Bonding head, bonding device, bonding method and storage medium

Abstract

The invention provides a bonding head, bonding equipment, a bonding method and a computer readable storage medium. The bonding head comprises a body and a suction nozzle replacement mechanism. The suction nozzle replacement mechanism is arranged at one end of the body and comprises at least one adsorption unit and at least one positive pressure channel. And the suction nozzle replacement mechanism adsorbs or releases the Bernoulli suction nozzle through the at least one adsorption unit, and provides positive pressure airflow for the adsorbed Bernoulli suction nozzle through the at least one positive pressure channel so as to adsorb a to-be-bonded piece in a non-contact manner. According to the invention, the suction nozzle replacement mechanism comprising the adsorption unit and the positive pressure channel is configured and used for replacing the corresponding Bernoulli suction nozzle on line according to the adsorption parameters of the to-be-bonded piece so as to adsorb the to-be-bonded piece in a non-contact manner.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor device processing, and in particular to a bonding head, a bonding device, a bonding method, and a computer-readable storage medium. Background Art

[0002] In the bonding process of wafers and chips, in order to keep the chips clean, semiconductor processing equipment uses a non-contact Bernoulli nozzle to adsorb the chips. For different chips, Bernoulli nozzles of different specifications are required for adsorption and transfer. However, in the prior art, when replacing the nozzle, the nozzle generally needs to be replaced manually. This method has low replacement efficiency and cumbersome replacement steps, resulting in a long time consumption, thereby reducing the bonding efficiency. In addition, due to the presence of PINs on the Bernoulli nozzle and the uneven side lengths of the chips, the distance distribution from the PIN to the center of the chip is not uniform. However, when replacing the nozzle, the prior art does not confirm the PIN distribution information and adsorption parameters such as the positive air pressure flow rate of the Bernoulli nozzle, resulting in it not matching the chip to be bonded.

[0003] In order to overcome the above-mentioned defects in the prior art, there is an urgent need in the art for an improved bonding head for online replacement of the corresponding Bernoulli suction nozzle according to the suction parameters of the bonded parts to be bonded, so as to non-contactly adsorb the bonded parts. Summary of the invention

[0004] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or decisive elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0005] In order to overcome the above-mentioned defects of the prior art, the present invention provides a bonding head, a bonding device, a bonding method and a computer-readable storage medium, which can be configured with a nozzle replacement mechanism including an adsorption unit and a positive pressure channel, for online replacing the corresponding Bernoulli nozzle according to the adsorption parameters of the workpiece to be bonded, so as to adsorb the workpiece to be bonded without contact.

[0006] Specifically, the bonding head provided according to the first aspect of the present invention includes a body and a nozzle replacement mechanism. The nozzle replacement mechanism is arranged at one end of the body and includes at least one suction unit and at least one positive pressure channel. The nozzle replacement mechanism adsorbs or releases the Bernoulli nozzle via the at least one suction unit, and provides a positive pressure airflow to the adsorbed Bernoulli nozzle via the at least one positive pressure channel to adsorb the bonded part without contact.

[0007] Furthermore, in some embodiments of the present invention, the bonding head further includes a controller. The controller is configured to: in response to an instruction to replace a suction nozzle, first control the suction nozzle replacement mechanism to close the at least one suction unit to release the first Bernoulli suction nozzle currently being suctioned, and then control the suction nozzle replacement mechanism to open the at least one suction unit to suction the second Bernoulli suction nozzle to be replaced.

[0008] Furthermore, in some embodiments of the present invention, each of the Bernoulli nozzles is provided with a mark indicating its adsorption parameter. The bonding head also includes a camera module. The step of controlling the nozzle replacement mechanism to open the at least one adsorption unit to adsorb the second Bernoulli nozzle to be replaced includes: obtaining a target mark image of the second Bernoulli nozzle corresponding to the adsorption parameter of the part to be bonded; collecting an actual mark image of at least one candidate Bernoulli nozzle via the camera module; respectively comparing each of the actual mark images with the target mark image to select the second Bernoulli nozzle from the at least one candidate Bernoulli nozzle; and in response to the first Bernoulli nozzle being released, controlling the nozzle replacement mechanism to align the at least one adsorption unit with the second Bernoulli nozzle, and opening the at least one adsorption unit to adsorb the second Bernoulli nozzle.

[0009] Further, in some embodiments of the present invention, the other end of the body is connected to the translation mechanism and the lifting mechanism of the bonding head. The mark carries the position information of the corresponding Bernoulli nozzle. The step of controlling the nozzle replacement mechanism to align the at least one adsorption unit with the second Bernoulli nozzle and opening the at least one adsorption unit to adsorb the second Bernoulli nozzle includes: parsing the actual mark image of the second Bernoulli nozzle to determine its position coordinates; according to the position coordinates of the second Bernoulli nozzle, controlling the translation mechanism to adjust the position of the at least one adsorption unit to align it with the second Bernoulli nozzle; and controlling the lifting mechanism to adjust the height of the at least one adsorption unit to make it contact with the second Bernoulli nozzle, and opening the at least one adsorption unit to adsorb the second Bernoulli nozzle.

[0010] Furthermore, in some embodiments of the present invention, the nozzle replacement mechanism also includes a rotation unit. The mark also carries the first deflection angle information of the corresponding Bernoulli nozzle. The controller is also configured to: parse the actual mark image of the second Bernoulli nozzle to determine its first deflection angle; obtain the second deflection angle of the part to be bonded; control the rotation unit to correct the second Bernoulli nozzle according to the difference between the first deflection angle and the second deflection angle; and non-contactly adsorb the part to be bonded via the second Bernoulli nozzle that has passed through the correction.

[0011] Furthermore, in some embodiments of the present invention, the step of contactlessly adsorbing the workpiece to be bonded via the second Bernoulli nozzle that has passed through the posture correction includes: responding to a control instruction to adsorb the workpiece to be bonded, providing an airflow of corresponding flow rate to the at least one positive pressure channel according to the adsorption parameters of the second Bernoulli nozzle; and controlling the lifting mechanism to adjust the height of the second Bernoulli nozzle so as to approach and adsorb the workpiece to be bonded.

[0012] Further, in some embodiments of the present invention, the at least one adsorption unit includes a negative pressure channel and / or an electromagnetic component. The negative pressure channel is opened to adsorb the Bernoulli nozzle, or is closed to release the Bernoulli nozzle. The electromagnetic component is turned on to adsorb the magnetic attraction portion on the Bernoulli nozzle, or is closed to release the magnetic attraction portion on the Bernoulli nozzle.

[0013] Furthermore, in some embodiments of the present invention, the nozzle replacement mechanism is also provided with a first guide structure on the adsorption surface of the Bernoulli nozzle, which is used to cooperate with the second guide structure on the Bernoulli nozzle to achieve alignment adsorption of the Bernoulli nozzle by the nozzle replacement mechanism.

[0014] Furthermore, in some embodiments of the present invention, the bonding head also includes a safety protection frame, which passes through the waist of the Bernoulli nozzle without contact, so as to support the Bernoulli nozzle when the nozzle replacement mechanism releases the Bernoulli nozzle, or when the nozzle replacement mechanism fails to adsorb the Bernoulli nozzle.

[0015] Furthermore, in some embodiments of the present invention, the bonding head further comprises a nozzle rotating frame, a plurality of nozzle placing frames and a rotating motor. The nozzle rotating frame is arranged at the one end of the body. The plurality of nozzle placing frames are arranged on the nozzle rotating frame to install a plurality of the nozzle replacement mechanisms. The rotating motor is used to drive the nozzle rotating frame to rotate around the axial direction of the body so that each of the nozzle replacement mechanisms can adsorb or replace the required Bernoulli nozzles one by one.

[0016] In addition, the bonding device provided according to the second aspect of the present invention comprises a wafer chuck and a bonding head and a wafer chuck as provided in the first aspect of the present invention. The wafer chuck is used to adsorb the wafer to be bonded. The bonding head is used to replace the corresponding Bernoulli suction nozzle online according to the adsorption parameters of the part to be bonded, so as to adsorb the part to be bonded without contact.

[0017] In addition, the above-mentioned bonding method provided according to the third aspect of the present invention includes the following steps: adsorbing the wafer to be bonded via the wafer chuck of the bonding device provided by the second aspect of the present invention; determining the corresponding second Bernoulli nozzle according to the second adsorption parameter of the second part to be bonded; releasing the currently adsorbed first Bernoulli nozzle and adsorbing the second Bernoulli nozzle via the nozzle replacement mechanism of the bonding head of the bonding device; and adsorbing the second part to be bonded without contact via the second Bernoulli nozzle, and bonding it to the second position of the wafer.

[0018] Furthermore, in some embodiments of the present invention, the bonding device is used to bond a plurality of parts to be bonded with different adsorption parameters to the wafer. Before determining the corresponding second Bernoulli nozzle according to the second adsorption parameter of the second part to be bonded, the bonding method further comprises the following steps: adsorbing the first Bernoulli nozzle corresponding to the first adsorption parameter of the first part to be bonded via the nozzle replacement mechanism; and adsorbing the first part to be bonded contactlessly via the first Bernoulli nozzle and bonding it to the first position of the wafer.

[0019] In addition, the above-mentioned computer-readable storage medium provided according to the fourth aspect of the present invention stores computer instructions thereon, and is characterized in that when the computer instructions are executed by a processor, the bonding method provided by the third aspect of the present invention is implemented. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or features may have the same or similar reference numerals.

[0021] Figure 1 A schematic diagram of the overall structure of a bonding head provided according to some embodiments of the present invention is shown.

[0022] Figure 2 A schematic diagram of a partial structure of a bonding head provided according to some embodiments of the present invention is shown.

[0023] Figure 3 A schematic structural diagram of a nozzle replacement mechanism provided according to some embodiments of the present invention is shown.

[0024] Figure 4 A front view of the connection between a safety protection frame and a Bernoulli nozzle provided according to some embodiments of the present invention is shown.

[0025] Figure 5 A top view of the connection between a safety protection frame and a Bernoulli nozzle provided according to some embodiments of the present invention is shown.

[0026] Figure 6 A schematic flow chart of a bonding method provided according to some embodiments of the present invention is shown.

[0027] Figure 7 A schematic diagram showing the acquisition of a marker image by a camera module provided according to some embodiments of the present invention is shown.

[0028] Figure 8 A schematic diagram showing location information of a marker image collected by a camera module according to some embodiments of the present invention is shown.

[0029] Fig. 9 A schematic diagram showing how a camera module according to some embodiments of the present invention obtains deflection angle information.

[0030] Fig.10 A schematic diagram showing the principle of correcting the posture of a Bernoulli nozzle according to a deflection angle provided in accordance with some embodiments of the present invention is shown.

[0031] Reference numerals:

[0032] 11 body

[0033] 12 Nozzle replacement mechanism

[0034] 121 Adsorption unit

[0035] 122 Positive pressure channel

[0036] 13 Bernoulli nozzle

[0037] 14 Safety protection frame

[0038] 15 Nozzle Rotating Stand

[0039] 16 Nozzle holder

[0040] 17 Rotating motor

[0041] 18 Camera Module

[0042] 19 Parts to be bonded DETAILED DESCRIPTION

[0043] The following specific embodiments illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this implementation. On the contrary, the purpose of introducing the invention in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.

[0044] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0045] In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the directions shown in the paragraph and the related drawings. Such relative terms are only used for the convenience of description and do not mean that the device described therein must be manufactured or operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0046] It is understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, regions, layers and / or parts, these components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers and / or parts. Therefore, the first component, region, layer and / or part discussed below may be referred to as a second component, region, layer and / or part without departing from some embodiments of the present invention.

[0047] As mentioned above, in the prior art, when replacing the suction nozzle, it is generally necessary to manually replace the suction nozzle. This method has low replacement efficiency and cumbersome replacement steps, resulting in a long time consumption, thereby reducing the bonding efficiency. In addition, due to the presence of PINs on the Bernoulli nozzle and the uneven side lengths of the chip, the distance distribution from the PIN to the center of the chip is uneven. However, when replacing the suction nozzle, the prior art does not confirm the PIN distribution information and adsorption parameters such as the positive air pressure flow rate of the Bernoulli nozzle, resulting in it not matching the chip to be bonded.

[0048] In order to overcome the above-mentioned defects of the prior art, the present invention provides a bonding head, a bonding device, a bonding method and a computer-readable storage medium, which can be configured with a nozzle replacement mechanism including an adsorption unit and a positive pressure channel, for online replacing the corresponding Bernoulli nozzle according to the adsorption parameters of the workpiece to be bonded, so as to adsorb the workpiece to be bonded without contact.

[0049] In some non-limiting embodiments, the bonding device provided in the second aspect of the present invention comprises a wafer chuck and the bonding head provided in the first aspect of the present invention. Here, the wafer chuck is used to adsorb the wafer to be bonded. The bonding head is used to replace the corresponding Bernoulli suction nozzle online according to the adsorption parameters of the part to be bonded (for example: PIN distribution information, positive air pressure flow rate) to adsorb the part to be bonded without contact.

[0050] Please refer to the reference for details Figure 1 to Figure 3 . Figure 1 A schematic diagram of the overall structure of a bonding head provided according to some embodiments of the present invention is shown. Figure 2 A schematic diagram of a partial structure of a bonding head provided according to some embodiments of the present invention is shown. Figure 3 A schematic structural diagram of a nozzle replacement mechanism provided according to some embodiments of the present invention is shown.

[0051] exist Figure 1 to Figure 3 In the illustrated embodiment, the bonding head provided by the first aspect of the present invention includes a body 11 and a nozzle replacement mechanism 12. Here, the nozzle replacement mechanism 12 is disposed at one end of the body 11, and includes at least one adsorption unit 121 and at least one positive pressure channel 122. The nozzle replacement mechanism 12 adsorbs or releases the Bernoulli nozzle 13 via at least one adsorption unit 121, and provides a positive pressure airflow to the adsorbed Bernoulli nozzle 13 via at least one positive pressure channel 122, so as to adsorb the bonded parts (e.g., chips and other grains with at least one circuit element) without contact.

[0052] Further, in some preferred embodiments, the at least one adsorption unit 121 includes a negative pressure channel and / or an electromagnetic component. Here, the negative pressure channel is opened to adsorb the Bernoulli nozzle 13, or is closed to release the Bernoulli nozzle 13. Similarly, the electromagnetic component is opened to adsorb the magnetic attraction portion (for example, metals such as iron, nickel, cobalt, or permanent magnets with opposite magnetic properties) on the Bernoulli nozzle 13, or is closed to release the magnetic attraction portion on the Bernoulli nozzle 13.

[0053] In addition, in some optional embodiments, the suction surface of the nozzle replacement mechanism 12 for the Bernoulli nozzle 13 is further provided with a first guide structure, which is used to cooperate with the second guide structure on the Bernoulli nozzle 13 to achieve the alignment and suction of the nozzle replacement mechanism 12 to the Bernoulli nozzle 13. For example, a guide groove with a chamfer is provided on the nozzle replacement mechanism 12, and a guide shaft is provided on the Bernoulli nozzle 13. When the guide shaft enters the guide groove, it will receive a tangential force, so that the guide shaft of the Bernoulli nozzle 13 accurately enters the preset position.

[0054] Please combine Figure 2 , Figure 4 and Figure 5 . Figure 4 A front view of the connection between a safety protection frame and a Bernoulli nozzle provided according to some embodiments of the present invention is shown. Figure 5 A top view of the connection between a safety protection frame and a Bernoulli nozzle provided according to some embodiments of the present invention is shown.

[0055] In addition, Figure 2 , Figure 4 and Figure 5 In the illustrated embodiment, the bonding head provided by the first aspect of the present invention further includes a safety protection frame 14. The safety protection frame 14 passes through the waist of the Bernoulli nozzle 13 without contact, that is, the small-sized position between the upper and lower ends of the Bernoulli nozzle 13, so as to support the Bernoulli nozzle 13 when the nozzle replacement mechanism 12 releases the Bernoulli nozzle 13 or when the suction of the Bernoulli nozzle 13 by the nozzle replacement mechanism 12 fails.

[0056] In addition, Figure 1 In the illustrated embodiment, the bonding head provided by the first aspect of the present invention further includes a nozzle rotating frame 15, a plurality of nozzle placing frames 16, and a rotating motor 17. Here, the nozzle rotating frame 15 is disposed at one end of the body 11. The plurality of nozzle placing frames 16 are disposed on the nozzle rotating frame 15 to install a plurality of nozzle replacement mechanisms 12. The rotating motor 17 is used to drive the nozzle rotating frame 15 to rotate around the axial direction of the body 11, so that each nozzle replacement mechanism 23 can absorb or replace the required Bernoulli nozzles 13 one by one.

[0057] In some non-limiting embodiments, the bonding device provided in the second aspect of the present invention includes a memory and a controller. Here, the memory includes but is not limited to the computer-readable storage medium provided in the fourth aspect, on which computer instructions are stored. The controller is connected to the memory and is configured to execute the computer instructions stored on the memory to implement the bonding method provided in the third aspect of the present invention.

[0058] The working principle of the above-mentioned bonding device will be described below in conjunction with some embodiments of the bonding method. Those skilled in the art will understand that these embodiments of the bonding method are only some non-limiting implementation methods provided by the present invention, which are intended to clearly demonstrate the main concept of the present invention and provide some specific solutions that are convenient for the public to implement, rather than limiting all functions or all working modes of the bonding device. Similarly, the bonding device is also only a non-limiting implementation method provided by the present invention, and does not constitute a limitation on the execution subject and execution order of each step in these bonding methods.

[0059] Please refer to Figure 6 . Figure 6 A schematic flow chart of a bonding method provided according to some embodiments of the present invention is shown.

[0060] like Figure 6 As shown, the controller may first absorb the wafer to be bonded via the wafer chuck of the bonding device provided in the second aspect of the present invention.

[0061] Furthermore, in some preferred embodiments, the bonding device can be used to jointly bond a plurality of to-be-bonded parts having different adsorption parameters to a wafer.

[0062] Specifically, the controller may first adsorb the first Bernoulli nozzle corresponding to the first adsorption parameter of the first bonding part through the nozzle replacement mechanism 12. Here, the first adsorption parameter of the first bonding part may be pre-configured and adsorbed, so that the controller does not need to perform the step of determining the corresponding first Bernoulli nozzle according to the first adsorption parameter of the first bonding part, and directly adsorbs the first Bernoulli nozzle.

[0063] For example, the determined Bernoulli nozzle 13 is different for adsorbing chips of different sizes. Specifically, adsorbing a 1mm×1mm chip requires the size of the head of the Bernoulli nozzle 13 to be smaller than 1mm×1mm. However, using a Bernoulli nozzle corresponding to a 1mm×1mm chip to adsorb a chip of 26mm×33mm will not be able to adsorb the chip at all. In addition, for chips of different sizes and thicknesses, the required adsorption force during the picking process is also different. For different required suction forces, it is necessary to change the flow rate of the airflow in the positive pressure channel 122 to achieve a change in suction force.

[0064] Afterwards, the controller can non-contactly absorb the first to-be-bonded component via the first Bernoulli suction nozzle and bond it to the first position of the wafer.

[0065] In this way, the bonding equipment provided by the second aspect of the present invention can adapt to the bonding requirements of chips with various marking positions only by adjusting the spherical height of the adsorption part through the telescopic part, thereby effectively avoiding the need to replace the suction nozzle and re-leveling to improve the joint bonding accuracy and efficiency of multiple chips.

[0066] Thereafter, the controller may determine the corresponding second Bernoulli nozzle according to the second adsorption parameter of the second part to be bonded, and release the currently adsorbed first Bernoulli nozzle and adsorb the second Bernoulli nozzle through the nozzle replacement mechanism 12 of the bonding head of the bonding device.

[0067] Specifically, in response to an instruction to replace the nozzle, the controller can first control the nozzle replacement mechanism 12 to close at least one adsorption unit 121 to release the currently adsorbed first Bernoulli nozzle, and then control the nozzle replacement mechanism to open at least one adsorption unit 121 to adsorb the second Bernoulli nozzle to be replaced.

[0068] Please refer to Figure 7 to Figure 10 . Figure 7 A schematic diagram showing the acquisition of a marker image by a camera module provided according to some embodiments of the present invention is shown. Figure 8 A schematic diagram showing location information of a marker image collected by a camera module according to some embodiments of the present invention is shown. Fig. 9 A schematic diagram showing how a camera module according to some embodiments of the present invention obtains deflection angle information. Fig.10 A schematic diagram showing the principle of correcting the posture of a Bernoulli nozzle according to a deflection angle provided in accordance with some embodiments of the present invention is shown.

[0069] like Figure 7 to Figure 10 As shown, during the process of adsorbing the second Bernoulli nozzle to be replaced, the controller can first correct the posture of the second Bernoulli nozzle. Since the chips to be bonded have different proportional sizes, such as 5mm×15mm, 3mm×15mm, etc., the head size of the Bernoulli nozzle 13 will also change with the change of chip size. However, since the size of the back of the Bernoulli nozzle needs to be placed on the nozzle placement rack 16, the size is not consistent with the size of the head. In order to prevent the Bernoulli nozzle 13 from misaligned contact, it is necessary to identify the mark (Mark) on the back of the Bernoulli nozzle 13 and correct its posture.

[0070] Further, in Figure 7In the illustrated embodiment, each Bernoulli nozzle 13 is provided with a mark indicating its adsorption parameter. The bonding head also includes a camera module 18. Here, the controller can first obtain a target mark image of the second Bernoulli nozzle corresponding to the adsorption parameter of the part to be bonded. Afterwards, the controller can first collect an actual mark image of at least one candidate Bernoulli nozzle through the camera module 18. Afterwards, the controller can respectively compare each actual mark image with the target mark image to select the second Bernoulli nozzle from at least one candidate Bernoulli nozzle. In response to the first Bernoulli nozzle being released, the controller can control the nozzle replacement mechanism 12 to align at least one adsorption unit 121 with the second Bernoulli nozzle, and open at least one adsorption unit 121 to adsorb the second Bernoulli nozzle.

[0071] Furthermore, in Figure 8 In the illustrated embodiment, the above-mentioned mark carries the position information of the corresponding Bernoulli nozzle 13. The other end of the body 11 is connected to the translation mechanism and the lifting mechanism of the bonding head. Here, the controller can parse the actual marking image of the second Bernoulli nozzle to determine its position coordinates. Afterwards, the controller can control the translation mechanism to adjust the position of at least one adsorption unit 121 according to the position coordinates of the second Bernoulli nozzle to align it with the second Bernoulli nozzle. Afterwards, the controller can control the lifting mechanism to adjust the height of at least one adsorption unit 121 so that it contacts the second Bernoulli nozzle, and open at least one adsorption unit 121 to adsorb the second Bernoulli nozzle.

[0072] In addition, Fig. 9 In the illustrated embodiment, the above-mentioned mark also carries the first deflection angle information of the corresponding Bernoulli nozzle 13 (for example: an arrow, a square, a triangle set at the center of the Bernoulli nozzle, or a plurality of circles surrounding the center of the Bernoulli nozzle). The nozzle replacement mechanism 12 also includes a rotation unit. Here, the controller can parse the actual mark image of the second Bernoulli nozzle to determine its first deflection angle in the horizontal direction. Then, as Fig.10 As shown, the controller can obtain the second deflection angle of the component to be bonded 19, and control the rotating unit to correct the posture of the second Bernoulli nozzle according to the difference between the first deflection angle and the second deflection angle.

[0073] Afterwards, the controller can non-contactly absorb the part to be bonded via the second Bernoulli nozzle that has been corrected, and bond it to the second position of the wafer.

[0074] Specifically, in response to the control instruction to adsorb the bonded part, the controller can provide a corresponding flow rate of airflow to at least one positive pressure channel according to the adsorption parameters of the second Bernoulli suction nozzle. Afterwards, the controller can control the lifting mechanism to adjust the height of the second Bernoulli suction nozzle to approach and adsorb the bonded part.

[0075] In summary, the above-mentioned bonding head, bonding equipment, bonding method and computer-readable storage medium provided by the present invention can be configured with a nozzle replacement mechanism including an adsorption unit and a positive pressure channel, which can be used to replace the corresponding Bernoulli nozzle online according to the adsorption parameters of the workpiece to be bonded, so as to adsorb the workpiece to be bonded without contact.

[0076] Although the above methods are illustrated and described as a series of actions for simplicity of explanation, it should be understood and appreciated that these methods are not limited by the order of the actions, because according to one or more embodiments, some actions may occur in a different order and / or concurrently with other actions from those illustrated and described herein or not illustrated and described herein but understandable to those skilled in the art.

[0077] Those skilled in the art will appreciate that information, signals, and data may be represented using any of a variety of different technologies and techniques. For example, data, instructions, commands, information, signals, bits, symbols, and chips cited throughout the above description may be represented by voltage, current, electromagnetic waves, magnetic fields or magnetic particles, optical fields or optical particles, or any combination thereof.

[0078] Although the controller described in the above embodiments can be implemented by a combination of software and hardware. However, it is understood that the controller can also be implemented in software and hardware. For hardware implementation, the controller can be implemented in one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors, other electronic devices for performing the above functions, or a selection combination of the above devices. For software implementation, the controller can be implemented by independent software modules such as procedures and functions running on a general-purpose chip, each of which performs one or more functions and operations described herein.

[0079] The steps of the method or algorithm described in conjunction with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. The software module may reside in a RAM memory, a flash memory, a ROM memory, an EPROM memory, an EEPROM memory, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to a processor so that the processor can read and write information from / to the storage medium. In an alternative, a storage medium may be integrated into a processor. The processor and the storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In an alternative, the processor and the storage medium may reside in a user terminal as discrete components.

[0080] In one or more exemplary embodiments, the functions described may be implemented in hardware, software, firmware, or any combination thereof. If implemented as a computer program product in software, each function may be stored on or transmitted by a computer-readable medium as one or more instructions or codes. Computer-readable media include both computer storage media and communication media, including any medium that facilitates the transfer of a computer program from one place to another. Storage media may be any available medium that can be accessed by a computer. As an example and not limitation, such a computer-readable medium may include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, disk storage or other magnetic storage device, or any other medium that can be used to carry or store the desired program code in the form of an instruction or data structure and can be accessed by a computer. Any connection is also properly referred to as a computer-readable medium. For example, if the software is transmitted from a website, a server, or other remote source using a coaxial cable, a fiber optic cable, a twisted pair, a digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwaves, the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwaves are included in the definition of the medium. Disk and disc as used herein include compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disk and Blu-ray disc, wherein disk often reproduces data magnetically, while disc reproduces data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media.

[0081] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but should be granted the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A bonding head, characterized in that: include: The entity; and The nozzle replacement mechanism is arranged at one end of the main body and includes at least one adsorption unit and at least one positive pressure channel, wherein the nozzle replacement mechanism adsorbs or releases the Bernoulli nozzle via the at least one adsorption unit, and provides positive pressure airflow to the adsorbed Bernoulli nozzle via the at least one positive pressure channel to adsorb the parts to be bonded without contact.

2. The bonding head according to claim 1, wherein: The bonding head also includes a controller, which is configured to: In response to an instruction to replace the suction nozzle, the suction nozzle replacement mechanism is first controlled to close the at least one suction unit to release the first Bernoulli suction nozzle currently being suctioned, and then the suction nozzle replacement mechanism is controlled to open the at least one suction unit to suction the second Bernoulli suction nozzle to be replaced.

3. The bonding head according to claim 2, characterized in that: Each of the Bernoulli nozzles is provided with a mark indicating its adsorption parameter, and the bonding head further includes a camera module. The step of controlling the nozzle replacement mechanism to open the at least one adsorption unit to adsorb the second Bernoulli nozzle to be replaced includes: Acquire a target mark image of a second Bernoulli nozzle corresponding to adsorption parameters of the workpiece to be bonded; Acquire, via the camera module, an actual marked image of at least one candidate Bernoulli nozzle; respectively comparing each of the actual marking images with the target marking image to select the second Bernoulli nozzle from the at least one candidate Bernoulli nozzle; and In response to the first Bernoulli nozzle being released, the nozzle replacement mechanism is controlled to align the at least one suction unit with the second Bernoulli nozzle, and the at least one suction unit is turned on to suction the second Bernoulli nozzle.

4. The bonding head according to claim 3, characterized in that The other end of the body is connected to the translation mechanism and the lifting mechanism of the bonding head, the mark carries the position information of the corresponding Bernoulli nozzle, and the steps of controlling the nozzle replacement mechanism to align the at least one suction unit with the second Bernoulli nozzle and opening the at least one suction unit to suction the second Bernoulli nozzle include: parsing the actual marking image of the second Bernoulli nozzle to determine its position coordinates; According to the position coordinates of the second Bernoulli nozzle, controlling the translation mechanism to adjust the position of the at least one adsorption unit to align it with the second Bernoulli nozzle; and The lifting mechanism is controlled to adjust the height of the at least one adsorption unit so that it contacts the second Bernoulli nozzle, and the at least one adsorption unit is opened to adsorb the second Bernoulli nozzle.

5. The bonding head according to claim 4, characterized in that The nozzle replacement mechanism also includes a rotating unit, the mark also carries the first deflection angle information of the corresponding Bernoulli nozzle, and the controller is further configured as follows: parsing an actual marking image of the second Bernoulli nozzle to determine a first deflection angle thereof; Acquiring a second deflection angle of the part to be bonded; According to the difference between the first deflection angle and the second deflection angle, controlling the rotation unit to correct the posture of the second Bernoulli nozzle; as well as The parts to be bonded are sucked contactlessly via the second Bernoulli suction nozzle that has passed through the posture correction.

6. The bonding head according to claim 5, characterized in that The step of non-contactly sucking the part to be bonded via the second Bernoulli suction nozzle after the posture correction comprises: In response to a control instruction for adsorbing the workpiece to be bonded, providing an airflow of a corresponding flow rate to the at least one positive pressure channel according to an adsorption parameter of the second Bernoulli suction nozzle; and The lifting mechanism is controlled to adjust the height of the second Bernoulli suction nozzle so as to approach and adsorb the part to be bonded.

7. The bonding head according to claim 1, wherein: The at least one adsorption unit comprises a negative pressure channel and / or an electromagnetic member, wherein: The negative pressure channel is opened to adsorb the Bernoulli nozzle, or is closed to release the Bernoulli nozzle. The electromagnetic member is turned on to attract the magnetic attraction portion on the Bernoulli nozzle, or is turned off to release the magnetic attraction portion on the Bernoulli nozzle.

8. The bonding head according to claim 1, wherein: The nozzle replacement mechanism is also provided with a first guide structure on the adsorption surface of the Bernoulli nozzle, which is used to cooperate with the second guide structure on the Bernoulli nozzle to achieve alignment adsorption of the Bernoulli nozzle by the nozzle replacement mechanism.

9. The bonding head according to claim 1, wherein: Also includes: A safety protection frame passes through the waist of the Bernoulli nozzle without contact to support the Bernoulli nozzle when the nozzle replacement mechanism releases the Bernoulli nozzle or when the nozzle replacement mechanism fails to adsorb the Bernoulli nozzle.

10. The bonding head according to claim 1, wherein: Also includes: A nozzle rotating frame, disposed at one end of the body; A plurality of nozzle placement racks are arranged on the nozzle rotating rack to install a plurality of the nozzle replacement mechanisms; as well as The rotary motor is used to drive the nozzle rotating frame to rotate around the axial direction of the body, so that each nozzle replacement mechanism can absorb or replace the required Bernoulli nozzles one by one.

11. A bonding device, characterized in that: include: Wafer chuck, used to absorb the wafer to be bonded; as well as The bonding head according to any one of claims 1 to 10 is used to replace the corresponding Bernoulli suction nozzle online according to the suction parameters of the part to be bonded, so as to suction the part to be bonded without contact.

12. A bonding method, characterized in that: The following steps are involved: Adsorbing the wafer to be bonded via the wafer chuck of the bonding device as claimed in claim 11; Determining a corresponding second Bernoulli suction nozzle according to a second adsorption parameter of a second part to be bonded; The bonding device releases the first Bernoulli nozzle currently being sucked by the nozzle replacement mechanism of the bonding head, and sucks the second Bernoulli nozzle; as well as The second to-be-bonded part is adsorbed contactlessly via the second Bernoulli suction nozzle and bonded to the second position of the wafer.

13. The bonding method according to claim 12, characterized in that: The bonding device is used to bond a plurality of to-be-bonded parts with different adsorption parameters to the wafer, wherein before determining the corresponding second Bernoulli nozzle according to the second adsorption parameter of the second to-be-bonded part, the bonding method further comprises the following steps: Adsorbing a first Bernoulli nozzle having a first adsorption parameter corresponding to a first part to be bonded via the nozzle replacement mechanism; and The first to-be-bonded component is adsorbed contactlessly via the first Bernoulli suction nozzle and bonded to a first position of the wafer.

14. A computer-readable storage medium having computer instructions stored thereon, characterized in that: When the computer instructions are executed by a processor, the bonding method according to claim 12 or 13 is implemented.

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