Apparatus for manufacturing display device

Abstract

Disclosed is an apparatus for manufacturing a display device. An apparatus for manufacturing a display device includes: a process unit including a first process line including a plurality of first process devices and a second process line including a plurality of second process devices; and a control unit that controls the process unit, the control unit including: a management unit that generates input variables including a target number of articles to be processed within a predetermined time on the first process line and the second process line, the number of the plurality of first process devices and the plurality of second process devices, and processing speeds of the plurality of first process devices and the plurality of second process devices; a dispatcher which receives the input variable from the management unit and outputs the output variable to the management unit; and a TC unit that receives, from the management unit, output variables including a power-saving process device that is a target of a power-saving mode among the plurality of first process devices and the plurality of second process devices, and a power-saving start time and a power-saving end time of the power-saving process device, and controls the process unit on the basis of the output variables.

Description

Technical Field

[0001] Embodiments of the present invention relate to a device, and more particularly, to a manufacturing device for a display device. Background Art

[0002] Electronic devices based on mobility are widely used. As mobile electronic devices, in addition to small electronic devices such as mobile phones, tablet PCs have been widely used in recent years.

[0003] The mobile electronic device described above includes a display device in order to support various functions and to provide visual information such as images or videos to the user. In recent years, as other components for driving the display device have become smaller, the proportion of the display device in the electronic device has gradually increased, and a structure that can be folded from a flat state to a predetermined angle has also been developed. Summary of the invention

[0004] The embodiments of the present invention can save power and reduce depreciation without hindering the execution of processes in a manufacturing apparatus of a display device.

[0005] However, these problems are merely illustrative, and the problems to be solved by the present invention are not limited thereto.

[0006] One embodiment of the present invention discloses a manufacturing device for a display device, comprising: a process section, comprising a first process line having a plurality of first process devices for executing a first process and a second process line having a plurality of second process devices for executing a second process; and a control section, controlling the process section, wherein the plurality of first process devices and the plurality of second process devices can respectively implement a power saving mode, the control section comprising: a management section, generating input variables, the input variables including a target number of items to be processed on the first process line within a specified time, a target number of items to be processed on the second process line within a specified time, the number of the plurality of first process devices, the number of the plurality of second process devices, a processing speed of the plurality of first process devices, and a processing speed of the plurality of second process devices; a scheduling machine, receiving the input variables from the management section and outputting output variables to the management section; and a TC (tool control) section, receiving the output variables from the management section and controlling the process section according to the output variables, the output variables including a power saving process device that is an object of the power saving mode among the plurality of first process devices and the plurality of second process devices, a power saving start time of the power saving process device, and a power saving end time of the power saving process device.

[0007] In this embodiment, the plurality of first process devices and the plurality of second process devices may be capable of adjusting the power saving degree to a plurality of stages in the power saving mode, respectively, and the output variable further includes the power saving degree of the power saving process device.

[0008] In this embodiment, at least one of the multiple first process devices and the multiple second process devices may include a heat treatment device for heat treating the article, and the heat treatment device includes: a cavity; a heating part, which is arranged inside the cavity and radiates heat; a temperature sensor, which senses the temperature inside the cavity; and a temperature control part, which controls the degree of heat radiation from the heating part based on information sensed by the temperature sensor, and the TC part adjusts the power saving degree by controlling the temperature control part.

[0009] In this embodiment, at least one of the multiple first process devices and the multiple second process devices may include a laser processing device, and the laser processing device includes: a laser irradiation unit, which irradiates laser; an energy sensor, which senses the energy of the laser; and an energy control unit, which controls the energy level of the laser irradiated by the laser irradiation unit based on information sensed by the energy sensor, and the TC unit adjusts the power saving level by controlling the energy control unit.

[0010] In this embodiment, the management unit may generate an inquiry signal for inquiring about a current power saving state of the process unit.

[0011] In this embodiment, the TC unit may transmit the query signal to the process unit. If the process unit receives the query signal, it calculates a query variable including the number of items processed so far on the first process line and the number of items processed so far on the second process line. The TC unit transmits the query variable to the management unit. The management unit compares the query variable, the input variable and the output variable to determine whether there is an error in the operation of the process unit.

[0012] In this embodiment, when the management unit determines that the work of the process unit is wrong, the management unit inputs the query variable and the input variable to the scheduling machine, and the scheduling machine receives the query variable and the input variable, corrects the output variable and outputs it to the management unit.

[0013] In this embodiment, the TC unit may receive the corrected output variable from the management unit, and control the process unit based on the corrected output variable.

[0014] In this embodiment, the management unit may generate the inquiry signal a plurality of times at predetermined time intervals.

[0015] In this embodiment, the plurality of second process devices may perform the second process on the article that has been subjected to the first process, and the first process and the second process may be different processes.

[0016] Other embodiments of the present invention disclose a method for manufacturing a display device, comprising: a step of executing a process by a process unit including a first process line and a second process line, wherein the first process line includes a plurality of first process devices for executing the first process, and the second process line includes a plurality of second process devices for executing the second process; a step of a management unit generating input variables, wherein the input variables include a target number of items to be processed within a specified time on the first process line, a target number of items to be processed within a specified time on the second process line, the number of the plurality of first process devices, the number of the plurality of second process devices, a processing speed of the plurality of first process devices, and a processing speed of the plurality of second process devices; a step of the management unit inputting the input variables to a scheduling machine; a step of the scheduling machine outputting output variables to the management unit based on the input variables; and a step of a TC (tool control) unit receiving the output variables from the management unit to control the process unit according to the output variables, the output variables including a power-saving process device that is an object of a power-saving mode among the plurality of first process devices and the plurality of second process devices, a power-saving start time of the power-saving process device, and a power-saving end time of the power-saving process device.

[0017] In this embodiment, the plurality of first process devices and the plurality of second process devices may be capable of adjusting the power saving degree to a plurality of stages in the power saving mode, respectively, and the output variable further includes the power saving degree of the power saving process device.

[0018] In this embodiment, at least one of the multiple first process devices and the multiple second process devices may include a heat treatment device for heat treating the article, and the heat treatment device includes: a cavity; a heating part, which is arranged inside the cavity and radiates heat; a temperature sensor, which senses the temperature inside the cavity; and a temperature control part, which controls the degree of heat radiation from the heating part based on information sensed by the temperature sensor, and the TC part adjusts the power saving degree by controlling the temperature control part.

[0019] In this embodiment, at least one of the multiple first process devices and the multiple second process devices may include a laser processing device, and the laser processing device includes: a laser irradiation unit, which irradiates laser; an energy sensor, which senses the energy of the laser; and an energy control unit, which controls the energy level of the laser irradiated by the laser irradiation unit based on information sensed by the energy sensor, and the TC unit adjusts the power saving level by controlling the energy control unit.

[0020] In this embodiment, the method for manufacturing the display device may further include: the management unit generating an inquiry signal for inquiring about a current power saving state of the process unit.

[0021] In this embodiment, the manufacturing method of the display device may further include: a step in which the TC unit transmits the query signal to the process unit; a step in which the process unit calculates a query variable including the number of items processed so far on the first process line and the number of items processed so far on the second process line if the process unit receives the query signal; a step in which the TC unit transmits the query variable to the management unit; and a step in which the management unit compares the query variable, the input variable and the output variable to determine whether the process unit is operating incorrectly.

[0022] In this embodiment, the manufacturing method of the display device may further include, when the management unit judges that the work of the process unit is wrong: a step in which the management unit inputs the query variable and the input variable to the scheduling machine; and a step in which the scheduling machine receives the query variable and the input variable to correct the output variable and output it to the management unit.

[0023] In this embodiment, the manufacturing method of the display device further includes a step in which the TC unit receives the corrected output variable from the management unit and controls the process unit according to the corrected output variable.

[0024] In this embodiment, the management unit may generate the inquiry signal a plurality of times at predetermined time intervals.

[0025] In this embodiment, the plurality of second process devices may perform the second process on the article that has been subjected to the first process, and the first process and the second process may be different processes.

[0026] Other aspects, features, and advantages other than those described above will become apparent from the following drawings, claims, and detailed description of the invention.

[0027] (Effects of the Invention)

[0028] According to the embodiments of the present invention, the manufacturing cost required by a manufacturing apparatus for a display device to manufacture a display device can be reduced.

[0029] The effects of the present invention are not limited to the effects mentioned above, and those skilled in the art should be able to clearly understand other effects not mentioned through the description of the claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic block diagram of a manufacturing device of a display device according to an embodiment of the present invention.

[0031] Figure 2 It is a schematic plan view of a process section according to an embodiment of the present invention.

[0032] Figure 3 It is a schematic sequence diagram of a method for manufacturing a display device according to an embodiment of the present invention.

[0033] Figure 4 It is a schematic block diagram of a heat treatment device according to an embodiment of the present invention.

[0034] Figure 5 It is a schematic block diagram of a laser processing device according to an embodiment of the present invention.

[0035] Figure 6 It is a plan view schematically showing a display device according to an embodiment of the present invention.

[0036] Figure 7 is a cross-sectional view schematically showing a display device according to an embodiment of the present invention, which may correspond to a cross-sectional view along Figure 6 A cross section of the display device taken along line VII-VII′.

[0037] Figure 8 It is an equivalent circuit diagram of any pixel in the display panel involved in an embodiment of the present invention.

[0038] Explanation of symbols:

[0039] 1: a manufacturing device for a display device; 10: a process unit; 11: a plurality of process lines; 12: a heat treatment device; 13: a laser processing device; 20: a control unit. DETAILED DESCRIPTION

[0040] The present invention is susceptible to various modifications and embodiments, and specific embodiments are illustrated in the drawings and described in detail herein. Figure 1 The effects and features of the present invention and methods for achieving the effects and features will become clear from the embodiments described in detail below. However, the present invention is not limited to the embodiments disclosed below, and the present invention can be implemented in various forms.

[0041] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. When describing with reference to the accompanying drawings, the same or corresponding components are given the same reference numerals and their repeated description is omitted.

[0042] In the following embodiments, the terms "first" and "second" are not restrictive terms, but are used to distinguish one constituent element from other constituent elements.

[0043] In the following embodiments, a singular expression includes a plural expression unless there is a clear contrary meaning in the text.

[0044] In the following embodiments, terms such as including or having should be understood to refer to the existence of features or constituent elements recorded in the specification, and do not exclude the possibility of adding one or more other features or constituent elements in advance.

[0045] In the following embodiments, when a film, a region, a constituent element, etc. is located on or above another part, it includes not only the case where it is directly located on the other part, but also the case where other films, regions, constituent elements, etc. exist in between.

[0046] In the drawings, the sizes of the components may be enlarged or reduced for the convenience of explanation. For example, the size and thickness of each component shown in the drawings are arbitrarily shown for the convenience of explanation, and the present invention is not necessarily limited to the illustrated cases.

[0047] In the following embodiments, the x-axis, y-axis and z-axis are not limited to the three axes on the rectangular coordinate system, and can be interpreted as including a broader meaning thereof. For example, the x-axis, y-axis and z-axis can be orthogonal to each other, but can also refer to different directions that are not orthogonal to each other.

[0048] When a certain embodiment can be implemented in different ways, a specific process sequence can also be performed differently from the described sequence. For example, two processes described in succession can be performed substantially at the same time, or in a sequence opposite to the described sequence.

[0049] Figure 1 is a schematic block diagram of a manufacturing device for a display device according to an embodiment of the present invention, Figure 2 It is a schematic plan view of a process section according to an embodiment of the present invention.

[0050] Reference Figure 1 and Figure 2 The manufacturing apparatus 1 of the display device may include a process unit 10 and a control unit 20 .

[0051] The process section 10 can perform a process on the article GD. The process section 10 can include a plurality of process lines 11, and each of the plurality of process lines 11 can include a plurality of process devices 111. The plurality of process devices 111 included in one process line 11 can perform the same process. Two or more of the plurality of process lines 11 can perform different processes. For example, each of the plurality of process lines 11 can perform different processes. At this time, the article GD can be processed while passing through the plurality of process lines 11 in sequence.

[0052] At least one of the plurality of process devices 111 may include a heat treatment device 12 (see Figure 4 ). For example, at least one of the plurality of process devices 111 may include a deposition device for depositing a deposition material onto the article GD. At least one of the plurality of process devices 111 may include a laser processing device 13 (see Figure 5 ). For example, at least one of the plurality of process devices 111 may include at least one of an exposure device for performing an extreme ultraviolet process (EUV) and a laser device for performing an ELA (Excimer Laser Annealing) process.

[0053] For example, the plurality of process lines 11 may include a first process line 11-1 including a plurality of first process devices 111-1, a second process line 11-2 including a plurality of second process devices 111-2, a third process line 11-3 including a plurality of third process devices 111-3, ... and an Nth process line 11-N including a plurality of Nth process devices 111-N.

[0054] In addition, for example, multiple first process devices 111-1 may include a 1-1 process device 111-11, a 1-2 process device 111-12, ... and a 1-N process device 111-1N, multiple second process devices 111-2 may include a 2-1 process device 111-21, a 2-2 process device 111-22, ... and a 2-N process device 111-2N, multiple third process devices 111-3 may include a 3-1 process device 111-31, a 3-2 process device 111-32, ... and a 3-N process device 111-3N, and multiple Nth process devices 111-N may include an N-1th process device 111-N1, an N-2th process device 111-N2, ... and a NNth process device 111-NN.

[0055] The first process line 11-1 can perform the first process, the second process line 11-2 can perform the second process, the third process line 11-3 can perform the third process, ..., and the Nth process line 11-N can perform the Nth process. That is, a plurality of first process devices 111-1 can perform the first process, a plurality of second process devices 111-2 can perform the second process, a plurality of third process devices 111-3 can perform the third process, ..., and a plurality of Nth process devices 111-N can perform the Nth process. The first process, the second process, the third process, ..., and the Nth process may be different processes from each other.

[0056] The article GD can be processed while moving on the first process line 11-1, the second process line 11-2, the third process line 11-3, ... and the Nth process line 11-N in sequence. For example, the article GD can be moved between the plurality of process lines 11 by a transport robot (not shown). The plurality of second process devices 111-2 can perform the second process on the article GD that has been subjected to the first process, the plurality of third process devices 111-3 can perform the third process on the article GD that has been subjected to the second process, ..., and the plurality of Nth process devices 111-N can perform the Nth process on the article GD that has been subjected to the N-1th process.

[0057] The first item GD1 supplied to the first supply line may be processed into the second item GD2 by performing the first process. The second item GD2 may be supplied to the second supply line along the moving path LT between the first supply line and the second supply line. The second item GD2 supplied to the second supply line may be processed into the third item GD3 by performing the second process. The third item GD3 may be supplied to the third supply line along the moving path LT between the second supply line and the third supply line. The third item GD3 supplied to the third supply line may be processed into the fourth item GD4 by performing the third process. The Nth item GDN supplied to the Nth supply line may be processed into the N+1th item GDN+1 by performing the Nth process. The N+1th item GDN+1 may be the final product manufactured by the manufacturing device 1 of the display device.

[0058] For example, the first item GD1 can be processed into the second item GD2 through the first process in the 1-1 process device 111-11, the second item GD2 can be processed into the third item GD3 through the second process in the 2-2 process device 111-22, the third item GD3 can be processed into the fourth item GD4 through the third process in the 3-1 process device 111-31, and finally, the Nth item GDN can be processed into the N+1th item GDN+1 through the Nth process in the NNth process device 111-NN.

[0059] exist Figure 2, a case where a plurality of process devices 111 are arranged in a row on one process line 11 is shown, but this is only an example, and the arrangement of the plurality of process devices 111 is not limited to this. In addition, a case where the article GD moves counterclockwise along a quadrilateral moving path LT between the plurality of process lines 11 is shown, but this is only an example, and the moving path LT of the article GD is not limited to this.

[0060] The control unit 20 can control the process unit 10. Figure 3 To be discussed later.

[0061] Figure 3 It is a schematic sequence diagram of a method for manufacturing a display device according to an embodiment of the present invention.

[0062] Reference Figures 1 to 3 The manufacturing apparatus 1 of the display device can consider the current process status and automatically save power while efficiently executing the process.

[0063] The plurality of process devices 111 may respectively implement the power saving mode. For example, the plurality of first process devices 111-1, the plurality of second process devices 111-2, the plurality of third process devices 111-3, ... and the plurality of Nth process devices 111-N may respectively implement the power saving mode.

[0064] That is, the plurality of process devices 111 can switch between the operating mode, the power saving mode, and the shut-down mode. In the operating mode, the plurality of process devices 111 can process the article GD. In the operating mode, the plurality of process devices 111 can continue to consume high power regardless of whether the article GD is currently being processed. In the power saving mode, the plurality of process devices 111 cannot process the article GD, and the amount of power used can be reduced compared to the operating mode. In the shut-down mode, the power supply of the plurality of process devices 111 can be turned off. Therefore, in the shut-down mode, the plurality of process devices 111 cannot process the article GD and do not consume power.

[0065] When the multiple process devices 111 are converted from the shutdown mode or the power saving mode to the working mode, a preparation time for preheating or setting may be required. In particular, when the multiple process devices 111 are converted from the shutdown mode to the working mode, it may take a considerable time. On the contrary, the time for the multiple process devices 111 to be converted from the power saving mode to the working mode can be shorter than the time for the multiple process devices 111 to be converted from the shutdown mode to the working mode.

[0066] The plurality of process devices 111 can adjust the power saving degree in a plurality of stages in the power saving mode. That is, the plurality of first process devices 111-1, the plurality of second process devices 111-2, the plurality of third process devices 111-3, ... and the plurality of Nth process devices 111-N can respectively adjust the power saving degree in a plurality of stages in the power saving mode. For example, the power saving degree can be adjusted between level 1 and level 10, and the higher the level, the higher the power saving degree can be.

[0067] In the high power saving mode, the power usage may be lower than that in the low power saving mode. However, the time to switch from the high power saving mode to the operating mode may be longer than the time to switch from the low power saving mode to the operating mode.

[0068] The control unit 20 can control the process unit 10 , and includes a management unit 21 , a scheduling machine 22 , and a TC (tool control) unit 23 .

[0069] The management unit 21 may generate an input variable IVL including information on the current process status and input the variable IVL to the scheduling machine 22 .

[0070] The input variable IVL may include the target number of articles GD to be processed in a specified time on each of the plurality of process lines 11, the number of the plurality of process devices 111 disposed in each of the plurality of process lines 11, and the processing speed of the process devices 111 disposed in each of the plurality of process lines 11. Here, the specified time may be one day (24 hours). That is, the input variable IVL may include the target number of articles GD to be processed in 24 hours on each of the plurality of process lines 11.

[0071] For example, the input variable IVL may include the target number of items GD to be processed within a specified time on the first process line 11-1, the second process line 11-2, the third process line 11-3,... and the Nth process line 11-N, the number of multiple first process devices 111-1, multiple second process devices 111-2, multiple third process devices 111-3,... and multiple Nth process devices 111-N, and the processing speeds of multiple first process devices 111-1, multiple second process devices 111-2, multiple third process devices 111-3,... and multiple Nth process devices 111-N.

[0072] Table 1 below is an example for explaining the aforementioned input variable IVL.

[0073] [Table 1]

[0074]

[0075]

[0076] The input variable IVL generated by the management unit 21 may include that the target number of items GD to be processed by the first process line 11-1 in one day is 400, the number of multiple first process devices 111-1 is 10, and the number of items GD that can be processed by multiple first process devices 111-1 in one day is 120.

[0077] The input variable IVL may include that the target number of items GD that the second process line 11-2 should process in one day is 550, the number of multiple second process devices 111-2 is 7, and the number of items GD that each of the multiple second process devices 111-2 can process in one day is 300.

[0078] In addition, the input variable IVL may include that the target number of items GD to be processed by the third process line 11-3 in one day is 600, the number of multiple third process devices 111-3 is 12, and the number of items GD that can be processed by multiple third process devices 111-3 in one day is 160.

[0079] In addition, the input variable IVL may include that the target number of items GD to be processed by the Nth process line 11-N in one day is 770, the number of multiple Nth process devices 111-N is 15, and the number of items GD that can be processed by multiple Nth process devices 111-N in one day is 170.

[0080] The scheduling machine 22 can receive information about the current process state from the management unit 21, and calculate the power saving content as a condition for effectively saving power in the process unit 10 without hindering the process of the process unit 10. That is, the scheduling machine 22 can receive the input variable IVL from the management unit 21, and output the output variable OVL including the power saving content to the management unit 21.

[0081] Here, the output variable OVL may include a power saving process device that is a target of the power saving mode, a power saving start time of the power saving process device, a power saving end time of the power saving process device, and a power saving degree of the power saving process device among the plurality of process devices 111. The power saving end time may be determined by taking into account the preparation time for switching from the power saving mode to the operating mode.

[0082] For example, the output variable OVL may include a power-saving process device that is the object of the power-saving mode among multiple first process devices 111-1, multiple second process devices 111-2, multiple third process devices 111-3,... and multiple Nth process devices 111-N, the power-saving start time of the power-saving process device, and the power-saving end time of the power-saving process device.

[0083] Table 2 below is an example for explaining the output variable OVL described above.

[0084] [Table 2]

[0085]

[0086]

[0087] The plurality of process devices 111 may maintain the operation mode except for the time described in Table 2.

[0088] The output variable OVL output by the scheduling machine 22 may include that the 1-1 process device 111-11 is maintained in a non-power saving state (operating mode) on the first process line 11-1, the 1-2 process device 111-12 is maintained in a power saving mode of level 3 from 12:00 to 12:30, maintained in a power saving mode of level 5 from 12:40 to 15:30 and maintained in a power saving mode of level 2 from 18:00 to 20:00, and the 1-N process device 111-1N is maintained in a power saving mode of level 3 from 07:00 to 12:30 and maintained in a power saving mode of level 5 from 15:00 to 21:00. That is, among the plurality of first process devices 111-1, the power saving process devices may be the 1-2 process device 111-12 and the 1-N process device 111-1N.

[0089] The output variable OVL may include that the 2-1 process device 111-21 on the second process line 11-2 is maintained in the power saving mode of level 6 from 09:20 to 10:50, maintained in the power saving mode of level 5 from 15:10 to 18:00, and maintained in the power saving mode of level 4 from 19:00 to 20:30, the 2-2 process device 111-22 is maintained in a non-power saving state (operating mode), and the 2-N process device 111-2N is maintained in the power saving mode of level 5 from 11:00 to 12:20, maintained in the power saving mode of level 7 from 13:40 to 16:30, and maintained in the power saving mode of level 3 from 17:20 to 17:30. That is, among the plurality of second process devices 111-2, the power saving process devices may be the 2-1 process device 111-21 and the 2-N process device 111-2N.

[0090] Furthermore, the output variable OVL may include that the 3-1 process device 111-31 on the third process line 11-3 is maintained in the power saving mode of level 2 from 07:20 to 12:50 and maintained in the power saving mode of level 4 from 15:10 to 21:10, the 3-2 process device 111-32 is maintained in the power saving mode of level 2 from 09:10 to 10:40, maintained in the power saving mode of level 3 from 15:50 to 18:10 and maintained in the power saving mode of level 2 from 19:10 to 21:40, and the 3-N process device 111-3N is maintained in the non-power saving state (operating mode). That is, among the plurality of third process devices 111-3, the power saving process devices may be the 3-1 process device 111-31 and the 3-2 process device 111-32.

[0091] Furthermore, the output variable OVL may include that the N-1th process device 111-N1 on the Nth process line 11-N is maintained in a non-power saving state (operating mode), the N-2th process device 111-N2 is maintained in a power saving mode of level 7 from 12:20 to 12:50, maintained in a power saving mode of level 5 from 13:30 to 15:20 and maintained in a power saving mode of level 5 from 18:10 to 20:10, and the NNth process device 111-NN is maintained in a power saving mode of level 6 from 07:30 to 13:00 and maintained in a power saving mode of level 5 from 15:30 to 21:20. That is, among the plurality of Nth process devices 111-N, the power saving process devices may be the N-2th process device 111-N2 and the NNth process device 111-NN.

[0092] The TC unit 23 can receive the output variable OVL from the management unit 21 and control the process unit 10 according to the output variable OVL. Therefore, the process unit 10 can operate according to whether or not, the power saving time, and the power saving degree of each of the plurality of process devices 111 included in the output variable OVL.

[0093] The management unit 21 may generate an inquiry signal for inquiring about the current power saving state of the process unit 10. The inquiry signal may be generated to check whether the current process is well executed without error even when at least one of the plurality of process devices 111 is in the power saving mode. Alternatively, the inquiry signal may be generated to correct the output variable OVL when the manufacturing plan of the manufacturing device 1 of the display device changes. For example, when the target number of articles GD to be processed in the first process line 11-1 in one day changes from 400 to 600, the inquiry signal may be generated.

[0094] The management unit 21 may generate the inquiry signal multiple times at certain time intervals. For example, the management unit 21 may generate the inquiry signal multiple times at intervals of 1 hour. Alternatively, the management unit 21 may generate the inquiry signal after 1 hour has passed from the power saving start time and 1 hour before the power saving end time.

[0095] The TC unit 23 may transmit the inquiry signal generated by the management unit 21 to the process unit 10. Therefore, the inquiry signal may be input from the management unit 21 to the process unit 10.

[0096] When the process section 10 receives the query signal, it can calculate a query variable indicating the current state of the process section 10. The query variable may include the number of articles GD processed so far on each of the plurality of process lines 11.

[0097] For example, the query variables may include the number of items GD processed so far on the first process line 11-1, the number of items GD processed so far on the second process line 11-2, the number of items GD processed so far on the third process line 11-3,... and the number of items GD processed so far on the Nth process line 11-N.

[0098] Next, the TC unit 23 can receive the query variable from the process unit 10 and transmit the query variable to the management unit 21. Therefore, the query variable can be input from the TC unit 23 to the management unit 21. The management unit 21 can compare the query variable, the input variable IVL, and the output variable OVL to determine whether the process unit 10 is operating with an error.

[0099] The management unit 21 can compare the ideal number of items GD that should be processed so far on multiple process lines 11 calculated based on the input variable IVL and the output variable OVL, and the actual number of items GD that have been processed so far on multiple process lines 11 included in the query variable. When the difference is greater than the specified value, it is judged that there is an error in the operation of the process unit 10. When the difference is less than the specified value, it is judged that the operation of the process unit 10 is normal.

[0100] If the management unit 21 determines that the operation of the process unit 10 is normal, the procedure can be terminated unless the management unit 21 generates an additional inquiry signal.

[0101] If the management unit 21 determines that there is an error in the work of the process unit 10, the management unit 21 can input the query variable and the input variable IVL to the scheduling machine 22. The scheduling machine 22 can receive the query variable and the input variable IVL, modify the output variable OVL, and output it to the management unit 21. The TC unit 23 can receive the modified output variable OVL from the management unit 21, and control the process unit 10 according to the modified output variable OVL.

[0102] The management unit 21 can compare with the situation where multiple process devices 111 are all in working state and calculate the amount of electricity saved. For example, the management unit 21 can calculate the amount of electricity saved by each of the multiple process lines 11. In addition, the management unit 21 can calculate the amount of electricity saved by each of the multiple process devices 111. The management unit 21 can calculate the amount of electricity saved during the day, week, month or year. The management unit 21 can communicate with the user device US. The management unit 21 can transmit the amount of electricity saved to the user device US. For example, the management unit 21 can transmit a chart to the user device US by showing the amount of electricity saved in a chart.

[0103] According to the embodiment of the present invention, unnecessary consumption of electric power caused by always setting the plurality of process devices 111 in the operating mode and rapid depreciation of various expensive components can be reduced.

[0104] Furthermore, according to the embodiment of the present invention, the inefficiency of the process caused by the considerable preparation time required when one or more of the plurality of process devices 111 is switched from the shutdown mode to the operating mode can be reduced.

[0105] That is, the embodiment of the present invention flexibly changes the power saving degree of each of the plurality of process devices 111 in consideration of the current process status, thereby improving the efficiency of the process and reducing unnecessary power consumption and depreciation of various components to reduce the manufacturing cost of the display device.

[0106] Figure 4 It is a schematic block diagram of a heat treatment device according to an embodiment of the present invention.

[0107] Reference Figures 1 to 4 The heat treatment device 12 may be a device for heat-treating the article GD. The heat treatment device 12 may be a deposition device for depositing a deposition material onto the article GD.

[0108] At least one of the plurality of process lines 11 may include a heat treatment apparatus 12. At least one of the plurality of first process apparatuses 111-1, the plurality of second process apparatuses 111-2, the plurality of third process apparatuses 111-3, ..., and the plurality of Nth process apparatuses 111-N may include a heat treatment apparatus 12.

[0109] For example, when the first process line 11-1 includes the heat treatment device 12, the first process may include a heat treatment process for heat-treating the product. In this case, the first article GD1 may be heat-treated into the second article GD2 by the first process device 111-1.

[0110] The heat treatment device 12 may include a cavity 121, a heating unit 122, a temperature sensor 123, and a temperature control unit 124. The cavity 121 may provide an internal space for storing the product during the heat treatment process of the product. The heating unit 122 may be arranged inside the cavity 121 to radiate heat. The internal space of the cavity 121 may be heated by the heating unit 122. The temperature sensor 123 may be arranged inside the cavity 121 to sense the temperature inside the cavity 121. The temperature control unit 124 may control the degree of heat radiated by the heating unit 122 based on the information sensed by the temperature sensor 123.

[0111] The temperature control unit 124 may be controlled by the TC unit 23. The TC unit 23 may adjust the degree of power saving by controlling the temperature control unit 124. That is, the TC unit 23 may control the temperature control unit 124 to reduce the heating value of the heating unit 122 when the degree of power saving of the process device 111 received from the management unit 21 is high, and may control the temperature control unit 124 to increase the heating value of the heating unit 122 when the degree of power saving of the process device 111 received from the management unit 21 is low.

[0112] Figure 5 It is a schematic block diagram of a laser processing device according to an embodiment of the present invention.

[0113] Reference Figures 1 to 3 as well as Figure 5 The laser processing device 13 may be a device for laser processing the article GD. The laser processing device 13 may be an exposure device for performing an extreme ultraviolet process (EUV) or a laser device for performing an ELA (Excimer Laser Annealing) process.

[0114] At least one of the plurality of process lines 11 may include a laser processing device 13. At least one of the plurality of first process devices 111-1, the plurality of second process devices 111-2, the plurality of third process devices 111-3, ..., and the plurality of Nth process devices 111-N may include a laser processing device 13.

[0115] For example, when the second process line 11-2 includes the laser processing device 13, the second process may include a laser processing process for laser processing the product. In this case, the second article GD2 may be laser processed into the third article GD3 by the second process device 111-2.

[0116] The laser processing device 13 may include a laser irradiation unit 131 , an energy sensor 132 , and an energy control unit 133 .

[0117] The laser irradiation unit 131 can irradiate laser. The laser irradiated by the laser irradiation unit 131 can process the object GD. The energy sensor 132 can sense the energy of the laser. The energy control unit 133 can control the energy level of the laser irradiated by the laser irradiation unit 131 based on the information sensed by the energy sensor 132.

[0118] The energy control unit 133 may be controlled by the TC unit 23. The TC unit 23 may adjust the degree of power saving by controlling the energy control unit 133. That is, the TC unit 23 may control the energy control unit 133 to reduce the energy of the laser irradiated by the laser irradiation unit 131 when the degree of power saving of the process device 111 received from the management unit 21 is high, and may control the energy control unit 133 to increase the energy of the laser irradiated by the laser irradiation unit 131 when the degree of power saving of the process device 111 received from the management unit 21 is low.

[0119] Figure 6 It is a plan view schematically showing a display device according to an embodiment of the present invention.

[0120] Reference Figure 6 The display device 2 manufactured according to an embodiment of the present invention may include a display area DA and a peripheral area PA located outside the display area DA. The display device 2 may provide an image through an array of a plurality of pixels PX arranged in a two-dimensional manner in the display area DA.

[0121] The peripheral area PA is an area where no image is displayed, and may surround the display area DA in whole or in part. A driver for providing an electrical signal or power supply to a pixel circuit corresponding to each pixel PX may be disposed in the peripheral area PA. A pad as an area capable of electrically connecting an electronic component or a printed circuit board may be disposed in the peripheral area PA.

[0122] In a plan view, the display device 2 may be a quadrilateral having short sides in the x direction and long sides in the y direction, but this is merely an example and the shape of the display device 2 is not limited thereto. In addition, the display device 2 may have a certain thickness in the z direction.

[0123] The following describes that the display device 2 includes an organic light emitting diode (OLED) (refer to Figure 7) as a light emitting element, but the display device 2 of the present invention is not limited to this. As another embodiment, the display device 2 may be a light emitting display device including an inorganic light emitting diode (i.e., an inorganic light emitting display device (Inorganic Light Emitting Display)). The inorganic light emitting diode may include a PN junction diode containing an inorganic semiconductor-based material. If a voltage is applied to the PN junction diode in the forward direction, holes and electrons are injected, and the energy generated by the recombination of the holes and electrons is converted into light energy, and light of a predetermined color can be emitted. The aforementioned inorganic light emitting diode may have a width of several to several hundred microns. In some embodiments, the inorganic light emitting diode may be referred to as a micro LED. As yet another embodiment, the display device 2 may be a quantum dot light emitting display device (Quantumdot Light Emitting Display).

[0124] On the other hand, the display device 2 can be used not only as a display screen of mobile electronic devices such as mobile phones, smart phones, tablet PCs (tablet personal computers), mobile communication terminals, electronic manuals, electronic books, PMPs (portable multimedia players), navigation devices, UMPCs (Ultra Mobile PCs), but also as a display screen of various products such as televisions, notebooks, monitors, billboards, and Internet of Things (IoT) devices. In addition, the display device 2 involved in one embodiment can be used in wearable devices such as smart watches, watch phones, glasses-type displays, and head-mounted displays (HMD). In addition, the display device 2 involved in one embodiment can be used as a dashboard of a car, a center fascia of a car, or a CID (Center Information Display) configured on the dashboard, a room mirror display instead of a rearview mirror of a car, and a display screen configured on the back of a front seat as an entertainment device for the rear seat of a car.

[0125] Figure 7 is a cross-sectional view schematically showing a display device according to an embodiment of the present invention, which may correspond to a cross-sectional view along Figure 6 A cross section of the display device taken along line VII-VII′.

[0126] Reference Figure 7 The display device 2 may include a stacked structure of a substrate 100 , a pixel circuit layer PCL, a display element layer DEL, and an encapsulation layer 300 .

[0127] The substrate 100 may be a multilayer structure including a base layer containing a polymer resin and an inorganic layer. For example, the substrate 100 may include a base layer containing a polymer resin and a barrier layer as an inorganic insulating layer. For example, the substrate 100 may include a first base layer 101, a first barrier layer 102, a second base layer 103, and a second barrier layer 104 stacked in sequence. The first base layer 101 and the second base layer 103 may include polyimide (PI), polyethersulfone (PES), polyarylate, polyetherimide (PEI), polyethylene napthalate (PEN), polyethylene terepthalate (PET), polyphenylene sulfide (PPS), polycarbonate, cellulose triacetate (TAC) and / or cellulose acetate propionate (CAP), etc. The first barrier layer 102 and the second barrier layer 104 may include an inorganic insulator such as silicon oxide, silicon oxynitride, and / or silicon nitride. The substrate 100 may have a flexible property.

[0128] The pixel circuit layer PCL is disposed on the substrate 100 . Figure 7 The pixel circuit layer PCL includes a thin film transistor TFT and a buffer layer 1111, a first gate insulating layer 112, a second gate insulating layer 113, an interlayer insulating layer 114, a first planarizing insulating layer 115 and a second planarizing insulating layer 116 arranged below and / or above the constituent elements of the thin film transistor TFT.

[0129] The buffer layer 1111 can reduce or block the penetration of foreign matter, moisture or external gas from the lower part of the substrate 100, and can provide a flat surface on the substrate 100. The buffer layer 1111 may include an inorganic insulator such as silicon oxide, silicon oxynitride, or silicon nitride, and may be formed of a single-layer structure or a multi-layer structure including the foregoing substances.

[0130] The thin film transistor TFT on the buffer layer 1111 may include a semiconductor layer Act, and the semiconductor layer Act may include polycrystalline silicon (poly-Si). Alternatively, the semiconductor layer Act may include amorphous silicon (a-Si), an oxide semiconductor, or an organic semiconductor. The semiconductor layer Act may include a channel region C and a drain region D and a source region S respectively disposed on both sides of the channel region C. The gate electrode GE may overlap the channel region C.

[0131] The gate electrode GE may include a low resistance metal material, a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed of a multilayer or single layer including the above materials.

[0132] The first gate insulating layer 112 between the semiconductor layer Act and the gate electrode GE may include silicon oxide (SiO 2 ), silicon nitride (SiN X ), silicon oxynitride (SiON), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), Tantalum Oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ) or zinc oxide (ZnO X ) and other inorganic insulators. Zinc oxide (ZnO X ) can be zinc oxide (ZnO) and / or zinc peroxide (ZnO 2 ).

[0133] The second gate insulating layer 113 may be provided to cover the gate electrode GE. The second gate insulating layer 113 may include, for example, silicon oxide (SiO 2 ), silicon nitride (SiN X ), silicon oxynitride (SiON), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), Tantalum Oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ) or zinc oxide (ZnO X ) and other inorganic insulators. Zinc oxide (ZnO X ) can be zinc oxide (ZnO) and / or zinc peroxide (ZnO 2 ).

[0134] An upper electrode Cst2 of the energy storage capacitor Cst may be disposed on the upper portion of the second gate insulating layer 113. The upper electrode Cst2 may overlap the gate electrode GE thereunder. At this time, the gate electrode GE and the upper electrode Cst2 overlapping with the second gate insulating layer 113 may form an energy storage capacitor Cst. That is, the gate electrode GE may function as the lower electrode Cst1 of the energy storage capacitor Cst.

[0135] As described above, the energy storage capacitor Cst and the thin film transistor TFT may be formed to overlap. In some embodiments, the energy storage capacitor Cst may also be formed not to overlap with the thin film transistor TFT.

[0136] The upper electrode Cst2 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W) and / or copper (Cu), and may be a single layer or multiple layers of the aforementioned substances.

[0137] The interlayer insulating layer 114 may cover the upper electrode Cst2. The interlayer insulating layer 114 may include silicon oxide (SiO 2 ), silicon nitride (SiN X ), silicon oxynitride (SiON), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), Tantalum Oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ) or zinc oxide (ZnO X ) etc. Zinc oxide (ZnO X ) can be zinc oxide (ZnO) and / or zinc peroxide (ZnO 2 ). The interlayer insulating layer 114 may be a single layer or multiple layers including the aforementioned inorganic insulating material.

[0138] The drain electrode DE and the source electrode SE may be located on the interlayer insulating layer 114, respectively. The drain electrode DE and the source electrode SE may be connected to the drain region D and the source region S, respectively, through contact holes formed in the insulating layer below them. The drain electrode DE and the source electrode SE may include materials with excellent conductivity. The drain electrode DE and the source electrode SE may include conductive substances containing molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed by a multilayer or a single layer including the above-mentioned materials. As an embodiment, the drain electrode DE and the source electrode SE may have a multilayer structure of Ti / Al / Ti.

[0139] The first planarization insulating layer 115 may cover the drain electrode DE and the source electrode SE. The first planarization insulating layer 115 may include an organic insulator such as a general-purpose polymer such as polymethylmethacrylate (PMMA) or polystyrene (PS), a polymer derivative having a phenol group, an acrylic polymer, an imide polymer, an aryl ether polymer, an amide polymer, a fluorine polymer, a p-xylene polymer, a vinyl alcohol polymer, and a mixture thereof.

[0140] The second planarization insulating layer 116 may be disposed on the first planarization insulating layer 115. The second planarization insulating layer 116 may include the same material as the first planarization insulating layer 115, and may include an organic insulating material such as a general-purpose polymer such as polymethylmethacrylate (PMMA) or polystyrene (PS), a polymer derivative having a phenol group, an acrylic polymer, an imide polymer, an aryl ether polymer, an amide polymer, a fluorine polymer, a p-xylene polymer, a vinyl alcohol polymer, and a mixture thereof.

[0141] The display element layer DEL may be configured on the pixel circuit layer PCL of the aforementioned structure. The display element layer DEL may include an organic light emitting diode OLED as a display element (i.e., a light emitting element), and the organic light emitting diode OLED may include a stacked structure of a pixel electrode 210, an intermediate layer 220, and a common electrode 230. The organic light emitting diode OLED may emit, for example, red, green, or blue light, or may emit red, green, blue, or white light. The organic light emitting diode OLED may emit light through a light emitting region, and the light emitting region may be defined as a pixel PX.

[0142] The pixel electrode 210 of the organic light emitting diode OLED may be electrically connected to the thin film transistor TFT through a contact hole formed in the second planarization insulating layer 116 and the first planarization insulating layer 115 and a contact metal CM disposed on the first planarization insulating layer 115 .

[0143] The pixel electrode 210 may include, for example, indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In 2 O 3:indium oxide), indium gallium oxide (IGO; indium gallium oxide) or aluminum zinc oxide (AZO; aluminum zinc oxide) such conductive oxide. As other embodiments, the pixel electrode 210 may include a reflective film containing silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr) or their compounds. As other embodiments, the pixel electrode 210 may also include a reflective film made of ITO, IZO, ZnO or In above / below the aforementioned reflective film. 2 O 3 The film formed.

[0144] A bank layer 117 having an opening 117OP that exposes the central portion of the pixel electrode 210 is disposed on the pixel electrode 210. The bank layer 117 may include an organic insulator and / or an inorganic insulator. The opening 117OP may define a light emitting region of light emitted from the organic light emitting diode OLED. For example, the size / width of the opening 117OP may be equivalent to the size / width of the light emitting region. Therefore, the size and / or width of the pixel PX may depend on the size and / or width of the opening 117OP of the corresponding bank layer 117.

[0145] The intermediate layer 220 may include a light emitting layer 222 formed corresponding to the pixel electrode 210. The light emitting layer 222 may include a high molecular organic substance or a low molecular organic substance that emits light of a predetermined color. Alternatively, the light emitting layer 222 may include an inorganic light emitting substance or include quantum dots.

[0146] As an embodiment, the intermediate layer 220 may include a first functional layer 221 and a second functional layer 223 respectively arranged below and above the light-emitting layer 222. The first functional layer 221 may include, for example, a hole transport layer (HTL: Hole Transport Layer) or a hole transport layer and a hole injection layer (HIL: Hole Injection Layer). The second functional layer 223 may include an electron transport layer (ETL: Electron Transport Layer) and / or an electron injection layer (EIL: Electron Injection Layer) as constituent elements arranged on the light-emitting layer 222. The first functional layer 221 and / or the second functional layer 223 may be a common layer formed to cover the entire substrate 100 in the same manner as the common electrode 230 described later.

[0147] The common electrode 230 may be disposed on the pixel electrode 210 and overlap the pixel electrode 210. The common electrode 230 may be formed of a conductive material having a low work function. For example, the common electrode 230 may include a (semi) transparent layer containing silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), or alloys thereof. Alternatively, the common electrode 230 may further include a (semi) transparent layer including ITO, IZO, ZnO, or Indium on the (semi) transparent layer including the aforementioned materials. 2 O 3 The common electrode 230 may be formed as a single body to cover the entire substrate 100 .

[0148] The encapsulation layer 300 may be disposed on the display element layer DEL to cover the display element layer DEL. The encapsulation layer 300 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. Figure 7 The case where the encapsulation layer 300 includes a first inorganic encapsulation layer 310 , an organic encapsulation layer 320 , and a second inorganic encapsulation layer 330 stacked in sequence is shown.

[0149] The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may include one or more inorganic substances among aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride and silicon oxynitride. The organic encapsulation layer 320 may be a polymer-based substance. As a polymer-based substance, acrylic resin, epoxy resin, polyimide resin and polyethylene resin may be included. As an embodiment, the organic encapsulation layer 320 may include an acrylate resin. The organic encapsulation layer 320 may be formed by curing a monomer or coating a polymer. The organic encapsulation layer 320 may have transparency.

[0150] Although not shown in the figure, a touch sensor layer may be configured on the encapsulation layer 300, and an optical function layer may be configured on the touch sensor layer. The touch sensor layer may obtain coordinate information related to external input (e.g., a touch event). The optical function layer may reduce the reflectivity of light (external light) incident from the outside toward the display device 2 and / or improve the color purity of light emitted from the display device 2. As an embodiment, the optical function layer may include a phase retarder and / or a polarizer. The phase retarder may be a film type or a liquid crystal coating type, and may include a λ / 2 phase retarder and / or a λ / 4 phase retarder. The polarizer may also be a film type or a liquid crystal coating type. The film type may include an extended synthetic resin film, and the liquid crystal coating type may include liquid crystals arranged in a predetermined arrangement. The phase retarder and the polarizer may also include a protective film.

[0151] An adhesive component may be disposed between the touch sensor layer and the optical function layer. The adhesive component may be made of any material known in the art without limitation. The adhesive component may be a pressure sensitive adhesive (PSA).

[0152] Reference Figures 1 to 5 Items described GD (refer to Figure 2 ) may include a display device 2. For example, referring to Figures 1 to 5 Items described GD (refer to Figure 2 ) may include a substrate 100.

[0153] Figure 8 It is an equivalent circuit diagram of any pixel in the display panel involved in an embodiment of the present invention.

[0154] Each pixel PX may include a pixel circuit PC and a display element (e.g., an organic light emitting diode OLED) connected to the pixel circuit PC. The pixel circuit PC may include a first thin film transistor T1, a second thin film transistor T2, and a storage capacitor Cst. Each pixel PX may emit, for example, red, green, blue, or white light through the organic light emitting diode OLED. The first thin film transistor T1 and the second thin film transistor T2 may correspond to Figure 7 Thin film transistor TFT in.

[0155] The second thin film transistor T2 is a switching thin film transistor, which can be connected to the scan line SL and the data line DL, and transmits the data voltage input from the data line DL to the first thin film transistor T1 based on the switching voltage input from the scan line SL. The energy storage capacitor Cst can be connected to the second thin film transistor T2 and the driving voltage line PL, and stores a voltage equivalent to the difference between the voltage received from the second thin film transistor T2 and the first power supply voltage ELVDD supplied to the driving voltage line PL.

[0156] The first thin film transistor T1 is a driving thin film transistor, which can be connected to the driving voltage line PL and the energy storage capacitor Cst, and controls the driving current flowing from the driving voltage line PL to the organic light emitting diode OLED corresponding to the voltage value stored in the energy storage capacitor Cst. The organic light emitting diode OLED can emit light with a predetermined brightness according to the driving current. The opposite electrode (e.g., cathode, corresponding to Figure 7 The common electrode 230 in the embodiment may receive the second power supply voltage ELVSS.

[0157] Figure 8The pixel circuit PC is described as including two thin film transistors and one energy storage capacitor, but the present invention is not limited to this. The number of thin film transistors and the number of energy storage capacitors can be changed in various ways according to the design of the pixel circuit PC. For example, the pixel circuit PC can include four, five or more thin film transistors in addition to the two thin film transistors mentioned above.

[0158] As described above, the present invention is described with reference to the embodiments shown in the drawings, but this is only an example, and those skilled in the art should be able to understand that various modifications and variations of the embodiments can be achieved therefrom. Therefore, the true technical protection scope of the present invention should be determined by the technical ideas of the claims.

Claims

1. A manufacturing device for a display device, comprising: A process section including a first process line having a plurality of first process devices for performing a first process and a second process line having a plurality of second process devices for performing a second process; as well as A control unit controls the process unit, The plurality of first process devices and the plurality of second process devices can respectively realize a power saving mode, The control unit includes: a management unit generating input variables, the input variables including a target number of articles to be processed within a specified time on the first process line, a target number of articles to be processed within a specified time on the second process line, the number of the plurality of first process devices, the number of the plurality of second process devices, processing speeds of the plurality of first process devices, and processing speeds of the plurality of second process devices; a scheduling machine that receives the input variable from the management unit and outputs the output variable to the management unit; and a tool control unit that receives the output variable from the management unit and controls the process unit according to the output variable; The output variables include a power saving process device that is a target of the power saving mode among the plurality of first process devices and the plurality of second process devices, a power saving start time of the power saving process device, and a power saving end time of the power saving process device.

2. The manufacturing device of a display device according to claim 1, wherein: The plurality of first process devices and the plurality of second process devices are capable of adjusting the power saving degree to a plurality of stages in the power saving mode, respectively. The output variable also includes the power saving degree of the power saving process device.

3. The manufacturing device of a display device according to claim 2, wherein: At least one of the plurality of first process devices and the plurality of second process devices includes a heat treatment device for heat-treating the article, The heat treatment device comprises: Cavity; A heating part is arranged inside the cavity to radiate heat; a temperature sensor, sensing the temperature inside the cavity; and a temperature control unit that controls the degree of radiant heat from the heating unit based on information sensed by the temperature sensor, The tool control unit adjusts the power saving degree by controlling the temperature control unit.

4. The manufacturing device of a display device according to claim 2, wherein: At least one of the plurality of first process devices and the plurality of second process devices includes a laser processing device, The laser processing device comprises: A laser irradiation unit, irradiating laser; an energy sensor for sensing the energy of the laser; and an energy control unit that controls the energy level of the laser irradiated by the laser irradiation unit based on the information sensed by the energy sensor, The tool control unit adjusts the power saving degree by controlling the energy control unit.

5. The manufacturing apparatus of a display device according to claim 1, wherein: The management unit generates an inquiry signal for inquiring about a current power saving state of the process unit.

6. The manufacturing device of a display device according to claim 5, wherein: The tool control unit transmits the query signal to the process unit, When the process unit receives the inquiry signal, it calculates an inquiry variable including the number of articles processed so far on the first process line and the number of articles processed so far on the second process line. The tool control unit transmits the query variable to the management unit, The management unit compares the query variable, the input variable, and the output variable to determine whether an error occurs in the operation of the process unit.

7. The manufacturing device of a display device according to claim 6, wherein: When the management unit determines that the work of the process unit is wrong, The management unit inputs the query variable and the input variable to the scheduling machine, The scheduler receives the query variable and the input variable, modifies the output variable, and outputs the output variable to the management unit.

8. The manufacturing device of a display device according to claim 7, wherein: The tool control unit receives the corrected output variable from the management unit, and controls the process unit based on the corrected output variable.

9. The manufacturing apparatus of a display device according to claim 5, wherein: The management unit generates the inquiry signal a plurality of times at predetermined time intervals.

10. The manufacturing device of a display device according to any one of claims 1 to 9, wherein: The plurality of second process devices execute the second process on the article that has executed the first process, The first step and the second step are different steps from each other.

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