Laser processing head and laser processing system

Abstract

In the prior art, a cooperative robot capable of executing work in cooperation with an operator is popular. As a result, a laser processing head that can be applied to a manual operation mode in which an operator performs a laser emission operation manually and an automatic operation mode in which a laser processing system performs a laser emission operation automatically is requested. A laser processing head (14) capable of performing a laser emission operation in a manual operation mode in which a control device (18) performs a laser emission operation in accordance with a manual laser emission command and an automatic operation mode in which the control device (18) automatically performs a laser emission operation in accordance with a processing program, the laser processing head (14) comprising: a first input device (58); the input unit receives an input operation for transmitting a manual laser emission command to a control device (18). And a distance measuring sensor (62) that measures the distance between the laser processing head (14) and the workpiece (W) when the control device (18) executes the laser emission operation in the automatic operation mode.

Description

Technical Field

[0001] The present disclosure relates to a laser processing head and a laser processing system. Background Art

[0002] A laser processing head used in a laser processing system that automatically performs a laser emitting operation according to a processing program is known (Patent Document 1). On the other hand, a laser processing head that is manually operated by an operator is also known (Patent Document 2).

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2000-52076

[0006] Patent Document 2: Japanese Patent Application Publication No. 2000-24787 Summary of the invention

[0007] Problems to be solved by the invention

[0008] In the past, collaborative robots that can perform work in cooperation with an operator have become popular. As a result, there is a demand for laser processing heads that can be used in a manual operation mode in which an operator manually performs a laser emitting operation, and in an automatic operation mode in which a laser processing system automatically performs a laser emitting operation.

[0009] Means for solving problems

[0010] In one embodiment of the present invention, a laser processing head capable of performing laser emission action in a manual operation mode in which a control device performs laser emission action according to a manual laser emission instruction and in an automatic operation mode in which the control device automatically performs laser emission action according to a processing program comprises: a first input device that accepts an input operation for sending a manual laser emission instruction to the control device; and a distance measuring sensor that measures the distance between the laser processing head and a workpiece when the control device performs the laser emission action in the automatic operation mode. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is a schematic diagram of a laser processing system according to one embodiment.

[0012] Figure 2 yes Figure 1 Block diagram of the laser processing system shown.

[0013] Figure 3 yes Figure 1 An enlarged view of the mode selector switch is shown.

[0014] Figure 4 yes Figure 1 An enlarged view of the laser processing head is shown.

[0015] Figure 5 A first input device according to another embodiment is shown.

[0016] Figure 6 This is an enlarged view of a laser processing head according to another embodiment.

[0017] Figure 7 yes Figure 6 Block diagram of the laser processing head shown.

[0018] Figure 8 It is used for Figure 6 The figure shows the function of the contact detection device.

[0019] Fig. 9 It is used for Figure 6 The figure for explaining the function of the command blocking unit shown in FIG. 1 shows a state in which the command blocking unit blocks the manual laser emission command.

[0020] Fig.10 It is used for Figure 6 The diagram for explaining the function of the command blocking unit shown in FIG. 1 shows a state in which the command blocking unit permits transmission of a manual laser emission command.

[0021] Fig.11 Yes means Figure 6 A flowchart showing an example of the operation flow of the laser processing head shown.

[0022] Fig.12 Yes means Fig.11 A flowchart of an example of the process of step S2 in .

[0023] Fig.13 Yes means Fig.11 A flowchart of an example of the process of step S3 in .

[0024] Fig.14 This is a block diagram of a laser processing head according to still another embodiment.

[0025] Fig.15 Yes means Fig.14 Flowchart of an example of the flow of step S2 executed by the laser processing head shown. DETAILED DESCRIPTION

[0026] Hereinafter, the embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In addition, in the various embodiments described below, the same elements are marked with the same reference numerals, and repeated descriptions are omitted. Figure 1 and Figure 2A laser processing system 10 according to one embodiment will be described. The laser processing system 10 is a system that can perform laser processing (laser welding, laser cutting, etc.) on a workpiece W in cooperation with an operator.

[0027] Specifically, the laser processing system 10 includes a robot 12, a laser processing head 14, a laser oscillator 16, and a control device 18. The robot 12 moves the laser processing head 14 relative to the workpiece W. In the present embodiment, the robot 12 is a vertical multi-joint robot, and includes a robot base 20, a rotary body 22, a lower arm 24, an upper arm 26, and a wrist 28.

[0028] The robot base 20 is fixed on the floor of the work unit. The revolving body 22 is provided on the robot base 20 so as to be rotatable around a vertical axis. The lower arm 24 is provided on the revolving body 22 so as to be rotatable around a horizontal axis. The upper arm 26 is provided at the top end of the lower arm 24 so as to be rotatable. The wrist 28 includes: a wrist base 28a provided at the top end of the upper arm 26 so as to be rotatable around two axes orthogonal to each other; and a wrist flange 28b provided on the wrist base 28a so as to be rotatable.

[0029] A plurality of servo motors 30 are provided in each component of the robot 12 (ie, the robot base 20, the rotary body 22, the lower arm 24, the upper arm 26, and the wrist 28). Figure 2 ). These servo motors 30 rotate the movable components of the robot 12 (i.e., the rotary body 22, the lower arm 24, the upper arm 26, the wrist 28, and the wrist flange 28b) around the drive axis according to the command from the control device 18. Thus, the robot 12 moves the laser processing head 14.

[0030] The robot 12 is provided with a force sensor 32. The force sensor 32 detects an external force F applied to the robot 12. As an example, the force sensor 32 is provided to each servomotor 30 of the robot 12 and includes a torque sensor that detects torque applied to an output shaft of the servomotor 30.

[0031] As another example, the force sensor 32 is provided in a component of the robot 12 (e.g., the robot base 20 or the wrist 28), and has a six-axis force sensor capable of detecting forces in six-axis directions. The control device 18 can determine the magnitude and direction of the external force F applied to the robot and the part of the robot 12 (e.g., the wrist 28) to which the external force F is applied based on the detection data of the force sensor 32.

[0032] The laser oscillator 16 performs laser oscillation internally according to the instruction (laser power instruction, etc.) from the control device 18 to generate a laser beam LB. The laser oscillator 16 can be any type of laser oscillator such as a fiber laser oscillator, a pulsed laser oscillator, a CO2 laser oscillator, or a solid laser (YAG laser) oscillator. The laser oscillator 16 supplies the generated laser beam LB to the laser processing head 14 via the light guide path 34. The light guide path 34 can be composed of a light guide material such as an optical fiber, a cavity, a crystal, a reflector, or an optical lens.

[0033] The control device 18 controls the laser emitting operation LO for operating the laser oscillator 16 to emit the laser beam LB from the laser processing head 14 and the moving operation MO for operating the robot 12 to move the laser processing head 14 mounted on the robot 12 relative to the workpiece W. Specifically, Figure 2 As shown, the control device 18 is a computer having a processor 36 , a memory 38 , and an I / O interface 40 .

[0034] The processor 36 includes a CPU or a GPU, etc., and is communicatively connected to the memory 38 and the I / O interface 40 via a bus 42, communicates with these components, and performs various calculations for executing the laser processing described later. The memory 38 includes a RAM or a ROM, etc., and temporarily or permanently stores various data used in the calculations executed by the processor 36, and various data generated in the middle of the calculations.

[0035] The I / O interface 40 has, for example, an Ethernet (registered trademark) port, a USB port, an optical fiber connector, or an HDMI (registered trademark) terminal, and communicates data with external devices by wire or wirelessly under the instruction from the processor 36. The robot 12 (specifically, the servo motor 30 and the force sensor 32), the laser processing head 14, and the laser oscillator 16 are connected to the I / O interface 40 so as to be communicable.

[0036] The control device 18 is further provided with an input device 44 and a display device 46. The input device 44 includes a keyboard, a mouse, a touch panel, etc., and receives data input from an operator. The display device 46 includes a liquid crystal display, an organic EL display, etc., and displays various data.

[0037] The input device 44 and the display device 46 are connected to the I / O interface 40 in a wired or wireless communication manner. In addition, the input device 44 and the display device 46 can be integrally assembled in the housing of the control device 18, or, for example, can be provided separately from the housing of the control device 18 as a computer (PC, etc.).

[0038] In this embodiment, a mode selection switch 48 is provided in the control device 18. The mode selection switch 48 is used to select the operation mode DM of the laser processing executed by the control device 18. Figure 3 As shown, in the present embodiment, the mode selection switch 48 is configured to be able to switch the operation mode DM between a manual operation mode DM1 indicating “manual” and an automatic operation mode DM2 indicating “automatic”.

[0039] The operator can switch the operation mode DM between the manual operation mode DM1 and the automatic operation mode DM2 by operating the mode selection switch 48. The manual operation mode DM1 is an operation mode DM in which the operator holds the laser processing head 14 by hand to carry it, and causes the control device 18 to manually execute the laser emission action LO, and manually laser processes the workpiece W using the laser beam LB emitted from the laser processing head 14. In the manual operation mode DM1, the operator manually provides the control device 18 with a manual laser emission command CM1 described later, and the processor 36 of the control device 18 executes the laser emission action LO according to the manual laser emission command CM1.

[0040] On the other hand, the automatic operation mode DM2 is an operation mode DM in which the processor 36 of the control device 18 automatically executes the laser emission operation LO and the movement operation MO according to the pre-made processing program PG1. Specifically, the processor 36 sequentially generates instructions for the laser oscillator 16 according to the processing program PG1, operates the laser oscillator 16 according to the instructions, and automatically executes the laser emission operation LO of emitting the laser beam LB from the laser processing head 14.

[0041] In addition, the processor 36 sequentially generates instructions (position instructions, speed instructions, torque instructions, etc.) for the robot 12 (specifically, each servo motor 30) according to the processing program PG1, and operates the robot 12 according to the instructions to automatically execute the movement MO of moving the laser processing head 14 relative to the workpiece W. The processing program PG1 is created by the operator and stored in the memory 38 in advance. In addition, Figure 3 The state in which the automatic operation mode DM2 (“automatic”) is selected by the mode selection switch 48 is shown.

[0042] The laser processing head 14 is detachably mounted on the wrist flange 28b of the robot 12. Figure 4 As shown, the laser processing head 14 includes a head body 50, a nozzle 52, a mounting member 54, a gripping portion 56, a first input device 58, a second input device 60, and a distance sensor 62. The head body 50 is hollow, and contains optical system components such as an optical lens (collimating lens, focusing lens, etc.) and a lens driving portion (for example, a servo motor) that shifts the optical lens according to a command from the control device 18.

[0043] The nozzle 52 is hollow and is disposed at the top end of the head body 50. In the present embodiment, the nozzle 52 has a truncated cone-shaped shape whose cross-sectional area decreases from its base end toward its top end, and an ejection port 52a is formed at its top end. A hollow chamber is formed inside the nozzle 52 and the head body 50, and an auxiliary gas AG is supplied into the chamber from an auxiliary gas supply device (not shown) disposed outside. The laser beam LB generated by the laser oscillator 16 propagates in the chamber and is ejected from the ejection port 52a along the optical axis A together with the auxiliary gas AG.

[0044] The detachable member 54 is provided on the head body 50, and is attached and detached to the wrist flange 28b of the robot 12. As an example, the detachable member 54 may also have a fastener such as a bolt, and is fastened to the wrist flange 28b by the fastener. As another example, the detachable member 54 may also have an engaging portion that is detachably engaged with an engaged portion formed on the wrist flange 28b, and is attached and detached to the wrist flange 28b by engaging the engaged portion with the engaging portion. As another example, the detachable member 54 may also have an electromagnet, and is adsorbed and fixed to the wrist flange 28b by the electromagnetic force generated by the electromagnet. The laser processing head 14 is detachably mounted on the wrist flange 28b of the robot 12 via the detachable member 54.

[0045] The gripping portion 56 is provided at the base end of the head body 50 so that the operator can grip it with one hand. In order for the operator to easily grip it with one hand, the gripping portion 56 may also have concave and convex portions corresponding to the fingers of the one hand. The operator can remove the laser machining head 14 from the wrist flange 28b by gripping the gripping portion 56, thereby being able to carry the laser machining head 14.

[0046] The first input device 58 receives an input operation for sending a manual laser emission command CM1 to the control device 18. In the present embodiment, the first input device 58 includes a push button, a switch, a touch panel, etc., which can be manually input by an operator, and is provided in the laser processing head 14 (for example, the head body 50 or the gripping portion 56).

[0047] When receiving an input operation by the operator (e.g., pressing a push button, switching a switch, or touching a touch panel), the first input device 58 supplies a manual laser emission command CM1 to the control device 18. The manual laser emission command CM1 may also be an on signal (or a "1" signal).

[0048] When the control device 18 receives the manual laser emission command CM1 during the execution of the manual operation mode DM1, the control device 18 executes the laser emission operation LO according to the manual laser emission command CM1. In this way, as the manual operation mode DM1, the operator can manually laser process the workpiece W using the laser beam LB emitted from the emission port 52a of the laser processing head 14 along the optical axis A while carrying the laser processing head 14 by hand. In addition, in the present embodiment, the first input device 58 is provided adjacent to the gripping portion 56 in such a manner that the operator can perform input operations with one hand holding the gripping portion 56.

[0049] The second input device 60 receives an input operation for issuing a manual gas injection command CM2 for injecting the assist gas AG. Specifically, the second input device 60 includes a push button, a switch, or a touch panel, etc., which an operator can perform an input operation by hand, and when receiving an input operation performed by the operator, the manual gas injection command CM2 is sent to the control device 18. In addition, the manual gas injection command CM1 may also be an on signal (or a "1" signal).

[0050] When receiving the manual gas injection command CM2 during the manual operation mode DM1, the control device 18 operates the assist gas supply device to supply assist gas AG to the laser processing head 14. As a result, the laser beam LB and assist gas AG are emitted from the emission port 52a of the laser processing head 14 held by the operator.

[0051] In addition, the second input device 60 can also be configured to directly send the manual gas injection command CM1 to the auxiliary gas supply device. In this embodiment, the second input device 60 is also arranged adjacent to the grip portion 56 and the first input device 58 in a manner that the operator can perform input operations with one hand holding the grip portion 56, just like the first input device 58 described above.

[0052] When the control device 18 performs the laser emitting operation LO in the automatic operation mode DM2, the distance sensor 62 measures the distance d between the laser processing head 14 (for example, the emission port 52a) and the workpiece W. Specifically, the distance sensor 62 is, for example, a capacitance type, an infrared type, a laser type, or a sonic wave type (for example, an ultrasonic type) distance sensor.

[0053] For example, in the case of an electrostatic capacitance type, the distance measuring sensor 62 is provided on the head body 50 (or the nozzle 52) so as to measure the distance to the object located at the position closest to the laser processing head 14. On the other hand, in the case of an infrared type, a laser type, or a sound wave type, the distance measuring sensor 62 is mounted on the head body 50 (or the nozzle 52) so that the measurement direction D (in other words, the radiation direction of the infrared ray, the laser, or the sound wave) for measuring the distance to the object is parallel to the optical axis A. That is, in this case, the distance measuring sensor 62 measures the distance d between the laser processing head 14 (the ejection port 52a) and the workpiece W in the direction of the optical axis A.

[0054] The distance sensor 62 continuously (e.g., periodically) measures the distance d when the control device 18 performs the laser emitting operation LO in the automatic operation mode DM2. The processor 36 of the control device 18 performs the laser emitting operation LO in the automatic operation mode DM2 when the distance d measured by the distance sensor 62 is within the predetermined allowable range RG, and does not perform the laser emitting operation LO when the distance d is outside the allowable range RG.

[0055] In addition, when the processor 36 executes the moving operation MO in the automatic operation mode DM2, the external force F detected by the force sensor 32 exceeds the predetermined threshold value F. th , the movement of the robot 12 is stopped. Thus, when the robot 12 in the mobile action MO collides with a surrounding object (for example, an operator), the robot 12 can be stopped urgently.

[0056] As described above, in the present embodiment, the laser processing head 14 is configured to be capable of performing laser emission action in manual operation mode DM1 and automatic operation mode DM2. The manual operation mode DM1 is a mode in which the control device 18 performs the laser emission action LO according to the manual laser emission instruction CM1, and the automatic operation mode DM2 is a mode in which the control device 18 automatically performs the laser emission action LO according to the processing program PG1.

[0057] In this way, in order to be applicable to both the manual operation mode DM1 and the automatic operation mode DM2, the laser processing head 14 has: a first input device 58, which accepts an input operation for sending a manual laser emission instruction CM1 to the control device 18; and a distance measuring sensor 62, which measures the distance d between the laser processing head 14 and the workpiece W when the control device 18 performs the laser emission action LO in the automatic operation mode DM2.

[0058] According to this structure, the operator can freely switch between the manual operation mode DM1 and the automatic operation mode DM2 according to the progress of the laser processing, and perform the laser processing. Thus, various laser processing can be performed. In addition, in the manual operation mode DM1, the operator can manually control the laser emission action LO by operating the first input device 58, while in the automatic operation mode DM2, the control device 18 can automatically control the laser emission action LO according to the distance d measured by the distance measuring sensor 62. Therefore, the safety of the laser processing operation can be ensured.

[0059] In the present embodiment, the first input device 58 includes a push button, a switch, or a touch panel that the operator can manually input. With this configuration, the operator can send a manual laser emission command CM1 to the control device 18 by a simple operation in the manual operation mode DM1.

[0060] In the present embodiment, the laser machining head 14 further includes a second input device 60 that receives an input operation of issuing a manual gas injection command CM2 for injecting the assist gas AG. With this configuration, the operator can manually control the injection of the assist gas AG even in the manual operation mode DM1.

[0061] In addition, in the present embodiment, the laser processing head 14 further includes: a detachable member 54 that is attached to and detached from the robot 12 (specifically, the wrist flange 28b) that moves the laser processing head 14; and a grip 56 that can be gripped by an operator with one hand. Furthermore, a first input device 58 is provided adjacent to the grip 56 so that input operations can be performed with the hand gripping the grip 56.

[0062] According to this configuration, the operator can easily perform the laser emitting operation LO in the manual operation mode DM1 by operating the detachable tool 54 to detach the laser processing head 14 from the robot 12 while holding the gripping portion 56 with one hand, and operating the first input device 58 with the same hand.

[0063] On the other hand, the operator can easily perform the laser emitting operation LO in the automatic operation mode DM2 by attaching the laser processing head 14 to the robot 12 via the attachment 54. Thus, the operator can switch between the manual operation mode DM1 and the automatic operation mode DM2 more smoothly and easily.

[0064] Furthermore, the first input device 58 is not limited to a push button, a switch, or a touch panel, and may include a foot pedal or a foot switch that an operator can perform input operations with his foot. Figure 5 Indicates this way. Figure 5In the laser processing head 14 ′ shown, the first input device 58 ′ has a foot pedal or a foot switch, which is provided separately from the head body 50 .

[0065] The first input device 58' is electrically connected to the electronic components (e.g., a processor described later) housed inside the head body 50. When the first input device 58' receives an input operation performed by the operator (e.g., stepping on a foot pedal or switching a foot switch), it sends a manual laser emission command CM1 to the control device 18 via the electronic components in the head body 50.

[0066] In addition, the first input device 58, 58' is not limited to a push button, a switch, a touch panel, a foot pedal or a foot switch, and can be any type of input device. For example, the first input device 58, 58' can also have a microphone for detecting the voice of the operator and a sound analysis unit for analyzing the voice. In this case, the first input device 58, 58' receives the voice input operation performed by the operator and sends the manual laser emission instruction CM1 to the control device 18.

[0067] In addition, the second input device 60 may be omitted from the laser processing head 14 or 14'. In this case, the second input device 60 may also be provided in the control device 18. Alternatively, the input device 44 described above may also function as the second input device 60. In this case, the operator may also operate the assist gas supply device by operating the input device 44 to supply the assist gas AG to the laser processing head 14 or 14'.

[0068] In addition, the gripping portion 56 may be omitted, and the operator may carry the laser processing head 14 or 14' by gripping the head body 50, for example. In addition, the first input device 58 may be provided at any position of the laser processing head 14 or 14', or the gripping portion 56 and the first input device 58 may be provided in such a manner that the operator can grip the gripping portion 56 (or the head body 50) with one hand and operate the first input device 58 with the other hand.

[0069] Next, refer to Figure 6 and Figure 7 , a laser processing head 64 of another embodiment is described. The laser processing head 64 can be applied to the laser processing system 10 instead of the above-mentioned laser processing head 14, and can be mounted on the wrist flange 28b of the robot 12 in a detachable manner. The laser processing head 64 is different from the above-mentioned laser processing head 14 in the following structure.

[0070] Specifically, the laser processing head 64 further includes a mode selection switch 48, a contact detection device 66, and a processor 68. In this embodiment, the mode selection switch 48 is integrally provided with the head body 50, and can switch between the manual operation mode DM1 and the automatic operation mode DM2 as in the above-mentioned embodiment.

[0071] The contact detection device 66 detects whether the laser processing head 64 is in contact or non-contact with the workpiece W. Specifically, the contact detection device 66 includes a conductive cable 66a and a resistance sensor 66b ( Figure 7 One end of the conductive cable 66a is electrically connected to the head body 50 of the laser processing head 64, and the other end is electrically connected to the workpiece W, thereby electrically connecting the laser processing head 64 and the workpiece W.

[0072] Here, in this embodiment, at least a portion of the head body 50 and the nozzle 52 of the laser processing head 64 is made of a conductive material (for example, metal). In addition, the workpiece W is made of metal (for example, iron or copper). Therefore, it is assumed that when the tip of the nozzle 52 of the laser processing head 64 contacts the workpiece W, as shown in FIG. Figure 8 As shown, a closed loop 70 is formed by the workpiece W, the head body 50 and the nozzle 52 of the laser processing head 64, and the conductive cable 66a.

[0073] The resistance sensor 66b measures the resistance R of the closed loop 70 by applying a voltage to the closed loop 70. Figure 8 As shown, when the laser processing head 64 is in contact with the workpiece W, the resistance R measured by the resistance sensor 66b is a very small value R0 (R0≈0). On the other hand, when the laser processing head 64 is not in contact with the workpiece W (that is, the tip of the nozzle 52 is separated from the workpiece W), the resistance R measured by the resistance sensor 66b is a very large value R1 (R1≈∞>>R0).

[0074] The contact detection device 66 can detect whether the laser processing head 64 is in contact or non-contact with the workpiece W based on the resistance R measured by the resistance sensor 66b. The resistance sensor 66b provides the measured data of the resistance R or the contact determination data indicating the contact or non-contact between the laser processing head 64 and the workpiece W as the detection data DD to the processor 68. The processor 68 can determine whether the laser processing head 64 is in contact or non-contact with the workpiece W based on the detection data DD of the resistance sensor 66b. In addition, the resistance sensor 66b can also be built in the head body 50.

[0075] Reference Figure 7The processor 68 has a CPU or a GPU, etc., and is built into the head body 50. The processor 68 is communicatively connected to the mode selection switch 48, the first input device 58, the second input device 60, the distance sensor 62, and the resistance sensor 66b via a bus (or communication line) 72.

[0076] Here, in the present embodiment, the processor 68 functions as a command blocking unit 74, and blocks the manual laser emission command CM1 sent from the first input device 58 to the control device 18 when the condition CD for executing the laser emission operation LO in the manual operation mode DM1 is not satisfied. Fig. 9 as well as Fig.10 The function of the command blocking unit 74 will be described.

[0077] Fig. 9 The state in which the manual laser emission command CM1 is blocked by the command blocking unit 74 is schematically shown. Specifically, the manual laser emission command CM1 sent by the first input device 58 is sent to the control device 18 via the communication line 76 , and a blocking circuit 78 is provided on the communication line 76 .

[0078] The blocking circuit 78 has, for example, an electronically controllable switch 78a (relay, etc.), which is built into the head body 50 of the laser processing head 64. The command blocking unit 74 opens and closes the switch 78a of the blocking circuit 78 according to a predetermined condition CD, thereby blocking the manual laser emission command CM1 or allowing the transmission of the manual laser emission command CM1.

[0079] For example, the condition CD for executing the laser emitting operation LO in the manual operation mode DM1 includes a first condition CD1 that the manual operation mode DM1 is selected by the mode selection switch 48 and a second condition CD2 that the laser machining head 64 is in contact with the workpiece W.

[0080] In the case that the first condition CD1 or the second condition CD2 is not satisfied, Fig. 9 As shown, the instruction blocking unit 74 turns off the switch 78a of the blocking circuit 78, thereby blocking the manual laser emission instruction CM1. On the other hand, when the first condition CD1 and the second condition CD2 are satisfied, as shown in FIG. Fig.10 As shown, the command blocking unit 74 closes the switch 78a of the blocking circuit 78, thereby allowing the transmission of the manual laser emission command CM1.

[0081] In this way, the processor 68 functions as the instruction blocking unit 74 and operates the blocking circuit 78, thereby blocking the manual laser emission instruction CM1 or allowing the transmission of the manual laser emission instruction CM1 according to the condition CD. In addition, the blocking circuit 78 (switch 78a) can be composed of an analog circuit, or can be composed of a digital circuit realized by signal processing performed by the processor 68. In addition, Fig. 9 and Fig.10 The blocking circuit 78 shown is an example and may be constituted by any circuit.

[0082] Next, refer to Fig.11 The functions of the laser processing head 64 will be described. When the processor 68 of the laser processing head 64 receives an operation start instruction from the control device 18, it starts Fig.11 In step S1, the processor 68 determines whether the manual operation mode DM1 is selected by the mode selection switch 48. The processor 68 determines YES if the manual operation mode DM1 is selected by the mode selection switch 48 and proceeds to step S2. On the other hand, the processor 68 determines NO and proceeds to step S3.

[0083] In step S2, the processor 68 executes the process of the manual operation mode DM1. Fig.12 The step S2 is described below. In addition, at the start time of step S2, the processor 68 may Fig. 9 The switch 78a of the blocking circuit 78 is opened as shown, or it can also be as shown in FIG. Fig.10 The switch 78a is shown closed.

[0084] After step S2 starts, in step S11, the processor 68 sends a manual operation mode transfer instruction CM3 to the control device 18. The processor 36 ( Figure 2 ) When the manual operation mode transfer command CM3 is received, the operation mode DM is transferred to the manual operation mode DM1.

[0085] After the transfer to the manual operation mode DM1, the processor 36 of the control device 18 becomes capable of accepting the manual laser emission instruction CM1, and on the other hand, rejects the automatic operation start instruction CM4 for starting the laser emission action LO and the movement action MO in the automatic operation mode DM2. In addition, in this step S11, the mode selection switch 48 may also provide the manual operation mode transfer instruction CM3 to the control device 18. In addition, the manual operation mode transfer instruction CM3 may also be an on signal (or a "1" signal).

[0086] In step S12, the processor 68 starts the operation of detecting contact or non-contact between the laser processing head 64 and the workpiece W by the contact detection device 66. Specifically, the processor 68 starts the operation of causing the resistance sensor 66b to measure the resistance R and continuously (eg, periodically) acquiring detection data DD from the resistance sensor 66b.

[0087] In step S13, processor 68 determines whether first input device 58 has received an input operation for sending manual laser emission command CM1. If first input device 58 has received an input operation by the operator, processor 68 determines that it is yes and proceeds to step S14. On the other hand, if it is no, the process proceeds to step S20.

[0088] In step S14, the processor 68 determines whether the manual operation mode DM1 is selected by the mode selection switch 48 (i.e., the condition CD1 is satisfied) in the same manner as in the above-mentioned step S1. The processor 68 proceeds to step S15 if the determination is yes, and proceeds to step S18 if the determination is no (i.e., the mode selection switch 48 is switched to the automatic operation mode DM2, and the condition CD1 is not satisfied).

[0089] In step S15, the processor 68 determines whether the laser machining head 64 is in contact with the workpiece W (i.e., condition CD2 is satisfied). Specifically, the processor 68 determines whether the laser machining head 64 and the workpiece W are in contact or non-contact as detected by the contact detection device 66 based on the detection data DD most recently acquired from the resistance sensor 66b.

[0090] When the processor 68 detects contact between the laser processing head 64 and the workpiece W, it determines as yes and proceeds to step S16. On the other hand, when the processor 68 detects non-contact between the laser processing head 64 and the workpiece W (i.e., when condition CD2 is not satisfied), it determines as no and proceeds to step S19.

[0091] In step S16, the processor 68 allows the manual laser emission command CM1 to be sent from the first input device 58 to the control device 18. Specifically, the processor 68 functions as the command blocking unit 74. Fig.10 As shown, the blocking circuit 78 is activated to close the switch 78a.

[0092] Thus, the first input device 58 can send the manual laser emission command CM1 to the control device 18 through the communication line 76 according to the input operation of the operator received in step S13. The processor 36 of the control device 18 executes the laser emission operation LO according to the manual laser emission command CM1 from the first input device 58, and as a result, the laser beam LB is emitted from the emission port 52a of the laser processing head 64. In this way, the operator can manually perform laser processing on the workpiece W.

[0093] In step S17, the processor 68 determines whether the operation end instruction is received from the control device 18. If the processor 68 receives the operation end instruction, it determines that it is yes and ends the process of step S2. Fig.11 On the other hand, if the processor 68 determines that it is negative, the process returns to step S13. In addition, if the processor 68 determines that it is positive in step S17, the processor 68 may function as the instruction blocking unit 74 to operate the blocking circuit 78 and turn off the switch 78a.

[0094] On the other hand, if the determination in step S14 is negative, in step S18, the processor 68 blocks the manual laser emission command CM1 sent from the first input device 58 to the control device 18. Specifically, the processor 68 functions as a command blocking unit 74, such as Fig. 9 As shown, the blocking circuit 78 is activated to open the switch 78a.

[0095] Thus, the manual laser emission command CM1 sent from the first input device 58 to the control device 18 is blocked, and the processor 36 of the control device 18 does not execute the laser emission operation LO. After step S18, the processor 68 of the laser processing head 64 enters the Fig.11 Step S3 in .

[0096] On the other hand, if the determination in step S15 is negative, in step S19, processor 68 functions as command blocking unit 74, similar to step S18, to block manual laser emission command CM1 sent from first input device 58 to control device 18. Processor 68 then returns to step S13.

[0097] If the determination result in step S13 is negative, in step S20, the processor 68 determines whether the manual operation mode DM1 is selected by the mode selection switch 48, similarly to the above-mentioned step S14. The processor 68 proceeds to step S17 if the determination result is positive, and proceeds to step S28 if the determination result is negative. Fig.11 Step S3 in .

[0098] Thus, while the processor 68 determines YES in steps S13 to S15 and NO in step S17 , the processor 68 continues to allow the transmission of the manual laser emission command CM1 in step S16 . Thus, the operator can continue manual laser processing while performing input operations on the first input device 58 .

[0099] On the other hand, after the processor 68 determines YES in step S13, if it determines NO in step S14 or S15, it blocks the manual laser emission command CM1 in step S18 or S19. As a result, the laser emission operation LO in the manual operation mode DM1 is prohibited.

[0100] Refer again Fig.11 In the case where the judgment is No in step S1 (or Fig.12 After the determination is negative in step S20 in the above, or after executing step S18), in step S3, the processor 68 executes the process of the automatic operation mode DM2. Fig.13 The step S3 is described. In addition, at the start time of step S3, the processor 68 may also Fig. 9 The switch 78a of the blocking circuit 78 is opened as shown.

[0101] After step S3 is started, in step S21, the processor 68 sends an automatic operation mode transfer instruction CM5 to the control device 18. The processor 36 ( Figure 2 ) When receiving the automatic operation mode transfer command CM5, the operation mode DM is transferred to the automatic operation mode DM2. In addition, in this step S21, the mode selection switch 48 can also supply the automatic operation mode transfer command CM5 to the control device 18. In addition, the automatic operation mode transfer command CM5 can also be an off signal (or a "0" signal).

[0102] After the transition to the automatic operation mode DM2, the processor 36 of the control device 18 is in a state capable of accepting the automatic operation start command CM4, and on the other hand, rejects the manual laser emission command CM1 from the laser processing head 64. Furthermore, when the processor 36 accepts the automatic operation start command CM4 from the operator through the input device 44, for example, the processor 36 automatically executes the laser emission action LO and the movement action MO in the automatic operation mode DM2 according to the processing program PG1.

[0103] In step S22, the processor 68 starts the operation of acquiring the distance d measured by the distance measuring sensor 62. Specifically, the processor 68 operates the distance measuring sensor 62 to continuously (e.g., periodically) measure the distance d between the laser processing head 64 and the workpiece W. The processor 68 continuously (e.g., periodically) acquires the distance d measured by the distance measuring sensor 62.

[0104] In step S23, the processor 68 determines whether the distance d obtained most recently from the distance measuring sensor 62 is within a predetermined allowable range RG. For example, the allowable range RG may be determined as d≤d th (For example, th =3[mm]), or can also be determined as [d th1 d th2 ](For example, d th1 =0.1[mm], d th2 =3[mm]) (i.e., d th1 ≤d≤d th2 ). The processor 68 determines YES when the distance d is within the permissible range RG and proceeds to step S25. On the other hand, the processor determines NO when the distance d is outside the permissible range RG and proceeds to step S24.

[0105] In step S24, the processor 68 sends a laser emission prohibition instruction CM6 to the control device 18. The laser emission prohibition instruction CM6 is an instruction for the processor 36 of the control device 18 to prohibit the laser emission operation LO in the automatic operation mode DM2. When the processor 36 of the control device 18 receives the laser emission prohibition instruction CM6, it stops (or does not start) the laser emission operation LO in the automatic operation mode DM1.

[0106] Thus, in the present embodiment, the processor 68 of the laser processing head 64 functions as the instruction sending unit 80 ( ) that sends the laser emission prohibition instruction CM6 to the control device 18. Figure 7 ) to function. In addition, the laser emission prohibition instruction CM6 may also be an off signal (or a "0" signal).

[0107] After step S24, processor 68 returns to step S23. Thus, while processor 68 makes a negative determination in step S23, in step S24, processor 68 sends laser emission prohibition command CM6, thereby prohibiting control device 18 from executing laser emission operation LO in automatic operation mode DM2.

[0108] On the other hand, if the determination in step S23 is YES, in step S25, the processor 68 functions as the command transmission unit 80 and transmits the laser emission permission command CM7 to the control device 18. The laser emission permission command CM7 is a command for allowing the processor 36 of the control device 18 to execute the laser emission operation LO in the automatic operation mode DM2.

[0109] When receiving the laser emission permission command CM7, the processor 36 of the control device 18 can execute the laser emission operation LO in the automatic operation mode DM1 according to the automatic operation start command CM4. The laser emission permission command CM7 may be an on signal (or "1" signal).

[0110] In step S26, the processor 68 determines whether the manual operation mode DM1 is selected by the mode selection switch 48, similarly to the above-mentioned step S14. The processor 68 proceeds to step S28 when the determination is yes, and proceeds to step S27 when the determination is no.

[0111] In step S27, the processor 68 determines whether the action end instruction is received, similarly to the above step S17. If the processor 68 determines that it is yes, the process of step S3 is terminated, and thus the process is terminated. Fig.11 On the other hand, if the determination result is negative, the processor 68 returns to step S23.

[0112] On the other hand, if the determination in step S26 is YES, in step S28, the processor 68 sends the laser emission prohibition instruction CM6 to the control device 18, similarly to the above-mentioned step S24. Then, the processor 68 proceeds to step S29. Fig.11 Step S2 in .

[0113] As described above, in the present embodiment, the laser processing head 64 further includes: a command blocking unit 74, which blocks the manual laser emission command CM1 sent from the first input device 58 to the control device 18 when the conditions CD (CD1, CD2) for performing the laser emission action LO in the manual operation mode DM1 are not satisfied (i.e., when it is determined as no in step S14 or S15).

[0114] According to this configuration, when the condition CD for ensuring the safety of the operator in the manual operation mode DM1 is not satisfied, the manual laser emission command CM1 is blocked to prohibit the laser beam LB from being emitted from the laser processing head 64. Thus, the safety of the operator in the manual operation mode DM1 can be reliably ensured.

[0115] In the present embodiment, the laser machining head 64 further includes a mode selection switch 48 that can select the manual operation mode DM1 or the automatic operation mode DM2. The condition CD includes a first condition CD1 in which the manual operation mode DM1 is selected by the mode selection switch 48.

[0116] Then, when the manual operation mode DM1 is not selected by the mode selection switch 48 (when it is determined to be NO in step S14), the command blocking unit 74 blocks the manual laser emission command CM1 (step S18). According to this structure, the operator needs to manually switch the mode selection switch 48 to the manual operation mode DM1 in order to perform laser processing in the manual operation mode DM. Therefore, it is possible to avoid accidentally performing the laser emission operation LO in the manual operation mode DM.

[0117] In addition, in the present embodiment, the laser processing head 64 further includes a contact detection device 66 that detects contact or non-contact between the laser processing head 64 and the workpiece W. In addition, the condition CD includes a second condition CD2 that the laser processing head 64 is in contact with the workpiece W. Then, when non-contact is detected by the contact detection device 66 (when it is determined to be negative in step S15), the command blocking unit 74 blocks the manual laser emission command CM1 (step S19).

[0118] According to this structure, when the laser emitting operation LO is performed in the manual operation mode DM, the laser processing head 64 is separated from the workpiece W, and the laser beam LB from the laser processing head 64 can be prevented from being emitted in an undesirable direction (for example, in the direction of the operator). Thus, the safety of the operator in the manual operation mode DM1 can be more reliably ensured.

[0119] In addition, in this embodiment, the contact detection device 66 has: a conductive cable 66a, which electrically connects the laser processing head 64 to the workpiece W; and a resistance sensor 66b, which measures the resistance R of the closed loop 70 formed by the workpiece W, the laser processing head 64 in contact with the workpiece W, and the conductive cable 66a.

[0120] Thus, the contact detection device 66 is configured to detect contact or non-contact between the laser machining head 64 and the workpiece W based on the resistance R measured by the resistance sensor 66b. According to this configuration, contact or non-contact between the laser machining head 64 and the workpiece W can be detected quickly and reliably with a relatively simple configuration.

[0121] In addition, in the present embodiment, the laser processing head 64 also has: a command sending unit 80, which sends a laser emission prohibition command CM6 to the control device 18 to prohibit the control device 18 from prohibiting the laser emission action LO in the automatic operation mode DM2 when the distance d measured by the distance measuring sensor 62 is outside the predetermined allowable range RG (that is, when it is determined to be no in step S23).

[0122] According to this configuration, when the laser emitting operation LO is executed in the automatic operation mode DM2, the laser emitting operation LO can be prohibited if the workpiece W is not disposed at an appropriate position relative to the laser processing head 64. This can improve the safety of the laser processing operation executed in the automatic operation mode DM2.

[0123] In addition, the mode selection switch 48 may be omitted from the laser processing head 64. Figure 1 In the embodiment shown in FIG. 1 , the contact detection device 66 may be omitted from the laser processing head 64. In this case, the contact detection device 66 may be omitted from the laser processing head 64. Fig.12 The illustrated flow omits steps S15 and S19. The contact detection device 66 is not limited to the one having the conductive cable 66a and the resistance sensor 66b, and may include any sensor such as a proximity sensor capable of detecting contact between the laser processing head 64 and the workpiece W.

[0124] In addition, the instruction sending unit 80 may be omitted from the laser processing head 64. In this case, the processor 68 (or the distance measuring sensor 62) of the laser processing head 64 may also provide the measurement data of the distance d measured by the distance measuring sensor 62 to the control device 18. Then, the processor 36 of the control device 18 may determine whether the laser emitting operation LO can be executed in the automatic operation mode DM2 based on the measurement data.

[0125] In addition, the processor 36 of the control device 18 may continuously (e.g., periodically) obtain the measurement data of the distance d from the distance measuring sensor 62 during the process of performing the laser emitting operation LO and the moving operation MO in the automatic operation mode DM2. Then, the processor 36 may perform gap control to control the distance d between the laser processing head 14 and the workpiece W to a predetermined target distance d0 based on the obtained measurement data. The target distance d0 can be predetermined as a value within the above-mentioned allowable range RG.

[0126] Next, refer to Fig.14 , a laser processing head 84 of another embodiment will be described. The laser processing head 84 can be applied to the laser processing system 10 instead of the above-mentioned laser processing head 64. The laser processing head 84 is different from the above-mentioned laser processing head 64 in that it further includes a timing unit 86. The timing unit 86 is built into the head body 50 together with the processor 68 and the resistance sensor 66b, for example, and counts the elapsed time t from a certain time point.

[0127] Next, refer to Fig.15 Step S2 performed by the laser processing head 84 will be described. Fig.11 In step S2, the processor 68 of the laser processing head 84 executes Fig.15In addition, Fig.15 In the process shown, Fig.12 The same steps in the flow chart are marked with the same step numbers and repeated descriptions are omitted.

[0128] Here, in the present embodiment, the processor 68 pre-sets a waiting time t0 from the time t0 when the contact detection device 66 detects that the laser processing head 84 is not in contact with the workpiece W (i.e., it is determined to be No in step S15) to the time when the manual laser emission command CM1 is blocked in step S19. th .

[0129] For example, the operator operates the input device 44 of the control device 18 to input the waiting time t th (For example, t th =0.4 [sec]). The processor 68 obtains the standby time t from the control device 18. th For example, the standby time t is registered in a register built into the processor 68. th The setting information of

[0130] In addition, the laser processing head 84 also has a memory (ROM or RAM, etc.), and the processor 68 can register the standby time t th Thus, the processor 68 pre-sets the standby time t th Therefore, the processor 68 sets the standby time t th The standby time setting unit 82 ( Fig.14 ) to perform its function.

[0131] exist Fig.15 In step S2 shown, when the processor 68 makes a negative determination in step S15, the processor 68 starts measuring the elapsed time t in step S31. Specifically, the processor 68 activates the measuring unit 86 to start measuring the elapsed time t from the time point t0 at which the processor 68 makes a negative determination in step S15.

[0132] In step S32, the processor 68 determines whether the elapsed time t measured by the timer 86 has reached the preset waiting time t th (i.e., t ≥ t th ). Processor 68 performs the following operations at t≥t th If the judgment is yes, the process proceeds to step S19. On the other hand, if t<t th If the result is no, the process goes to step S33.

[0133] In step S33, similarly to step S15 described above, the processor 68 determines whether the contact between the laser processing head 84 and the workpiece W is detected by the contact detection device 66. If the determination is yes, the processor 68 returns to step S13, and if the determination is no (i.e., the laser processing head 84 and the workpiece W are still not in contact), the processor 68 returns to step S32.

[0134] The technical significance of steps S31 to S33 is described below. Once the processor 68 allows the transmission of the manual laser emission command CM1 in step S16, the processor 36 of the control device 18 executes the laser emission action LO in the manual operation mode DM1. During the execution of the laser emission action LO (i.e., during the period when the determination is yes in step S13), if the determination is no in step S15, the processor 68 will wait for the waiting time t0 from the time point t0 when the determination is no in step S15. th Before that (that is, before it is determined to be YES in step S32), step S19 is not executed (in other words, the laser emitting operation LO is continued).

[0135] Then, after the waiting time t has passed, the processor 68 th If the previous determination in step S33 is negative (i.e., during the entire period t th When the non-contact between the laser processing head 84 and the workpiece W is continuously detected, the blocking unit 74 is instructed to execute step S19, and as a result, the laser emitting operation LO is prohibited.

[0136] As described above, in the present embodiment, the laser processing head 84 further includes: a standby time setting unit 82, which sets the standby time t0 from the time point t0 when the contact detection device 66 detects non-contact (determined as No in step S15) when the control device 18 performs the laser emission action LO in the manual operation mode DM1 to the time point t1 when the instruction blocking unit 74 blocks the manual laser emission instruction CM1 (i.e., executes step S19). th .

[0137] Then, the command blocking unit 74 waits for a waiting time t set by the waiting time setting unit 82 to elapse from the time point t0. th (Yes in step S32), the manual laser emission instruction CM1 is blocked (step S19). Here, in the manual operation mode DM1, the operator sometimes moves the laser processing head 84 toward the workpiece W while bringing the top end of the laser processing head 84 into contact with the workpiece W, and performs laser processing using the laser beam LB emitted from the laser processing head 84.

[0138] In this case, for example, the laser processing head 84 can be separated from the workpiece W instantly (for example, 0.3 [sec]) by the concavo-convex portion on the surface of the workpiece W. In this way, even if the laser processing head 84 is separated from the workpiece W instantly, the possibility of the laser beam LB from the laser processing head 84 being emitted in the direction of the operator is low, so the safety of the operator can be ensured.

[0139] According to the present embodiment, by setting the waiting time t until the manual laser emission command CM1 is blocked in step S19, th Even if the laser processing head 84 and the workpiece W are separated momentarily as described above, the laser emitting operation LO can be continued. On the other hand, even if the waiting time t th Even when the non-contact between the laser processing head 84 and the workpiece W is still detected, the laser emitting operation LO can be prohibited by immediately executing step S19. Therefore, according to the present embodiment, the laser processing operation can be efficiently performed and the safety of the operator can be reliably ensured.

[0140] In addition, the processor 68 can also execute according to the computer program PG2 Fig.11 The computer program PG2 may also be stored in a memory (ROM, RAM, etc.) built into the laser processing head 14, 64, or 84. In addition, the functions of the instruction blocking unit 74, the instruction sending unit 80, and the standby time setting unit 82 executed by the processor 68 may also be functional modules implemented by the computer program PG2.

[0141] In addition, you can also Figure 5 The first input device 58' shown is applied to the laser processing head 64 or 84. In addition, the processor 68 can execute Fig.11 The process shown in FIG. 1 and the lens driving unit described above are controlled. In addition, the timing unit 86 may be omitted from the laser processing head 84. In this case, the timing unit 86 may be provided in the control device 18, and the processor 68 may obtain information on the elapsed time t from the timing unit 86 of the control device 18. In addition, the light guide path 34 may be omitted from the laser processing system 10. In this case, the laser oscillator 16 may be directly connected to the laser processing head 14, 14', 64 or 84.

[0142] In addition, the laser processing head 14, 14', 64 or 84 may be any type of device such as a laser scanner (or a galvanometer scanner). The laser scanner has a plurality of mirrors that reflect the laser beam LB supplied from the laser oscillator 16, a plurality of mirror driving units that drive the plurality of mirrors individually, and an optical lens that focuses the laser beam reflected by the mirrors. The laser scanner can move the irradiation point of the laser beam LB irradiated to the workpiece W at high speed on the surface of the workpiece W by changing the orientation of the plurality of mirrors using the mirror driving unit.

[0143] In addition, the robot 12 is not limited to a vertical multi-articular robot, and may be, for example, a horizontal multi-articular robot or a parallel linkage robot, or may be configured to have a first and a second ball screw mechanism for moving the workpiece W in a horizontal plane, and a third ball screw mechanism for moving the laser processing head 14, 14', 64 or 84 in a vertical direction.

[0144] In addition, the control device 18 may include a first control device 18A for controlling the moving motion MO of the robot 12 and a second control device 18B for controlling the laser emitting motion LO of the laser oscillator 16. As mentioned above, the present disclosure has been described through the embodiments, but the above-mentioned embodiments do not limit the invention involved in the scope of the claimed patent protection.

[0145] Explanation of symbols

[0146] 10 Laser Processing System

[0147] 12 Robot

[0148] 14, 14', 64, 84 laser processing heads

[0149] 16 Laser Oscillator

[0150] 18 Control Devices

[0151] 36, 68 processors

[0152] 48 Mode selector switch

[0153] 54 Loading and unloading parts

[0154] 56 Handle

[0155] 58, 58' first input device

[0156] 60 Second input device

[0157] 62 Distance Sensor

[0158] 66 Contact detection device

[0159] 70 Closed loop

[0160] 74 Instruction blocking unit

[0161] 80 Command sending unit

[0162] 82 Standby time setting unit.

Claims

1. A laser processing head capable of performing laser emitting operation in a manual operation mode and an automatic operation mode, wherein the manual operation mode is a mode in which a control device performs laser emitting operation according to a manual laser emitting instruction, and the automatic operation mode is a mode in which the control device automatically performs laser emitting operation according to a processing program, characterized in that: The laser processing head has: A first input device that receives an input operation for sending the manual laser ejection instruction to the control device; and A distance measuring sensor is used to measure the distance between the laser processing head and the workpiece when the control device executes the laser emitting operation in the automatic operation mode.

2. The laser processing head according to claim 1, characterized in that: The first input device includes a push button, a switch, or a touch panel that an operator can operate by hand to perform input, or includes a foot pedal or a foot switch that an operator can operate by foot to perform input.

3. The laser processing head according to claim 1 or 2, characterized in that: The laser processing head further includes a second input device that receives an input operation for issuing a manual gas injection command for injecting an assist gas.

4. The laser processing head according to any one of claims 1 to 3, characterized in that: The laser machining head further includes a command blocking unit configured to block the manual laser emitting command transmitted from the first input device to the control device when a condition for executing the laser emitting operation in the manual operation mode is not satisfied.

5. The laser processing head according to claim 4, characterized in that: The laser processing head further comprises: a mode selection switch capable of selecting the manual operation mode or the automatic operation mode. The condition includes a first condition that the manual operation mode is selected by the mode selection switch, The command blocking unit blocks the manual laser emission command when the manual operation mode is not selected by the mode selection switch.

6. The laser processing head according to claim 4 or 5, characterized in that: The laser processing head further comprises: a contact detection device for detecting whether the laser processing head is in contact or non-contact with the workpiece, The conditions include a second condition that the laser processing head is in contact with the workpiece, The command blocking unit blocks the manual laser emission command when the non-contact is detected by the contact detection device.

7. The laser processing head according to claim 6, characterized in that: The contact detection device comprises: a conductive cable electrically connecting the laser processing head to the workpiece; and a resistance sensor for measuring the resistance of a closed loop formed by the workpiece, the laser processing head in contact with the workpiece, and the conductive cable, The contact detection device is configured to detect the contact or the non-contact based on the resistance measured by the resistance sensor.

8. The laser processing head according to claim 6 or 7, characterized in that: The laser processing head further comprises: a standby time setting unit, which sets the standby time from the time when the contact detection device detects the non-contact when the control device performs the laser emission action in the manual operation mode to the time when the instruction blocking unit blocks the manual laser emission instruction, The command blocking unit blocks the manual laser emission command when the standby time set by the standby time setting unit has elapsed from the time point.

9. The laser processing head according to any one of claims 1 to 8, characterized in that: The laser machining head further includes a command transmission unit that transmits a laser emission prohibition command to the control device for causing the control device to prohibit the laser emission operation in the automatic operation mode when the distance measured by the distance measuring sensor is outside a predetermined allowable range.

10. The laser processing head according to any one of claims 1 to 9, characterized in that: The laser processing head also has: A handling member for handling relative to a robot that moves the laser processing head; and a grip portion that can be gripped by an operator with one hand, The first input device is provided adjacent to the grip portion so that input operation can be performed with the single hand gripping the grip portion.

11. A laser processing system, characterized in that: The laser processing system has: robot; The laser processing head according to any one of claims 1 to 10, which is detachably mounted on the robot; and The control device executes the laser emitting operation in the manual operation mode and the laser emitting operation in the automatic operation mode.

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