Laminated coil component

Abstract

The invention provides a laminated coil component which can flow a large current and can obtain impedance in a wide frequency band.

Description

Technical Field

[0001] The present disclosure relates to a laminated coil component. Background Art

[0002] In recent years, attention has been paid to coil components capable of passing large currents. For example, Patent Document 1 discloses a coil component comprising: a drum-shaped core having a winding core and a flange provided at an end of the winding core; a conductor wound around the winding core; and a terminal electrode connected to the end of the conductor.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2020-109789

[0004] In the laminated coil component described in Patent Document 1, since the coil portion is not covered by a magnetic body, the leakage of magnetic flux is large, and there is a concern that if it is mounted on a substrate together with other components, the magnetic flux will interfere with other components. Therefore, even if a large current flows, it is difficult to obtain impedance in a wide frequency band. On the other hand, a laminated coil component in which a coil is arranged in a magnetic body is preferred because the leakage of magnetic flux is small. Summary of the invention

[0005] An object of the present disclosure is to provide a laminated coil component that can allow a large current to flow and that can obtain impedance in a wide frequency band.

[0006] The present disclosure includes the following aspects.

[0007] [1] A laminated coil component comprising:

[0008] a laminated body including a plurality of insulating layers and a plurality of coil conductor layers; and

[0009] an external electrode disposed on a surface of the stack and electrically connected to the coil conductor layer;

[0010] in,

[0011] The plurality of insulating layers are magnetic.

[0012] The plurality of coil conductor layers are electrically connected to form a coil.

[0013] The axis of the coil is approximately parallel to the mounting surface.

[0014] The dimension of the laminate in the longitudinal direction is 1.8 mm or more and 2.2 mm or less, and the dimension of the laminate in the width direction is 1.05 mm or more and 1.45 mm or less,

[0015] When the number of turns of the above-mentioned coil is set to x and the distance between the above-mentioned coil conductor layers is set to y (mm), (x, y) is located within the area surrounded by A1 (54, 0.005), B1 (54, 0.01), C1 (42, 0.01), D1 (42, 0.02), E1 (36, 0.02), F1 (36, 0.03), G1 (30, 0.03), H1 (30, 0.04), I1 (24, 0.04), J1 (24, 0.05), K1 (18, 0.05), L1 (18, 0.01), M1 (12, 0.01), and N1 (12, 0.005).

[0016] [2] A stacked coil component according to the above [1], wherein the above (x, y) is located within an area surrounded by A1 (54, 0.005), B1 (54, 0.01), C1 (42, 0.01), D1 (42, 0.02), E1 (36, 0.02), F1 (36, 0.03), H1 (30, 0.04), O1 (24, 0.03), P1 (24, 0.01), L1 (18, 0.01), and Q1 (18, 0.005).

[0017] [3] The laminated coil component according to [1] or [2] above, wherein a dimension of the laminate in a height direction is not less than 1.05 mm and not more than 1.45 mm.

[0018] [4] The laminated coil component according to any one of [1] to [3] above, wherein the impedance in a frequency band of 10 MHz to 1 GHz is 300Ω or more.

[0019] [5] A laminated coil component comprising:

[0020] a laminated body including a plurality of insulating layers and a plurality of coil conductor layers; and

[0021] an external electrode disposed on a surface of the stack and electrically connected to the coil conductor layer;

[0022] in,

[0023] The plurality of insulating layers are magnetic.

[0024] The plurality of coil conductor layers are electrically connected to form a coil.

[0025] The axis of the coil is approximately parallel to the mounting surface.

[0026] The dimension of the laminate in the longitudinal direction is 3.0 mm or more and 3.4 mm or less, and the dimension of the laminate in the width direction is 1.4 mm or more and 1.8 mm or less,

[0027] When the number of turns of the above-mentioned coil is set to x and the distance between the above-mentioned coil conductor layers is set to y (mm), (x, y) is located within the area surrounded by A2 (84, 0.005), B2 (84, 0.01), C2 (75, 0.01), D2 (75, 0.02), E2 (54, 0.02), F2 (54, 0.03), G2 (42, 0.03), H2 (42, 0.04), I2 (36, 0.04), J2 (36, 0.05), K2 (30, 0.05), L2 (30, 0.06), M2 (18, 0.06), N2 (18, 0.03), O2 (12, 0.03), P2 (12, 0.01), Q2 (18, 0.01), and R2 (18, 0.005).

[0028] [6] A laminated coil component according to [5], wherein the above (x, y) is located at A2 (84, 0.005), B2 (84, 0.01), C2 (75, 0.01), D2 (75, 0.02), E2 (54, 0.02), F2 (54, 0.03), G2 (42, 0.03), H2 (42, 0.04), I2 (36, 0.04 ), J2(36, 0.05), K2(30, 0.05), L2(30, 0.06), S2(24, 0.06), T2(24, 0.04), U2(18, 0.03), V2(24, 0.02), W2(36, 0.02), X2(36, 0.01), Y2(54, 0.01), and Z2(54, 0.005).

[0029] [7] The laminated coil component according to [5] or [6] above, wherein a dimension of the laminate in a height direction is not less than 1.4 mm and not more than 1.8 mm.

[0030] [8] The laminated coil component according to any one of [5] to [7] above, wherein the impedance in a frequency band of 10 MHz to 1 GHz is 300Ω or more.

[0031] [9] A laminated coil component comprising:

[0032] a laminated body including a plurality of insulating layers and a plurality of coil conductor layers; and

[0033] an external electrode disposed on a surface of the stack and electrically connected to the coil conductor layer;

[0034] in,

[0035] The plurality of insulating layers are magnetic.

[0036] The plurality of coil conductor layers are electrically connected to form a coil.

[0037] The axis of the coil is approximately parallel to the mounting surface.

[0038] The dimension of the laminate in the longitudinal direction is 3.0 mm or more and 3.4 mm or less, and the dimension of the laminate in the width direction is 2.3 mm or more and 2.7 mm or less,

[0039] When the number of turns of the coil is x and the distance between the coil conductor layers is y (mm), (x, y) is located at A3 (84, 0.005), B3 (84, 0.01), C3 (75, 0.01), D3 (75, 0.02), E3 (54, 0.02), F3 (54, 0.03), G3 (42, 0.03), H3 (42, 0.04), I3 (36, 0.04), J3 (36, 0.05 ), K3(30, 0.05), L3(30, 0.06), M3(12, 0.06), N3(18, 0.05), O3(18, 0.04), P3(24, 0.04), Q3(24, 0.03), R3(36, 0.03), S3(36, 0.02), E3(54, 0.02), T3(54, 0.01), C3(75, 0.01), and U3(75, 0.005).

[0040]

[10] The laminated coil component according to [9] above, wherein the impedance in a frequency band of 10 MHz to 1 GHz is 300Ω or more.

[0041]

[11] The laminated coil component according to any one of [1] to

[10] above, wherein the thickness of the coil conductor layer is not less than 10 μm and not more than 25 μm.

[0042]

[12] The laminated coil component according to any one of [1] to

[11] above, wherein the coil is electrically connected to the external electrode via a lead portion.

[0043] The present disclosure can provide a laminated coil component that can pass a large current and obtain impedance in a wide frequency band. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 It is a perspective view schematically showing a laminated coil component 1 according to the present disclosure.

[0045] Figure 2 Yes means Figure 1 The illustrated cross-sectional view of the laminated coil component 1 is taken along the II-II cut section.

[0046] Figure 3 It is a diagram for explaining the method of manufacturing the laminated coil component 1 of the present disclosure.

[0047] Figure 4 This is a diagram showing a region where the laminated coil component A in the example provides an impedance of 300Ω or more.

[0048] Figure 5 This is a diagram showing a region where the laminated coil component A in the example provides an impedance of 500Ω or more.

[0049] Figure 6 This is a diagram showing a region where the laminated coil component B in the example provides an impedance of 300Ω or more.

[0050] Figure 7 This is a diagram showing a region where the laminated coil component B in the example provides an impedance of 500Ω or more.

[0051] Figure 8 This is a diagram showing a region where the laminated coil component C in the example provides an impedance of 300Ω or more. DETAILED DESCRIPTION

[0052] Hereinafter, the present disclosure will be described in detail with reference to the drawings. However, the shapes and arrangements of the laminated coil component and each component are not limited to the examples shown in the drawings.

[0053] The perspective view of the laminated coil component 1 of this embodiment is as follows Figure 1 As shown, the cross-sectional view is Figure 2 However, the shapes and configurations of the laminated coil components and the components of the following embodiments are not limited to the examples shown in the drawings. Sometimes, the same reference numerals are attached to components with the same functions in the drawings. The sizes and positional relationships of the components shown in the drawings are sometimes exaggerated to make the description clear.

[0054] like Figure 1 as well as Figure 2 As shown in FIG. 1 , the laminated coil component 1 of the present embodiment is a laminated coil component having a substantially rectangular parallelepiped shape. Figure 1The surface perpendicular to the L axis is called the "end surface", the surface perpendicular to the W axis is called the "side surface", and the surface perpendicular to the T axis is called the "upper surface" and the "lower surface". The stacked coil component 1 is mounted on other electronic components such as a substrate on the lower surface. That is, the lower surface of the stacked coil component 1 is the mounting surface. In general, the stacked coil component 1 includes a stacked body 2 stacked with multiple insulator layers and multiple coil conductor layers, and external electrodes 4 and 5 arranged on the surface of the stacked body 2. The stacked body 2 includes an insulator portion 6 and a coil 7 buried in the insulator portion 6. The insulator portion 6 is formed by stacking multiple insulator layers. Multiple coil conductor layers 8 are stacked, and the coil conductor layers adjacent to each other in the stacking direction are connected by connecting conductors to form a coil 7. The external electrodes 4 and 5 are respectively continuously arranged on one end surface and a part of the four side surfaces of the stacked body 2. The coil axis of the coil 7, that is, the lamination direction of the laminate 2, that is, the lamination direction of the insulating layers and the coil conductor layers 8, is substantially parallel to the mounting surface, that is, the lower surface of the laminated coil component.

[0055] Hereinafter, the laminated coil component 1 according to the present embodiment described above will be described. In the present embodiment, a mode in which the insulator portion 6 is formed of a ferrite material will be described.

[0056] In the laminated coil component 1 of the present embodiment, the laminated body 2 is composed of the insulator portion 6 and the coil 7 .

[0057] The insulator portion 6 is formed by laminating a plurality of insulator layers.

[0058] The insulator portion 6 is preferably made of a magnetic body, and more preferably made of sintered ferrite. The sintered ferrite contains at least Fe, Ni, and Zn as main components. The sintered ferrite may further contain Cu.

[0059] In one embodiment, the sintered ferrite contains at least Fe, Ni, Zn, and Cu as main components. Preferably, the sintered ferrite is Ni—Cu—Zn ferrite.

[0060] In the above-mentioned sintered ferrite, the Fe content, calculated as Fe2O3, is preferably 40.0 mol% to 49.5 mol% (based on the total of main components, the same applies hereinafter), and more preferably 45.0 mol% to 49.5 mol%.

[0061] In the sintered ferrite, the Zn content is preferably 2.0 mol% to 35.0 mol% (based on the total of main components, the same applies hereinafter), and more preferably 10.0 mol% to 30.0 mol% in terms of ZnO.

[0062] In the sintered ferrite, the Cu content is preferably 6.0 mol% to 13.0 mol% (based on the total of main components, the same applies hereinafter), and more preferably 7.0 mol% to 10.0 mol% in terms of CuO.

[0063] In the sintered ferrite, the Ni content is not particularly limited, and can be the remainder of the other main components Fe, Zn, and Cu. For example, the Ni content is preferably 10.0 mol % or more and 45.0 mol % or less in terms of NiO.

[0064] In one embodiment, for the above-mentioned sintered ferrite, Fe is converted to Fe2O3 and is greater than 40.0 mol% and less than 49.5 mol%, Zn is converted to ZnO and is greater than 2.0 mol% and less than 35.0 mol%, Cu is converted to CuO and is greater than 6.0 mol% and less than 13.0 mol%, and Ni is converted to NiO and is greater than 10.0 mol% and less than 45.0 mol%.

[0065] In the present disclosure, the above-mentioned sintered ferrite may also contain additives. As additives in the sintered ferrite, for example, Mn, Co, Sn, Bi, Si, etc. can be listed, but it is not limited to this. Preferably, the content (addition amount) of Mn, Co, Sn, Bi and Si is 0.1 weight part or more and 1 weight part or less relative to a total of 100 weight parts of the main components (Fe (converted to Fe2O3), Zn (converted to ZnO), Cu (converted to CuO) and Ni (converted to NiO)), respectively converted to Mn3O4, Co3O4, SnO2, Bi2O3 and SiO2. In addition, the above-mentioned sintered ferrite may also contain impurities that are inevitable in manufacturing.

[0066] The relative magnetic permeability of the insulator portion 6 is preferably 3 or more and 800 or less, more preferably 100 or more and 400 or less, and further preferably 100 or more and 200 or less.

[0067] As described above, the coil 7 is formed by electrically connecting the coil conductor layers 8 to each other in a coil shape. The coil conductor layers 8 adjacent to each other in the stacking direction are connected by a connection conductor (e.g., a via conductor) that passes through the insulator portion 6. The coil 7 is electrically connected to the external electrodes 4 and 5 through the lead portion.

[0068] The material constituting the coil conductor layer 8 is not particularly limited, but examples thereof include Au, Ag, Cu, Pd, Ni, etc. The material constituting the coil conductor layer 8 is preferably Ag or Cu, more preferably Ag. The conductive material may be only one kind or two or more kinds.

[0069] The thickness of the coil conductor layer 8 is preferably 5 μm or more and 50 μm or less, and more preferably 10 μm or more and 25 μm or less. By increasing the thickness of the coil conductor layer 8, the resistance value of the coil conductor layer 8 becomes smaller, so that a stacked coil component capable of handling a larger current can be obtained. Here, the thickness of the coil conductor layer refers to the thickness of the coil conductor layer along the stacking direction (in Figure 2 The thickness of the coil conductor layer (in the L direction).

[0070] The width of the coil conductor layer 8 is preferably 100 μm or more and 600 μm or less, and more preferably 200 μm or more and 400 μm or less. By increasing the width of the coil conductor layer 8, the resistance value of the coil conductor layer 8 becomes smaller, so that a stacked coil component capable of handling a larger current can be obtained. Here, the width of the coil conductor layer refers to the width of the coil conductor layer perpendicular to the winding direction and stacking direction of the coil.

[0071] The thickness of the coil conductor layer can be measured as follows.

[0072] Grinding was performed with the LT surface of the chip facing the sandpaper, and the grinding was stopped at the center of the W dimension of the coil conductor layer. Afterwards, observation was performed under a microscope, and the thickness of the coil conductor layer was measured using the measurement function attached to the microscope. The width direction of the coil conductor layer in the LT section (in Figure 2 The thickness of the coil conductor layer is measured at the center of the coil conductor layer (in the T direction).

[0073] The width of the coil conductor layer can be measured as follows.

[0074] The chip was polished with the TW surface of the chip facing the sandpaper, and the polishing was stopped at the center of the coil conductor layer in the L dimension. Thereafter, the chip was observed with a microscope, and the width of the coil conductor layer was measured using a measurement function attached to the microscope.

[0075] The connecting conductor is arranged to penetrate the insulating layer. The material constituting the connecting conductor can be the material recorded in relation to the coil conductor layer 8. The material constituting the connecting conductor may be the same as or different from the material constituting the coil conductor layer 8. In a preferred embodiment, the material constituting the connecting conductor is the same as the material constituting the coil conductor layer 8. In a preferred embodiment, the material constituting the connecting conductor is Ag.

[0076] The dimension of the laminate 2 in the longitudinal direction (length in the L direction) is preferably 1.8 mm to 3.4 mm, and the dimension in the width direction (length in the W direction) is preferably 1.05 mm to 2.7 mm.

[0077] In one embodiment, the dimension of the laminate 2 in the longitudinal direction is 1.8 mm or more and 2.2 mm or less, and the dimension in the width direction is 1.05 mm or more and 1.45 mm or less.

[0078] In another embodiment, the dimension of the laminate 2 in the longitudinal direction is 3.0 mm or more and 3.4 mm or less, and the dimension in the width direction is 1.4 mm or more and 1.8 mm or less.

[0079] In another embodiment, the dimension of the laminate 2 in the longitudinal direction is 3.0 mm or more and 3.4 mm or less, and the dimension in the width direction is 2.3 mm or more and 2.7 mm or less.

[0080] The dimension of the stacked body 2 in the height direction is 1.05 mm or more and 1.45 mm or less in one embodiment, 1.4 mm or more and 1.8 mm or less in another embodiment, and 2.3 mm or more and 2.7 mm or less in still another embodiment.

[0081] The number of turns of the coil 7 is preferably 12 or more and 84 or less.

[0082] The number of turns of the coil is the so-called winding number of the coil. That is, the number of turns increases by 1 every time the coil is wound 360°.

[0083] The distance between the coil conductor layers in the laminate 2 is preferably 0.005 mm or more and 0.06 mm or less, and more preferably 0.005 mm or more and 0.04 mm or less.

[0084] The distance between the coil conductor layers can be measured as follows.

[0085] Grind with the LT surface of the chip facing the sandpaper, and stop grinding at the center of the W dimension of the coil conductor layer. Then, observe with a microscope, and measure the shortest distance between the coil conductor layers using the measurement function attached to the microscope ( Figure 2 The shortest distances between all coil conductor layers in the cross section are measured and the average is taken as the "distance between coil conductor layers".

[0086] In one embodiment, the dimension of the laminate 2 in the long side direction is 1.8 mm or more and 2.2 mm or less, and the dimension in the width direction is 1.05 mm or more and 1.45 mm or less. When the number of turns of the coil 7 of the laminate 2 is x and the distance between the coil conductor layers is y (mm), as shown in FIG. Figure 4As shown, (x, y) is located within the area enclosed by A1(54, 0.005), B1(54, 0.01), C1(42, 0.01), D1(42, 0.02), E1(36, 0.02), F1(36, 0.03), G1(30, 0.03), H1(30, 0.04), I1(24, 0.04), J1(24, 0.05), K1(18, 0.05), L1(18, 0.01), M1(12, 0.01), and N1(12, 0.005).

[0087] In a preferred embodiment, the dimension of the laminate 2 in the long side direction is 1.8 mm or more and 2.2 mm or less, and the dimension in the width direction is 1.05 mm or more and 1.45 mm or less. When the number of turns of the coil 7 of the laminate 2 is x and the distance between the coil conductor layers is y (mm), Figure 5 As shown, (x, y) is located within the area enclosed by A1(54, 0.005), B1(54, 0.01), C1(42, 0.01), D1(42, 0.02), E1(36, 0.02), F1(36, 0.03), H1(30, 0.04), O1(24, 0.03), P1(24, 0.01), L1(18, 0.01), and Q1(18, 0.005).

[0088] In one embodiment, the dimension of the laminate 2 in the long side direction is 3.0 mm or more and 3.4 mm or less, and the dimension in the width direction is 1.4 mm or more and 1.8 mm or less. When the number of turns of the coil 7 of the laminate 2 is x and the distance between the coil conductor layers is y (mm), as shown in FIG. Figure 6 As shown, (x, y) is located within the area surrounded by A2(84, 0.005), B2(84, 0.01), C2(75, 0.01), D2(75, 0.02), E2(54, 0.02), F2(54, 0.03), G2(42, 0.03), H2(42, 0.04), I2(36, 0.04), J2(36, 0.05), K2(30, 0.05), L2(30, 0.06), M2(18, 0.06), N2(18, 0.03), O2(12, 0.03), P2(12, 0.01), Q2(18, 0.01), and R2(18, 0.005).

[0089] In a preferred embodiment, the dimension of the laminate 2 in the long side direction is 3.0 mm or more and 3.4 mm or less, and the dimension in the width direction is 1.4 mm or more and 1.8 mm or less. When the number of turns of the coil 7 of the laminate 2 is x and the distance between the coil conductor layers is y (mm), Figure 7As shown, (x, y) is located within the area enclosed by A2(84, 0.005), B2(84, 0.01), C2(75, 0.01), D2(75, 0.02), E2(54, 0.02), F2(54, 0.03), G2(42, 0.03), H2(42, 0.04), I2(36, 0.04), J2(36, 0.05), K2(30, 0.05), L2(30, 0.06), S2(24, 0.06), T2(24, 0.04), U2(18, 0.03), V2(24, 0.02), W2(36, 0.02), X2(36, 0.01), Y2(54, 0.01), and Z2(54, 0.005).

[0090] In one embodiment, the dimension of the laminate 2 in the long side direction is 3.0 mm or more and 3.4 mm or less, and the dimension in the width direction is 2.3 mm or more and 2.7 mm or less. When the number of turns of the coil 7 of the laminate 2 is x and the distance between the coil conductor layers is y (mm), as shown in FIG. Figure 8 As shown, (x, y) is located between A3 (84, 0.005), B3 (84, 0.01), C3 (75, 0.01), D3 (75, 0.02), E3 (54, 0.02), F3 (54, 0.03), G3 (42, 0.03), H3 (42, 0.04), I3 (36, 0.04), J3 (36, 0.05), K3 (30, 0.05), L3 (3 0, 0.06), M3(12, 0.06), N3(18, 0.05), O3(18, 0.04), P3(24, 0.04), Q3(24, 0.03), R3(36, 0.03), S3(36, 0.02), E3(54, 0.02), T3(54, 0.01), C3(75, 0.01), and U3(75, 0.005).

[0091] The laminated coil component of the present disclosure can pass a large current and obtain impedance in a wide frequency band by satisfying the above-mentioned dimensions of the laminate and (x, y).

[0092] The external electrodes 4 and 5 are provided to cover both end surfaces of the laminate 2. The external electrodes are made of a conductive material, preferably one or more metal materials selected from Au, Ag, Pd, Ni, Sn and Cu.

[0093] The external electrodes 4 and 5 may be single-layered or multi-layered. In one embodiment, the external electrodes are multi-layered, preferably two or more layers and four or less layers, and may be three layers, for example.

[0094] In one embodiment, the external electrodes 4 and 5 are multilayered and may include a layer containing Ag or Pd, a layer containing Ni, or a layer containing Sn. In a preferred embodiment, the external electrodes 4 and 5 are composed of a layer containing Ag or Pd, a layer containing Ni, and a layer containing Sn. Preferably, the above-mentioned layers are sequentially provided from the coil conductor layer side, including a layer containing Ag or Pd, preferably a layer containing Ag, a layer containing Ni, and a layer containing Sn. Preferably, the above-mentioned layer containing Ag or Pd is a layer obtained by baking Ag paste or Pd paste, and the above-mentioned layer containing Ni and the layer containing Sn are electroplated layers.

[0095] The impedance of the laminated coil component of the present disclosure in the frequency band of 10 MHz to 1 GHz is preferably 300Ω or more, and more preferably 500Ω or more.

[0096] The laminated coil component of the present disclosure can preferably flow a current of 500 mA or more, and more preferably flow a current of 1.0 A or more. The upper limit of the current value that can flow through the laminated coil component of the present disclosure is not particularly limited, but is, for example, 6 A or less.

[0097] Hereinafter, a method for manufacturing the laminated coil component 1 of the present embodiment described above will be described. In the present embodiment, a mode in which the insulator portion 6 is formed of a ferrite material will be described. However, the method for manufacturing the laminated coil component 1 is not limited to the example described below.

[0098] (1) Preparation of magnetic materials

[0099] First, a ferrite material is prepared. The ferrite material contains, for example, Fe, Zn, Cu, and Ni as main components. Usually, the main components of the ferrite material are actually composed of oxides of Fe, Zn, Cu, and Ni (ideally, Fe2O3, ZnO, NiO, and CuO).

[0100] As a ferrite material, Fe2O3, ZnO, CuO, NiO and the components added as needed are weighed to make a specified composition, mixed and crushed. For example, the raw materials of the specified composition are put into a ball mill together with pure water and PSZ (partially stabilized zirconia) balls, and mixed and crushed in a wet manner for 4 to 8 hours. The crushed ferrite material is dried and calcined to obtain a calcined powder. For example, after evaporating and drying the water, calcine at a temperature of 700°C to 800°C for 2 hours to 5 hours to obtain a calcined powder.

[0101] In the above-mentioned ferrite material, the Fe content, calculated as Fe2O3, is preferably 40.0 mol% to 49.5 mol% (based on the total of main components, the same applies hereinafter), and more preferably 45.0 mol% to 49.5 mol%.

[0102] In the ferrite material, the Zn content is preferably 2.0 mol % to 35.0 mol % (based on the total of main components, the same applies hereinafter), and more preferably 10.0 mol % to 30.0 mol % in terms of ZnO.

[0103] In the ferrite material, the Cu content is preferably 6.0 mol % to 13.0 mol % (based on the total of main components, the same applies hereinafter), and more preferably 7.0 mol % to 10.0 mol % in terms of CuO.

[0104] In the ferrite material, the Ni content is not particularly limited, and can be the remainder of the other main components Fe, Zn, and Cu. For example, the Ni content is preferably 10.0 mol % or more and 45.0 mol % or less in terms of NiO.

[0105] In one embodiment, for the above-mentioned ferrite material, Fe is converted to Fe2O3 and is greater than 40.0 mol% and less than 49.5 mol%, Zn is converted to ZnO and is greater than 2.0 mol% and less than 35.0 mol%, Cu is converted to CuO and is greater than 6.0 mol% and less than 13.0 mol%, and Ni is converted to NiO and is greater than 10.0 mol% and less than 45.0 mol%.

[0106] In the present disclosure, the above-mentioned ferrite material may also contain additives. As additives in the ferrite material, for example, Mn, Co, Sn, Bi, Si, etc. can be listed, but it is not limited to this. Preferably, the content (addition amount) of Mn, Co, Sn, Bi and Si is 0.1 weight part or more and 1 weight part or less relative to a total of 100 weight parts of the main components (Fe (converted to Fe2O3), Zn (converted to ZnO), Cu (converted to CuO) and Ni (converted to NiO)), which are converted to Mn3O4, Co3O4, SnO2, Bi2O3 and SiO2 respectively. In addition, the above-mentioned ferrite material may also contain impurities that are inevitable in manufacturing.

[0107] In addition, it can be considered that the Fe content (converted to Fe2O3), Mn content (converted to Mn2O3), Cu content (converted to CuO), Zn content (converted to ZnO) and Ni content (converted to NiO) in the above-mentioned sintered ferrite are substantially no different from the Fe content (converted to Fe2O3), Mn content (converted to Mn2O3), Cu content (converted to CuO), Zn content (converted to ZnO) and Ni content (converted to NiO) in the ferrite material before firing.

[0108] (2) Preparation of ferrite sheets

[0109] The calcined powder is put into a ball mill together with a PSZ medium, and an organic binder such as polyvinyl butyral, an organic solvent such as ethanol and toluene, and a plasticizer are further put in and mixed. Next, the powder is formed into a sheet having a film thickness of 20 μm or more and 50 μm or less by a doctor blade method, and the sheet is punched into a rectangular shape to form a green sheet.

[0110] (3) Preparation of conductive paste for coil conductor layer

[0111] First, prepare a conductive material. As the conductive material, for example, Au, Ag, Cu, Pd, Ni, etc. can be listed, preferably Ag or Cu, more preferably Ag. The conductive paste for the coil conductor layer can be prepared by weighing a predetermined amount of powder of the conductive material, and kneading it with a predetermined amount of a solvent (such as eugenol), a resin (such as ethyl cellulose), and a dispersant in a planetary mixer, etc., and then dispersing it in a three-roll mill, etc.

[0112] (4) Preparation of coil pattern

[0113] The green sheet obtained above is irradiated with laser to form through holes at predetermined positions. The conductive paste is screen printed to fill the through holes with the conductive paste and form a pattern of the coil conductor layer. Figure 3 As shown in (a) to (l) of FIG. 1 , through holes are formed in the green sheets 21a to 21l, and via-hole conductor patterns 31a to 31l and coil conductor layer patterns 32c to 32j are formed.

[0114] (5) Preparation of unfired laminate

[0115] The green sheets with coil patterns formed thereon are stacked in a prescribed order. Figure 3 As shown in (a) to (b), raw sheets with via hole conductor patterns are stacked. The stacked raw sheets form the outer packaging of the stacked coil component, and the via hole conductor pattern forms the lead-out portion. In addition, in this process, the number of stacked raw sheets can be appropriately selected according to the desired thickness of the outer packaging. Next, as Figure 3 As shown in (c) to (j) of FIG. 1 , green sheets having via hole conductor patterns and coil conductor patterns are stacked. Figure 3 The number of turns of the coil pattern formed by the raw sheets (c) to (f) is 3. In this process, the number of stacked raw sheets can be appropriately selected according to the desired number of turns. Figure 3As shown in (k) to (l) of FIG. 1 , green sheets having via hole conductor patterns are stacked. The stacked green sheets form the outer packaging of the stacked coil component, and the via hole conductor patterns form the lead-out portion. In addition, in this process, the number of stacked green sheets can be appropriately selected according to the desired thickness of the outer packaging. The stacked green sheets are thermally pressed to form an unfired stacked block.

[0116] (6) Firing

[0117] Next, the unfired laminated body block obtained above is cut by a cutter or the like to be individualized into green bodies.

[0118] Next, the unfired green body is fired at a temperature of, for example, 900° C. or higher and 920° C. or lower for 2 to 4 hours to obtain the laminated body 2 of the laminated coil component 1 .

[0119] Next, the obtained laminate 2 can also be subjected to roller treatment to shave off the corners of the blank and form rounded corners. In addition, the unfired laminate can be subjected to roller treatment, and the fired laminate can also be subjected to roller treatment. In addition, the roller treatment can also be any one of dry and wet treatments. The roller treatment can be a method in which the elements are rubbed against each other, or a method in which the elements are subjected to roller treatment together with the medium.

[0120] (7) Formation of external electrodes

[0121] Next, an Ag paste containing Ag and glass for forming an external electrode is applied to the end surface of the laminate 2 and fired at 800°C to 820°C to form a base electrode. The thickness of the base electrode is preferably 1 μm to 10 μm, more preferably 3 μm to 6 μm. Next, a Ni coating and a Sn coating are sequentially formed on the base electrode by electroplating to form an external electrode. Figure 1 The laminated coil component 1 is as shown.

[0122] As mentioned above, although one embodiment of the present invention has been described, this embodiment can be modified in various ways.

[0123] Hereinafter, the present invention will be described with reference to Examples, but the present invention is not limited to these Examples.

[0124] Example

[0125] Example

[0126] Using Femtet (registered trademark), an analysis simulation software from Murata Software Co., Ltd., the number of turns and the distance between coil conductor layers were varied to find the region where impedance of 300 Ω or more and 500 Ω or more was obtained in the frequency region of 10 MHz to 1 GHz. The following laminated coil components A, B, and C were simulated.

[0127] Laminated coil component A: Dimension in the long side direction = 2.0 mm, dimension in the width direction = 1.2 mm Laminated coil component B: Dimension in the long side direction = 3.2 mm, dimension in the width direction = 1.6 mm Laminated coil component C: Dimension in the long side direction = 3.2 mm, dimension in the width direction = 2.5 mm Simulation conditions

[0128] The simulation was performed using CAE (Computer Aided Engineering) software Femtet (registered trademark of Murata Software Co., Ltd.). Figure 1 , 2 And the 3D model of the stacked coil component shown in 3. The dimension of the stacked coil component in the long side direction is set to 3.100mm, the dimension in the width direction and the height direction is set to 1.520mm, the inner diameter of the coil is set to 0.450mm, the width of the coil conductor layer is set to 0.210mm, the thickness of the coil conductor layer is set to 0.018mm, the pad radius is set to 0.125mm, the via hole radius is set to 0.060mm, the dimension of the stacked coil component of the external electrode in the long side direction is set to 0.775mm, the thickness between the coil conductor layers is set to the range from 0.005mm to 0.060mm, and the total number of turns of the coil is set to the range from 18.00 turns to 84.00 turns. The material of the coil conductor part and the external electrode is silver. At this time, the relative dielectric constant of silver is set to 1.0, and the conductivity is set to 6.289×10 7 S / m, the body of the chip coil component is ferrite. At this time, the relative dielectric constant of ferrite is set to 15, the relative permeability and tanδ at 10MHz are set to 125 and 0.0116 respectively, the relative permeability and tanδ at 100MHz are set to 42 and 1.4980 respectively, and the relative permeability and tanδ at 1GHz are set to 1.42 and 8.0975 respectively. The analysis conditions are set to harmonic analysis of electric field analysis, and the impedance (|Z| value) at 10MHz, 100MHz and 1GHz is calculated. (The relative dielectric constant, conductivity, relative permeability, and tanδ are measured values.)

[0129] The obtained results are shown in Tables 1 to 3 below.

[0130] Table 1: Simulation results in laminated coil component A [Table 1]

[0131]

[0132] Table 2: Simulation results in laminated coil component B [Table 2]

[0133]

[0134] Table 3: Simulation results in laminated coil component C [Table 3]

[0135]

[0136] Based on the above results, the regions where impedances of 300Ω or more and 500Ω or more can be obtained for the laminated coil components A to C are as follows: The number of turns of the coil is x, and the distance between the coil conductor layers is y (mm).

[0137] Laminated coil component A, 300Ω or more

[0138] The area surrounded by A1(54, 0.005), B1(54, 0.01), C1(42, 0.01), D1(42, 0.02), E1(36, 0.02), F1(36, 0.03), G1(30, 0.03), H1(30, 0.04), I1(24, 0.04), J1(24, 0.05), K1(18, 0.05), L1(18, 0.01), M1(12, 0.01), N1(12, 0.005) ( Figure 4 Area shown)

[0139] Laminated coil component A, 500Ω or more

[0140] The area surrounded by A1(54, 0.005), B1(54, 0.01), C1(42, 0.01), D1(42, 0.02), E1(36, 0.02), F1(36, 0.03), H1(30, 0.04), O1(24, 0.03), P1(24, 0.01), L1(18, 0.01), Q1(18, 0.005) ( Figure 5 The area shown) laminated coil component B, 300Ω or more

[0141] The area surrounded by A2(84, 0.005), B2(84, 0.01), C2(75, 0.01), D2(75, 0.02), E2(54, 0.02), F2(54, 0.03), G2(42, 0.03), H2(42, 0.04), I2(36, 0.04), J2(36, 0.05), K2(30, 0.05), L2(30, 0.06), M2(18, 0.06), N2(18, 0.03), O2(12, 0.03), P2(12, 0.01), Q2(18, 0.01), and R2(18, 0.005) ( Figure 6 Area shown)

[0142] Laminated coil component B, 500Ω or more

[0143] The area surrounded by A2(84, 0.005), B2(84, 0.01), C2(75, 0.01), D2(75, 0.02), E2(54, 0.02), F2(54, 0.03), G2(42, 0.03), H2(42, 0.04), I2(36, 0.04), J2(36, 0.05), K2(30, 0.05), L2(30, 0.06), S2(24, 0.06), T2(24, 0.04), U2(18, 0.03), V2(24, 0.02), W2(36, 0.02), X2(36, 0.01), Y2(54, 0.01), and Z2(54, 0.005) ( Figure 7 Area shown)

[0144] Laminated coil component C, 300Ω or more

[0145] From A3 (84, 0.005), B3 (84, 0.01), C3 (75, 0.01), D3 (75, 0.02), E3 (54, 0.02), F3 (54, 0.0 3), G3 (42, 0.03), H3 (42, 0.04), I3 (36, 0.04), J3 (36, 0.05), K3 (30, 0.05), L3 (30, 0. The area surrounded by ( Figure 8 Area shown)

[0146] Industrial Applicability

[0147] The laminated coil component disclosed herein can be used in a wide variety of applications such as an inductor.

[0148] Explanation of reference numerals: 1… stacked coil component, 2… stacked body, 4, 5… external electrodes, 6… insulator portion, 7… coil, 8… coil conductor layer, 21a to 211… raw sheet, 31a to 311… via hole conductor pattern, 32c to 32j… coil conductor pattern.

Claims

1. A laminated coil component, comprising: a laminated body including a plurality of insulating layers and a plurality of coil conductor layers; as well as an external electrode disposed on a surface of the stack and electrically connected to the coil conductor layer; in, The plurality of insulating layers are magnetic. The plurality of coil conductor layers are electrically connected to form a coil. The axis of the coil is approximately parallel to the mounting surface. The dimension of the laminate in the longitudinal direction is 1.8 mm or more and 2.2 mm or less, and the dimension of the laminate in the width direction is 1.05 mm or more and 1.45 mm or less, When the number of turns of the above-mentioned coil is set to x and the distance between the above-mentioned coil conductor layers is set to y, (x, y) is located within the area surrounded by A1 (54, 0.005), B1 (54, 0.01), C1 (42, 0.01), D1 (42, 0.02), E1 (36, 0.02), F1 (36, 0.03), G1 (30, 0.03), H1 (30, 0.04), I1 (24, 0.04), J1 (24, 0.05), K1 (18, 0.05), L1 (18, 0.01), M1 (12, 0.01), and N1 (12, 0.005), where the unit of y is mm.

2. The laminated coil component according to claim 1, wherein: The above (x, y) is located within the area enclosed by A1 (54, 0.005), B1 (54, 0.01), C1 (42, 0.01), D1 (42, 0.02), E1 (36, 0.02), F1 (36, 0.03), H1 (30, 0.04), O1 (24, 0.03), P1 (24, 0.01), L1 (18, 0.01), and Q1 (18, 0.005).

3. The laminated coil component according to claim 1, wherein The dimension of the stacked body in the height direction is 1.05 mm or more and 1.45 mm or less.

4. The laminated coil component according to claim 1, wherein The impedance in the frequency band of 10 MHz to 1 GHz is 300Ω or more.

5. A laminated coil component, comprising: a laminated body including a plurality of insulating layers and a plurality of coil conductor layers; as well as an external electrode disposed on a surface of the stack and electrically connected to the coil conductor layer; in, The plurality of insulating layers are magnetic. The plurality of coil conductor layers are electrically connected to form a coil. The axis of the coil is approximately parallel to the mounting surface. The dimension of the laminate in the longitudinal direction is 3.0 mm or more and 3.4 mm or less, and the dimension of the laminate in the width direction is 1.4 mm or more and 1.8 mm or less, When the number of turns of the above-mentioned coil is set to x and the distance between the above-mentioned coil conductor layers is set to y, (x, y) is located within the area surrounded by A2 (84, 0.005), B2 (84, 0.01), C2 (75, 0.01), D2 (75, 0.02), E2 (54, 0.02), F2 (54, 0.03), G2 (42, 0.03), H2 (42, 0.04), I2 (36, 0.04), J2 (36, 0.05), K2 (30, 0.05), L2 (30, 0.06), M2 (18, 0.06), N2 (18, 0.03), O2 (12, 0.03), P2 (12, 0.01), Q2 (18, 0.01), and R2 (18, 0.005), where the unit of y is mm.

6. The laminated coil component according to claim 5, wherein: The above (x, y) is located in the area surrounded by A2(84, 0.005), B2(84, 0.01), C2(75, 0.01), D2(75, 0.02), E2(54, 0.02), F2(54, 0.03), G2(42, 0.03), H2(42, 0.04), I2(36, 0.04), J2(36, 0.05), K2(30, 0.05), L2(30, 0.06), S2(24, 0.06), T2(24, 0.04), U2(18, 0.03), V2(24, 0.02), W2(36, 0.02), X2(36, 0.01), Y2(54, 0.01), and Z2(54, 0.005).

7. The laminated coil component according to claim 5, wherein: The dimension of the stacked body in the height direction is 1.4 mm or more and 1.8 mm or less.

8. The laminated coil component according to claim 5, wherein: The impedance in the frequency band of 10 MHz to 1 GHz is 300Ω or more.

9. A laminated coil component, comprising: a laminated body including a plurality of insulating layers and a plurality of coil conductor layers; as well as an external electrode disposed on a surface of the stack and electrically connected to the coil conductor layer; in, The plurality of insulating layers are magnetic. The plurality of coil conductor layers are electrically connected to form a coil. The axis of the coil is approximately parallel to the mounting surface. The dimension of the laminate in the longitudinal direction is 3.0 mm or more and 3.4 mm or less, and the dimension of the laminate in the width direction is 2.3 mm or more and 2.7 mm or less, When the number of turns of the above coil is x and the distance between the above coil conductor layers is y, (x, y) is located at A3 (84, 0.005), B3 (84, 0.01), C3 (75, 0.01), D3 (75, 0.02), E3 (54, 0.02), F3 (54, 0.03), G3 (42, 0.03), H3 (42, 0.04), I3 (36, 0.04), J3 (36, 0.05), K3 (30, 0.05), L3(30, 0.06), M3(12, 0.06), N3(18, 0.05), O3(18, 0.04), P3(24, 0.04), Q3(24, 0.03), R3(36, 0.03), S3(36, 0.02), E3(54, 0.02), T3(54, 0.01), C3(75, 0.01), and U3(75, 0.005), where the unit of y is mm.

10. The laminated coil component according to claim 9, wherein: The impedance in the frequency band of 10 MHz to 1 GHz is 300Ω or more.

11. The laminated coil component according to any one of claims 1 to 10, wherein: The coil conductor layer has a thickness of 10 μm or more and 25 μm or less.

12. The laminated coil component according to any one of claims 1 to 11, wherein: The coil is electrically connected to the external electrode via a lead portion.

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