SMD-LED lamp bead and packaging process thereof

Abstract

The application provides an SMD-LED lamp bead packaging process, comprising obtaining a support semi-finished product module; obtaining a positioning jig; dispensing glue in a plurality of lens forming grooves and a plurality of packaging grooves of the support semi-finished products respectively; turning over the support semi-finished product module, and making the plurality of packaging grooves of the support semi-finished products respectively and directly opposite to the plurality of lens forming grooves; making the plurality of packaging grooves of the support semi-finished products respectively and directly corresponding to the plurality of lens forming grooves; closing the upper die plate to the lower die plate; baking and curing; and fusing the glue in the lens forming grooves to the surface of the support semi-finished product and forming a lens. Through the setting of the lens forming grooves, the glue in the lens forming grooves is fused to the surface of the support semi-finished product to form a lens, which has the advantage of lower cost compared with the traditional mode of mold pressing and glue injection. Meanwhile, through the setting of the first positioning pin and the second positioning pin, the support bearing plate and the die strip can be accurately positioned respectively, so that the plurality of support semi-finished products and the plurality of lens forming grooves can accurately form a one-to-one corresponding relationship.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of lamp bead production, in particular to an SMD-LED lamp bead and a packaging process thereof. BACKGROUND

[0002] The packaging of the SMD LED refers to packaging of the LED light-emitting chip in the bracket. The function of the packaging is to provide sufficient protection for the chip, prevent the chip from being exposed to air for a long time or being damaged mechanically, and improve the stability of the chip.

[0003] At present, the packaging of the SMD-LED lamp bead mainly has three modes of glue dotting, glue injection and mold pressing. The traditional glue dotting mode is to directly dot the packaging glue into the packaging groove of the bracket, but this mode can only form a flat surface on the surface of the bracket and cannot form a lens structure, not to mention forming a lens structure with a specific shape. The application scene is narrow. The lens structure with a specific shape needs to be formed through the glue injection mode for packaging. However, the volume of the bracket semi-finished product is small, and the glue injection packaging needs to be simultaneously performed on multiple bracket semi-finished products. Therefore, the precision requirement of the glue injection mold is high, and the mold for forming different shapes of the lens needs to be reformed. The mold is long in reforming time and high in cost, and the packaging cost is increased. SUMMARY

[0004] In view of the deficiencies of the prior art, the application provides an SMD-LED lamp bead and a packaging process thereof.

[0005] The packaging process of the SMD-LED lamp bead disclosed in the application comprises the following steps: obtaining a bracket semi-finished product module; the bracket semi-finished product module comprises a plurality of bracket semi-finished products, and the bracket semi-finished product has a packaging groove; obtaining a positioning jig; the positioning jig comprises an upper mold plate, a lower mold plate and a mold strip, the mold strip is arranged on the lower mold plate, and the surface of the mold strip has a plurality of lens forming grooves; respectively dotting glue in the plurality of lens forming grooves and the packaging grooves of the plurality of bracket semi-finished products; turning over the bracket semi-finished product module, and making the packaging grooves of the plurality of bracket semi-finished products respectively and one by one correspond to the plurality of lens forming grooves; closing the upper mold plate on the lower mold plate, pressing the bracket semi-finished product module on the mold strip, and making the plurality of bracket semi-finished products respectively and one by one correspond to the plurality of lens forming grooves; baking and curing; fusing the glue in the lens forming grooves on the surface of the bracket semi-finished product and forming a lens; demolding and stripping; and obtaining a plurality of SMD-LED lamp beads.

[0006] Preferably, the positioning jig further comprises a plurality of first positioning pins, the plurality of first positioning pins are arranged on the surface of the lower mold plate, and the bracket semi-finished product module is provided with a plurality of first positioning holes corresponding to the positions of the plurality of first positioning pins.

[0007] The step of connecting the packaging grooves of the plurality of support semi-finished products with the plurality of lens forming grooves one by one comprises the following sub-steps: making the plurality of first positioning pins correspond to the plurality of first positioning holes one by one; inserting the plurality of first positioning pins into the plurality of first positioning holes one by one; and connecting the packaging grooves of the plurality of support semi-finished products with the plurality of lens forming grooves one by one.

[0008] Preferably, the lower mold plate is provided with a plurality of lower mold grooves, and a plurality of mold strips are correspondingly arranged in the plurality of lower mold grooves.

[0009] The step of obtaining the positioning jig comprises the following sub-steps: selecting a corresponding mold strip according to the shape of the lens to be formed, wherein the mold strip is provided with a lens forming groove matching the shape of the lens; selecting a lower mold plate provided with a lower mold groove capable of bearing the mold strip; arranging the plurality of mold strips in the plurality of lower mold grooves; and selecting an upper mold plate matching the lower mold plate to obtain the positioning jig.

[0010] Preferably, each mold strip is provided with a second positioning hole, and the positioning jig further comprises a plurality of second positioning pins arranged in the lower mold groove.

[0011] When the plurality of mold strips are arranged in the plurality of lower mold grooves, the plurality of mold strips are positioned and arranged in the preset positions of the lower mold groove through the cooperation of the second positioning hole and the second positioning pin.

[0012] Preferably, the lower mold plate is provided with at least two guide pins, and the upper mold plate is provided with a guide hole corresponding to the position of the guide pin.

[0013] The upper mold plate is matched with the lower mold plate through the cooperation of the guide pin and the guide hole.

[0014] Preferably, the baking and curing step further comprises the following step: performing vacuumizing treatment on the lens forming groove and the packaging groove to remove bubbles in the glue.

[0015] Preferably, the mold strip comprises a mold strip body and a plurality of lens forming bodies, the mold strip body is provided with a plurality of mounting holes arranged in sequence and at intervals, the plurality of lens forming bodies are correspondingly arranged in the plurality of mounting holes, each lens forming body is provided with a lens forming groove, and the second positioning hole is arranged on the surface of the mold strip body close to the side edge.

[0016] The step of selecting a corresponding mold strip according to the shape of the lens to be formed comprises the following sub-steps: selecting a corresponding lens forming body according to the shape of the lens to be formed, wherein the lens forming body is provided with a lens forming groove matching the shape of the lens; arranging the plurality of lens forming bodies in the plurality of mounting holes; and obtaining a mold strip corresponding to the shape of the lens to be formed.

[0017] Preferably, the positioning jig further comprises a pressing plate provided with a through hole and a plurality of through holes.

[0018] After the step of respectively installing the plurality of mold strips into the lower mold groove, the method further comprises the following steps: covering the plurality of mold strips with a pressing plate, and allowing the first positioning pin to pass through the through hole, and allowing the plurality of lens forming bodies to be respectively located in the plurality of through holes.

[0019] Preferably, before the dispensing step in the plurality of lens forming grooves and the plurality of packaging grooves of the support semi-finished product, the method further comprises the following steps: performing preliminary dispensing in the plurality of packaging grooves of the support semi-finished product; and baking and curing the preliminary dispensing, and performing sealing on the chip in the packaging groove after the glue fusion.

[0020] The application also discloses an SMD-LED lamp bead prepared by using the SMD-LED lamp bead packaging process.

[0021] The application has the beneficial effect that the dispensing is performed in the plurality of lens forming grooves and the plurality of packaging grooves of the support semi-finished product, the glue in the packaging groove forms a sealing structure in the packaging groove after glue fusion to seal the LED chip in the packaging groove, and the glue in the lens forming groove forms a lens on the surface of the support semi-finished product after glue fusion, so that the lens can be formed on the surface of the support semi-finished product without the glue injection process, the high manufacturing cost of the glue injection mold is avoided, and the production cost is reduced.

[0022] Meanwhile, through cooperation of the first positioning pin and the first positioning hole, it is ensured that the plurality of support semi-finished products can be accurately inserted into the lens forming grooves one by one when the support carrier plate is placed on the surface of the mold strip, and it is ensured that the lens of the corresponding shape can be accurately formed on the surface of each support semi-finished product, thereby improving the packaging efficiency and product quality.

[0023] In addition, through cooperation of the second positioning pin and the second positioning hole, each mold strip can be accurately positioned and installed on the preset position of the lower mold groove, and through positioning of the mold strip and the support carrier plate respectively, it is ensured that the positions of the plurality of support semi-finished products and the plurality of lens forming grooves can accurately form a one-to-one corresponding relationship, thereby ensuring that each lens can be correspondingly formed on the surface of the support semi-finished product. BRIEF DESCRIPTION OF DRAWINGS

[0024] The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiments of the application and serve to explain the principles of the application. In the drawings:

[0025] Figure 1 FIG. 1 is a structural schematic view of a support semi-finished product module in an embodiment;

[0026] Figure 2 FIG. 2 is a structural schematic view of a support semi-finished product module and a positioning jig in an embodiment;

[0027] Figure 3This is a schematic structural diagram of the lower template in Example 2;

[0028] Figure 4 This is a structural schematic diagram of the lower template after the pressure plate is removed in Example 2;

[0029] Figure 5 This is a schematic structural diagram of the lower mold plate after the pressing plate and mold strips are removed in Example 2;

[0030] Figure 6 Schematic diagram of the structure of the mold strip in Example 2;

[0031] Figure 7 This is a schematic structural diagram of the pressure plate in Example 2;

[0032] Figure 8 This is a flow chart of the SMD-LED lamp bead packaging process in Example 3.

[0033] Reference numerals:

[0034] 1. Bracket semi-finished product module; 11. Bracket bearing plate; 12. Bracket semi-finished product; 13. First positioning hole; 2. Positioning fixture; 21. Upper template; 211. Guide hole; 22. Lower template; 221. Lower mold groove; 222. Guide pin; 23. Mold strip; 231. Mold strip body; 2311. Second positioning hole; 232. Lens molding body; 2321. Lens molding groove; 24. First positioning pin; 25. Second positioning pin; 26. Press plate; 261. Through hole; 262. Through hole. DETAILED DESCRIPTION

[0035] The following diagrams illustrate various embodiments of the present application. For clarity, many practical details will be included in the following description. However, it should be understood that these practical details are not intended to limit the present application. In other words, in some embodiments of the present application, these practical details are not essential. Furthermore, to simplify the drawings, some conventional structures and components are depicted in a simplified schematic manner.

[0036] It should be noted that all directional indications such as up, down, left, right, front, back, etc. in the embodiments of the present application are only used to explain the relative position relationship, movement status, etc. between the various components in a certain specific posture as shown in the accompanying drawings. If the specific posture changes, the directional indication will also change accordingly.

[0037] In addition, the description such as "first", "second" and the like in the present application is only for the purpose of description, and does not mean to indicate or imply the order or sequence, nor to limit the present application. It is merely to distinguish the components or operations described by the same technical terms, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second" can explicitly or implicitly include at least one of the features. In addition, the technical solutions of various embodiments can be combined with each other, but it must be based on the realization of ordinary skilled in the art. When the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, nor within the protection scope required by the present application.

[0038] In order to further understand the application content, characteristics and effects of the present application, the following examples are given, and the detailed description is given as follows with reference to the accompanying drawings.

[0039] Example one:

[0040] Referring to Figure 1 , Figure 1 The structure diagram of the support semi-finished product module in example one, the support semi-finished product module 1 in the present embodiment includes a support bearing plate 11 and a plurality of support semi-finished products 12, the plurality of support semi-finished products 12 are respectively arranged on the support bearing plate 11, and the plurality of support semi-finished products 12 are arranged in a matrix. At least one packaging groove is formed on the surface of each support semi-finished product 12. In the present embodiment, three packaging grooves are formed on the surface of each support semi-finished product 12, and one LED chip is loaded in each packaging groove. It can be understood that the support semi-finished product 12 in the present embodiment is a lamp bead support formed after sequentially passing through the injection molding, die bonding and wire bonding processes, and the support semi-finished product module 1 is an LED support whole plate composed of a plurality of lamp bead supports connected with each other. Further, a plurality of first positioning holes 13 are formed on the side edge of the support bearing plate 11, the plurality of first positioning holes 13 are sequentially and spaced apart on the support bearing plate 11 along the long edge direction of the support bearing plate 11, and the plurality of first positioning holes 13 are linearly arranged and close to one side edge of the length direction of the support bearing plate 11. The plurality of support semi-finished products 12 are arranged in a matrix of multiple rows and multiple columns. In order to facilitate the introduction, the long edge direction of the support bearing plate 11 is referred to as the row, and the short edge direction of the support bearing plate 11 is referred to as the column. Each first positioning hole 13 is on the same straight line with the support semi-finished product 12 in one column.

[0041] It can be understood that the support semi-finished product 12 in the embodiment will form an SMD-LED lamp bead after packaging. Specifically, the SMD-LED lamp bead includes a support body, three single-color chips, and a lens body. The support body surface is provided with three accommodating cavities arranged in a linear interval. The three single-color chips are respectively arranged in the three accommodating cavities. The lens body includes a lens cover and three lenses respectively arranged on the lens cover. The lens cover is arranged on the surface of the support body, and the three lenses are respectively arranged on the three single-color chips. The accommodating cavities are formed by the packaging grooves on the support semi-finished product 12 and the glue solidified in the packaging grooves. The lenses are formed by the glue solidified in the lens forming grooves 2321.

[0042] Embodiment two

[0043] Referring to Figure 2 and Figure 3 , Figure 2 is a structural schematic view of a support semi-finished product module and a positioning jig in embodiment two, Figure 3 is a structural schematic view of a lower mold plate in embodiment two. The positioning jig 2 in the embodiment includes an upper mold plate 21, a lower mold plate 22, and a mold strip 23. The mold strip 23 is arranged on the lower mold plate 22, and the surface of the mold strip 23 is provided with a plurality of lens forming grooves 2321. In specific applications, the surface of the lower mold plate 22 is provided with a plurality of lower mold grooves 221, and a plurality of mold strips 23 are respectively arranged in the plurality of lower mold grooves 221. The surface of each mold strip 23 is provided with a plurality of lens forming grooves 2321. In the embodiment, each mold strip 23 is provided with two rows of lens forming grooves 2321. The plurality of lower mold grooves 221 are arranged in sequence along the length direction of the lower mold plate 22. The plurality of mold strips 23 are arranged in sequence and correspondingly arranged in the plurality of lower mold grooves 221, so that the plurality of lens forming grooves 2321 are arranged in a matrix on the surface of the lower mold plate 22.

[0044] Referring to Figure 4 and Figure 5 , Figure 4 is a structural schematic view of the lower mold plate after the disassembly of the pressing plate in embodiment two, Figure 5As shown in FIG. 2, the lower mold plate 22 is provided with a plurality of first positioning pins 24. The first positioning pins 24 are used to cooperate with the first positioning holes 13 in the support carrier 11. When the first positioning pins 24 are respectively inserted into the first positioning holes 13, the support carrier half-finished product 1 can be effectively positioned and fixed on the lower mold plate 22 at a predetermined position, so that the packaging grooves of the support carrier half-finished product 12 are respectively and correspondingly connected to the lens forming grooves 2321. In this embodiment, the number of the first positioning pins 24 is three. The three first positioning pins 24 are linearly and spacedly arranged and are located on the side of the lens forming grooves 2321. It should be noted that each column of the support carrier half-finished product 12 on the support carrier 11 is provided with the first positioning holes 13, and the number of the first positioning pins 24 is only three, which are respectively arranged on the side of the three columns of the lens forming grooves 2321. The three first positioning pins 24 are respectively and correspondingly inserted into the three first positioning holes 13, so that the packaging grooves of the support carrier half-finished product 12 are respectively and correspondingly connected to the lens forming grooves 2321. Compared with arranging more first positioning pins 24, the positioning effect is equivalent, and the time required for positioning is saved.

[0045] Referring to Figure 6 , Figure 6For the structural schematic diagram of the mold strip in Embodiment Two, preferably, each mold strip 23 is provided with a second positioning hole 2311, and the positioning jig 2 further comprises a plurality of second positioning pins 25, which are respectively arranged in the lower mold groove 221. In specific application, each mold strip 23 is provided with two positioning holes, which are respectively located at the two sides in the length direction of the mold strip 23, and the plurality of second positioning pins 25 are divided into two rows, which are respectively close to the two opposite side walls of the lower mold groove 221, and each second positioning hole 2311 corresponds to the position of a second positioning pin 25. In this way, through the cooperation of the second positioning hole 2311 and the second positioning pin 25, the plurality of mold strips 23 are positioned and installed at the preset positions of the lower mold groove 221. Further, through the arrangement of the second positioning hole 2311 and the second positioning pin 25, the mold strip 23 can be detachably installed in the lower mold groove 221. Since the shape of the lens forming groove 2321 is the shape of the lens after curing, when it is required to form lenses of different shapes (such as circular arc, ellipse, irregular ellipse, etc., which are irregular ellipses in this embodiment) on the surface of the support semi-finished product 12, or when it is required to form a corresponding number of lenses according to the number of the surface packaging grooves of the support semi-finished product 12, the mold strip 23 can be disassembled and replaced with a mold strip 23 having a lens forming groove 2321 of a corresponding shape, thereby widening the application scenarios. Further, since the mold strip 23 is a consumable product and will be damaged after a long time of use, the detachable arrangement can disassemble and replace the mold strip 23 after it is damaged, thereby saving the material cost of manufacturing the upper mold plate 21 and the lower mold plate 22. Specifically, the mold strip 23 comprises a mold strip main body 231 and a plurality of lens forming bodies 232, the mold strip main body 231 is provided with a plurality of installation holes arranged in sequence and at intervals, and the plurality of lens forming bodies 232 are respectively installed in the plurality of installation holes. Each lens forming body 232 is provided with a lens forming groove 2321, and the second positioning hole 2311 is arranged at a position close to the side edge of the surface of the mold strip main body 231.

[0046] Referring back to Figures 3-6 , preferably, the surface of the lower mold plate 22 is provided with at least two guide pins 222, and the upper mold plate 21 is provided with guide holes 211 corresponding to the positions of the guide pins 222. In specific application, the number of the guide pins 222 and the guide holes 211 in this embodiment is two, the two guide pins 222 are respectively arranged at the diagonal positions of the lower mold plate 22, and the two guide holes 211 are respectively arranged at the diagonal positions of the upper mold plate 21. Through the arrangement of the guide pins 222 and the guide holes 211, the upper mold plate 21 and the lower mold plate 22 can be accurately clamped, the support carrier plate 11 can be pressed and attached to the surface of the mold strip 23, and the surface of the support semi-finished product 12 can be correspondingly inserted into the lens forming groove 2321.

[0047] Referring back to Figure 7 , Figure 7As shown in the structural schematic diagram of the pressing plate in Embodiment Two, preferably, the positioning jig 2 further comprises a pressing plate 26, which is provided with a through hole 261 and a plurality of through holes 262. In practical applications, when the pressing plate 26 is placed on the surface of the plurality of die strip bodies 231, the first positioning pin 24 passes through the through hole 261, and the plurality of lens forming bodies 232 are correspondingly arranged in the plurality of through holes 262. The through holes 262 are long strips, and the plurality of through holes 262 are arranged in sequence along the length direction of the lower mold plate 22. The plurality of lens forming bodies 232 in the same column are arranged in the same through hole 262. In this way, the pressing plate 26 also plays a role in assisting the positioning of the lens forming bodies 232. At the same time, when the pressing plate 26 is placed on the surface of the plurality of die strip bodies 231, the pressing plate 26 plays a role in supporting the bracket carrier plate 11. The surface of the bracket semi-finished product 12 enters the through hole 262 and corresponds to the lens forming groove 2321. It needs to be particularly pointed out that the surface of the bracket semi-finished product 12 does not enter the groove bottom of the lens forming groove 2321. In this way, the thickness of the lens can also be adjusted by changing the thickness of the pressing plate 26 to adjust the depth of the bracket semi-finished product 12 extending into the lens forming groove 2321, so as to adjust the thickness of the formed lens.

[0048] It needs to be particularly pointed out that through the cooperation of the first positioning pin 24 and the first positioning hole 13, it is ensured that when the bracket carrier plate 11 is placed on the surface of the die strip 23, the plurality of bracket semi-finished products 12 can be correspondingly and accurately arranged in the lens forming groove 2321, so as to ensure that the lens of the corresponding shape can be accurately formed on the surface of each bracket semi-finished product 12, and the packaging efficiency and product quality are improved. In addition, through the cooperation of the second positioning pin 25 and the second positioning hole 2311, each die strip 23 can be accurately positioned and installed at the preset position of the lower mold groove 221. Through the positioning of the die strip 23 and the bracket carrier plate 11 respectively, it is ensured that the positions of the plurality of bracket semi-finished products 12 and the plurality of lens forming grooves 2321 can accurately form a one-to-one corresponding relationship, so as to ensure that each lens can be correspondingly formed on the surface of the bracket semi-finished product 12.

[0049] Embodiment Three

[0050] Referring to Figure 8 , Figure 8 As shown in the flowchart of the SMD-LED lamp bead packaging process in Embodiment Three, the SMD-LED lamp bead packaging process in this embodiment comprises the following steps:

[0051] S1: Obtain the bracket semi-finished product module 1. The bracket semi-finished product module 1 comprises a plurality of bracket semi-finished products 12, and the bracket semi-finished product 12 has a packaging groove. In practical applications, the bracket semi-finished product module 1 in this embodiment is prepared after the bracket semi-finished product module 1 in Embodiment One is sequentially subjected to the injection molding, die bonding and wire bonding processes, and the first positioning hole 13 is arranged on the side of each column of bracket semi-finished products 12. Here, no further description is given.

[0052] S2: Obtain a positioning jig 2. The positioning jig 2 includes an upper mold plate 21, a lower mold plate 22, and a mold strip 23 provided on the lower mold plate 22, and the mold strip 23 has a plurality of lens forming grooves 2321 on the surface. In specific applications, the shape of the lens forming groove 2321 is the shape of the lens to be formed on the surface of the support semi-finished product 12. The positioning jig 2 in this embodiment is the style of Example 2.

[0053] Preferably, the S2 step includes the following sub-steps:

[0054] S21: Select the corresponding mold strip 23 according to the shape of the lens to be formed, wherein the mold strip 23 has a lens forming groove 2321 that matches the shape of the lens. In specific applications, since the shape of the lens forming groove 2321 is the shape of the lens formed by curing the glue, when different shapes of lenses (such as circular arc, ellipse, irregular ellipse, etc.) need to be formed on the surface of the support semi-finished product 12, or when a corresponding number of lenses need to be formed according to the number of packaging grooves on the surface of the support semi-finished product 12, only the type of lens forming groove 2321 needed is determined according to the type of lens to be formed, and then the mold strip 23 with the corresponding lens forming groove 2321 is selected. In this way, by only replacing the mold strip 23, different shapes and different numbers of lenses can be formed, which widens the application scenarios and greatly saves the cost of mold manufacturing compared with the method of injecting glue to form lenses. Specifically, the mold strip 23 includes a mold strip body 231 and a plurality of lens forming bodies 232, the mold strip body 231 is provided with a plurality of installation holes arranged in sequence and at intervals, and the plurality of lens forming bodies 232 are respectively installed in the plurality of installation holes. Each lens forming body 232 is provided with a lens forming groove 2321, and a second positioning hole 2311 is provided on the surface of the mold strip body 231 close to the side edge. It can be understood that the mold strip body 231 is a metal piece obtained by stamping, and the lens forming body 232 can be obtained by mold injection. The lens forming body is provided with a lens forming groove 2321, and the lens forming body 232 is a consumable product. When needed, the corresponding lens forming body 232 is selected according to the shape of the lens to be formed, wherein the lens forming body 232 has a lens forming groove 2321 that matches the shape of the lens. The lens forming body 232 is installed in the installation hole to obtain the required mold strip 23, which improves the adaptability.

[0055] S22: Select a lower mold plate 22, which has a lower mold groove 221 capable of bearing the mold strip 23. In specific applications, one side of the lower mold plate 22 facing the upper mold plate 21 is provided with a groove, and the lower mold groove 221 is a long strip. A plurality of lower mold grooves 221 are arranged in sequence and side by side in the groove, and each lower mold groove 221 corresponds to a column of lens forming bodies 232. The lower mold groove 221 is used for the part of the lens forming body 232 that extends through the mold strip body 231 to the bottom of the mold strip body 231, and also serves to assist in positioning the mold strip body 231.

[0056] S23: A plurality of mold strips 23 are respectively installed in the lower mold groove 221. In specific applications, each mold strip 23 has two rows of lens forming bodies 232, that is, each mold strip 23 corresponds to two lower mold grooves 221. The two side edges of the length direction of each mold strip body 231 are provided with second positioning holes 2311, and the lower mold plate 22 is provided with a plurality of second positioning pins 25, which are divided into two rows. The two rows of second positioning pins 25 are respectively close to the opposite two side walls of the lower mold groove 221. Through the cooperation of the second positioning hole 2311 and the second positioning pin 25, the plurality of mold strips 23 are positioned and installed at the preset position of the lower mold groove 221, ensuring the accuracy of the position of the mold strip 23, thereby ensuring that the plurality of lens forming grooves 2321 are accurately located at the preset position of the lower mold groove 221, and each mold strip body 231 is positioned at both ends by two second positioning pins 25, which avoids the shaking of the mold strip body 231, further improving the accuracy of the position.

[0057] S24: The pressing plate 26 is covered on the surface of the plurality of mold strip bodies 231, the first positioning pin 24 passes through the hole 261, and the plurality of lens forming bodies 232 are respectively located in the plurality of through holes 262. Through the setting of the pressing plate 26, the pressing plate 26 also plays a role in assisting the positioning of the position of the lens forming body 232. When the pressing plate 26 is covered on the surface of the plurality of mold strip bodies 231, the pressing plate 26 plays a supporting role on the support carrier plate 11. The surface of the support semi-finished product 12 enters the through hole 262 and corresponds to extend into the lens forming groove 2321. It needs to be particularly pointed out that the surface of the support semi-finished product 12 does not extend into the groove bottom of the lens forming groove 2321. In this way, the depth of the support semi-finished product 12 extending into the lens forming groove 2321 can be adjusted by changing the thickness of the pressing plate 26, so as to adjust the thickness of the formed lens.

[0058] S25: The upper mold plate 21 suitable for the lower mold plate 22 is selected to obtain the positioning jig 2. In specific applications, the surface of the lower mold plate 22 is provided with two guide pins 222, and the upper mold plate 21 is provided with two guide holes 211 corresponding to the positions of the guide pins 222. The upper mold plate 21 is guided by the cooperation of the guide pins 222 and the guide holes 211 and the lower mold plate 22 is combined. Through the setting of the guide pins 222 and the guide holes 211, the upper mold plate 21 and the lower mold plate 22 can be accurately combined, that is, the upper mold plate 21 can only move in the vertical direction relative to the lower mold plate 22, avoiding the horizontal displacement of the upper mold plate 21 leading to the displacement of the support semi-finished product mold group 1, further ensuring that the surface of the support semi-finished product 12 can be accurately pressed into the lens forming groove 2321.

[0059] S3: dispensing glue into the packaging grooves of the plurality of support semi-finished products 12 and the plurality of lens forming grooves 2321. In a specific application, the glue in the packaging grooves of the support semi-finished products 12 is used to close the packaging grooves after solidification, thereby enclosing the LED chips in the packaging grooves. The glue in the lens forming grooves 2321 is used to form lenses on the surface of the support semi-finished product 12 after solidification. It can be understood that the shape of the lens forming groove 2321 is the shape of the lens. In this way, lenses can be formed on the surface of the support semi-finished product 12 without injection molding, without the need for high-cost injection molding molds, and the production cost is reduced.

[0060] Preferably, the S3 step further includes an S30 step of: dispensing glue into the packaging grooves of the plurality of support semi-finished products 12, baking and curing the preliminary dispensing of glue, and closing the chips in the packaging grooves after the glue solidifies. In a specific application, the packaging grooves of the support semi-finished product 12 are dispensed with glue twice, the first time is preliminary dispensing of glue, in order to first stably close the LED chips in the packaging grooves, avoid the LED chips falling out of the packaging grooves or the position deviating when the support semi-finished product module 1 is flipped in the subsequent process, and improve product quality. The second dispensing of glue is performed after the glue dispensed the first time has solidified. The glue after the two dispensing processes forms a packaging structure that is flush with the packaging groove after solidification, and the glue dispensed the second time in the packaging groove is connected to the glue in the lens forming groove 2321. In this way, after solidification, the formed packaging structure and the lens are closely connected without gaps, thereby avoiding the shape of the gaps being uncontrollable, causing uncontrollable refraction of light, and improving product quality.

[0061] S4: flip the support semi-finished product module 1, and make the packaging grooves of the plurality of support semi-finished products 12 respectively correspond to the plurality of lens forming grooves 2321. In a specific application, since the volume of each support semi-finished product 12 is small, in this embodiment, it is a "2835" specification, i.e., 28 mm wide and 35 mm long, and each support semi-finished product 12 includes three packaging grooves. The bottom of the lens forming groove 2321 corresponds to three irregular elliptical grooves. To ensure that each packaging groove corresponds to an irregular elliptical groove, the precision requirements for the positions of the support semi-finished product module 1 and the lens forming groove 2321 are high. In this embodiment, the number of lens forming grooves 2321 is equal to the number of support semi-finished products 12, and the arrangement and distribution are the same. Therefore, it is necessary to first make the packaging grooves of the plurality of support semi-finished products 12 correspond to the plurality of lens forming grooves 2321 to avoid misalignment that leads to missing rows or columns. Of course, in other embodiments, the number of packaging grooves on each support semi-finished product 12 can also be one, two, or more, which is not limited here.

[0062] S5: The packaging grooves of the plurality of support semi-finished products 12 are respectively and one-to-one correspondingly connected with the plurality of lens forming grooves 2321. In a specific application, when the support carrier plate 11 is covered on the surface of the pressing plate 26, the support carrier plate 11 is accurately positioned by the cooperation of the first positioning pins 24 and the first positioning holes 13, so as to ensure that each support semi-finished product 12 can be accurately positioned on the preset position, that is, the packaging grooves of the plurality of support semi-finished products 12 are respectively and one-to-one correspondingly connected with the plurality of lens forming grooves 2321, and specifically, each packaging groove is connected with an irregular oval groove, at this time, the glue in the packaging groove and the glue in the lens forming groove 2321 are connected with each other, and the stability of the position of the support semi-finished product 12 is also improved.

[0063] Preferably, the S5 step further comprises the following sub-steps:

[0064] S51: The plurality of first positioning pins 24 are respectively and one-to-one correspondingly connected with the plurality of first positioning holes 13.

[0065] S52: The plurality of first positioning pins 24 are respectively and one-to-one correspondingly connected with the plurality of first positioning holes 13. By the cooperation of the first positioning pins 24 and the first positioning holes 13, it is ensured that when the support carrier plate 11 is placed on the surface of the pressing plate 26, the plurality of support semi-finished products 12 can be one-to-one correspondingly connected with the plurality of lens forming grooves 2321, so as to ensure that the lens with a corresponding shape can be accurately formed on the surface of each support semi-finished product 12, and the packaging efficiency and the product quality are improved. At the same time, the plurality of first positioning pins 24 can also fix the position of the support carrier plate 11, so as to avoid the position deviation of the support carrier plate 11 in the subsequent fusion process, thereby avoiding the position deviation of the formed lens, and improving the product quality.

[0066] S53: The packaging grooves of the plurality of support semi-finished products 12 are respectively and one-to-one correspondingly connected with the plurality of lens forming grooves 2321.

[0067] S6: The upper mold plate 21 is combined with the lower mold plate 22, so that the support semi-finished product mold set 1 is pressed on the mold strip 23, and a plurality of support semi-finished products 12 are respectively and one-to-one inserted into a plurality of lens forming grooves 2321. In specific applications, the upper mold plate 21 is combined with the lower mold plate 22 through the cooperation of the guide pin 222 and the guide hole 211. Through the arrangement of the guide pin 222 and the guide hole 211, the upper mold plate 21 and the lower mold plate 22 can be accurately combined, that is, the upper mold plate 21 can only move in the vertical direction relative to the lower mold plate 22, avoiding the displacement of the upper mold plate 21 leading to the displacement of the support semi-finished product mold set 1, further ensuring that the surface of the support semi-finished product 12 can be accurately pressed into the lens forming groove 2321. It should be particularly pointed out that through the arrangement of the second positioning pin 25 and the second positioning hole 2311, each mold strip 23 can be accurately positioned and installed at the preset position of the lower mold groove 211. As for the plurality of lens forming grooves 2321 in the same column, the distance between the adjacent two lens forming grooves 2321 is the same as the distance between the adjacent two support semi-finished products 12 in the same column on the support semi-finished product mold set 1, and the distance between the adjacent two mounting holes can be controlled to be the same as the distance between the adjacent two support semi-finished products 12 in the same column on the support semi-finished product mold set 1, and as for the plurality of lens forming grooves 2321 in the same row, the distance between the adjacent two lens forming grooves 2321 is the same as the distance between the adjacent two support semi-finished products 12 in the same row on the support semi-finished product mold set 1, and the cooperation of the second positioning pin 25 and the second positioning hole 2311 can be controlled, so as to ensure that the plurality of support semi-finished products 12 and the plurality of lens forming grooves 2321 are in a one-to-one corresponding relationship, and the product quality is improved.

[0068] S7: Baking and curing; the glue in the lens forming groove 2321 is fused to the surface of the support semi-finished product 12 and forms a lens. In specific applications, the combined positioning jig 2 is placed in an oven for curing, wherein the glue in the packaging groove is cured to form a packaging structure for closing the packaging groove and enclosing the LED chip inside the packaging groove, and the glue in the lens forming groove 2321 is cured on the surface of the support semi-finished product 12, that is, a lens with a corresponding shape is formed on the surface of the packaging structure.

[0069] Preferably, the S7 step further comprises a S70 step of vacuumizing the lens forming groove 2321 and the encapsulation groove to remove the air bubbles in the glue. In practical applications, air bubbles are generated in the process of dispensing glue or in the process of the glue in the lens forming groove 2321 contacting the glue in the encapsulation groove, which will cause the formed encapsulation structure or lens to have a cavity, affecting the accuracy of light. Specifically, the upper mold plate 21 is provided with a vacuum treatment hole which is in communication with a vacuum pump and a groove of the lower mold plate 22, and the air bubbles in the glue are effectively removed by vacuumizing treatment, so that the glue in the lens forming groove 2321 and the encapsulation groove is more uniform, thereby ensuring that the formed encapsulation structure and lens are more complete in structure and improving the product quality.

[0070] S8: demolding and stripping. In practical applications, a demolding jig matched with the positioning jig 2 is used to demold the formed SMD-LED lamp bead from the lens forming groove 2321, and then a plurality of SMD-LED lamp beads are cut off from the support carrier plate 11 by cutting and stripping.

[0071] S9: obtaining a plurality of SMD-LED lamp beads.

[0072] In summary, the glue is dispensed in the lens forming grooves 2321 and the encapsulation grooves of the support semi-finished products 12 respectively, and the glue in the encapsulation grooves forms an encapsulation structure after solidification to encapsulate the LED chip in the encapsulation groove, and the glue in the lens forming groove 2321 forms a lens on the surface of the support semi-finished product 12 after solidification, so that the lens can be formed on the surface of the support semi-finished product 12 without the injection molding process, which saves the high cost of manufacturing injection molding molds and reduces the production cost. At the same time, through the cooperation of the first positioning pin 24 and the first positioning hole 13, it is ensured that the plurality of support semi-finished products 12 can be accurately inserted into the lens forming groove 2321 when the support carrier plate 11 is placed on the surface of the mold strip 23, and the lens of the corresponding shape can be accurately formed on the surface of each support semi-finished product 12, thereby improving the encapsulation efficiency and product quality. In addition, through the cooperation of the second positioning pin 25 and the second positioning hole 2311, each mold strip 23 can be accurately positioned and installed at the preset position of the lower mold groove 221, and through positioning the mold strip 23 and the support carrier plate 11 respectively, it is ensured that the positions of the plurality of support semi-finished products 12 and the plurality of lens forming grooves 2321 can accurately form a one-to-one corresponding relationship, so that each lens can be correspondingly formed on the surface of the support semi-finished product 12.

[0073] Example Four:

[0074] The SMD-LED lamp bead in the embodiment is prepared by using the SMD-LED lamp bead packaging process in Embodiment 3. Specifically, the SMD-LED lamp bead comprises a support body, three single-color chips and a lens body. The support body is provided with three accommodating cavities arranged in a linear interval on the surface. The three single-color chips are respectively arranged in the three accommodating cavities. The lens body comprises a lens cover and three lenses respectively arranged on the lens cover. The lens cover is arranged on the surface of the support body, and the three lenses are respectively arranged on the three single-color chips.

[0075] In summary, the glue is respectively dispensed in the lens forming grooves 2321 and the packaging grooves of the support semi-finished products 12. The glue in the packaging grooves is solidified to form an encapsulation structure in the packaging grooves for encapsulating the LED chips in the packaging grooves. The glue in the lens forming grooves 2321 is solidified to form lenses on the surface of the support semi-finished products 12. In this way, the lenses can be formed on the surface of the support semi-finished products 12 without the glue injection process, which eliminates the high manufacturing cost of the glue injection mold and reduces the production cost. At the same time, through the cooperation of the first positioning pin 24 and the first positioning hole 13, it is ensured that the support carrier plate 11 is placed on the surface of the mold strip 23, and the plurality of support semi-finished products 12 can be accurately inserted into the lens forming grooves 2321 one by one, so that the lenses of corresponding shapes can be accurately formed on the surface of each support semi-finished product 12, and the packaging efficiency and product quality are improved. In addition, through the cooperation of the second positioning pin 25 and the second positioning hole 2311, each mold strip 23 can be accurately positioned and installed on the preset position of the lower mold groove 221. By positioning the mold strip 23 and the support carrier plate 11 respectively, it is ensured that the positions of the plurality of support semi-finished products 12 and the plurality of lens forming grooves 2321 can accurately form a one-to-one corresponding relationship, so that each lens can be correspondingly formed on the surface of the support semi-finished product 12.

[0076] The above is only an embodiment of the present application and is not intended to limit the present application. The present application can have various modifications and changes for those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the scope of the claims of the present application.

Claims

1. A SMD-LED lamp bead packaging process, characterized in that: include: Obtaining a stent semi-finished product module (1); the stent semi-finished product module (1) includes a plurality of stent semi-finished products (12), and the stent semi-finished products (12) have packaging grooves; A positioning jig (2) is obtained; the positioning jig (2) comprises an upper template (21), a lower template (22), and a mold strip (23); the mold strip (23) is provided on the lower template (22); and a surface of the mold strip (23) has a plurality of lens molding grooves (2321); Dispensing glue in the plurality of lens molding grooves (2321) and the packaging grooves of the plurality of bracket semi-finished products (12); Turning over the bracket semi-finished product module (1), and making the packaging grooves of the plurality of bracket semi-finished products (12) face the plurality of lens forming grooves (2321) one by one; Connecting the packaging grooves of the plurality of the bracket semi-finished products (12) to the plurality of the lens forming grooves (2321) in a one-to-one correspondence; The upper mold plate (21) is molded onto the lower mold plate (22), so that the bracket semi-finished product module (1) is pressed onto the mold bar (23), and a plurality of the bracket semi-finished products (12) are respectively and one by one extended into a plurality of the lens molding grooves (2321); Baking and curing; the glue in the lens forming groove (2321) is melted and solidified on the surface of the bracket semi-finished product (12) to form a lens; Demolding and stripping; Get multiple SMD-LED lamp beads.

2. The SMD-LED lamp bead packaging process according to claim 1, characterized in that: The positioning fixture (2) further comprises a plurality of first positioning pins (24), the plurality of first positioning pins (24) being arranged on the surface of the lower template (22), and the bracket semi-finished product module (1) is provided with a plurality of first positioning holes (13) at positions corresponding to the plurality of first positioning pins (24); The step of connecting the packaging grooves of the plurality of the bracket semi-finished products (12) to the plurality of the lens forming grooves (2321) in a one-to-one correspondence comprises the following sub-steps: The plurality of first positioning pins (24) are respectively aligned with the plurality of first positioning holes (13); A plurality of the first positioning pins (24) are respectively inserted into the plurality of the first positioning holes (13); The packaging grooves of the plurality of the bracket semi-finished products (12) are respectively connected to the plurality of the lens forming grooves (2321) in a one-to-one correspondence.

3. The SMD-LED lamp bead packaging process according to claim 2, characterized in that: The surface of the lower mold plate (22) is provided with a plurality of lower mold grooves (221), and the plurality of mold strips (23) are respectively installed in the plurality of lower mold grooves (221), and the surface of each mold strip (23) is provided with a plurality of lens forming grooves (2321); The step of obtaining a positioning fixture (2) includes the following sub-steps: Selecting a corresponding mold strip (23) according to the shape of the desired molded lens, wherein the mold strip (23) has a lens molding groove (2321) adapted to the shape of the lens; Selecting a lower template (22), wherein the lower template (22) has a lower mold groove (221) capable of visually carrying the mold strip (23); Installing the plurality of mold strips (23) respectively and correspondingly in the lower mold groove (221); An upper template (21) adapted to the lower template (22) is selected to obtain a positioning jig (2).

4. The SMD-LED lamp bead packaging process according to claim 3, characterized in that: Each of the mold strips (23) is provided with a second positioning hole (2311), and the positioning fixture (2) further includes a plurality of second positioning pins (25), and the plurality of second positioning pins (25) are respectively arranged in the lower mold groove (221); When the plurality of mold strips (23) are respectively installed in the lower mold groove (221), the plurality of mold strips (23) are positioned and installed at the preset positions of the lower mold groove (221) through the cooperation and guidance of the second positioning holes (2311) and the second positioning pins (25).

5. The SMD-LED lamp bead packaging process according to claim 4, characterized in that: The surface of the lower template (22) is provided with at least two guide pins (222), and the upper template (21) is provided with guide holes (211) at positions corresponding to the guide pins (222); The upper mold plate (21) is molded together with the lower mold plate (22) through the cooperation and guidance of the guide pin (222) and the guide hole (211).

6. The SMD-LED lamp bead packaging process according to claim 5, characterized in that: The following steps are also included before the baking and curing step: The lens molding groove (2321) and the packaging groove are vacuumed to remove bubbles in the glue.

7. The SMD-LED lamp bead packaging process according to claim 4, characterized in that: The mold strip (23) includes a mold strip body (231) and a plurality of lens forming bodies (232). The mold strip body (231) is provided with a plurality of mounting holes arranged in sequence and at intervals. The plurality of lens forming bodies (232) are respectively installed in the plurality of mounting holes. Each of the lens forming bodies (232) is provided with a lens forming groove (2321). The second positioning hole (2311) is provided on the surface of the mold strip body (231) near the side. The step of selecting a corresponding mold strip (23) according to the shape of the desired molded lens includes the following sub-steps: Selecting a corresponding lens molding body (232) according to the shape of the desired molded lens, wherein the lens molding body (232) has a lens molding groove (2321) adapted to the shape of the lens; Installing the plurality of lens forming bodies (232) correspondingly in the plurality of mounting holes; The mold strip (23) corresponding to the desired molded lens shape is obtained.

8. The SMD-LED lamp bead packaging process according to claim 7, characterized in that: The positioning fixture (2) further includes a pressing plate (26), wherein the pressing plate (26) is provided with a through hole (261) and a plurality of through holes (262); After the step of respectively installing the plurality of mold strips (23) in the lower mold groove (221), the following steps are also included: The pressing plate (26) is covered on the surfaces of the plurality of mold strips (23), and the first positioning pin (24) is passed through the through hole (261). The plurality of lens forming bodies (232) are respectively located in the plurality of through holes (262).

9. The SMD-LED lamp bead packaging process according to claim 1, characterized in that: Before the step of dispensing glue in the packaging grooves of the plurality of lens molding grooves (2321) and the plurality of bracket semi-finished products (12), the following steps are also included: Performing preliminary glue dispensing in the packaging grooves of a plurality of the semi-finished bracket products (12); Bake and solidify the glue and seal the chip in the package groove after the glue is melted and solidified.

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