Wafer processing equipment

Abstract

The invention relates to wafer processing equipment. Comprising a process processing area which is provided with a relatively closed processing cavity, and the processing cavity comprises at least one processing unit and an operation space which is arranged above the processing unit and used for wafer movement; the suction unit is adjacently arranged on the first side of the process treatment area; a plurality of air duct holes communicated with the suction unit and the treatment cavity are formed in the side wall of the first side of the treatment cavity; the first side is any side of the process treatment area; the air supply unit is adjacently arranged on the second side of the process treatment area, and the second side is any side except the first side; an air inlet communicated with the air supply unit is formed in the side wall of the second side of the treatment cavity, or an air supply nozzle of the air supply unit penetrates through the side wall of the second side and enters the treatment cavity; the transfer unit is used for clamping the wafer to move in the operation space, so that the wafer enters and exits from the processing unit to be processed; the suction unit and the air supply unit are respectively provided with a trigger switch for working, and the trigger switches are triggered to start working under the condition that the wafer is ready to enter the processing unit. According to the technical scheme, retention of volatile gas in the equipment can be greatly reduced.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing, and in particular to a wafer processing device. Background Art

[0002] In the manufacturing process of semiconductor devices, wafer cleaning is a key step. In the cleaning process area, the wafer undergoes a series of cleaning and processing steps to remove surface contaminants and impurities.

[0003] However, in actual production, it is often the case that wafers are not clean enough or are even contaminated after being processed by cleaning equipment. Summary of the invention

[0004] In view of this, the present application provides a wafer processing device to solve at least one problem existing in the background technology.

[0005] To achieve the above purpose, the technical solution of this application is implemented as follows:

[0006] The present application provides a wafer processing device, including:

[0007] A process processing area, having a relatively closed processing chamber, wherein the processing chamber includes a plurality of processing units and an operating space for wafer movement above the processing units;

[0008] A transfer unit configured to transfer the wafer between a plurality of processing units in the operation space in a manner that the wafer surface is parallel to the gravity direction, and process the wafer in the processing units;

[0009] A suction unit is arranged on a first side of the process area; a plurality of air duct holes connecting the suction unit and the process chamber are opened on a side wall of the first side of the process chamber;

[0010] An air supply unit is arranged on the second side of the process area, and the flow direction of the gas delivered from the air supply unit is parallel to the wafer surface in the operation space and perpendicular to the direction in which the multiple processing units are arranged; the processing chamber is provided with an air inlet connected to the air supply unit on the side wall of the second side, or the air supply nozzle of the air supply unit passes through the side wall of the second side and enters the processing chamber;

[0011] A control unit controls the suction unit and the air supply unit to work simultaneously.

[0012] Optionally, the processing chamber includes at least a first area and a second area, each of the first area and the second area is allocated with at least one of the processing units, and each of the first area and the second area is independently configured with the suction unit and the air supply unit.

[0013] Optionally, the liquid medicine in the processing unit in the first area is different from the liquid medicine in the processing unit in the second area.

[0014] Optionally, the air duct hole is in a circular or oval shape.

[0015] Optionally, the diameter of the air duct hole is 0.5mm-2mm.

[0016] Optionally, the porosity of the side wall of the first side is 20%-40%, and the porosity is the ratio of the total hole area of ​​the plurality of air duct holes to the surface area of ​​the side wall of the first side.

[0017] Optionally, the suction unit comprises a wind tube having an air duct, and gas flows into the wind tube from a plurality of the air duct holes;

[0018] An adjusting plate capable of adjusting the cross-sectional area of ​​the air duct is arranged in the air cylinder.

[0019] Optionally, two ends of the adjustment plate are respectively hinged on opposite side walls of the air cylinder to adjust the cross-sectional area of ​​the air duct by rotation.

[0020] Optionally, the suction unit further comprises a gas-liquid separation box, which is located at the bottom of the wind cylinder; an inner cavity of the gas-liquid separation box is connected to both the air duct and the processing unit.

[0021] Optionally, the second side is a side of the top of the process treatment area; the gas supply unit delivers the preset gas into the treatment chamber from top to bottom;

[0022] The preset gas is clean gas that has been filtered.

[0023] Compared with the prior art, the beneficial effects of the present application are as follows: by arranging a suction unit on one side of the processing chamber and opening a plurality of air duct holes on the side wall of the processing chamber, the volatile gas generated by the liquid medicine in the processing unit in the processing chamber can be sucked away by the suction unit from the plurality of air duct holes; in addition, by arranging an air supply unit, the clean gas delivered by the air supply unit can be replaced with the volatile gas in the processing chamber, and the cooperation between the air supply unit and the suction unit enables the gas in the processing chamber to form a specific airflow direction, so as to achieve the effect of guiding the discharge of the volatile gas, so that the volatile gas can be sucked away faster, and the accumulation of the volatile gas in the local area is reduced;

[0024] On the other hand, the flow direction of the gas delivered by the gas delivery unit is parallel to the wafer in the operating space and perpendicular to the direction in which the multiple processing units are arranged. This ensures that regardless of whether the chemical solutions in the multiple processing units are the same, the gas environment around any two processing units is relatively independent and will not mix.

[0025] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0027] Figure 1 A schematic diagram of a wafer processing device provided in an embodiment of the present application;

[0028] Figure 2 for Figure 1 Schematic diagram of the projection in the back direction;

[0029] Figure 3 A schematic cross-sectional view of a wafer processing device provided in an embodiment of the present application;

[0030] Figure 4 A schematic diagram of a process processing area and a suction unit in a wafer processing device provided in an embodiment of the present application;

[0031] Figure 5 A schematic diagram of an air cylinder in a wafer processing device provided in an embodiment of the present application.

[0032] Description of reference numerals:

[0033] 10. Processing area; 11. Processing unit; 12. Air duct hole; 20. Suction unit; 21. Air cylinder; 211. Adjustment plate; 22. Gas-liquid separation box; 30. Air supply unit; 40. Transfer unit; 50. Loading unit; 60. Unloading unit. DETAILED DESCRIPTION

[0034] In order to make the technical solutions and beneficial effects of the present application more obvious and easy to understand, the following is a detailed description by listing specific embodiments. The drawings are not necessarily drawn to scale, and local features may be enlarged or reduced to more clearly show the details of the local features; unless otherwise defined, the technical and scientific terms used herein have the same meanings as those in the technical field to which the present application belongs.

[0035] In the description of the present application, terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "height", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of simplified description of the present application, and do not indicate that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and should not be understood as a limitation on the present application.

[0036] In this application, the terms "first" and "second" are used only for the purpose of clear description and should not be understood as the relative importance of the indicated features or the number of the indicated technical features. Therefore, the features defined as "first" and "second" can explicitly include at least one of the features. In the description of this application, "multiple" means at least two, such as two, three, etc.; "several" means at least one, such as one, two, three, etc., unless otherwise clearly and specifically defined.

[0037] In this application, unless otherwise clearly defined, the terms "install", "connect", "connect", "fix", "set", etc. should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0038] In the present application, unless otherwise clearly defined, a first feature being “on”, “above”, “above”, “below”, “below”, “below” or “below” a second feature may mean that the first feature is in direct contact with the second feature, or the first feature and the second feature are in indirect contact with each other through an intermediate medium. Moreover, a first feature being “on”, “above” or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the horizontal height of the first feature is higher than the horizontal height of the second feature. A first feature being “below”, “below” or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the horizontal height of the first feature is lower than the horizontal height of the second feature.

[0039] In order to thoroughly understand the present application, detailed steps and detailed structures will be presented in the following description to illustrate the technical solution of the present application. The preferred embodiments of the present application are described in detail below, but in addition to these detailed descriptions, the present application may also have other implementation methods.

[0040] The applicant of the present application discovered during research and development that the process processing area 10 of the wafer cleaning and processing equipment is provided with a plurality of processing units, and each processing unit is provided with different liquids, such as acids, alkalis or other solvents, so as to use a variety of liquids to comprehensively clean the wafers. However, the liquid used for cleaning may contain volatile components, and the volatilized gases of these liquids will be retained in the cleaning and processing area, which may cause secondary contamination of the wafers after cleaning, resulting in poor cleanliness of the wafers after cleaning or other defects. Moreover, after these gases accumulate for a long time, there is also a risk of flowing to various areas of the equipment, corroding the cleaning and processing equipment, and reducing the service life of the cleaning and processing equipment.

[0041] Therefore, after further research and development by the applicant, the following technical solution was proposed.

[0042] The present application embodiment provides a wafer processing device. Figure 1 and Figure 2 , the wafer processing equipment comprises:

[0043] The process treatment area 10 has a relatively closed processing chamber, wherein the processing chamber includes at least one processing unit 11 and an operating space for wafer movement above the processing unit 11;

[0044] The transfer unit 40 is configured to transfer the wafer between the plurality of processing units 11 in the operation space in a manner that the wafer surface is parallel to the gravity direction, and process the wafer in the processing unit 11, that is, to transfer the wafer between the operation space and the plurality of processing units 11 in a vertical manner;

[0045] A suction unit 20 is disposed on a first side of the process area 10; a plurality of air duct holes 12 are provided on a side wall of the first side of the process chamber, connecting the suction unit 20 and the process chamber;

[0046] The gas supply unit 30 is arranged on the second side of the process area 10; the flow direction of the gas delivered from the gas supply unit 30 is parallel to the wafer surface in the operation space and perpendicular to the direction in which the multiple processing units 11 are arranged; the processing chamber is provided with an air inlet connected to the gas supply unit 30 on the side wall of the second side, or the gas supply nozzle of the gas supply unit 30 passes through the side wall of the second side and enters the processing chamber;

[0047] The control unit controls the suction unit 20 and the air supply unit 30 to work simultaneously.

[0048] It can be understood that the processing unit 11 mainly contains liquid for cleaning wafers, and liquid for other processing can also be provided.

[0049] Specifically, the liquid medicine mainly includes hydrofluoric acid liquid medicine, ammonia water mixed liquid alkaline liquid medicine, hydrochloric acid mixed liquid acid liquid and other chemical agents.

[0050] It can be understood that the operating space is configured for wafers to enter the processing unit 11 or move from one processing unit 11 to another processing unit 11 .

[0051] The suction unit 20 and the air supply unit 30 are both adjacently arranged in the process treatment area 10, so that the suction unit 20 can more efficiently suck the volatile gas generated by the volatilization of the liquid in the process treatment area 10. It is also beneficial for the air supply unit 30 to more efficiently replace the volatile gas. In addition, in order to prevent interference between the two, the positions of the suction unit 20 and the air supply unit 30 need to be staggered. Therefore, one is arranged on the first side and the other is arranged on the second side.

[0052] It can be understood that by arranging the suction unit 20 and the processing chamber on the first side, a plurality of air duct holes 12 connecting the suction unit 20 and the processing chamber are opened on the side wall of the first side, and an air supply unit 30 is arranged on the second side, so that the clean gas sent out by the air supply unit 30 replaces the volatile gas in the processing chamber, so that the volatile gas can be discharged by the suction unit 20 after passing through the plurality of air duct holes 12, and the cooperation between the air supply unit 30 and the suction unit 20 makes the gas in the processing chamber form a specific airflow direction, so as to achieve the effect of guiding the discharge of the volatile gas, so that the volatile gas can be drawn away faster, and the accumulation of the volatile gas in the local area is reduced. In addition, the air supply unit 30 delivers clean gas toward the process treatment area 10, which can balance the negative pressure generated by the suction unit 20, and prevent the negative pressure generated in the process treatment area 10, which causes the outside air to flow in abnormally through various gaps, thereby maintaining the pressure in the process treatment area 10 stable.

[0053] On the other hand, the flow direction of the gas delivered from the gas delivery unit 30 is parallel to the wafer surface of the wafer in the operating space and perpendicular to the arrangement direction of the multiple processing units 11, so that no matter whether the liquid medicine in the multiple processing units 11 is the same, the gas environment around any two processing units 11 is relatively independent and will not mix, which is convenient for subsequent gas processing. It can be understood that the gas delivery unit 30 is set at the top or the opposite side of the suction unit 20.

[0054] In this embodiment, the second side is one side of the top of the process treatment area 10, that is, the air supply unit 30 is set at the top; the air supply unit 30 delivers the preset gas into the treatment chamber from top to bottom; the preset gas is a clean gas that has been filtered. By setting the air supply unit 30 at the top of the process treatment area 10, the air flow is more reasonable, and the air blowing vertically downward from the top can directly act on the surface of the treatment unit 11, forming a downward pressure airflow for the gas generated by the liquid medicine in the treatment unit 11, which helps the suction unit 20 on one side to quickly discharge the gas and improve the gas discharge efficiency. Moreover, the air supply unit 30 is set at the top of the process treatment area 10, which does not occupy horizontal space.

[0055] The control unit controls the suction unit 20 and the air supply unit 30 to work simultaneously because, if the suction unit 20 works before the air supply unit 30, negative pressure will be generated in the process treatment area 10, causing external unfiltered air to flow in abnormally from the gaps, causing pollution; if the air supply unit 30 works before the suction unit 20, the volatile gases generated by the various processing units 11 in the process treatment area 10 will mix with each other due to the lack of negative pressure guidance.

[0056] Specifically, the air supply unit 30 may include a fan filter unit (FFU, Fan Filter Unit).

[0057] It can be understood that simultaneous operation can include: the time difference between the two starting to work is within a preset range, for example, the time difference is within 1 second. Because of the control accuracy or the working characteristics of each component, for example, the start-up time of the suction unit 20 and the air supply unit 30 may be different, for example, one starts fast and the other starts slowly. Even if the control unit has made corresponding settings according to the start-up speed, such as delayed start of the fast start, it still cannot guarantee that they work completely simultaneously. Therefore, whether it is the setting of the control unit or the actual operation, if the time difference between the two starting to work is within the preset range, the impact on the operation of the entire device is very small, and it can still be considered to be working simultaneously.

[0058] Further, the processing chamber includes at least a first area and a second area, each of which is assigned at least one of the processing units 11, and each of the first area and the second area is independently configured with the suction unit 20 and the air supply unit 30. The liquid medicine in the processing unit 11 in the first area is different from the liquid medicine in the processing unit 11 in the second area. In this embodiment, the liquid medicine in the processing unit 11 in the first area is a hydrofluoric acid acid liquid, and the liquid medicine in the processing unit 11 in the first area is an alkaline liquid medicine of ammonia water mixture. By dividing the processing chamber into different areas, and each area is configured with a separate suction unit 20 and air supply unit 30, the gas exhaust efficiency is further improved, and the exhaust path of the gas generated by different types of liquid medicine is optimized, and they will not mix with each other. In other embodiments, a third area, a fourth area, etc. can also be provided, and the third area and the fourth area are also configured with separate suction units 20 and air supply units 30, so as to carry out directional exhaust of different volatile gases. The division of the areas is not specifically limited here, and can be specifically set according to the type of liquid medicine.

[0059] Furthermore, in the present embodiment, there is no obstruction between the first area and the second area, that is, the first area and the second area are interconnected, so as to reduce the opening and closing of the baffle plate and the waiting and proceeding of the transfer unit 40 for clamping the wafer when the wafer flows between the first area and the second area, thereby simplifying the movement path of the entire wafer.

[0060] In some other embodiments of the present application, the air duct hole 12 is in a circular or oval shape.

[0061] The inventor has experimentally found that, compared with other shapes, the circular or oval-shaped air duct holes 12 have smaller air flow resistance, which is beneficial to improving the suction efficiency of the suction unit 20 .

[0062] In some other embodiments of the present application, the diameter of the air duct hole 12 is 0.5 mm-2 mm.

[0063] The inventors have found through experiments that the aperture of the air duct hole 12 adopts the above size, which can improve the suction efficiency, for example, make the airflow velocity and flow rate more ideal. It can also make the suction airflow more stable, and the airflow in more areas can be stably sucked, the suction is more comprehensive, and the suction dead angle is reduced. In addition, the above aperture can also reduce the impact on the cleaning of the wafer.

[0064] In some other embodiments of the present application, the porosity of the side wall of the first side is 20%-40%, and the porosity is the ratio of the sum of the hole areas of the plurality of air duct holes 12 to the surface area of ​​the side wall of the first side.

[0065] The inventors have found through experiments that the porosity ratios mentioned above can also improve the suction efficiency, for example, making the airflow velocity and flow rate more ideal. It can also make the suction airflow more stable, so that the airflow in more areas is stably sucked, the suction is more comprehensive, and the suction dead angle is reduced. In addition, the above porosity can also reduce the impact on the cleaning of the wafer and maintain the strength of the side wall of the process area 10 where the air duct hole 12 is opened.

[0066] It can be understood that the aperture of the air duct hole 12 and the porosity of the side wall are parameters that influence each other and therefore need to cooperate with each other.

[0067] When the porosity of the sidewall is constant, an excessively large pore size will result in a lower airflow velocity, and the distribution of the airflow in the closed processing chamber may become uneven, especially in areas far from the sidewalls, where airflow stagnation or retention may occur in local areas, and the airflow cannot be effectively discharged. Long-term airflow retention may cause the gas quality of the processing unit 11 far from the sidewall to deteriorate, thereby adversely affecting the cleanliness of the wafer.

[0068] In addition, unstable airflow may also generate vortices, causing particles carried by volatile gases in the liquid medicine pool to be trapped in the vortex area, thereby causing secondary contamination to the wafer surface.

[0069] When the porosity of the side wall is constant and the aperture is too small, the resistance of the airflow through the side wall will increase significantly. Large wind resistance will limit the passage of airflow, causing the pressure difference between the closed processing chamber and the external negative pressure area to become too large, thereby affecting the operation of the FFU and making it impossible to maintain the designed FFU flow rate. In addition, the speed of the airflow through the hole will increase significantly, and turbulence or turbulence is likely to occur at the orifice. As the airflow becomes unstable, the airflow in the closed processing chamber may be unevenly distributed, and the clean gas blown out by the FFU is attracted to the side wall before it reaches the vicinity of the processing unit 11, resulting in insufficient fresh air replenishment near the processing unit 11, and particles may accumulate near the liquid medicine pool, which may affect the cleanliness of the wafer after long-term operation.

[0070] When the pore size is constant and the porosity is too large, the resistance of the gas passing through the air duct hole 12 is significantly reduced, and the airflow can pass through the side wall more easily. This will cause the gas flow rate to decrease, and sufficient gas flow cannot be formed. The area far from the side wall may experience air stagnation or uneven flow rate, and the gas may not circulate effectively, and the volatile gas or pollutants cannot be discharged in time.

[0071] When the aperture is constant and the porosity is too small, the small porosity means that the proportion of the air duct holes 12 per unit area is low. Although the gas flow rate through the air duct holes 12 will increase, turbulence and turbulence are easily formed near the hole mouth; in addition, since the upper wall surface of the entire side wall accounts for a large proportion, the gas flow rate is unevenly distributed on the entire side wall surface, and it is even easy to generate eddies near the side wall, affecting the discharge of volatile gases and pollutants in the area.

[0072] In other embodiments of the present application, reference Figure 3-Figure 5 The suction unit 20 includes a wind tube 21 having an air duct, and an adjusting plate 211 capable of adjusting the cross-sectional area of ​​the air duct is arranged in the wind tube 21 to adjust the air volume or wind speed of the suction unit 20.

[0073] In this way, the air volume or wind speed of the suction unit 20 can be adjusted according to the type and amount of the volatile gas or other actual conditions.

[0074] Specifically, the air cylinder 21 may be cylindrical, that is, the air duct is a cylindrical inner cavity, which is helpful to reduce resistance and enables the gas to be discharged from the air cylinder 21 more smoothly.

[0075] It can be understood that the suction unit 20 may further include a vacuum pump, which is used to form a negative pressure state in the air duct.

[0076] In other embodiments of the present application, reference Figure 3 and Figure 5 The two ends of the adjustment plate 211 are respectively hinged on the opposite side walls of the air cylinder 21 to adjust the cross-sectional area of ​​the air duct by rotation.

[0077] In this way, the adjustment is more convenient, the structure is simple and reliable.

[0078] Specifically, a power component may be provided to drive the regulating plate 211, and the power component may be a motor. The power component may be communicatively connected to a control system of a wafer processing device to drive the regulating plate 211 by receiving instructions from the control system, thereby better regulating the flow rate in the air cylinder 21.

[0079] In other embodiments of the present application, reference Figure 3 and Figure 5 The suction unit 20 further includes a gas-liquid separation box 22, which is located at the bottom of the air cylinder 21; the inner cavity of the gas-liquid separation box 22 is connected to the air duct and the processing unit.

[0080] In this way, the liquid generated by the liquefaction of the volatile gas flowing out of the processing unit and entering the air duct can be collected, reducing the impact of the accumulation of liquid on the air duct. A discharge channel can also be provided for the liquid entering the air duct in the processing unit. In some cases, the liquid in the processing unit may directly enter the air duct.

[0081] Specifically, the wafer processing equipment may also include:

[0082] The loading unit 50 is used to transport the wafers to the process area 10 for cleaning and other treatments;

[0083] The unloading unit 60 is used to transport the wafers out of the process area 10 to enter the next process.

[0084] Specifically, the transfer unit 40 can be used for both transportation and shipping out.

[0085] It should be understood that the above embodiments are exemplary and are not intended to include all possible implementations included in the claims. Various modifications and changes may be made on the basis of the above embodiments without departing from the scope disclosed in the present application. Similarly, the various technical features of the above embodiments may be arbitrarily combined to form other embodiments of the present application that may not be explicitly described. Therefore, the above embodiments only express several implementations of the present application and do not limit the scope of protection of the patent of this application.

Claims

1. A wafer processing device, characterized in that: include: A process processing area, having a relatively closed processing chamber, wherein the processing chamber includes a plurality of processing units and an operating space for wafer movement above the processing units; A transfer unit configured to transfer the wafer between a plurality of processing units in the operation space in a manner that the wafer surface is parallel to the gravity direction, and process the wafer in the processing units; A suction unit, disposed on a first side of the process treatment area; The processing chamber is provided with a plurality of air duct holes on the side wall of the first side, which are connected with the suction unit and the processing chamber; An air supply unit is arranged on the second side of the process area, and the flow direction of the gas delivered from the air supply unit is parallel to the wafer surface in the operation space and perpendicular to the direction in which the multiple processing units are arranged; the processing chamber is provided with an air inlet connected to the air supply unit on the side wall of the second side, or the air supply nozzle of the air supply unit passes through the side wall of the second side and enters the processing chamber; A control unit controls the suction unit and the air supply unit to work simultaneously.

2. The wafer processing equipment according to claim 1, characterized in that: The processing chamber includes at least a first area and a second area, each of the first area and the second area is allocated with at least one of the processing units, and each of the first area and the second area is independently configured with the suction unit and the gas supply unit.

3. The wafer processing equipment according to claim 2, characterized in that: The liquid medicine in the treatment unit in the first region is different from the liquid medicine in the treatment unit in the second region.

4. The wafer processing equipment according to claim 1, characterized in that: The shape of the air duct hole is circular or oval.

5. The wafer processing equipment according to claim 4, characterized in that: The diameter of the air duct hole is 0.5mm-2mm.

6. The wafer processing equipment according to claim 1, characterized in that: The porosity of the side wall of the first side is 20%-40%, and the porosity is the ratio of the total hole area of ​​the plurality of air duct holes to the surface area of ​​the side wall of the first side.

7. The wafer processing equipment according to claim 6, characterized in that: The suction unit comprises a wind tube having a wind channel, and gas flows into the wind tube from a plurality of the wind channel holes; An adjusting plate capable of adjusting the cross-sectional area of ​​the air duct is arranged in the air cylinder.

8. The wafer processing equipment according to claim 7, characterized in that: The two ends of the adjustment plate are respectively hinged on the opposite side walls of the air cylinder so as to adjust the cross-sectional area of ​​the air duct by rotation.

9. The wafer processing equipment according to claim 7, characterized in that: The suction unit further comprises a gas-liquid separation box, which is located at the bottom of the wind tube; the inner cavity of the gas-liquid separation box is communicated with both the air duct and the processing unit.

10. The wafer processing equipment according to any one of claims 1 to 9, characterized in that: The second side is a side of the top of the process treatment area; the gas supply unit delivers the preset gas into the treatment chamber from top to bottom; The preset gas is clean gas that has been filtered.

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