A detection device and detection method for automotive semiconductor chips
By introducing chip switching devices, automatic clamping devices and uniform diffusion devices into the chip detection equipment, the problems of cumbersome steps and low detection efficiency when detecting chips of different sizes are solved, and efficient and accurate chip detection is achieved.
Patent Information
- Application Number
- CN202510033153.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-09
- Publication Date
- 2025-04-11
- Estimated Expiration
- 2045-01-09
AI Technical Summary
When existing chip detection equipment detects chips of different sizes, the steps are cumbersome, the detection efficiency is low, and the internal environment is susceptible to external influences, affecting the accuracy of the detection results.
A detection device for automotive semiconductor chips is designed, and a chip switching device, an automatic clamping device and a uniform diffusion device are used to realize automatic switching of chips, automatic clamping of closed doors and uniform diffusion of the environment.
Through automated chip switching and environmental control, detection efficiency is improved, operating steps are reduced, and the accuracy and reliability of detection results are ensured.
Smart Images

Figure CN119471325B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of chip detection equipment, and in particular to a detection device and a detection method for automotive-grade semiconductor chips. Background Art
[0002] Automotive semiconductor chips, also known as automotive chips, refer to chips that are designed and manufactured specifically for automotive applications and meet the strict standards of the automotive industry. These chips are widely used in the fields of automotive body control devices, vehicle-mounted monitoring devices, and vehicle-mounted electronic control devices, and play a vital role. They are mainly distributed in body control modules, vehicle-mounted infotainment systems, powertrain integrated control systems, active safety systems, advanced driver assistance systems, and other aspects. In new energy vehicles, due to the increase in the application scenarios of motor control systems and battery management systems, the use of semiconductor chips is more than that of traditional fuel vehicles. At the same time, due to the rapid development of electric vehicles in my country, the use of automotive semiconductor chips is increasing.
[0003] It should be noted that during the production process of the chip, the tolerance of the chip needs to be tested. During the test, the chip is placed in the test body, and then the test body blows hot air or water vapor to the chip through its own air duct or air duct to simulate a high temperature environment or a humid environment to test the life of the chip in different environments. However, due to the different sizes of chips, the environmental requirements are also different. Generally, only chips of the same size can be tested, and then the closed door of the test body is opened and the chip is reinstalled. Not only are the steps very cumbersome, but the test efficiency is also low. In addition, the internal environment is easily affected by the external environment during the frequent opening and closing of the test body, which affects the accuracy of the test results. Summary of the invention
[0004] The purpose of the present invention is to provide a detection device and a detection method for automotive-grade semiconductor chips to solve the problems raised in the above-mentioned background technology.
[0005] To achieve the above object, the present invention provides the following technical solutions:
[0006] A testing device for automotive semiconductor chips, comprising a chip testing body, a closed door rotatably mounted on one side of the chip testing body, and a bearing base for placing the chip movably mounted in the chip testing body;
[0007] A chip switching device is installed on the carrier base, and the chip switching device is used to switch different types of chips; the chip switching device includes a plurality of carriers, and the plurality of carriers are movably installed in the carrier base, and a plurality of sealing covers are rotatably installed on the carrier base, and the sealing covers are used to seal the carriers in the carrier base, and a plurality of placement grooves for placing chips are opened on the carrier, and the carrier rises to lift the chips out of the carrier base;
[0008] It also includes an automatic clamping device, which is installed in the chip detection body and is used to clamp the closed door; the automatic clamping device includes a closed frame, which is installed on the closed door, and a clamping strip is installed on the closed frame. A plurality of blowing plates are provided in the chip detection body, and a clamping frame is installed on one side of the blowing plate, and the clamping frame is inserted on the clamping strip and is used to clamp the closed door;
[0009] It also includes a uniform diffusion device, which is movably installed in the chip detection body and is used to diffuse hot air or water vapor; the uniform diffusion device includes a diffusion tube rack, which is slidably installed on the bottom inner wall of the chip detection body, and the diffusion tube rack is connected to a blowing pipe and a water vapor pipe, and the blowing pipe and the water vapor pipe are respectively connected to the air duct and the air duct of the chip detection body.
[0010] Furthermore, in a preferred embodiment of the present invention, the chip switching device further comprises a plurality of mounting bars, the plurality of mounting bars are all mounted on the bearing base, and the plurality of sealing covers are rotatably mounted on the plurality of mounting bars respectively;
[0011] A torsion groove is provided in the installation strip, a connecting shaft is rotatably installed in the torsion groove, the sealing cover is installed on the connecting shaft, a torsion spring is installed on the connecting shaft, and the other end of the torsion spring is installed on the inner wall of the torsion groove.
[0012] Furthermore, in a preferred embodiment of the present invention, a plurality of driving shafts are rotatably mounted on one side of the bearing base, and a rotating push rod is mounted on each of the plurality of driving shafts;
[0013] A lifting frame is installed on the bottom side of each of the plurality of carrier frames, a lifting shaft is rotatably installed on each of the plurality of rotating push rods, and the plurality of lifting shafts are movably installed in each of the plurality of lifting frames.
[0014] Furthermore, in a preferred embodiment of the present invention, a driving column is installed at the other end of each of the plurality of driving shafts, a plurality of movable plates are movably installed on one side of the bearing base, and a push rod is installed on the bottom side of each of the plurality of movable plates;
[0015] The plurality of driving columns are each provided with an arc-shaped driving groove, and the plurality of pushing rods are respectively and movably installed in the plurality of driving grooves.
[0016] Furthermore, in a preferred embodiment of the present invention, a plurality of extrusion grooves are provided on one side of the bearing base, and a plurality of the movable plates are movably installed in the plurality of extrusion grooves respectively;
[0017] A return spring is installed on an inner wall of one side of the extrusion groove, and the other end of the return spring is installed on the moving plate.
[0018] Furthermore, in a preferred embodiment of the present invention, a cylinder is installed on one side of the bearing base, and a push bar is installed on the output end of the cylinder;
[0019] A pressing plate is installed on the pushing bar, and the pressing plate is used for pressing the moving plate.
[0020] Furthermore, in a preferred embodiment of the present invention, the automatic clamping device further comprises a plurality of connecting sleeves, and the plurality of connecting sleeves are all mounted on the top inner wall of the chip detection body;
[0021] A stretching rod is movably installed in each of the plurality of connecting sleeves, two stretching rods located on the same straight line are installed on one of the blowing plates, and a pull-back spring is connected between the connecting sleeve and the stretching rod.
[0022] Furthermore, in a preferred embodiment of the present invention, a plurality of clamping grooves are provided on the clamping strip, and a plurality of the clamping frames are respectively inserted into the plurality of the clamping grooves;
[0023] A plurality of warning lights are installed on one side of the closed door, switches are installed in the plurality of clamping slots, the plurality of warning lights are electrically connected to the plurality of switches respectively, and the clamping frame is inserted into the clamping slot for squeezing the switches.
[0024] Furthermore, in a preferred embodiment of the present invention, the uniform diffusion device further comprises a sliding block, the sliding block is slidably mounted on the inner wall of the bottom side of the chip detection body, the diffusion tube rack is mounted on the sliding block, and a rotating column is rotatably mounted in the sliding block;
[0025] A motor is installed in the chip detection body, the rotating column is installed on the output shaft of the motor through a coupling, a rotating hole is opened on the sliding block, the rotating column is rotatably installed in the rotating hole, a linkage groove is opened in a circular and inclined manner on the rotating column, a linkage block is installed on the inner wall of the rotating hole, the linkage block is located in the linkage groove, and the linkage block and the linkage groove are both arranged in an arc shape.
[0026] A method for detecting automotive semiconductor chips is performed according to the above-mentioned detection device for automotive semiconductor chips, and comprises the following steps:
[0027] S1. The cylinder drives the push bar to move, the push bar drives the extrusion plate to move, the extrusion plate squeezes a moving plate at the corresponding position to move, and drives the moving plate to drive the push rod to move, so that the push rod drives the driving column to rotate, the driving column rotates through the driving shaft to drive the rotating push rod to rotate, the rotating push rod drives the lifting frame to move through the lifting shaft, the lifting frame moves and drives the carrier frame to move up, and pushes the sealing cover to rotate and open, so that the chip at the required position is automatically lifted for testing;
[0028] S2, the closed door is closed, air or water vapor is blown into the chip detection body, and the blowing plates are moved downward, and the movement of the blowing plates drives the card-joining frame to be inserted into the card-joining groove, so that the card-joining strip is stuck, and the closed door is stuck;
[0029] S3, the card holder is inserted into the card slot and the switch is squeezed to turn on the warning light. The chip detection body is partially blocked, resulting in no air flow, so that the warning light at the corresponding position is not turned on, prompting the staff that the chip detection body is partially blocked;
[0030] S4. Start the motor to drive the rotating column to rotate. The rotating column rotates in the rotating hole, driving the sliding block to slide in the chip detection body. The sliding block drives the diffusion tube rack to evenly diffuse the hot air or water vapor in the chip detection body, so that the temperature or humidity in the chip detection body remains uniform.
[0031] The beneficial effects of the detection device and detection method for automotive-grade semiconductor chips proposed by the present invention are:
[0032] In the present invention, through the setting of the chip switching device, when placing the chips, the chips of the same size are placed on the same carrier rack. During detection, the carrier base is moved out by the carrier rack, and the sealing cover can be automatically opened, so that the chip at the required position can be automatically lifted for testing, and the chips at other positions can continue to be isolated and sealed by the sealing cover, which can achieve the purpose of switching and detecting chips of different sizes without opening the closed door, thereby detecting chips of various sizes, effectively improving the detection efficiency.
[0033] Furthermore, in the present invention, by setting an automatic clamping device, when detecting, the closed door is closed, so that the clamping frame can be inserted into the clamping slot, so that the clamping strip is clamped, and then the closed door is clamped, thereby avoiding the problem of the closed door being opened by mistake during detection. At the same time, when the clamping frame is inserted into the clamping slot, the switch at the corresponding position is squeezed open, and then the warning light at the corresponding position is turned on; if during the chip detection process, the chip detection body is partially blocked, resulting in uneven air outlet, so that the blowing plate at the corresponding position cannot be blown, and then the warning light at the corresponding position cannot be turned on, it is convenient for the staff to find the fault point in time, facilitate maintenance, and can be timely repaired to ensure the chip detection quality.
[0034] Furthermore, in the present invention, by setting up a uniform diffusion device, when the chip is inspected, the hot air or water vapor is evenly diffused in the chip inspection body by moving the diffusion tube rack, ensuring that the temperature or humidity in the chip inspection body remains uniform, further ensuring the inspection quality of the chip. BRIEF DESCRIPTION OF THE DRAWINGS
[0035] Figure 1 A schematic diagram of the three-dimensional structure of a detection device for automotive-grade semiconductor chips provided by an embodiment of the present invention;
[0036] Figure 2 A schematic diagram of the internal structure of a detection device for automotive-grade semiconductor chips provided by an embodiment of the present invention;
[0037] Figure 3 A schematic diagram of the structure of a connection between a carrier frame and a closed frame and other structures of a detection device for automotive-grade semiconductor chips provided by an embodiment of the present invention;
[0038] Figure 4 A schematic diagram of the structure of the connection between a supporting base and a sealing cover and other structures of a detection device for automotive-grade semiconductor chips provided by an embodiment of the present invention;
[0039] Figure 5 A schematic diagram of the structure of the connection between a supporting base and a cylinder and other structures of a detection device for automotive semiconductor chips provided by an embodiment of the present invention;
[0040] Figure 6 A detection device for automotive semiconductor chips provided in an embodiment of the present invention Figure 5 The structural diagram of part A in the figure;
[0041] Figure 7 A schematic diagram of a partial structure of a driving shaft and a driving column and other structures connected to a detection device for automotive semiconductor chips provided by an embodiment of the present invention;
[0042] Figure 8 A schematic diagram of a partial cross-sectional structure of a sealing cover and a mounting bar and other structures connected to a detection device for automotive-grade semiconductor chips provided by an embodiment of the present invention;
[0043] Fig. 9 A schematic diagram of a partial structure of a lifting frame and a rotating push rod and other structures connected to a detection device for automotive-grade semiconductor chips provided by an embodiment of the present invention;
[0044] Fig.10 A schematic diagram of a partial cross-sectional structure of a connection between a card strip and a card frame and other structures of a detection device for automotive-grade semiconductor chips provided by an embodiment of the present invention;
[0045] Fig.11 A schematic diagram of a partial cross-sectional structure of the connection between a diffusion tube rack and a water vapor pipe and other structures of a detection device for automotive-grade semiconductor chips provided in an embodiment of the present invention.
[0046] In the figure: 1-chip detection body; 2-enclosed door; 3-carrying base; 4-chip switching device; 401-carrying frame; 402-placing slot; 403-sealing cover; 404-installation bar; 405-torsion slot; 406-connecting shaft; 407-torsion spring; 408-lifting frame; 409-rotating push rod; 410-lifting shaft; 411-driving shaft; 412-driving column; 413-moving plate; 414-extrusion slot; 415-reset spring; 416-pushing rod; 417-driving slot; 418-pushing bar; 419 - extrusion plate; 420-cylinder; 5-automatic clamping device; 501-closing frame; 502-clamping strip; 503-warning light; 504-clamping groove; 505-switch; 506-clamping frame; 507-blowing plate; 508-stretching rod; 509-connecting sleeve; 510-return spring; 6-uniform diffusion device; 601-diffusion tube frame; 602-blowing tube; 603-sliding block; 604-rotating column; 605-motor; 606-rotating hole; 607-linkage block; 608-linkage groove; 609-water vapor pipe. DETAILED DESCRIPTION
[0047] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.
[0048] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0049] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.
[0050] In addition, in the description of the present invention, it should be noted that the terms "center", "upper", "lower", "vertical", "horizontal", "inside", "outside", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings, or the orientation or position relationship in which the invented product is usually placed when in use, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.
[0051] In addition, the terms "horizontal", "vertical", "vertical" and the like do not mean that the components are required to be absolutely vertical, but can be slightly tilted. For example, "vertical" only means that its direction is more vertical than "horizontal", and does not mean that the structure must be completely vertical, but can be slightly tilted.
[0052] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0053] Please refer to the attached manual Figure 1-11 An embodiment of the present invention provides a detection device for automotive-grade semiconductor chips, which includes a chip detection body 1, a closed door 2 is rotatably installed on one side of the chip detection body 1, and a supporting base 3 for placing the chip is movably installed in the chip detection body 1.
[0054] For further information, please refer to the attached manual. Figure 3-9, an embodiment of the present invention provides a detection device for automotive semiconductor chips, a chip switching device 4 is installed on the carrier base 3, and the chip switching device 4 is used to switch different types of chips; the chip switching device 4 includes a plurality of carriers 401, and the plurality of carriers 401 are movably installed in the carrier base 3, and a plurality of sealing covers 403 are rotatably installed on the carrier base 3, and the sealing covers 403 are used to seal the carriers 401 in the carrier base 3, and the carriers 401 are provided with a plurality of placement grooves 402 for placing chips, and the carriers 401 rise to lift the chips out of the carrier base 3. It should be noted that in the embodiment of the present invention, when placing chips, chips of the same size are placed on the same carrier 401, and when testing, the chips are moved out of the carrier base 3 through the carrier 401, and the sealing cover 403 can be automatically opened, so that the chips at the required position can be automatically lifted for testing, and the chips at other positions can continue to be isolated and sealed by the sealing cover 403, so that the chips of different sizes can be switched and tested without opening the closed door 2.
[0055] More specifically, in the embodiment of the present invention, an automatic clamping device 5 is further included, which is installed in the chip detection body 1 and is used to clamp the closed door 2; the automatic clamping device 5 includes a closed frame 501, which is installed on the closed door 2, and a clamping strip 502 is installed on the closed frame 501. A plurality of blowing plates 507 are provided in the chip detection body 1, and a clamping frame 506 is installed on one side of the blowing plate 507. The clamping frame 506 is inserted on the clamping strip 502 and is used to clamp the closed door 2. It should be noted that in the embodiment of the present invention, when testing, the closed door 2 is closed, so that the clamping frame 506 can be inserted into the clamping groove 504, so that the clamping strip 502 is clamped, and then the closed door 2 is clamped, so as to avoid the problem that the closed door 2 is opened by mistake during testing.
[0056] More specifically, in the embodiment of the present invention, a uniform diffusion device 6 is also included, which is movably installed in the chip detection body 1, and is used to diffuse hot air or water vapor; the uniform diffusion device 6 includes a diffusion tube rack 601, which is slidably installed on the inner wall of the bottom side of the chip detection body 1, and the diffusion tube rack 601 is connected with a blow pipe 602 and a water vapor pipe 609, and the blow pipe 602 and the water vapor pipe 609 are respectively connected to the air duct and the air duct of the chip detection body 1. It should be noted that in the embodiment of the present invention, when the chip is detected, the hot air or water vapor is evenly diffused in the chip detection body 1 by moving the diffusion tube rack 601, so as to ensure that the temperature or humidity in the chip detection body 1 remains uniform, and further ensure the detection quality of the chip.
[0057] Please continue to refer to the instruction manual Figure 3-9, further, in an embodiment of the present invention, a detection device for automotive-grade semiconductor chips is provided, the chip switching device 4 further includes a plurality of mounting bars 404, the plurality of mounting bars 404 are all mounted on the bearing base 3, and the plurality of sealing covers 403 are rotatably mounted on the plurality of mounting bars 404 respectively;
[0058] In addition, a torsion groove 405 is provided in the mounting bar 404, a connecting shaft 406 is rotatably mounted in the torsion groove 405, the sealing cover 403 is mounted on the connecting shaft 406, a torsion spring 407 is mounted on the connecting shaft 406, and the other end of the torsion spring 407 is mounted on the inner wall of the torsion groove 405. It should be noted that in the embodiment of the present invention, when the sealing cover 403 rotates, the connecting shaft 406 rotates in the mounting bar 404, and drives the torsion spring 407 to bear force, so that when the carrier 401 moves out of the carrier base 3, the sealing cover 403 can be automatically opened; when the carrier 401 moves downward, the resilience of the torsion spring 407 helps the sealing cover 403 to be automatically closed to isolate the chip.
[0059] More specifically, in the embodiment of the present invention, a plurality of driving shafts 411 are rotatably mounted on one side of the bearing base 3, and a rotating push rod 409 is mounted on each of the plurality of driving shafts 411; in addition, a lifting frame 408 is mounted on the bottom side of each of the plurality of bearing frames 401, and a lifting shaft 410 is rotatably mounted on each of the plurality of rotating push rods 409, and the plurality of lifting shafts 410 are movably mounted in each of the plurality of lifting frames 408. It should be noted that in the embodiment of the present invention, when the driving shaft 411 rotates, the rotating push rod 409 is driven to rotate, and the rotating push rod 409 drives the lifting frame 408 to move through the lifting shaft 410, and the lifting shaft 410 slides in the lifting frame 408, thereby enabling the bearing frame 401 to move upward.
[0060] More specifically, in the embodiment of the present invention, a driving column 412 is installed at the other end of each of the multiple driving shafts 411, and multiple moving plates 413 are movably installed on one side of the supporting base 3, and a push rod 416 is installed on the bottom side of each of the multiple moving plates 413; in addition, arc-shaped driving grooves 417 are provided on each of the multiple driving columns 412, and multiple pushing rods 416 are movably installed in the multiple driving grooves 417. It should be noted that in the embodiment of the present invention, when the moving plate 413 drives the pushing rod 416 to move, the pushing rod 416 moves in the driving groove 417, thereby driving the driving column 412 to rotate, so that the driving column 412 drives the rotating push rod 409 to rotate through the driving shaft 411, and the rotating push rod 409 drives the lifting frame 408 to move through the lifting shaft 410, thereby driving the supporting frame 401 to move upward.
[0061] Please continue to refer to the instruction manual Figure 3-9, more specifically, in the embodiment of the present invention, a plurality of extrusion grooves 414 are provided on one side of the bearing base 3, and a plurality of movable plates 413 are movably mounted in the plurality of extrusion grooves 414 respectively; a return spring 415 is mounted on the inner wall of one side of the extrusion groove 414, and the other end of the return spring 415 is mounted on the movable plate 413. It should be noted that in the embodiment of the present invention, when the movable plate 413 is squeezed, it moves in the extrusion groove 414 and drives the return spring 415 to be stressed, so that the return spring 415 can help the movable plate 413 to be reset under the resilience of the return spring 415, thereby facilitating the return of the bearing frame 401.
[0062] More specifically, in the embodiment of the present invention, a cylinder 420 is installed on one side of the bearing base 3, and a push bar 418 is installed on the output end of the cylinder 420; a pressing plate 419 is installed on the pushing bar 418, and the pressing plate 419 is used to press the moving plate 413. It should be noted that in the embodiment of the present invention, by starting the cylinder 420, the cylinder 420 drives the pushing bar 418 to move, and the pushing bar 418 drives the pressing plate 419 to move, so that the pressing plate 419 presses a moving plate 413 at a corresponding position, and then the carrier 401 drives the chip to move out of the bearing base 3 and automatically lift it for testing.
[0063] For further information, please refer to the attached manual. Figure 3 and Fig.10 , an embodiment of the present invention provides a detection device for automotive semiconductor chips, the automatic clamping device 5 also includes a plurality of connecting sleeves 509, the plurality of connecting sleeves 509 are all installed on the top inner wall of the chip detection body 1; a stretching rod 508 is movably installed in the plurality of connecting sleeves 509, two stretching rods 508 located on the same straight line are installed on a blowing plate 507, and a pull-back spring 510 is connected between the connecting sleeve 509 and the stretching rod 508. It should be noted that in the embodiment of the present invention, when blowing air in the chip detection body 1, the plurality of blowing plates 507 are blown downward, the blowing plates 507 are moved in the two connecting sleeves 509 through the two stretching rods 508, and the pull-back spring 510 is stretched by force, the blowing plates 507 move and drive the clamping frame 506 to be inserted into the clamping groove 504, so that the clamping strip 502 is stuck, and then the closed door 2 is stuck, so as to avoid the problem of the closed door 2 being opened by mistake during the detection process.
[0064] More specifically, in the embodiment of the present invention, a plurality of clamping slots 504 are provided on the clamping strip 502, and a plurality of clamping frames 506 are respectively inserted into the plurality of clamping slots 504; in addition, a plurality of warning lights 503 are installed on one side of the closed door 2, and switches 505 are installed in the plurality of clamping slots 504, and the plurality of warning lights 503 are respectively electrically connected to the plurality of switches 505, and the clamping frame 506 is inserted into the clamping slot 504 to squeeze the switches 505. It should be noted that in the embodiment of the present invention, when the clamping frame 506 is inserted into the clamping slot 504, the switches 505 at the corresponding positions are squeezed open, and then the warning lights 503 at the corresponding positions are turned on; if the chip detection body 1 is partially blocked during the chip detection process, resulting in uneven air discharge, the blowing plate 507 at the corresponding position cannot be blown, and then the warning lights 503 at the corresponding position cannot be turned on, which is convenient for the staff to find the fault point in time and facilitate maintenance.
[0065] Please refer to the instruction manual Figure 3 and Fig.11 , further, in an inspection device for automotive-grade semiconductor chips provided by an embodiment of the present invention, the uniform diffusion device 6 also includes a sliding block 603, the sliding block 603 is slidably mounted on the inner wall of the bottom side of the chip inspection body 1, the diffusion tube rack 601 is mounted on the sliding block 603, and a rotating column 604 is rotatably mounted in the sliding block 603;
[0066] In addition, a motor 605 is installed in the chip detection body 1, and a rotating column 604 is installed on the output shaft of the motor 605 through a coupling. A rotating hole 606 is opened on the sliding block 603, and the rotating column 604 is rotatably installed in the rotating hole 606. A linkage groove 608 is opened in a ring-shaped and inclined manner on the rotating column 604, and a linkage block 607 is installed on the inner wall of the rotating hole 606. The linkage block 607 is located in the linkage groove 608, and the linkage block 607 and the linkage groove 608 are both arc-shaped. It should be noted that, in the embodiment of the present invention, the starting motor 605 drives the rotating column 604 to rotate, and the rotating column 604 rotates in the rotating hole 606, so that the rotating column 604 drives the linkage block 607 to move through the linkage groove 608, so that the linkage block 607 drives the sliding block 603 to slide in the chip detection body 1, and when the rotating column 604 rotates one circle, the sliding block 603 moves back and forth once, so that the diffusion tube rack 601 diffuses the hot air or water vapor evenly in the chip detection body 1, ensuring that the temperature or humidity in the chip detection body 1 remains uniform.
[0067] In summary, the working principle of a detection device for automotive semiconductor chips provided by an embodiment of the present invention, that is, the method for performing detection using the detection device for automotive semiconductor chips according to an embodiment of the present invention, is as follows:
[0068] When placing the chips, the chips of the same size are placed on the same carrier 401. At this time, the carrier base 3 is installed in the chip detection body 1, and the cylinder 420 is started, so that the cylinder 420 drives the push bar 418 to move, and the push bar 418 drives the extrusion plate 419 to move. When the extrusion plate 419 moves to one side of a desired carrier 401, it squeezes a moving plate 413 at the corresponding position, and the moving plate 413 moves in the extrusion groove 414, and drives the reset spring 415 to be stressed. At the same time, the movement of the moving plate 413 drives the push rod 416 to move, so that the push rod 416 moves in the driving groove 417, and then the moving plate 413 moves. The driving column 412 is driven to rotate, and the driving column 412 rotates to drive the rotating push rod 409 to rotate through the driving shaft 411, and the rotating push rod 409 drives the lifting frame 408 to move through the lifting shaft 410, and the lifting shaft 410 slides in the lifting frame 408, and the lifting frame 408 moves to drive the carrier 401 to move up, and pushes the sealing cover 403 to rotate, and the sealing cover 403 rotates in the mounting bar 404 through the connecting shaft 406, and drives the torsion spring 407 to be stressed, so that when the carrier 401 moves out of the carrying base 3, the sealing cover 403 can be automatically opened, so that the chip at the required position can be automatically lifted for testing;
[0069] It should be noted that during the inspection, the closed door 2 needs to be closed, and the chip inspection body 1 blows air through its own air duct or air duct, thereby blowing multiple blowing plates 507 downward, and the blowing plates 507 move in the two connecting sleeves 509 through the two stretching rods 508, and drive the pull-back spring 510 to be stretched, and the blowing plates 507 move to drive the clamping frame 506 to be inserted into the clamping groove 504, so that the clamping strip 502 is stuck, and then the closed door 2 is stuck, and at the same time, when the clamping frame 506 is inserted into the clamping groove 504, the switch 505 at the corresponding position is squeezed open, and then the warning light 503 at the corresponding position is turned on; if the chip inspection body 1 is partially blocked during the chip inspection process, resulting in uneven air outlet, the blowing plates 507 at the corresponding position cannot be blown, and then the warning light 503 at the corresponding position cannot be turned on, which is convenient for the staff to find the fault point in time, facilitate maintenance, and can be timely repaired to ensure the inspection quality of the chip;
[0070] Furthermore, when the chip is being inspected, the motor 605 is started so that the motor 605 drives the rotating column 604 to rotate, and the rotating column 604 rotates in the rotating hole 606, so that the rotating column 604 drives the linkage block 607 to move through the linkage slot 608, so that the linkage block 607 drives the sliding block 603 to slide in the chip inspection body 1; in addition, when the diffusion tube rack 601 moves, hot air or water vapor can be blown into the chip inspection body 1 through the blowing pipe 602 or the water vapor pipe 609, so that the diffusion tube rack 601 diffuses the hot air or water vapor evenly in the chip inspection body 1, thereby ensuring that the temperature or humidity in the chip inspection body 1 remains uniform, and further ensuring the inspection quality of the chip.
[0071] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.
Claims
1. A detection device for automotive semiconductor chips, characterized in that: It comprises a chip detection body, a closed door is rotatably installed on one side of the chip detection body, and a bearing base for placing the chip is movably installed in the chip detection body; A chip switching device is installed on the carrier base, and the chip switching device is used to switch different types of chips; the chip switching device includes a plurality of carriers, and the plurality of carriers are movably installed in the carrier base, and a plurality of sealing covers are rotatably installed on the carrier base, and the sealing covers are used to seal the carriers in the carrier base, and a plurality of placement grooves for placing chips are opened on the carrier, and the carrier rises to lift the chips out of the carrier base; It also includes an automatic clamping device, which is installed in the chip detection body and is used to clamp the closed door; the automatic clamping device includes a closed frame, which is installed on the closed door, and a clamping strip is installed on the closed frame. A plurality of blowing plates are provided in the chip detection body, and a clamping frame is installed on one side of the blowing plate, and the clamping frame is inserted on the clamping strip and is used to clamp the closed door; It also includes a uniform diffusion device, which is movably installed in the chip detection body and is used to diffuse hot air or water vapor; the uniform diffusion device includes a diffusion tube rack, which is slidably installed on the inner wall of the bottom side of the chip detection body, and the diffusion tube rack is connected to a blowing pipe and a water vapor pipe, and the blowing pipe and the water vapor pipe are respectively connected to the air duct and the air duct of the chip detection body; The chip switching device further comprises a plurality of mounting bars, wherein the plurality of mounting bars are all mounted on the bearing base, and the plurality of sealing covers are rotatably mounted on the plurality of mounting bars respectively; A torsion groove is provided in the installation bar, a connecting shaft is rotatably installed in the torsion groove, the sealing cover is installed on the connecting shaft, a torsion spring is installed on the connecting shaft, and the other end of the torsion spring is installed on the inner wall of the torsion groove; A plurality of driving shafts are rotatably mounted on one side of the bearing base, and a rotating push rod is mounted on each of the plurality of driving shafts; A lifting frame is installed on the bottom side of each of the plurality of the carrier frames, a lifting shaft is rotatably installed on each of the plurality of the rotating push rods, and the plurality of the lifting shafts are movably installed in each of the plurality of the lifting frames; The other ends of the plurality of driving shafts are each installed with a driving column, a plurality of movable plates are movably installed on one side of the bearing base, and a push rod is installed on the bottom side of the plurality of movable plates; The plurality of driving columns are each provided with an arc-shaped driving groove, and the plurality of pushing rods are movably installed in the plurality of driving grooves respectively; A plurality of extrusion grooves are provided on one side of the bearing base, and the plurality of movable plates are movably installed in the plurality of extrusion grooves respectively; A return spring is installed on one inner wall of the extrusion groove, and the other end of the return spring is installed on the moving plate; A cylinder is installed on one side of the bearing base, and a push bar is installed on the output end of the cylinder; The pushing bar is provided with a pressing plate, and the pressing plate is used for pressing the moving plate; The automatic clamping device further comprises a plurality of connection sleeves, and the plurality of connection sleeves are all mounted on the top inner wall of the chip detection body; A stretching rod is movably installed in each of the plurality of connecting sleeves, two stretching rods located on the same straight line are installed on one of the blowing plates, and a pull-back spring is connected between the connecting sleeve and the stretching rod; The clamping strip is provided with a plurality of clamping slots, and the plurality of clamping frames are respectively inserted into the plurality of clamping slots; A plurality of warning lights are installed on one side of the closed door, switches are installed in the plurality of clamping slots, the plurality of warning lights are electrically connected to the plurality of switches respectively, and the clamping frame is inserted into the clamping slot for squeezing the switches.
2. The detection device for automotive semiconductor chips according to claim 1, characterized in that: The uniform diffusion device further comprises a sliding block, which is slidably mounted on the inner wall of the bottom side of the chip detection body, the diffusion tube rack is mounted on the sliding block, and a rotating column is rotatably mounted in the sliding block; A motor is installed in the chip detection body, the rotating column is installed on the output shaft of the motor through a coupling, a rotating hole is opened on the sliding block, the rotating column is rotatably installed in the rotating hole, a linkage groove is opened in a circular and inclined manner on the rotating column, a linkage block is installed on the inner wall of the rotating hole, the linkage block is located in the linkage groove, and the linkage block and the linkage groove are both arranged in an arc shape.
3. A method for detecting automotive semiconductor chips, which is performed according to the detection device for automotive semiconductor chips according to any one of claims 1-2, characterized in that: The following steps are involved: S1. The cylinder drives the push bar to move, the push bar drives the extrusion plate to move, the extrusion plate squeezes a moving plate at the corresponding position to move, and drives the moving plate to drive the push rod to move, so that the push rod drives the driving column to rotate, the driving column rotates through the driving shaft to drive the rotating push rod to rotate, the rotating push rod drives the lifting frame to move through the lifting shaft, the lifting frame moves and drives the carrier frame to move up, and pushes the sealing cover to rotate and open, so that the chip at the required position is automatically lifted for testing; S2, the closed door is closed, air or water vapor is blown into the chip detection body, and the blowing plates are moved downward, and the movement of the blowing plates drives the card-joining frame to be inserted into the card-joining groove, so that the card-joining strip is stuck, and the closed door is stuck; S3, the card holder is inserted into the card slot and the switch is squeezed to turn on the warning light. The chip detection body is partially blocked, resulting in no air flow, so that the warning light at the corresponding position is not turned on, prompting the staff that the chip detection body is partially blocked; S4. Start the motor to drive the rotating column to rotate. The rotating column rotates in the rotating hole, driving the sliding block to slide in the chip detection body. The sliding block drives the diffusion tube rack to evenly diffuse the hot air or water vapor in the chip detection body, so that the temperature or humidity in the chip detection body remains uniform.
Citation Information
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Chip aging test equipment
CN117092495A
Heat resistance detection device of power equipment chip
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