the wafer 200 . Therefore, in this embodiment, the rotation speed of the tachometer wheel 140 with a faster speed is used as the rotation speed of the wafer 200 .

[0156] An embodiment of the present application also proposes a wafer cleaning method, which includes a cleaning step and a speed measurement step performed simultaneously, wherein the cleaning step includes, for example, brushing the wafer with a roller brush, and the speed measurement step includes detecting the wafer rotation speed by the aforementioned wafer rotation speed measurement method.

[0157] Since the wafer rotating device has the above-mentioned effects, the wafer rotation speed measurement method using the wafer rotating device also has corresponding technical effects, which will not be elaborated here.

[0158] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A wafer support seat, characterized in that: The wafer support seat is used to support a vertically placed wafer, and comprises: Support components; a support shaft, the support assembly being swingably connected to the support shaft; A driving wheel and a tachometer wheel installed on the support assembly, the driving wheel is used to drive the wafer to rotate, and the tachometer wheel is used to detect the rotation speed of the wafer. The driving wheel and the tachometer wheel are arranged parallel to the rotating shaft, and the circumferential outer edges of the driving wheel and the tachometer wheel are both provided with an annular groove for supporting the wafer; A counterweight is connected to the side of the support assembly facing away from the wafer, and is used to apply a swingable force to the support assembly, and the weight of the counterweight matches the weight of the wafer; before the wafer is placed in the wafer support seat, the counterweight causes the wafer support seat to swing outward, and after the wafer is placed in the wafer support seat, the gravity of the wafer causes the wafer support seat to swing inward, so that the driving wheel and the tachometer wheel automatically align the supporting position of the wafer.

2. The wafer support according to claim 1, characterized in that: The support assembly comprises: A support body, the support body being swingably connected to the support shaft; A first support member connected to the support body, and the driving wheel is mounted on the first support member; The second support member is connected to the support body and arranged at an angle with the first support member. The speed measuring wheel is installed on the second support member. The counterweight member is connected to the first support member or the second support member.

3. The wafer support according to claim 1, characterized in that: Also includes: A driven wheel, mounted on the rotating shaft of the driving wheel; The driving wheel is rotatably connected to the supporting assembly, and the driving wheel is used to be connected to the driving device to drive the driving wheel to rotate through the driven wheel.

4. The wafer support base according to claim 3, characterized in that: The driven wheel is meshingly connected with the driving wheel; or, The driven wheel is connected to the driving wheel through a transmission member.

5. The wafer support base according to claim 2, characterized in that: The support body, the first support member and the second support member are integrally formed into a bent structure.

6. The wafer support according to claim 2, characterized in that: The support body is an angle adjustment member, and the first support member and the second support member are connected through the angle adjustment member, which is used to adjust the angle between the first support member and the second support member.

7. The wafer support according to claim 6, characterized in that: The angle adjustment member comprises: Bolts and nuts, the support body, the first support member and the second support member are all provided with connecting holes, and the bolts pass through the connecting holes to be connected with the nuts.

8. The wafer support base according to claim 1, characterized in that: Also includes: The speed measuring component is used to measure the rotation speed of the speed measuring wheel.

9. The wafer support base according to claim 8, characterized in that: The speed measuring component comprises: A magnet, mounted on the speed measuring wheel; A bracket connected to the support assembly; The Hall sensor is mounted on the bracket and corresponds to the position of the magnet in the radial direction of the speed measuring wheel.

10. The wafer support base according to claim 9, characterized in that: The support shaft is a hollow shaft, and the bracket includes a first support portion and a second support portion that are arranged at an angle and connected to each other, the first support portion passes through the hollow shaft, and the Hall sensor is installed on the second support portion.

11. The wafer support base according to claim 10, characterized in that: A cover body is formed at the connection between the first supporting part and the second supporting part; A gap is provided between the first supporting portion and the hollow shaft, and the cover body is covered on the end of the hollow shaft to seal the gap.

12. The wafer support base according to claim 11, characterized in that: Gas for sealing is also introduced into the gap.

13. The wafer support base according to claim 9, characterized in that: The interior of the bracket is a hollow structure, and the connecting wire of the Hall sensor is passed through the hollow structure.

14. The wafer support base according to claim 2, characterized in that: The counterweight is disposed on a side of the first support member facing away from the second support member; or, The counterweight is arranged on a side of the second support member facing away from the first support member.

15. The wafer support base according to claim 2, characterized in that: The counterweight comprises: a connecting piece and a counterweight block; wherein, The connecting member is connected to a side of the first supporting member facing away from the second supporting member, and the counterweight is connected to the connecting member; or, The connecting member is connected to a side of the second supporting member facing away from the first supporting member, and the counterweight block is connected to the connecting member.

16. The wafer support base according to claim 15, characterized in that: The counterweight blocks are at least two and are detachably connected to the connecting member.

17. The wafer support base according to claim 6, characterized in that: The angle between the first support member and the second support member ranges from 80° to 120°.

18. The wafer support base according to claim 2, characterized in that: The distance between the rotating shaft of the driving wheel and the supporting shaft is equal to the distance between the rotating shaft of the speed measuring wheel and the supporting shaft.

19. The wafer support base according to claim 3, characterized in that: The supporting shaft is a hollow shaft, and the rotating shaft of the driving wheel is rotatably arranged through the hollow shaft.

20. The wafer support base according to claim 1, characterized in that: The driving wheel and the tachometer wheel have the same diameter.

21. The wafer support base according to claim 1, characterized in that: Also includes: Motor; A driving wheel connected to the output shaft of the motor; The driven wheel is mounted on the rotating shaft of the driving wheel and is connected to the driving wheel through a transmission member.

22. A wafer rotation support device, characterized in that: include: Pedestal; Two wafer support seats as described in any one of claims 1 to 21, wherein the support shaft of each wafer support seat is connected to the base, and the counterweights of the two wafer support seats are arranged back to back.

23. The wafer rotation support device according to claim 22, characterized in that: Also includes: The two first limiting members are respectively arranged on the inner sides of the two wafer supporting seats relative to each other and are fixedly connected to the base, so as to limit the wafer supporting seats when they rotate inward.

24. The wafer rotation support device according to claim 23, characterized in that: Also includes: The two second limiting members are respectively arranged on the outer sides of the two wafer supporting seats which are opposite to each other and are fixedly connected to the base, and are used for limiting the wafer supporting seats when they rotate outward.

25. The wafer rotation support device according to claim 24, characterized in that: The two first limiting members and the two second limiting members are both connected to the base in an adjustable manner.

26. The wafer rotation support device according to claim 25, characterized in that: The first limiting member is a first limiting pin, the base is provided with at least two first plugging holes, and the first limiting pin can be plugged into any of the first plugging holes; accordingly; The second limiting member is a second limiting pin, the base is provided with at least two second plugging holes, and the second limiting pin can be plugged into any one of the second plugging holes.

27. The wafer rotation support device according to claim 22, characterized in that: The swing range of each wafer support relative to the base is 10° to 45°.

28. The wafer rotation support device according to claim 22, characterized in that: At least one of the wafer support seats is adjustably connected to the base to adjust the angle between the support axes of the two wafer support seats.

29. The wafer rotation support device according to claim 22, characterized in that: The two wafer support seats have the same structure.

30. A wafer cleaning device, characterized in that: It comprises a supply device, a spray device and a wafer rotation support device as described in any one of claims 22 to 29.

31. A wafer rotation speed measurement method, characterized in that: include: Placing a wafer into the wafer rotation support device according to any one of claims 22 to 29 and driving the wafer to rotate; Obtaining the rotation speed of the tachometer wheels in the two wafer support seats in the wafer rotation support device; The rotation speed of the wafer is determined according to the rotation speeds of the two tachometer wheels.

32. The wafer rotation speed measurement method according to claim 31, characterized in that: Determining the rotation speed of the wafer according to the rotation speeds of the two tachometer wheels further comprises: comparing the rotational speeds of the two tachometer wheels; The faster rotation speed is used as the rotation speed of the wafer.

33. A wafer cleaning method, characterized in that: It includes a cleaning step and a speed measurement step that are performed simultaneously, and the speed measurement step includes detecting the wafer rotation speed by the wafer rotation speed measurement method as described in claim 31 or 32.

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