High-sensitivity electrocardio and heart sound integrated sensor and installation method thereof

Abstract

The invention discloses a high-sensitivity electrocardio and heart sound integrated sensor and an installation method thereof, and belongs to the technical field of biomedical sensors. A high-sensitivity electrocardio and heart sound integrated sensor comprises a shell and an integrated circuit board arranged on the inner side of the shell, a top cover is arranged on the shell, an auscultation diaphragm is installed between the top cover and the shell, a mounting plate is arranged on the inner side of the shell, a first supporting seat is installed on the side, close to the auscultation diaphragm, of the mounting plate, and a second supporting seat is installed on the side, close to the auscultation diaphragm, of the mounting plate. A first mechanical layer is mounted on the first supporting seat, and a first mass seat is mounted at the other end of the first mechanical layer; according to the heart sound sensor, the high-sensitivity design is adopted, the first mechanical layer is divided into three equal parts at equal intervals, a cavity structure is formed between the first mechanical layer and the first piezoelectric plate, the normal strain of the first piezoelectric plate in the working process of the sensor is increased through the design, and therefore the sensitivity of the heart sound sensor is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of biomedical sensors, and in particular relates to a high-sensitivity electrocardiogram and heart sound integrated sensor and a mounting method thereof. Background Art

[0002] With the improvement of people's living standards, heart disease has become one of the main diseases affecting the health of Chinese residents. Therefore, heart sounds and electrocardiogram signals, as important indicators for assessing physical health status, are of great significance for preventing cardiovascular diseases.

[0003] Traditional electrocardiographs and stethoscopes are used separately, and cannot accurately correlate and analyze the electrocardiogram and heart sound signals at a specific time point. In fact, some lesions of the heart tissue itself will not be directly reflected in the electrocardiogram, but can be better reflected in the heart sound signal, such as congenital inotropic heart valve damage. Therefore, only detecting a single signal will lead to misjudgment of some complex heart diseases and miss the best treatment time. In addition, traditional acoustic stethoscopes have the disadvantages of poor low-frequency response, low sensitivity, and susceptibility to environmental noise interference. Therefore, in order to obtain more accurate heart sound signals, algorithms are often used for filtering and noise reduction, which results in the heart murmur signal containing pathological information being processed as noise, affecting later processing and pathological research. Summary of the invention

[0004] The purpose of the present invention is to provide a high-sensitivity integrated electrocardiograph and heart sound sensor and a mounting method thereof in view of the problems existing in the prior art.

[0005] To achieve the above-mentioned purpose, the invention adopts the following technical scheme: a high-sensitivity integrated electrocardiograph and heart sound sensor, comprising a shell, and an integrated circuit board arranged on the inner side of the shell, a top cover is provided on the shell, a stethoscope diaphragm is installed between the top cover and the shell, a mounting plate is provided on the inner side of the shell, a first support seat is installed on the side of the mounting plate close to the stethoscope diaphragm, a first mechanical layer is installed on the first support seat, a first mass seat is installed on the other end of the first mechanical layer, a first piezoelectric sheet is arranged between the first mass seat and the first support seat, an energy harvesting component is provided on the side of the mounting plate away from the first support seat, and the energy harvesting component is electrically connected to the integrated circuit board through a lead;

[0006] The energy harvesting component includes a second support seat installed on the mounting plate, a second mechanical layer is installed on the second support seat, a second mass seat is installed on the other end of the second mechanical layer, a third mechanical layer is installed on the side of the second mass seat close to the second support seat, a third mass seat is provided at the other end of the third mechanical layer, and the second mass seat is provided with a second piezoelectric sheet respectively connected to the second support seat and the third mass seat.

[0007] The working principle of the above scheme is that the vibration generated by the heartbeat is transmitted to the first mechanical layer, the first mass seat and the first piezoelectric sheet through the stethoscope diaphragm, so that the first piezoelectric sheet is subjected to mechanical vibration, thereby polarization occurs inside the first piezoelectric sheet and an electrical signal is generated, thereby realizing force-to-electricity conversion; the vibration generated by the heartbeat is transmitted to the second mass seat and the third mass seat through the mounting plate, and then transmitted to the second piezoelectric sheet, so that a polarization effect occurs inside the second piezoelectric sheet and electrical energy is generated, and the electrical energy is connected to the integrated circuit board through the leads to power the integrated circuit board, and the integrated circuit board after power-on amplifies, filters and digitizes the electrical signal.

[0008] By adopting the above technical solution, the sensor achieves high-sensitivity collection of heart sounds and self-powered processing of heart sounds through a specific structural design, including a stethoscope diaphragm, a first piezoelectric sheet between the first mechanical layer and the first mass seat, and an energy harvesting component. Among them, through the design of the first mechanical layer and the first mass seat and the first piezoelectric sheet, it can be used to capture heart sound signals. Under the power supply of the energy harvesting component, the captured heart sound signals can be enhanced, thereby improving the overall performance of the sensor.

[0009] Furthermore, the integrated circuit board includes a heart sound signal circuit and an electrocardiogram signal conditioning circuit.

[0010] By adopting the above technical solution, the design of the heart sound signal circuit and the ECG signal conditioning circuit can simultaneously collect ECG and heart sound signals, and accurately synchronize and collect the two in time. These two signals can provide doctors with more comprehensive diagnostic information, which helps to improve the accuracy and efficiency of diagnosis.

[0011] Optionally, the shell is cylindrical, and a plurality of mounting seats are provided on the outside of the shell, and the mounting seats are equidistantly distributed on the outer circumference of the shell. The mounting seats are integrally formed with the shell, and the upper ends of the mounting seats and the upper ends of the shell are respectively on the same horizontal plane. A mounting groove is provided on the mounting seat, and a lead hole is provided between the mounting groove and the shell.

[0012] By adopting the above technical solution, the design of the mounting base and the shell being integrally formed enhances the stability and durability of the overall structure. The design of the mounting base enables the ECG electrode patch to be conveniently installed thereon, thereby realizing the collection of ECG signals. The mounting groove provided on the mounting base is used to place the ECG electrode patch, and the lead hole allows the signal line of the ECG electrode patch to be introduced into the shell, thereby facilitating signal transmission. This design makes the installation and replacement of the ECG electrode patch simple and quick, and improves the convenience of use.

[0013] Optionally, a connecting groove for fixing the top cover is provided on the inner wall of the shell, the middle of the top cover is hollow, and the edge of the stethoscope diaphragm is fixedly connected through the top cover and the connecting groove.

[0014] By adopting the above technical solution, the edge of the stethoscope diaphragm is fixedly connected to the connecting groove through the top cover, thereby ensuring the stability and reliability of the stethoscope diaphragm. This design enables the vibration signal to be clearly transmitted to the inside of the sensor, thereby improving the sensitivity of the sensor.

[0015] Optionally, a fixing plate is provided at one end of the mounting plate away from the top cover, a fixing hole connected to the fixing plate is opened on the mounting plate, the fixing plate is a double-layer structure, and the integrated circuit board is installed on the bottom fixing plate.

[0016] By adopting the above technical solution, the fixing holes are used to firmly fix the mounting plate to the inner side of the shell, thereby ensuring the stability and reliability of the overall structure of the sensor. This design helps to reduce the vibration and displacement of the sensor during operation.

[0017] Optionally, the first piezoelectric sheet and the second piezoelectric sheet are respectively PZT piezoelectric ceramics, and the PZT piezoelectric ceramics have a thickness of 0.2 mm-0.5 mm, a width of 2 mm-5 mm, and a length of 6 mm-12 mm.

[0018] By adopting the above technical solution, PZT piezoelectric ceramics have excellent piezoelectric effect and stability, and can convert mechanical vibrations into electrical energy. The thickness, width and length of the piezoelectric sheet are precisely controlled to ensure the sensitivity and accuracy of the sensor. This design enables the sensor to collect and power heart sound signals.

[0019] Optionally, the stethoscope diaphragm is TPU, and the thickness of the TPU is 0.02mm-0.05mm.

[0020] By adopting the above technical solution, TPU has excellent elasticity and wear resistance, can fit tightly on the shell, and effectively isolate external noise. At the same time, the thickness of TPU is also precisely controlled to ensure the sensitivity and durability of the sensor. This design enables the sensor to capture heart sound signals more accurately and improve the accuracy of diagnosis.

[0021] Optionally, the first mechanical layer is divided into three equal parts, and the spacing between the three equal parts is the same. There is a gap between the first mechanical layer, the second mechanical layer and the third mechanical layer and the mounting plate respectively, and the gap is 0.5mm-0.8mm.

[0022] By adopting the above technical solution, the first mechanical layer is divided into three equal parts, and the spacing between the three equal parts is the same. This design increases the normal strain of the piezoelectric layer of the sensor during operation, thereby improving the sensitivity of the sensor. At the same time, there are gaps between the first mechanical layer, the second mechanical layer and the third mechanical layer and the mounting plate respectively. These gaps help to reduce energy loss during mechanical vibration and improve signal transmission efficiency.

[0023] Optionally, a single cavity structure is formed between the first piezoelectric sheet and the first mechanical layer and between the third mechanical layer and the second piezoelectric sheet, respectively, and two cavity structures are formed between the second mechanical layer and the second piezoelectric sheet.

[0024] By adopting the above technical solutions, these cavity structures help to increase the vibration response and sensitivity of the sensor during operation. At the same time, the design of the cavity structure also makes the sensor more sensitive to heart sound signals perpendicular to the direction of the piezoelectric layer, further suppressing the noise influence in other directions.

[0025] Optionally, a method for installing a high-sensitivity integrated electrocardiogram and heart sound sensor comprises the following steps:

[0026] Prepare the required high-sensitivity integrated ECG and heart sound sensors and all their components;

[0027] Install the first support seat and the first mechanical layer on the mounting plate, install the first mass seat at the other end of the first mechanical layer, and ensure that there is a gap between the first mechanical layer and the mounting plate, and install the first piezoelectric sheet on the first support seat and the first mass seat by UV curing glue;

[0028] After installing the first piezoelectric piece, perform a preliminary functional test to ensure that the first piezoelectric piece can properly respond to mechanical vibrations, and record the test data for subsequent calibration and verification;

[0029] Next, the second support seat of the energy harvesting component is installed on the other end of the mounting plate, and the second mechanical layer, the second mass seat, the third mechanical layer and the third mass seat are installed on the second support seat in sequence. During the installation process, the parallelism and gap consistency between the layers are maintained, and the second piezoelectric sheet is fixed on the second support seat and the third mass seat using UV curing glue to ensure that the required cavity structure is formed between the second piezoelectric sheet and the second mechanical layer and the third mechanical layer;

[0030] After all mechanical layers and piezoelectric sheets are installed, overall functional testing and calibration are performed;

[0031] Fixing the assembled mounting plate to the fixing plate inside the housing by means of bolts;

[0032] Take out a piece of TPU stethoscope diaphragm, place the stethoscope diaphragm on the top of the shell, then cover the stethoscope diaphragm with the top cover, and tightly connect the stethoscope diaphragm to the shell by threaded connection;

[0033] After completing the installation of all components, check whether the connections of each component are firm and reliable, and perform a collection test of the ECG and heart sound signals.

[0034] By adopting the above technical scheme, the installation method of the sensor describes in detail the entire process from preparing the required components to completing the installation of all parts. The piezoelectric piece is fixed to the support seat and the mass seat by UV curing glue, which ensures the stability and reliability of the piezoelectric piece. At the same time, the stethoscope diaphragm is placed on the top of the shell and tightly connected to the shell by threaded connection, which ensures the clear transmission of the heart sound signal. Finally, the sensor is tested for the collection of electrocardiogram and heart sound signals by testing equipment to ensure that the sensor can work normally and the collected signals are clear and accurate. This installation method is not only simple and fast, but also ensures the performance and reliability of the sensor.

[0035] Compared with the prior art, the present invention has the following beneficial effects:

[0036] 1. The heart sound sensor of the present invention adopts a highly sensitive design, including components such as a stethoscope diaphragm, a mechanical layer and a piezoelectric sheet. The stethoscope diaphragm is made of TPU material, which has excellent elasticity and wear resistance, can fit tightly on the shell, and effectively isolate external noise. The first mechanical layer is divided into three equal parts at equal intervals, and a cavity structure is formed between the first piezoelectric sheet. This design makes it easier for the mechanical layer to deform in a direction perpendicular to the piezoelectric sheet (i.e., normal direction) when subjected to sound wave pressure, thereby improving the sensitivity of the heart sound sensor;

[0037] 2. The integrated ECG and heart sound sensor of the present invention also adopts a unique asymmetric cavity structure design for the energy collection component, which forms a bistable piezoelectric energy harvester through two consistent fixed piezoelectric cantilever beam cavity structures (two parts consisting of the second mechanical layer and the second piezoelectric sheet) and a free end cantilever beam cavity structure (another part consisting of the third mechanical layer and the second piezoelectric sheet) located in the middle and led by the mass block. This design can more effectively collect multi-band signals generated by heart vibration and convert these mechanical energies into electrical energy, providing continuous power supply for the integrated integrated circuit of the sensor. This self-powered capability not only reduces the use cost of the sensor, but also improves its long-term stability and reliability.

[0038] 3. The integrated sensor of the present invention can simultaneously collect ECG and heart sound signals and synchronize the two accurately. This synchronous collection capability enables doctors to more intuitively analyze the relationship between ECG and heart sound signals, thereby more accurately judging the health of the heart. In addition, since ECG and heart sound signals reflect the electrophysiological activity and mechanical activity of the heart respectively, synchronous collection of these two signals can provide doctors with more comprehensive diagnostic information, which helps to improve the accuracy and efficiency of diagnosis.

[0039] 4. The integrated sensor of the present invention has the advantages of high sensitivity, strong reliability, low cost, portability, low noise, and simultaneous detection of multiple parameters of electrocardiogram and heart sound. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 This is a schematic diagram of the overall structure of the integrated electrocardiogram and heart sound sensor of the present invention;

[0041] Figure 2 This is a schematic diagram of the structure of the heart sound sensor of the present invention installed inside the housing;

[0042] Figure 3 It is a schematic diagram of the three-dimensional structure of the housing of the present invention;

[0043] Figure 4 This is a schematic diagram of the overall connection structure of the heart sound sensor and the energy collection component of the present invention;

[0044] Figure 5 This is a schematic diagram of the connection structure between the energy collection component and the mounting plate of the present invention;

[0045] Figure 6 It is a schematic diagram of the cross-sectional structure of the heart sound sensor and energy collection assembly of the present invention;

[0046] Figure 7 It is a schematic diagram of the structure of the heart sound circuit of the present invention;

[0047] Figure 8 It is a schematic diagram of the structure of the ECG circuit of the present invention.

[0048] In the figure: 1. Shell; 101. Mounting seat; 102. Mounting groove; 103. Lead hole; 104. Routing hole; 2. Top cover; 3. Stethographic diaphragm; 4. Mounting plate; 401. Fixing hole; 402. Fixing plate; 5. First support seat; 6. First mechanical layer; 7. First mass seat; 8. First piezoelectric sheet; 9. Energy harvesting component; 91. Second support seat; 92. Second mechanical layer; 93. Second mass seat; 94. Third mechanical layer; 95. Third mass seat; 96. Second piezoelectric sheet. DETAILED DESCRIPTION

[0049] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0050] In the description of the present invention, it should be noted that the directions or positional relationships indicated by terms such as "middle", "upper", "lower", "left", "right", "inside" and "outside" are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0051] like Figure 1 —6, the specific scheme of the embodiment is as follows: a high-sensitivity integrated ECG and heart sound sensor, comprising a shell 1, and an integrated circuit board arranged on the inner side of the shell 1, the shell 1 is cylindrical, and a plurality of mounting seats 101 are arranged on the outer side of the shell 1, and the plurality of mounting seats 101 are equidistantly distributed on the outer periphery of the shell 1, the mounting seats 101 and the shell 1 are integrally formed, and the upper ends of the mounting seats 101 and the upper ends of the shell 1 are respectively on the same horizontal plane, the mounting seats 101 are circular and flat, and a mounting groove 102 is opened on the mounting seat 101, and the bottom of the mounting groove 102 is a closed arc shape, and the mounting groove 102 is used to install an ECG electrode patch, and the ECG electrode patch is installed on the inner side of the mounting groove 102 by a snap clip fixer, and the snap clip fixer can flexibly fix the ECG electrode patch in the mounting groove 102;

[0052] A lead hole 103 is provided between the mounting groove 102 and the housing 1, and the lead hole 103 can be used to introduce the signal line of the ECG electrode patch into the housing 1. The side wall of the housing 1 is provided with a plurality of wiring holes 104;

[0053] The shell 1 is provided with a top cover 2, which is made of aluminum material using 3D printing technology. A stethoscope diaphragm 3 is installed between the top cover 2 and the shell 1. The inner wall of the shell 1 is provided with a connecting groove for fixing the top cover 2. The middle of the top cover 2 is hollow, and the edge of the stethoscope diaphragm 3 is fixedly connected to the connecting groove through the top cover 2. There are two grooves at the cavity opening of the shell 1. The outer groove has a threaded structure for fixing and sealing the top cover 2, and the inner groove is used to place the stethoscope diaphragm 3. The stethoscope diaphragm 3 is TPU (thermoplastic polyurethane elastomer). The TPU has excellent elasticity and wear resistance, can fit tightly on the shell 1, and effectively isolates external noise. The thickness of the TPU is 0.02mm-0.05mm, and the thickness is controlled between 0.02mm-0.05mm, which not only ensures sufficient sensitivity, but also avoids the problem of fragility caused by being too thin.

[0054] A mounting plate 4 is provided on the inner side of the shell 1, and the mounting plate 4 provides a stable supporting platform for installing various sensor components. A fixing plate 402 is provided at one end of the mounting plate 4 away from the top cover 2. A fixing hole 401 connected to the fixing plate 402 is opened on the mounting plate 4. The fixing plate 402 is a two-layer symmetrical structure. The setting of the fixing plate 402 can be used for installing an integrated circuit board, and the integrated circuit board is installed on the bottom fixing plate 402.

[0055] In some embodiments, the integrated circuit board includes a heart sound signal circuit (e.g. Figure 7 as shown) and ECG signal conditioning circuit (as shown Figure 8 As shown); the heart sound signal circuit adopts the operational amplifier LMP7721 module for charge amplifier design. LMP7721 has an ultra-low typical input bias current of 3fA and a low voltage noise of 6.5, which is an ideal choice for amplifying high impedance signals. The average level of the input of the operational amplifier LMP7721 module is biased by the voltage divider R1 and R2. The amplification factor of the circuit is inversely proportional to the feedback capacitor C1, and the signal-to-noise ratio (SNR) and the lower cutoff frequency are also inversely proportional to C1. Under the compromise of charge amplification speed, SNR and lower cutoff frequency, C1 in the charge amplifier is set to 47pF, so the amplification factor of the circuit is 21.3. In addition, the charge amplifier circuit is designed with a 1GΩ feedback resistor R3. The circuit can generate a low cutoff frequency of 3.4Hz, so that it can meet the monitoring requirements of heart sound signals;

[0056] The ECG signal conditioning circuit adopts the AD8232 module. The AD8232 is an integrated signal conditioning module for ECG and other bioelectric measurement applications. The device is designed to extract, amplify and filter weak bioelectric signals in the presence of noise generated by movement or remote electrode placement. The AD8232 uses a two-pole high-pass filter to eliminate motion artifacts and electrode half-cell potentials. The filter is tightly coupled with the instrumentation amplifier structure to achieve single-stage high gain and high-pass filtering. In this embodiment, R6, R7, C1, and C3 are used to form a passive low-pass filter, and R11, R12, R13, C4, and C6 are used to form a passive high-pass filter, where R12 is used to control the quality factor Q to limit the frequency to 0.5Hz to 40Hz.

[0057] A first support seat 5 is installed on one side of the mounting plate 4 close to the stethoscope diaphragm 3, a first mechanical layer 6 is installed on the first support seat 5, the first mechanical layer 6 is a three-part structure, and the spacing between the three-part structures is the same, a first mass seat 7 is installed on the other end of the first mechanical layer 6, and a first piezoelectric sheet 8 is provided between the first mass seat 7 and the first support seat 5.

[0058] An energy harvesting component 9 is provided on a side of the mounting plate 4 away from the first support seat 5, and the energy harvesting component 9 is electrically connected to the integrated circuit board through a lead. The energy harvesting component 9 includes a second support seat 91 mounted on the mounting plate 4, a second mechanical layer 92 is mounted on the second support seat 91, a second mass seat 93 is mounted on the other end of the second mechanical layer 92, and a third mechanical layer 94 is mounted on the side of the second mass seat 93 close to the second support seat 91. There are gaps between the first mechanical layer 6, the second mechanical layer 92 and the third mechanical layer 94 and the mounting plate 4, respectively, and the gaps are 0.5mm-0.8mm. The design of the gaps helps to reduce energy loss during mechanical vibration and improve signal transmission efficiency. A third mass seat 95 is provided on the other end of the third mechanical layer 94, and a second piezoelectric sheet 96 connected to the second support seat 91 and the third mass seat 95, respectively, is provided on the second mass seat 93;

[0059] The first piezoelectric sheet 8 and the second piezoelectric sheet 96 are respectively PZT (lead zirconate titanate) piezoelectric ceramics. The PZT piezoelectric ceramics are prepared into piezoelectric sheets by cutting and thinning processes. A layer of gold is sputtered on the top and bottom of the prepared piezoelectric sheet using magnetron sputtering technology as its upper and lower electrodes for outputting cardiac sound signals. The thickness of the PZT piezoelectric ceramics is 0.2mm-0.5mm, the width is 2mm-5mm, and the length is 6mm-12mm. The thickness of the first mechanical layer 6, the second mechanical layer 9 and the third mechanical layer 94 is 0.4mm-0.8mm, the width is 4mm-7mm, and the length is 4mm-16mm. The width of the piezoelectric sheet is smaller than the width of the mechanical layer, and the two are in an asymmetric state. The first piezoelectric sheet 8 and the first mechanical layer 6 are in an asymmetric state, and the second piezoelectric sheet 96 and the second mechanical layer 9 and the third mechanical layer 94 are also in an asymmetric state.

[0060] A single cavity structure is formed between the first piezoelectric sheet 8 and the first mechanical layer 6 and between the third mechanical layer 94 and the second piezoelectric sheet 96 respectively. Two cavity structures are formed between the second mechanical layer 92 and the second piezoelectric sheet 96. The design of the cavity structure also makes the sensor more sensitive to cardiac sound signals perpendicular to the direction of the piezoelectric layer, and further suppresses the influence of noise in other directions. The vibration mass of the mechanical layer can be increased by setting the first mass seat 7, the second mass seat 93 and the third mass seat 95, thereby improving the response sensitivity of the sensor to cardiac sound signals. The shell 1, the first support seat 5, the first mechanical layer 6, the mounting plate 4, the first mass seat 7, the second support seat 91, the second mechanical layer 92, the second mass seat The measuring seat 93, the third mechanical layer 94 and the third mass seat 95 are all made of aluminum metal material. The good electrical conductivity and thermal conductivity of aluminum metal material help to improve the signal transmission efficiency and heat dissipation performance of the sensor. The size of the first support seat 5 is 12mm×6mm×5mm (length×width×height), the size of the first mass seat 7 is 12mm×18mm×4mm (length×width×height), the size of the second support seat 91 is 12mm×6mm×4.5mm (length×width×height), the size of the second mass seat 93 is 12mm×4mm×3.5mm (length×width×height), and the size of the third mass seat 95 is 5mm×3mm×3.5mm (length×width×height).

[0061] The energy collection component 9 forms a highly integrated energy conversion system through processing and assembly, wherein the second support seat 91 serves as a fixed foundation to support the entire energy collection structure; the second mechanical layer 92 and the third mechanical layer 94 serve as a bridge for transmitting vibration;

[0062] When the heart beats, the sound waves generated are captured by the stethoscope diaphragm 3; the sound waves generate vibrations on the stethoscope diaphragm 3, and these vibrations are transmitted to the first mass seat 7 and the first piezoelectric sheet 8 through the first mechanical layer 6; when the first piezoelectric sheet 8 is subjected to mechanical vibration, polarization occurs inside the piezoelectric sheet to generate an electrical signal, thereby realizing force-to-electricity conversion, and then amplified by the operational amplifier LMP7721 module on the integrated circuit board to realize the pickup of weak heart sound signals;

[0063] At the same time, the vibration is transmitted to the second mechanical layer 92 and the third mechanical layer 94 through the mounting plate 4, and the second mechanical layer 92 and the third mechanical layer 94 will also vibrate, and these vibrations are then transmitted to the second piezoelectric film 96, which also causes a polarization effect inside the piezoelectric film to generate electrical energy, and the electrical energy is connected to the integrated circuit board through the leads to power the operational amplifier LMP7721 module and the AD8232 module on the integrated circuit board. After being powered on, the operational amplifier LMP7721 module and the AD8232 module amplify, filter and digitize the electrical signals on the passive sensors. The electrical signals after amplification, filtering and digitization have a higher signal-to-noise ratio and clarity, and can more accurately reflect the detailed characteristics of the heartbeat.

[0064] A method for installing a high-sensitivity integrated electrocardiogram and heart sound sensor comprises the following steps:

[0065] Prepare the required high-sensitivity integrated ECG and heart sound sensors and all their components;

[0066] Install the first support seat 5 and the first mechanical layer 6 on the mounting plate 4, and install the first mass seat 7 at the other end of the first mechanical layer 6, and ensure that there is a gap between the first mechanical layer 6 and the mounting plate 4, and install the first piezoelectric sheet 8 on the first support seat 5 and the first mass seat 7 by UV curing glue;

[0067] After the first piezoelectric sheet 8 is installed, a preliminary functional test is performed to ensure that the first piezoelectric sheet 8 can correctly respond to mechanical vibrations, and the test data is recorded;

[0068] Next, the second support seat 91 of the energy harvesting component 9 is installed on the other end of the mounting plate 4, and the second mechanical layer 92, the second mass seat 93, the third mechanical layer 94 and the third mass seat 95 are installed on the second support seat 91 in sequence. During the installation process, the parallelism and gap consistency between the layers are maintained, and the second piezoelectric sheet 96 is fixed on the second support seat 91 and the third mass seat 95 using ultraviolet curing glue to ensure that the required cavity structure is formed between the second piezoelectric sheet 96 and the second mechanical layer 92 and the third mechanical layer 94;

[0069] After all mechanical layers and piezoelectric sheets are installed, overall functional testing and calibration are performed;

[0070] Fix the assembled mounting plate 4 to the fixing plate 402 on the inner side of the housing 1 by means of bolts;

[0071] Take out a piece of TPU stethoscope diaphragm 3, place the stethoscope diaphragm 3 on the top of the housing 1, then cover the stethoscope diaphragm 3 with the top cover 2, and tightly connect the stethoscope diaphragm 3 to the housing 1 by threaded connection;

[0072] After completing the installation of all components, check whether the connections of each component are firm and reliable, and perform a collection test of the ECG and heart sound signals.

[0073] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-sensitivity integrated ECG and heart sound sensor, characterized in that: It comprises a shell, and an integrated circuit board arranged inside the shell, the shell is provided with a top cover, a stethoscope diaphragm is installed between the top cover and the shell, a mounting plate is provided inside the shell, a first support seat is installed on the side of the mounting plate close to the stethoscope diaphragm, a first mechanical layer is installed on the first support seat, a first mass seat is installed on the other end of the first mechanical layer, a first piezoelectric sheet is arranged between the first mass seat and the first support seat, an energy harvesting component is arranged on a side of the mounting plate away from the first support seat, and the energy harvesting component is electrically connected to the integrated circuit board through a lead; The energy harvesting component includes a second support seat installed on the mounting plate, a second mechanical layer is installed on the second support seat, a second mass seat is installed on the other end of the second mechanical layer, a third mechanical layer is installed on the side of the second mass seat close to the second support seat, a third mass seat is provided at the other end of the third mechanical layer, and the second mass seat is provided with a second piezoelectric sheet respectively connected to the second support seat and the third mass seat.

2. The high-sensitivity integrated ECG and heart sound sensor according to claim 1, characterized in that: The integrated circuit board includes a heart sound signal circuit and an electrocardiogram signal conditioning circuit.

3. The high-sensitivity integrated ECG and heart sound sensor according to claim 1, characterized in that: The shell is cylindrical, and a plurality of mounting seats are provided on the outer side of the shell. The mounting seats are equidistantly distributed on the outer circumference of the shell. The mounting seats are integrally formed with the shell, and the upper ends of the mounting seats and the upper ends of the shell are respectively located on the same horizontal plane. A mounting groove is provided on the mounting seat, and a lead hole is provided between the mounting groove and the shell.

4. The high-sensitivity integrated ECG and heart sound sensor according to claim 1, characterized in that: The inner wall of the shell is provided with a connecting groove for fixing the top cover, the middle of the top cover is hollow, and the edge of the stethoscope diaphragm is fixedly connected through the top cover and the connecting groove.

5. The high-sensitivity integrated ECG and heart sound sensor according to claim 1, characterized in that: A fixing plate is provided at one end of the mounting plate away from the top cover, a fixing hole connected to the fixing plate is provided on the mounting plate, the fixing plate is a double-layer structure, and the integrated circuit board is mounted on the bottom fixing plate.

6. The high-sensitivity integrated ECG and heart sound sensor according to claim 1, characterized in that: The first piezoelectric sheet and the second piezoelectric sheet are respectively PZT piezoelectric ceramics, and the PZT piezoelectric ceramics have a thickness of 0.2 mm-0.5 mm, a width of 2 mm-5 mm, and a length of 6 mm-12 mm.

7. The high-sensitivity integrated ECG and heart sound sensor according to claim 1, characterized in that: The stethoscope membrane is TPU, and the thickness of the TPU is 0.02mm-0.05mm.

8. The high-sensitivity integrated ECG and heart sound sensor according to claim 1, characterized in that: The first mechanical layer is divided into three equal parts, and the intervals between the three equal parts are the same. There are gaps between the first mechanical layer, the second mechanical layer and the third mechanical layer and the mounting plate, respectively, and the gaps are 0.5 mm-0.8 mm.

9. The high-sensitivity integrated ECG and heart sound sensor according to claim 1, characterized in that: A single cavity structure is formed between the first piezoelectric sheet and the first mechanical layer and between the third mechanical layer and the second piezoelectric sheet, respectively, and two cavity structures are formed between the second mechanical layer and the second piezoelectric sheet.

10. The method for installing the high-sensitivity integrated ECG and heart sound sensor according to any one of claims 1 to 9, characterized in that: The steps include: Prepare the required high-sensitivity integrated ECG and heart sound sensors and all their components; Install the first support seat and the first mechanical layer on the mounting plate, install the first mass seat at the other end of the first mechanical layer, and ensure that there is a gap between the first mechanical layer and the mounting plate, and install the first piezoelectric sheet on the first support seat and the first mass seat by UV curing glue; After installing the first piezoelectric sheet, perform a preliminary functional test to ensure that the first piezoelectric sheet can properly respond to mechanical vibrations, and record the test data; Next, the second support seat of the energy harvesting component is installed on the other end of the mounting plate, and the second mechanical layer, the second mass seat, the third mechanical layer and the third mass seat are installed on the second support seat in sequence. During the installation process, the parallelism and gap consistency between the layers are maintained, and the second piezoelectric sheet is fixed on the second support seat and the third mass seat using UV curing glue to ensure that the required cavity structure is formed between the second piezoelectric sheet and the second mechanical layer and the third mechanical layer; After all mechanical layers and piezoelectric sheets are installed, overall functional testing and calibration are performed; Fixing the assembled mounting plate to the fixing plate inside the housing by means of bolts; Take out a piece of TPU stethoscope diaphragm, place the stethoscope diaphragm on the top of the shell, then cover the stethoscope diaphragm with the top cover, and tightly connect the stethoscope diaphragm to the shell by threaded connection; After all components are installed, the ECG and heart sound signal collection test is performed.

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