High-speed parallel wiring with heat dissipation function

Abstract

The present application provides a high-speed parallel line pair with heat dissipation function, comprising two wire cores, a shielding layer, a heat dissipation layer, and a sheath layer. Along a first direction, the two wire cores are arranged in parallel; the shielding layer is wrapped around the outer periphery of the two wire cores; the heat dissipation layer is wrapped around the outer periphery of the shielding layer; the sheath layer is wrapped around the outer periphery of the heat dissipation layer; wherein the heat dissipation layer comprises a cold end layer, an electric cooling main body layer, and a hot end layer arranged in sequence, the cold end layer is thermally coupled with the shielding layer, the hot end layer is thermally coupled with the sheath layer, and the electric cooling main body layer is configured to form a temperature difference between the cold end layer and the hot end layer after power is supplied, so as to transfer the heat of the shielding layer to the sheath layer.

Description

Technical Field

[0001] The present application relates to the technical field of high-speed parallel lines, and in particular to a high-speed parallel line with a heat dissipation function. Background Art

[0002] High-speed parallel lines are generally composed of two parallel wire cores, which can achieve high-speed and high-precision signal transmission. The existing high-speed parallel lines are prone to heating of the wire core during operation, affecting the efficiency and accuracy of signal transmission. Summary of the invention

[0003] The present application provides a high-speed parallel line pair with a heat dissipation function to solve the problem in the prior art that the core of the high-speed parallel line is heated and affects signal transmission.

[0004] The present application provides a high-speed parallel line pair with heat dissipation function, comprising two wire cores, a shielding layer, a heat dissipation layer, and a sheath layer, wherein the two wire cores are arranged in parallel along a first direction; the shielding layer is wrapped around the outer periphery of the two wire cores; the heat dissipation layer is wrapped around the outer periphery of the shielding layer; the sheath layer is wrapped around the outer periphery of the heat dissipation layer; wherein the heat dissipation layer comprises a cold end layer, an electric cooling main body layer, and a hot end layer arranged in sequence, the cold end layer is thermally coupled with the shielding layer, the hot end layer is thermally coupled with the sheath layer, and the electric cooling main body layer is configured to form a temperature difference between the cold end layer and the hot end layer after power is supplied, so as to transfer the heat of the shielding layer to the sheath layer.

[0005] In a possible implementation, the high-speed parallel line pair with heat dissipation function also includes a temperature measuring line, which is arranged in the shielding layer and between the two wire cores, and is configured to monitor the temperature of the environment in the shielding layer.

[0006] In a possible implementation manner, the high-speed parallel line pair with heat dissipation function further includes a ground wire, and the ground wire is arranged in the shielding layer, and the ground wire is located between the two wire cores.

[0007] In a possible implementation manner, along a second direction, the ground line and the temperature measuring line are spaced apart, and the second direction intersects with the first direction;

[0008] The high-speed parallel line with heat dissipation function also includes a support frame. Along the first direction, the support frame is located between the two line cores. Along the second direction, the support frame is located between the temperature measuring line and the ground line.

[0009] In a possible implementation manner, the support frame is made of a heat-conducting material, and the support frame is thermally coupled with the two wire cores and the temperature measuring wire.

[0010] In a possible implementation, along the second direction, the temperature measuring wire is clamped between the inner wall of one side of the shielding layer and one end of the support frame, and the ground wire is clamped between the inner wall of the other side of the shielding layer and the other end of the support frame;

[0011] Along the first direction, one of the wire cores is clamped between the inner wall of one side of the shielding layer and one side of the support frame, and the other of the wire cores is clamped between the inner wall of the other side of the shielding layer and the other side of the support frame.

[0012] In a possible implementation manner, along the first direction, first accommodating grooves are respectively provided on opposite sides of the support frame, and the two wire cores are respectively partially accommodated in the two first accommodating grooves;

[0013] Along the second direction, two opposite ends of the support frame are respectively provided with second accommodating grooves, and the temperature measuring wire and the ground wire are respectively partially accommodated in the two second accommodating grooves.

[0014] In a possible implementation manner, the shielding layer is filled with a filling structure.

[0015] In a possible implementation, the high-speed parallel line pair with heat dissipation function also includes a control element, which is connected to the temperature measuring line signal and is used to receive the temperature signal detected by the temperature measuring line. Based on the temperature signal, the control element controls the current flowing into the electric cooling main layer.

[0016] In a possible implementation manner, the sheath layer is made of a heat-conductive and insulating material.

[0017] In the high-speed parallel line with heat dissipation function of the present application, a heat dissipation layer is arranged between the shielding layer and the sheath layer, and the heat dissipation layer is composed of a cold end layer, an electric cooling main layer and a hot end layer. The electric cooling main layer can form a temperature difference between the cold end layer and the hot end layer after being connected to an external power supply. The cold end layer then dissipates the heat of the shielding layer and transfers the heat to the hot end layer. The hot end layer then transfers the heat to the sheath layer, and then the heat dissipation of the shielding layer and its inner wire core can be completed by dissipating the heat of the sheath layer. It can complete its own heat dissipation when working in the high-speed parallel line, and avoid affecting its signal transmission efficiency and signal transmission accuracy due to the heating of the wire core. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic structural diagram of a high-speed parallel line with heat dissipation function in one embodiment of the present application.

[0019] Figure 2 for Figure 1 Schematic diagram of the structure of the heat dissipation layer of the high-speed parallel lines with heat dissipation function.

[0020] Figure 3 FIG. 1 is a schematic diagram of signal transmission of a high-speed parallel pair of lines with heat dissipation function in one embodiment of the present application.

[0021] Explanation of the main component symbols: 100, high-speed parallel line with heat dissipation function; X, first direction; Z, second direction; Y, third direction; 1, control element; 2, power supply component; 10, wire core; 11, wire; 12, insulation layer; 20, temperature measuring line; 30, thermal insulation; 40, support frame; 41, first receiving groove; 42, second receiving groove; 50, ground wire; 60, shielding layer; 70, heat dissipation layer; 71, cold end layer; 72, electric cooling main body layer; 73, hot end layer; 80, sheath layer; 90, filling structure.

[0022] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0023] The following description will refer to the accompanying drawings to more fully describe the content of the present application. Shown in the accompanying drawings are exemplary embodiments of the present application. However, the present application can be implemented in many different forms and should not be construed as being limited to the exemplary embodiments set forth herein. These exemplary embodiments are provided to make the present application thorough and complete, and to fully convey the scope of the present application to those skilled in the art. Similar reference numerals represent identical or similar components.

[0024] The terms used herein are only used for the purpose of describing specific exemplary embodiments and are not intended to limit the present application. As used herein, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to also include the plural forms. In addition, when used herein, "including" and / or "comprising" and / or "having", integers, steps, operations, components and / or components, but do not exclude the existence or addition of one or more other features, regions, integers, steps, operations, components and / or groups thereof.

[0025] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which this application belongs. In addition, unless explicitly defined herein, terms such as those defined in general dictionaries should be interpreted as having a meaning consistent with their meaning in the relevant technology and the content of this application, and will not be interpreted as an idealized or overly formal meaning.

[0026] The specific implementation methods of the present application are further described in detail below with reference to the accompanying drawings.

[0027] like Figure 1As shown, this embodiment provides a high-speed parallel line pair 100 with heat dissipation function, including two line cores 10, a shielding layer 60, a heat dissipation layer 70, and a sheath layer 80.

[0028] For the convenience of subsequent reading, the present application introduces a first direction X, a second direction Z, and a third direction Y to describe the embodiments of the present application. The first direction X, the second direction Z, and the third direction Y may be three non-parallel linear directions in space; further, the first direction X, the second direction Z, and the third direction Y may be three mutually perpendicular directions in a three-dimensional coordinate system (three-dimensional Cartesian coordinate system). In the subsequent embodiments, the first direction X is the X-axis direction of the coordinate axis of the three-dimensional coordinate system, the second direction Z is the Z-axis direction of the coordinate axis of the three-dimensional coordinate system, and the third direction Y is the Y-axis direction of the coordinate axis of the three-dimensional coordinate system.

[0029] Along the first direction X, the two cores 10 are arranged in parallel, and the extension directions of the two cores 10 are parallel to the third direction Y. The shielding layer 60 is wrapped around the outer periphery of the two cores 10, and the inner peripheral surface of the shielding layer 60 at least partially abuts against the outer peripheral surface of the two cores 10. The heat dissipation layer 70 is wrapped around the outer periphery of the shielding layer 60, and the inner peripheral surface of the heat dissipation layer 70 abuts against the outer peripheral surface of the shielding layer 60. The sheath layer 80 is wrapped around the outer periphery of the heat dissipation layer 70, and the inner peripheral surface of the sheath layer 80 abuts against the outer peripheral surface of the heat dissipation layer 70. Among them, the heat dissipation layer 70 includes a cold end layer 71, an electric cooling main body layer 72 and a hot end layer 73 arranged in sequence from the inside to the outside, the cold end layer 71 is thermally coupled with the shielding layer 60, the hot end layer 73 is thermally coupled with the sheath layer 80, and the electric cooling main body layer 72 is configured to form a temperature difference between the cold end layer 71 and the hot end layer 73 after power is turned on, so as to transfer the heat of the shielding layer 60 to the sheath layer 80.

[0030] Thus, in the high-speed parallel line 100 with heat dissipation function of the present application, a heat dissipation layer 70 is arranged between the shielding layer 60 and the sheath layer 80, and the heat dissipation layer 70 is composed of a cold end layer 71, an electric cooling main layer 72 and a hot end layer 73. The electric cooling main layer 72 can form a temperature difference between the cold end layer 71 and the hot end layer 73 after being connected to an external power supply. The cold end layer 71 then dissipates the heat for the shielding layer 60 and transfers the heat to the hot end layer 73. The hot end layer 73 then transfers the heat to the sheath layer 80, and then the shielding layer 60 and its inner core 10 can be dissipated by dissipating the heat for the sheath layer 80. It can complete its own heat dissipation when the high-speed parallel line is working, and avoid affecting its signal transmission efficiency and signal transmission accuracy due to the heating of the core 10.

[0031] Please combine again Figure 1In one embodiment, the core 10 includes a conductor 11 and an insulating layer 12 wrapped around the outer circumference of the conductor 11. The conductor 11 is an aluminum wire or the like. The insulating layer 12 may be made of a polytetrafluoroethylene (PTFE) composite material or a polyimide (PI) composite material to ensure that the insulating layer 12 has excellent electrical insulation performance. The provision of the insulating layer 12 of the two cores 10 can preliminarily ensure signal crosstalk between the two cores 10.

[0032] It is understandable that in other embodiments, a thermally conductive filler may be added to the insulating layer 12 to improve the thermal conductivity of the insulating layer 12. The thermally conductive filler may be glass fiber or graphite.

[0033] Please combine again Figure 1 In one embodiment, along the first direction X, the two wire cores 10 are spaced apart, and opposite sides of the two wire cores 10 respectively abut against adjacent sides of the inner circumference of the shielding layer 60 .

[0034] The high-speed parallel line 100 with heat dissipation function also includes a temperature measuring line 20, which is arranged in the shielding layer 60 and between the two cores 10. The temperature measuring line 20 is configured to monitor the temperature of the environment in the shielding layer 60. The temperature measuring line 20 can be a temperature measuring optical fiber, and the outer peripheral surface of the temperature measuring line 20 partially abuts against the inner peripheral surface of the shielding layer 60, and the outer peripheral surface of the temperature measuring line 20 partially abuts against the outer peripheral surfaces of the two cores 10. On the one hand, the two cores 10 are respectively pressed against the inner peripheral surface of the shielding layer 60 by the temperature measuring line 20, and on the other hand, the temperature of the cores 10 can be directly contacted with the two cores 10 to accurately detect the temperature of the cores 10, so as to adjust the input power of the electric cooling main layer 72 according to the current temperature change of the cores 10, and then adjust the heat dissipation capacity of the electric cooling main layer 72, so as to realize dynamic adjustment of the heat dissipation capacity, and reduce energy consumption costs while ensuring the heat dissipation effect.

[0035] Furthermore, the high-speed parallel line 100 with heat dissipation function also includes a ground wire 50, which is arranged in the shielding layer 60, and the ground wire 50 is located between the two wire cores 10, which can reduce the interference between the two wire cores 10 and ensure the stability of signal transmission. Along the second direction Z, the ground wire 50 is parallel to the temperature measuring line 20 and is arranged at intervals. The outer peripheral surface of the ground wire 50 partially abuts against the inner peripheral surface of the shielding layer 60, and the outer peripheral surface of the ground wire 50 partially abuts against the outer peripheral surfaces of the two wire cores 10, so that the ground wire 50 can cooperate with the temperature measuring line 20 to simultaneously press the two wire cores 10 against the inner peripheral surface of the shielding layer 60, ensuring that the positions of the two wire cores 10 will not be offset and destroy the parallelism between the two, resulting in signal transmission being affected.

[0036] Please combine again Figure 1In one embodiment, the high-speed parallel line 100 with heat dissipation function further includes a support frame 40. Along the first direction X, the support frame 40 is located between the two line cores 10, and along the second direction Z, the support frame 40 is located between the temperature measuring line 20 and the ground line 50.

[0037] Along the second direction Z, the temperature measuring wire 20 is clamped between the inner wall of one side of the shielding layer 60 and one end of the support frame 40, and the ground wire 50 is clamped between the inner wall of the other side of the shielding layer 60 and the other end of the support frame 40. Along the first direction X, one wire core 10 is clamped between the inner wall of one side of the shielding layer 60 and one side of the support frame 40, and the other wire core 10 is clamped between the inner wall of the other side of the shielding layer 60 and the other side of the support frame 40. In this way, a support frame 40 is set between the temperature measuring line 20, the ground wire 50, and the two wire cores 10, and the temperature measuring line 20, the ground wire 50, and the two wire cores 10 can be pressed against the inner circumferential surface of the shielding layer 60 at the same time through the support frame 40, and the two wire cores 10 are pressed against the inner circumferential surface of the shielding layer 60 respectively in cooperation with the above-mentioned temperature measuring line 20 and the ground wire 50, ensuring that the temperature measuring line 20, the ground wire 50, and the two wire cores 10 are completely limited on the plane where the first direction X and the second direction Z are located, ensuring that during the operation of the high-speed parallel line 100 with heat dissipation function, the positions of the two wire cores 10 will not shift and affect the parallelism between the two.

[0038] Further, along the first direction X, the support frame 40 is provided with first receiving grooves 41 on opposite sides thereof, and the two wire cores 10 are respectively partially received in the two first receiving grooves 41. The groove wall of the first receiving groove 41 is a curved surface, and is adapted to the shape of the wire core 10, so as to improve the stability of the support frame 40 in limiting the two wire cores 10.

[0039] Along the second direction Z, the two opposite ends of the support frame 40 are respectively provided with second accommodating grooves 42, and the temperature measuring wire 20 and the ground wire 50 are respectively partially accommodated in the two second accommodating grooves 42. The groove wall of the second accommodating groove 42 is a curved surface, and is adapted to the shape of the temperature measuring wire 20 and the ground wire 50, so as to improve the stability of the support frame 40 limiting the temperature measuring wire 20 and the ground wire 50.

[0040] In the present embodiment, the support frame 40 is made of a heat-conducting material, and the support frame 40 is thermally coupled with the two wire cores 10 and the temperature measuring wire 20. The support frame 40 may be made of a metal material such as aluminum or copper, or the outer surface of the support frame 40 may be plated with aluminum or copper. In this way, when the temperature of the two wire cores 10 is high, since there is a large contact area between the two wire cores 10 and the support frame 40, the two wire cores 10 can quickly transfer heat to the support frame 40 in contact therewith, and the support frame 40 then transfers the heat to the temperature measuring wire 20, so that the temperature measuring wire 20 can more accurately measure the current temperature of the wire core 10, avoiding the problem of slow and inaccurate temperature measurement caused by only the contact between the temperature measuring wire 20 and the wire core 10.

[0041] In addition, as mentioned above, since the support frame 40 is made of metal materials such as aluminum or copper, or the outer surface of the support frame 40 can be plated with aluminum or copper, the support frame 40 located between the two cores 10 can form an electromagnetic shield between the two cores 10, thereby avoiding problems such as crosstalk between the two cores 10 during signal transmission. In addition, along the second direction Z, one side of the temperature measuring line 20 and the shielding layer 60 are pressed against each other, the other side of the temperature measuring line 20 and one end of the support frame 40 are pressed against each other, one side of the ground wire 50 and the shielding layer 60 are pressed against each other, and the other side of the ground wire 50 and the other end of the support frame 40 are pressed against each other, so that the temperature measuring line 20, the support frame 40 and the ground wire 50 together form a partition structure, thereby dividing the inner cavity of the shielding layer 60 into two cavities separated by the partition structure, and the two cores 10 are respectively located in two cavities separated from each other, further ensuring that there will be no crosstalk between the two cores 10, thereby improving the quality of signal transmission.

[0042] In this embodiment, the shielding layer 60 is filled with a filling structure 90. The filling structure 90 can be a cured polytetrafluoroethylene (PTFE) composite material or a polyimide (PI) composite material. The filling structure 90 is filled in the gap between the wire core 10, the temperature measuring wire 20, the ground wire 50, the support frame 40, and the shielding layer 60, so as to limit the wire core 10, the temperature measuring wire 20, the ground wire 50, and the support frame 40 through the filling structure 90, and ensure the structural strength of the high-speed parallel line. In addition, the filling structure 90 uniformly filled in the shielding layer 60 can also improve the impedance uniformity of the high-speed parallel line and reduce the attenuation jitter of the high-speed parallel line.

[0043] Please combine again Figure 1 In one embodiment, the shielding layer 60 is made of aluminum or copper. For example, the shielding layer 60 can be made of hot-melt self-adhesive aluminum foil or hot-melt self-adhesive copper foil. The shielding layer 60 can form a good electromagnetic shielding function between the wire core 10 and the outside world to prevent the outside environment from interfering with the signal transmission of the wire core 10. In addition, the shielding layer 60 is made of aluminum or copper, which has good thermal conductivity. The shielding layer 60 can quickly transfer the heat of the wire core 10 in contact with its inner circumference to the heat dissipation layer 70 in contact with its outer circumference, thereby achieving rapid heat dissipation of the wire core 10.

[0044] In particular, the high-speed parallel line 100 with heat dissipation function further includes a heat insulating member 30, which is attached to the inner peripheral surface of the shielding layer 60, and the side of the temperature measuring line 20 away from the support frame 40 abuts against the heat insulating member 30 to prevent the temperature measuring line 20 from directly contacting the shielding layer 60 and affecting the temperature measuring effect of the temperature measuring line 20. The heat insulating member 30 can be made of thermal insulation materials such as glass wool.

[0045] Please combine again Figures 1 to 3In one embodiment, the electric cooling main body layer 72 may be made of silicon-based materials or III-V semiconductor materials, etc., which can achieve heat transfer based on the Peltier effect. When the electric cooling main body layer 72 is powered, it can transfer the heat of the cold end layer 71 to the hot end layer 73. The electric cooling main body layer 72 can be externally connected to a power supply component 2 through a conductive wire, so that the power supply component 2 can supply power to the electric cooling main body layer 72.

[0046] In this embodiment, the electric cooling main body layer 72 can be integrally formed with the hot end layer 73 and the cold end layer 71, and the three are wrapped around the outer peripheral surface of the shielding layer 60, which can improve production efficiency.

[0047] In other embodiments, the electric cooling main body layer 72 may use a semiconductor cooling chip. The semiconductor cooling chip is embedded between the hot end layer 73 and the cold end layer 71, and the hot end of the semiconductor cooling chip is thermally coupled to the hot end layer 73, and the cold end of the semiconductor cooling chip is thermally coupled to the cold end layer 71. The number of semiconductor cooling chips is set to multiple, and along the third direction Y, the multiple semiconductor cooling chips are arranged in sequence at intervals to improve heat dissipation uniformity.

[0048] Furthermore, the heat dissipation layer 70 is wrapped around the outer peripheral surface of the shielding layer 60, and the heat dissipation layer 70 adopts the above-mentioned silicon-based material or III-V semiconductor material, etc., which can form a shielding structure on the outside of the shielding layer 60, thereby forming a double-layer shielding structure through the shielding layer 60 and the heat dissipation layer 70 to protect the wire core 10 in the shielding layer 60 from external electromagnetic interference, thereby improving the signal transmission quality of the high-speed parallel line.

[0049] Please combine again Figure 1 In one embodiment, the jacket layer 80 is made of a thermally conductive and insulating material. For example, the jacket layer 80 may be made of a polytetrafluoroethylene (PTFE) composite material or a polyimide (PI) composite material, and a thermally conductive filler may be added to the jacket layer 80 to improve the thermal conductivity of the jacket layer 80. The thermally conductive filler may be glass fiber or graphite.

[0050] The jacket layer 80 is thermally coupled to the hot end layer 73, and can conduct the heat of the hot end layer 73 to the outside. In addition, the heat dissipation of the jacket layer 80 can be accelerated by blowing cold air to the jacket layer 80 through a fan, so as to avoid heat accumulation at the jacket layer 80.

[0051] Please combine again Figure 1 and Figure 3 In one embodiment, the high-speed parallel line 100 with heat dissipation function further includes a control element 1. The control element 1 is connected to the temperature measuring line 20 for receiving a temperature signal detected by the temperature measuring line 20. Based on the temperature signal, the control element 1 controls the current flowing into the electric cooling main layer 72.

[0052] The control element 1 is preset with current values ​​corresponding to different temperature signals. The control element 1 is also connected to the power supply component 2 by signal. Based on the temperature signal, the control element 1 retrieves the current value corresponding to the temperature signal and sends a control signal to the power supply component 2. Based on the control signal, the power supply component 2 outputs a current of corresponding magnitude to the electric cooling main layer 72, thereby dynamically adjusting the cooling effect of the heat dissipation layer 70.

[0053] In addition, when the electric cooling main body layer 72 adopts the structural form of the above-mentioned multiple semiconductor cooling chips, each semiconductor cooling chip is electrically connected to the power supply component 2 through a conductive wire. Along the third direction Y, each semiconductor cooling chip is spaced and evenly distributed in different sections of the high-speed parallel line. When the temperature measuring line 20 adopts a temperature measuring optical fiber, it can monitor the temperature of different sections in the extension direction of the high-speed parallel line, and transmit the temperature signals of different sections to the control element 1. The control element 1 can control the current size transmitted to the semiconductor cooling chip corresponding to the section according to the temperature signal of the different section, thereby realizing the dynamic adjustment of the heat dissipation capacity of different sections of the high-speed parallel line 100 with heat dissipation function, which can reduce energy consumption and realize accurate heat dissipation and avoid uneven heat dissipation affecting the signal transmission of the high-speed parallel line 100 with heat dissipation function.

[0054] In the above, the specific embodiments of the present application are described with reference to the accompanying drawings. However, those skilled in the art will appreciate that various changes and substitutions may be made to the specific embodiments of the present application without departing from the scope of the present application. These changes and substitutions are all within the scope defined by the present application.

Claims

1. A high-speed parallel line with heat dissipation function, characterized in that: include: Two wire cores, the two wire cores are arranged in parallel along a first direction; A shielding layer, wrapped around the outer circumference of the two wire cores; A heat dissipation layer, disposed on the outer periphery of the shielding layer; A sheath layer, wrapped around the outer periphery of the heat dissipation layer; Wherein, the heat dissipation layer comprises a cold end layer, an electric cooling main body layer and a hot end layer arranged in sequence, the cold end layer is thermally coupled with the shielding layer, and the hot end layer is thermally coupled with the sheath layer; the heat dissipation layer forms a shielding structure on the outside of the shielding layer; The high-speed parallel line with heat dissipation function also includes a support frame, a temperature measuring line and a ground wire. The temperature measuring line and the ground wire are arranged in the shielding layer and are both located between the two wire cores. Along the second direction, the ground wire and the temperature measuring line are arranged at intervals, and the second direction intersects with the first direction; along the first direction, the support frame is located between the two wire cores, along the second direction, the support frame is located between the temperature measuring line and the ground wire, along the second direction, the temperature measuring line is clamped between the inner wall of one side of the shielding layer and one end of the support frame, and the ground wire is clamped between the inner wall of the other side of the shielding layer. Between the wall and the other end of the support frame, there is a separation structure composed of the temperature measuring wire, the support frame and the ground wire to separate the two wire cores, and the outer peripheral surface of the temperature measuring wire partially abuts against the outer peripheral surfaces of the two wire cores to press the two wire cores against the inner peripheral surface of the shielding layer; along the first direction, one of the wire cores is clamped between the inner wall of one side of the shielding layer and one side of the support frame, and the other wire core is clamped between the inner wall of the other side of the shielding layer and the other side of the support frame, the support frame is made of heat-conducting material, and the support frame is thermally coupled with the two wire cores and the temperature measuring wire.

2. The high-speed parallel wiring with heat dissipation function according to claim 1, characterized in that: Along the first direction, the supporting frame is provided with first accommodating grooves on two opposite sides thereof, and the two wire cores are respectively partially accommodated in the two first accommodating grooves; Along the second direction, two opposite ends of the support frame are respectively provided with second accommodating grooves, and the temperature measuring wire and the ground wire are respectively partially accommodated in the two second accommodating grooves.

3. The high-speed parallel wiring with heat dissipation function as claimed in claim 1, characterized in that: The shielding layer is filled with a filling structure.

4. The high-speed parallel wiring with heat dissipation function as claimed in claim 1, characterized in that: The high-speed parallel line with heat dissipation function also includes a control element, which is connected to the temperature measuring line signal and is used to receive the temperature signal detected by the temperature measuring line. Based on the temperature signal, the control element controls the current flowing into the electric cooling main layer.

5. The high-speed parallel wiring with heat dissipation function as claimed in claim 1, characterized in that: The sheath layer is made of a heat-conducting and insulating material.

6. The high-speed parallel wiring with heat dissipation function as claimed in claim 1, characterized in that: in, The electric cooling main body layer is configured to include a plurality of semiconductor cooling chips. Along a third direction, the third direction intersects with the first direction and the second direction. The semiconductor cooling chips are spaced and evenly distributed at different sections of the high-speed parallel line. The temperature measuring line is configured to include a temperature measuring optical fiber, which can monitor the temperature of different sections in the extension direction of the high-speed parallel line and transmit the temperature signals of the different sections to a control element. The control element can control the current delivered to the semiconductor cooling chip corresponding to the section according to the temperature signals of the different sections.

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