Deposition module and display device manufacturing apparatus including the same

Abstract

The invention relates to a display device manufacturing apparatus and a deposition module. The display device manufacturing apparatus includes: a mask assembly; and a deposition module configured to provide a deposition material toward the mask assembly. The deposition module includes a deposition frame, an ejection portion, a heater, and an intimate contact portion. The deposition frame has an interior space. And the spraying part comprises a crucible part and a nozzle part. The heater heats the nozzle portion and is configured to be switchable between a first state and a second state, the second state having a higher heat value than the first state. The close contact portion brings the crucible portion and the nozzle portion into close contact with each other, and the close contact portion includes a pressing surface spaced apart from the ejection portion in a first state and configured to press against the ejection portion in a second state.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application is based on and claims the benefit of priority from Korean Patent Application No. 10-2023-0104344 filed in the Korean Intellectual Property Office on August 9, 2023, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] One or more embodiments relate to an apparatus, and more particularly, to a deposition module and a display device manufacturing apparatus. Background Art

[0004] Recently, electronic devices have been widely used. Electronic devices are used in various ways, such as mobile electronic devices and fixed electronic devices. Such electronic devices include display devices that provide visual information such as images or videos to users to support various functions.

[0005] The display device is configured to visually display data and is manufactured by depositing various layers such as organic layers and metal layers. The deposition material can be deposited to form multiple layers of the display device. That is, the deposition material is ejected from a deposition source and deposited on a substrate through a mask assembly.

[0006] The background art is technical information possessed by the inventor for deriving the present disclosure or technical information obtained during deriving the present disclosure, and is not necessarily known technology disclosed to the public before filing the present disclosure. Summary of the invention

[0007] According to an embodiment, a deposition material does not leak through a gap between the crucible part and the nozzle part during a deposition process, and the crucible part is easily separated from the nozzle part when the deposition process is completed.

[0008] However, this is merely an example, and the technical problem to be solved by the present disclosure is not limited thereto.

[0009] Additional aspects will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the presented embodiments of the disclosure.

[0010] According to one or more embodiments, a display device manufacturing apparatus includes: a mask assembly; and a deposition source, including a deposition module, the deposition module being configured to provide a deposition material toward the mask assembly. The deposition module includes a deposition frame, an ejection portion, a heater, and a close contact portion. The deposition frame has an internal space. The ejection portion is accommodated in the internal space and includes a crucible portion and a nozzle portion, the crucible portion being configured to provide a storage space for storing the deposition material, the nozzle portion being connected to the crucible portion and being configured to eject the deposition material stored in the storage space. The heater is accommodated in the internal space to heat the nozzle portion, and is configured to be switchable between a first state and a second state, the heat value of the second state being higher than the heat value of the first state. The close contact portion is accommodated in the internal space so that the crucible portion and the nozzle portion are in close contact with each other, and the close contact portion includes a pressing surface that is spaced apart from the ejection portion in the first state and is configured to press on the ejection portion in the second state.

[0011] In the present embodiment, at least one of the crucible portion and the nozzle portion may have a thermal expansion coefficient higher than that of the close contact portion.

[0012] In the present embodiment, the crucible portion may include a carbon material, and the nozzle portion may include a metal material.

[0013] In the present embodiment, in the first state, the close contact portion may be detachable from the ejection portion.

[0014] In the present embodiment, the crucible portion may include: a first crucible portion configured to store a deposition material and having a longitudinal direction in a first direction toward the nozzle portion; and a second crucible portion protruding from the first crucible portion in a second direction intersecting the first direction. The nozzle portion may include: a first nozzle portion in contact with the crucible portion; and a second nozzle portion configured to discharge the deposition material and protruding from the first nozzle portion in the first direction. The close contact portion may be configured to press on the second crucible portion and the first nozzle portion in the second state.

[0015] In the present embodiment, a first receiving groove may be provided in a lower surface of the second crucible portion, and the first end portion of the close contact portion may be received in the first receiving groove.

[0016] In the present embodiment, the close contact portion may be further configured to be pressed on the upper surface of the first nozzle portion in the second state.

[0017] In the present embodiment, a second receiving groove may be provided in the upper surface of the first nozzle portion, and the second end portion of the close contact portion may be received in the second receiving groove.

[0018] In the present embodiment, a second receiving groove may be provided in a side surface of the first nozzle portion, and a second end portion of the close contact portion may be provided in the second receiving groove and configured to be pressed on the nozzle portion in the second state.

[0019] In the present embodiment, the display device manufacturing apparatus may further include a support portion configured to support the ejection portion from the deposition frame, wherein the close contact portion may be fixed to the support portion and the pressing surface may face one surface of the nozzle portion.

[0020] In this embodiment, the close contact portion may include: a close contact frame fixed to the support portion; and a plurality of pressing portions protruding from the close contact frame toward one surface of the nozzle portion. The plurality of pressing portions include a plurality of pressing surfaces, and the plurality of pressing surfaces of the plurality of pressing portions may be spaced apart from each other.

[0021] In the present embodiment, a separation opening configured to separate at least two of the plurality of pressing portions from each other may be disposed in the close-contact frame.

[0022] In the present embodiment, in the second state, at least two pressing portions among the plurality of pressing portions may have different heights.

[0023] In the present embodiment, the separation opening may include: a first separation opening having a longitudinal direction; and a second separation opening connected to an end portion of the first separation opening and having a circular planar shape.

[0024] In the present embodiment, the crucible portion and the close contact portion may include the same material.

[0025] According to one or more embodiments, the deposition module includes a deposition frame, an injection portion, a heater, and a close contact portion. The deposition frame has an internal space. The injection portion is accommodated in the internal space and includes a crucible portion and a nozzle portion, the crucible portion having a storage space for storing a deposition material, and the nozzle portion is connected to the crucible portion and configured to inject the deposition material stored in the storage space. The heater is accommodated in the internal space to heat the nozzle portion, and is configured to be switchable between a first state and a second state, the heat value of the second state being higher than the heat value of the first state. The close contact portion is accommodated in the internal space of the deposition frame so that the crucible portion and the nozzle portion are in close contact with each other. The close contact portion includes a pressing surface that is spaced apart from the injection portion in the first state and is configured to press on the injection portion in the second state.

[0026] In the present embodiment, at least one of the crucible portion and the nozzle portion may have a thermal expansion coefficient higher than that of the close contact portion.

[0027] In the present embodiment, the crucible portion may include a carbon material, and the nozzle portion may include a metal material.

[0028] In the present embodiment, the close contact portion may be detachable from the ejection portion in the first state.

[0029] In this embodiment, the close contact portion may be provided in the form of a clamp. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The above and other aspects and features of certain embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings.

[0031] Figure 1 is a cross-sectional view showing a display device manufacturing apparatus according to an embodiment.

[0032] Figure 2 is a schematic perspective view of a deposition source according to an embodiment.

[0033] Figure 3 According to the implementation method Figure 2 The line I-I' intercepts Figure 2 Cross-sectional view of a deposition source.

[0034] Figure 4 is a schematic cross-sectional view of a portion of a deposition module in a first state according to an embodiment.

[0035] Figure 5 is a schematic cross-sectional view of a portion of a deposition module in a second state according to an embodiment.

[0036] Figure 6 is a schematic cross-sectional view of a portion of a deposition module in a first state according to an embodiment.

[0037] Figure 7 is a schematic cross-sectional view of a portion of a deposition module in a second state according to an embodiment.

[0038] Figure 8 is a schematic cross-sectional view of a portion of a deposition module in a first state according to an embodiment.

[0039] Fig. 9 is a schematic cross-sectional view of a portion of a deposition module in a second state according to an embodiment.

[0040] Fig.10 is a schematic cross-sectional view of a portion of a deposition module in a first state according to an embodiment.

[0041] Fig.11is a schematic plan view of a close contact portion according to an embodiment.

[0042] Fig.12 is a schematic cross-sectional view of a portion of a deposition module in a second state according to an embodiment.

[0043] Fig.13 is a schematic side view of a portion of a deposition module in a second state according to an embodiment.

[0044] Fig.14 is a plan view schematically showing a display device manufactured by using a display device manufacturing apparatus according to an embodiment.

[0045] Fig.15 is a cross-sectional view schematically showing a display device manufactured by using a display device manufacturing apparatus according to an embodiment.

[0046] Fig.16 is an equivalent circuit diagram of a pixel of a display panel according to an embodiment. DETAILED DESCRIPTION

[0047] Reference will now be made in detail to embodiments, examples of which are shown in the accompanying drawings, wherein the same reference numerals represent the same elements throughout. In this regard, the present embodiments may have different forms and should not be construed as being limited to the descriptions set forth herein. Therefore, embodiments are described below only by reference to the accompanying drawings to explain aspects of this specification. As used herein, the term "and / or" includes any and all combinations of one or more of the relevant listed items. Throughout the disclosure, the expression "at least one of a, b, and c" means only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0048] Since this specification allows various changes and many embodiments, specific embodiments will be shown in the drawings and described in detail in the written description. The effects and features of the present disclosure and methods for achieving them will be explained with reference to the embodiments described in detail below with reference to the drawings. However, the present disclosure is not limited to the following embodiments and can be implemented in various forms.

[0049] Hereinafter, the embodiments will be described in detail with reference to the accompanying drawings. When describing the embodiments with reference to the accompanying drawings, the same or corresponding elements are denoted by the same reference numerals.

[0050] It will be understood that the terms "first", "second", etc. may be used herein to describe various elements, but these elements should not be limited by these terms. These terms are only used to distinguish one element from another.

[0051] As used herein, the singular forms are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0052] It will also be understood that the terms “comprises” and / or “comprising” used herein specify the presence of stated features or elements, but do not preclude the presence or addition of one or more other features or elements.

[0053] It will be further understood that when a layer, region or element is referred to as being “on” another layer, region or element, it can be directly or indirectly on the other layer, region or element. That is, for example, intervening layers, regions or elements may be present.

[0054] In addition, the size of the elements in the drawings may be exaggerated or reduced for convenience of explanation. For example, since the size and thickness of the elements in the drawings are arbitrarily shown for convenience of explanation, the present disclosure is not limited thereto.

[0055] The x-axis, y-axis, and z-axis are not limited to the three axes of the rectangular coordinate system and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other.

[0056] When a specific embodiment can be implemented differently, a specific process order can be performed differently from the described order. For example, two processes described in succession can be performed substantially simultaneously, or in the reverse order of the described order.

[0057] Figure 1 is a cross-sectional view showing a display device manufacturing apparatus 1 according to the embodiment.

[0058] The display device manufacturing apparatus 1 may include a chamber 10 , a first supporting part 20 , a second supporting part 30 , a mask assembly 40 , a deposition source 50 , a magnetic part 60 , a vision part 70 , and a pressure controller 80 .

[0059] A space may be formed within the chamber 10. The display substrate DS and the mask assembly 40 may be accommodated in the chamber 10. A portion of the chamber 10 may be formed as an opening, and a gate valve 11 may be installed in the opening portion of the chamber 10. In this case, the opening portion of the chamber 10 may be opened or closed according to the operation of the gate valve 11.

[0060] The display substrate DS may refer to a substrate 100 (eg, a substrate 100 formed by depositing at least one of an organic layer, an inorganic layer, and a metal layer) in manufacturing a display device to be described below. Fig.15 Alternatively, the display substrate DS may be the substrate 100 on which any one of the organic layer, the inorganic layer, and the metal layer has not been deposited.

[0061] The first supporting portion 20 may support the display substrate DS. The first supporting portion 20 may be in the form of a plate fixed within the chamber 10. In an embodiment, the first supporting portion 20 may be in the form of a shuttle on which the display substrate DS is placed and which can be linearly moved within the chamber 10. In an embodiment, the first supporting portion 20 may include an electrostatic chuck or an adhesive chuck fixed to the chamber 10 or provided in the chamber 10 to be movable within the chamber 10.

[0062] The second supporting part 30 may support the mask assembly 40. The second supporting part 30 may be disposed in the chamber 10. The second supporting part 30 may finely adjust the position of the mask assembly 40. The second supporting part 30 may include a separate driver or aligner (alignment unit) to enable the mask assembly 40 to move in different directions.

[0063] In an embodiment, the second supporting portion 30 may be in the form of a shuttle. In this case, the mask assembly 40 may be placed on the second supporting portion 30, and the second supporting portion 30 may transfer the mask assembly 40. For example, after the mask assembly 40 is placed on the second supporting portion 30, the second supporting portion 30 may be moved to the outside of the chamber 10 or enter the chamber 10 from the outside of the chamber 10.

[0064] At this time, the first support portion 20 and the second support portion 30 may be integrally formed as a single body. In this case, the first support portion 20 and the second support portion 30 may include a movable shuttle. At this time, the first support portion 20 and the second support portion 30 may include a structure for fixing the mask assembly 40 to the display substrate DS (where the display substrate DS is placed on the mask assembly 40), and the display substrate DS and the mask assembly 40 may be linearly moved at the same time.

[0065] However, for convenience of explanation, the following description focuses on a case where the first and second supporting portions 20 and 30 are formed differently from each other and arranged in different positions and a case where the first and second supporting portions 20 and 30 are arranged in the chamber 10 .

[0066] The mask assembly 40 may be disposed in the chamber 10 to face the display substrate DS. The deposition material M may pass through the mask assembly 40 and be deposited on the display substrate DS.

[0067] The deposition source 50 may be arranged to face the mask assembly 40, and may provide the deposition material M so that the deposition material M passes through the deposition region of the mask assembly 40 and is deposited on the display substrate DS. At this time, the deposition source 50 may evaporate or sublimate the deposition material M by applying heat to the deposition material M. The deposition source 50 may be fixedly arranged in the chamber 10, or may be arranged in the chamber 10 to be able to move linearly in one direction.

[0068] The magnetic part 60 may be arranged in the chamber 10 to face the display substrate DS and / or the mask assembly 40. At this time, the magnetic part 60 may apply a magnetic force to the mask assembly 40 so that the mask assembly 40 faces the display substrate DS. Specifically, the magnetic part 60 may prevent the mask assembly 40 from sagging and may allow the mask assembly 40 to be adjacent to the display substrate DS. In addition, the magnetic part 60 may maintain a uniform gap between the mask assembly 40 and the display substrate DS.

[0069] The vision part 70 may be arranged in the chamber 10, and may take an image of the positions of the display substrate DS and the mask assembly 40. At this time, the vision part 70 may include a camera configured to take an image of the display substrate DS and the mask assembly 40. Based on the image taken by the vision part 70, the positions of the display substrate DS and the mask assembly 40 may be determined, and the deformation of the mask assembly 40 may be recognized. In addition, based on the image, the position of the display substrate DS on the first supporting part 20 may be finely adjusted, or the position of the mask assembly 40 on the second supporting part 30 may be finely adjusted. However, the following description will be directed in detail to the case where the positions of the display substrate DS and the mask assembly 40 are aligned by finely adjusting the position of the mask assembly 40 on the second supporting part 30.

[0070] The pressure controller 80 may be connected to the chamber 10 and configured to control the internal pressure of the chamber 10. For example, the pressure controller 80 may adjust the internal pressure of the chamber 10 to be equal to or similar to the atmospheric pressure. In addition, the pressure controller 80 may adjust the internal pressure of the chamber 10 to be equal to or similar to a vacuum state.

[0071] The pressure controller 80 may include a connection pipe 81 connected to the chamber 10 and a pump 82 installed in the connection pipe 81. At this time, according to the operation of the pump 82, external air may be introduced through the connection pipe 81, or the gas in the chamber 10 may be guided to the outside through the connection pipe 81.

[0072] On the other hand, in the method of manufacturing a display device (not shown) by using the display device manufacturing apparatus 1, the display substrate DS may be prepared in advance.

[0073] The pressure controller 80 may maintain the interior of the chamber 10 in a state equal to or similar to the atmospheric pressure, and the gate valve 11 may operate to open the opening portion of the chamber 10 .

[0074] Thereafter, the display substrate DS may be loaded from the outside of the chamber 10 to the inside of the chamber 10. At this time, the display substrate DS may be loaded into the chamber 10 in various ways. For example, the display substrate DS may be inserted from the outside of the chamber 10 to the inside of the chamber 10 by a robot disposed outside the chamber 10. In an embodiment, in the case where the first supporting portion 20 is formed in the form of a shuttle, after the first supporting portion 20 is unloaded from the inside of the chamber 10 to the outside of the chamber 10, the display substrate DS may be placed on the first supporting portion 20 by a separate robot disposed outside the chamber 10, and the first supporting portion 20 may be loaded from the outside of the chamber 10 to the inside of the chamber 10.

[0075] As described above, the mask assembly 40 may be in a state of being arranged in the chamber 10. In an embodiment, the mask assembly 40 may be loaded from the outside of the chamber 10 to the inside of the chamber 10 in the same or similar manner as the display substrate DS.

[0076] When the display substrate DS is loaded into the chamber 10, the display substrate DS may be placed on the first supporting part 20. At this time, the vision part 70 may take an image of the positions of the display substrate DS and the mask assembly 40. The positions of the display substrate DS and the mask assembly 40 may be determined based on the image taken by the vision part 70. At this time, the display device manufacturing apparatus 1 may include a separate controller (not shown) to determine the positions of the display substrate DS and the mask assembly 40.

[0077] Once the positions of the display substrate DS and the mask assembly 40 are determined, the second supporting portion 30 may finely adjust the position of the mask assembly 40 .

[0078] Thereafter, the deposition source 50 may operate to provide the deposition material M to the mask assembly 40, and the deposition material M having passed through the plurality of pattern holes of the mask assembly 40 may be deposited on the display substrate DS. At this time, the deposition source 50 may move in parallel with the display substrate DS and the mask assembly 40, or the display substrate DS and the mask assembly 40 may move in parallel with the deposition source 50. That is, the deposition source 50 may move relative to the display substrate DS and the mask assembly 40. At this time, the pump 82 may suck the gas within the chamber 10 and discharge the gas to the outside to maintain the internal pressure of the chamber 10 equal to or similar to vacuum.

[0079] As described above, the deposition material M provided from the deposition source 50 may pass through the mask assembly 40 and be deposited on the display substrate DS. Thus, at least one of a plurality of layers stacked in a display device to be described below, such as an organic layer, an inorganic layer, and a metal layer, may be formed.

[0080] Figure 2 is a schematic perspective view of a deposition source 50 according to an embodiment. Figure 3According to the implementation method Figure 2 The line I-I' intercepts Figure 2 5 is a cross-sectional view of a deposition source 50.

[0081] refer to Figures 1 to 3 , a deposition source 50 according to an embodiment may include a deposition module 51 and a shuttle 52 .

[0082] The deposition module 51 may provide a deposition material M such that the deposition material M passes through the mask assembly 40 and is deposited on the display substrate DS. The deposition module 51 may include a deposition frame 511 , a spray portion 512 , a close contact portion 513 , a support portion 514 , a heater 515 , a reflector 516 , and an angle limiter 517 .

[0083] The deposition frame 511 may form the outside of the deposition module 51 and may provide an internal space 511A. The deposition frame 511 may be formed with a one-side opening so that the deposition material M is ejected to the outside. The deposition frame 511 may include a cooler. In this structure, the deposition frame 511 may cool the heat generated in the internal space 511A. Therefore, the deposition frame 511 may reduce the phenomenon that the heat generated in the internal space 511A leaks to the outside and affects other components including the mask frame and the substrate. Although Figure 2 and Figure 3 The deposition frame 511 is shown to have a hexahedral shape with one side opened, but this is only an example, and the shape of the deposition frame 511 is not limited thereto.

[0084] The spray portion 512 may be accommodated in the inner space 511A of the deposition frame 511 , and may spray the stored deposition material M. The spray portion 512 may include a crucible portion 5121 and a nozzle portion 5122 .

[0085] The crucible portion 5121 may provide a storage space 5121A in which a deposition material M is stored. The deposition material M may be stored in the storage space 5121A of the crucible portion 5121. The nozzle portion 5122 may be connected to the crucible portion 5121 and may spray the deposition material M stored in the storage space 5121A of the crucible portion 5121. Spray holes 5122H through which the deposition material M is sprayed may be arranged in the nozzle portion 5122. The storage space 5121A of the crucible portion 5121 and the spray holes 5122H of the nozzle portion 5122 may be in communication with each other.

[0086] The close contact portion 513 may be received in the inner space 511A of the deposition frame 511 so that the crucible portion 5121 and the nozzle portion 5122 are in close contact with each other. The close contact portion 513 may apply pressure to at least one of the crucible portion 5121 and the nozzle portion 5122 so that the crucible portion 5121 and the nozzle portion 5122 are in close contact with each other. Therefore, a phenomenon in which the deposition material M leaks between the crucible portion 5121 and the nozzle portion 5122 during a process in which the deposition material M is sprayed by the spray portion 512 may be reduced.

[0087] The support portion 514 may support the injection portion 512 from the deposition frame 511. The support portion 514 may be accommodated in the inner space 511A of the deposition frame 511. One side of the support portion 514 may be fixed to the deposition frame 511, and may be supported from the deposition frame 511. The support portion 514 may support the close contact portion 513, thereby supporting the injection portion 512 fixed to the close contact portion 513. For example, when the injection portion 512 and the close contact portion 513 are accommodated in the support portion 514, one side of the close contact portion 513 may be supported by being suspended on a step portion 514C provided in the support portion 514. However, this is merely an example, and the method in which the support portion 514 supports the injection portion 512 is not limited thereto.

[0088] The heater 515 may be accommodated in the inner space 511A of the deposition frame 511 to heat the nozzle portion 5122. The heater 515 may be disposed to surround the injection portion 512, the close contact portion 513, and the support portion 514. The heater 515 may be between the support portion 514 and the deposition frame 511. For example, Figure 3 As shown in FIG. 5 , the heater 515 has a “U” shaped cross section, and the ejection portion 512 may be accommodated in the heater 515. For example, the heater 515 may be supported from the deposition frame 511 by being fixed to the support portion 514. However, this is merely an example, and the arrangement and shape of the heater 515 are not limited thereto.

[0089] The heater 515 may switch between a first state and a second state, the heat value of the second state being higher than the heat value of the first state. The heater 515 may not heat the nozzle portion 5122 in the first state, and may heat the nozzle portion 5122 in the second state. That is, in the first state, the ejection portion 512 may not eject the deposition material M, and in the second state, the ejection portion 512 may eject the deposition material M.

[0090] In the second state, the deposition material M stored in the crucible portion 5121 may be heated by the heater 515. The heater 515 may heat the side surface of the ejection portion 512 (e.g., the surface of the ejection portion 512 facing the x-axis direction) and the lower surface of the ejection portion 512 (e.g., the surface of the ejection portion 512 facing the -z-axis direction). When the heater 515 heats the deposition material M, the deposition material M stored in the crucible portion 5121 may evaporate. Therefore, the deposition material M evaporated by the heater 515 may be ejected through the nozzle portion 5122. In addition, in the second state, when the heater 515 heats the nozzle portion 5122, heat may be transferred to the deposition material M passing through the ejection hole 5122H of the nozzle portion 5122. Therefore, the phenomenon that the temperature of the evaporated deposition material M drops when passing through the nozzle portion 5122 and thus the evaporated deposition material M solidifies and blocks the nozzle portion 5122 may be reduced.

[0091] For example, the heater 515 may include a heat generating component that generates heat. The heat generating component may directly generate heat. For example, a heating wire that generates heat may be provided on a surface of the heater 515 that faces the nozzle portion 5122. However, this is merely an example, and the method by which the heater 515 heats the nozzle portion 5122 is not limited thereto.

[0092] The reflector 516 may prevent heat generated in the inner space 511A of the deposition frame 511 from being transferred to the mask assembly 40. The reflector 516 may be between the heater 515 and the mask assembly 40. In this structure, the reflector 516 may prevent the mask assembly 40 or the display substrate DS from being damaged by the heat transferred from the heater 515 to the mask assembly 40. In addition, a phenomenon in which heat generated in the inner space 511A of the deposition frame 511 is dissipated to the outside may be reduced, and thus the thermal efficiency of the heater 515 may be improved.

[0093] The reflector 516 may be connected to the deposition frame 511. When the deposition frame 511 includes a cooler, the deposition frame 511 may cool the reflector 516. In this structure, the reflector 516 may effectively block heat generated in the inner space 511A of the deposition frame 511 from being transferred to the mask assembly 40.

[0094] The angle limiter 517 may be connected to the deposition frame 511, and may limit a supply angle of the deposition material M provided to the mask assembly 40. The angle limiter 517 may prevent a portion of the deposition material M sprayed through the nozzle portion 5122 from being provided to the display substrate DS. That is, the angle limiter 517 may limit the supply angle of the deposition material M by passing only the deposition material M having a supply angle within a specified range.

[0095] A plurality of deposition modules 51 may be provided. For example, two deposition modules 51 may be provided. The two deposition modules 51 may be arranged side by side to provide deposition material M toward the display substrate DS. One of the two deposition modules 51 may provide a first deposition material M1, and the other of the two deposition modules 51 may provide a second deposition material M2. The first deposition material M1 and the second deposition material M2 may be different materials. In the process of providing the first deposition material M1 and the second deposition material M2, an overlap region CA in which the first deposition material M1 and the second deposition material M2 overlap each other may be formed. In this structure, a mixture of the first deposition material M1 and the second deposition material M2 may be deposited on the display substrate DS.

[0096] The first deposition material M1 and the second deposition material M2 may be different materials. For example, the first deposition material M1 may include a host component. In addition, the second deposition material M2 may include a dopant component. Therefore, a mixture of the host component and the dopant component may be deposited on the display substrate DS.

[0097] The shuttle 52 may prevent the deposition material M provided by the deposition module 51 from being deposited on the display substrate DS. The shuttle 52 may prevent the deposition material M from reaching the display substrate DS by covering a portion of the deposition module 51.

[0098] like Figure 2 and Figure 3 As shown in FIG. 5 , the deposition material M may be deposited on the display substrate DS in a state where the shuttle 52 does not cover the deposition module 51. However, when the shuttle 52 moves to cover a portion of the deposition module 51, the deposition material M may not be deposited on the display substrate DS. In this structure, the thickness of the deposition material M deposited on the display substrate DS may be adjusted by adjusting the time for which the shuttle 52 blocks the deposition material M.

[0099] The number of shuttles 52 may correspond to the number of deposition modules 51. For example, when two deposition modules 51 are provided, two shuttles 52 may be provided. When one shuttle 52 blocks the provision of the first deposition material M1, the other shuttle 52 may block the provision of the second deposition material M2. In addition, when one shuttle 52 does not block the provision of the first deposition material M1, the other shuttle 52 may not block the provision of the second deposition material M2. Therefore, the first deposition material M1 and the second deposition material M2 may be deposited on the display substrate DS at the same time or may be blocked at the same time.

[0100] Figure 4 is a schematic cross-sectional view of a portion of a deposition module 51 in a first state according to an embodiment. Figure 5 is a schematic cross-sectional view of a portion of a deposition module 51 in a second state according to an embodiment.

[0101] exist Figure 4 and Figure 5 , for convenience of explanation, only the spraying portion 512 and the close contact portion 513 of the deposition module 51 are shown.

[0102] refer to Figures 3 to 5 , the close contact portion 513 may be configured in the form of a clamp.

[0103] The crucible portion 5121 may include a first crucible portion 51211 and a second crucible portion 51212. The first crucible portion 51211 may store the deposition material M, and may have a longitudinal direction in a first direction (e.g., z-axis direction) toward the nozzle portion 5122. That is, the storage space 5121A of the crucible portion 5121 may be disposed in the first crucible portion 51211.

[0104] The second crucible portion 51212 may protrude from the first crucible portion 51211 in a second direction (e.g., the x-axis direction). The second direction (e.g., the x-axis direction) may intersect with the first direction (e.g., the z-axis direction). The upper surface of the first crucible portion 51211 and the upper surface of the second crucible portion 51212 may form a plane. That is, the upper surface of the first crucible portion 51211 and the upper surface of the second crucible portion 51212 may form an upper surface 5121US of the crucible portion 5121.

[0105] The nozzle portion 5122 may include a first nozzle portion 51221 and a second nozzle portion 51222. The first nozzle portion 51221 may be in contact with an upper surface 5121US of the crucible portion 5121. A width of a portion of the first nozzle portion 51221 protruding outward from the first crucible portion 51211 may be equal to a width of the second crucible portion 51212. That is, a side surface of the first nozzle portion 51221 and a side surface of the second crucible portion 51212 may form a plane.

[0106] The second nozzle portion 51222 may discharge the deposition material M and may protrude from the first nozzle portion 51221 in a first direction (eg, z-axis direction). That is, the injection hole 5122H of the nozzle portion 5122 may pass through the first nozzle portion 51221 and the second nozzle portion 51222. Figure 2 As shown in , a plurality of second nozzle parts 51222 may be provided. The second nozzle parts 51222 may be arranged linearly. However, this is merely an example, and the number and arrangement of the nozzle parts 5122 are not limited thereto.

[0107] The close contact portion 513 may be provided in the form of a fixture. In terms of cross section, the close contact portion 513 may include a C shape. The close contact portion 513 may be arranged on the side surfaces of the crucible portion 5121 and the nozzle portion 5122 to press the crucible portion 5121 and the nozzle portion 5122. The crucible portion 5121 and the nozzle portion 5122 may be partially accommodated in the close contact portion 513. A plurality of close contact portions 513 may be provided. For example, two close contact portions 513 may be provided. The two close contact portions 513 may be pressed on the crucible portion 5121 and the nozzle portion 5122 on both sides of the injection portion 512.

[0108] The first receiving groove 5121G may be arranged in the lower surface 51212DS of the second crucible portion 51212. The first end portion 513E1 of the close contact portion 513 may be accommodated in the first receiving groove 5121G. In addition, the second receiving groove 5122G may be arranged in the upper surface 51221US of the first nozzle portion 51221. The second end portion 513E2 of the close contact portion 513 may be accommodated in the second receiving groove 5122G. In this structure, the phenomenon that the close contact portion 513 is accidentally separated from the crucible portion 5121 and the nozzle portion 5122 can be prevented.

[0109] The nozzle portion 5122 may include a metal material having a high heat transfer coefficient. Therefore, the heat emitted from the heater 515 can be easily transferred to the injection hole 5122H. Therefore, the phenomenon that the deposition material M solidifies and blocks the injection hole 5122H can be reduced. For example, the nozzle portion 5122 may include a molybdenum-lanthanum (Mo-La) alloy. However, this is only an example, and the material of the nozzle portion 5122 is not limited thereto.

[0110] The crucible portion 5121 may include a material different from that of the nozzle portion 5122. The crucible portion 5121 may include a material having a heat transfer coefficient lower than that of the nozzle portion 5122. For example, the crucible portion 5121 may include a carbon material. Therefore, the phenomenon in which the deposition material M solidifies and adheres between the crucible portion 5121 and the nozzle portion 5122 and thus the crucible portion 5121 and the nozzle portion 5122 are attached to each other can be reduced. Due to this, no separate mechanical or chemical treatment is required to separate the crucible portion 5121 from the nozzle portion 5122, which simplifies the manufacturing process and improves the durability of the deposition module 51. For example, the crucible portion 5121 may include a carbon composite material (CC). However, this is merely an example, and the crucible portion 5121 may include tungsten (W) or tantalum (Ta).

[0111] At least one of the crucible portion 5121 and the nozzle portion 5122 may have a higher thermal expansion coefficient than the thermal expansion coefficient of the close contact portion 513. For example, the crucible portion 5121 and the close contact portion 513 may include the same material. For example, the close contact portion 513 and the crucible portion 5121 may each include CC, and the nozzle portion 5122 may include a Mo-La alloy. That is, the close contact portion 513 may have a lower thermal expansion coefficient than the thermal expansion coefficient of the nozzle portion 5122.

[0112] For example, in the process of manufacturing the crucible portion 5121, the crucible portion 5121 may be stacked in a first direction (e.g., z-axis direction) toward the nozzle portion 5122. In addition, in the process of manufacturing the close contact portion 513, the close contact portion 513 may be stacked in a second direction (e.g., x-axis direction) intersecting the first direction (e.g., z-axis direction). Therefore, the thermal expansion coefficient of the crucible portion 5121 in the first direction (e.g., z-axis direction) may be higher than the thermal expansion coefficient of the close contact portion 513 in the first direction (e.g., z-axis direction).

[0113] when Figure 4 The first state in the switch is Figure 5 In the second state, each of the heated crucible part 5121, the heated nozzle part 5122 and the heated close contact part 513 may thermally expand. At this time, the close contact part 513 may include a pressing surface 513S1 that is spaced apart from the injection part 512 in the first state and presses the injection part 512 in the second state.

[0114] like Figure 4 As shown in , in the first state, the pressing surface 513S1 may be spaced apart from the ejection portion 512. For example, the pressing surface 513S1 may be spaced apart from the lower surface 51212DS of the second crucible portion 51212. Therefore, in the first state, the close contact portion 513 may be removed from the ejection portion 512. In the first state, the close contact portion 513 is separated from the ejection portion 512, and the crucible portion 5121 is separated from the nozzle portion 5122. Thereafter, the deposition material M is replenished in the storage space 5121A, or the ejection portion 512 may be cleaned.

[0115] like Figure 5As shown in, in the second state, the pressing surface 513S1 can press the injection portion 512. Because the thermal expansion degree of the nozzle portion 5122 and the crucible portion 5121 in the first direction (e.g., z-axis direction) is greater than the thermal expansion degree of the close contact portion 513 in the first direction (e.g., z-axis direction), the pressing surface 513S1 can contact the lower surface 51212DS of the second crucible portion 51212. Therefore, in the second state, the close contact portion 513 can press the second crucible portion 51212 and the first nozzle portion 51221, so that the nozzle portion 5122 and the crucible portion 5121 are in close contact with each other. In an embodiment, close contact means that at least two structures are in direct contact and firmly pressed against each other. That is, the upper surface 5121US of the crucible portion 5121 and the lower surface 5122DS of the nozzle portion 5122 can be in close contact with each other. Therefore, the leakage of the deposition material M between the nozzle portion 5122 and the crucible portion 5121 can be reduced.

[0116] When the pressing surface 513S1 is spaced apart from the ejection portion 512 in the first state, excessive pressure applied to the close contact portion 513 in the second state can be reduced. Therefore, damage to the close contact portion 513 due to thermal expansion of the ejection portion 512 can be reduced.

[0117] Figure 6 is a schematic cross-sectional view of a portion of a deposition module 51 in a first state according to an embodiment. Figure 7 is a schematic cross-sectional view of a portion of a deposition module 51 in a second state according to an embodiment.

[0118] exist Figure 6 and Figure 7 , for convenience of explanation, only the spraying portion 512 and the close contact portion 513 of the deposition module 51 are shown.

[0119] exist Figure 6 and Figure 7 In, with Figure 4 and Figure 5 The same reference numerals as those in the drawings denote the same components, and redundant descriptions thereof are omitted.

[0120] refer to Figure 3 , Figure 6 and Figure 7 , the close contact portion 513 may be provided in the form of a fixture. In terms of cross section, the close contact portion 513 may include a C shape. The close contact portion 513 may be arranged on the side surfaces of the crucible portion 5121 and the nozzle portion 5122 to press the crucible portion 5121 and the nozzle portion 5122. The crucible portion 5121 and the nozzle portion 5122 may be partially accommodated in the close contact portion 513.

[0121] The first receiving groove 5121G may be arranged in the lower surface 51212DS of the second crucible portion 51212. The first end portion 513E1 of the close contact portion 513 may be accommodated in the first receiving groove 5121G. The second receiving groove 5122G may be arranged in the side surface 51221SS of the first nozzle portion 51221, and the second end portion 513E2 of the close contact portion 513 may be arranged in the second receiving groove 5122G. In addition, the second end portion 513E2 of the close contact portion 513 may press the nozzle portion 5122 in the second state.

[0122] In this structure, the phenomenon that the close contact portion 513 is accidentally separated from the crucible portion 5121 and the nozzle portion 5122 can be prevented. In addition, the area of ​​the close contact portion 513 surrounding the nozzle portion 5122 can be reduced. Therefore, the heat loss from the nozzle portion 5122 having high thermal conductivity to the close contact portion 513 having low thermal conductivity in the second state can be reduced. Due to this, the phenomenon that the deposition material M solidifies and blocks the injection hole 5122H in the second state can be reduced.

[0123] Figure 8 is a schematic cross-sectional view of a portion of a deposition module 51 in a first state according to an embodiment. Fig. 9 is a schematic cross-sectional view of a portion of a deposition module 51 in a second state according to an embodiment.

[0124] exist Figure 8 and Fig. 9 , for convenience of explanation, only the spray portion 512, the close contact portion 513, and the support portion 514 of the deposition module 51 are shown.

[0125] exist Figure 8 and Fig. 9 In, with Figure 4 and Figure 5 The same reference numerals as those in the drawings denote the same components, and redundant descriptions thereof are omitted.

[0126] refer to Figure 3 , Figure 8 and Fig. 9 , the close contact portion 513 may be fixed to the support portion 514, and the pressing surface 513S1 may face one surface of the nozzle portion 5122. The close contact portion 513 may include a close contact frame 5131 and a fixing member FM.

[0127] The close contact frame 5131 may form the outside of the close contact portion 513. The close contact frame 5131 may be fixed to the support portion 514. The pressing surface 513S1 may be provided on the lower surface of the close contact frame 5131. The pressing surface 513S1 may face the upper surface 51221US of the first nozzle portion 51221.

[0128] The fixing member FM may fix the close contact frame 5131 to the support portion 514. The fixing member FM may have a screw shape. In this structure, the close contact frame 5131 may be screwed to the support portion 514. However, this is merely an example, and the method by which the fixing member FM fixes the close contact frame 5131 is not limited thereto.

[0129] In the first state, the close contact portion 513 and the injection portion 512 may be spaced apart from each other, and in the second state, the close contact portion 513 may press the injection portion 512. Therefore, in the second state, the crucible portion 5121 and the nozzle portion 5122 may be in close contact with each other.

[0130] The thermal expansion coefficients of the support portion 514, the close contact frame 5131, and the fixing member FM may be the same as each other. For example, the materials of the support portion 514, the close contact frame 5131, and the fixing member FM may be the same as each other. Therefore, due to the thermal expansion of the support portion 514 and the close contact frame 5131, the load applied to the fixing member FM may be reduced. Due to this, the external force applied to the fixing member FM in the second state may be reduced.

[0131] Fig.10 is a schematic cross-sectional view of a portion of a deposition module 51 in a first state according to an embodiment. Fig.11 is a schematic plan view of a close contact portion 513 according to an embodiment. Fig.12 is a schematic cross-sectional view of a portion of a deposition module 51 in a second state according to an embodiment. Fig.13 is a schematic side view of a portion of a deposition module 51 in a second state according to an embodiment.

[0132] For ease of explanation, Figures 10 to 12 Only the ejection portion 512, the close contact portion 513 and the support portion 514 of the deposition module 51 are shown, and Fig.13 Only the ejection portion 512 and the pressing portion 5132 are shown.

[0133] exist Figures 10 to 13 In, with Figure 4 and Figure 5 The same reference numerals as those in the drawings denote the same components, and redundant descriptions thereof are omitted.

[0134] refer to Figure 3 as well as Figures 10 to 13 , the close contact portion 513 may be fixed to the support portion 514, and the pressing surface 513S1 may face one surface of the nozzle portion 5122. The close contact portion 513 may include a close contact frame 5131, a fixing member FM, and a pressing portion 5132.

[0135] The close contact frame 5131 may form the outside of the close contact portion 513. The close contact frame 5131 may be fixed to the support portion 514. The close contact frame 5131 may be fixed to the support portion 514 by a fixing member FM.

[0136] A plurality of pressing portions 5132 may be provided. The pressing portions 5132 may protrude from a surface of the close contact frame 5131 toward the nozzle portion 5122. Pressing surfaces 513S1 may be provided on the pressing portions 5132, respectively. The pressing surfaces 513S1 may be provided on the lower surface of the pressing portions 5132, and may face the upper surface 51221US of the first nozzle portion 51221. The pressing portions 5132 may be spaced apart from each other. That is, the pressing surfaces 513S1 of the pressing portions 5132 may be spaced apart from each other. For example, the pressing portions 5132 may be fixed to the close contact frame 5131 with a separate adhesive. However, this is merely an example, and the pressing portions 5132 and the close contact frame 5131 may be integrally formed as a single body.

[0137] In the first state, the pressing portion 5132 and the injection portion 512 may be spaced apart from each other, and in the second state, the pressing portion 5132 may press the injection portion 512. Therefore, in the second state, the crucible portion 5121 and the nozzle portion 5122 may be in close contact with each other.

[0138] Because the pressing portions 5132 are spaced apart from each other, the contact area between the pressing portion 5132 and the nozzle portion 5122 in the second state can be reduced. Therefore, in the second state, the amount of heat lost by the nozzle portion 5122 from the close contact portion 513 can be reduced. That is, the phenomenon that the deposition material M solidifies and blocks the injection hole 5122H can be reduced.

[0139] refer to Fig.11 , a separation opening 513O may be arranged in the close contact frame 5131 to separate at least two of the pressing portions 5132 from each other. In a plan view, the separation opening 513O may be between two pressing portions 5132. Due to the separation opening 513O, a plurality of teeth 51311 may be provided in the close contact frame 5131. One pressing portion 5132 may be arranged on one tooth 51311. In this structure, the flexibility of the close contact frame 5131 may be improved.

[0140] The separation opening 513O may include a first separation opening 513O1 and a second separation opening 513O2. The first separation opening 513O1 may have a longitudinal direction and may be between the two pressing portions 5132. The second separation opening 513O2 may be connected to an end portion of the first separation opening 513O1 and may have a circular planar shape. In this structure, the flexibility of the close contact frame 5131 may be improved, and damage to the close contact frame 5131 due to bending may be reduced.

[0141] refer to Fig.13 , in the second state, the degree of thermal expansion of the nozzle portion 5122 may not be uniform. When the nozzle portion 5122 is heated non-uniformly, the degree of thermal expansion of the nozzle portion 5122 in the first direction (e.g., the z-axis direction) may vary in the longitudinal direction of the nozzle portion 5122. For example, the degree of thermal expansion on both sides of the nozzle portion 5122 may be greater than the degree of thermal expansion in the central portion of the nozzle portion 5122. Therefore, in the second state, the heights of at least two of the pressing portions 5132 may be different from each other. That is, the height 5132H2 of the pressing portion 5132 adjacent to both sides of the nozzle portion 5122 may be higher than the height 5132H1 of the pressing portion 5132 adjacent to the center of the nozzle portion 5122.

[0142] In reference Figures 10 to 13 In the described present embodiment, since the flexibility of the close contact frame 5131 is ensured, the pressing portion 5132 can press the nozzle portion 5122 even when the degree of thermal expansion of the nozzle portion 5122 is uneven. Therefore, a phenomenon in which the pressing portion 5132 cannot properly press the nozzle portion 5122 in the second state and thus the deposition material M leaks through the gap between the crucible portion 5121 and the nozzle portion 5122 is avoided.

[0143] Fig.14 is a plan view schematically showing a display device 2 manufactured by using the display device manufacturing apparatus 1 according to the embodiment. Fig.15 is a cross-sectional view schematically showing a display device 2 manufactured by using the display device manufacturing apparatus 1 according to the embodiment.

[0144] refer to Fig.14 and Fig.15 , the display device 2 may include a display area DA and a non-display area NDA surrounding the display area DA. Pixels PX connected to signal lines including, for example, scan lines SL and data lines DLn may be located in the display area DA. The display device 2 may include a display substrate S. The display substrate S may include a substrate 100 and layers of the display layer DL except for the common electrode 23 and the intermediate layer.

[0145] The display layer DL and the thin film encapsulation layer TFE may be disposed on the substrate 100. The display layer DL may include a pixel circuit layer PCL and a display element layer DEL.

[0146] The substrate 100 may include glass or a polymer resin such as polyethersulfone, polyarylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyimide, polycarbonate, cellulose triacetate, or cellulose acetate propionate.

[0147] A barrier layer (not shown) may be further provided between the display layer DL and the substrate 100. The barrier layer may prevent the infiltration of foreign materials from outside, and may include an inorganic material (such as silicon nitride (SiN x , x>0) or silicon oxide (SiO x , x>0)) of single or multiple layers.

[0148] The pixel circuit layer PCL may be disposed on the substrate 100. The pixel circuit layer PCL may include a thin film transistor TFT and a buffer layer 111, a first insulating layer 13a, a second insulating layer 13b, a third insulating layer 15, and a planarization layer 17 disposed below and / or above components of the thin film transistor TFT.

[0149] The buffer layer 111 may include an inorganic insulating material such as silicon nitride, silicon oxynitride, and silicon oxide, and may include a single layer or a plurality of layers including the above inorganic insulating material.

[0150] The thin film transistor TFT may include a semiconductor layer 12, and the semiconductor layer 12 may include polycrystalline silicon. Alternatively, the semiconductor layer 12 may include amorphous silicon, an oxide semiconductor, or an organic semiconductor. The semiconductor layer 12 may include a channel region 12c and a drain region 12a and a source region 12b on both sides of the channel region 12c, respectively. The gate electrode 14 may overlap the channel region 12c.

[0151] The gate electrode 14 may include a low resistance metal material, a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may include a single layer or multiple layers including the above conductive materials.

[0152] The first insulating layer 13a between the semiconductor layer 12 and the gate electrode 14 may include silicon oxide (SiO 2 ), Silicon Nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), Tantalum Oxide (Ta 2 O5 ), hafnium oxide (HfO 2 ) or zinc oxide (ZnO x ). ZnO x It can be ZnO and / or ZnO 2 .

[0153] The second insulating layer 13b may cover the gate electrode 14. Similar to the first insulating layer 13a, the second insulating layer 13b may include silicon oxide (SiO 2 ), Silicon Nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), Tantalum Oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ) or zinc oxide (ZnO x ). ZnO x It can be ZnO and / or ZnO 2 .

[0154] The upper electrode Cst2 of the storage capacitor Cst may be disposed on the second insulating layer 13b. The upper electrode Cst2 may overlap the gate electrode 14 thereunder. At this time, the gate electrode 14 and the upper electrode Cst2 may form a storage capacitor Cst, wherein the gate electrode 14 and the upper electrode Cst2 overlap each other with the second insulating layer 13b therebetween. That is, the gate electrode 14 may serve as the lower electrode Cst1 of the storage capacitor Cst.

[0155] As described above, the storage capacitor Cst and the thin film transistor TFT may overlap each other. In some embodiments, the storage capacitor Cst may not overlap the thin film transistor TFT.

[0156] The upper electrode Cst2 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W) and / or copper (Cu), and may include a single layer or multiple layers containing the above materials.

[0157] The third insulating layer 15 may cover the upper electrode Cst2. The third insulating layer 15 may include silicon oxide (SiO 2 ), Silicon Nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), Tantalum Oxide (Ta 2 O5 ), hafnium oxide (HfO 2 ) or zinc oxide (ZnO x ). ZnO x It can be ZnO and / or ZnO 2 The third insulating layer 15 may include a single layer or multiple layers including the above-mentioned inorganic insulating material.

[0158] The drain electrode 16a and the source electrode 16b may be disposed on the third insulating layer 15. The drain electrode 16a and the source electrode 16b may each include a material having good electrical conductivity. The drain electrode 16a and the source electrode 16b may each include a conductive material containing molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may each include a single layer or multiple layers containing the above conductive materials. In an embodiment, the drain electrode 16a and the source electrode 16b may each have a multilayer structure of Ti / Al / Ti.

[0159] The planarization layer 17 may include an organic material. The planarization layer 17 may include an organic insulating material, for example, a general polymer such as polymethyl methacrylate (PMMA) or polystyrene (PS), a polymer derivative having a phenolic group, an acrylic polymer, an imide polymer, an aryl ether-based polymer, an amide polymer, a fluoropolymer, a p-xylene polymer, a vinyl alcohol polymer, and any mixture thereof.

[0160] The display element layer DEL may be disposed on the pixel circuit layer PCL having the above structure. The display element layer DEL may include an organic light emitting diode OLED. The pixel electrode 21 of the organic light emitting diode OLED may be electrically connected to the thin film transistor TFT through a contact hole defined in the planarization layer 17 .

[0161] The pixel PX may include an organic light emitting diode OLED and a thin film transistor TFT. The pixel PX may emit red, green, or blue light through the organic light emitting diode OLED, or may emit red, green, blue, or white light through the organic light emitting diode OLED.

[0162] The pixel electrode 21 may include a conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In 2 O 3 ), indium gallium oxide (IGO) or aluminum zinc oxide (AZO). In an embodiment, the pixel electrode 21 may include a reflective layer, and the reflective layer includes silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr) or any compound thereof. In an embodiment, the pixel electrode 21 may also include ITO, IZO, ZnO or In above and / or below the reflective layer.2 O 3 layer.

[0163] A pixel defining layer 19 having an opening 19OP exposing a central portion of the pixel electrode 21 may be disposed on the pixel electrode 21. The pixel defining layer 19 may include an organic insulating material and / or an inorganic insulating material. The opening 19OP may define an emission region (hereinafter referred to as an emission region EA) of light emitted from the organic light emitting diode OLED. For example, the width of the opening 19OP may correspond to the width of the emission region EA.

[0164] The emission layer 22 may be disposed in the opening 19OP of the pixel defining layer 19. The emission layer 22 may include a high molecular weight organic material or a low molecular weight organic material that emits light of a specific color. In an embodiment, the emission layer 22 may include a quantum dot material. The emission layer 22 may be formed by spraying droplets using the display device manufacturing apparatus 1 as an embodiment.

[0165] Although not shown, the first functional layer and the second functional layer may be disposed below and above the emission layer 22, respectively. For example, the first functional layer may include a hole transport layer (HTL), or may include an HTL and a hole injection layer (HIL). The second functional layer may be optionally disposed on the emission layer 22. The second functional layer may include an electron transport layer (ETL) and / or an electron injection layer (EIL). As with the common electrode 23 to be described below, the first functional layer and / or the second functional layer may be a common layer that completely covers the substrate 100.

[0166] The common electrode 23 may include a conductive material having a low work function. For example, the common electrode 23 may include a (semi) transparent layer including silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca) or any alloy thereof. Alternatively, the common electrode 23 may also include a conductive material including ITO, IZO, ZnO or In on the (semi) transparent layer including the above materials. 2 O 3 layer.

[0167] The thin film encapsulation layer TFE may be disposed on the common electrode 23. In an embodiment, the thin film encapsulation layer TFE may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. As an embodiment, Fig.15 It is shown that the thin film encapsulation layer TFE includes a first inorganic encapsulation layer 31, an organic encapsulation layer 32, and a second inorganic encapsulation layer 33 which are sequentially stacked in the stated order.

[0168] The first inorganic encapsulation layer 31 and the second inorganic encapsulation layer 33 may each include at least one inorganic material selected from aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride. The organic encapsulation layer 32 may include a polymer-based material. The polymer-based material may include acrylic resin, epoxy resin, polyimide, polyethylene, etc. In an embodiment, the organic encapsulation layer 32 may include acrylate.

[0169] In an embodiment, the thin film encapsulation layer TFE may have a structure in which the substrate 100 and the upper substrate as a transparent member are bonded to each other by a sealing member to seal the internal space between the substrate 100 and the upper substrate. In this case, a hygroscopic agent or a filler may be located in the internal space. The sealing member may be a sealant. In an embodiment, the sealing member may include a material that can be cured by laser. For example, the sealing member may be glass frit. Specifically, the sealing member may include an organic sealant such as a urethane-based resin, an epoxy-based resin, and an acrylic resin, or an inorganic sealant such as a silicone resin. Examples of urethane-based resins may include urethane acrylate. Examples of acrylic resins may include butyl acrylate and ethylhexyl acrylate. On the other hand, the sealing member may include a material that can be cured by heating.

[0170] Fig.16 is an equivalent circuit diagram of a pixel PX of a display panel according to an embodiment.

[0171] The pixel PX may include a pixel circuit PC and a display element connected to the pixel circuit PC. The display element may be an organic light emitting diode OLED. The pixel circuit PC may include a first thin film transistor T1, a second thin film transistor T2, and a storage capacitor Cst. The pixel PX may emit, for example, red light, green light, blue light, or white light from the organic light emitting diode OLED.

[0172] The second thin film transistor T2 used as a switching thin film transistor may be connected to the scan line SL and the data line DLL, and may be configured to transmit a data voltage input from the data line DLL to the first thin film transistor T1 in response to a switching voltage input from the scan line SL. The storage capacitor Cst may be connected to the second thin film transistor T2 and the driving voltage line PL, and may be configured to store a voltage corresponding to a difference between a voltage received from the second thin film transistor T2 and a first power supply voltage ELVDD supplied to the driving voltage line PL.

[0173] The first thin film transistor T1 used as a driving thin film transistor can be connected to the driving voltage line PL and the storage capacitor Cst, and can be configured to control the driving current flowing from the driving voltage line PL to the organic light emitting diode OLED according to the voltage value stored in the storage capacitor Cst. The organic light emitting diode OLED can be configured to emit light with a specific brightness according to the driving current. The opposite electrode (e.g., cathode) of the organic light emitting diode OLED can be configured to receive the second power supply voltage ELVSS.

[0174] Fig.16 The pixel circuit PC is shown to include two thin film transistors and one storage capacitor, but the present disclosure is not limited thereto. The number of thin film transistors and the number of storage capacitors may be variously changed according to the design of the pixel circuit PC. For example, the pixel circuit PC may also include three or more thin film transistors.

[0175] According to one or more embodiments, a process of manufacturing a display device may be simplified, and durability of a deposition module may be improved.

[0176] The effects of the present disclosure are not limited to the above features, and other features not mentioned herein will be clearly understood from the claims by those having ordinary skill in the art.

[0177] It should be understood that the embodiments described herein should be considered to be merely descriptive and not for limiting purposes. The description of features or aspects within each embodiment should generally be considered to be applicable to other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope as defined by the appended claims.

Claims

1. A display device manufacturing apparatus, comprising: Mask assembly; as well as a deposition source, comprising a deposition module, the deposition module being configured to provide a deposition material toward the mask assembly, Wherein, the deposition module comprises: a deposition frame having an interior space; a spraying portion accommodated in the inner space and including a crucible portion having a storage space for storing the deposition material and a nozzle portion connected to the crucible portion and configured to spray the deposition material stored in the storage space; a heater accommodated in the internal space to heat the nozzle portion and configured to be switchable between a first state and a second state, the second state having a higher heat value than the first state; and a close contact portion accommodated in the internal space so that the crucible portion and the nozzle portion are in close contact with each other, and The close contact portion includes a pressing surface that is spaced apart from the ejection portion in the first state and is configured to press on the ejection portion in the second state.

2. The display device manufacturing apparatus according to claim 1, wherein: At least one of the crucible portion and the nozzle portion has a thermal expansion coefficient higher than a thermal expansion coefficient of the close contact portion.

3. The display device manufacturing apparatus according to claim 1, wherein: The crucible portion includes a carbon material, and the nozzle portion includes a metal material.

4. The display device manufacturing apparatus according to claim 1, wherein: In the first state, the close contact portion is detachable from the ejection portion.

5. The display device manufacturing apparatus according to claim 1, wherein: The crucible part comprises: a first crucible portion configured to store the deposition material and having a longitudinal direction in a first direction toward the nozzle portion; and a second crucible portion protruding from the first crucible portion in a second direction intersecting the first direction, The nozzle part comprises: a first nozzle portion in contact with the crucible portion; and a second nozzle portion configured to discharge the deposition material and protruding from the first nozzle portion in the first direction, and The close contact portion is configured to press on the second crucible portion and the first nozzle portion in the second state.

6. The display device manufacturing apparatus according to claim 5, wherein: A first receiving groove is provided in the lower surface of the second crucible part, and A first end portion of the close contact portion is received in the first receiving groove.

7. The display device manufacturing apparatus according to claim 5, wherein: The close contact portion is further configured to be pressed on an upper surface of the first nozzle portion in the second state.

8. The display device manufacturing apparatus according to claim 7, wherein: A second receiving groove is provided in the upper surface of the first nozzle portion, and The second end portion of the close contact portion is received in the second receiving groove.

9. The display device manufacturing apparatus according to claim 6, wherein: A second receiving groove is provided in a side surface of the first nozzle portion, and The second end portion of the close contact portion is disposed in the second accommodation groove, and is configured to be pressed on the nozzle portion in the second state.

10. The display device manufacturing apparatus according to claim 1, further comprising a supporting portion configured to support the ejection portion from the deposition frame, in, The close contact portion is fixed to the support portion, and The pressing surface faces one surface of the nozzle portion.

11. The display device manufacturing apparatus according to claim 10, wherein: The close contact portion includes: a close contact frame fixed to the support portion; and a plurality of pressing portions protruding from the close contact frame toward the one surface of the nozzle portion, The plurality of pressing portions include a plurality of the pressing surfaces, and The plurality of pressing surfaces of the plurality of pressing portions are spaced apart from each other.

12. The display device manufacturing apparatus according to claim 11, wherein: A separation opening configured to separate at least two of the plurality of pressing portions from each other is arranged in the close-contact frame.

13. The display device manufacturing apparatus according to claim 12, wherein: In the second state, the at least two pressing portions of the plurality of pressing portions have different heights.

14. The display device manufacturing apparatus according to claim 12, wherein: The separation opening comprises: a first separation opening having a longitudinal direction; and The second separation opening is connected to an end portion of the first separation opening and has a circular planar shape.

15. The display device manufacturing apparatus according to claim 1, wherein: The crucible portion and the close contact portion include the same material.

16. Deposition module, including: a deposition frame having an interior space; a spraying portion accommodated in the inner space and including a crucible portion having a storage space for storing a deposition material and a nozzle portion connected to the crucible portion and configured to spray the deposition material stored in the storage space; a heater accommodated in the internal space to heat the nozzle portion and configured to be switchable between a first state and a second state, the second state having a higher heat value than the first state; as well as a close contact portion accommodated in the internal space so that the crucible portion and the nozzle portion are in close contact with each other, and The close contact portion includes a pressing surface that is spaced apart from the ejection portion in the first state and is configured to press on the ejection portion in the second state.

17. The deposition module according to claim 16, wherein: At least one of the crucible portion and the nozzle portion has a thermal expansion coefficient higher than a thermal expansion coefficient of the close contact portion.

18. The deposition module according to claim 16, wherein: The crucible portion includes a carbon material, and the nozzle portion includes a metal material.

19. The deposition module according to claim 16, wherein: The close contact portion is detachable from the ejection portion in the first state.

20. The deposition module of claim 16, wherein: The close contact portion is provided in the form of a clamp.

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