MEMS chip test equipment

Abstract

The invention discloses MEMS chip test equipment, which comprises a rack, and a stock bin assembly, a loading and unloading assembly and a test assembly which are respectively mounted on the rack, and is characterized in that the loading and unloading assembly comprises an X-direction driving module, a movable Y-direction driving module, a movable Z-axis driving module and a plurality of suction nozzles for picking up chips; the vertically-arranged suction nozzle is movably installed on the Z-axis driving module, the stock bin assembly comprises at least one feeding box and at least two discharging boxes, and the feeding boxes and the discharging boxes are each internally provided with a plurality of chip trays arranged in the vertical direction. According to the invention, stable pressing of each chip and double-axis multi-angle rotation of the plurality of chips can be realized through the pressing head in the testing process, so that batch testing of the plurality of chips is realized, and the stress stability and consistency of the chips in the whole testing process can be ensured; and the chip in the chip seat can be quickly taken and placed through the strip-shaped through hole, so that the production test efficiency is improved, and the test precision is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of chip testing, and in particular to MEMS chip testing equipment. Background Art

[0002] In recent years, the trend of miniaturization of MEMS chips has become more and more obvious, and the demand for MEMS chip testing is also increasing. There are many types of MEMS, and hundreds of millions of MEMS are consumed every year in the world, and they are widely used in smart phones, automotive electronics, smart manufacturing and other fields. In addition, the market share of MEMS chips depends more on their own quality. The quality inspection of MEMS chips usually requires the use of corresponding test sockets to control the quality of MEMS chips. However, the existing products for MEMS chip testing have too high manufacturing costs and cannot be well promoted and used on a larger scale, which greatly increases the manufacturing costs and testing cycles of MEMS chip manufacturers, which is not conducive to improving their own economic benefits. Summary of the invention

[0003] The purpose of the present invention is to provide a MEMS chip testing device, which can not only realize batch testing of multiple chips, but also ensure the stability and consistency of the force applied to the chips during the entire testing process, and can also quickly take and place the chips in the chip seat through the bar-shaped through holes, thereby improving the production testing efficiency and ensuring the testing accuracy.

[0004] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a MEMS chip testing device, comprising: a frame and a hopper assembly, a loading and unloading assembly, and a testing assembly respectively mounted on the frame, wherein the loading and unloading assembly comprises: an X-axis driving module, a Y-axis driving module movably mounted on the X-axis driving module, a Z-axis driving module movably mounted on the Y-axis driving module, and a plurality of suction nozzles for picking up chips, wherein the vertically arranged suction nozzles are movably mounted on the Z-axis driving module, the hopper assembly comprises at least one loading box and at least two unloading boxes, wherein the loading box and the unloading box are both provided with a plurality of chips arranged in the vertical direction. The sheet material tray is arranged on one side of the silo assembly and below the loading and unloading assembly. The test assembly comprises: a marble base plate horizontally mounted on a frame, a first support plate vertically mounted on the upper surface of the marble base plate, a second support plate and a test carrier plate arranged between the first support plate and the second support plate, wherein the test carrier plate is mounted on a rotating part of a first turntable that can rotate around a first direction, the fixed part of the first turntable is mounted on a rotating base, the other end of the rotating base that is rotatably connected to the first support plate is mounted on a rotating part of a second turntable that can rotate around a second direction, and the fixed part of the second turntable is mounted on the second support plate; A test board communicating with a host computer and a chip carrier electrically connected to the test board are arranged in sequence above the test carrier, a plurality of chip seats are arranged on the upper surface of the chip carrier opposite to the test board, a plurality of pressure heads corresponding to the chip seats are arranged on the lower surface of a pressure plate arranged above the chip carrier, a plurality of the pressure heads are arranged to form at least two pressure head rows, a plurality of pressure heads in each pressure head row are arranged at intervals along the X direction, a strip through hole extending along the X direction is provided on the upper surface of the pressure plate and between any two adjacent pressure head rows, at least one horizontal cylinder that can be extended and retracted along the Y direction perpendicular to the X direction is installed on the upper surface of the test carrier, a movable plate connected to the piston rod of the horizontal cylinder is slidably arranged above the test carrier, at least two vertical cylinders are installed on the movable plate, the piston rod of each vertical cylinder is connected to the pressure plate, when the pressure head on the pressure plate moves to the top of the chip seat with the horizontal cylinder and the piston rod of the vertical cylinder is in a contracted state, the pressure head is in compression contact with the chip in the chip seat.

[0005] The further improved scheme in the above technical scheme is as follows: 1. In the above scheme, one surface of a movable carrier that can move in the vertical direction is installed on the Z-axis driving module, and a variable pitch module is installed on the other surface of the movable carrier. A support bar is installed on each variable pitch slider of the variable pitch module, and a suction nozzle is installed at the lower end of each support bar whose upper end is connected to the variable pitch slider.

[0006] 2. In the above scheme, a blade cylinder is installed at the lower end of each support bar, and the upper end of each suction nozzle is connected to the corresponding blade cylinder.

[0007] 3. In the above scheme, a vertically arranged contraction cylinder is also installed on the movable carrier plate, and the lower end of the piston rod of the contraction cylinder is connected to a horizontally arranged adsorption plate. A plurality of adsorption holes opened on the lower surface of the adsorption plate are connected to a vacuum pump or a vacuum generator through pipelines. When the piston rod of the contraction cylinder is in an extended state, the lower surface of the adsorption plate is lower than the lower end surface of the suction nozzle.

[0008] 4. In the above scheme, a visual bracket is installed on the Y-axis driving module and located on one side of the Z-axis driving module. A camera and a light source located directly below the camera are installed on the surface of the visual bracket movable along the Y direction and opposite to the driving module.

[0009] 5. In the above scheme, the silo assembly also includes: a bottom base plate and a plurality of partitions installed at intervals on the upper surface of the bottom base plate, a silo area for embedding an upper silo or a lower silo is formed between adjacent partitions and the bottom base plate, and the bottom surface of each of the upper silo and the lower silo is slidably connected to the upper surface of the bottom base plate in the corresponding silo area through at least one set of silo slide rails and silo sliders.

[0010] 6. In the above scheme, a baffle is connected between the ends of the plurality of partitions close to the test assembly, and at least two sets of mutually cooperating guide columns and guide sleeves are arranged between each of the upper and lower material boxes and the baffle.

[0011] 7. In the above solution, the first direction intersects the second direction perpendicularly and their intersection coincides with the center of gravity of the test component.

[0012] 8. In the above solution, a rotating motor and a routing slip ring for driving the rotating part to rotate are installed on the fixed part of each of the first turntable and the second turntable.

[0013] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art: 1. The MEMS chip testing device of the present invention, wherein the testing assembly is arranged at one side of the silo assembly and below the loading and unloading assembly, and comprises: a marble substrate horizontally mounted on a frame, a first support plate vertically mounted on the upper surface of the marble substrate, a second support plate and a testing carrier plate arranged between the first support plate and the second support plate, wherein the testing carrier plate is mounted on a rotating portion of a first turntable rotatable around a first direction, the fixed portion of the first turntable is mounted on a rotating base, the other end of the rotating base having one end rotatably connected to the first support plate is mounted on a rotating portion of a second turntable rotatable around a second direction, a testing board communicating with a host computer and a chip carrier plate electrically connected to the testing board are arranged in sequence above the testing carrier plate, a plurality of chip seats are arranged on the upper surface of the chip carrier plate opposite to the testing board, and a plurality of pressure plates corresponding to the chip seats are arranged on the lower surface of a pressure plate arranged above the chip carrier plate A head is provided, and several pressure heads are arranged to form at least two pressure head rows, and several pressure heads in each pressure head row are arranged at intervals along the X direction, and a strip through hole extending along the X direction is provided on the upper surface of the pressure plate and between any two adjacent pressure head rows, and at least one horizontal cylinder which can be extended and retracted along the Y direction perpendicular to the X direction is installed on the upper surface of the test carrier, and a movable plate connected to the piston rod of the horizontal cylinder is slidably arranged above the test carrier, and at least two vertical cylinders are installed on the movable plate, and the piston rod of each vertical cylinder is connected to the pressure plate, which can realize stable pressing and holding of each chip and perform dual-axis multi-angle rotation of multiple chips through the pressure head during the test process, thereby realizing batch testing of multiple chips, and ensuring the stability and consistency of the force on the chip during the whole test process, and can also quickly take and place the chip in the chip holder through the strip through hole, thereby improving the production test efficiency and ensuring the test accuracy.

[0014] 2. The MEMS chip testing device of the present invention has a movable carrier that can move in the vertical direction, one surface of which is mounted on the Z-axis driving module, and a variable pitch module is mounted on the other surface of the movable carrier, and each variable pitch slider of the variable pitch module is mounted with a support bar, and each support bar whose upper end is connected to the variable pitch slider is mounted with a suction nozzle at the lower end, which can realize the simultaneous picking and transportation of multiple chips between the silo assembly and the test assembly, and can also compensate for the chip position difference between the silo assembly and the test assembly by adjusting the distance between the suction nozzles, thereby improving the chip transportation efficiency and test efficiency; further, each support bar is mounted with a suction nozzle at the lower end There is a blade cylinder, and the upper end of each suction nozzle is connected to the corresponding blade cylinder. The independent picking and placing of the chip can be achieved by contracting the blade cylinder without affecting the chips on other suction nozzles; in addition, a vertically arranged contraction cylinder is installed on the movable carrier plate, and the lower end of the piston rod of the contraction cylinder is connected to a horizontally arranged adsorption plate. A plurality of adsorption holes opened on the lower surface of the adsorption plate are connected to a vacuum pump or a vacuum generator through a pipeline. When the piston rod of the contraction cylinder is in an extended state, the lower surface of the adsorption plate is lower than the lower end surface of the suction nozzle, so that the chip tray can be adsorbed and transported as a whole and interference and damage to the suction nozzle can be avoided during the transportation process. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Attached Figure 1 This is a schematic diagram of the overall structure of the MEMS chip testing equipment of the present invention; Attached Figure 2 This is a structural schematic diagram of a rotating test bench of a MEMS chip testing device of the present invention; Attached Figure 3 This is a schematic diagram of the partial structure of the rotary test bench of the MEMS chip testing equipment of the present invention; Attached Figure 4 for Figure 3 A magnified view of the structure at center; Attached Figure 5 It is a schematic diagram of a partial first viewing angle of the feeding structure of the MEMS chip testing equipment of the present invention; Attached Figure 6 It is a partial second viewing angle schematic diagram of the feeding structure of the MEMS chip testing equipment of the present invention; Attached Figure 7 This is a schematic diagram of the silo structure of the MEMS chip testing equipment of the present invention; Attached Figure 8 for Figure 7 A magnified view of the structure at B in the middle; Attached Fig. 9 This is a schematic diagram of the internal structure of the silo of the MEMS chip testing equipment of the present invention; Attached Fig.10 This is an enlarged view of the local structure inside the silo of the MEMS chip testing equipment of the present invention.

[0016] In the above drawings: 100, rack; 200, chip; 300, chip tray; 1, marble substrate; 2, first support plate; 3, second support plate; 4, test carrier; 51, first turntable; 52, second turntable; 53, rotating motor; 54, routing slip ring; 6, rotating base; 7, test plate; 8, chip carrier; 9, chip seat; 10, pressing plate; 11, pressing head; 12, vertical cylinder; 13, horizontal cylinder; 14, movable plate; 15, strip through hole; 21, X-axis drive module; 22, Y-axis drive module; 221, visual bracket; 222, camera; 223, light source; 23, Z-axis drive module; 24, nozzle; 25, movable carrier; 26, variable pitch module; 261, variable pitch Slider; 262, bracket; 27, support bar; 28, blade cylinder; 29, retraction cylinder; 30, adsorption plate; 301, adsorption hole; 31, loading box; 32, unloading box; 33, bottom base plate; 34, partition; 35, box area; 361, silo slide rail; 362, silo slider; 37, baffle; 371, guide column; 372, guide sleeve; 38, support plate; 39, screw rod; 40, top plate; 41, motor; 42, nut; 43, vertical support plate; 441, slide rail; 442, slider; 45, movable block; 461, guide column; 462, guide sleeve; 47, bearing seat; 48, limit plate; 49, first push block; 50, second push block; 51, first cylinder; 52, second cylinder. DETAILED DESCRIPTION

[0017] The present invention can be further understood by the specific examples given below, but they are not intended to limit the present invention.

[0018] Embodiment 1: A MEMS chip testing device, comprising: a rack 100 and a hopper assembly, a loading and unloading assembly, and a testing assembly respectively mounted on the rack 100, wherein the loading and unloading assembly comprises: an X-axis driving module 21, a Y-axis driving module 22 movably mounted on the X-axis driving module 21, a Z-axis driving module 23 movably mounted on the Y-axis driving module 22, and a plurality of suction nozzles 24 for picking up a chip 200, wherein the vertically arranged suction nozzles 24 are movably mounted on the Z-axis driving module 23, and the hopper assembly comprises at least one loading box 31 and at least two unloading boxes 32, wherein the loading box 31 and the unloading box 32 are both provided with a plurality of chip trays 3 arranged in a vertical direction. 00, the test assembly arranged on one side of the silo assembly and located below the loading and unloading assembly comprises: a marble substrate 1 horizontally mounted on a frame 100, a first support plate 2 vertically mounted on the upper surface of the marble substrate 1, a second support plate 3 and a test carrier plate 4 arranged between the first support plate 2 and the second support plate 3, the test carrier plate 4 is mounted on a rotating portion of a first turntable 51 that can rotate around a first direction, the fixed portion of the first turntable 51 is mounted on a rotating base 6, the other end of the rotating base 6 rotatably connected to the first support plate 2 is mounted on a rotating portion of a second turntable 52 that can rotate around a second direction, and the fixed portion of the second turntable 52 is mounted on the second support plate 3; A test board 7 for communicating with a host computer and a chip carrier 8 electrically connected to the test board 7 are arranged in sequence above the test carrier 4. The chip carrier 8 is provided with a plurality of chip seats 9 on the upper surface opposite to the test board 7. A pressure plate 10 arranged above the chip carrier 8 has a plurality of pressure heads 11 corresponding to the chip seats 9 on the lower surface. The plurality of pressure heads 11 are arranged to form at least two pressure head rows. The plurality of pressure heads 11 in each pressure head row are arranged at intervals along the X direction. A strip extending along the X direction is provided on the upper surface of the pressure plate 10 and located between any two adjacent pressure head rows. Through hole 15, the upper surface of the test carrier 4 is equipped with at least one horizontal cylinder 13 which can be extended and retracted along the Y direction perpendicular to the X direction, and a movable plate 14 connected to the piston rod of the horizontal cylinder 13 is slidably arranged above the test carrier 4, and at least two vertical cylinders 12 are installed on the movable plate 14, and the piston rod of each vertical cylinder 12 is connected to the pressure plate 10. When the pressure head 11 on the pressure plate 10 moves to the top of the chip seat 9 with the horizontal cylinder 13 and the piston rod of the vertical cylinder 12 is in a retracted state, the pressure head 11 is in compression contact with the chip 200 in the chip seat 9.

[0019] One surface of a movable carrier 25 that can move in the vertical direction is installed on the Z-axis driving module 23, and a variable pitch module 26 is installed on the other surface of the movable carrier 25. A support bar 27 is installed on each variable pitch slider 261 of the variable pitch module 26, and a suction nozzle 24 is installed at the lower end of each of the support bars 27 whose upper end is connected to the variable pitch slider 261.

[0020] A blade cylinder 28 is installed at the lower end of each of the support bars 27 , and the upper end of each of the suction nozzles 24 is connected to the corresponding blade cylinder 28 .

[0021] A vertically arranged contraction cylinder 29 is also installed on the above-mentioned movable carrier plate 25. The lower end of the piston rod of the above-mentioned contraction cylinder 29 is connected to a horizontally arranged adsorption plate 30. A plurality of adsorption holes 301 opened on the lower surface of the adsorption plate 30 are connected to a vacuum pump or a vacuum generator through a pipeline. When the piston rod of the above-mentioned contraction cylinder 29 is in an extended state, the lower surface of the above-mentioned adsorption plate 30 is lower than the lower end surface of the suction nozzle 24.

[0022] The pitch-changing module 26 is mounted on the movable carrier plate 25 via a bracket 262 and is located on the side of the retracting cylinder 29 opposite to the movable carrier plate 25 .

[0023] A visual bracket 221 is installed on the Y-axis driving module 22 and located on one side of the Z-axis driving module 23. A camera 222 and a light source 223 located directly below the camera 222 are installed on the surface of the visual bracket 221 movable along the Y direction and opposite to the driving module 22.

[0024] A horizontally extending support plate 38 is fixedly installed between the inner walls of each of the above-mentioned loading box 31 and the unloading box 32. The upper end of a vertically extending screw rod 39 passes through the above-mentioned support plate 38 and is connected to a top plate 40 arranged above the support plate 38. The lower end of the above-mentioned screw rod 39 is connected to the output shaft of a motor 41. A nut 42 is sleeved on the outer side of the above-mentioned screw rod 39. The above-mentioned nut 42, which is threadably matched with the screw rod 39, is fixedly installed on the support plate 38. A vertical support plate 43 is installed on the lower surface of the above-mentioned support plate 38. A movable block 45 that can move in the vertical direction is installed on the above-mentioned vertical support plate 43 through a slide rail 441 and a slider 442, and the above-mentioned motor 41 is installed on the movable block 45.

[0025] At least two vertically extending guide posts 461 are installed on the lower surface of the top plate 40 , and guide sleeves 462 corresponding to the guide posts 461 are installed on the support plate 38 . Each of the guide posts 461 passes through the corresponding guide sleeve 462 and slidably cooperates with the guide sleeve 462 .

[0026] The four guide pillars 461 are respectively installed at the four corners of the lower surface of the top plate 40 .

[0027] The lower end of the screw rod 39 is rotatably mounted on the movable block 45 through a bearing seat 47 .

[0028] The nut 42 is fixedly mounted on the lower surface of the support plate 38 .

[0029] A limit plate 48 is provided on the outer side of the corners at both ends of the upper surface of the support plate 38, and a plurality of chip trays 300 stacked on the upper surface of the top plate 40 are located in the area surrounded by four vertically extending limit plates 48. A first push block 49 is provided on the outer side of each end of any long side of the chip tray 300 located on the top layer, and a second push block 50 is provided on the outer side of any short side of the chip tray 300. The two first push blocks 49 movable along the short side direction of the chip tray 300 are each connected to the piston rod of a first cylinder 51, and the second push block 50 movable along the long side direction of the chip tray 300 is connected to the piston rod of a second cylinder 52.

[0030] The second push block 50 is disposed on the outer side of at least one limiting plate 48 , and a through hole is formed on the limiting plate 48 for the second push block 50 to pass through.

[0031] The first cylinder 51 and the second cylinder 52 are respectively installed on the inner wall of the upper material box 31 and the lower material box 32 or on the limiting plate 48.

[0032] The two first cylinders 51 are respectively arranged on the outside of the two ends of the chip material tray 300, and the first push block 49 is an L-shaped push block. The vertical part of this L-shaped push block is connected to the piston rod of the first cylinder 51, and the horizontal part is located on the outside of the two ends of the long side of the uppermost chip material tray 300. The inner walls of the upper box 31 and the lower box 32 are provided with avoidance holes for the horizontal part of the L-shaped push block to be embedded.

[0033] The first direction and the second direction intersect perpendicularly, and their intersection coincides with the center of gravity of the test component.

[0034] The first support plate 2 and the second support plate 3 are both marble support plates.

[0035] A rotating motor 53 and a wiring slip ring 54 for driving the rotating parts to rotate are installed on the fixed parts of the first turntable 51 and the second turntable 52 respectively. The first turntable, the second turntable, the rotating motor and the wiring slip ring are all purchased from outside and belong to the scope of the prior art, and will not be described in detail in this application.

[0036] The pressing head 11 is an elastic pressing head.

[0037] The pressure head 11 is a polyurethane pressure head.

[0038] The upper ends of the piston rods of the four vertical cylinders 12 are connected to the four corners of the lower surface of the pressing plate 10 respectively.

[0039] The two lateral cylinders 13 are respectively installed on the outer sides of both ends of the pressing plate 10 .

[0040] The two movable plates 14 correspondingly connected to the piston rods of the two transverse cylinders 13 are each slidably mounted on the lower surface of the test plate 7 via at least one set of slide rails 141 and sliders 142 .

[0041] Embodiment 2 A MEMS chip testing device comprises: a frame 100 and a hopper assembly, a loading and unloading assembly, and a testing assembly respectively mounted on the frame 100, wherein the loading and unloading assembly comprises: an X-axis driving module 21, a Y-axis driving module 22 movably mounted on the X-axis driving module 21, a Z-axis driving module 23 movably mounted on the Y-axis driving module 22, and a plurality of suction nozzles 24 for picking up the chip 200, wherein the vertically arranged suction nozzles 24 are movably mounted on the Z-axis driving module 23, and the hopper assembly comprises at least one loading box 31 and at least two unloading boxes 32, wherein the loading box 31 and the unloading box 32 are both provided with a plurality of chip trays 3 arranged in a vertical direction. 00, the test assembly arranged on one side of the silo assembly and located below the loading and unloading assembly comprises: a marble substrate 1 horizontally mounted on a frame 100, a first support plate 2 vertically mounted on the upper surface of the marble substrate 1, a second support plate 3 and a test carrier plate 4 arranged between the first support plate 2 and the second support plate 3, the test carrier plate 4 is mounted on a rotating portion of a first turntable 51 that can rotate around a first direction, the fixed portion of the first turntable 51 is mounted on a rotating base 6, the other end of the rotating base 6 rotatably connected to the first support plate 2 is mounted on a rotating portion of a second turntable 52 that can rotate around a second direction, and the fixed portion of the second turntable 52 is mounted on the second support plate 3; A test board 7 for communicating with a host computer and a chip carrier 8 electrically connected to the test board 7 are arranged in sequence above the test carrier 4. The chip carrier 8 is provided with a plurality of chip seats 9 on the upper surface opposite to the test board 7. A pressure plate 10 arranged above the chip carrier 8 has a plurality of pressure heads 11 corresponding to the chip seats 9 on the lower surface. The plurality of pressure heads 11 are arranged to form at least two pressure head rows. The plurality of pressure heads 11 in each pressure head row are arranged at intervals along the X direction. A strip extending along the X direction is provided on the upper surface of the pressure plate 10 and located between any two adjacent pressure head rows. Through hole 15, the upper surface of the test carrier 4 is equipped with at least one horizontal cylinder 13 which can be extended and retracted along the Y direction perpendicular to the X direction, and a movable plate 14 connected to the piston rod of the horizontal cylinder 13 is slidably arranged above the test carrier 4, and at least two vertical cylinders 12 are installed on the movable plate 14, and the piston rod of each vertical cylinder 12 is connected to the pressure plate 10. When the pressure head 11 on the pressure plate 10 moves to the top of the chip seat 9 with the horizontal cylinder 13 and the piston rod of the vertical cylinder 12 is in a retracted state, the pressure head 11 is in compression contact with the chip 200 in the chip seat 9.

[0042] The above-mentioned silo assembly also includes: a bottom substrate 33 and a plurality of partitions 34 installed at intervals on the upper surface of the bottom substrate 33, and a silo area 35 is formed between adjacent partitions 34 and the bottom substrate 33 for the upper material box 31 or the lower material box 32 to be embedded. The bottom surface of each of the above-mentioned upper material box 31 and lower material box 32 is slidably connected to the upper surface of the bottom substrate 33 in the corresponding silo area 35 through at least one set of silo slide rails 361 and silo sliders 362.

[0043] A baffle 37 is connected between one end of each of the partitions 34 close to the test assembly, and at least two sets of mutually cooperating guide columns 371 and guide sleeves 372 are arranged between each of the upper material box 31, the lower material box 32 and the baffle 37.

[0044] The pressure head 11 is a silicone pressure head.

[0045] First, the piston rods of the vertical cylinder and the horizontal cylinder of the test assembly are placed in the first state, so that the pressure head moving with the vertical cylinder is away from the chip seat in the vertical direction, and the strip through hole on the pressure plate moving with the horizontal cylinder is moved to the top of the chip seat, so as to facilitate the chip to be placed in the chip seat; The nozzle of the loading and unloading assembly is used to pick up the chip tray on the top layer from the loading box of the silo assembly to pick up the chip to be tested, and then the chip to be tested is moved to the chip seat of the test assembly through the combined movement of the X-axis, Y-axis and Z-axis in the loading and unloading assembly; When picking up the chips to be tested in the loading box, the distance between adjacent variable-pitch sliders on the variable-pitch module is consistent with the distance between adjacent chips in the loading box. Before placing the chips to be tested on the suction nozzle into the chip seat of the test component, the distance between adjacent variable-pitch sliders is adjusted by the variable-pitch module to make it consistent with the distance between adjacent chip seats, so that the chips to be tested on each suction nozzle can be placed into the chip seat at the same time. The distance between the suction nozzles is adjusted by the variable-pitch module to compensate for the chip position difference between the silo component and the test component, thereby improving the chip transportation efficiency and test efficiency. The variable-pitch module is purchased from outside and belongs to the scope of the prior art, which will not be described in detail here. Switch the piston rods of the horizontal cylinder and the vertical cylinder of the test assembly from the first state to the second state, so that the pressure head array on the pressure plate moving with the horizontal cylinder moves to the top of the chip to be tested in the chip seat, and the pressure head moving with the vertical cylinder approaches the chip seat in the vertical direction and presses the chip to be tested; The first rotating disk and the second rotating disk are driven to rotate by a rotating motor, thereby driving the chip to be tested in the chip holder to rotate in two directions. During this process, the performance of the chip is tested, and the chip is graded according to the test results. The specific test process, test software, etc. do not belong to the invention of this application and will not be described here. After the test is completed, the first turntable and the second turntable are reset, and the piston rods of the vertical cylinder and the horizontal cylinder of the test assembly are switched from the second state to the first state again, so that the pressure head moving with the vertical cylinder is away from the chip seat in the vertical direction, and the strip through hole on the pressure plate moving with the horizontal cylinder is moved to the top of the chip seat, so as to pick up the chips that have been tested in the chip seat and put the next batch of chips to be tested into the chip seat; The tested chip is picked up from the chip holder by the suction nozzle of the loading and unloading assembly, and then the tested chip is moved to the top of the silo assembly by the combined movement of the X, Y and Z axes in the loading and unloading assembly. According to the grade classification of the chips obtained during the test, the chips of different grades are placed in the chip trays in different unloading boxes, for example, the chips of grade A are placed in the chip tray in the A unloading box, and the chips of grade B are placed in the chip tray in the B unloading box. When a chip that has been tested needs to be placed in the chip tray in the corresponding unloading box, the suction nozzle that picks up the tested chip is first moved to the top of the corresponding chip tray by the combined movement of the X, Y and Z axes, and then the suction nozzle is further driven downward by the blade cylinder to place the chip in the corresponding chip tray. During this process, the chips on the other suction nozzles will not be adversely interfered and collided or fallen off. After all the tested chips in the test assembly are moved to the chip tray in the unloading box, the nozzle of the upper and lower material assembly is used to pick up the chip tray on the top layer from the upper and lower material assembly to pick up the chip to be tested. Then, the chip to be tested is moved to the chip holder of the test assembly through the combined movement of the X, Y and Z axes in the upper and lower material assembly to carry out the next round of testing, and the process is repeated in sequence. When all the chips to be tested in the chip tray on the top layer in the loading box of the silo assembly are picked up, the Z axis of the upper and lower material assembly is moved to the high position, and then the adsorption plate is moved to the top of the empty chip tray through the combined movement of the upper and lower material assembly in the X and Y directions, and then the piston rod of the contraction cylinder is placed in an extended state so that the lower surface of the adsorption plate fits the upper surface of the empty chip tray, and the vacuum pump or vacuum generator is started to adsorb the empty chip tray, and then the empty chip tray is transported to the stacking place of the empty trays through the combined movement of the upper and lower material assembly in the X and Y directions; Next, the motor drives the top plate to move up, so that the chip tray stacked on the upper surface of the top plate and containing the chips to be tested moves up to fill the position, and the chip tray on the top layer moves to the loading position; then the first cylinder and the second cylinder are started to drive the first push block and the second push block to position the chip tray on the top layer from two directions, thereby improving the position accuracy of the chip tray on the top layer, and then improving the accuracy of subsequent chip loading.

[0046] When the above-mentioned MEMS chip testing equipment is used, it can not only realize stable pressing and holding of each chip through the pressure head during the test and perform dual-axis multi-angle rotation of multiple chips, thereby realizing batch testing of multiple chips, but also ensure the stability and consistency of the force applied to the chip during the entire test process, and can also quickly take and place the chip in the chip holder through the bar-shaped through hole, thereby improving production test efficiency and ensuring test accuracy. It can realize simultaneous picking and transportation of multiple chips between the silo component and the test component, and can also compensate for the chip position difference between the silo component and the test component by adjusting the distance between the suction nozzles, thereby improving the transportation efficiency and testing efficiency of the chips; it can realize independent placement of chips by contracting the blade cylinder without affecting the chips on other suction nozzles; and it can adsorb and transport the chip tray as a whole and avoid interference and damage to the suction nozzles during transportation.

[0047] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with the technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A MEMS chip testing device, comprising: A frame (100) and a silo assembly, a loading and unloading assembly, and a testing assembly respectively mounted on the frame (100), wherein the loading and unloading assembly comprises: an X-axis driving module (21), a Y-axis driving module (22) movably mounted on the X-axis driving module (21), a Z-axis driving module (23) movably mounted on the Y-axis driving module (22), and a plurality of suction nozzles (24) for picking up chips (200), wherein the vertically arranged suction nozzles (24) are movably mounted on the Z-axis driving module (23), and the silo assembly comprises at least one loading box (31) and at least two unloading boxes (32), wherein the loading box (31) and the unloading box (32) are each provided with a plurality of chip trays (300) arranged in a vertical direction, and wherein: The test assembly located on one side of the assembly and below the loading and unloading assembly comprises: a marble base plate (1) mounted horizontally on a frame (100), a first support plate (2) vertically mounted on the upper surface of the marble base plate (1), a second support plate (3) and a test carrier plate (4) arranged between the first support plate (2) and the second support plate (3), wherein the test carrier plate (4) is mounted on a rotating portion of a first turntable (51) that can rotate about a first direction, a fixed portion of the first turntable (51) is mounted on a rotating base (6), one end of the rotating base (6) rotatably connected to the first support plate (2) is mounted on a rotating portion of a second turntable (52) that can rotate about a second direction, and a fixed portion of the second turntable (52) is mounted on the second support plate (3); A test board (7) communicating with a host computer and a chip carrier (8) electrically connected to the test board (7) are arranged in sequence above the test carrier (4); a plurality of chip seats (9) are arranged on the upper surface of the chip carrier (8) opposite to the test board (7); a plurality of pressure heads (11) corresponding to the chip seats (9) are arranged on the lower surface of a pressure plate (10) arranged above the chip carrier (8); the plurality of pressure heads (11) are arranged to form at least two pressure head rows; the plurality of pressure heads (11) in each pressure head row are arranged at intervals along the X direction; a strip-shaped through hole (11) extending along the X direction is provided on the upper surface of the pressure plate (10) and between any two adjacent pressure head rows. 5), at least one transverse cylinder (13) which can be extended and retracted in a Y direction perpendicular to an X direction is installed on the upper surface of the test carrier (4), a movable plate (14) connected to the piston rod of the transverse cylinder (13) is slidably arranged above the test carrier (4), at least two vertical cylinders (12) are installed on the movable plate (14), and the piston rod of each vertical cylinder (12) is connected to the pressure plate (10), when the pressure head (11) on the pressure plate (10) moves to the top of the chip seat (9) with the transverse cylinder (13) and the piston rod of the vertical cylinder (12) is in a retracted state, the pressure head (11) is in compression contact with the chip (200) in the chip seat (9).

2. The MEMS chip testing device according to claim 1, characterized in that: One surface of a movable carrier (25) movable in a vertical direction is mounted on a Z-axis driving module (23); a pitch-changing module (26) is mounted on the other surface of the movable carrier (25); a support bar (27) is mounted on each pitch-changing slider (261) of the pitch-changing module (26); and a suction nozzle (24) is mounted on the lower end of each support bar (27) whose upper end is connected to the pitch-changing slider (261).

3. The MEMS chip testing device according to claim 2, characterized in that: A blade cylinder (28) is mounted on the lower end of each support bar (27), and the upper end of each suction nozzle (24) is connected to the corresponding blade cylinder (28).

4. The MEMS chip testing device according to claim 2 or 3, characterized in that: A vertically arranged contraction cylinder (29) is also mounted on the movable carrier plate (25); the lower end of the piston rod of the contraction cylinder (29) is connected to a horizontally arranged adsorption plate (30); a plurality of adsorption holes (301) provided on the lower surface of the adsorption plate (30) are connected to a vacuum pump or a vacuum generator through a pipeline; when the piston rod of the contraction cylinder (29) is in an extended state, the lower surface of the adsorption plate (30) is lower than the lower end surface of the suction nozzle (24).

5. The MEMS chip testing device according to claim 2, characterized in that: A visual support (221) is installed on the Y-axis driving module (22) and located on one side of the Z-axis driving module (23); a camera (222) and a light source (223) located directly below the camera (222) are installed on the surface of the visual support (221) that is movable along the Y direction and is opposite to the driving module (22).

6. The MEMS chip testing device according to claim 1, characterized in that: The silo assembly further comprises: a bottom substrate (33) and a plurality of partitions (34) installed at intervals on the upper surface of the bottom substrate (33); a silo area (35) for embedding a top silo (31) or a bottom silo (32) is formed between adjacent partitions (34) and the bottom substrate (33); the bottom surface of each top silo (31) or bottom silo (32) and the upper surface of the bottom substrate (33) in the corresponding silo area (35) are slidably connected via at least one set of silo slide rails (361) and silo sliders (362).

7. The MEMS chip testing device according to claim 7, characterized in that: A baffle (37) is connected between one end of each of the plurality of partitions (34) close to the test assembly, and at least two sets of mutually cooperating guide columns (371) and guide sleeves (372) are provided between each of the upper material box (31), the lower material box (32) and the baffle (37).

8. The MEMS chip testing device according to claim 1, characterized in that: The first direction intersects the second direction perpendicularly, and the intersection thereof coincides with the center of gravity of the test component.

9. The MEMS chip testing device according to claim 1, characterized in that: A rotating motor and a routing slip ring for driving the rotating parts thereof to rotate are installed on the fixed parts of the first rotating disk and the second rotating disk respectively.

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