Chip cleaning and defect detection integrated equipment and detection method thereof

Abstract

The invention relates to the technical field of chip defect detection equipment, in particular to chip cleaning and defect detection integrated equipment and a detection method thereof.The chip cleaning and defect detection integrated equipment comprises a rack, a feeding mechanism, a carrying mechanism, an end face detection mechanism, a back face detection mechanism, a cleaning mechanism, a front face detection mechanism, a front face redetection mechanism, a gold thread detection mechanism and a discharging mechanism; the feeding mechanism, the end face detection mechanism, the back face detection mechanism, the cleaning mechanism, the gold thread detection mechanism and the discharging mechanism are sequentially arranged on the rack in the transverse direction and can slide in the longitudinal direction. The carrying mechanism is erected on the rack and can slide on the rack in the transverse direction. A suction nozzle of the carrying mechanism can ascend and descend in the vertical direction. The front surface detection mechanism is arranged above the end surface detection mechanism; the cleaning mechanism comprises a cleaning table, a cleaner and an end face reinspection mechanism; the cleaning table is slidably arranged on the rack in the longitudinal direction; the cleaning device and the end face reinspection mechanism are correspondingly arranged on the side of the cleaning table. And the front reinspection mechanism is arranged above the cleaning table.

Description

Technical Field

[0001] The present invention relates to the technical field of chip defect detection equipment, and in particular to a chip cleaning and defect detection integrated equipment and a detection method thereof. Background Art

[0002] After the chip is mounted, it is necessary to inspect the chip for appearance defects, including dirt, breakage, cleavage lines, scratches, regional discoloration, graphic abnormalities, size abnormalities and other appearance defects. The inspection range includes the front, back and two side cavity surfaces (end faces) of the chip.

[0003] Due to production process reasons, dirt may be generated on the end face of the chip during the chip mounting process, thus affecting the chip defect detection equipment's detection of defects on the chip end face. Therefore, it is necessary to clean the dirty chip before performing defect detection. However, existing chip defect detection equipment and chip cleaning equipment are usually set up independently, resulting in a long workpiece turnover time and low production efficiency. Summary of the invention

[0004] 1. Technical issues to be resolved

[0005] In view of the above-mentioned shortcomings and deficiencies of the prior art, the present invention provides a chip cleaning and defect detection integrated device and a detection method thereof, which solves the technical problem of low integration between the existing chip defect detection equipment and chip cleaning equipment.

[0006] (II) Technical solution

[0007] In order to achieve the above-mentioned object, the chip cleaning and defect detection integrated equipment of the present invention comprises a rack, a loading mechanism, a transport mechanism, an end face detection mechanism, a back face detection mechanism, a cleaning mechanism, a front face detection mechanism, a gold wire detection mechanism and a unloading mechanism;

[0008] The feeding mechanism, the end face detection mechanism, the back face detection mechanism, the cleaning mechanism, the gold wire detection mechanism and the unloading mechanism are sequentially arranged on the frame in the transverse direction, and are all capable of sliding in the longitudinal direction;

[0009] The transport mechanism is mounted on the frame and can slide laterally on the frame; the suction nozzle of the transport mechanism can be lifted and lowered vertically;

[0010] The front detection mechanism is arranged above the end detection mechanism;

[0011] Wherein, the cleaning mechanism comprises a cleaning table, a cleaning device and an end face re-inspection mechanism; the cleaning table is slidably arranged on the frame along the longitudinal direction; the cleaning device and the end face re-inspection mechanism are correspondingly arranged on the side of the cleaning table.

[0012] Optionally, the feeding mechanism includes a feeding and transferring module, a material positioner and a lifting mechanism;

[0013] The loading and transferring module is slidably arranged on the frame along the longitudinal direction;

[0014] The material locator is mounted on the frame and is located above the loading and transferring module;

[0015] The ejector mechanism is arranged on the side of the loading and transferring module; the ejector pin of the ejector mechanism can be lifted and lowered vertically;

[0016] The suction nozzle can be raised and lowered above the ejector pin.

[0017] Optionally, the transport mechanism further comprises a lateral transfer module, a vertical lifting module, a rotary drive and a belt;

[0018] The lateral transfer module is slidably connected to the frame; the vertical lifting module is arranged on the lateral transfer module; the rotary drive is arranged on the vertical lifting module;

[0019] The rotary driver is provided with a driving wheel; the suction nozzle is provided with a driven wheel; the driving wheel and the driven wheel are connected through the belt transmission; the rotary driver can drive the suction nozzle to rotate around the vertical direction.

[0020] Optionally, a first transport module is provided between the feeding mechanism and the end surface detection mechanism;

[0021] A second transport module is provided between the end surface detection mechanism and the cleaning mechanism;

[0022] A third transport module is provided between the cleaning mechanism and the gold wire detection mechanism;

[0023] A fourth transport module is provided between the gold wire detection mechanism and the unloading mechanism;

[0024] The first conveying module, the second conveying module, the third conveying module and the fourth conveying module are sequentially slidably arranged on the frame along the transverse direction.

[0025] Optionally, the end face detection mechanism includes a first detection platform and a pair of end face detectors;

[0026] The end face detector is slidably arranged on the frame along the longitudinal direction; a pair of the end face detectors are arranged on both sides of the first detection platform in a one-to-one correspondence;

[0027] The front detection mechanism is arranged above the first detection platform.

[0028] Optionally, a suction head that rotates around the vertical direction is arranged on the first detection table.

[0029] Optionally, the front detection mechanism includes a T-shaped bracket, and a front detector and a cleaning positioner correspondingly arranged on both sides of the top of the T-shaped bracket;

[0030] The bottom end of the T-shaped bracket is connected to the frame;

[0031] The front detector is arranged above the end face detection mechanism; the cleaning positioner is arranged above the cleaning mechanism.

[0032] Optionally, the gold wire detection mechanism includes a longitudinal transfer module, a second detection platform and a gold wire detector;

[0033] The longitudinal transfer module is slidably arranged on the frame along the longitudinal direction;

[0034] The second inspection platform and the gold wire detector are both arranged on the longitudinal transfer module; and the gold wire detector is arranged above the second inspection platform.

[0035] Optionally, the cleaner is a snowflake cleaner.

[0036] Furthermore, the present invention also provides a detection method for a chip cleaning and defect detection integrated device, the detection method for the chip cleaning and defect detection integrated device is implemented based on the chip cleaning and defect detection integrated device as described above, and the detection method comprises the following steps:

[0037] Loading materials at the loading mechanism;

[0038] The transport mechanism takes the material from the loading mechanism and transports the workpiece to the end face detection mechanism; the end face detection mechanism performs end face defect detection on the workpiece, and the front face detection mechanism performs front face defect detection on the workpiece;

[0039] The transport mechanism transports the workpiece to the back side inspection mechanism; the back side inspection mechanism performs back side defect inspection on the workpiece;

[0040] If dirt is detected during the end face defect detection, the transport mechanism transports the workpiece to the cleaning table, the cleaner cleans the workpiece, and after cleaning, the end face re-inspection mechanism re-inspects the end face of the workpiece; if dirt is not detected during the end face defect detection, the transport mechanism directly transports the workpiece to the gold wire detection mechanism for gold wire detection;

[0041] The transport mechanism transports the workpiece to the unloading mechanism for unloading.

[0042] (III) Beneficial effects

[0043] The beneficial effects of the present invention are:

[0044] The cleaning mechanism chooses to clean or not clean the workpiece according to the detection result of the end face detection mechanism. When the workpiece does not need to be cleaned, it is directly moved from the back detection mechanism to the gold wire detection mechanism for gold wire detection. The equipment has a high degree of intelligence and high detection efficiency. When the workpiece needs to be cleaned, the workpiece is placed on the cleaning table, and the end face of the workpiece is cleaned by the cleaner. After cleaning, the end face re-inspection mechanism re-inspects the end face of the workpiece, and there is no need to move it to the end face detection mechanism for detection, which improves the detection efficiency when the workpiece is dirty.

[0045] The feeding mechanism, end face detection mechanism, back face detection mechanism, cleaning mechanism, gold wire detection mechanism and unloading mechanism are arranged in sequence along the horizontal direction. By sequentially detecting the end face (and front face), back face and gold wire of the workpiece, defective products can be screened out in advance to avoid defective products flowing into the later process and occupying production time; the end face detection mechanism can also detect whether the end face of the workpiece is dirty. If there is dirt, the cleaning mechanism will clean it and re-inspect the end face before detecting the gold wire of the workpiece. The layout between the components is reasonable, the integration is high, and the detection efficiency is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 It is a schematic diagram of the structure of the chip cleaning and defect detection integrated device of the present invention;

[0047] Figure 2 A top view of the chip cleaning and defect detection integrated device of the present invention;

[0048] Figure 3 It is a structural schematic diagram of the material loading and transferring module of the present invention;

[0049] Figure 4 It is a structural schematic diagram of the material locator of the present invention;

[0050] Figure 5 It is a structural schematic diagram of the ejecting mechanism of the present invention;

[0051] Figure 6 It is a structural schematic diagram of the transport mechanism of the present invention;

[0052] Figure 7 It is a structural schematic diagram of the end face detector of the present invention;

[0053] Figure 8 It is a structural schematic diagram of the first detection platform of the present invention;

[0054] Fig. 9 It is a structural schematic diagram of the front detection mechanism of the present invention;

[0055] Fig.10 It is a structural schematic diagram of the cleaning station of the present invention;

[0056] Fig.11 It is a structural schematic diagram of the cleaning device of the present invention;

[0057] Fig.12 It is a structural schematic diagram of the gold wire detection mechanism of the present invention;

[0058] Fig.13 It is a structural schematic diagram of the blanking mechanism of the present invention.

[0059] [Description of Reference Numerals]

[0060] 1: rack;

[0061] 2: feeding mechanism; 21: feeding and transferring module; 22: material positioner; 23: ejector mechanism; 231: ejector pin;

[0062] 3: transport mechanism; 31: suction nozzle; 32: horizontal transfer module; 33: vertical lifting module; 34: rotary drive; 35: belt;

[0063] 4: end surface detection mechanism; 41: first detection station; 411: suction head; 42: end surface detector;

[0064] 5: Back detection mechanism;

[0065] 6: cleaning mechanism; 61: cleaning table; 62: cleaning device; 63: end face re-inspection mechanism;

[0066] 7: front detection mechanism; 71: T-shaped bracket; 72: front detector; 73: cleaning positioner;

[0067] 8: Unloading mechanism;

[0068] 9: gold wire detection mechanism; 91: longitudinal transfer module; 92: second detection station; 93: gold wire detector. DETAILED DESCRIPTION

[0069] In order to better explain the present invention and facilitate understanding, the present invention is described in detail below through specific implementation modes in conjunction with the accompanying drawings.

[0070] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0071] In addition, in the present invention, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0072] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; "connection" can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0073] See also Figure 1 , Figure 2 , Figure 5 , Fig.10 , Fig.11 and Fig.13 The present invention provides an integrated chip cleaning and defect detection device, which includes a frame 1, a loading mechanism 2, a conveying mechanism 3, an end face detection mechanism 4, a back face detection mechanism 5, a cleaning mechanism 6, a front face detection mechanism 7, a gold wire detection mechanism 9 and a unloading mechanism 8; the loading mechanism 2, the end face detection mechanism 4, the back face detection mechanism 5, the cleaning mechanism 6, the gold wire detection mechanism 9 and the unloading mechanism 8 are sequentially arranged on the frame 1 in the horizontal direction, and can all slide in the longitudinal direction; the conveying mechanism 3 is mounted on the frame 1 and can slide in the horizontal direction on the frame 1; the suction nozzle 31 of the conveying mechanism 3 can be lifted and lowered in the vertical direction; the front face detection mechanism 7 is arranged above the end face detection mechanism 4; wherein the cleaning mechanism 6 includes a cleaning table 61, a cleaner 62 and an end face re-inspection mechanism 63; the cleaning table 61 is slidably arranged on the frame 1 in the longitudinal direction; the cleaner 62 and the end face re-inspection mechanism 63 are correspondingly arranged on the side of the cleaning table 61. The chip cleaning and defect detection integrated equipment of the present invention can detect and clean chips such as COC, CHIP, Bar and COS.

[0074] The end face detection mechanism 4, the back face detection mechanism 5, the front face detection mechanism 7 and the gold wire detection mechanism 9 respectively detect defects on the end face, back face, front face and gold wire of the workpiece, perform comprehensive defect detection on the workpiece, and improve the control quality of the equipment for workpiece defect detection.

[0075] The feeding mechanism 2 can rotate horizontally between the feeding mechanism 2, the end face detection mechanism 4, the back face detection mechanism 5, the cleaning mechanism 6, the gold wire detection mechanism 9 and the unloading mechanism 8, and the equipment has a high degree of integration. The feeding mechanism 2, the end face detection mechanism 4, the back face detection mechanism 5, the cleaning mechanism 6, the gold wire detection mechanism 9 and the unloading mechanism 8 can all slide longitudinally to achieve loading and unloading or compensation adjustment of the workpiece position, improve the placement accuracy of the workpiece, and thus improve the reliability of the equipment.

[0076] The front detection mechanism 7 is arranged above the end detection mechanism 4 to achieve synchronous detection of the front and end faces of the workpiece, thereby improving the detection efficiency.

[0077] The cleaning mechanism 6 selects to clean or not clean the workpiece according to the detection result of the end face detection mechanism 4. When the workpiece does not need to be cleaned, it is directly moved from the back detection mechanism 5 to the gold wire detection mechanism 9 for gold wire detection. The equipment has a high degree of intelligence and high detection efficiency. When the workpiece needs to be cleaned, the workpiece is placed on the cleaning table 61, and the end face of the workpiece is cleaned by the cleaner 62. After cleaning, the end face of the workpiece is re-inspected by the end face re-inspection mechanism 63, and there is no need to move to the end face detection mechanism 4 for detection, which improves the detection efficiency when the workpiece is dirty.

[0078] The feeding mechanism 2, the end face detection mechanism 4, the back face detection mechanism 5, the cleaning mechanism 6, the gold wire detection mechanism 9 and the unloading mechanism 8 are arranged in sequence in the horizontal direction. By sequentially detecting the end face (and the front face), the back face and the gold wire of the workpiece, defective products can be screened out in advance to prevent defective products from flowing into the later process and occupying production time; the end face detection mechanism 4 can also detect whether the end face of the workpiece is dirty. If there is dirt, the cleaning mechanism 6 is used to clean and re-inspect the end face before detecting the gold wire of the workpiece. The layout between the components is reasonable, the integration is high, and the detection efficiency is high.

[0079] like Figures 3 to 5As shown, the feeding mechanism 2 includes a feeding and transferring module 21, a material positioner 22 and a material ejecting mechanism 23; the feeding and transferring module 21 is slidably arranged on the frame 1 in the longitudinal direction; the material positioner 22 is mounted on the frame 1 and is located above the feeding and transferring module 21; the material ejecting mechanism 23 is arranged on the side of the feeding and transferring module 21; the ejector pin 231 of the ejector pin 231 can be lifted and lowered vertically; the suction nozzle 31 can be lifted and lowered above the ejector pin 231. Specifically, a blue film is manually loaded on the feeding mechanism 2, and a chip is adhered to the blue film. The feeding mechanism 2 transports the chip to the pre-scanning station, and the material positioner 22 takes a picture for positioning, so that the suction nozzle 31 can take the material with high precision. In addition, before the suction nozzle 31 takes the material, the ejector pin 231 is lifted and lowered to separate the chip from the blue film, which is convenient for the suction nozzle 31 to take the material, thereby improving the reliability of the equipment. In this embodiment, the material ejection mechanism 23 is disposed on one side of the loading and transferring module 21 close to the end surface detection mechanism 4 to shorten the material picking movement path of the transport mechanism 3 on the loading and transferring module 21, thereby improving the detection efficiency.

[0080] See also Figure 6 The transport mechanism 3 also includes a lateral transfer module 32, a vertical lifting module 33, a rotary drive 34 and a belt 35; the lateral transfer module 32 is slidably connected to the frame 1; the vertical lifting module 33 is arranged on the lateral transfer module 32; the rotary drive 34 is arranged on the vertical lifting module 33; a driving wheel is arranged on the rotary drive 34; a driven wheel is arranged on the suction nozzle 31; the driving wheel and the driven wheel are connected by a belt 35; the rotary drive 34 can drive the suction nozzle 31 to rotate vertically. Specifically, the suction nozzle 31 absorbs the workpiece through vacuum, and the rotary drive 34 is an electric motor. Through the effective cooperation between the master and slave wheels and the belt 35, the rotary drive 34 can adjust the placement angle of the suction nozzle 31 in the horizontal plane, and the position information required for compensation adjustment is calculated according to the detection result of the corresponding detector, thereby reducing the workpiece placement error and improving the detection quality of the workpiece.

[0081] In one embodiment, a first conveying mechanism is provided between the loading mechanism 2 and the end face detection mechanism 4; a second conveying mechanism is provided between the end face detection mechanism 4 and the cleaning mechanism 6; a third conveying mechanism is provided between the cleaning mechanism 6 and the gold wire detection mechanism 9; a fourth conveying mechanism is provided between the gold wire detection mechanism 9 and the unloading mechanism 8; the first conveying mechanism, the second conveying mechanism, the third conveying mechanism and the fourth conveying mechanism are slidably provided on the frame 1 in sequence along the horizontal direction. Specifically, the first conveying mechanism, the second conveying mechanism, the third conveying mechanism and the fourth conveying mechanism operate independently and have clear division of labor. Compared with the embodiment in which only one conveying mechanism 3 is provided, the four conveying mechanisms 3 operate in a targeted manner, which can effectively reduce the working hours of workpiece detection or cleaning of a single station, that is, defect detection of multiple chips can be performed on the equipment at the same time, and there is no need to wait for one chip to complete cleaning and all-round detection before loading the next chip, thereby improving the detection efficiency.

[0082] like Figure 7 As shown, the end face detection mechanism 4 includes a first detection platform 41 and a pair of end face detectors 42; the end face detector 42 is slidably arranged on the frame 1 along the longitudinal direction; the pair of end face detectors 42 are arranged one by one on both sides of the first detection platform 41; and the front detection mechanism 7 is arranged above the first detection platform 41. Specifically, the pair of end face detectors 42 are arranged corresponding to the two side cavity surfaces of the workpiece, so that after the workpiece is placed on the first detection platform 41, the front detection mechanism 7 and the pair of end face detectors 42 can directly detect the front and two side cavity surfaces of the workpiece. For the embodiment in which only one end face detector 42 is set, it is necessary to make the first detection platform 41 drive the workpiece to rotate 180° before the other cavity surface can be detected. Therefore, it is more efficient to set a pair of end face detectors 42 to perform end face detection on the workpiece.

[0083] See also Figure 8 , a suction head 411 that can rotate vertically is provided on the first inspection table 41. In this embodiment, each transfer module is a motor screw module, and the cleaning positioner 73 is a laser sensor; the material positioner 22, the end face detector 42, the front detector 72, the end face re-inspection mechanism 63, the back detection mechanism 5 and the gold wire detector 93 are detection cameras; a third inspection table is provided on the back detection mechanism 5, and the first inspection table 41, the second inspection table 92, the third inspection table and the cleaning table 61 are all of the same type of inspection table structure, and the inspection table is provided with a suction head 411 that can rotate vertically, so as to be able to compensate and adjust the workpiece placement position and reduce the influence of the workpiece placement error.

[0084] like Fig. 9As shown, the front detection mechanism 7 includes a T-shaped bracket 71, and a front detector 72 and a cleaning positioner 73 correspondingly arranged on both sides of the top of the T-shaped bracket 71; the bottom end of the T-shaped bracket 71 is connected to the frame 1; the front detector 72 is arranged above the end face detection mechanism 4; and the cleaning positioner 73 is arranged above the cleaning mechanism 6. Specifically, the front detector 72 and the cleaning positioner 73 are both arranged on the T-shaped bracket 71, which improves the integration of the equipment and reduces the occupied space of the equipment. The front detector 72 can detect the front defects of the workpiece and scan the placement position information of the workpiece on the first inspection table 41. The cleaning positioner 73 can position the workpiece during the cleaning process, improve the movement accuracy of the nozzle of the cleaner 62, and improve the cleaning quality of the cleaner 62.

[0085] See also Fig.12 , the gold wire detection mechanism 9 includes a longitudinal transfer module 91, a second detection platform 92 and a gold wire detector 93; the longitudinal transfer module 91 is slidably arranged on the frame 1 along the longitudinal direction; the second detection platform 92 and the gold wire detector 93 are both arranged on the longitudinal transfer module 91; and the gold wire detector 93 is arranged above the second detection platform 92. In this embodiment, one gold wire detector 93 is arranged directly above the second detection platform 92, and the other gold wire detector 93 is arranged obliquely above the second detection platform 92. The second detection platform 92 is provided with a suction head 411 that can rotate vertically. The suction head 411 can be used for compensating and adjusting the placement position of the workpiece, and can also rotate the workpiece in a horizontal plane, and cooperate with the gold wire detector 93 to detect the gold wire of the workpiece, which has strong flexibility and comprehensive gold wire detection.

[0086] Furthermore, the cleaning device 62 is a snowflake cleaning device. A snowflake cleaning device is also known as dry ice cleaning. The dry ice particles of the dry ice cleaning device are sprayed onto the surface of the workpiece to be cleaned through high-pressure air, and the physical reaction of the temperature difference is used to make different substances separate at different shrinkage speeds to achieve a decontamination effect. The snowflake cleaning method is relatively gentle, not easy to damage the workpiece, and the cleaning is fast and efficient.

[0087] In addition, the present invention also provides a detection method for a chip cleaning and defect detection integrated device. The detection method for a chip cleaning and defect detection integrated device is implemented based on the above-mentioned chip cleaning and defect detection integrated device. The detection method comprises the following steps:

[0088] Loading the material at the loading mechanism 2, specifically placing the blue film with the chip attached on the loading mechanism 2;

[0089] The loading mechanism 2 moves the chip to the pre-scanning station, and the material locator 22 takes a photo to locate it; the transport mechanism 3 accurately picks up the material on the loading mechanism 2 according to the positioning information of the material locator 22, and transports the workpiece to the first inspection table 41; the end face inspection mechanism 4 performs end face defect inspection on the workpiece, and the front face inspection mechanism 7 performs front face defect inspection on the workpiece; if the end face defect inspection and the front face defect inspection are both OK, the following steps are executed, otherwise the defective products are screened out and the material is discharged;

[0090] The transport mechanism 3 transports the workpiece to the back detection mechanism 5; the back detection mechanism 5 performs back defect detection on the workpiece;

[0091] If dirt is detected during the end face defect detection, the transport mechanism 3 transports the workpiece to the cleaning table 61, the cleaning device 62 cleans the workpiece, and the end face re-inspection mechanism 63 re-inspects the end face of the workpiece after cleaning; if dirt is not detected during the end face defect detection, the transport mechanism 3 directly transports the workpiece to the gold wire detection mechanism 9 for gold wire detection;

[0092] The transport mechanism 3 transports the workpiece to the unloading mechanism 8 for unloading, specifically, unloading the chip onto the parent-child ring on the unloading mechanism 8 .

[0093] If the end surface re-inspection result of the workpiece by the rear end surface re-inspection mechanism 63 after cleaning is OK, the workpiece is transported to the gold wire detection mechanism 9 through the conveying mechanism 3. Otherwise, the equipment alarms and the operator eliminates the error.

[0094] The chip cleaning and defect detection integrated device of the present invention is arranged according to priority when performing defect detection, that is, the end face (front), back face and gold wire of the workpiece are defectively detected one by one. If an appearance defect is detected, the defective products are directly screened out of the equipment to prevent the defective products from flowing into the next process and occupying production time. If dirt is detected on the end face of the workpiece, the workpiece is transported to the cleaning mechanism 6 for cleaning and the end face is re-inspected, so that the workpiece finally unloaded by the unloading mechanism 8 has a good appearance and is free of dirt, which effectively improves the quality control level of the workpiece. When the workpiece is not detected to be dirty, the cleaning mechanism 6 is not enabled, and the equipment is flexible in use, which can not only ensure the unloading quality of the workpiece, but also shorten the production time of the workpiece and improve production efficiency.

[0095] It should be understood that the above description of the specific embodiments of the present invention is only for illustrating the technical route and features of the present invention, and its purpose is to enable those skilled in the art to understand the content of the present invention and implement it accordingly, but the present invention is not limited to the above specific implementation methods. Any changes or modifications made within the scope of the claims of the present invention should be included in the protection scope of the present invention.

Claims

1. A chip cleaning and defect detection integrated device, characterized in that: The chip cleaning and defect detection integrated device comprises a frame (1), a loading mechanism (2), a transport mechanism (3), an end face detection mechanism (4), a back face detection mechanism (5), a cleaning mechanism (6), a front face detection mechanism (7), a gold wire detection mechanism (9) and a unloading mechanism (8); The feeding mechanism (2), the end face detection mechanism (4), the back face detection mechanism (5), the cleaning mechanism (6), the gold wire detection mechanism (9) and the unloading mechanism (8) are sequentially arranged on the frame (1) in a transverse direction, and are all capable of sliding in a longitudinal direction; The transport mechanism (3) is mounted on the frame (1) and is capable of sliding laterally on the frame (1); the suction nozzle (31) of the transport mechanism (3) is capable of rising and falling vertically; The front detection mechanism (7) is arranged above the end detection mechanism (4); The cleaning mechanism (6) comprises a cleaning table (61), a cleaning device (62) and an end face re-inspection mechanism (63); the cleaning table (61) is slidably arranged on the frame (1) along the longitudinal direction; the cleaning device (62) and the end face re-inspection mechanism (63) are correspondingly arranged on the side of the cleaning table (61).

2. The chip cleaning and defect detection integrated device according to claim 1, characterized in that: The feeding mechanism (2) comprises a feeding and transferring module (21), a material positioner (22) and a material ejecting mechanism (23); The loading and transferring module (21) is slidably arranged on the frame (1) along the longitudinal direction; The material locator (22) is mounted on the frame (1) and is located above the loading and transferring module (21); The ejection mechanism (23) is arranged on the side of the loading and transferring module (21); the ejector pin (231) of the ejection mechanism (23) can be lifted and lowered vertically; The suction nozzle (31) can be raised and lowered above the ejector pin (231).

3. The chip cleaning and defect detection integrated device according to claim 1, characterized in that: The transport mechanism (3) further comprises a lateral transfer module (32), a vertical lifting module (33), a rotary drive (34) and a belt (35); The lateral transfer module (32) is slidably connected to the frame (1); the vertical lifting module (33) is arranged on the lateral transfer module (32); the rotary drive (34) is arranged on the vertical lifting module (33); The rotary drive (34) is provided with a driving wheel; the suction nozzle (31) is provided with a driven wheel; the driving wheel and the driven wheel are connected by the belt (35); the rotary drive (34) can drive the suction nozzle (31) to rotate around the vertical direction.

4. The chip cleaning and defect detection integrated device according to claim 3, characterized in that: A first transport mechanism is provided between the feeding mechanism (2) and the end surface detection mechanism (4); A second transport mechanism is provided between the end surface detection mechanism (4) and the cleaning mechanism (6); A third transport mechanism is provided between the cleaning mechanism (6) and the gold wire detection mechanism (9); A fourth transport mechanism is provided between the gold wire detection mechanism (9) and the material unloading mechanism (8); The first conveying mechanism, the second conveying mechanism, the third conveying mechanism and the fourth conveying mechanism are slidably arranged on the frame (1) in sequence along the transverse direction.

5. The chip cleaning and defect detection integrated device according to claim 1, characterized in that: The end face detection mechanism (4) comprises a first detection platform (41) and a pair of end face detectors (42); The end face detector (42) is slidably arranged on the frame (1) along the longitudinal direction; a pair of the end face detectors (42) are arranged on both sides of the first detection platform (41) in a one-to-one correspondence; The front detection mechanism (7) is arranged above the first detection platform (41).

6. The chip cleaning and defect detection integrated device according to claim 5, characterized in that: The first detection platform (41) is provided with a suction head (411) which rotates around the vertical direction.

7. The chip cleaning and defect detection integrated device according to claim 1, characterized in that: The front detection mechanism (7) comprises a T-shaped bracket (71), and a front detector (72) and a cleaning positioner (73) respectively arranged on both sides of the top of the T-shaped bracket (71); The bottom end of the T-shaped bracket (71) is connected to the frame (1); The front detector (72) is arranged above the end surface detection mechanism (4); and the cleaning positioner (73) is arranged above the cleaning mechanism (6).

8. The chip cleaning and defect detection integrated device according to claim 1, characterized in that: The gold wire detection mechanism (9) comprises a longitudinal transfer module (91), a second detection platform (92) and a gold wire detector (93); The longitudinal transfer module (91) is slidably arranged on the frame (1) along the longitudinal direction; The second inspection platform (92) and the gold wire detector (93) are both arranged on the longitudinal transfer module (91); and the gold wire detector (93) is arranged above the second inspection platform (92).

9. The chip cleaning and defect detection integrated device according to claim 1, characterized in that: The washer (62) is a snowflake washer.

10. A detection method for integrated chip cleaning and defect detection equipment, characterized in that: The detection method of the chip cleaning and defect detection integrated device is implemented based on the chip cleaning and defect detection integrated device according to any one of claims 1 to 9, and the detection method comprises the following steps: Loading material at the loading mechanism (2); The transport mechanism (3) takes material from the loading mechanism (2) and transports the workpiece to the end face detection mechanism (4); the end face detection mechanism (4) performs end face defect detection on the workpiece, and the front face detection mechanism (7) performs front face defect detection on the workpiece; The transport mechanism (3) transports the workpiece to the back side detection mechanism (5); the back side detection mechanism (5) performs back side defect detection on the workpiece; If dirt is detected during the end face defect detection, the transport mechanism (3) transports the workpiece to the cleaning table (61), the cleaning device (62) cleans the workpiece, and after cleaning, the end face re-inspection mechanism (63) re-inspects the end face of the workpiece; if dirt is not detected during the end face defect detection, the transport mechanism (3) directly transports the workpiece to the gold wire detection mechanism (9) for gold wire detection; The transport mechanism (3) transports the workpiece to the unloading mechanism (8) for unloading.

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