Temperature control device and electrical equipment

Abstract

The invention discloses a temperature control device which comprises a semiconductor cooler, a heater, a temperature detector and a controller, gas flows through the semiconductor cooler and the heater, the semiconductor cooler is used for cooling the gas, the heater is used for heating the gas, and the temperature detector is used for detecting the temperature of the gas. And the controller controls the semiconductor cooler and the heater to independently start working according to a detection result of the temperature detector. The controller controls the semiconductor refrigerator and the heater to start working independently according to the gas temperature detection result, the semiconductor refrigerator is responsible for refrigerating gas, and gas heating is completed by the independently arranged heater. According to the air conditioner, refrigerating or heating work can be independently carried out, combined work of refrigerating and heating can be achieved through linkage control, the temperature regulation and control range is widened, and the working efficiency of temperature regulation and control is improved. The invention further discloses the electrical equipment comprising the temperature control device.

Description

Technical Field

[0001] The present invention relates to the field of temperature control, and in particular to a temperature control device. In addition, the present invention also relates to an electrical device comprising the temperature control device. Background Art

[0002] With the advent of the intelligent era, the calculation and processing of information is increasing, and the heat generated by the core components of intelligent devices and their production equipment is increasing. Temperature control not only affects the service life of the equipment or components, but also causes functional defects, performance degradation, and yield reduction of the equipment. In the process of realizing the invention, the inventor found that there are at least the following problems in the prior art: when the existing semiconductor refrigeration components perform temperature control, they often only have heating function or cooling function, and the temperature control function is relatively single, and thus the temperature control range is narrow.

[0003] Therefore, how to provide a temperature control device that can perform cooling or heating work independently, or realize combined cooling and heating work through linkage control is a technical problem that technical personnel in this field currently need to solve. Summary of the invention

[0004] The object of the present invention is to provide a temperature control device and an electrical device to solve the problem that the existing semiconductor refrigeration device has a single gas temperature control function and a narrow temperature control range.

[0005] In order to solve the above technical problems, the present invention provides a temperature control device, including a semiconductor refrigerator, a heater, a temperature detector and a controller, wherein gas flows through the semiconductor refrigerator and the heater, the semiconductor refrigerator is used to cool the gas, the heater is used to heat the gas, the temperature detector is used to detect the gas temperature, and the controller controls the semiconductor refrigerator and / or the heater to start working according to the detection result of the temperature detector.

[0006] Preferably, it also includes a mass flow controller for controlling the gas flow rate, wherein the mass flow controller is connected to the gas inlet of the device and quantitatively delivers gas to the semiconductor refrigerator and the heater.

[0007] Preferably, the semiconductor refrigerator is connected to the heater, the outlet of the mass flow controller is connected to the inlet of the semiconductor refrigerator, the outlet of the semiconductor refrigerator is connected to the inlet of the heater, and the outlet of the heater is connected to the gas outlet of the equipment.

[0008] Preferably, it comprises an outer shell body, wherein the semiconductor refrigerator, the heater, the temperature detector, the controller and the mass flow controller are installed in the outer shell body, and the device gas inlet and the device gas outlet are provided at both ends of the outer shell body.

[0009] Preferably, the heater is an electric heater.

[0010] Preferably, a power supply unit is included, and the power supply unit is connected to the semiconductor refrigerator, the electric heater, the controller and the mass flow controller.

[0011] Preferably, the controller is a PID cascade controller, including a main PID controller and a secondary PID controller, and the temperature detector includes a first temperature sensor and a second temperature sensor, the first temperature sensor is used to detect the outlet temperature of the gas outlet of the equipment and feed back to the main PID controller, and the second temperature sensor is used to detect the cold end temperature of the semiconductor refrigerator and feed back to the secondary PID controller.

[0012] Preferably, the semiconductor refrigerator comprises a cold end heat exchange plate and a hot end heat exchange plate which are arranged at a relative interval, a semiconductor refrigeration sheet is attached between the cold end heat exchange plate and the hot end heat exchange plate, a cold end coil is arranged on the cold end heat exchange plate, the inlets in the two end interfaces of the cold end coil are connected to the gas inlet of the equipment, and a hot end coil is arranged on the hot end heat exchange plate, the two end interfaces of the hot end coil are respectively connected to the inlet and outlet of the cooling medium circulation system.

[0013] Preferably, the cold end heat exchange plate and the hot end heat exchange plate are metal plates.

[0014] The present invention provides an electrical device, comprising a temperature control device as described in any one of the above.

[0015] The present invention provides a temperature control device, comprising a semiconductor refrigerator, a heater, a temperature detector and a controller. Gas flows through the semiconductor refrigerator and the heater. The semiconductor refrigerator is used to cool the gas, the heater is used to heat the gas, the temperature detector is used to detect the gas temperature, and the controller controls the semiconductor refrigerator and / or the heater to start working according to the detection result of the temperature detector.

[0016] During operation, the gas enters from the gas inlet of the device, flows through the semiconductor refrigerator and the heater, and then flows out from the gas device outlet. At the same time, the temperature of the gas is detected. When the gas temperature is higher than the required temperature, the semiconductor refrigerator is started alone to cool the gas, and the heater is turned off. When the gas temperature is lower than the required temperature, the heater is started alone to heat the gas, and the semiconductor refrigerator is turned off. The semiconductor refrigerator and the heater are switched on in a quick response manner. The two components are used in combination or alone. When the semiconductor refrigerator does not need to switch the heat exchange mode, the semiconductor refrigerator is used for cooling, and the heating work is completed by a separate heater. The controller controls the semiconductor refrigerator and the heater to start working separately according to the gas temperature detection result, wherein the semiconductor refrigerator is responsible for cooling the gas, and the gas heating is completed by a separately set heater. The present invention can not only perform cooling or heating work alone, but also realize the combined work of cooling and heating through linkage control, thereby expanding the temperature control range and improving the working efficiency of temperature control.

[0017] The present invention also provides an electrical device comprising the above-mentioned temperature control device. Since the above-mentioned temperature control device has the above-mentioned technical effects, the above-mentioned electrical device should also have the same technical effects, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] FIG1 is a schematic structural diagram of a specific embodiment of a temperature control device provided by the present invention;

[0019] FIG2 is a control schematic diagram of a specific embodiment of the temperature control device provided by the present invention;

[0020] FIG3 is a schematic structural diagram of a cold end heat exchange plate in a specific implementation manner of the temperature control device provided by the present invention.

[0021] Among them, there are semiconductor refrigerator 1, cold end heat exchange plate 11, hot end heat exchange plate 12, semiconductor refrigeration plate 13, straight pipe 14, curved pipe 15, heater 2, controller 3, main PID controller 31, secondary PID controller 32, first temperature sensor 33, second temperature sensor 34, mass flow controller 4, equipment gas inlet 5, equipment gas outlet 6, power supply unit 7, and cooling medium circulation system 8. DETAILED DESCRIPTION

[0022] The core of the present invention is to provide a temperature control device and electrical equipment, which are equipped with a temperature detector, a semiconductor refrigerator and a heater. The controller controls the semiconductor refrigerator and the heater to start working separately according to the gas temperature detection result. Among them, the semiconductor refrigerator is responsible for cooling the gas, and the gas heating is completed by a separately arranged heater. The present invention can not only perform cooling or heating work separately, but also can realize the combined work of cooling and heating through linkage control, thereby expanding the temperature control range and improving the working efficiency of temperature control.

[0023] In order to enable those skilled in the art to better understand the solution of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0024] Please refer to FIG. 1 , which is a schematic structural diagram of a specific implementation of the temperature control device provided by the present invention.

[0025] A specific embodiment of the present invention provides a temperature control device, including a semiconductor refrigerator 1, a heater 2, a temperature detector and a controller 3, and has an equipment gas inlet 5 and an equipment gas outlet 6. A box can be set up to place the various components in the box, wherein the gas flows through the semiconductor refrigerator 1 and the heater 2, the semiconductor refrigerator 1 is used to cool the gas, the heater 2 is used to heat the gas, the temperature detector is used to detect the gas temperature, and the controller 3 controls the semiconductor refrigerator 1 and the heater 2 to start working separately according to the detection result of the temperature detector.

[0026] During operation, the gas enters from the gas inlet 5 of the device, flows through the semiconductor refrigerator 1 and the heater 2, and then flows out from the gas device outlet 6. At the same time, the temperature of the gas is detected. When the gas temperature is higher than the required temperature, the semiconductor refrigerator 1 is started alone to cool the gas, and the heater 2 is turned off. When the gas temperature is lower than the required temperature, the heater 2 is started alone to heat the gas, the semiconductor refrigerator 1 is turned off, and the semiconductor refrigerator 1 and the heater 2 are switched on in a quick response manner. The two components are used together. When the semiconductor refrigerator does not need to switch the heat exchange mode, the semiconductor refrigerator is used for cooling, and the heating work is completed by a separate heater. The controller controls the semiconductor refrigerator and the heater to start working separately according to the gas temperature detection result, wherein the semiconductor refrigerator is responsible for cooling the gas, and the gas heating is completed by a separately set heater. The present application can not only perform cooling or heating work alone, but also realize the combined work of cooling and heating through linkage control, which expands the temperature control range and improves the working efficiency of temperature control.

[0027] Preferably, in order to use high-precision equipment to achieve controllable and stable pressure and flow of the outlet gas, a mass flow controller 4 is also provided for controlling the gas flow rate. The mass flow controller 4 is connected to the gas inlet 5 of the equipment and quantitatively delivers gas to the semiconductor refrigerator 1 and the heater 2, thereby accurately controlling the gas flow rate and reducing terminal flow fluctuations and pressure fluctuations.

[0028] In the first embodiment, the outlet of the semiconductor refrigerator 1 is connected to the inlet of the heater 2. The equipment gas inlet 5 is connected to the inlet of the mass flow controller 4, the outlet of the mass flow controller 4 is connected to the inlet of the semiconductor refrigerator 1, the outlet of the semiconductor refrigerator 1 is connected to the inlet of the heater 2, and the outlet of the heater 2 is connected to the equipment gas outlet 6. During operation, the gas passes through the mass flow controller 4, the semiconductor refrigerator 1 and the heater 2 in sequence. During operation, the gas enters from the equipment gas inlet 5, flows through the semiconductor refrigerator 1 and the heater 2, and then flows out from the gas equipment outlet 6. At the same time, the temperature of the gas flowing out of the gas equipment outlet 6 is detected. When the temperature of the gas flowing out of the gas equipment outlet 6 is higher than the required temperature, the semiconductor refrigerator 1 is started alone to cool the gas, and the heater 2 is turned off. When the temperature of the gas flowing out of the gas equipment outlet 6 is lower than the required temperature, the heater 2 is started alone to heat the gas, and the semiconductor refrigerator 1 is turned off, so as to realize independent cooling or heating work. Or when the temperature of the gas flowing out of the gas equipment outlet 6 is higher than the required temperature, the semiconductor refrigerator 1 is started to cool the gas. If it is detected that the temperature of the gas output by the semiconductor refrigerator 1 is lower than the required temperature, the heater 2 is started to heat the gas output by the semiconductor refrigerator 1. The gas output by the heater 2 flows out from the gas equipment outlet 6. It is detected whether the temperature of the gas output from the gas equipment outlet 6 meets the temperature requirement. The cycle is repeated to realize the combined control of cooling and heating, expand the temperature control range, and improve the working efficiency of temperature control.

[0029] Among them, the positions of the semiconductor refrigerator 1 and the heater 2 can be exchanged, the device gas inlet 5 is connected to the inlet of the mass flow controller 4, the outlet of the mass flow controller 4 is connected to the inlet of the heater 2, the outlet of the heater 2 is connected to the inlet of the semiconductor refrigerator 1, and the outlet of the semiconductor refrigerator 1 is connected to the device gas outlet 6. During operation, the gas passes through the mass flow controller 4, the heater 2 and the semiconductor refrigerator 1 in sequence. During the operation, the gas enters from the device gas inlet 5, flows through the heater 2 and the semiconductor refrigerator 1, and flows out from the gas device outlet 6. At the same time, the temperature of the gas flowing out of the gas device outlet 6 is detected. When the temperature of the gas flowing out of the gas device outlet 6 is higher than the required temperature, the semiconductor refrigerator 1 is started alone to cool the gas, and the heater 2 is turned off. When the temperature of the gas flowing out of the gas device outlet 6 is lower than the required temperature, the heater 2 is started alone to heat the gas, and the semiconductor refrigerator 1 is turned off, so as to realize independent cooling or heating work. Or when the temperature of the gas flowing out of the gas equipment outlet 6 is lower than the required temperature, start the heater 2 to heat the gas. If it is detected that the temperature of the gas output by the heater 2 is higher than the required temperature, start the semiconductor refrigerator 1 to cool the gas output by the heater 2. The gas output by the semiconductor refrigerator 1 flows out from the gas equipment outlet 6. Check whether the temperature of the gas equipment outlet 6 meets the temperature requirement. Repeat this cycle to achieve combined control of cooling and heating, expand the temperature control range, and improve the working efficiency of temperature control.

[0030] In the second embodiment, the outlet of the mass flow controller 4 is connected to the inlet of the semiconductor refrigerator 1 and the heater 2 respectively. The equipment gas inlet 5 is connected to the inlet of the mass flow controller 4, and the outlet of the mass flow controller 4 is connected to the control valve. The control valve is connected to the inlet of the semiconductor refrigerator 1 and the heater 2 respectively, and the outlets of the semiconductor refrigerator 1 and the heater 2 are simultaneously connected to the equipment gas outlet 6. During operation, the gas enters from the equipment gas inlet 5, passes through the mass flow controller 4 and reaches the control valve, and one of the two output ports of the control valve is opened, such as the cooling output port of the control valve is opened, the semiconductor refrigerator 1 is turned on, and the heating output port of the control valve is closed, the heater 2 is isolated, and the gas flows out of the equipment gas outlet 6 through the semiconductor refrigerator 1. At the same time, the temperature of the gas is detected. When the gas temperature is higher than the required temperature, the cooling output port of the control valve is opened, the semiconductor refrigerator 1 is turned on, the heating output port of the control valve is closed, the heater 2 is isolated, and the semiconductor refrigerator 1 is started separately to cool the gas, and the heater 2 is turned off. When the gas temperature is lower than the required temperature, the cooling output port of the control valve is closed, the semiconductor refrigerator 1 is isolated, the heating output port of the control valve is opened, the heater 2 is turned on, and the heater 2 is started separately to heat the gas, and the semiconductor refrigerator 1 is turned off. Among them, the control valve can be a three-way switching valve, or a control valve group composed of two stop valves. Using various types of valves is within the protection scope of the present invention.

[0031] In the temperature control device provided in the specific embodiment of the present invention, the heater 2 is specifically an electric heater, which can be in the form of electric heating, semiconductor heating or other forms of heating devices.

[0032] A power supply unit 7 is also provided, and the power supply unit 7 is connected to the semiconductor refrigerator 1, the electric heater, the controller 3 and the mass flow controller 4. The power supply can be a battery or an external power supply. Furthermore, a filter or other equipment can be provided at the gas inlet 5 of the equipment to clean the gas and ensure the output of clean gas.

[0033] Please refer to FIG. 2 , which is a control schematic diagram of a specific implementation of the temperature control device provided by the present invention.

[0034] In the temperature control device provided in the specific embodiment of the present invention, the controller 3 is responsible for signal acquisition, signal processing, control instruction issuance, external communication, etc., so that the entire system can achieve the preset function. The controller 3 is a PID cascade controller, PID (Proportional Integral Derivative) is proportional, integral and differential, including a main PID controller 31 and a secondary PID controller 32, and the temperature detector includes a first temperature sensor 33 and a second temperature sensor 34. The first temperature sensor 33 is used to detect the outlet temperature of the gas outlet 6 of the equipment and feed it back to the main PID controller 31 to form an internal control closed loop. The second temperature sensor 34 is used to detect the cold end temperature of the semiconductor refrigerator 1 and feed it back to the secondary PID controller 32 to form an internal control closed loop. Specifically, during operation, the gas enters the device through the gas inlet 5, flows through the semiconductor refrigerator 1 and the heater 2, and then flows out from the gas device outlet 6. At the same time, the first temperature sensor 33 detects the temperature of the gas flowing out of the gas device outlet 6 and feeds back to the main PID controller 31. When the first temperature sensor 33 detects that the temperature of the gas flowing out of the gas device outlet 6 is higher than the required temperature, the semiconductor refrigerator 1 is started alone to cool the gas, and the heater 2 is turned off. When the first temperature sensor 33 detects that the temperature of the gas flowing out of the gas device outlet 6 is lower than the required temperature, the heater 2 is started alone to heat the gas, and the semiconductor refrigerator 1 is turned off, thereby realizing independent cooling or heating work. Or when the first temperature sensor 33 detects that the temperature of the gas flowing out of the gas device outlet 6 is higher than the required temperature, the semiconductor refrigerator 1 is started to cool the gas, and the second temperature sensor 34 detects the cold end temperature of the semiconductor refrigerator 1 and feeds back to the secondary PID controller 32. If the second temperature sensor 34 detects that the temperature of the gas output by the semiconductor refrigerator 1 is lower than the required temperature, the heater 2 is started to heat the gas output by the semiconductor refrigerator 1. The gas output by the heater 2 flows out of the gas device outlet 6, and the first temperature sensor 33 detects whether the temperature of the gas device outlet 6 meets the temperature requirement. The cycle is repeated to realize the combined control of cooling and heating, expand the temperature control range, and improve the working efficiency of temperature control. Among them, the positions of the semiconductor refrigerator 1 and the heater 2 can be exchanged, which will not be repeated here.

[0035] The second temperature sensor 34 may be disposed on the cold end heat exchange plate 11 of the semiconductor refrigerator 1 , or may be disposed at the outlet of the semiconductor refrigerator 1 .

[0036] The PID cascade controller introduces the control of two process variables. The PID cascade control can effectively suppress the interference and disturbance in the main process variable and improve the stability and anti-interference ability of the system. The adjustment of the secondary process variable can respond to the changes of the main process variable more quickly and pass it to the main PID controller 31 for corresponding adjustment. This can speed up the response speed of the system and improve the control effect. By correcting the set value of the main process variable according to the adjustment of the secondary process variable, the PID cascade control can achieve more precise control. It can eliminate the coupling effect between the main process variable and the secondary process variable and improve the control accuracy of the system. The PID cascade control can adjust the parameters of the main PID controller 31 and the secondary PID controller 32, as well as the setting of the set value, to make more flexible and precise adjustments to the system.

[0037] Please refer to FIG. 3 , which is a schematic diagram of the structure of a cold end heat exchange plate in a specific implementation of the temperature control device provided by the present invention.

[0038] On the basis of the temperature control device provided in the above specific embodiments, the semiconductor refrigerator 1 includes a cold end heat exchange plate 11 and a hot end heat exchange plate 12 arranged opposite to each other, with a gap between the cold end heat exchange plate 11 and the hot end heat exchange plate 12, a semiconductor refrigeration sheet 13 is attached between the cold end heat exchange plate 11 and the hot end heat exchange plate 12, and the two sides of the semiconductor refrigeration sheet 13 are attached to the inner side of the cold end heat exchange plate 11 and the hot end heat exchange plate 12 respectively, and a cold end coil is arranged on the outer side of the cold end heat exchange plate 11. In the first embodiment, the two end interfaces of the cold end coil are respectively connected to the mass flow controller 4 and the heater 2. Or when the positions of the semiconductor refrigerator 1 and the heater 2 are exchanged, the two end interfaces of the cold end coil are respectively connected to the heater 2 and the gas equipment outlet 6. In the second embodiment, the two end interfaces of the cold end coil are respectively connected to the mass flow controller 4 and the equipment gas outlet 6. The hot end heat exchange plate 12 is provided with a hot end coil, and the two end interfaces of the hot end coil are respectively connected to the inlet and outlet of the cooling medium circulation system 8. The cooling medium circulation system 8 is liquid cooling, which reduces the vibration and noise that cannot be eliminated by air cooling and improves the cooling effect.

[0039] Preferably, the cold end heat exchange plate 11 and the hot end heat exchange plate 12 are metal plates, and the cold end coil and the hot end coil are metal smooth tubes. Specifically, the cold end heat exchange plate 11 and the hot end heat exchange plate 12 can be aluminum alloy plates, and the cold end coil and the hot end coil are stainless steel smooth tubes. Other materials can also be used, all within the protection scope of the present invention. In order to ensure that the clean gas is not contaminated when it flows through the semiconductor refrigerator 1 for temperature control, the inside of the stainless steel pipe is electropolished, but the bends of the pipe will damage the electropolished layer on the inner wall of the pipe.

[0040] Therefore, the cold end coil includes a straight pipe 14 and a curved pipe 15. During processing, the straight pipe 14 and the curved pipe 15 are processed separately, and the inner walls of the separate straight pipe 14 and curved pipe 15 are electro-polished. Then, the straight pipe 14 and the curved pipe 15 are welded to form a coil structure, and the coil structure is cleaned after welding. The electro-polished layer on the inner wall of the stainless steel caused by the curved pipe is avoided, and a high-cleanliness gas transmission pipeline is realized.

[0041] In addition to the above-mentioned temperature control device, a specific embodiment of the present invention further provides an electrical device including the above-mentioned temperature control device. For the structures of other parts of the electrical device, please refer to the prior art and will not be described in detail herein.

[0042] Specifically, the above-mentioned electrical equipment may be high-precision equipment or medical equipment.

[0043] The temperature control device and electrical equipment provided by the present invention are introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A temperature control device, characterized in that: The invention comprises a semiconductor refrigerator (1), a heater (2), a temperature detector and a controller (3); gas flows through the semiconductor refrigerator (1) and the heater (2); the semiconductor refrigerator (1) is used to cool the gas; the heater (2) is used to heat the gas; the temperature detector is used to detect the temperature of the gas; and the controller (3) controls the semiconductor refrigerator (1) and / or the heater (2) to start working according to the detection result of the temperature detector.

2. The temperature control device according to claim 1, characterized in that: It also includes a mass flow controller (4) for controlling the gas flow rate, wherein the mass flow controller (4) is connected to the device gas inlet (5) and quantitatively delivers gas to the semiconductor refrigerator (1) and the heater (2).

3. The temperature control device according to claim 2, characterized in that: The semiconductor refrigerator (1) is connected to the heater (2), the outlet of the mass flow controller (4) is connected to the inlet of the semiconductor refrigerator (1), the outlet of the semiconductor refrigerator (1) is connected to the inlet of the heater (2), and the outlet of the heater (2) is connected to the equipment gas outlet (6).

4. The temperature control device according to claim 3, characterized in that: The invention comprises an outer shell body, wherein the semiconductor refrigerator (1), the heater (2), the temperature detector, the controller (3) and the mass flow controller (4) are installed in the outer shell body, and the device gas inlet (5) and the device gas outlet (6) are provided at both ends of the outer shell body.

5. The temperature control device according to claim 2, characterized in that: The heater (2) is specifically an electric heater.

6. The temperature control device according to claim 5, characterized in that: It comprises a power supply unit (7), wherein the power supply unit (7) is connected to the semiconductor refrigerator (1), the electric heater, the controller (3) and the mass flow controller (4).

7. The temperature control device according to claim 2, characterized in that: The controller (3) is a PID cascade controller, comprising a main PID controller (31) and a secondary PID controller (32); the temperature detector comprises a first temperature sensor (33) and a second temperature sensor (34); the first temperature sensor (33) is used to detect the outlet temperature of the gas outlet (6) of the device and feed it back to the main PID controller (31); the second temperature sensor (34) is used to detect the cold end temperature of the semiconductor refrigerator (1) and feed it back to the secondary PID controller (32).

8. The temperature control device according to any one of claims 2 to 7, characterized in that: The semiconductor refrigerator (1) comprises a cold end heat exchange plate (11) and a hot end heat exchange plate (12) which are arranged at a relative interval, a semiconductor cooling sheet (13) being bonded between the cold end heat exchange plate (11) and the hot end heat exchange plate (12), a cold end coil being arranged on the cold end heat exchange plate (11), an inlet of two end interfaces of the cold end coil being connected to the gas inlet (5) of the device, and a hot end coil being arranged on the hot end heat exchange plate (12), and two end interfaces of the hot end coil being respectively connected to an inlet and an outlet of a cooling medium circulation system (8).

9. The temperature control device according to claim 8, characterized in that: The cold end heat exchange plate (11) and the hot end heat exchange plate (12) are metal plate parts.

10. An electrical device, characterized in that: Comprising the temperature control device according to any one of claims 1 to 9.

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