Method and apparatus for load impedance aware effective isotropic radiation power (EIRP) calibration in FR2 phased array transmitters
By adopting internal calibration routines in the UE, using a bidirectional coupler to receive signals and measure power, and determine the power correction value, the problem of high time and cost of the EIRP calibration process in the prior art is solved, and an efficient and accurate power detector is realized calibration.
Patent Information
- Application Number
- CN202411039785.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-01-25
- Filing Date
- 2024-07-31
- Publication Date
- 2025-02-14
AI Technical Summary
The prior art faces chip-to-chip variations across antenna arrays and antenna load impedance variations when calibrating the effective isotropic radiated power (EIRP) levels in user equipment (UE), resulting in higher OTA measurement time and cost.
Using an internal calibration routine, the power correction value is determined based on the relationship between the signal ratio and the load reflection coefficient by receiving a signal at a bidirectional coupler of the antenna path and measuring the power delivered to the antenna.
This method reduces the time and cost of the calibration process, realizes optimized power detector calibration based on antenna load, and improves the accuracy and efficiency of EIRP calibration.
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Figure CN119449200A_ABST
Abstract
Description
[0001] CROSS-REFERENCE TO RELATED APPLICATIONS
[0002] This application claims priority to U.S. Provisional Application No. 63 / 517,025, filed on August 1, 2023, and U.S. Patent Application No. 18 / 422,459, filed on January 25, 2024, the disclosures of which are incorporated herein by reference in their entirety as if fully set forth herein. Technical Field
[0003] The present disclosure relates generally to user equipment (UE) power maintenance. More specifically, the subject matter disclosed herein relates to improvements to methods for calibrating the effective isotropic radiated power (EIRP) level of a UE based on antenna loading. Background Art
[0004] Ensuring the required radiated power level with a low error margin is critical to UE operation. Furthermore, maintaining a high level of accuracy in the EIRP levels sent from the UE has a direct impact on radio link performance, UE battery life and regulation.
[0005] Calibrating EIRP levels using on-chip power detectors can present many challenges due to chip-to-chip variations across antenna arrays and antenna load impedance variations. This can lead to expensive and time-consuming calibration processes at different stages (e.g., at the module level or UE level).
[0006] To address this issue, a set of calibration values can be established based on over-the-air (OTA) EIRP measurements and can be used to calibrate the power detectors in each antenna path, which will compensate for the above-mentioned variations. These calibration values can be determined for individual and simultaneous operation in each antenna path.
[0007] One problem with the above approach is that OTA measurements are cumbersome and may require a significant amount of time and cost. Summary of the invention
[0008] To overcome this problem, systems and methods are described herein for an internal calibration routine to estimate load impedance with the ability to optimize power detector calibration based on antenna loading.
[0009] This method improves upon previous methods in that the calibration routine is completely self-contained and does not require equipment for OTA EIRP measurements, thereby reducing the time and cost required.
[0010] In an embodiment, an antenna communication method is provided, in which a third signal may be received at a bidirectional coupler of an antenna path. A third power delivered to an antenna of the antenna path may be measured based on a fourth signal and a fifth signal, wherein the fourth signal corresponds to a second forward signal provided to the antenna from the bidirectional coupler and the fifth signal corresponds to a second reverse signal reflected from the antenna back to the bidirectional coupler. A power correction value may be determined based on a ratio of the fourth signal to the fifth signal and a one-to-one relationship between the ratio and a load reflection coefficient of the antenna. A fourth power delivered to the antenna may be determined based on the third power and the power correction value.
[0011] In an embodiment, an antenna communication method is provided, in which a first signal and a second signal may be determined for each of a plurality of simulated reflection coefficients at a bidirectional coupler of an antenna path, wherein the first signal corresponds to a first forward signal provided from the bidirectional coupler to an antenna of the antenna path, and the second signal corresponds to a first reverse signal reflected from the antenna back to the bidirectional coupler. An input signal to the bidirectional coupler may be maintained for each of the plurality of simulated reflection coefficients. A first power may be measured for each of the plurality of simulated reflection coefficients based on the first signal and the second signal. A second power delivered to the antenna may be determined for each of the plurality of simulated reflection coefficients based on the corresponding reflection coefficient, and a corresponding power correction value may be determined based on the first power and the second power. A lookup table associating the corresponding reflection coefficient, a ratio of the first signal to the second signal, and the corresponding power correction value may be generated for each of the plurality of simulated reflection coefficients.
[0012] In an embodiment, a UE is provided, the UE including a phased array, each antenna path of the phased array including an antenna and a bidirectional coupler. The UE also includes a processor and a non-transitory computer-readable storage medium storing instructions. The instructions, when executed, cause the processor to perform the following operations: for each antenna path: receiving a third signal at the bidirectional coupler, measuring a third power delivered to the antenna based on a fourth signal corresponding to a second forward signal provided to the antenna from the bidirectional coupler and a fifth signal corresponding to a second reverse signal reflected back from the antenna to the bidirectional coupler, determining a power correction value based on a ratio of the fourth signal to the fifth signal and a one-to-one relationship between the ratio and a load reflection coefficient of the antenna, and determining a fourth power delivered to the antenna based on the third power and the power correction value. The determined powers from the antenna paths may be summed, and the EIRP of the phased array may be determined based on the summed powers and the antenna gain of the phased array. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] In the following sections, various aspects of the subject matter disclosed herein will be described with reference to exemplary embodiments shown in the drawings, in which:
[0014] Figure 1 is a diagram showing a communication system according to an embodiment;
[0015] Figure 2 is a diagram showing a transmit mode phased array with a bidirectional coupler incorporated after the PA in each antenna path for transmit power monitoring according to an embodiment;
[0016] Figure 3 is a diagram showing a circuit level representation of a transmit path with a bidirectional coupler and a specific antenna load according to an embodiment;
[0017] Figure 4 is a flow chart illustrating a method for generating a lookup table (LUT) for EIRP calibration of a phased array according to an embodiment;
[0018] Figure 5 is a flow chart illustrating a method for determining the EIRP of a phased array based on a pre-generated LUT according to an embodiment; and
[0019] Figure 6 is a block diagram of an electronic device in a network environment according to an embodiment. DETAILED DESCRIPTION
[0020] In the following detailed description, many specific details are set forth in order to provide a thorough understanding of the present disclosure. However, those skilled in the art will appreciate that the disclosed aspects may be practiced without these specific details. In other cases, well-known methods, processes, components, and circuits are not described in detail to avoid obscuring the subject matter disclosed herein.
[0021] References throughout this specification to "one embodiment" or "an embodiment" refer to specific features, structures, or characteristics described in conjunction with the embodiment that may be included in at least one embodiment disclosed herein. Therefore, the phrases "in one embodiment" or "in an embodiment" or "according to an embodiment" (or other phrases with similar meanings) that appear in various places throughout this specification may not necessarily all refer to the same embodiment. In addition, specific features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In this regard, as used herein, the word "exemplary" means "used as an example, instance, or illustration." Any embodiment described herein as "exemplary" should not be interpreted as necessarily being preferred or advantageous over other embodiments. In addition, specific features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In addition, depending on the context discussed herein, singular terms may include corresponding plural forms, and plural terms may include corresponding singular forms.
[0022] In addition, depending on the context discussed herein, singular terms may include corresponding plural forms, and plural terms may include corresponding singular forms. It should also be noted that the various drawings (including component drawings) shown and discussed herein are for illustrative purposes only and are not drawn to scale. For example, for clarity, the size of some elements may be exaggerated relative to other elements. In addition, if deemed appropriate, reference numerals are repeated in the drawings to indicate corresponding and / or similar elements.
[0023] The terms used herein are only used for the purpose of describing some example embodiments and are not intended to limit the claimed subject matter. As used herein, unless the context clearly indicates otherwise, the singular form is intended to also include the plural form. It will be further understood that when used in this specification, the terms "include" and / or "comprise" specify the presence of features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.
[0024] It should be understood that when an element or layer is referred to as being on, "connected to" or "coupled to" another element or layer, it may be directly on, connected to or coupled to another element or layer, or there may be intermediate elements or layers. Conversely, when an element is referred to as being "directly on," "directly connected to" or "directly coupled to" another element or layer, there are no intermediate elements or layers. The same reference numerals always represent the same element. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.
[0025] As used herein, the terms "first", "second", etc. are used as labels for the nouns preceding them, and do not imply any type of ordering (e.g., spatial, temporal, logical, etc.) unless explicitly defined as such. In addition, the same reference numerals may be used in two or more figures to refer to parts, components, blocks, circuits, units, or modules having the same or similar functions. However, such use is only for simplicity of illustration and ease of discussion; this does not imply that the construction or architectural details of such components or units are the same in all embodiments, or that such commonly referenced parts / modules are the only way to implement some example embodiments disclosed herein.
[0026] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the subject matter belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and will not be interpreted in an idealized or overly formal sense unless explicitly defined as such in this article.
[0027] As used herein, the term "module" refers to any combination of software, firmware, and / or hardware configured to provide the functionality described herein in conjunction with the module. For example, software may be implemented as a software package, code, and / or instruction set or instructions, and the term "hardware" as used in any embodiment described herein may include, for example, individually or in any combination, components, hardwired circuits, programmable circuits, state machine circuits, and / or firmware storing instructions executed by programmable circuits. Modules may be implemented collectively or individually as circuits that form part of a larger system, such as, but not limited to, an integrated circuit (IC), a system on a chip (SoC), a component, etc.
[0028] Figure 1 is a diagram showing a communication system according to an embodiment. Figure 1In the architecture shown in FIG. 1 , a control path 102 may enable control information to be sent through a network established between a base station or gNode B (gNB) 104, a first UE 106, and a second UE 108. A data path 110 may enable data (and some control information) to be sent on a side link between the first UE 106 and the second UE 108. The control path 102 and the data path 110 may be on the same frequency, or may be on different frequencies.
[0029] Figure 2 is a diagram illustrating a transmit mode phased array transmission with a bidirectional coupler incorporated after the PA in each antenna path for transmit power monitoring according to an embodiment. A transmitter in frequency range-2 (FR2) may involve the use of a phased array with multiple power amplifiers (PAs) and antennas. Thus, multiple antenna paths (e.g., 202 l and 202 n ). In each antenna path, a in The input signal is provided to PA 204, which can provide amplified power to bidirectional coupler 206 and then to corresponding antenna 208. Bidirectional coupler 206 can be used as a sensing device for power control purposes. On-chip power detector 210 can use the output b from bidirectional power coupler 206 to 3 and b 4 to detect the power delivered to antenna 208. The on-chip power detector 210 may require calibration to correlate the readings with the actual transmit power, and the detected readings from the power detectors in each antenna path may be combined to estimate the total transmit EIRP level.
[0030] According to an embodiment, a method for calibrating the EIRP of a FR2 transmit phased array is provided. This method may be independent of any changes in load impedance and that may occur due to different materials in close proximity to the antenna (e.g., due to the UE housing). The EIRP calibration may be adjusted to reduce estimation inaccuracies.
[0031] An internal calibration routine is provided that can be used at UE level or module level to estimate antenna loading and thereby calibrate the on-chip power detector. For example, the method for EIRP calibration can be based on a LUT that is generated based on a reference load-pull (LP) measurement without requiring any OTA EIRP measurement, making it a cost- and time-effective solution for calibration in large-scale production lines.
[0032] Figure 3 is a diagram showing a circuit level representation of a transmit path with a bidirectional coupler and a specific antenna load according to an embodiment.
[0033] Specifically, Figure 3 FIG. 1 shows a transmit path hardware design in which an input power P may be received at PA 304. in , and the bidirectional coupler 306 can help sense the power provided to the antenna 308 and the power due to the antenna load Z L The power reflected back by any impedance mismatch (e.g., load reflection coefficient Γ L The bidirectional coupler 306 (and the associated non-idealities) may be represented by a four-port network including a first port 314, a second port 316, a third port 318, and a fourth port 320. Each port has a corresponding input a i and output b i (For example, a 1 、b 1 、a 2 、b 2 、b 3 、b 4 ), and the inputs (a 3 and a 4 ) may be assumed to be zero. The bidirectional coupler 306 may include non-ideal factors 322 (such as parasitics and other loading effects), which may be represented by S parameters and corresponding ports (e.g., S 21 , S 22 , S 31 , S 32 , S 41 , S 42 )express.
[0034] The b output from the third port 318 and the fourth port 320 of the bidirectional coupler 306 may be used. 3 and b 4 signal to determine the power delivered to the load. 3 and b 4 The corresponding power levels of the signal can be sampled and read as 0 and 2 P -1, where P is the number of bits in the analog-to-digital converter (ADC) used in the power detector. These ADC readback (RB) levels can be related to the actual power radiated using a proportionality constant, which may be referred to herein as calibration of the antenna path. The power detector RB values may not always be linear and may include nonlinearities from finite coupler directivity, parasitic effects, and / or different loading effects.
[0035] The antenna 308 connected to the second port 316 (e.g., a radio frequency (RF) port) of the bidirectional coupler 306 may have a frequency-dependent return loss and gain distribution that may complicate the calibration process. In fifth generation (5G) FR2 operation, multiple non-identical antenna paths may be involved in the phased array beamformer, resulting in a complex calibration that fuses each power detector RB value to predict the actual radiated EIRP level.
[0036] Return to reference Figure 3 , signal b 3 and b 4 The first input signal a received at the first port 314 of the bidirectional coupler 306 may be 1 To express it, as shown in equation (1) and equation (2).
[0037]
[0038]
[0039] Assuming the coupler directivity is sufficient, the quantity |b 3 | 2 -|b 4 | 2 can be used to represent the power delivered to the load and can be expressed as shown in equation (3) below.
[0040]
[0041] As mentioned above, sensing |b 3 | 2 -|b 4 | 2 The power detector of the analog signal value can use an ADC to read the detector reading and can generate an integer level as RB, which can be expressed as K(|b 3 | 2 -|b 4 | 2 ), where K is the proportionality constant. The power delivered to the load P d It can be expressed as shown in equation (4), so the power calibration value P corr (for P d With K(|b 3 | 2 -|b 4 | 2 ) can take the form shown in equation (5).
[0042]
[0043]
[0044] As shown in equation (5), the power calibration value P corr Can depend on the load reflection coefficient Γ L , load reflection coefficient Γ L The load impedance Z L and the output impedance of the RF integrated circuit (RFIC) port seen by the load.
[0045] In a phased array, due to array geometry and mutual coupling, the effective impedance seen by each RFIC output port can be different in each antenna path, which can cause the calibration coefficient to be different for each antenna path. In order to estimate the load impedance and select the load-dependent calibration coefficient for each antenna path, the reflection coefficient Γ is shown in the following equation (6) L to b 3 / b 4 Mapping of complex-valued gains.
[0046]
[0047] Since antenna arrays are typically used for FR2 cellular operation, the transmitted EIRP level depends on the total antenna array gain G array and the total power delivered to the array P d,array , where the EIRP level P can be calculated as shown in equation (7) EIRP .
[0048] P EIRP =G array ·P d,array (7)
[0049] The value P can be calculated based on the power delivered to each antenna port d,array , as shown in equation (8), where P d,i is the power delivered to each ith antenna, where i∈[1,N], and N represents the number of total antenna elements in the array.
[0050]
[0051] The power detector reading P at each i-th antenna path can be det,i and the calibration factor P of the path corr,i P is calculated as shown in equation (9): d,i Therefore, the estimated EIRP level P can be derived as shown in the following equation (10): EIRP,est .
[0052] P d,i =P corr,i ·P det,i (9)
[0053]
[0054] As shown in formula (6), b 3 / b 4 With Γ L There is a one-to-one relationship. This allows the actual antenna impedance or load reflection coefficient Γ to be estimated using internal measurements L , and allows the use of load impedance aware power calibration factors in the UE based on a preset reference map. For the reference map, the LP measurement (LPM) setting can be used to generate a table with sufficiently sampled Smith chart load points to calculate the power factor according to the reflection coefficient Γ at the load. L Create a mapping, for example, as shown in Table 1. Assuming that the variation between the output impedances between antenna paths is small, the table can be created based on the data of one port. The power delivered to the simulated load in the LP tuner (P d ) and the corresponding power detector reading (P det ) can be used to calculate P in column 4 of Table 1 corr This LUT can be used to calculate the b based on the measured / calculated b at each antenna path of the phased array module. 3 / b 4 The complex-valued gain is used to find the load-dependent P corr .
[0055] Table 1
[0056]
[0057] This can be accomplished by sending a known baseband signal x[n] (where n is the sample index) and capturing and post-processing b 3 [n] and b 4 [n] baseband signal samples (with the same sampling rate as x[n]) to obtain b in Table 1 3 / b 4 Ratio. Each captured signal b 3 [n] and b 4 [n] can be cross-correlated with the transmitted signal samples separately for time alignment to obtain c p [m], as shown in equation (11), where b p p in [n]=3 or 4.
[0058] c p [m] = ∑ n (x * [n]b p [n+m]), where m,n∈ Z & p∈[3,4] (11)
[0059] If in equation (11), b 3 [n] and b 4 The cross-correlation peaks of [n] appear at m=m and m=m respectively.4 At this point, the complex-valued gain ratio can be calculated as shown in equation (12), called b 3 / b 4 .
[0060]
[0061] During calibration, b of each i-th path 3 / b 4 Ratio β i can be measured and can be shown as the algorithm in Table 2. The measured β i The value can be used to obtain the corresponding P from a pre-stored LUT (e.g., Table 1) corr,i The obtained P corr,i The value can be used to estimate the EIRP value P EIRP,est , as shown in equation (10) above, where G array Can be based on measurements or simulations for a specific operating frequency.
[0062] Table 2
[0063]
[0064]
[0065] Figure 44 is a flow chart illustrating a method for generating a LUT for EIRP calibration of a phased array according to an embodiment. At 402, for each of a plurality of simulated reflection coefficients at a bidirectional coupler of an antenna path, a first signal corresponding to a first forward signal provided from the bidirectional coupler to an antenna of the antenna path may be captured (as described above with respect to equation (1)), and a second signal corresponding to a first reverse signal reflected from the antenna back to the bidirectional coupler may be captured (as described above with respect to equation (2)). For each of a plurality of simulated reflection coefficients, the input signal of the bidirectional coupler remains the same. At 404, for each of a plurality of simulated reflection coefficients, a power reading (i.e., a first power) may be measured by an on-chip power detector based on the first signal and the second signal, as described above with respect to equation (3). At 406, for each of a plurality of simulated reflection coefficients, a second power delivered to a load may be determined based on the corresponding reflection coefficient, as described above with respect to equation (4). At 408, for each of the plurality of simulated reflection coefficients, a power correction value may be determined based on a ratio of the second power determined at 406 to the power determined at 404, as described above with respect to equation (5). At 410, for each of the plurality of simulated reflection coefficients, a LUT mapping the corresponding reflection coefficient, the first ratio of the first signal to the second signal, and the power correction value may be generated. The bidirectional coupler may include a first port receiving the input signal, a second port outputting the first signal, a third port outputting the second signal, and a fourth port outputting the first forward signal and receiving the first reverse signal.
[0066] Figure 5 is a flow chart illustrating a method for determining an EIRP of a phased array based on a pre-generated LUT according to an embodiment. At 502, a third signal may be received at a bidirectional coupler of an antenna path connected to an actual antenna load. The third signal may be provided to the bidirectional coupler from a power amplifier in the antenna path.
[0067] At 504, a power detector may be used to measure a third power delivered to the antenna of the antenna path based on a fourth signal corresponding to a second forward signal provided to the antenna from the bidirectional coupler and a fifth signal corresponding to a second reverse signal reflected from the antenna back to the bidirectional coupler. The bidirectional coupler may include a first port that receives the third signal, a second port that outputs the fourth signal, a third port that outputs the fifth signal, and a fourth port that outputs the second forward signal and receives the second reverse signal. The fourth signal and the fifth signal may be based on the third signal and a corresponding loading effect for one or more of the first port or the second port.
[0068] At 506, a power correction value may be determined based on a ratio of the fourth signal to the fifth signal and the LUT. The ratio may be a complex-valued gain measurement ratio. The LUT associates the ratio of the fourth signal to the fifth signal and the power correction value based on a one-to-one relationship between the ratio of the fourth signal to the fifth signal and the corresponding load reflection coefficient, as described above with respect to Figure 4 Specifically, the power correction value may be selected from the LUT entry having a ratio closest to the measured ratio of the fourth signal and the fifth signal.
[0069] At 508, a fourth power delivered to the antenna may be determined based on the third power and the power correction value. The antenna path may be part of a phased array having multiple antenna paths. The fourth power may be summed with one or more powers determined to be provided to antennas in the remaining antenna paths of the phased array. At 510, an EIRP of the phased array may be determined based on the summed power and the antenna gain of the phased array.
[0070] Figure 6 is a block diagram of electronic devices in a network environment 600 according to an embodiment.
[0071] Reference Figure 6 , the electronic device 601 in the network environment 600 may communicate with the electronic device 602 via a first network 698 (e.g., a short-range wireless communication network), or communicate with the electronic device 604 or the server 608 via a second network 699 (e.g., a long-range wireless communication network). The electronic device 601 may communicate with the electronic device 604 via the server 608. The electronic device 601 may include a processor 620, a memory 630, an input device 650, a sound output device 655, a display device 660, an audio module 670, a sensor module 676, an interface 677, a haptic module 679, a camera module 680, a power management module 688, a battery 689, a communication module 690, a user identification module (SIM) card 696, or an antenna module 697. In one embodiment, at least one of the above components (e.g., the display device 660 or the camera module 680) may be omitted from the electronic device 601, or one or more other components may be added to the electronic device 601. Some of the above components may be implemented as a single integrated circuit (IC).For example, the sensor module 676 (eg, a fingerprint sensor, an iris sensor, or an illumination sensor) may be embedded in the display device 660 (eg, a display).
[0072] The processor 620 may execute software (eg, program 640 ) to control at least one other component (eg, hardware component or software component) of the electronic device 601 connected to the processor 620 , and may perform various data processing or calculations.
[0073] As at least part of the data processing or calculation, the processor 620 may load commands or data received from another component (e.g., the sensor module 676 or the communication module 690) into the volatile memory 632, process the commands or data stored in the volatile memory 632, and store the resultant data in the non-volatile memory 634. The processor 620 may include a main processor 621 (e.g., a central processing unit (CPU) or an application processor (AP)) and an auxiliary processor 623 (e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operationally independent or combined with the main processor 621. Additionally or alternatively, the auxiliary processor 623 may be adapted to consume less power than the main processor 621, or to perform a specific function. The auxiliary processor 623 may be implemented to be separate from the main processor 621, or to be implemented as part of the main processor 621.
[0074] When the main processor 621 is in an inactive (e.g., sleep) state, the auxiliary processor 623 (rather than the main processor 621) may control at least some of the functions or states related to at least one component (e.g., display device 660, sensor module 676, or communication module 690) among the components of the electronic device 601, or when the main processor 621 is in an active state (e.g., running an application), the auxiliary processor 623 may control at least some of the functions or states related to at least one component (e.g., display device 660, sensor module 676, or communication module 690) among the components of the electronic device 601 together with the main processor 621. The auxiliary processor 623 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., a camera module 680 or a communication module 690) that is functionally related to the auxiliary processor 623.
[0075] The memory 630 may store various data used by at least one component of the electronic device 601 (e.g., the processor 620 or the sensor module 676). The various data may include, for example, software (e.g., the program 640) and input data or output data for commands related thereto. The memory 630 may include a volatile memory 632 or a non-volatile memory 634. The non-volatile memory 634 may include an internal memory 636 and an external memory 638.
[0076] The program 640 may be stored as software in the memory 630 , and may include, for example, an operating system (OS) 642 , middleware 644 , or an application 646 .
[0077] The input device 650 may receive commands or data to be used by other components (eg, the processor 620) of the electronic device 601 from outside the electronic device 601 (eg, a user). The input device 650 may include, for example, a microphone, a mouse, or a keyboard.
[0078] The sound output device 655 can output a sound signal to the outside of the electronic device 601. The sound output device 655 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records, and the receiver can be used to receive incoming calls. The receiver can be implemented as a separate speaker or as part of the speaker.
[0079] The display device 660 may visually provide information to the outside (e.g., user) of the electronic device 601. The display device 660 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. The display device 660 may include a touch circuit adapted to detect a touch or a sensor circuit (e.g., a pressure sensor) adapted to measure the strength of a force caused by a touch.
[0080] The audio module 670 can convert sound into an electrical signal and vice versa. The audio module 670 can obtain sound via the input device 650, or output sound via the sound output device 655 or an earphone of an external electronic device 602 directly (eg, wired) or wirelessly connected to the electronic device 601.
[0081] The sensor module 676 may detect an operating state (e.g., power or temperature) of the electronic device 601 or an environmental state (e.g., a state of a user) outside the electronic device 601, and then generate an electrical signal or data value corresponding to the detected state. The sensor module 676 may include, for example, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.
[0082] The interface 677 may support one or more specific protocols to be used to connect the electronic device 601 directly (e.g., wired) or wirelessly with the external electronic device 602. The interface 677 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.
[0083] The connection end 678 may include a connector via which the electronic device 601 may be physically connected to the external electronic device 602. The connection end 678 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
[0084] The haptic module 679 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via tactile or kinesthetic sense. The haptic module 679 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.
[0085] The camera module 680 may capture still images or moving images. The camera module 680 may include one or more lenses, an image sensor, an image signal processor, or a flash. The power management module 688 may manage the power supply to the electronic device 601. The power management module 688 may be implemented as at least part of a power management integrated circuit (PMIC), for example.
[0086] The battery 689 may power at least one component of the electronic device 601. The battery 689 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.
[0087] The communication module 690 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 601 and an external electronic device (e.g., electronic device 602, electronic device 604, or server 608), and perform communication via the established communication channel. The communication module 690 may include one or more communication processors capable of operating independently from the processor 620 (e.g., AP) and supporting direct (e.g., wired) communication or wireless communication. The communication module 690 may include a wireless communication module 692 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 694 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate via a first network 698 (e.g., a short-range communication network such as Bluetooth TM , Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA) standards) or a second network 699 (e.g., a long-distance communication network such as a cellular network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN)))) to communicate with an external electronic device. These various types of communication modules can be implemented as a single component (e.g., a single IC), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple ICs). The wireless communication module 692 can use user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 696 to identify and authenticate the electronic device 601 in a communication network (such as the first network 698 or the second network 699).
[0088] The antenna module 697 may transmit or receive a signal or power to or from the outside of the electronic device 601 (e.g., an external electronic device). The antenna module 697 may include one or more antennas, and at least one antenna suitable for a communication scheme used in a communication network (such as the first network 698 or the second network 699) may be selected from the plurality of antennas by, for example, the communication module 690 (e.g., the wireless communication module 692). A signal or power may then be transmitted or received between the communication module 690 and the external electronic device via the selected at least one antenna.
[0089] The antenna module 697 may include Figure 2 A phased array of antenna paths as shown and described, and each antenna path may include a ... Figure 3 The PA, bidirectional coupler, power detector, and antenna are shown and described.
[0090] A command or data may be sent or received between the electronic device 601 and the external electronic device 604 via the server 608 connected to the second network 699. Each of the electronic device 602 and the electronic device 604 may be a device of the same type as the electronic device 601, or a device of a different type from the electronic device 601. All or some operations to be executed in the electronic device 601 may be executed in one or more of the external electronic device 602, the external electronic device 604, or the server 608. For example, if the electronic device 601 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 601 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 601 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices that receive the request may execute at least part of the requested function or service, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 601. The electronic device 601 may provide the result as at least a partial reply to the request with or without further processing the result. To this end, for example, cloud computing technology, distributed computing technology, or client-server computing technology may be used.
[0091] The subject matter and the embodiments of the operation described in this specification may be implemented in digital electronic circuits, or in computer software, firmware or hardware (including the structures disclosed in this specification and their structural equivalents, or a combination of one or more of them). The embodiments of the subject matter described in this specification may be implemented as one or more computer programs encoded on a computer storage medium for execution or control of the operation of a data processing device, that is, one or more modules of computer program instructions. Alternatively or additionally, the program instructions may be encoded on an artificially generated propagation signal (e.g., a machine-generated electrical, optical or electromagnetic signal), which is generated to encode information to be sent to a suitable receiver device for execution by a data processing device. The computer storage medium may be in a computer-readable storage device, a computer-readable storage substrate, a random or serial access memory array or device, or a combination thereof, or the computer storage medium may be included in a computer-readable storage device, a computer-readable storage substrate, a random or serial access memory array or device, or a combination thereof. In addition, although the computer storage medium is not a propagation signal, the computer storage medium may be the source or destination of the computer program instructions encoded in the artificially generated propagation signal. The computer storage medium may also be one or more separate physical components or media (e.g., multiple CDs, disks, or other storage devices), or the computer storage medium may be included in one or more separate physical components or media (e.g., multiple CDs, disks, or other storage devices). In addition, the operations described in this specification may be implemented as operations performed by a data processing device on data stored on one or more computer-readable storage devices or received from other sources.
[0092] Although this specification may contain many specific implementation details, the implementation details should not be interpreted as limiting the scope of any claimed subject matter, but rather as a description of features specific to a particular embodiment. Specific features described in the context of a separate embodiment in this specification may also be implemented in combination in a single embodiment. On the contrary, the various features described in the context of a single embodiment may also be implemented in multiple embodiments individually or in any suitable sub-combination. In addition, although the features may be described above as functioning in a particular combination and even initially claimed as such, one or more features from the claimed combination may be deleted from the combination in some cases, and the claimed combination may be directed to a sub-combination or a variation of the sub-combination.
[0093] Similarly, although operations are depicted in a particular order in the accompanying drawings, this should not be understood as requiring that the operations be performed in the particular order shown or in a sequential order, or that all of the operations shown be performed, to achieve the desired results. In certain circumstances, multitasking and parallel processing may be advantageous. In addition, the separation of various system components in the above-described embodiments should not be understood as requiring such separation in all embodiments, and it should be understood that the described program components and systems can generally be integrated together in a single software product or packaged into multiple software products.
[0094] Thus, particular embodiments of the subject matter have been described herein. Other embodiments are within the scope of the appended claims. In some cases, the actions set forth in the claims can be performed in a different order and still achieve the desired results. Furthermore, the processes depicted in the accompanying drawings do not necessarily require the particular order or sequential order shown to achieve the desired results. In particular embodiments, multitasking and parallel processing may be advantageous.
[0095] As those skilled in the art will recognize, the innovative concepts described herein are susceptible to modification and variation in a wide range of applications. Therefore, the scope of the claimed subject matter should not be limited to any specific exemplary teachings discussed above, but rather is defined by the appended claims.
Claims
1. An antenna communication method, comprising: determining, for each of a plurality of simulated reflection coefficients at a bidirectional coupler of an antenna path, a first signal and a second signal, wherein the first signal corresponds to a first forward signal provided from the bidirectional coupler to an antenna of the antenna path and the second signal corresponds to a first reverse signal reflected from the antenna back to the bidirectional coupler, wherein an input signal is maintained for each of the plurality of simulated reflection coefficients; For each of the plurality of simulated reflection coefficients, measuring a first power based on the first signal and the second signal; for each simulated reflection coefficient of the plurality of simulated reflection coefficients, determining a second power delivered to the antenna based on the corresponding reflection coefficient; For each of the plurality of simulated reflection coefficients, determining a corresponding power correction value based on the first power and the second power; and For each simulated reflection coefficient of the plurality of simulated reflection coefficients, a lookup table is generated that associates the corresponding reflection coefficient, a first ratio of the first signal to the second signal, and the corresponding power correction value.
2. The method according to claim 1, further comprising: applying a third signal to the bidirectional coupler; measuring a third power delivered to the antenna based on a fourth signal and a fifth signal, wherein the fourth signal corresponds to a second forward signal provided from the bidirectional coupler to the antenna and the fifth signal corresponds to a second reverse signal reflected from the antenna back to the bidirectional coupler; determining a power correction value based on the lookup table and a second ratio of the fourth signal to the fifth signal; and A fourth power delivered to the antenna is determined based on the third power and the power correction value.
3. The method according to claim 2, wherein: The bidirectional coupler includes a first port receiving the input signal and the third signal, a second port outputting the first signal and the fourth signal, a third port outputting the second signal and the fifth signal, and a fourth port outputting the first forward signal and the second forward signal and receiving the first reverse signal and the second reverse signal; and The first power and the third power are measured by an on-chip power detector.
4. The method according to claim 3, wherein: The fourth signal and the fifth signal are based on the third signal and a corresponding loading effect for one or more of the first port or the second port.
5. The method according to claim 2, wherein: The third signal is received at the bidirectional coupler from a power amplifier in the antenna path.
6. The method according to claim 2, wherein: The second ratio comprises a complex-valued gain measurement ratio.
7. The method according to claim 2, wherein: The antenna path is part of a phased array comprising a plurality of antenna paths, and the method further comprises: adding the fourth power to one or more powers determined to be delivered to antennas in remaining antenna paths of the phased array; and The effective isotropic radiated power (EIRP) of the phased array is determined based on the added power and the antenna gain of the phased array.
8. An antenna communication method, comprising: receiving a third signal at a bidirectional coupler in the antenna path; measuring a third power delivered to the antenna of the antenna path based on a fourth signal and a fifth signal, wherein the fourth signal corresponds to a second forward signal provided from the bidirectional coupler to the antenna and the fifth signal corresponds to a second reverse signal reflected from the antenna back to the bidirectional coupler; determining a power correction value based on a ratio of the fourth signal to the fifth signal and a one-to-one relationship between the ratio and a loading reflection coefficient of the antenna; as well as A fourth power delivered to the antenna is determined based on the third power and the power correction value.
9. The method according to claim 8, wherein: The bidirectional coupler includes a first port for receiving the third signal, a second port for outputting the fourth signal, a third port for outputting the fifth signal, and a fourth port for outputting the second forward signal and receiving the second reverse signal; and The third power is measured by an on-chip power detector.
10. The method according to claim 9, wherein: The fourth signal and the fifth signal are based on the third signal and a corresponding loading effect for one or more of the first port or the second port.
11. The method according to claim 8, wherein: The third signal is received at the bidirectional coupler from a power amplifier in the antenna path.
12. The method according to claim 8, wherein: The power correction value is determined based on a lookup table LUT that associates ratios with power correction values based on the one-to-one relationship, and the power correction value is selected from a LUT entry having a ratio closest to a ratio of the fourth signal to the fifth signal.
13. The method according to claim 8, wherein: The ratio comprises a complex-valued gain measurement ratio.
14. The method according to claim 8, wherein: The antenna path is part of a phased array comprising a plurality of antenna paths, and the method further comprises: adding the fourth power to one or more powers determined to be delivered to antennas in remaining antenna paths of the phased array; and The effective isotropic radiated power (EIRP) of the phased array is determined based on the added power and the antenna gain of the phased array.
15. A user equipment UE, comprising: A phased array, wherein each antenna path of the phased array comprises an antenna, a bidirectional coupler and a power detector; Processor; and A non-transitory computer-readable storage medium storing instructions that, when executed, cause the processor to perform the following operations: for each antenna path: receiving a third signal at the bidirectional coupler; measuring, at the power detector, a third power delivered to the antenna based on a fourth signal and a fifth signal, wherein the fourth signal corresponds to a second forward signal provided from the bidirectional coupler to the antenna and the fifth signal corresponds to a second reverse signal reflected from the antenna back to the bidirectional coupler; determining a power correction value based on a ratio of the fourth signal to the fifth signal and a one-to-one relationship between the ratio and a loading reflection coefficient of the antenna; and determining a fourth power delivered to the antenna based on the third power and the power correction value; summing the determined powers from each antenna path; and The effective isotropically radiated power (EIRP) of the phased array is determined based on the summed power and the antenna gain of the phased array.
16. The UE according to claim 15, wherein: The bidirectional coupler includes a first port receiving the third signal, a second port outputting the fourth signal, a third port outputting the fifth signal, and a fourth port outputting the second forward signal and receiving the second reverse signal.
17. The UE according to claim 16, wherein: The fourth signal and the fifth signal are based on the third signal and a corresponding loading effect for one or more of the first port or the second port.
18. The UE according to claim 15, wherein: Each antenna path also includes a power amplifier that provides the third signal to the bidirectional coupler.
19. The UE according to claim 15, wherein: The power correction value is determined based on a lookup table LUT that associates ratios with power correction values based on the one-to-one relationship, and the power correction value is selected from a LUT entry having a ratio closest to a ratio of the fourth signal to the fifth signal.
20. The UE according to claim 15, wherein: The ratio comprises a complex-valued gain measurement ratio.